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MEMS Processes in EE143 Lecture

This document discusses MEMS process technologies and covers the following key points in 3 sentences: The document is about Lecture 14 of the EE143 Microfabrication Technologies course which focuses on MEMS process technologies. It provides an overview of the ADXL-50 accelerometer chip and its differential capacitive sensing mechanism. Examples of MEMS structures that can be fabricated using the EE143 process including resonators, comb drives, and modularly integrated MEMS/CMOS devices are also presented.

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kareem hamed
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100% found this document useful (1 vote)
207 views8 pages

MEMS Processes in EE143 Lecture

This document discusses MEMS process technologies and covers the following key points in 3 sentences: The document is about Lecture 14 of the EE143 Microfabrication Technologies course which focuses on MEMS process technologies. It provides an overview of the ADXL-50 accelerometer chip and its differential capacitive sensing mechanism. Examples of MEMS structures that can be fabricated using the EE143 process including resonators, comb drives, and modularly integrated MEMS/CMOS devices are also presented.

Uploaded by

kareem hamed
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

EE143  

– Fall  2016
Microfabrication  Technologies

Lecture  14:  MEMS  Process

Prof.  Ming  C.  Wu  


wu@eecs.berkeley.edu
511  Sutardja Dai  Hall  (SDH)

ADXL-­50  Chip  Diagram

M.  C.  Wu 2
2

1
ADXL  Sensors

http://www.analog.com/publications/magazines/Dialogue/
archives/30-­4/acccel.html

M.  C.  Wu 3
3

ADXL  Differential  Capacitive  Sensor

M.  C.  Wu 4
4

2
Differential  Capacitive  Sensing

x0 x0
C1 = C C2 = C
x0 + dx x0 - dx

For  small  displacement:


æ x0 x0 ö
C1 - C 2 = C çç - ÷÷
è x0 + dx x0 - dx ø
- 2 x dx 2
= C 2 0 2 » -C dx
x0 - dx x0
C1 + C2 » 2C

C1 dx
V0 = -VS + × 2VS V0 » - VS
C1 + C 2 x0
C1 - C 2 Output  voltage  is  linearly  
= VS
C1 + C 2 proportional  to  the  displacement

M.  C.  Wu 5
5

ADXL  Block  Diagram  – Open  Loop

Vamp V demo V OUT


d

time

M.  C.  Wu 6
6

3
Close-­Loop  Force-­Feedback  Accelerometers
-­-­ ADXL  50  Block  Diagram
• The  feedback  signal  is  fed  back  to  the  sensing  comb,  keeping  the  combs  
at  nearly  zero  displacement
• The  signal  =  the  voltage  required  to  keep  the  comb  at  zero  displacement

M.  C.  Wu 7
7

ADI’s  ADXL  Family  of  


Accelerometers

M.  C.  Wu 8
8

4
M.  C.  Wu 9
9

MEMS  Structures  in  EE  143  Process  

10

5
MEMS  Structures  in  EE  143  Process  

11

MEMS  Structures  in  EE  143  Process  

12

6
MEMS  Structures  in  EE  143  Process  

13

Si0.35Ge0.65-­MEMS/CMOS  Technology
Schematic  cross-­sectional  view  of  modularly  integrated  devices

• Conventional  CMOS  process  (Al  metallization)


• Structural  layer:  ~65%  Ge,  2.5  µm  thick
– deposited  by  LPCVD  at  450oC  (1µm/hr),  in-­situ  B  doped  (6  W/o)
– no  post-­dep.  anneal  (-­10  MPa  stress;;  ~10-­4/µm  strain  gradient)
• Sacrificial  layer:  100%  Ge,  2  µm  thick
– deposited  by  LPCVD  at  450oC  (~1  µm/hr)
– selectively  removed  using  H2O2 (80oC)  to  release  microstructures

T.-­J.  King-­Liu,  R.  Howe


14

7
Integrated  SiGe-­MEMS/CMOS

Resonator  next  to  Amplifier Resonator  on  top  of  Amplifier


• conventional  layout  of   • smaller  area  -­-­>  lower  cost
integrated  MEMS • reduced  interconnect  parasitics  
-­-­>  improved  performance

A. E. Franke et al., Solid-State Sensor and Actuator Workshop Technical Digest, pp. 18-21, June 2000

T.-­J.  King-­Liu,  R.  Howe


15

Si0.35Ge0.65 Resonator  Response

-­55 Q=70 150


Magnitude  (dB)

Tested  In  Air 100


Phase  (deg.)

-­65
50
-­75 0
-­50
-­85
-­100
-­95 -­150
16 18 20 22 24
Frequency  (kHz)
Q  =  14,000  at  40  µTorr
T.-­J.  King-­Liu,  R.  Howe
16

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