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WELDING
Welding
Process by which two pieces of similar metals are joined
together without the addition of another metal.
INDICATIONS
• In orthodontics, to join flat structures like bands and brackets
• In pedodontics, to join bands and other appliances
• In prosthodontics, to join wrought wire clasp and repair of
broken metal partial dentures.
Broad electrode for thin material and narrow for thicker for even
distribution of weld nugget (the spot where the parts are joined
together). Insert the weld (parts to be joined) b/w the electrode press the
switch to allow large current
Combination of heat and pressure will join the metal piece together .
Soldering
Soldering is a process where 2 or more metals are joined together by
melting and flowing a filler metal (solder) into the joint. It is of 2 types:
Metal or alloy
Also known as substrate metal.
Different parent metal have different melting
points, wettability and oxide formation.
Thus, solder and the flux have to be chosen
accordingly.
The most common parent/ substrate metals in
orthodontics are stainless steel, beta titanium and
cobalt-chrome.
Filler metal/solder
Alloy of two or more metal
used for joining other metal
together by creating a strong
intermetallic bond between
itself and the parent metal
Qualities of an ideal solder
1. Should melt at lower temp. (at
least 55.6ºC) than the parent
metal.
2. Should have sufficient fluidity
3. Should have ability to wet.
4. Good resistance to corrosion.
5. Acceptable color to produce
an inconspicous joint
Classification of solder
Functions of flux:
1. Eliminates impurities by dissolving any oxide
present and carries them away from the
joint (Solvent) .
2. Reduces any oxides present and exposes
the clean surface (Reducing agent).
3. Covers the metal surface and prevents
access to oxygen so that no oxides can
form. (Surface protection type)
4. Acts as a wetting agent and reduces the
surface tension.
* Presence of oxide layer prevents the flow of solder on the parent metal.
Classification of fluxes
According to their purpose
1. Surface protection type
2. Reducing agent type.
3. Reducing solvent type.
Acc. to their pH
1. Acidic flux . Eg . SiO2.
2. Basic flux. Eg.CaO(lime).
3. Neutral flux. Eg.borax
Acc to their source
1. Organic eg. Rosin flux
2. Inorganic eg.halogenides
Acc to their composition
1. Borax flux: Used for noble metal alloys
2. Flouride flux: Used for base metal alloys
1. Borax flux:
Used for noble metal alloys.
Based on boric or borate compounds such as boric acid and boric anhydrate.
Act as protective and reducing fluxes.
2. Flouride flux:
Used for base metal alloys.
Act as protective, reducing and solvent fluxes.
Flux may be used by painting it on the substrate metal at the junction of pieces to be joined.
Minimal amount of flux should be used. Otherwise it may lead to weakening of the joint and
discoloration.
Antiflux material used to restrict the flow of solder into unwanted areas eg. Graphite,
whiting(calcium carbonate in alcohol), rouge.
Heat sources