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HUAWEI MU203 WCDMA M2M Module

Datasheet

MU203 Module
V100R001

Issue 1.0
Date 2010-04-02

HUAWEI TECHNOLOGIES CO., LTD.


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HUAWEI MU203 WCDMA M2M Module Datasheet
-(V100R001_01)

About This Document

Summary
This document provides information about the major functions, supported services,
system architecture, and technical references of HUAWEI MU203 WCDMA M2M
Module.
The following table lists the contents of this document.

Chapter Details

1 Overview Describes the basic functions, key features, and


hardware and software overview of the product.
2 Mechanical Describes the mechanical specifications of the
Specifications product.
3 Electrical Specifications Describes the electrical specifications of the product.
4 RF Specifications Describes the RF specifications of the product.
5 Test and Certification Describes the information about test and certification
of the product.
6 Technical Reference Describes the technical references of the product.
Acronyms and Lists the acronyms and abbreviations mentioned in this
Abbreviations document.
Safety Information Lists the safety information of using the product.

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HUAWEI MU203 WCDMA M2M Module Datasheet
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History
Date Details

2009-12-01 Creation
2010-02-01 Added power on and off timing description in chapter 3.2.2
Updated UART interface description in chapter3.2.6
Removed RST interface description
Removed ADC interface description
Added power supply description and updated power
consumption values in chapter 3.3
Updated conducted Rx Sensitivity and Tx power values in
chapter 4.3
Removed software overview description

Removed test and certification description


2010-03-30 Added the LED indicator blinks specification in chapter 3.2.8

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HUAWEI MU203 WCDMA M2M Module Datasheet
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Contents

1 Overview ...........................................................................................................................7
1.1 Introduction .................................................................................................................................... 7
1.2 Key Features ................................................................................................................................. 8
1.3 Hardware Overview ...................................................................................................................... 9
1.3.1 Hardware Logic Block Diagram ......................................................................................... 9
1.3.2 External Hardware Interfaces .......................................................................................... 10
2 Mechanical Specifications ...............................................................................................13
2.1 Dimensions and interfaces ........................................................................................................ 13
2.1.1 Dimensions and interfaces of MU203............................................................................. 13
2.1.2 Dimensions of the BTB Connector.................................................................................. 14
2.1.3 Dimensions of the Antenna Connector ........................................................................... 16
2.2 Reliability ...................................................................................................................................... 18
2.3 Temperature................................................................................................................................. 19
3 Electrical Specifications ..................................................................................................20
3.1 BTB Connector Pin Definition ................................................................................................... 20
3.2 Pin Descriptions .......................................................................................................................... 23
3.2.1 Digital Signal DC Characteristics .................................................................................... 23
3.2.2 Power Sources and Grounds ........................................................................................... 24
3.2.3 VCOIN Power source ........................................................................................................ 27
3.2.4 USB Signals ....................................................................................................................... 29
3.2.5 USIM Signals ...................................................................................................................... 29
3.2.6 UART Interface Signals .................................................................................................... 33
3.2.7 Analog Audio Signals ........................................................................................................ 36
3.2.8 Status Indication Signals .................................................................................................. 37
3.2.9 WAKEUP_SLEEP_IN Signal ........................................................................................... 40
3.2.10 WAKEUP_SLEEP_OUT Signal ..................................................................................... 41
3.2.11 POWER_ON_OFF Signal .............................................................................................. 41
3.2.12 NC Pins ............................................................................................................................. 42
3.3 Power Supply and Consumption .............................................................................................. 43
3.3.1 Power Supply ..................................................................................................................... 43
3.3.2 Power Consumption .......................................................................................................... 44

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3.4 ESD Features .............................................................................................................................. 47


3.4.1 Overview ............................................................................................................................. 47
3.4.2 ESD Protection of the Antenna Interface ....................................................................... 48
3.4.3 ESD Protection of the USIM Card Interface .................................................................. 48
4 RF Specifications ............................................................................................................49
4.1 Operating Frequencies .............................................................................................................. 49
4.2 Conducted RF Measurement .................................................................................................... 49
4.2.1 Test Environment ............................................................................................................... 49
4.2.2 Test Standards.................................................................................................................... 50
4.3 Conducted Rx Sensitivity and Tx Power ................................................................................. 50
4.3.1 Conducted Receive Sensitivity ........................................................................................ 50
4.3.2 Conducted Transmit Power .............................................................................................. 51
4.4 Antenna Design Requirements ................................................................................................. 51
4.4.1 Antenna Design Indicators ............................................................................................... 51
4.4.2 Interference......................................................................................................................... 53
4.4.3 Radio Test Environment .................................................................................................... 53
5 Test and Certification .......................................................................................................55
Product Certifications .................................................................................................................. 55
Nameplate..................................................................................................................................... 55
6 Technical Reference ........................................................................................................57
6.1 Layer 1 Specifications (Physical).............................................................................................. 57
6.2 Layer 2 Specifications (MAC/RLC) .......................................................................................... 57
6.3 Layer 3 Specifications (RRC) .................................................................................................... 57
6.4 Layer 3 NAS/Core Network (MM/CM) ..................................................................................... 57
6.5 GSM Protocol Specifications..................................................................................................... 58
6.6 GPRS Protocol Specifications .................................................................................................. 58
6.7 General Specifications ............................................................................................................... 58
6.8 Performance/Test Specifications .............................................................................................. 59
6.9 SIM Specifications ...................................................................................................................... 59

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HUAWEI MU203 WCDMA M2M Module Datasheet
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1 Overview

1.1 Introduction
HUAWEI MU203 WCDMA M2M Module (hereinafter referred to as MU203) is a
WCDMA Wireless Wide Area Network (WWAN) M2M module. It is a multi-mode
wireless terminal for industry.
The MU203 supports the following standards:
z Universal Mobile Telecommunications System (UMTS)
z Enhanced Data Rates for Global Evolution (EDGE)
z General Packet Radio Service (GPRS)
z Global System for Mobile Communications (GSM)
The MU203 provides the following services:
z UMTS packet data service
z EDGE/GPRS packet data service
z WCDMA/GSM short message service (SMS)
The MU203 can be connected to the external application via the 60-pin board-to-
board connector. In the service area of the UMTS, EDGE, GPRS or GSM network,
you can surf the Internet, send messages and emails, and receive messages/emails
cordlessly. The MU203 is fast, reliable, and easy to operate. Thus, mobile users can
experience many new features and services with MU203. These features and
services will enable a large number of users to use MU203 and the average revenue
per user (ARPU) of operators will increase substantially.
The MU203 family contains MU203 and MU203-b.Figure 1-1 shows the profile of the
MU203 family.

Module Top View

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Module Top View

MU203

MU203-b

Figure 1-1 Profile of MU203 family

1.2 Key Features


Table 1-1 lists the key features of MU203 family

Table 1-1 Key features of MU203 family


Feature MU203 MU203-b
UMTS 2100 MHz Y Y
UMTS 1900 MHz N N
UMTS 900 MHz N Y
UMTS 850 MHz Y N
UMTS 800 MHz Y N
GSM/GPRS 850/900/1800/1900 MHz Y Y

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Feature MU203 MU203-b


EDGE 850/900/1800/1900 MHz N Y
UMTS PS domain data service of up to 384 kbps Y Y
EDGE packet data service of up to 236.8 kbps N Y
GPRS packet data service of up to 85.6 kbps Y Y
CS domain data service based on UMTS Y Y
CS domain data service based on GSM Y Y
SMS based on the CS/PS domain of WCDMA Y Y
SMS based on the CS/PS domain of GSM Y Y
Analog Audio interface O O
60-pin Board to Board Connector interface Y Y
Windows CE/Windows XP/Linux 2.6.18 or later Y Y
versions
Notes:
Y: The feature is supported.
O: The feature is optional.
N: The feature is NOT supported.

1.3 Hardware Overview


The MU203 consists of three sections: baseband section and radio frequency (RF)
section and power manager (PM) section. External interfaces include the antenna
interface and the 60-pin BTB interface.

1.3.1 Hardware Logic Block Diagram


The MU203 is completed on a single-board. Figure 1-2 shows the hardware
functional block diagram.

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Figure 1-2 Hardware functional block diagram

The circuitry of MU203 consists of three sections: baseband section, RF section and
PM section.
z The baseband section includes the baseband processor, power management
and MCP. It implements baseband signals processing, wireless protocols,
management of various peripheral devices and providing the power supply and
power management for the whole module.
z The RF section includes the RF transceiver, PA, antenna switches, duplexer,
and antenna interfaces.
z The PM section providing the power supply and power management for the
whole module.

1.3.2 External Hardware Interfaces


1. Antenna interface
The MU203 has an antenna connector and an antenna pad. External antenna can be
connected via antenna connector or antenna pad, but both solutions can only be
applied alternatively. This means, whenever an antenna is plugged to the connector,
the pad must not be used. Vice versa, if the antenna is connected to the pad, then
the connector must be left empty.

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HUAWEI MU203 WCDMA M2M Module Datasheet
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Antenna connector
Antenna pad

Antenna connector
The antenna connector has been chosen as antenna reference point (ARP) for the
HUAWEI reference equipment submitted to type approve MU203. All RF data
specified throughout this datasheet are related to the ARP. For compliance with the
test results of the MU203 type approval you are advised to give priority to the
connector, rather than using the antenna pad. See Section 2.1.3 for details about
antenna connector.

Antenna Pad
When you decide to use the antenna pad take into account that the pad has not been
intended as antenna reference point (ARP) for the type approval. Also, consider that
50Ω connector is mandatory for type approval measurements. This requires user
devices with an integral antenna to be temporarily equipped with a suitable connector
or a low loss RF cable with adapter.
To prevent damage to the module and to obtain long-term solder joint properties you
are advised to maintain the standards of good engineering practice for soldering. Be
sure to solder the antenna core to the pad and the shielding of the coax cable to the
ground plane of the module next to the antenna pad. The direction of the cable is not
relevant from the electrical point of view.
2. BTB connector interface
The MU203 provide a 60-pin male BTB connector interface. The major signals of the
BTB connector describe as the following figure.

Figure 1-3 BTB connector identification

− USIM interface: The USIM interface provides the interface for a USIM card.
The USIM card can be inserted into the host side.

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− USB interface: The USB interface supports USB 2.0 full speed standard.
− UART interface: The module supports 3-line or full serial port interface.
− Analog voice interface: The module supports two analog audio interfaces,
each with a microphone input and an analog earpiece output.
− Power sources and grounds: 3.8V recommended, voltage range is 3.3V~4.2V.

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2 Mechanical Specifications

2.1 Dimensions and interfaces


2.1.1 Dimensions and interfaces of MU203
The dimensions of MU203 are 45 mm (length) × 31 mm (width) × 5.4mm (height).
Figure 2-1 shows the dimensions of MU203 in details.

Figure 2-1 Dimensions of MU203

Figure 2-2 shows the appearance of the interfaces on MU203.

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Figure 2-2 Appearance of the interfaces on MU203

60-pin male BTB connector


It is used to connect MU203 to the female BTB interface of the user side.
Screw holes
They are used to fix MU203 on the user’s board with screws.
Antenna interfaces
They are used to connect to antennas. Both solutions can only be applied
alternatively. This means, whenever an antenna is plugged to the connector, the pad
must not be used. Vice versa, if the antenna is connected to the pad, then the
connector must be left empty.

2.1.2 Dimensions of the BTB Connector


The MU203 provides a 60-Pin BTB connector interface. The header connector on
module is from HRS company and the type is DF12(3.0)-60DS-0.5V(86). Mating
receptacle type is DF12(3.0)-60DP-0.5V(86).

Figure 2-3 DF12(3.0)-60DS-0.5V(86) connector on MU203

Figure 2-4 DF12(3.0)-60DP-0.5V(86) receptacle on user board

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Table 2-1 Ordering information DF12 series


Stacking
Item Part number height HRS number
(mm)
Headers on MU203 DF12(3.0)-60DS- 3.0 537-0611-1-
0.5V(86) 86
Receptacles on user DF12(3.0)-60DP- 3.0 537-0731-3-
boards 0.5V(86) 86

Figure 2-5 Mechanical dimensions of Hirose DF12 connector on MU203 (mm)

Figure 2-6 Pad dimensions of Hirose DF12 connector on user board (mm)

You can get to know detailed Hirose connector by visiting the website
http://www.hirose-connectors.com

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2.1.3 Dimensions of the Antenna Connector


MU203 provides an interface for connecting an external antenna. The external
antenna is connected to the module through the coaxial connector that is the Hirose
U.FL-R-SMT-1(10) (you can get to know Hirose U.FL-R-SMT-1(10) by visiting the
website http://www.hirose-connectors.com/products/U.FL_1.htm).

Figure 2-7 Dimensions of the antenna connector

Figure 2-8 shows the specifications of the antenna mating connectors (take the ones
with the Hirose part number as U.FL-LP as examples).

Figure 2-8 Specifications of the antenna mating connectors

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For more information about Hirose Ltd., SMD connectors, and mating connectors,
visit the website of Hirose http://www.hirose-connectors.com.

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2.2 Reliability
Table 2-2 Requirements on the environment reliability

Item Test Condition Standard


Frequency range: 5–200 Hz IEC 60068-2-6-
Sinusoidal
Acceleration: 10 m/s2 2007
vibration
Scanning frequency: 1 oct/min
3 axes, 5 cycles for each axis
IEC 60068-2-27-
Shock test Half-sine wave shock
2008
Acceleration: 300 m/ s2
Shock duration: 11 ms
6 axes (±x, ±y, and ±z), 3 shocks for
each axis
IEC 60068-2-29-
Collision test Half-sine wave with peak
1987
acceleration of 180 m/s2
Pulse duration: 6 ms
6 axes, 1000 shocks for each axis
Low temperature: –30oC±2oC IEC 60068-2-14
Temperature
High temperature: +75oC±2oC Na
shock
Changeover time: < 30s
Repetition times: 100
High temperature: +55oC±2oC IEC 60068-2-30
Damp heat
Low temperature: +25oC±2oC -1980
cycling
Humidity: (95±2)%
Repetition times: 2
Test duration: 24 h + 24 h
Temperature: –20±2oC IEC 60068-2-1-
Low-
Test duration: 24 h 2007
temperature
working
Temperature: –30oC±2oC IEC 60068-2-1-
Extended low-
Test duration: 24 h 2007
temperature
working
Temperature: +70oC±2oC IEC 60068-2-2-
High-
Test duration: 24 h 2007
temperature
working
Temperature: +75oC±2oC IEC 60068-2-2-
Extended high-
Test duration: 24 h 2007
temperature
working
Temperature: -40oC±2oC IEC 60068-2-1-
Low-temperature
Test duration: 24 h 2007
storage
Temperature: +85oC±2oC IEC 60068-2-2-
High-temperature
Test duration: 24 h 2007
storage

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Item Test Condition Standard


Test temperature: –20oC to +70oC IEC 60068-2-14
Temperature
Repetition times: 12 Nb
cycling
IEC 60068-2-1-
Dew test Expose the wireless module to the
2007
temperature of –40oC for 2 h.
Expose the wireless module to the
normal temperature of 25oC for 5
min and then perform the function
test.
Perform the function test for six
times.
Temperature: 35°C IEC 60068-2-11-
Salt fog test
Density of the NaCl solution: 5%±1% 1981
Spraying duration: 8 h
PH:6.5~7.2
Duration of drying the wireless
module: 16 h
Dust density: 2 Kg/m3 IEC 60068-2-68-
Dust test
Talc powder granularity: < 75 μm 1994
Test duration: 8 h
Solar radiation strength: 1120 W/m2 IEC 60068-2-9-
Solar radiation
Duration: 24 h (20-hour exposure 2007
test
duration and 4-hour exposure-free
duration)
Repetition times: 3
Six faces and two cycles IEC 60068-2-32-
Drop test
Bumps on level granite plates 1975
High: 0.3m Face: 6 Cycle:10
High: 0.8m Face: 6 Cycle:2

2.3 Temperature
Table 2-3 Operating and storage temperature
Description Minimum Maximum Unit

Operating temperature –20 70 °C


Operating temperature
-30 75 °C
(reduced RF performance)
Storage temperature –40 85 °C
Relative storage humidity 5% 95%

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3 Electrical Specifications

3.1 BTB Connector Pin Definition


Device operations comply with USB 2.0 full speed specifications.
Table 3-1 lists the BTB connector pins of MU203.

Table 3-1 Definition of BTB interface pins


Definition of MU203 Family BTB Interface Pins

Direction
Pin Typ
Pin Description Additional Description to
No. e
Module

Input of the external power


1 VBAT P Input
supply
2 GND - Ground -
Input of the external power
3 VBAT P Input
supply
4 GND - Ground -
Input of the external power
5 VBAT P Input
supply
6 GND - Ground -
Input of the external power
7 VBAT P Input
supply
8 GND - Ground -
Input of the external power
9 VBAT P Input
supply
10 GND - Ground -
11 MODE_LED A Mode indication Output

RTC power supply Input


12 VCOIN P
retaining /Output
13 STATUS_LED A Status indication Output
14 VREG_MSMP P 2.6 V voltage output Output

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Definition of MU203 Family BTB Interface Pins

Direction
Pin Typ
Pin Description Additional Description to
No. e
Module

15 NC - If unused keep pin open -


16 NC - If unused keep pin open -
17 NC - If unused keep pin open -
System power-on or
18 POWER_ON_OFF D Input
power-off
19 NC - If unused keep pin open -
Permission to send data
20 UART_RTS D Output
through the serial interface
21 NC - If unused keep pin open -
22 UART_RING D Call display Output
DTE data sending through
23 UART_RD D Input
the serial interface
24 UART_DSR D Device ready Output
25 NC - If unused keep pin open -
Request for DTE data
26 UART_CTS D sending through the serial Input
interface
DTE data receiving through
27 UART_TD D Output
the serial interface
28 UART_DTR D DTE ready Input
29 NC - If unused keep pin open -
Data carrier detect of the
30 UART_DCD D Output
serial interface
31 NC - If unused keep pin open -
32 FOTA_N D FOTA status indication Output
33 NC - If unused keep pin open -
WAKEUP_SLEEP_I Module sleep or wakeup
34 D Input
N request
35 NC - If unused keep pin open -

Negative pole of the USB Input


36 USB_D- D
data signal /Output
37 NC - If unused keep pin open -

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Definition of MU203 Family BTB Interface Pins

Direction
Pin Typ
Pin Description Additional Description to
No. e
Module

Positive pole of the USB Input


38 USB_D+ D
data signal /Output
39 NC - If unused keep pin open -
WAKEUP_SLEEP_ Module sleep or wakeup
40 D Output
OUT status indication
41 NC - If unused keep pin open -
Clock signal of the FOMA
42 USIM_CLK D Output
card
43 NC - If unused keep pin open -
Power supply of the FOMA
44 VREG_USIM P Output
card
45 NC - If unused keep pin open -

Data input and output of Input


46 USIM_IO D
the FOMA card /Output
Negative pole of the output
47 EAR1_N A Output
of audio interface 1
48 USIM_RST D FOMA card reset Output
Positive pole of the output
49 EAR1_P A Output
of audio interface 1
50 NC - If unused keep pin open -
Negative pole of the input
51 MIC1_N A Input
of audio interface 1
52 GND - Ground -
Positive pole of the input of
53 MIC1_P A Input
audio interface 1
Negative pole of the output
54 SPKR_OUT_N A Output
of audio interface 2
55 GND - Ground -
Positive pole of the output
56 SPKR_OUT_P A Output
of audio interface 2
57 NC - If unused keep pin open -
Negative pole of the input
58 MIC2_N A Input
of audio interface 1

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Definition of MU203 Family BTB Interface Pins

Direction
Pin Typ
Pin Description Additional Description to
No. e
Module

59 NC - If unused keep pin open -


Negative pole of the input
60 MIC2_P A Input
of audio interface 1

Notes:

1. Pin type is P = power; A = analog; D = digital.

2. For details about the description, functions and usage methods of each pin listed in Table 3-1,
see the related chapters.

The Figure 3-1 lists the Pin order of BTB connector. Please define the counterpart on
user board according to the pin sequence of MU203 module.

Figure 3-1 The order of BTB interface pins

3.2 Pin Descriptions


3.2.1 Digital Signal DC Characteristics
HUAWEI MU203 WCDMA M2M Module recommends the application condition as
following table.

Table 3-2 Digital signal DC characteristics


Param Description Minimum Maximum Unit
eter Value Value

VIH High-level input 0.65*VDD_PX VDD_PX +0.3 V


voltage

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VIL Low-level input –0.3 0.35* VDD_PX V


voltage
Ileak Input leakage –0.2 0.2 uA
current
VOH High-level output VDD_PX – VDD_PX V
voltage 0.45
VOL Low-level output 0 0.45 V
voltage
IOH High-level output 1.5 mA
current
IOL Low-level output –1.5 mA
current

Notes:

VDD_PX is 1.8 V for the 1.8 V USIM card (class C) and 2.85 V for the 3 V USIM card (class B). For
other digital I/O interfaces, VDD_PX is 2.6 V.

3.2.2 Power Sources and Grounds


Input Power Supply
For the MU203, the input voltage range is 3.3~4.2 V, which is supplied from the BTB
connector.

Table 3-3 Power and ground specifications


Name Pins Minimum Type Maximum

VBAT 1,3,5,7 and 9 3.3 V 3.8 V 4.2 V

GND 2,4,6,8,10,52 and 55 0V

Notes:

1. The interface on the wireless module must not be powered on before the wireless module is
powered on. Otherwise, the wireless module may be abnormal or damaged.

2. If the external power supply voltage drops below 3.5 V, the connection between the external
power supply and the wireless module must be as short as possible. The input end of the
power supply must use a capacitor of more than 1000 uF to regulate the voltage. Otherwise,
the voltage that is actually input to the wireless module may be lower than 3.3 V, resulting in
the degradation of RF performance, or even the instable operation of the wireless module.

3. The power supply of the wireless module must be stable and within the specified range.
Ensure that no instantaneous disconnection occurs. Design a protection mechanism for the
external circuit to prevent the possible power failure or instantaneous disconnection.

After VBAT has been applied and is stable, the module will generate an on board
power on reset signal and will remain in reset condition until RST is de-asserted.

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After de-assertion of RST, the module will boot up. USB D+ becomes high when
booting is completed, simultaneously the module starts to communicate with host via
USB or UART. Figure 3-2 shows power up timing.
During it’s better to keep VBAT available to avoid startup delays occurred when
power down the module.

Figure 3-2 Power on timing

Table 3-4 Power on timing


Parameter Comments Time(Nominal Units
values)

TPD+ POWER_ON_OFF Valid to 5.2 sec


USB D+ high
TPW POWER_ON_OFF Valid to 2.4 sec
WAKEUP_SLEEP_OUT high
TPD POWER_ON_OFF Valid to 2.4 sec
UART_DCD high
TPRI POWER_ON_OFF Valid to 2.4 sec
UART_RING high
TPRT POWER_ON_OFF Valid to 7.0 sec
UART_RTS de-assert

If PC need to detect the PID/VID of module during the BIOS phase, the detect time
should exceed the TPD+ time.

Figure 3-3 Power off timing

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Table 3-5 Power off timing


Parameter Comments Time(Nominal Units
values)

TPD+ POWER_ON_OFF Valid to 4.1 sec


USB D+ high
TPW POWER_ON_OFF Valid to 4.0 sec
WAKEUP_SLEEP_OUT
high
TPD POWER_ON_OFF Valid to 3.8 sec
UART_DCD high
TPRI POWER_ON_OFF Valid to 3.5 sec
UART_RING high
TPRT POWER_ON_OFF Valid to 4.3 sec
UART_RTS de-assert

Output Power Supply


The wireless module provides two pins for the output power supply. Table 3-66 lists
the power output specifications of the wireless module.

Table 3-6 Power output specifications of the wireless module


Parameter Pins Minimum Typical Maximum Maximum Remarks
Value Value Value output
current

VREG_MSM 14 2.54 V 2.6 V 2.65 V 50 mA —


P

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VREG_USI 44 1.76 V 1.8 V 1.84 V 150 mA Class C


M
2.79 V 2.85 V 2.91 V 150 mA Class B

Notes:

If the external device of the wireless module uses the preceding power supplies, ensure that the
load current does not exceed the maximum output current. Otherwise, the performance of the
power supply degrades.

3.2.3 VCOIN Power source


VCOIN pin of MU203 is used as an analog input from the 3V coin cell for SMPL
(sudden momentary power loss), RTC and crystal oscillator keep-alive power. A
capacitor (rather than a coin cell) can be used if only SMPL is supported (not RTC or
XTAL). VCOIN pin is used as an analog output for coin cell or capacitor charging also.

Table 3-7 VCOIN specifications


Name Pins Minimum Type Maximum

VCOIN 12 1.5 V 3.0 V 3.25 V

Notes:

1. The VCOIN power source is not required. In applications that do not use SMPL or RTC, the
VCOIN pin can be left unconnected.

Sudden momentary power loss


The SMPL feature initiates a power-on sequence without software intervention if the
monitored VBAT drops out-of-range (< 2.55 V nominal) then returns in-range within a
programmable interval of between 0.5 and 2.0 seconds. SMPL achieves immediate
and automatic recovery from momentary power loss. A valid voltage on VCOIN is
required to run the SMPL timer. If a capacitor is used instead of a coin, it must be
connected between VCOIN and ground. The capacitor must be charged to operate
properly as the SMPL power source. The capacitor value depends on the SMPL timer
setting.

Table 3-8 Keep-alive capacitor values vs. SMPL timer settings


SMPL timer setting Capacitor value Capacitor package (X5R)

0.5 sec 1.5 uF 0805


1.0 sec 3.3 uF 0805
1.5 sec 4.7 uF 0805
2.0 sec 6.8 uF 1206

If the SMPL counter expires without VBAT returning to its valid range the MU203
must undergo the normal power-on sequence whenever the VBAT detected.

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Real-time clock
If RTC is used, a manganese-lithium rechargeable battery is suggested, for example,
the SII Micro Parts HB-414 and the ML-series of Panasonic. Two sets of coin cell
specifications are compared in Table 3-79. When the MU203 is off, the crystal
oscillator and RTC continue to run off the coin cell attached to VCOIN.

Table 3-9 Coin cell characteristics

Specifications
Parameter
HB-414 ML-series

Nominal voltage 3V 3V
Nominal capacity 0.3 mAh 3.4 mAh
Continuous standard load 5 mA 10 mA
Operating temperature -20 to +60 -20 to +60
Diameter 4.8 mm 6.8 mm
Height 1.4 mm 1.45 mm
Weight 0.07 g 0.17 g

An interrupt is generated if the coin cell voltage drops too low (and the main battery is
not present). If this interrupt occurs, the RTC might be corrupted. A different interrupt
is generated if the crystal oscillator stops; this signifies that handset timing is no
longer accurate. Again, the RTC is corrupted.
When the VBAT power supply of the MU203 is normal, the coin cell charging is
powered from VBAT. The MU203 reads the coin cell voltage and monitors the
charging. During normal operation, the VCOIN pin voltage will stay above 2.2V, even
when the coin cell charger is turned off.
Figure 3-44 shows the reference RTC circuit.

Figure 3-4 Reference RTC circuit

Notes:

Do not connect a non-rechargeable battery to the VCOIN pin. Otherwise, accidents such as faults
or fires may occur.

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3.2.4 USB Signals


The MU203 is compliant with USB 2.0 full speed specification.

Table 3-10 USB pins


Name Pins Description Direction to Module

USB D- 36 USB data signal D- Input/Output


USB D+ 38 USB data signal D+ Input/Output

Notes:

The USB interface is powered directly from the 3.3 V supply. The USB input/output lines are
compatible with the USB 2.0 3.3 V signal specifications.

Table 3-11 USB signal DC characteristics


VOHmin VOLmax VIHmin VILmax

2.8V 0.3V 2V 0.8V

3.2.5 USIM Signals


The USIM is a smart card for UMTS/GSM cellular applications. The USIM provides
the required subscription information to allow the mobile equipment to attach to a
GSM or UMTS network. The USIM also provides the subscriber's verification
procedures as well as authentication methods for network authentication during the
attach procedures.

Table 3-12 USIM pins


Name Pins Description Direction to
Module

VREG_USIM 44 Power source for the external Output


UIM/SIM.
USIM_IO 46 External UIM/SIM data signal. Input/Output
USIM_CLK 42 External UIM/SIM clock signal. Output
USIM_RST 48 External UIM/SIM reset signal. Output

Notes:

It is recommended that the SIM card is inserted only after the power of the module is
disconnected, otherwise the SIM card can be destroyed.

USIM interface schematic reference

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There is no SIM card interface circuit in MU203, and users need to add the USIM
interface circuit. Figure 3-55 shows the definition of interface signals and the typical
USIM interface schematic.

Figure 3-5 USIM interface schematic on user side

Figure 3-6 Pin definition of SIM Socket

pin1:VREG_USIM

pin2:USIM_RST

pin3:USIM_CLK

pin4:GND

pin5:NULL

pin6:USIM_IO

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Design guide
The USIM signals are connected to the BTB connector (the card edge connector)
and pass through an EMI filtering and ESD protection circuit on MU203 board before
entering MU203 processor. There is also an EMI filtering and ESD protection circuit
between SIM card interface and BTB interface on the user’s board.
1. Power supply
The SIM interface is powered by an internal LDO regulator of MU203. The default
value of this regulator is 2.85 V. The power of the regulator is programmable in the
range of 1.5 V to 3.05 V and is expected to be set to 3.0 V or 1.8 V.
2. Modem signals
After a power-on or reset, the USIM signals are activated to detect if a SIM card is
present and to initialize it if it exists. Once a card has been detected and initialized,
the interface is always on. However, the clock signal is only activated when data is
actually being transferred. The USIM signals from the module are connected to the
level translators and then to the host connector.
z UIM_DETECT pin is optional, according to whether need this function.
z UIM_DATA needn’t add pull-up resistance, it has been pulled up to UIM_PWR by
a 15 kΩ resistor on the module, as the standard ISO/IEC 7816-3 recommends.
z UIM_PWR need add additional decoupling capacitors (range 1uF-
10μF,typevalue 4.7uF ),which place near the SIM slot, also 10pF capacitor are
placed on the signals UIM_RST, UIM_CLK and UIM_DATA each.
These levels exceed those required in ISO/IEC 7816-3.
3. SIM signals
The following data is taken from ETSI standard Specification of the 3 Volt Subscriber
Identity Module - Mobile Equipment (SIM-ME) interface (GSM 11.12 version 4.3.1).

Table 3-13 SIM RST requirements


RST Minimum Maximum

VIL 0 0.2Vcc
VIH 0.7Vcc Vcc

Table 3-14 SIM CLK requirements


CLK Minimum Maximum

VIL 0 0.2Vcc
VIH 0.7Vcc Vcc

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Table 3-15 SIM IO requirements


IO Minimum Maximum

VIL 0 0.4
VIH 0.7Vcc Vcc
VOL –0.3 0.2 Vcc
VOH 0.7 Vcc Vcc+0.3

Notes:

The VOLmax of 0.45 V for the outputs is specified at an output current of 3 mA whereas the
VILmax of 0.4 V for the SIM IO input is specified at an input current of 1 mA. With the smaller
current drive, the output voltage would be driven lower than the stated maximum value.

4. ESD protection
Since the SIM is a CMOS device, ESD protection devices should be placed near to
the SIM connector to provide protection before connecting to the module. In addition,
all the SIM interface signals should be bypassed with a 10 pF capacitor.
The used ESD device (PESD3V3L5UY, NXP) in reference schematic is a low
capacitance 5-fold ESD protection diode arrays in SOT363 package.
5. Clock frequency
The SIM must support clock frequencies between 1 MHz and 4 MHz. (The MU203
can be programmed to generate a clock of 1.625 MHz, 2.6 MHz, or 3.25 MHz).
6. Routing recommendations
The SIM interface signals consist of four signals that are UIM_PWR, UIM_RST,
UIM_CLK, and UIM_DATA ( UIM_Vpp isn’t connected also not used in many
applications). Due to the relatively low clock frequencies involved, the concern is not
the degradation of the SIM signals themselves. The main concern is routing of the
SIM interface signals through areas considered to be of high risk for RF noise
coupling (crosstalk and RF contamination) which can desensitize the radio circuitry.
The general guidelines that should be followed are listed as follows:
z It is recommended that these signals should be routed over a contiguous ground
plane.
z SIM interface signals should not be routed near high transient signals (power
supply chokes and DC/DC switching FETs).
z Avoid routing of these signals near output connectors.
z Keep SIM interface signals isolated from other signals. 2x width spacing (1.5x
min) between SIM interface signals and all other signal routing is recommended.

Certification test
Using test equipment simulates a (U)SIM card to test U(SIM) protocol in GCF or
PTCRB test, Some strange issues may be encountered during SIM/USIM test,
please contact with Huawei for more details.

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3.2.6 UART Interface Signals


The MU203 module has an nine-wire serial port mode with the flow control function.
The nine-wire serial port (UART) supports data services, that is, users can set up the
PPP dial-up connection for data services through UART.
The UART interfaces support programmable data width, data stop bit, and parity
check (or no parity). UART supports a maximum baud rate of 230.4Kbps and a
default baud rate of 115.2Kbps.
The full EIA232 standard defines that, the equipment at the far end of the connection
is named the DTE device (Data Terminal Equipment, usually a computer or terminal),
has a male connector, equipment at the near end of the connection (the user board
interface) is named the DCE device (Data Circuit-terminating Equipment, usually a
modem), has a female connector. The cable linking DTE and DCE devices is a
parallel straight-through cable with no cross-overs or self-connects in the connector
hoods. Figure 3-7 shows the orientation and connector types for DTE and DCE
devices:

Figure 3-7 DCE-DTE connections

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Figure 3-8 MU203 and Female DB 9 connections

Table 3-16 lists the definitions of the interface signals.

Table 3-16 UART interface signals


Pin Name Description Feature Direction to
Module

27 UART_TD Data sending on The DTE Output


the wireless receives serial
module data.
23 UART_RD Data receive end The DTE Input
of the module transmits serial
data.
22 UART_RIN Ringing indication The DTE is Output
G on the wireless notified of a
module remote call.

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20 UART_RTS Data sending The DTE Output


request on the notifies the DCE
wireless module of sending
requests.
28 UART_DTR Data terminal The DTE is Input
ready on the ready.
wireless module
26 UART_CTS Clearing to send The DCE Input
on the wireless switches to the
module receiving mode.
30 UART_DCD Data carrier Data links are Output
detection on the connected.
wireless module
24 UART_DSR Data ready on the The DCE is Output
wireless module ready.

Connect the MU203 to a standard RS-232-C interface through an RS-232 chip.


When a three-wire serial port is used, you are recommended to adopt a MAX3232
chip. Through the MAX3232 chip, the UART_TD signal of the MU203 module is
converted and then sent to the RXD pin of the DTE while the RXD signal of the DTE
is converted and then sent to the UART_RD pin of the MU203 module.

Figure 3-9 Electrical connection diagram of a two-wire serial port

When an nine-wire serial port is used, you are recommended to adopt a MAX3232, a
SP3238 chip, or a MAX3238 chip.

Figure 3-10 Electrical connection diagram of an nine-wire serial port with the flow control
function

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3.2.7 Analog Audio Signals


The MU203 provides two audio I/O channels. Table 3-177 lists the signals on the
audio interface.

Table 3-17 Signals on the audio interface


Pins Name Description

51 MIC1_N Negative pole of the audio input signal of the


first channel
53 MIC1_P Positive pole of the audio input signal of the
first channel
47 EAR1_N Negative pole of the audio output signal of the
first channel
49 EAR1_P Positive pole of the audio output signal of the
first channel
58 MIC2_N Negative pole of the audio input signal of the
second channel
60 MIC2_P Positive pole of the audio input signal of the
second channel
54 SPKR_OUT_N Negative pole of the audio output signal of the
second channel
56 SPKR_OUT_P Positive pole of the audio output signal of the
second channel

The first audio I/O channel is fully differential and thus has good performance of
resisting RF interferences. This channel can be used for the handset audio input and
output without requiring any audio amplifier.

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Because audio signals are in differential pairs, the routes on the printed circuit board
(PCB) should be placed in parallel with each other and should be short. The filter
circuit on the two sides should be symmetric. The differential signals should be close
to each other, and the grounding is required. The audio output signals in differential
pairs and the audio input signals in differential pairs should be separated effectively
through ground. In addition, the audio signals should be away from the circuits of the
power supply, RF, and antenna.
Differentiate and separate functional modules during the PCB design of the DEMO of
MU203.

Figure 3-11 Circuit diagram of the interface of the first audio channel

Differential signals are transmitted though the first audio channel. By reserving a
place for the resistor in the loop, you can adjust the quality and volume of the voice. It
is recommended that a TVS is used on the related interface, to prevent electrostatic
discharge and protect integrated circuit (IC) components.
The second audio channel output can drive a 8-ohm Speaker directly.

Figure 3-12 The connection between HUAWEI MU203 and 8 Ohm speaker

3.2.8 Status Indication Signals


The MU203 has two LEDs, a mode LED and a status LED. The mode LED functions
as the network mode indicator and the status LED function as the signal strength
indicator. The LEDs are controlled by a sink current source. The high voltage is the
voltage of VBAT (with the typical value of 3.8 V).

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Table3-18 lists the LED status pin.

Table 3-18 Definitions of network mode signals and status indication signals
Pins Name Description Additional Direction
Description to Module

11 MODE_LED Mode indicator L: Light on Output


SINK current source H: Light off
Driver current: 10 mA
13 STATUS_LED Status indicator L: Light on Output
SINK current source H: Light off
Driver current: 10 mA

The following table lists the output statuses of the MODE_LED and STATUS_LED.

Table 3-19 Description of the output statuses of the network mode and status indication
signals
No. Operating Status STATUS_LED MODE_LED

1 The 3G network is The indicator blinks Light off


successfully registered. once each time.
2 The dial-up connection is Light on Light off
set up for accessing 3G
data services.
3 3G PS service connected The indicator blinks Light off
in a packet data fast.
connection but actively
transferring data.
4 The software is being Light off The indicator
downloaded or upgraded. blinks fast.
5 The network is being Light off The indicator
searched for or no blinks twice each
network is detected. time.
6 The 2G network is Light off The indicator
successfully registered. blinks once each
time.
7 The dial-up connection is Light off Light on
set up for accessing 2G
data services.

Blinking Once Each Time

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Figure 3-13 Status when the indictor blinks once each time

Blinking Fast

Figure 3-14 Status when the indictor blinks fast

Blinking Twice Each Time

Figure 3-15 Status when the indictor blinks twice each time

External Circuits
Figure 3-16 shows the recommended circuits of the MODE_LED and STATUS_LED
pins. According to LED feature, you can adjust the LED brightness by adjusting the
impedance of resistor R.

Figure 3-16 Recommended circuits of the LED pins

For resistance of R placed on user board, choose the value such that it satisfies the
following equation:

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IF*R+VF = VBAT
VF: Forward Voltage
IF: Forward current
Take the LED 19-213/GVC-AMNB/3T as an example (Its manufacturer is Everlight
Electronics., Ltd. and the website is http://www.everlight.com). Figure3-17 shows its
IF-VF curves. If VBAT is 3.8V and the desired current through the LED IF is 3mA, then
the voltage of the LED VF is 1.5V according to IF-VF curves, the corresponding value
for resistance of R is (3.8-1.5)/0.003=767 Ω.
The brightness of the LED depends on the current value, and for most of the
indicator lights the current from 2mA to 5mA is already enough.

Figure 3-17 LED Typical Electro-Optical Characteristics Curves

3.2.9 WAKEUP_SLEEP_IN Signal


The DTE controls the sleep and wakeup modes of the wireless module through the
WAKEUP_SLEEP_IN signal.
If there is no external WAKEUP_SLEEP_IN signal, the wireless module stays in
wakeup state by default. After receiving the WAKEUP_SLEEP_IN signal, the wireless
module determines whether to enter the sleep mode according to the level status of
the WAKEUP_SLEEP_IN signal.
Please refer to the following table.

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Table 3-20 Definition of the WAKEUP_SLEEP_IN signal


Pin Name Description Direction
to
Module

34 WAKEUP_SLEEP_IN H: DTE wakeup module. Input


L: DTE set module to sleep
mode.

3.2.10 WAKEUP_SLEEP_OUT Signal


The wireless module uses the WAKEUP_SLEEP_OUT signal to indicate the sleep
and wakeup modes of itself.
Please refer to the following table.

Table 3-21 WAKE_NB_N signal


Pin Name Description Direction
to
Module

40 WAKEUP_SLEEP_OUT H: Module is in wakeup mode Output


and module serial/USB is
available.
L: Module is in sleep mode
and serial/USB is not
available.

3.2.11 POWER_ON_OFF Signal


The POWER_ON_OFF signal is provided to allow users to power on or power off the
module.

Table 3-22 POWER_ON_OFF signal


Pin Name Description Direction
to
Module

18 POWER_ON_OFF power on or power off the Input


module.

When the wireless module is powered off and the VBAT power supply reaches the
standard power supply range for more than 3s, the wireless module is powered on if
the power-on key (POWER_ON_OFF pin) is pulled down for more than 0.3s and then
released.

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Figure 3-18 Power-on process of the wireless module

When the wireless module is working, the wireless module is powered off if the
power-on key is pulled down for more than 0.5s and then released.
To ensure the normal power-off of the wireless module, you must ensure that the
power-on key is pulled down for more than 0.5s and then released to the OPEN state.

Figure 3-19 Power-off process of the wireless module

Notes:

When powering on or powering off the wireless module, do not pull down the power-on key
constantly. Otherwise, the wireless module may start abnormally or fail to be powered off normally.

3.2.12 NC Pins
You can leave those pins open if you don’t use them.

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3.3 Power Supply and Consumption


3.3.1 Power Supply
MU203 is supplied by 3.8 V power source or a battery. The detailed requirements are
listed in Table 3-233.

Table 3-23 Power requirements


Parameter Minimum Typical Maximum Ripple Unit
Value Value Value

VBAT 3.3 3.8 4.2 < 50 mVp-p V


(0 Hz to 2.5 GHz)
VCOIN 1.5 3.0 3.25 < 30 mVpp V

If the application design requires an adapter cable between power source and the
module, use a flex cable as short as possible in order to minimize power losses.
In burst transmit mode of GSM/GPRS/EDGE, the instantaneous current of the
module generate, which will pull down the power voltage transitorily and perhaps
result in the reset of the module or host.
Ensure that the voltage drop during transmit burst should not exceed 400mV. In order
to avoid this case, you can add a large bulk capacitor beside the module on the host
side (at least two 1000uF capacitors).

Figure 3-20 Power supply with a 2.2mF capacitor during GSM transmit burst

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Figure 3-21 Power supply without any capacitor during GSM transmit burst

3.3.2 Power Consumption


The power consumptions of MU203 in different scenarios are respectively listed in
Table 3-244, Table 3-255 and 06. The power supply is 3.8V.

Table 3-24 DC power consumption (WCDMA)


Test Value2
Description Band Units Tx Power
MU203 MU203-b

WCDMA 242 241 mA 1 dBm


Band I
352 277 10 dBm
(IMT2100)
553 534 All 13

/ 234 mA 1 dBm
Band VIII
/ 340 10 dBm
(PCS 900)
/ 551 All 13

238 / mA 1 dBm
Band V
335 / 10 dBm
(850M)
505 / All 13

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Test Value2
Description Band Units Tx Power
MU203 MU203-b

235 / mA 1 dBm
Band VI
322 / 10 dBm
(800M)
464 / All 13

Table 3-25 DC power consumption (GSM/GPRS/EDGE)


Test Value2
Description Units PCL Configuration
MU203 MU203-b

315 342 1 Up/1 Down


467 498 mA 3 2 Up/1 Down
/ 716 4 Up/1 Down
GPRS850
174 182 1 Up/1 Down
223 268 mA 15 2 Up/1 Down
/ 424 4 Up/1 Down
319 319 1 Up/1 Down
487 464 mA 3 2 Up/1 Down
/ 673 4 Up/1 Down
GPRS900
173 175 1 Up/1 Down
222 257 mA 15 2 Up/1 Down
/ 402 4 Up/1 Down
246 205 1 Up/1 Down
347 280 mA 0 2 Up/1 Down
/ 383 4 Up/1 Down
GPRS1800
163 133 1 Up/1 Down
201 170 mA 10 2 Up/1 Down
/ 217 4 Up/1 Down
GPRS1900 227 209 1 Up/1 Down
311 293 mA 0 2 Up/1 Down
/ 403 4 Up/1 Down
160 134 mA 10 1 Up/1 Down

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Test Value2
Description Units PCL Configuration
MU203 MU203-b

196 172 2 Up/1 Down


/ 224 4 Up/1 Down
/ 201 1 Up/1 Down
/ 309 mA 8 2 Up/1 Down
/ 427 4 Up/1 Down
EDGE850
/ 148 1 Up/1 Down
/ 199 mA 15 2 Up/1 Down
/ 281 4 Up/1 Down
/ 208 1 Up/1 Down
/ 309 mA 8 2 Up/1 Down
/ 397 4 Up/1 Down
EDGE900
/ 143 1 Up/1 Down
/ 191 mA 15 2 Up/1 Down
/ 267 4 Up/1 Down
/ 169 1 Up/1 Down
/ 229 mA 2 2 Up/1 Down
/ 287 4 Up/1 Down
EDGE1800
/ 130 1 Up/1 Down
/ 162 mA 10 2 Up/1 Down
/ 205 4 Up/1 Down
/ 174 1 Up/1 Down
/ 237 mA 2 2 Up/1 Down
/ 301 4 Up/1 Down
EDGE1900
/ 129 1 Up/1 Down
/ 164 mA 10 2 Up/1 Down
/ 209 4 Up/1 Down

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Table 3-26 DC power consumption(Idle and Suspend)

Scenario Module Idle1 Suspend Unit

WCDMA 2100MHz MU203 43 <3


mA
DRX = 8 (2.56 s) MU203-b 40 <3

GSM 900MHz MU203 50 <3


mA
MFRM = 5 (1.18 s) MU203-b 46 <3

Notes:

1 In idle mode, the module is registered to the network, USB bus is active, no voice or data call
connection is ongoing.

2 The above values are the average of some test samples.

3 All 1 is the setup of test instrument, that means the maximal power transmit.

3.4 ESD Features


3.4.1 Overview
When the MU203 module is used, the ESD protection should be considered. The
ESD performance of the MU203 module has been tested according to the EN61000-
4-2 standard. The Table 3-27 lists the test results.

Table 3-27 ESD performance


Atmospheric discharge: ± 8000 V
USIM card interface
Contact discharge: ± 4000 V
Atmospheric discharge: ± 8000 V
USB Interface
Contact discharge: ± 4000 V

Notes:
The other ports of MU203 are not accessible to the user of the final product (since they are installed
within the device) and therefore, are only protected according to the “Human Body Model”
requirements.

The following sections describe the recommended circuits of the antenna interface
and the USIM card interface.

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3.4.2 ESD Protection of the Antenna Interface


The antenna interface of the MU203 module is sensitive to ESD. Poor ESD
protection can cause permanent damage to internal RF components. Figure 3-2222
shows the recommended ESD-protection circuit of the antenna interface.

Figure 3-22 Recommended ESD-protection circuit of the antenna interface

3.4.3 ESD Protection of the USIM Card Interface


Figure 3-2323 shows the recommended ESD-protection circuit of the USIM card
interface on the MU203 module. The transient voltage suppressor (TVS) diode
should be placed as close to the USIM card connector as possible.

Figure 3-23 Recommended ESD-protection circuit of the USIM card interface

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4 RF Specifications

4.1 Operating Frequencies


Table 4-1 shows the RF bands supported by MU203 family.

Table 4-1 RF bands


Operating Band Tx Rx

UMTS 2100 (Band I) 1920–1980 MHz 2110–2170 MHz


UMTS 1900 (Band II) 1850–1910 MHz 1930–1990 MHz
UMTS 850 (Band V) 824–849 MHz 869–894 MHz
UMTS 900 (Band VIII) 880–915 MHz 925–960 MHz
UMTS 800 (Band VI) 830–840 MHz 875–885 MHz
GSM 850 824–849 MHz 869–894 MHz
GSM 900 880–915 MHz 925–960 MHz
GSM 1800(DCS) 1710–1785 MHz 1805–1880 MHz
GSM 1900(PCS) 1850–1910 MHz 1930–1990 MHz

4.2 Conducted RF Measurement


4.2.1 Test Environment
Test instrument:

R&S CMU200

Power supply:

KEITHLEY 2306

RF cable for testing:


L08-C014-350 of DRAKA COMTEQ or Rosenberger
Cable length: 29 cm

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Compensation for WCDMA 850 MHz or WCDMA 900 MHz: 0.6 dB


Compensation for WCDMA 2100 MHz or WCDMA 1900 MHz: 0.8 dB
Notes:

The compensation for different frequency bands relates to the cable and the test environment.
The instrument compensation needs to be set according to the actual cable conditions.

4.2.2 Test Standards


Huawei modules meet all 3GPP test standards relating to both 2G and 3G. Each
module passes strict tests in factory; and thus the quality of the modules is
guaranteed.

4.3 Conducted Rx Sensitivity and Tx Power


4.3.1 Conducted Receive Sensitivity
The conducted receive sensitivity is a key parameter that indicates the receiver
performance of MU203. The conducted receive sensitivity means the weakest signal
that the module at the antenna port can receive. The BER must meet the 3GPP
protocol requirements in the case of the minimum signal.
The 3GPP Protocol Claim column in Table 4-2 lists the required minimum values,
and the Test Value column lists the tested values of MU203.

Table 4-2 MU203 conducted Rx sensitivity (Unit: dBm)

3GPP Protocol Test Value2


Item
Claim MU203 MU203-b

GSM850 (2.43%1) <–102 -109 -109


GSM900 (2.43%) <–102 -110 -109
GSM1800(2.43%) <–102 -108.5 -109
GSM1900(2.43%) <–102 -109 -109
W2100 (0.1%) <–106.7 -110 -110
W900 (0.1%) <–103.7 / -110
W850 (0.1%) <–104.7 -110 /
W800 (0.1%) <–106.7 -110 /

Notes:

1 % = Bit Error Rate or Block Error Rate.

2 The test values are the average of some test samples.

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4.3.2 Conducted Transmit Power


The conducted transmit power is another indicator that measures the performance of
MU203. The conducted transmit power means the maximum power that the module
tested at the antenna port can transmit. According to the 3GPP protocol, the required
transmit power varies with the power class.
Table 4-3 lists the required ranges of the conducted transmit power of MU203. The
tested values listed in the Test Value column must range from the minimum power to
the maximum power.

Table 4-3 MU203 conducted Tx power (Unit: dBm)


Minimum Maximum Test Value2
Power Power
Item Required in Required in
the 3GPP the 3GPP MU203 MU203-b
Protocol Protocol

GSM850 31 35 32 33
EDGE850 24 30 / 26.5
GSM900 31 35 32 33
EDGE900 24 30 / 26.5
GSM1800 28 32 29.5 30
EDGE1800 23 29 / 26
GSM1900 28 32 29.5 30
EDGE1900 23 29 / 26
W2100 21 25 23 23
W900 21 25 / 23
W850 21 25 22.5 /
W800 21 25 22.5 /

4.4 Antenna Design Requirements


4.4.1 Antenna Design Indicators
Antenna Efficiency
Antenna efficiency is the ratio of the input power to the radiated or received power of
an antenna. The radiated power of an antenna is always lower than the input power
due to the following antenna losses: return loss, material loss, and coupling loss. The
efficiency of an antenna relates to its electrical dimensions. To be specific, the
antenna efficiency increases with the electrical dimensions. In addition, the
transmission cable from the antenna port of MU203 to the antenna is also part of the

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antenna. The cable loss increases with the cable length and the frequency. It is
recommended that the cable loss should be as low as possible, for example, U.FL-
LP-088 made by HRS.
The following antenna efficiency (free space) is recommended for MU203 to ensure
high radio performance of the module:
z Efficiency of the master antenna > 40% (–4 dB)

S11 or VSWR
S11 (return loss) indicates the degree to which the input impedance of an antenna
matches the reference impedance (50 ohm). S11 shows the resonance feature and
impedance bandwidth of an antenna. Voltage standing wave ratio (VSWR) is another
expression of S11. S11 relates to the antenna efficiency. S11 can be measured with a
vector analyzer.
The following S11 values are recommended for the antenna of MU203:
z S11 of the master antenna < –6 dB

Polarization
The polarization of an antenna is the orientation of the electric field vector that rotates
with time in the direction of maximum radiation.
The linear polarization is recommended for the antenna of MU203.

Radiation Pattern
The radiation pattern of an antenna reflects the radiation features of the antenna in
the remote field region. The radiation pattern of an antenna commonly describes the
power or field strength of the radiated electromagnetic waves in various directions
from the antenna. The power or field strength varies with the angular coordinates (θ
and φ), but is independent of the radial coordinates.
The radiation pattern of half wave dipole antennas is the best to wireless terminals.
The radiation pattern of half wave dipole antennas is omnidirectional in the horizontal
plane, and the incident waves of base stations are often in the horizontal plane. For
this reason, the receiving performance is optimal.
The following radiation patterns is recommended for the antenna of MU203:
z Master antenna: omnidirectional

Gain and Directivity


The radiation pattern of an antenna represents the field strength of the radiated
electromagnetic waves in all directions, but not the power density that the antenna
radiates in the specific direction. The directivity of an antenna, however, measures
the power density that the antenna radiates.
Gain, as another important parameter of antennas, correlates closely to the directivity.
The gain of an antenna takes both the directivity and the efficiency of the antenna
into account. The appropriate antenna gain prolongs the service life of relevant
batteries.
The following antenna gain is recommended for MU203-b:

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z Gain of the master antenna ≤ 2.1 dBi


Notes:

1 The antenna consists of the antenna body and the relevant RF transmission cable. Take the
RF transmission cable into account when measuring any of the preceding antenna
indicators.

2 Huawei cooperates with various famous antenna suppliers who are able to make
suggestions on antenna design, for example, Amphenol, Skycross, Pulse etc.

4.4.2 Interference
Besides the antenna performance, the interference on the user board also affects the
radio performance (especially the TIS) of the module. To guarantee high performance
of the module, the interference sources on the user board must be properly controlled.
On the user board, there are various interference sources, such as the LCD, CPU,
audio circuits, and power supply. All the interference sources emit interference
signals that affect the normal operation of the module. For example, the module
sensitivity can be decreased due to interference signals. Therefore, during the design,
you need to consider how to lessen the effects of interference sources on the module.
You can take the following measures: Use an LCD with optimized performance;
shield the LCD interference signals; shield the signal cable of the board; or design
filter circuits.
Huawei is able to make technical suggestions on radio performance improvement of
the module.

4.4.3 Radio Test Environment


The antenna efficiency, antenna gain, radiation pattern, total radiated power (TRP),
and TIS can be tested in a microwave testing chamber.
Huawei has a complete set of OTA test environment (SATIMO microwave testing
chambers and ETS microwave testing chambers). The testing chambers are
certificated by professional organizations and are applicable to testing at frequencies
ranging from 380 MHz to 6 GHz. The test items are described as follows:

Passive Tests
z Antenna efficiency
z Gain
z Pattern shape
z Envelope correlation coefficient

Active Tests
z TRP: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems
z TIS: GSM, WCDMA, CDMA, TD-SCDMA, and LTE systems
Figure 4-1 shows the SATIMO microwave testing chamber.

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Figure 4-1 SATIMO microwave testing chamber

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5 Test and Certification

Product Certifications
Table 5-1 Product Certifications
Certification MU203 MU203-b
CE √ √
FCC √ √
SRRC&CCC&CTA
NCC
A-TICK √
Jate&Telec √
IC
EU RoHS √ √
JGPSSI
SGS RoHS
PVC-Free
GCF √ √
PTCRB
SUPL 1.0
REACH √

Nameplate
Take the MU203-b for example:

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1: CE mark and notified body number


2: Product model
3: FCC ID
4: EU's RoHS mark
5: IMEI number
6: WEEE compliance mark
7: Serial number
8: Part number

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6 Technical Reference

6.1 Layer 1 Specifications (Physical)


z Examples of Channel Coding and Multiplexing TR 25.944
z Physical Layer–General Description TS 25.201
z Physical Channels and Mapping of Transport Channels onto Physical Channels
(FDD) TS 25.211
z Multiplexing and Channel Coding (FDD) TS 25.212
z Spreading and Modulation (FDD) TS 25.213
z Physical Layer–Procedures (FDD) TS 25.214
z Physical Layer–Measurements (FDD) TS 25.215
z 3GPP HSDPA overall description 25.308
z 3GPP HSUPA overall description 25.309
z 3GPP UE radio access capabilities 25.306

6.2 Layer 2 Specifications (MAC/RLC)


z MAC Protocol Specification TS 25.321
z RLC Protocol Specification TS 25.322

6.3 Layer 3 Specifications (RRC)


z UE Interlayer Procedures in Connected Mode TS 25.303
z UE Procedures in Idle Mode TS 25.304
z RRC Protocol Specification TS 25.331

6.4 Layer 3 NAS/Core Network (MM/CM)


z Architectural Requirements for Release 1999 TS 23.121
z NAS Functions Relevant to Mobile Station (MS) in Idle Mode TS 23.122
z Mobile Radio Interface Signaling Layer 3–General Aspects TS 24.007

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z Mobile Radio Interface Layer 3 Specification–Core Network TS 24.008


z PP SMS Support on Mobile Radio Interface TS24.011

6.5 GSM Protocol Specifications


z Mobile Radio Interface Layer 3 Specification, Radio Resource Control Protocol
TS 04.18
z Mobile Station–Base Station System (MS–BSS) interface; Data Link (DL) Layer
Specification TS 04.06
z Digital Cellular Telecommunications System (Phase 2+); Multiplexing and
Multiple Access on the Radio Path TS 05.02
z Technical Specification Group GERAN; Channel coding TS 05.03
z Digital Cellular Telecommunications System (Phase 2+); Radio Subsystem Link
Control TS 05.08
z Digital Cellular Telecommunications System (Phase 2+); Radio Subsystem
Synchronization TS 05.10

6.6 GPRS Protocol Specifications


z Overall Description of the GPRS Radio Interface; stage 2 TS 3.64
z Mobile Radio Interface Layer 3 Specification TS 04.08
z Mobile Radio Interface Layer 3 Specification: Radio Resource Control Protocol
TS 04.18
z General Packet Radio Service (GPRS): Mobile Station (MS)–Base Station
System (BSS) interface; Radio Link Control/Medium Access Control (RLC/MAC)
protocol TS 04.60
z Mobile Station–Serving GPRS Support Node (MS–SGSN) Logical Link Control
(LLC) Layer Specification TS 04.64
z Mobile Station–Serving GPRS Support Node (MS–SGSN); Subnetwork
Dependent Convergence Protocol (SNDCP) TS 04.65
z Multiplexing and Multiple Access on the Radio Path TS 05.02
z Channel Coding TS 05.03
z Modulation TS 05.04
z Radio Transmission and Reception TS 05.05
z General Packet Radio Service (GPRS); Stage 1 TS 22.060
z Mobile Execution Environment (MexE) TS 23.057
z General Packet Radio Service (GPRS) Service description; stage 2 TS 23.060

6.7 General Specifications


z UE Capability Requirements TR 21.904
z UE Radio Access Capabilities TR 25.926
z Vocabulary TR 25.990

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z Radio Interface Protocol Architecture TS 25.301


z Services Provided by the Physical Layer TS 25.302
z Synchronization in UTRAN Stage 2 TS 25.402

6.8 Performance/Test Specifications


z UE Radio Transmission and Reception (FDD) TS 25.101
z Common Test Environments for User Equipment (UE) TS 34.108
z Special Conformance Testing Functions TS 34.109
z Terminal Conformance Specification TS 34.121
z User Equipment (UE) Conformance Specification; Part 1: Protocol Conformance
TS 34.123-1
z User Equipment (UE) Conformance Specification; Part 2: Protocol Conformance
TS 34.123-2

6.9 SIM Specifications


z SIM and IC Card Requirements TS 21.111
z 3rd Gen. Partnership Proj Tech. Spec. Group Terminals; SIM App. Toolkit (USAT)
TS 31.111

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Acronyms and Abbreviations

3G Third Generation
3GPP 3rd Generation Partnership Project
AGPS Assisted GPS
APN Access Point Name
ARPU Average Revenue Per User
BSS Base Station Subsystem
CM Connection Management
CPU Central Processing Unit
CS domain Circuit Switched domain
DTM Digital Trunk Module
EDGE Enhanced Data Rates for GSM Evolution
FDD Frequency Division Duplex
GERAN GSM/EDGE Radio Access Network
GPRS General Packet Radio Service
GPS Global Position System
GSM Global System for Mobile Communications
HSDPA High Speed Downlink Packet Access
HSPA High Speed Packet Access
HSUPA High Speed Uplink Packet Access
IC Integrated Circuit
LCD Liquid Crystal Display
LED Light Emitting Diode
MAC Medium Access Control
MexE Mobile Execution Environment
MID Mobile Internet Device
Mini PCI Express Mini Peripheral Component Interconnect Express

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MM Mobility Management
Modem Modulator Demodulator
MS Mobile Station
MSC Mobile Switching Center
NAS Non-Access Stratum
NMEA National Marine Electronics Association
OS Operating System
OTA Over The Air
PCM Pulse Code Modulation
PIN Personal Identification Number
PnP Plug and Play
PP Point-to-Point
PS domain Packet Switched domain
PUK PIN Unblocking Key
RF Radio Frequency
RLC Radio Link Control
RRC Radio Resource Control
SGSN Serving GPRS Support Node
SIM Subscriber Identity Module
SMS Short Messaging Service
SNDCP Subnetwork Dependent Convergence Protocol
TBD To Be Determined
TIS Total Isotropic Sensitivity
TR Technical Report
TRP Total Radiated Power
TS Technical Specification
UE User Equipment
UMTS Universal Mobile Telecommunications System
USAT USIM Application Toolkit
USB Universal Serial Bus
USIM UMTS Subscriber Identity Module
USSD Unstructured Supplementary Service Data
UTRAN UMTS Terrestrial Radio Access Network

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WCDMA Wideband Code Division Multiple Access


WWAN Wireless Wide Area Network
PCIE CEM specification PCI Express Mini Card Electromechanical Specification

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Safety Information

Read the safety information carefully to ensure the correct and safe use of your
wireless device. Applicable safety information must be observed.

Interference
Power off your wireless device if using the device is prohibited. Do not use the
wireless device when it causes danger or interference with electric devices.

Medical Device
z Power off your wireless device and follow the rules and regulations set forth by
the hospitals and health care facilities.
z Some wireless devices may affect the performance of the hearing aids. For any
such problems, consult your service provider.
z Pacemaker manufacturers recommend that a minimum distance of 15 cm be
maintained between the wireless device and a pacemaker to prevent potential
interference with the pacemaker. If you are using an electronic medical device,
consult the doctor or device manufacturer to confirm whether the radio wave
affects the operation of this device.

Area with Inflammables and Explosives


To prevent explosions and fires in areas that are stored with inflammable and
explosive devices, power off your wireless device and observe the rules. Areas
stored with inflammables and explosives include but are not limited to the following:
z Gas station
z Fuel depot (such as the bunk below the deck of a ship)
z Container/Vehicle for storing or transporting fuels or chemical products
z Area where the air contains chemical substances and particles (such as granule,
dust, or metal powder)
z Area indicated with the "Explosives" sign
z Area indicated with the "Power off bi-direction wireless equipment" sign
z Area where you are generally suggested to stop the engine of a vehicle

Traffic Security
z Observe local laws and regulations while using the wireless device. To prevent
accidents, do not use your wireless device while driving.

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z RF signals may affect electronic systems of motor vehicles. For more information,
consult the vehicle manufacturer.
z In a motor vehicle, do not place the wireless device over the air bag or in the air
bag deployment area. Otherwise, the wireless device may hurt you owing to the
strong force when the air bag inflates.

Airline Security
Observe the rules and regulations of airline companies. When boarding or
approaching a plane, power off your wireless device. Otherwise, the radio signal of
the wireless device may interfere with the plane control signals.

Safety of Children
Do not allow children to use the wireless device without guidance. Small and sharp
components of the wireless device may cause danger to children or cause
suffocation if children swallow the components.

Environment Protection
Observe the local regulations regarding the disposal of your packaging materials,
used wireless device and accessories, and promote their recycling.

WEEE Approval
The wireless device is in compliance with the essential requirements and other
relevant provisions of the Waste Electrical and Electronic Equipment Directive
2002/96/EC (WEEE Directive).

RoHS Approval
The wireless device is in compliance with the restriction of the use of certain
hazardous substances in electrical and electronic equipment Directive 2002/95/EC
(RoHS Directive).

Laws and Regulations Observance


Observe laws and regulations when using your wireless device. Respect the privacy
and legal rights of the others.

Care and Maintenance


It is normal that your wireless device gets hot when you use or charge it. Before you
clean or maintain the wireless device, stop all applications and power off the wireless
device.
z Use your wireless device and accessories with care and in clean environment.
Keep the wireless device from a fire or a lit cigarette.
z Protect your wireless device and accessories from water and vapour and keep
them dry.
z Do not drop, throw or bend your wireless device.

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z Clean your wireless device with a piece of damp and soft antistatic cloth. Do not
use any chemical agents (such as alcohol and benzene), chemical detergent, or
powder to clean it.
z Do not leave your wireless device and accessories in a place with a considerably
low or high temperature.
z Use only accessories of the wireless device approved by the manufacture.
Contact the authorized service center for any abnormity of the wireless device or
accessories.
z Do not dismantle the wireless device or accessories. Otherwise, the wireless
device and accessories are not covered by the warranty.

Emergency Call
This wireless device functions through receiving and transmitting radio signals.
Therefore, the connection cannot be guaranteed in all conditions. In an emergency,
you should not rely solely on the wireless device for essential communications.

Specific Absorption Rate (SAR)


Your wireless device is a radio transmitter and receiver. It is designed not to exceed
the limits for exposure to radio waves recommended by international guidelines.
These guidelines were developed by the independent scientific organization ICNIRP
and include safety margins designed to assure the protection of all persons,
regardless of age and health.
The guidelines use a unit of measurement known as the Specific Absorption Rate, or
SAR. The SAR limit for wireless devices is 2.0 W/kg and the highest SAR value for
this device when tested complied with this limit.

Regulatory Information
The following approvals and notices apply in specific regions as noted.
CE Approval (European Union)
The wireless device is approved to be used in the member states of the EU. The
wireless device is in compliance with the essential requirements and other relevant
provisions of the Radio and Telecommunications Terminal Equipment Directive
1999/5/EC (R&TTE Directive).
Federal Communications Commission Notice (United States): Before a wireless
device model is available for sale to the public, it must be tested and certified to the
FCC that it does not exceed the limit established by the government-adopted
requirement for safe exposure.
The SAR limit adopted by the USA and Canada is 1.6 watts/kilogram (W/kg)
averaged over one gram of tissue. The highest SAR value reported to the FCC for
this device type was compliant with this limit.
FCC Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference, and (2)
this device must accept any interference received, including interference that may
cause undesired operation.

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The antenna(s) used for this transmitter must be installed to provide a separation
distance of at least 20 cm from all persons.
Warning: Changes or modifications made to this equipment not expressly approved
by HUAWEI may void the FCC authorization to operate this equipment.

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Reference Schematic

TBD

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