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Network Music player FWP2000/78

TABLE OF CONTENTS
Chapter
Technical Specifications ........................................... 1-2
Safety Instructions ........................................................ 1-4
Location of PCB Boards ........................................... 2-1
Version Variation ..................................................... 2-2
Measurement Setup ................................................. 2-3
Service Aids .............................................................. 2-4
Rescue Mode & Repair Instructions.................... ...... 3
Disassembly Instructions & Service positions ........... 4
Block & Wiring Diagram ............................................ 5
Main Board ............................................................... 6
AMP+Powder Board ........................................................ 7
Key+Mic Board ........................................................ 8
VFD Board ................................................................ 9
Jack Board ................................................................ 10
Exploded View........................................................... 11

©Copyright 2011 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.


All rights reserved. No part of this publication may be reproduced, stored in
a retrieval system or transmitted, in any form or by any means, electronic,
mechanical, photocopying, or otherwise without the prior permission of Philips.

Published by PZ-SL WK1 BG LE Printed in the Netherlands Subject to modication 3141 785 371
Version 1.



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1-

2. Safety Instructions, Warnings, Notes, and Abbreviation List


Index of this chapter: • Where necessary, measure the waveforms and voltages
2.1 Safety Instructions with ( ) and without ( ) aerial signal. Measure the
2.2 Warnings voltages in the power supply section both in normal
2.3 Notes operation ( ) and in stand-by ( ). These values are
2.4 Abbreviation List indicated by means of the appropriate symbols.

2.3.2 Schematic Notes


2.1 Safety Instructions
• All resistor values are in ohms, and the value multiplier is
Safety regulations require the following during a repair:
often used to indicate the decimal point location (e.g. 2K2
• Connect the set to the Mains/AC Power via an isolation
indicates 2.2 k:).
transformer (> 800 VA).
• Resistor values with no multiplier may be indicated with
• Replace safety components, indicated by the symbol ,
either an “E” or an “R” (e.g. 220E or 220R indicates 220 :).
only by components identical to the original ones. Any
• All capacitor values are given in micro-farads (P u10-6),
other component substitution (other than original type) may
nano-farads (n u10-9), or pico-farads (p u10-12).
increase risk of fire or electrical shock hazard.
• Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
Safety regulations require that after a repair, the set must be
• An “asterisk” (*) indicates component usage varies. Refer
returned in its original condition. Pay in particular attention to
to the diversity tables for the correct values.
the following points:
• The correct component values are listed in the Spare Parts
• Route the wire trees correctly and fix them with the
List. Therefore, always check this list when there is any
mounted cable clamps.
doubt.
• Check the insulation of the Mains/AC Power lead for
external damage.
• Check the strain relief of the Mains/AC Power cord for 2.3.3 BGA (Ball Grid Array) ICs
proper function.
• Check the electrical DC resistance between the Mains/AC Introduction
Power plug and the secondary side (only for sets that have For more information on how to handle BGA devices, visit this
a Mains/AC Power isolated power supply): URL: www.atyourservice.ce.philips.com (needs subscription,
1. Unplug the Mains/AC Power cord and connect a wire not available for all regions). After login, select “Magazine”,
between the two pins of the Mains/AC Power plug. then go to “Repair downloads”. Here you will find Information
2. Set the Mains/AC Power switch to the “on” position on how to deal with BGA-ICs.
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the BGA Temperature Profiles
Mains/AC Power plug and the metal shielding of the For BGA-ICs, you must use the correct temperature-profile,
tuner or the aerial connection on the set. The reading which is coupled to the 12NC. For an overview of these profiles,
should be between 4.5 M: and 12 M:. visit the website www.atyourservice.ce.philips.com (needs
4. Switch “off” the set, and remove the wire between the subscription, but is not available for all regions)
two pins of the Mains/AC Power plug. You will find this and more technical information within the
• Check the cabinet for defects, to prevent touching of any “Magazine”, chapter “Repair downloads”.
inner parts by the customer. For additional questions please contact your local repair help
desk.
2.2 Warnings
2.3.4 Lead-free Soldering

• All ICs and many other semiconductors are susceptible to


Due to lead-free technology some rules have to be respected
electrostatic discharges (ESD ). Careless handling
during repair can reduce life drastically. Make sure that, by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order
during repair, you are connected with the same potential as
code 0622 149 00106. If lead-free solder paste is required,
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
• Be careful during measurements in the high voltage
workshops should be avoided because paste is not easy to
section.
• Never replace modules or other components while the unit store and to handle.
• Use only adequate solder tools applicable for lead-free
is switched “on”.
soldering tin. The solder tool must be able:
• When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a – To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
circuit becoming unstable.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
2.3 Notes 360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
2.3.1 General Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
• Measure the voltages and waveforms with regard to the
reduce heat.
chassis (= tuner) ground ( ), or hot ground ( ), depending
• Mix of lead-free soldering tin/parts with leaded soldering
on the tested area of circuitry. The voltages and waveforms
tin/parts is possible but PHILIPS recommends strongly to
shown in the diagrams are indicative. Measure them in the
avoid mixed regimes. If this cannot be avoided, carefully
Service Default Mode (see chapter 5) with a colour bar
clear the solder-joint from old tin and re-solder with new tin.
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
1-4

2. Safety Instructions, Warnings, Notes, and Abbreviation List


Index of this chapter: • Where necessary, measure the waveforms and voltages
2.1 Safety Instructions with ( ) and without ( ) aerial signal. Measure the
2.2 Warnings voltages in the power supply section both in normal
2.3 Notes operation ( ) and in stand-by ( ). These values are
2.4 Abbreviation List indicated by means of the appropriate symbols.

2.3.2 Schematic Notes


2.1 Safety Instructions
• All resistor values are in ohms, and the value multiplier is
Safety regulations require the following during a repair:
often used to indicate the decimal point location (e.g. 2K2
• Connect the set to the Mains/AC Power via an isolation
indicates 2.2 k:).
transformer (> 800 VA).
• Resistor values with no multiplier may be indicated with
• Replace safety components, indicated by the symbol ,
either an “E” or an “R” (e.g. 220E or 220R indicates 220 :).
only by components identical to the original ones. Any
• All capacitor values are given in micro-farads (P u10-6),
other component substitution (other than original type) may
nano-farads (n u10-9), or pico-farads (p u10-12).
increase risk of fire or electrical shock hazard.
• Capacitor values may also use the value multiplier as the
decimal point indication (e.g. 2p2 indicates 2.2 pF).
Safety regulations require that after a repair, the set must be
• An “asterisk” (*) indicates component usage varies. Refer
returned in its original condition. Pay in particular attention to
to the diversity tables for the correct values.
the following points:
• The correct component values are listed in the Spare Parts
• Route the wire trees correctly and fix them with the
List. Therefore, always check this list when there is any
mounted cable clamps.
doubt.
• Check the insulation of the Mains/AC Power lead for
external damage.
• Check the strain relief of the Mains/AC Power cord for 2.3.3 BGA (Ball Grid Array) ICs
proper function.
• Check the electrical DC resistance between the Mains/AC Introduction
Power plug and the secondary side (only for sets that have For more information on how to handle BGA devices, visit this
a Mains/AC Power isolated power supply): URL: www.atyourservice.ce.philips.com (needs subscription,
1. Unplug the Mains/AC Power cord and connect a wire not available for all regions). After login, select “Magazine”,
between the two pins of the Mains/AC Power plug. then go to “Repair downloads”. Here you will find Information
2. Set the Mains/AC Power switch to the “on” position on how to deal with BGA-ICs.
(keep the Mains/AC Power cord unplugged!).
3. Measure the resistance value between the pins of the BGA Temperature Profiles
Mains/AC Power plug and the metal shielding of the For BGA-ICs, you must use the correct temperature-profile,
tuner or the aerial connection on the set. The reading which is coupled to the 12NC. For an overview of these profiles,
should be between 4.5 M: and 12 M:. visit the website www.atyourservice.ce.philips.com (needs
4. Switch “off” the set, and remove the wire between the subscription, but is not available for all regions)
two pins of the Mains/AC Power plug. You will find this and more technical information within the
• Check the cabinet for defects, to prevent touching of any “Magazine”, chapter “Repair downloads”.
inner parts by the customer. For additional questions please contact your local repair help
desk.
2.2 Warnings
2.3.4 Lead-free Soldering

• All ICs and many other semiconductors are susceptible to


Due to lead-free technology some rules have to be respected
electrostatic discharges (ESD ). Careless handling
during repair can reduce life drastically. Make sure that, by the workshop during a repair:
• Use only lead-free soldering tin Philips SAC305 with order
during repair, you are connected with the same potential as
code 0622 149 00106. If lead-free solder paste is required,
the mass of the set by a wristband with resistance. Keep
components and tools also at this same potential. please contact the manufacturer of your soldering
equipment. In general, use of solder paste within
• Be careful during measurements in the high voltage
workshops should be avoided because paste is not easy to
section.
• Never replace modules or other components while the unit store and to handle.
• Use only adequate solder tools applicable for lead-free
is switched “on”.
soldering tin. The solder tool must be able:
• When you align the set, use plastic rather than metal tools.
This will prevent any short circuits and the danger of a – To reach a solder-tip temperature of at least 400°C.
– To stabilize the adjusted temperature at the solder-tip.
circuit becoming unstable.
– To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature of around
2.3 Notes 360°C - 380°C is reached and stabilized at the solder joint.
Heating time of the solder-joint should not exceed ~ 4 sec.
2.3.1 General Avoid temperatures above 400°C, otherwise wear-out of
tips will increase drastically and flux-fluid will be destroyed.
To avoid wear-out of tips, switch “off” unused equipment or
• Measure the voltages and waveforms with regard to the
reduce heat.
chassis (= tuner) ground ( ), or hot ground ( ), depending
• Mix of lead-free soldering tin/parts with leaded soldering
on the tested area of circuitry. The voltages and waveforms
tin/parts is possible but PHILIPS recommends strongly to
shown in the diagrams are indicative. Measure them in the
avoid mixed regimes. If this cannot be avoided, carefully
Service Default Mode (see chapter 5) with a colour bar
clear the solder-joint from old tin and re-solder with new tin.
signal and stereo sound (L: 3 kHz, R: 1 kHz unless stated
otherwise) and picture carrier at 475.25 MHz for PAL, or
61.25 MHz for NTSC (channel 3).
1-5
Safety Instructions, Warnings, Notes, and Abbreviation List
2.3.5 Alternative BOM identification 2.4 Abbreviation List

It should be noted that on the European Service website, 0/6/12 SCART switch control signal on A/V
“Alternative BOM” is referred to as “Design variant”. board. 0 = loop through (AUX to TV),
6 = play 16 : 9 format, 12 = play 4 : 3
The third digit in the serial number (example: format
KX 2B0835000001) indicates the number of the alternative 2DNR Spatial (2D) Noise Reduction
B.O.M. (Bill Of Materials) that has been used for producing the 3DNR Temporal (3D) Noise Reduction
specific AV set. In general, it is possible that the same AV AARA Automatic Aspect Ratio Adaptation:
model on the market is produced with e.g. two different types algorithm that adapts aspect ratio to
of display, coming from two different suppliers. This remove horizontal black bars; keeps
will then result in sets which have the same CTN (Commercial the original aspect ratio
Type Number; e.g. MCM394/12) but which have a different ACI Automatic Channel Installation:
B.O.M. number. algorithm that installs TV channels
directly from a cable network by
Also, it is possible that same model on the market is produced means of a predefined TXT page
with two production centers, however their partslist is the same. ADC Analogue to Digital Converter
In such case, no alternative B.O.M. will be created. AFC Automatic Frequency Control: control
signal used to tune to the correct
By looking at the third digit of the serial number, one can frequency
identify which B.O.M. is used for the set he is working with. AGC Automatic Gain Control: algorithm that
If the third digit of the serial number contains the number “1” controls the video input of the feature
(example: KX 1B033500001), then the set has been box
manufactured according to B.O.M. number 1. If the third digit is AM Amplitude Modulation
a “2” (example: KX 2B0335000001), then the set has been ANR Automatic Noise Reduction: one of the
produced according to B.O.M. no. 2. This is important for algorithms of Auto TV
ordering the correct spare parts! AP Asia Pacific
For the third digit, the numbers 1...9 and the characters A...Z AR Aspect Ratio: 4 by 3 or 16 by 9
can be used, so in total: 9 plus 26= 35 different B.O.M.s can be ASF Auto Screen Fit: algorithm that adapts
indicated by the third digit of the serial number. aspect ratio to remove horizontal black
bars without discarding video
Identification: The bottom line of a type plate gives a 14-digit information
serial number. Digits 1 and 2 refer to the production centre (e.g. ATSC Advanced Television Systems
LM is Arts), digit 3 refers to the B.O.M. code, digit 4 refers Committee, the digital TV standard in
to the Service version change code, digits 5 and 6 refer to the the USA
production year, and digits 7 and 8 refer to production week (in ATV See Auto TV
example below it is 2008 week 50). The 6 last digits contain the Auto TV A hardware and software control
serial number. system that measures picture content,
and adapts image parameters in a
Model FWM572/12 dynamic way
220-230 50Hz 60W AV External Audio Video
AVC Audio Video Controller
AVIP Audio Video Input Processor
FWM572/12 B/G Monochrome TV system. Sound
carrier distance is 5.5 MHz
LM1A0850005644 BLR Board-Level Repair
BTSC Broadcast Television Standard
Committee. Multiplex FM stereo sound
Figure 2-1 Serial number (example) system, originating from the USA and
used e.g. in LATAM and AP-NTSC
2.3.6 Module Level Repair (MLR) or Component Level Repair countries
(CLR) B-TXT Blue TeleteXT
C Centre channel (audio)
If a board is defective, consult your repair procedure to decide CEC Consumer Electronics Control bus:
if the board has to be exchanged or if it should be repaired on remote control bus on HDMI
component level. connections
If your repair procedure says the board should be exchanged CL Constant Level: audio output to
completely, do not solder on the defective board. Otherwise, it connect with an external amplifier
cannot be returned to the O.E.M. supplier for back charging! CLR Component Level Repair
COLUMBUS COlor LUMinance Baseband
2.3.7 Practical Service Precautions Universal Sub-system
ComPair Computer aided rePair
CP Connected Planet / Copy Protection
• It makes sense to avoid exposure to electrical shock.
CSM Customer Service Mode
While some sources are expected to have a possible
CTI Color Transient Improvement:
dangerous impact, others of quite high potential are of
manipulates steepness of chroma
limited current and are sometimes held in less regard.
transients
• Always respect voltages. While some may not be
CVBS Composite Video Blanking and
dangerous in themselves, they can cause unexpected
Synchronization
reactions that are best avoided. Before reaching into a
DAC Digital to Analogue Converter
powered TV set, it is best to test the high voltage insulation.
DBE Dynamic Bass Enhancement: extra
It is easy to do, and is a good service precaution.
low frequency amplification
DDC See “E-DDC”
1-6

Safety Instructions, Warnings, Notes, and Abbreviation List

D/K Monochrome TV system. Sound lines. The fields are written in “pairs”,
carrier distance is 6.5 MHz causing line flicker.
DFI Dynamic Frame Insertion IR Infra Red
DFU Directions For Use: owner's manual IRQ Interrupt Request
DMR Digital Media Reader: card reader ITU-656 The ITU Radio communication Sector
DMSD Digital Multi Standard Decoding (ITU-R) is a standards body
DNM Digital Natural Motion subcommittee of the International
DNR Digital Noise Reduction: noise Telecommunication Union relating to
reduction feature of the set radio communication. ITU-656 (a.k.a.
DRAM Dynamic RAM SDI), is a digitized video format used
DRM Digital Rights Management for broadcast grade video.
DSP Digital Signal Processing Uncompressed digital component or
DST Dealer Service Tool: special remote digital composite signals can be used.
control designed for service The SDI signal is self-synchronizing,
technicians uses 8 bit or 10 bit data words, and has
DTCP Digital Transmission Content a maximum data rate of 270 Mbit/s,
Protection; A protocol for protecting with a minimum bandwidth of 135
digital audio/video content that is MHz.
traversing a high speed serial bus, ITV Institutional TeleVision; TV sets for
such as IEEE-1394 hotels, hospitals etc.
DVB-C Digital Video Broadcast - Cable JOP Jaguar Output Processor
DVB-T Digital Video Broadcast - Terrestrial LS Last Status; The settings last chosen
DVD Digital Versatile Disc by the customer and read and stored
DVI(-d) Digital Visual Interface (d= digital only) in RAM or in the NVM. They are called
E-DDC Enhanced Display Data Channel at start-up of the set to configure it
(VESA standard for communication according to the customer's
channel and display). Using E-DDC, preferences
the video source can read the EDID LATAM Latin America
information form the display. LCD Liquid Crystal Display
EDID Extended Display Identification Data LED Light Emitting Diode
(VESA standard) L/L' Monochrome TV system. Sound
EEPROM Electrically Erasable and carrier distance is 6.5 MHz. L' is Band
Programmable Read Only Memory I, L is all bands except for Band I
EMI Electro Magnetic Interference LORE LOcal REgression approximation
EPLD Erasable Programmable Logic Device noise reduction
EU Europe LPL LG.Philips LCD (supplier)
EXT EXTernal (source), entering the set by LS Loudspeaker
SCART or by cinches (jacks) LVDS Low Voltage Differential Signalling
FBL Fast BLanking: DC signal Mbps Mega bits per second
accompanying RGB signals M/N Monochrome TV system. Sound
FDS Full Dual Screen (same as FDW) carrier distance is 4.5 MHz
FDW Full Dual Window (same as FDS) MIPS Microprocessor without Interlocked
FLASH FLASH memory Pipeline-Stages; A RISC-based
FM Field Memory or Frequency microprocessor
Modulation MOP Matrix Output Processor
FPGA Field-Programmable Gate Array MOSFET Metal Oxide Silicon Field Effect
FTV Flat TeleVision Transistor, switching device
Gb/s Giga bits per second MPEG Motion Pictures Experts Group
G-TXT Green TeleteXT MPIF Multi Platform InterFace
H H_sync to the module MUTE MUTE Line
HD High Definition NC Not Connected
HDD Hard Disk Drive NICAM Near Instantaneous Compounded
HDCP High-bandwidth Digital Content Audio Multiplexing. This is a digital
Protection: A “key” encoded into the sound system, mainly used in Europe.
HDMI/DVI signal that prevents video NTC Negative Temperature Coefficient,
data piracy. If a source is HDCP coded non-linear resistor
and connected via HDMI/DVI without NTSC National Television Standard
the proper HDCP decoding, the Committee. Color system mainly used
picture is put into a “snow vision” mode in North America and Japan. Color
or changed to a low resolution. For carrier NTSC M/N= 3.579545 MHz,
normal content distribution the source NTSC 4.43= 4.433619 MHz (this is a
and the display device must be VCR norm, it is not transmitted off-air)
enabled for HDCP “software key” NVM Non-Volatile Memory: IC containing
decoding. TV related data such as alignments
HDMI High Definition Multimedia Interface O/C Open Circuit
HP HeadPhone OSD On Screen Display
I Monochrome TV system. Sound OTC On screen display Teletext and
carrier distance is 6.0 MHz Control; also called Artistic (SAA5800)
I2 C Inter IC bus P50 Project 50: communication protocol
I2 D Inter IC Data bus between TV and peripherals
I2 S Inter IC Sound bus PAL Phase Alternating Line. Color system
IF Intermediate Frequency mainly used in West Europe (color
Interlaced Scan mode where two fields are used carrier= 4.433619 MHz) and South
to form one frame. Each field contains America (color carrier PAL M=
half the number of the total amount of
1-7
Safety Instructions, Warnings, Notes, and Abbreviation List

3.575612 MHz and PAL N= 3.582056 V V-sync to the module


MHz) VCR Video Cassette Recorder
PCB Printed Circuit Board (same as “PWB”) VESA Video Electronics Standards
PCM Pulse Code Modulation Association
PDP Plasma Display Panel VGA 640x480 (4:3)
PFC Power Factor Corrector (or Pre- VL Variable Level out: processed audio
conditioner) output toward external amplifier
PIP Picture In Picture VSB Vestigial Side Band; modulation
PLL Phase Locked Loop. Used for e.g. method
FST tuning systems. The customer WYSIWYR What You See Is What You Record:
can give directly the desired frequency record selection that follows main
POR Power On Reset, signal to reset the uP picture and sound
Progressive Scan Scan mode where all scan lines are WXGA 1280x768 (15:9)
displayed in one frame at the same XTAL Quartz crystal
time, creating a double vertical XGA 1024x768 (4:3)
resolution. Y Luminance signal
PTC Positive Temperature Coefficient, Y/C Luminance (Y) and Chrominance (C)
non-linear resistor signal
PWB Printed Wiring Board (same as “PCB”) YPbPr Component video. Luminance and
PWM Pulse Width Modulation scaled color difference signals (B-Y
QRC Quasi Resonant Converter and R-Y)
QTNR Quality Temporal Noise Reduction YUV Component video
QVCP Quality Video Composition Processor
RAM Random Access Memory
RGB Red, Green, and Blue. The primary
color signals for TV. By mixing levels
of R, G, and B, all colors (Y/C) are
reproduced.
RC Remote Control
RC5 / RC6 Signal protocol from the remote
control receiver
RESET RESET signal
ROM Read Only Memory
R-TXT Red TeleteXT
SAM Service Alignment Mode
S/C Short Circuit
SCART Syndicat des Constructeurs
d'Appareils Radiorécepteurs et
Téléviseurs
SCL Serial Clock I2C
SCL-F CLock Signal on Fast I2C bus
SD Standard Definition
SDA Serial Data I2C
SDA-F DAta Signal on Fast I2C bus
SDI Serial Digital Interface, see “ITU-656”
SDRAM Synchronous DRAM
SECAM SEequence Couleur Avec Mémoire.
Color system mainly used in France
and East Europe. Color carriers=
4.406250 MHz and 4.250000 MHz
SIF Sound Intermediate Frequency
SMPS Switched Mode Power Supply
SoC System on Chip
SOG Sync On Green
SOPS Self Oscillating Power Supply
S/PDIF Sony Philips Digital InterFace
SRAM Static RAM
SRP Service Reference Protocol
SSB Small Signal Board
STBY STand-BY
SVGA 800x600 (4:3)
SVHS Super Video Home System
SW Software
SWAN Spatial temporal Weighted Averaging
Noise reduction
SXGA 1280x1024
TFT Thin Film Transistor
THD Total Harmonic Distortion
TMDS Transmission Minimized Differential
Signalling
TXT TeleteXT
TXT-DW Dual Window with TeleteXT
UI User Interface
uP Microprocessor
UXGA 1600x1200 (4:3)


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4-1 4-1

DISASSEMBLY INSTRUCTIONS

4.1 Dismantling of Main Unit Dismantling of Back Panel Ass’y


1)Upward the apparatus as shown in figure1 1)Loosen 12 screw“G”as shown in figure8
2) Loosen 8 screws“A”open Top cover as shown figure3 2)Disconnet the wires to draw out the Back Panel as shown in figure9
3) Disconnect the wires in the canbinet as shown in B

Figure 1 Figure2 Figure3


Figure8 Figure9
Dismantling of Main Board Dismantling of AMP+Power Board & Jack Board
1)Keep flat the Top cover ASS’Y as shown in figure 4
2)Loosen 6screw”C” as shown in figure5 to detach Main Board 2)Loosen 6screw“H” as shown in figure10to detach Remote Board
2)Loosen 4screw“I” as shown in figure12 to detach Jack Board in figure11

Figure 4 Figure5

Dismantling of MIC Board &VFD Board Figure 10 Figure 11


1)Loosen 4screw“D”detach MIC Board & loosen 5 screw”E” detach VFD Board as shown in figure6
1)Loosen 4screw“F” as shown in figure7

Figure 12

Figure6 Figure7
4-2 4-2
Service Position

Note: Refer to the wiring Diagram for the correct cable connection between boards.

Service Position

Note: In some service positions the components or copper patterns of one board may risk touching its neighbouring pc boards or metallic parts.
To prevent such short-circuit use a piece of hard paper or other insulating material between them.
5-1 5-1
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6-1 6-1

STM8S105XX DIAGRAM

Reset block XTAL 1-16 MHz


Clock controller

Reset Reset
RC int. 16 MHz

Detector
POR BOR
RC int. 128 kHz
Main Board
Clock to peripherals and core

Window WDG
STM8 core

Independent WDG

Single wire Debug/SWIM Up to 32 Kbytes


debug interf.
program Flash

Master/slave
autosynchro UART2
LIN master 1 Kbytes
SPI emul. data EEPROM
TABLE OF CONTENTS
400 Kbit/s 2
I C Up to 2 Kbytes
Circuit Diagram................................................................................................................ 6-2 RAM
PCB Layout Top View ..................................................................................................... 6-6
8 Mbit/s SPI Boot ROM
PCB Layout Bottom View.............................................................................................. 6-7
Address and data bus

Up to
16-bit advanced control 4 CAPCOM
timer (TIM1) channels +3
complementary
outputs
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16-bit general purpose
5 CAPCOM
timers (TIM2, TIM3)
channels

Up to 10 channels
ADC1 8-bit basic timer
(TIM4)

1/2/4 kHz Beeper


beep AWU timer
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TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 8-2
PCB5PQ Layout View ............................................................................................................................... 8-4
 PCB #PUUPNLayout View......................................................................................................................... 8-5
8-2 8-2
CIRCUIT DIAGRAM

   

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TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 9-2
PCB Layout View ......................................................................................................................................... 9-3
9-2 9-2
CIRCUIT DIAGRAM
       

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TABLE OF CONTENTS
Circuit Diagram ........................................................................................................................................... 10-2
PCB Layout View ......................................................................................................................................... 10-3
PCB Layout View ......................................................................................................................................... 10-4
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CIRCUIT DIAGRAM

   

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