UNIVERSITY OF NUEVA CACERES

COLLEGE OF ENGINEERING AND ARCHITECTURE

CITY OF NAGA

Project Study 1

Design and Fabrication of Thermoelectric

Refrigerator

Datoon, Mary Antonette M.

Olazo, Chloe Faye S.

Bachelor of Science in Mechanical Engineering

March 2019
 Chapter 1

INTRODUCTION

Refrigeration is defined as a process of removing heat from a space or substance and

transfers that heat to another space or substance[1]. Nowadays, one cannot refuse the use of

refrigeration system in our life not only in kitchen but also in shops, industries and

commercial purposes. Today’s compression refrigeration system has given very good

performance but it has been observed during the last two decades that the Ozone layer (O 3) is

slowly destroyed because of the refrigerant (CFC and HFC) used for the refrigeration and air-

conditioning purposes. The common refrigerant used is HFC’s which are leaked and slowly

ascend into the atmosphere. A single molecule of HFC can destroy thousands of O 3

molecules and that's why it has created a threat for the not only to maintain earth eco system

stable but also to existence of earth [2].

Although researches are going on, better alternatives for the CFC refrigerants is still

on the hunt. So instead of using conventional refrigeration an alternative way was introduced

by using Thermoelectric Refrigeration.The basic concept behind thermoelectric (TE)

technology is the Peltier effect. The Peltier effect occurs whenever electrical current flows

through two dissimilar conductors; depending on the direction of current flow, the junction of

the two conductors will either absorb or release heat[3].

Semiconductor thermoelectric coolers (also known as Peltier coolers) offer several

advantages over conventional systems. They are entirely solid-state devices, with no moving

parts; this makes them rugged, reliable, and quiet. They use no ozone depleting

chlorofluorocarbons, potentially offering a more environmentally responsible alternative to

conventional refrigeration. They can be extremely compact, much more so than compressor-
based systems. Precise temperature control (< ± 0.1 °C) can be achieved with Peltier

coolers[4]. However, their efficiency is low compared to conventional refrigerators. Thus,

they are used in niche applications where their unique advantages outweigh their low

efficiency. Although some large-scale applications have been considered (on submarines and

surface vessels), Peltier coolers are generally used in applications where small size is needed

and the cooling demands are not too great, such as for cooling electronic components.

The researchers’ goals are to introduce the new refrigeration system using

thermoelectric which can overcome the existing disadvantages of refrigeration system. It also

aims to design and develop a compact refrigerator using thermoelectric coolers that

minimized the use of electricity and that can be constructed from local materials for a

reasonable cost.

The refrigeration system must have storage capacity of 18 L inner volume that

utilizes the Peltier effect to cool and maintain a selected temperature range of 10oC to 15oC.

The design requirements are to cool this volume to temperature within a short period of time

and capable of maintaining the temperature of the materials for a long duration Even though

the system is designed for maintaining a fixed chamber temperature throughout the

operational period, the design should be such that it is adaptable for refrigerating the chamber

from ambient temperature to the required temperature.

Through this research, it may help to improve studies regarding future applications in

refrigeration industry. Since the issues of food safety, health and energy manifests,

refrigeration is essential to mankind. Having knowledge, young people will incite to turn to

promising aid their curiosity and do further investigations and studies regarding this matter.
 This study focuses on design and development of thermoelectric refrigerator for small

scale cooling, determining the performance for larger application such as industrial

refrigeration is the limit of this study.

 Chapter 2

REVIEW OF RELATED LITERATURE

This chapter presents the related literature and studies that has significant relation and

contribution to the study. This section also contained the theory that serve as proponent’s

guide towards the possible completion of the research. Important points were quoted to

support the proponent’s ideas.

Refrigerator
A refrigerator is a device used to store food and drink. Modern refrigerators differ in

terms of their sizes, capacity, cooling system, features and etc.

Types of Refrigerator

Mini

Yes, refrigerators, indeed are one of the important equipment in our home. But how

does it differ to the typical ref? Because of their size, they cost lessand take up a lot less

space in a home.
 Commercial

If you are into a business where there is a need of refrigerator, this type of refrigerator

is perfectly suited for you. It is important that you consider whether you are going to be using

the refrigerator in storage where your customers will not see it or if you are going to be

displaying food for purchase in your store.Considering its size, you can store more things in

it unlike the mini ref.

Wine Refrigerator

A wine lover? A good wine refrigerator is essential for maintaining your wine

collection at its optimum temperature. Wine refrigerators are available in a variety of sizes

and styles.
 Compact Refrigerators

Compact refrigerators are larger than their mini fridge counterparts. In terms of

interior space, these refrigerators range from 3 to 7 or more cubic feet.[5] They are handy and

it is not costly. Unfortunately, only fewer drinks and beverages can kept here.

Portable Refrigerators

Portable refrigerators may be small and offer the least amount of storage. Portable

fridges often resemble coolers, but they keep food cool through other methods besides ice.

Thermoelectric Cooling

A thermoelectric (TE) cooler, sometimes called a thermoelectric module or Peltier

cooler, is a semiconductor-based electronic component that functions as a small heat pump.

By means of applying a low voltage DC power source to a TE module, heat will be moved

through the module from one side to the other. Since the module has two opposite sides,
whenthe other face is being cooled simultaneously, the other one is heated. When the heat is

to be moved in the opposite direction, a change in polarity takes place.Since a thermoelectric

module may be used for both heating and cooling, it is highly suitable for precise temperature

control applications. [6]

Although thermoelectric coolers and mechanical refrigerators are governed by

fundamental laws of thermodynamics and refrigeration systems, their difference in form and

function are easy to determine. [7]

In a mechanical refrigeration unit, there is a need for a compressor to raise the

pressure of a liquid and makes the refrigerant circulates through the system. In the evaporator

or “freezer” area,when the refrigerant boils and turned to be a vapor, it absorbs the heat

causing the freezer to become cold. The heat absorbed in the freezer area is moved to the

condenser where it is transferred to the environment from the condensing refrigerant. In a

thermoelectric cooling system, the semiconductor material is being doped in order to upset

the bonds and free up charge carriers and it is essentially takes the place of the liquid

refrigerant, the condenser is replaced by a finned heat sink, and the compressor is replaced by

a DC power source. The application of DC power to the thermoelectric module causes

electrons to move through the semiconductor material. At the cold end (or “freezer side”) of

the semiconductor material, heat is absorbed by the electron movement, moved through the

material, and expelled at the hot end. Since the hot end of the material is physically attached

to a heat sink, the heat is passed from the material to the heat sink and then, in turn,

transferred to the environment. [8]

History

The principles upon which modern thermoelectric coolers are based takes place in

early 1800’s, although commercial TE modules were not available until almost 1960. The

first important discovery relating to thermoelectricity occurred in 1821 when a German

scientist, Thomas Seebeck, found that an electric current would flow continuously in a closed

circuit made up of two dissimilar metals provided that the junctions of the metals were

maintained at two different temperatures. In 1834, a French watchmaker and part time

physicist, Jean Peltier, while investigating the “Seebeck Effect,” found that there was an

opposite phenomenon whereby thermal energy could be absorbed at one dissimilar metal

junction and discharged at the other junction when an electric current flowed within the

closed circuit. Twenty years later, William Thomson (eventually known as Lord Kelvin)

issued a comprehensive explanation of the Seebeck and Peltier Effects and described their

interrelationship. At the time, however, these phenomena were still considered to be mere

laboratory curiosities and were without practical application. [9]

In the 1930’s, the Russian scientists began studying some of the earlier thermoelectric

work in an effort to construct power generators for use at remote locations throughout the

country. Due to their interest in thermoelectricity, they eventually caught the attention of

different people around the world, inspired them to finally start the development of practical

thermoelectric modules. Today’s thermoelectric coolers make use of modern semiconductor

technology whereby doped semiconductor material takes the place of dissimilar metals used

in early thermoelectric experiments. [10]

Thermoelectric Effects

The Seebeck Effect

The Seebeck effect is the conversion of heat directly into electricity at the junction of

different types of wire. It is named for the Baltic German physicist Thomas Johann Seebeck.

The Seebeck effect is a classic example of an electromotive force (emf) and leads to

measurable currents or voltages inthe same way as any other emf. [11]

Thermoelectric power supply generators are based on the Seebeck effect which is

based on voltage generation along a conductor subjected to a gradient of temperature. When

a temperature gradient is applied to a conductor, an electromotive force is produced. The

voltage difference generated is proportional to the temperature difference across the

thermoelectric module between the two junctions. [12]

Figure 2.1: Schematic Representation of Seebeck Effect (Ferrotec,USA)

Peltier Effect
 It states that ”when an electric current flows across two dissimilar conductors, the

junction of the conductors will either absorb or emit heat depending on the flow of the

electric current”. The heat absorbed or released at the junction is proportional to the input

electric current. The constant of proportionality is called the Peltier coefficient. [13]

Figure 2.2: Schematic Representation of Peltier Effect

When a current is made to flow through a junction between two conductors A and B,

heat may be generated (or removed) at the junction. The Peltier heat generated at the junction

per unit time, Q, is equal to;

QαI

Q = πabI

πab= πa-πb

where (πa & πb) is the Peltier coefficient of conductor A & B, and I is the electric

current (from A to B)

Thomson Effect

The Thomson effect is one of three reversible thermoelectric phenomena (often

known simply as thermoelectric effects), the others are the Seebeck effect and the Peltier

effect. In 1851, William Thomson(later Lord Kelvin) was led b to conclude that sources

ofelectromotive force (emf) exist in a thermoelectric circuit in addition to those located at the
junctions. According to him, he predicted that an emf would arise within in a singleconductor

whenever a temperature gradient was present. Since A temperature gradient is the change in

temperature over a specified distance between two locations.[14]

Figure 2.3: Schematic Representation of Thomson Effect

Parts of Peltier Module

The thermoelectric module consists of thermocouple formed by pairs of P-type and

N-type semi-conductor thermoelement which are electrically connected in series

configuration and thermally connected in parallel configuration. Due to their solid state

construction the modules are considered to be highly reliable. For most applications, they

will provide long, trouble free service. For cooling application, an electrical current supply is

given to the module, heat is transferred from one side to the other, and the result is that the

module will become cooler at one side and hotter at the other side. [15]
 Figure 2.4: Parts of Peltier Module

How Thermoelectric Works

“How Thermoelectric Works”, Journal of Tellurex Corporation (2006), the basic

concept behind thermoelectric (TE) technology is the Peltier effect—a phenomenon first

discovered in the early 19th century. In the world of thermoelectric technology,

semiconductors (usually Bismuth Telluride) are the material of choice for producing the

Peltier effect—in part because they can be more easily optimized for pumping heat, but also

because designers can control the type of charge carrier employed within the conductor [16]

Using this type of material, a Peltier device (i.e., thermoelectric module) can be

constructed—in its simplest form—around a single semiconductor “pellet” which is soldered

to electrically-conductive material on each end (usually plated copper). In this “stripped-

down” configuration, the second dissimilar material required for the Peltier effect, is actually

the copper connection paths to the power supply. It is important to note that the heat will be
moved (or “pumped”) in the direction of charge carrier movement throughout the circuit

(actually, it is the charge carriers that transfer the heat). [17]

In Figure 2.5a, “N-type” semiconductor material is used to fabricate the pellet so that

electrons (with a negative charge) will be the charge carrier employed to create the bulk of

the Peltier effect. With a DC voltage source connected, the electrons will be repelled by the

negative pole and attracted by the positive pole of the supply; this forces electron flow in a

clockwise direction (as shown in the drawing). With the electrons flowing through the Ntype

material from bottom to top, heat is absorbed at the bottom junction and actively transferred

to the top junction—it is effectively pumped by the charge carriers through the

semiconductor pellet. In the thermoelectric industry, “P-type” semiconductor pellets are also

employed. Ptype pellets are manufactured so that the charge carriers in the material are

positive (known in electronics as holes). These holes enhance the electrical conductivity of

the P-type crystalline structure, allowing electrons to flow more freely through the material

when a voltage is applied. Positive charge carriers are repelled by the positive pole of the DC

supply and attracted to the negative pole; thus hole current flows in a direction opposite to

that of electron flow. Because it is the charge carriers inherent in the material which convey

the heat through the conductor, use of the P-type material results in heat being drawn toward

the negative pole of the power supply and away from the positive pole. This contrasting heat-

pumping action of P and N-type materials is very important in the design of practical TE

devices. [18]

)
(a) (b)

Figure 2.5: Configuration of Peltier Module (Tellurex Corporation)

While Figure 2.5b—for simplicity’s sake—shows hole flow through the connections

to the power supply, in reality, electrons are the charge carriers through the copper pathways.

Heat Sink Considerations

The heat sink is an integral part of a thermoelectric cooling system and its importance

to total system performance must be emphasized. Since all operational characteristics of TE

devices are related to heat sink temperature, heat sink selection and design should be

considered carefully. [19]

A perfect heat sink would be capable of absorbing an unlimited quantity of heat

without displaying any increase in temperature. Since this is not possible in practice, the

designer must select a heat sink that will have an acceptable temperature rise while handling

the total heat flow from the TE device(s). When considering acceptable increase in heat sink

temperature, necessarily, it depends upon the specific application, but because a TE module’s

heat pumping capability decreases with increasing temperature differential, it is highly

desirable to minimize this value. A heat sink temperature rise of 5 to 15°C above ambient (or

cooling fluid) is typical for many thermoelectric applications. (Ferrotec, USA) [120]
 Several types of heat sink includes natural convection, forced convection, and liquid-

cooled. You might consider natural convection heat sinks on very low power applications

especially when using small TE devices operating at 2 amperes or less. For the majority of

applications, natural convection heat sinks won’t beable to remove the required amount of

heat from the system, forced convection or liquid-cooled heat sinks can be a possible option.

[21]Heat sink performance usually is specified in terms of thermal resistance (Q):

Ts−Ta
Qs= Q

where:

Qs = Thermal Resistance in Degrees C per Watt

Ts = Heat Sink Temperature in Degrees C

Ta = Ambient or Coolant Temperature in Degrees C

Q = Heat Input to Heat Sink in Watts

Note that when you combined thermoelectric cooling modules and heat sinks into a

total thermal system, normally, it is NOT necessary to take into consideration, the heat loss

or temperature rise at the module to heat sink junctions. When using commercially available

heat sinks for thermoelectric cooler applications, you should be aware of certain situation that

the off-the-shelf units do not have adequate surface flatness. A flatness of 1mm/m (0.001

in/in) or better is recommended for satisfactory thermal performance. To meet your flatness

specs in the units, it is necessary to perform an additional lapping, flycutting, or grinding

operation. [22]

Natural convection heat sinks

 Natural convection heat sinks normally are useful only for low power applications

where very little heat is involved, most natural convection heat sinks have a thermal

resistance (Qs) greater than 0.5°C/watt and often exceeding 10°C/watt. A natural convection

heat sink should be positioned so that (a) the long dimension of the fins is in the direction of

normal air flow, vertical operation improves natural convection and (b) there are no

significant physical obstructions to impede air flow. You have to consider, most importantly,

heat generating components that are located near the heat sink can increase the ambient air

temperature, thereby affecting overall performance. [23]

Probably the most common heat-sinking method used with thermoelectric coolers is

forced convection. When compared to natural convection heat sinks, substantially better

performance can be realized. The thermal resistance of quality forced convection systems

typically falls within a range of 0.02 to 0.5°C/watt. Cooling air may be supplied from a fan or

blower and may either be passed totally through the length of the heat sink or may be

directed at the center of the fins and pass out both open ends. This second air flow pattern,

illustrated in Figure (2.6), generally provides the best performance since the air blown into

the face of the heat sink creates greater turbulence resulting in improved heat transfer. For

optimum performance, the housing of an axial fan should be mounted a distance of 8-20mm

(0.31-0.75″) from the fins. Other configurations may be considered depending on the

application.
 Figure 2.6: Forced Convection Heat Sink System Showing Preferred Air Flow

The thermal resistance of heat sink extrusions often is specified at an air flow rate

stated in terms of velocity whereas the output of most fans is given in terms of volume. [24]

The conversion from volume to velocity is:

Volume
Velocity =
Cross−sectional Areaof Air Passage

Cubic Feet per Minut

or: Linear Feet per Minute =
Area∈ Square Feet

Cubic Feet per Minute

or: Linear Meters per Minute =
Area∈Square Meters

Liquid cooled heat sinks

Liquid cooled heat sinks can exhibit a very low thermal resistance, thus providing the

highest thermal performance per unit volume when optimally designed. Although there are

many exceptions, the thermal resistance of liquid cooled heat sinks typically falls between

0.01 and 0.1°C/watt. You can create simple liquid heat sinks by soldering copper tubing onto
a flat copper plate or by drilling holes in a metal block through which water may pass. With

greater complexity (and greater thermal performance), an elaborate serpentine water channel

may be milled in a copper or aluminum block that later is sealed-off with a cover plate. We

can contemplate several liquid-type heat sinks that can be advantageous in the thermoelectric

system. When considering other commercial heat sinks, always check the surface flatness

prior to installation. While liquid cooling may be considered undesirable and/or

unsatisfactory for many applications, it may be the only viable approach in specific

situations. [25]

Installation of Thermoelectric Modules

When we install thermoelectric modules in a cooling system there are certain

techniques that are extremely important. When these basic principles are not met, it may

result in unsatisfactory performance or reliability. Some of the factors to be considered in

system design and module installation include the following:

 Thermoelectric modules have high mechanical strength in the compression

mode but shear strength is relatively low. As a result, a TE cooler should not

be designed into a system where it serves as a significant supporting member

of the mechanical structure.

 All interfaces between system components must be flat, parallel, and clean to

minimize thermal resistance. High conductivity thermal interface material is

often used to ensure good contact between surfaces.

 The “hot” and “cold” sides of standard thermoelectric modules may be

identified by the position of the wire leads. Wires are attached to the hot side

of the module, which is the module face that is in contact with the heat sink.

For modules having insulated wire leads, when the red and black leads are

connected to the respective positive and negative terminals of a DC power

supply, heat will be pumped from the module’s cold side, through the module,

and into the heat sink. Note that for TE modules having bare wire leads, the

positive connection is on the right side and the negative connection is on the

left when the leads are facing toward the viewer and the substrate with the

leads attached presented on the bottom.

 When cooling below ambient, the object being cooled should be insulated as

much as possible to minimize heat loss to the ambient air. To reduce

convective losses, fans should not be positioned so that air is blowing directly

at the cooled object. Conductive losses also may be minimized by limiting

direct contact between the cooled object and external structural members.

 When cooling below the dew point, moisture or frost will tend to form on

exposed cooled surfaces. To prevent moisture from entering a TE module and

severely reducing its thermal performance, an effective moisture seal should

be installed. This seal should be formed between the heat sink and cooled

object in the area surrounding the TE module(s). Flexible foam insulating tape

or sheet material and/or silicone rubber RTV are relatively easy to install and

make an effective moisture seal. Several methods for mounting thermoelectric

 modules are available and the specific product application often dictates the

method to be used. Possible mounting techniques are outlined in the following

paragraphs. [26]

Clamping

The most common mounting method that involves clamping the thermoelectric

module(s) between a heat sink and flat surface of the article to be cooled.[27] This approach,

as illustrated in Figure 2.7.

Figure 2.7: Typical Fastener Components

Bonding with Epoxy

A second module mounting method that is useful for certain applications involves

bonding the module(s) to one or both mounting surfaces using a special high thermal-

conductivity epoxy adhesive. [28]

Soldering
 The metallized external faces of the thermoelectric module may be soldered into an

assembly provided to prevent module overheating. When a soldering a rigid structural

member of an assembly it should be performed on one side of the module only (normally the

hot side) in order to avoid excessive mechanical stress on the module. Note that with a

module’s hot side soldered to a rigid body, however, a component or small electronic circuit

may be soldered to the module’s cold side provided that the component or circuit is not

rigidly coupled to the external structure. Good temperature control must be maintained

within the soldering system in order to prevent damage to the TE module due to overheating.

Thermoelectric modules are rated for continuous operation at relatively high temperatures

(150 or 200 °C) so they are suitable in most applications where soldering is desirable.

Naturally these relative temperatures should not be exceeded in the process. Since the

coefficients of expansion of the module ceramics, heat sink and cooled object vary, we do

not recommend soldering modules larger than 15 x 15 millimeters. [29]

Power Supply Requirements

Thermoelectric coolers operate directly from DC power suitable power sources, it can

range from batteries to simple unregulated DC power supplies to extremely sophisticated

closed-loop temperature control systems. The thermoelectric cooling module has a low-

impedance semiconductor device that presents a resistive load to its power source. The nature

of the Bismuth Telluride material present in the thermoelectric modules, it exhibits a positive

resistance temperature coefficient of approximately 0.5 percent per degree C based on

average module temperature. For many noncritical applications, a lightly filtered

conventional battery charger may provide adequate power for a TE cooler. Simple
temperature control may be obtained through the use of a standard thermostat or by means of

a variable-output DC power supply used to adjust the input power level to the TE device. In

applications where the thermal load is reasonably constant, a manually adjustable DC power

supply often will provide temperature control on the order of +/- 1°C over a period of several

hours or more. Where precise temperature control is required, a closed-loop (feedback)

system generally is used whereby the input current level or duty cycle of the thermoelectric

device is automatically controlled. With such a system, temperature control to +/- 0.1°C may

be readily achieved and much tighter control is not unusual. [30]

Figure 2.8, illustrates a simple power supply capable of driving a 71-couple, 6-

ampere module. This circuit features a bridge rectifier configuration and capacitive-input

filter. With suitable component changes, a full-wave-center-tap rectifier could be used and/or

a filter choke added ahead of the capacitor. A switching power supply, having a size and

weight advantage over a comparable linear unit, also is appropriate for powering for

powering thermoelectric devices. [31]

Figure 2.8: Simple Power Supply to Drive a 71-Couple, 6-Ampere TE Module

 A typical analog closed-loop temperature controller is illustrated in Figure 2.9. This

system is capable of closely controlling and maintaining the temperature of an object and will

automatically correct for temperature variations by means of the feedback loop. Many

variations of this system are possible including adaptation to digital and/or computer control.

[32]

Figure2.9:Block Diagram of a Typical Closed-Loop Temperature Controller

Thermal System Design Considerations

Active load

The active heat load is the actual heat generated by the component, “black box” or

system to be cooled. For most applications, the active load will be equal to the electrical

power input to the article being cooled (Watts = Volts x Amps) but in other situations the

load may be more difficult to determine. [33]

Passive Heat Load

The passive heat load (sometimes called heat leak or parasitic heat load) is that heat

energy which is lost or gained by the article being cooled due to conduction, convection,
and/or radiation. Passive heat losses may occur through any heat-conductive path including

air, insulation, and electrical wiring. In applications where there is no active heat generation,

the passive heat leak will represent the entire heat load on the thermoelectric cooler. [34]

Heat transfer equations

Several fundamental heat transfer equations are presented in evaluating some of the

thermal aspects of a design or system. [35]

Heat conduction through a solid material

The relationship that describes the transfer of heat through a solid material was

suggested by J.B. Fourier in the early 1800’s. Thermal conduction is dependent upon the

geometry and thermal conductivity of a given material plus the existing temperature gradient

through the material. Although thermal conductivity varies with temperature, the actual

variation is quite small and can be neglected for our purposes. [36] Mathematically, heat

transfer by conduction may be expressed as:

KΔTA
Q= x

Heat transfer from an exposed surface to ambient by convection

Heat leak to or from an uninsulated metal surface can constitute a significant heat

load in a thermal system. Isaac Newton proposed the relationship describing the transfer of

heat when a cooled (or heated) surface is exposed directly to the ambient air. To account for

the degree of thermal coupling between the surfaces and surrounding air, a numerical value
(h), called the Heat Transfer Coefficient, must be incorporated into the equation. [37] Heat

lost or gained in this manner may be expressed mathematically as:

Q=(h)(A)(DT)

Heat transfer through the walls of an insulated enclosure

Heat leak to or from an insulated container combines an element of thermal

conduction through the insulating material with an element of convection loss at the external

insulation surfaces. [38] Heat lost from (or gained by) an insulated enclosure may be

expressed mathematically as:

ΔT x Area
Qpassive = 1 x
+
h k

Time needed to change the temperature of an object

Determination of the time required to thermoelectrically cool or heat a given object is

a moderately complicated matter. For good accuracy, it would be necessary to make a

detailed analysis of the entire thermal system including all component parts and interfaces.

By using the simplified method presented here, however, it is possible to make a reasonable

estimate of a system’s thermal transient response. [39]

mCpΔT
t= Q

Thermal insulation considerations

 In order to maximize thermal performance and minimize condensation, all cooled

objects should be properly insulated. Insulation type and thickness often is governed by the

application and it may not be possible to achieve the optimum insulation arrangement in all

cases. All effort should be made, however, to prevent ambient air from blowing directly on

the cooled object and/or thermoelectric device. [40]

Figures 2.10 and 2.11 illustrate the relationship between the heat leak from an

insulated surface and the insulation thickness. Thicker insulation will provide a significant

reduction in heat loss. The two heat leak graphs show heat loss in watts per square unit of

surface area for a one degree temperature difference (DT) through the insulation. [41] Total

heat leak (Qtot) in watts for other surface areas (SA) or DT’s may be calculated by the

expression:

QT = SAQleakDT

Figure 2.10: Heat Leak from an Insulated Surface in Metric Units (Ferrotec,USA)
Figure 2.11: Heat Leak from an Insulated Surface in English Units (Ferrotec, USA)

Thermal Insulation Materials

There are plenty of cheap and common insulation materials available on the market

today. Many of these have been around for quite some time. Each of these insulation

materials has their own ups and downs. As a result, when deciding which insulation material

should use, one must be aware of which material would work best in the situation. [42]

Material Thermal Conductivity (W/m-K)

Diamond 1000

Steel 50.2

Aluminum 205

Asbestos 0.08

Polysterene 0.033

Lead 34.7

Wood 0.12-0.04
 Table 2.1:

Related Studies

The review of related studies is an essential part of any research. It is a crucial aspect

of the planning of the study.

(SuwitJugsujinda, AthornVora-ud and TosawatSeethawan et.al, 2015) The

refrigeration system of thermoelectric refrigerator (TER; 25 x 25 x 35cm3) was fabricated by

using a thermoelectric cooler (TEC; 4 x 4cm2) and applied electrical power of 40W. The TER

does not have cooling fan for the coldness which circulates in the refrigerator. The

temperature of the TER was measured at ten points to check the cooling system. The current,

differential temperature, time, and coefficient of performance (COP) were analyzed. TEC

cold plate temperature (Tc) was decreased from 30 ºC to –4.2 ºC for 1 hr and continuously

decreasing to –7.4 ºC for 24 hrs and 50 ºC for hot plate temperature (Th). The TER

temperature was decreased from 30 ºC to 20 ºC in 1 hr and slowly decreasing temperature for

24 hrs. The maximum COP of TEC and TER were 3.0 and 0.65, respectively.

(Chen et. al 2016) :- Compared the performance of single stage and two stage

thermoelectric refrigeration system. For this, they established cycle model of single and two

stage TER system and derived general expressions of three important performance

parameters such as COP, rate of refrigeration and power input. It states maximum COP of

two stage is larger than that of a single stage but maximum rate of refrigeration is smaller. In

general, it is more convenient to use directly a single stage thermoelectric refrigeration

system when the temperature ratio of the heat sink to the cooled space is small. However,

when the temperature ratio of the heat sink to the cooled space is larger, both the maximum
COP and the maximum rate of refrigeration system are larger than those of a single stage

thermoelectric refrigeration system. The study of Chen et. al., provide some theoretical bases

for the optimal design and operation of a two stage thermoelectric refrigeration system.

Chapter III

DESIGN AND FABRICATION OF THERMOELECTRIC REFRIGERATOR

Introduction

Refrigeration is defined as a process of removing heat from a space or substance and

transfers that heat to another space or substance[1]. Nowadays, one cannot refuse the use of

refrigeration system in our life not only in kitchen but also in shops, industries and

commercial purposes. Today’s compression refrigeration system has given very good

performance but it has been observed during the last two decades that the Ozone layer (O 3) is

slowly destroyed because of the refrigerant (CFC and HFC) used for the refrigeration and air-

conditioning purposes. The common refrigerant used is HFC’s which are leaked and slowly

ascend into the atmosphere. A single molecule of HFC can destroy thousands of O 3

molecules and that's why it has created a threat for the not only to maintain earth eco system

stable but also to existence of earth [2].

Although researches are going on, better alternatives for the CFC refrigerants is still

on the hunt. So instead of using conventional refrigeration an alternative way was introduced

by using Thermoelectric Refrigeration.The basic concept behind thermoelectric (TE)

technology is the Peltier effect. The Peltier effect occurs whenever electrical current flows

through two dissimilar conductors; depending on the direction of current flow, the junction of

the two conductors will either absorb or release heat[3].

 Semiconductor thermoelectric coolers (also known as Peltier coolers) offer several

advantages over conventional systems. They are entirely solid-state devices, with no moving

parts; this makes them rugged, reliable, and quiet. They use no ozone depleting

chlorofluorocarbons, potentially offering a more environmentally responsible alternative to

conventional refrigeration. They can be extremely compact, much more so than compressor-

based systems. Precise temperature control (< ± 0.1 °C) can be achieved with Peltier

coolers[4]. However, their efficiency is low compared to conventional refrigerators. Thus,

they are used in niche applications where their unique advantages outweigh their low

efficiency. Although some large-scale applications have been considered (on submarines and

surface vessels), Peltier coolers are generally used in applications where small size is needed

and the cooling demands are not too great, such as for cooling electronic components.

The researchers’ goals are to introduce the new refrigeration system using

thermoelectric which can overcome the existing disadvantages of refrigeration system. It also

aims to design and develop a compact refrigerator using thermoelectric coolers that

minimized the use of electricity and that can be constructed from local materials for a

reasonable cost.

The refrigeration system must have storage capacity of 18 L inner volume that

utilizes the Peltier effect to cool and maintain a selected temperature range of 10oC to 15oC.

The design requirements are to cool this volume to temperature within a short period of time

and capable of maintaining the temperature of the materials for a long duration Even though

the system is designed for maintaining a fixed chamber temperature throughout the

operational period, the design should be such that it is adaptable for refrigerating the chamber

from ambient temperature to the required temperature.

 Through this research, it may help to improve studies regarding future applications in

refrigeration industry. Since the issues of food safety, health and energy manifests,

refrigeration is essential to mankind. Having knowledge, young people will incite to turn to

promising aid their curiosity and do further investigations and studies regarding this matter.

This study focuses on design and development of thermoelectric refrigerator for small

scale cooling, determining the performance for larger application such as industrial

refrigeration is the limit of this study.

Research Methodology

In this chapter, researcher will discuss the design procedures including the material

selection, procurement of materials, fabrication and construction and also the necessary tests

to determine the performance and efficiency of the thermoelectric refrigerator.

The design progressed through a series of steps shown in 3.1. These steps were

planning, designing, implementation, and analysis .The main design considerations were

Geometry, Selection of Thermoelectric cooler and materials, Heat load calculation, and

System Design.

 Research and Studying

Principle
Planning  Considering Review of related
Literature and Studies
 Consultation

 Geometry
Designing  Material Selection
 Heat Load Calculation
 System Design
 Implementation  Implementation of Design
 Construction and Fabrication

m
 Cooling Rate Test
Analysis  Efficiency of Thermoelectric
Refrigerator

Figure 3.1: Process Flow of Methodology

Statement of the Problem

Refrigeration has been defined as the science of providing and maintaining

temperature below that of surrounding atmosphere. Refrigeration provides temperature

differential for processes like food preservation, food processing, storage applicationsetc.

Another requirement of refrigeration is in developing scientific equipment and their

operation under controlled environmentto get reliable result. This can be achieved by using

conventional refrigeration systems which uses Chlorofluorocarbons(CFCs) and Hydro

Chlorofluorocarbons (HCFCs) as refrigerants. These CFCs and HCFCs are mainly

responsible forenvironmental degradation such as Ozone layer depletion and global warming.

As a result, there is need to develop clean refrigerationtechnology and hence extensive

research is happening in field of thermoelectric refrigeration.

Objectives of the Study

The objectives of the study are to design and develop a refrigerator that can overcome

the existing disadvantages of refrigeration system. It also aims to design and develop a
compact refrigerator using thermoelectric coolers that minimized the use of electricity and

that can be constructed from local materials for a reasonable cost.

Specifically this study aims to:

1. Design a thermoelectric refrigerator that hasa capacity of 18 L that utilizes the

Peltier effect to cool and maintain a selected temperature range of 10oC to

15oC.

2. Fabricate the desired design of thermoelectric refrigerator.

3. Determine the time for cooling and efficiency of the designed thermoelectric

refrigerator

A. Planning and Preparation

In order to achieve the desired output, planning was the first things that have been

considered. It includes researching and studying the principle of thermoelectric. The

researchers also consider related literatures and studies through different sources that will be

needed in designing. Consultation and discussion to professors is also applied to ensure the

precision of the output.

B. Designing

In designing process there are several considerations that need to follow to optimize

the efficiency of thermoelectric refrigerator. These include the geometry, material selection

for inside and cabin walls, heat load calculation and system design.

B.1 Geometry

Two main geometries were considered for the device the first was a rectangle. The

advantage of rectangle is its simplicity to build and insulate. A door can easily be attached to
one of the sides. Finally, any insulation thermoelectric modules or heat sinks are easily

fastened to the sides. The second choice for cooler geometry was a cylinder. The advantage

found with this shape is that it has the largest volume to surface area ratio of the two designs

considered. This is a good property when the objective is to minimize heat loss. But

considering the simplicity to build and insulate rectangle box is considered.

Specification of Rectangular Box

Parameters Value
Depth 40
Outside dimension (cm) Width 35
Height 35
Depth 30
Inside Dimension (cm) Width 25
Height 25
Table 3.1:Dimension of Thermoelectric Refrigerator

B.2 Material Selection for Inside and Outside walls

Galvanized Steel (ASTM A525) will be used for the outer wall of the refrigerator

with thermal conductivity of 52W/m-K. The material was chosen for its resistance to rust and

prevents corrosion.While for the inner wall Expanded polystyrene (EPS) slabs with thermal

conductivity of 0.33W/mK and thickness of 5 cm were going to use to give the required

thermal insulation.

B.3 Heat Load Calculation

The thermoelectric cooling modules for development of thermoelectric refrigerator

cabinet have been selected on the basis of active and passive heat removal from refrigeration

cabinet.Active load is considered whenever part of the load actually produces heat. Many TE
applications don’t have an active load and this term can be entirely discarded in these cases.

To maintain a temperature difference between the thermal load of the system and the ambient

environment, a small amount of energy must be continually moved into or out of the load.

The rate at which this energy is moved is the passive load.

With a TE system, the main aim is to keep the thermal load colder than the ambient

temperature. But unfortunately, no matter how well the design of the system, there will be

some leakage in the system. There is no insulation available with an infinite thermal

resistance, so some heat will pass right through the primary line of defense. Furthermore,

seals used to cope with the inevitable holes will also be imperfect. Thus, in a cooling

application, some heat leakage into the thermal load will occur from the ambient

environment. Heat Loss or gained by an insulated enclosure may be expressed

mathematically as:

ΔT x Area
Qpassive = 1 x
+
h k

Where:

Qpassive – heat load (W)

A – total external surface area of enclosure (m2 )
x = thickness of insulation
k = thermal conductivity of insulation (W/m2 –K)
h = convective heat transfer coefficient (W/m2 –K)
Δ = Temperature difference
Parameters Value
Temperature to be maintained in the cabin 10oC
KGS 52W/m-K
 KEPS 0.033 W/m-K
hair 10W/m2-K
Table 3.2: Parameters of Known Materials

B.4 System Design

B.4.1 TEC Selection

It is required to choose a TEC module that not only has sufficient cooling capacity to

maintain the proper temperature, but also meet the dimensional requirements imposed. A

module is arbitrarily chosen by considering the geometrical constrain imposed due to the size

of cabin and also appears to have appropriate performance characteristics. In order to begin

the design process it must first evaluate the heat sink and make an estimate of the worst case

module hot side temperature (TH) and module temperature differential, ΔT. The heat in-leak

or heat load QC should be calculated. In this problem since it is required only to maintain the

required temperature, only heat infiltration & others heat losses contributes to the heat load,

QC.

Parameters Value
Design Without Silicon Sealed
Size 40 x 40 x 3.9 mm
Weight 27 g
Qmax at ΔT = 0 63 W
Imax 6.4 A
Vmax 15.4 V
ΔTmax 68 oC
P-n junction 127 couples
Table 3.3: Performance Specification of TEC1-12706
 B.4.2 Heat Sink Selection

When electric power is applied to a TE module, one face becomes cold while the

other is heated. In accordance with the laws of thermodynamics, heat from the (warmer) area

being cooled will pass from the cold face to the hot face. To complete the thermal system, the

hot face of the TE cooler must be attached to a suitable heat sink that is capable of dissipating

both the heat pumped by the module and Joule heat created as a result of supplying electrical

power to the module.

C. Procurement of Materials

The next step includes purchasing and gathering the identified parts and components.

The availability of the materials and the cost has been well thought-out also to minimize the

budget and to sustain the needs during the project.

Table 3.4 are the known costing of the partial materials that will be use in constructing

the thermoelectric refrigerator.

Quantity Unit Item Unit Price Amount

Peltier Module
Heat Sink
Heat Sink Fan
Galvanized Steel
Expanded
polystyrene (EPS)
slabs
Table 3.4: Cost of material to be use

D. Fabrication and Assembling

 The outer wall is built using galvanized steel with (30 x 25 x 25 cm 3) dimension. The

sheet will be cut and perform suitable bending while its sides are welded and riveted. EPS

slabs with 5cm thickness will be used to obtain the required thermal insulation. The slabs

having a thermal conductivity of 0.33 W/m-K, were pasted to the inside walls of the cabin.

The gaps between the walls are filled with silicon paste.

The configuration of thermoelectric system is shown in Fig 3.2. Here the challenge is

to “gather” heat from the inside of the box, pump it to a heat exchanger on the outside of the

box, and release the collected heat into the ambient air. This is done by employing two heat

sink/fan combinations in conjunction with one or more Peltier devices. The smaller of the

heat sinks is used on the inside of the enclosure; cooled to a temperature below that of the air

in the box, the sink picks up heat as the air circulates between the fins. In the simplest case,

the Peltier device is mounted between this “cold side” sink and a largersink on the “hot side”

of the system. As direct current passes through the thermoelectric device, it activelypumps

heat from the cold side sink to the one on the hot side. The fan on the hot side then circulates

ambient air between the sink’s fins to absorb some of the collected heat. Note that the heat

dissipated on the hot side not only includes what is pumped from the box, but also the heat

produced within the Peltier device itself (Vx I).

 Figure 3.2: Configuration of Thermoelectric System

E. Preliminary Testing and Revision

In order to determine if the system is functioning according to the desired output,

certain tests are conducted. From various testing procedures, defects on the system were

observed and conduct a necessary adjustment and repair to the system.

F. Final Testing

An experimental and performance analysis on fabricated thermoelectric refrigerator

was conducted. The cold side of the thermoelectric module was used in the system to cool

the refrigerator cabin and a digital thermo meter is used to measure the temperature. In order

to validate the performance of the thermoelectric refrigerator cooling rate test will be applied

to the system.

F.1 Cooling rate test

Before turning on the system, the temperature inside and outside the refrigerator is

measured using digital thermometer for initial temperature. Water with known temperature

will be inserted in the system as a active heat load before switching on the refrigerator. To

determine the time for cooling the temperature inside the cabin will be observed using a

stopwatch until the desired temperature will be achieved. The temperature inside will be

recorded within 2 hours with a 20-minute interval.Different input power is also applied to

determine what working condition will the system operate efficiently.

Time (mins) 20 40 60 80 100 120

Temperature
 F.2 Efficiency of Thermoelectric Refrigerator

To evaluate the efficiency of refrigeration cycle is through Coefficient of

Performance (COP) is used. COP is defined as the ratio of useful cooling provided to the

work required. The computed COP in this study will determine the usefulness of

thermoelectric cooler in refrigeration.

Qc
COP =
W

Significance of the Study

Through this research, it may help to improve studies regarding future applications in

refrigeration industry. Since the issues of food safety, health and energy manifests,

refrigeration is essential to mankind. Having knowledge, young people will incite to turn to

promising aid their curiosity and do further investigations and studies regarding this matter.

Scope and limitations

This study focuses on design and development of thermoelectric refrigerator for a

small scale cooling, determining the performance for larger application such as industrial

refrigeration is the limit of this study.

References:

Berg Chilling System (1972). Toronto, Canada,“The Principles of Basic

Refrigeration”

Khemani, H., Mechanical Engineering (2010). HVAC: Heating, Ventilation & Air-
Conditioning, “Chlorofluorocarbons Refrigerants, CFC Refrigerants: Ozone Layer
Depletion and Greenhouse Effect”

Steinbrecher, T. (1997). Frankfurt, Germany,“Heat Sink Guide: Peltier Basics”

Tellurex Corporation (2006), 1462 International Drive, Traverse City, Michigan,
“The Most Frequently Asked Questions about Thermoelectric Cooling”, page 1