Professional Documents
Culture Documents
50
FF @ –55ºC
40 TYP @ –55ºC
30 TYP @ 155ºC
IRAMP (µA)
SS @ 155ºC
20
10
0
0 1 2 3 4 5 6 7
VEAO (V)
output voltage would be 400V for a 11.3MΩ resistor to Voltage Loop Compensation
the boost output voltage and 5V steady-state at the VEAO
pin. The voltage loop bandwidth must be set to less than
120Hz to limit line current harmonic distortion. A typical
VBOOST – VEAO crossover frequency is 30Hz. Equation 2 assumes that the
R12 + R13 = = (1)
IPGM pole capacitor (C15) in the compensation network
dominates the error amp gain at the unity gain frequency.
400V – 5V Equation 3 places a pole at the crossover frequency
= 113
. MΩ
35µA providing 45º of phase margin. Equation 4 places a zero a
decade prior to the pole providing the necessary phase
The IPGM variation over temperature and process is 4%. boost. Figure 3 displays a simplified schematic of the
Adding an additional 2% variation in the programming voltage control loop.
resistor results in a total variation of approximately 6% in
the PFC output voltage. This assumes a temperature Bode plots illustrating the overall gain and phase are
coefficient of less than 200ppm for the programming shown in Figures 4 and 5.
resistance. This results in a spread of 377V to 426V in the
PFC output voltage, requiring a PFC output capacitor PIN
C15 = =
rated at 450V. RP × VBOOST × ∆VEAO × C OUT × 2πf b g 2 (2)
VOUT = 400V
RP
VC1
GATE
VEAO
OUTPUT
4 +
COMP
C1 –
30pF
RCOMP CCOMP 35µA 5V
CZERO R1
ISENSE
3 –4
VI SENSE
20
11.3MΩ
GAIN (dB)
POWER
COMPENSATION
STAGE –60
0.1 1 10 100 1000
FREQUENCY (Hz)
0
Power Stage
Overall Gain
Compensation
Network Gain VCC
50
0
VEAO
PHASE (º)
100 0
VOUT
0
150
VBOOST
200 0
0.1 1 10 100 1000
FREQUENCY (Hz) 200ms/Div.
PFC Current Sense Resistor harmonic distortion in the input AC current, it should kept
to a minimum by this low-pass network.
In Discontinous Conduction Mode (DCM) the input
current wave shaping technique used by the ML4803 can To select the PFC RSENSE value, use a peak current that is
cause the input current to run away, forcing the PFC 120% of that found in Equation 5.
output to increase until the VCCOVP point is reached. In
order for the PWM technique to work properly under VLIMIT
R3 = = (9)
DCM, the programmed ramp must meet the boost 120% × IPK
inductor current down slope at zero amps. Assuming the
programmed ramp is zero under light load, the off time 1V
will be terminated once the inductor current reaches zero. = 0.15Ω
. × 5.3A
12
Subsequently, the PFC gate drive would be initiated
eliminating any necessary deadtime needed for the DCM PFC and PWM Gate Drive
mode. The problem is resolved by adding an offset voltage
to the current sense signal, which forces the duty cycle to The peak current rating of the PFC and PWM gate drive
zero at light loads. The offset prevents the PFC from outputs is 1A. A 36Ω gate drive resistor is used to drive
operating in the Discontinous Conduction Mode (DCM) two MOSFETs in parallel and limit the gate drive peak
and forces pulse skipping from Continuous Conduction current to less than 1A. The charge required to elevate the
Mode (CCM) to no duty, avoiding the DCM problem gate of the IRF840 to 15V is taken from the
altogether. External filtering of the current sense signal manufacturer’s data sheet in order to estimate the gate
helps to smooth out the signal, expanding the operating drive turn-on time. Estimating the current as a constant
range somewhat into the DCM range. This should be done allows the approximate time to be derived from Equation
carefully as the filtering reduces the bandwidth of the 10. Given the switching frequency, the average gate
signal feeding the pulse-by-pulse current limit current drawn from VCC can be calculated from Equation
information. 11. Since a typical carbon film resistor is only capable of
a peak power of 4 times its average, rated power, a ¼W
Figure 7 displays the circuit used to provide offset to the resistor is limited to 1W peak. With a peak current of
ISENSE pin under light load conditions. It adds a negative 0.416A in a 36Ω resistor, the peak power is 6.23W, well
offset to the ISENSE pin that is inversely proportional to the in excess of the 1W limitation. For this reason carbon
PFC pulse width, preventing excessive input current under composition resistors are typically used for gate drive
light load conditions. Components C23 and CR16 offset applications.
the PFC gate drive by –15V, while the subsequent low-
pass network averages the offset square wave. The net QGATE QGATE
t≈ = =
effect is a negative voltage summed with the input IPK VCC (10)
current sense that increases as the PFC pulse width RGATE
decreases. Figure 8 illustrates how ILIMIT vs. duty cycle
varies with the PFC gate drive offset signal. The 120Hz 60nC 60nC
= = 144ns
component of the PFC gate drive is attenuated by more 15V 0.416A
than –50dB at the ISENSE pin. Because this 120Hz 36Ω
component added to the ISENSE input will increase the
6.8 0
6.6 –0.05
ISENSE
6.4 –0.10
C23 R29 R28 R4
OFFSET (V)
ILIMIT (A)
R3
CR16 C22 R19 C5 6.0 –0.20
.015Ω
1N4148 1µF 10kΩ 8.2nF
3W VOFFSET
5.8 ILIMIT –0.25
VCC RTN
ILIMITMOD
5.6 –0.30
0 20 40 60 80 100
DUTY CYCLE (%)
Figure 7. ISENSE Offset Circuit Figure 8. ISENSE and VOFFSET Over Duty Cycle
ICCDRIVE = QGATE × fS = (11) holdup voltage of 320V (Equation 8), and a transformer
coupling coefficient of 0.9, the transformer turns ratio
60nC × 70kHz = 4.2mA required is 0.087. The actual transformer used in this
example has a turns ratio of 0.083.
The high-side gate drive transformer magnetizing current
can be estimated from Equation 12. N SEC
N= (17)
NPRI
VCC
IAVG = = (12) VOUT + VD
8 × fS × LMAG N= =
VHU × D MAX × k (18)
15V
= 60mA
8 × 70kHz × 450µH 12V + 05
.V
N= = 0087
.
320V × 05
. × 09
.
The total ICC due to gate drive can now be estimated from
the sum of all of the above. The primary magnetizing inductance of the main
transformer is selected so that the magnetizing current is
roughly equal to the reflected output inductor ripple
PWM POWER STAGE DESIGN current.
voltage will range from 377V to 426V, as discussed in the The maximum voltage at VCC is limited internally by a
"one-pin error amp" section. Given this variation, the low current (<10mA) zener clamp ranging from 16.7V to
minimum VCCOVP trip level must be guaranteed to occur 18.3V. This will limit the VCC voltage applied to the IC
at a voltage greater than 426V while the maximum OVP during conditions where VCC is applied through the high
trip level must be less than the output capacitor’s rated impedance start up resistors R26 and R27. During normal
voltage (450V). The spread on the VCCOVP is ±0.5V for a operation, when the VCC voltage is supplied by way of the
maximum of 16.5V and a minimum of 15.5V. Given the boost choke bootstrap winding, VCC will be limited by the
specified PFC choke winding turns ratio, one can VCCOVP protection circuitry (<16.5V). In the case where
calculate the required additional series drop required to VCC is supplied by a low impedance source other than a
limit the minimum OVP trip level to greater than 426V. bootstrap winding, the zener minimum voltage (16.7V)
This additional drop can be achieved by selecting an must not be exceeded.
appropriate value for resistor R31. The maximum VCCOVP
trip level can then be checked. RESULTS AND CONCLUSIONS
NAUX 4 Table 1 displays the IEC input current harmonic content
N2 = = = 0.039 (21)
NPRI 102 requirements. A summary of the power supply
performance is shown in Table 2. Figures 9 through 14
VSERIES = (VOUTMIN × N2 × k ) – VCCOVPMIN = (22) display input current under various operating conditions,
load transients, and turn-on overshoot.
(426V × 0.039 × 0.95) – 155
. V = 0.283V
This design shows that the ML4803 provides an effective,
VCCOVPMAX + VSERIES inexpensive solution for a power factor corrected 240W
VOUTMAX = = (23) switching power supply. Higher power levels can be
N2 × k
achieved with proper buffering of the gate drive outputs
16.5V + 0.283V and detailed attention paid to printed circuit board (PCB)
= 450V layout. The design has also shown that proper layout can
0.039 × 0.95
be achieved with a single-sided PCB layout. Applications
In general, the VCCOVP trip level should not interfere include desktop PCs, servers, monitors, and distributed
with the normal steady-state operation of the PFC, and at power systems.
the same time should be guaranteed to trip at a level
below the maximum rating of the 450V output capacitor.
Figure 9. Input AC Current @ 85 V AC. Figure 10. Input AC Current @ 115 V AC.
50W, 100W, 200W, 300W Input Power. 50W, 100W, 200W, 300W Input Power.
2 A/div. 1 A/div.
Figure 11. Input AC Current @ 230 V AC. Figure 12. Input AC Current @ 265 V AC.
50W, 100W, 200W, 300W Input Power. 50W, 100W, 200W, 300W Input Power.
0.5 A/div. 0.5 A/div.
Figure 13. Boost Output Voltage Turn-On Overshoot @ Figure 14. Boost Output Voltage Load Transient Responce
115 V AC Full Load and No Load Top Trace: Load Current Step No Load to 15A
230 V AC Full Load and No Load Bottom Traces: Boost Output Voltage Transient Responce
@ 85 V AC, 115 V AC, and 265 V AC Input Voltage
R28 C14
R12 4.7µF
20kΩ ML4803 R9
5.62MΩ CR10 Q3
1 8 R5 36Ω 1.5kΩ
PFC PWM 5
2 7 U3 R37
GND 1
VCC 330Ω
R4 1kΩ R11 150Ω C17
3 6 0.1µF R15
ISENSE ILIMIT
CR12 R32 100Ω 2 9.09kΩ
4 5 4
VEAO VDC
C13 1nF
R25 C5 C10 R10
390kΩ 0.01µF 2.2nF 0.75Ω
CR9 R21 3W R17 3.3kΩ
7.0V C15 C28 CR4
CR11 10kΩ
0.015µF C6 1µF R20 3
C8 C27 C12 0.1µF R18 1kΩ
1µF 0.01µF 510Ω U2 1
0.15µF
2
R16
2.37kΩ
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems 2. A critical component in any component of a life support
which, (a) are intended for surgical implant into the body, device or system whose failure to perform can be
or (b) support or sustain life, and (c) whose failure to reasonably expected to cause the failure of the life support
perform when properly used in accordance with device or system, or to affect its safety or effectiveness.
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.