IPC CHECKLIST

for Producing Rigid Printed Board Assemblies

Where is the
Copper?

Revision August 1, 2014

IPC Offices Contents
IPC (Headquarters) IPC Washington Office IPC Media Training IPC Offices ......................................................................................... inside front cover
3000 Lakeside Drive, 309 S 1331 Pennsylvania Avenue, NW P.O. Box 389
Suite 910 7200 Highway 518 Purpose of IPC Checklists ........................................................................................... 2
Bannockburn, IL 60015
Tel: + 1 847-615-7100 Washington, D.C. 20004 Ranchos de Taos, NM 87557 Chain of Production ..................................................................................................... 3
Tel: + 1 202-661-8090 Tel: +1 575-758-7937
IPC Reference Standards ............................................................................................ 4
IPC Europe IPC Russia IPC India IPC Performance Class 1, 2, or 3................................................................................. 6
Lowek 123298, Narodnogo Opolchenia # 238/34, 1st floor IPC Producibility Levels ............................................................................................... 7
Gurlitavägen 17 st, 50, korpus 1 32nd Cross, 7th Block,
S-168 39 Bromma, Sweden Moscow, Russia Jayanagar, Checklist at the Project Start Level ............................................................................. 8
Tel: +46 8 26 10 07 Tel: + 7 499 943-44-02 Bangalore – 560070 Checklist at the CAD Level ........................................................................................ 10
LarsWallin@ipc.org Tel: +91 (0)80 2653 2211
Checklist at Printed Board Ordering Level................................................................. 12
IPCIPC
China
China Checklist at Printed Board Assembly Ordering Level ................................................ 14
IPCIPC
China
China
HQHQ
5F B3-1,
5F B3-1,
Block
Block
B, International
B, International
Innovation
Innovation
Park,
Park, Checklist for Cleaning and Conformal Coating .......................................................... 16
#1 First
#1 First
Keyuanwei
KeyuanweiRd.,Rd.,
Laoshan
Laoshan
District,
District,
Qingdao,
Qingdao,
266101,
266101,
PRCPRC Terms and Definitions ................................................................................................ 18
青岛市崂山区科苑纬一路1号国际创新园B座5层B3-1
青岛市崂山区科苑纬一路1号国际创新园B座5层B3-1
邮编：266101
邮编：266101 IPC STANDARDS — Everything You Need from Start to Finish ................................ 19
Tel:Tel:
+86+86
400400
6218
6218
610610 Phenomena in Cross Section of Plated Through Holes ............................................. 21
IPCIPC
ChinaChina
— Suzhou
— Suzhou Office
Office Experience the Benefits of IPC Membership ............................................................ 31
RoomRoom 2406,
2406,
Yongjie
Yongjie
Fenghui
FenghuiBuilding,
Building,
#19#19
SouthSouth
Guangji
Guangji
Rd.,Rd.,
Jinchang
Jinchang
District,
District,
Suzhou,
Suzhou,
215008,
215008,
PRCPRC Membership Options................................................................................................. 34
苏州市金阊区广济南路19号永捷峰汇2406室
苏州市金阊区广济南路19号永捷峰汇2406室
Get Ahead with IPC Training & Certification Programs.............................................. 36
邮编：215008
邮编：215008
Tel:Tel:
+86+8621 2221
21 2221
00300030
IPCIPC
ChinaChina
— Shanghai
— Shanghai Office
Office
RoomRoom 510,
510,
Modern
Modern
Logistic
Logistic
Building,
Building,
#448#448
Hongcao
Hongcao
Rd.,Rd.,
Xuhui
Xuhui
District,
District,
Shanghai,
Shanghai,
200233,
200233,
PRC PRC
上海市徐汇区虹漕路448号现代物流大厦510室
上海市徐汇区虹漕路448号现代物流大厦510室
邮编：200233
邮编：200233
Attachments
Tel:Tel:
+86+8621 2221
21 2221
00000000
1. IPC Standards Tree — “Everything You Need from Start to Finish”
IPCIPC
ChinaChina
— Chengdu
— Chengdu Office
Office
RoomRoom 712/714,
712/714,Electronics
Electronics
Industry
Industry
Building,
Building, 2. Phenomena in Cross Section of Plated-Through Holes
#159#159
East East
First
First
RingRing
Rd.,Rd.,
Chengdu,
Chengdu,
610054,
610054,
PRCPRC
3. IPC Factory for Electronic Design, CAD and CAM
成都市一环路东一段159号电子信息产业大厦第712/714号
成都市一环路东一段159号电子信息产业大厦第712/714号
邮编：610054
邮编：610054 4. IPC Factory for Rigid Bare Board Production
Tel:Tel:
+86+8621 2221
21 222100500050 5. IPC Factory for Assembling, Soldering and Testing
IPCIPC
ChinaChina
— Beijing
— Beijing
Office
Office 6. IPC Factory for Cleaning and Conformal Coating
RoomRoom 610,
610,
China
China
Railway
Railway
19th
19th
Bldg.,
Bldg.,
#19#19
Ronghua
Ronghua
South
South
Rd.,Rd.,
Beijing,
Beijing,
100176,
100176,
PRCPRC 7. Get Ahead with IPC Training and Certification
北京市经济技术开发区荣华南路19号中铁十九局办公大楼610室
北京市经济技术开发区荣华南路19号中铁十九局办公大楼610室 8. Experience the Benefits of IPC Membership
邮编：100176
邮编：100176
Tel:Tel:
+86+8621 2221
21 2221
0100
0100
IPCIPC
China
China
— Shenzhen
— Shenzhen Office
Office
27F27F
A-D,A-D,
XinXin
Baohui
BaohuiBuilding,
Building,
Nanhai
Nanhai
Avenue,
Avenue,
Nanshan
Nanshan
District,
District,
Shenzhen,
Shenzhen,
518054,
518054,
PRCPRC
Association Connecting Electronics Industries
深圳市南山区南海大道新保辉大厦27楼A-D
深圳市南山区南海大道新保辉大厦27楼A-D
邮编：518054
邮编：518054
Tel:Tel:
+86+86
21 2221
21 2221
00700070 ®
1
 Purpose of IPC Checklists Chain of Production
In the entire production chain of a completed rigid printed board assembly number of DEMANDS:
parameters and varieties exist. MARKET
Quicker.
No Rigid Printed Board assembly Parameters Relevant IPC Standard(s) Variables Smaller.
1 Choice of component package 50 ELECTRONIC DESIGN Smarter.
2 Choice of surface finish on components: IPC J-STD-002 10 Higher quality.
Analog technique and/or digital technique.
3 CAD acc to IPC-2221 & 2222 Class 1, 2 or 3 3
4 CAD acc to IPC-2221 & 2222 Level A, B or C 3 Components Thru Hole Technology (THT), Surface
mounted (SMD) and/or embedded (HDI).
5 Footprint/land acc to IPC-7351 Density Level A, B or C 3
6 Demands for cooling in/on printed boards 2 Around 5 million to choose between.
7 Design/CAD of QFN: IPC-7093 3
8 Design/CAD of BGA/CSP: IPC-7095 3
ELECTRONIC DESIGN
9 Design/CAD of stencils: IPC-7525 5
10 Placement of components 10
Choice of components (BOM).
11 Choice of printed board base material: IPC-4101 8 Draw schematic diagram and create a Net list.
12 Choice of printed board base material Cu foil: IPC-4562 2
13 Choice of printed board solder mask: IPC-SM-840 3
14 Choice of printed board surface finish: IPC-4552, 4553, 4554 or 4556 5 CAD
15 Choice of printed board handling and storage: IPC-1601 2
Create footprints and make electrical connections
16 Age/Wetting of printed board: IPC J-STD-003 3
without any shorts plus consider EMC regulations
17 Printed board process steps at supplier: IPC-6011 and 6012 20 and cleaning and conformal coating.
18 Different stencil/printing options: IPC-7526 and 7527 5
19 Solder paste/stick/wire options: IPC J-STD-005 and 006 17
20 Flux with solder paste/stick/wire options: IPC J-STD-004 5
21 Reflow/vapor phase/wave/selective/hand options. 5 CAD
22 Choice of soldering environments (O2 free, N2 or Air) 3 GERBER FILES are created.
23 Choice of lead or lead-free process. 2 A printed board specification is established.
24 Choice of process cycle: IPC J-STD-020 and 075 10
25 Choice of moisture sensitive level (MSL): IPC J-STD-033 5
26 Choice of cleaning method: IPC-CH-65, IPC-5702, IPC-5703 4
PRINTED BOARD MANUFACTURING
27 Conformal coating IPC-CC-830, J-STD-001 3
28 Printed board assembly requirements Class 1, 2 or 3: IPC J-STD-001 3
29 Printed board assembly acceptability Class 1, 2 or 3: IPC-A-610 3
30 Printed board assembly touch up and repair: IPC-7711/21 3 ASSEMBLING AND SOLDERING
Printed board assembly requirements/acceptability for electronic
31 6 Purchase components according to BOM.
enclosures: IPC-A-630
Printed board assembly requirements/acceptability for cable: IPC/ Purchase printed boards.
32 3
WHMA-A-620
Total variables 212 Purchase solder paste.
Purchase solder paste stencil.
Theoretically, if each of these 32 parameters and their 212 variables depend on each other Receive Pick & Place data.
(worst case and not true), the number of potential combinations is as high as 4 200 000 000
Assembly, soldering, testing and final assembly plus
000 000 000 0, (4,2E19) — too many to be handled by the human brain.
cleaning and conformal coating of printed board
The purpose of this IPC Checklist is to assist all involved in the entire production chain of assemblies.
Printed board’s (see facing page) in minimizing the risk of combinations that don´t give good Association Connecting Electronics Industries

solder joints according to IPC-A-610 Class 1, 2 or 3.

2 ®
3
 IPC
IPCReference
ReferenceStandards
Standards
1. IPC-2221, Generic Standard on
Printed Board Design.
2. IPC-2222, Sectional Design Standard
for Rigid Organic Printed Boards.
3. IPC-2141, Design Guide for High-
Speed Controlled Impedance Circuit
Boards.
4. IPC-2251, Design Guide for the
Packaging of High Speed Electronic
Circuits.
5. IPC-2152, Standard for Determining
Current Carrying Capacity in printed
board Design.
6. IPC-2615, Printed Board Dimensions
and Tolerances.
7. IPC-2581, Generic Requirements for
Printed Board Assembly Products
Manufacturing Description Data and
Transfer Methodology.
8. J-STD-002, Solderability Tests for
Components Leads, Terminations,
Lugs and Wires.
9. J-STD-033, Handling, Packing,
Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devises.
10. IPC-7093, Design and Assembly
Process Implementation for Bottom
Termination (Typical QFN and LCC)
Components.
11. IPC-7094, Design and Assembly
Process Implementation for Flip Chip
and Die Size Components.
12. J-STD-030, Selection and Application
of Board Level Underfill Materials
13. IPC-7095, Design and Assembly
Process Implementation for BGAs.
14. IPC-7351, Land Pattern Calculator
and Tools.
15. IPC-7525, Stencil Design Guidelines.
16. IPC-7526, Stencil and Misprinted
Board Cleaning Handbook.
Please NOTE:
• Applicable documents are referenced in the standard but the requirements are
not invoked unless specifically stated.
• Related standards would have no call out, only useful references.
4 ®
17. IPC-7527, Requirements for Solder
Paste Printing.
18. IPC-4562, Metal Foil for Printed
Board Applications.
19. IPC-4563, Resin Coated Copper Foil
for Printed Boards Guideline.
20. IPC-4101, Specification for Base
Material for Rigid and Multilayer
Printed Boards.
21. IPC-4121, Guidelines for Selecting
Core Construction for Multilayer
Printed Wiring Board Applications.
22. IPC-6011, Generic Performance
Specification for Printed Boards.
23. IPC-6012, Qualification and
Performance Specification for Rigid
Printed Boards.
24. IPC-SM-840, Qualification and
Performance Specification of
Permanent Solder Mask and Flexible
Cover Materials.
25. IPC-4552, Specification for
Electroless Nickel/Immersion Gold
(ENIG) Plating for Printed Boards.
26. IPC-4553, Specification for
Immersion Silver Plating for Printed
Boards.
27. IPC-4554, Specification for
Immersion Tin Plating for Printed
Boards.
28. IPC-4556, Specification for
Electroless Nickel/Electroless
Palladium/Immersion Gold (ENEPIG)
Plating for Printed Boards.
29. IPC-A-600, Acceptability of Printed
Boards.
30. J-STD-003, Solderability Tests for
Printed Boards.
31. IPC-1601, Printed Board Handling
and Storage Guidelines.
32. IPC-TM-650, Test Methods Manual.
33. IPC-9691, User Guide for the IPC-
TM-650, Method 2.6.25, Conductive
Anodic Filament (CAF) Resistance Test
(Electrochemical Migration Testing).
34. IPC-1752, Material Declaration
Management.
35. J-STD-609, IPC/JEDEC Marking and
Labeling of Components, Printed Boards
and Printed board’s to Identify (Pb), Lead
Free (Pb-Free) and Other Attributes.
36. J-STD-001, Requirements for Soldered
Electrical and Electronic Assemblies.
37. IPC-HDBK-001, Handbook and Guide to
Supplement J-STD-001.
38. J-STD-004, Requirements for Soldering
Fluxes.
39. J-STD-005, Requirements for Soldering
Pastes.
40. IPC-HDBK-005, Guide to Solder Paste
Assessment.
41. J-STD-006, Requirements for Electronic
Grade Solder Alloys and Fluxed and Non-
Fluxed Solid Solders for Electronic Solder
Applications.
42. IPC-A-610, Acceptability of Electronic
Assemblies.
43. IPC-7711/21, Rework, Modification and
Repair of Electronic Assemblies.
44. IPC/WHMA-A-620, Requirements and
Acceptability for Cable and Wire Harness
Assemblies.
45. J-STD-020, Moisture/Reflow Sensitivity
Classification for Nonhermetic Solid State
Surface Mount Devices .
46. J-STD-075, Classification of Non-IC
Electronic Components for Assembly
Processes.
47. IPC-2611, Generic Requirements for
Electronic Product Documentation.
48. IPC-2612, Sectional Requirements for
Electronic Diagramming Documentation
(Schematic and Logic Descriptions).
Association Connecting Electronics Industries
49. IPC-2614, Sectional Requirements for
Board Fabrication Documentation.
50. IPC-CH-65, Guidelines for Cleaning of
Circuit Boards and Assemblies.
51. IPC-5701, User Guide for Cleanliness of
Unpopulated Printed Boards.
52. IPC-5702, Guidelines for OEMs in
Determining Acceptable Levels of
Cleanliness of Unpopulated Printed
Boards.
53. IPC-5703, Cleanliness Guidelines for
Printed Board Fabricators.
54. IPC-5704, Cleanliness Requirements for
Unpopulated Printed Boards.
55. IPC-8497-1, Cleaning Methods and
Contamination Assessment for Optical
Assembly
56. IPC-9201, Surface Insulation Resistance
Handbook.
57. IPC-9202, Material and Process
Characterization/Qualification Test
Protocol for Assessing Electrochemical
Performance.
58. IPC-9203, User Guide to IPC-9202 and
the IPC-B-52 Standard Test Vehicle.
59. IPC-PE-740, Troubleshooting for Printed
Board Manufacture and Assembly
60. IPC-CC-830, Qualification and
Performance of Electrical Insulating
Compounds for Printed Wiring
Assemblies – Includes Amendment 1.
61. IPC-HDBK-830, Guidelines for Design,
Selection and Application of Conformal
Coatings.
62. IPC-AJ-820, Assembly and Joining
Handbook.
63. IPC-A-630, Acceptability Standard for
Manufacture, Inspection and Testing of
Electronic Enclosures.
64. IPC-T-50, Terms and Definitions for
Interconnecting and Packaging Electronic
Circuits.
5
 IPC Performance Classes IPC Producibility Levels

Performance Classes Producibility Levels

Three general classes have been established to reflect progressive increases in When appropriate, IPC standards (IPC-2221, IPC-2222 and IPC-7351) provide three design
sophistication, functional performance requirements and testing/inspection frequency. producibility levels of features, tolerances, measurements, assembly and testing of completion
It should be recognized that there may be an overlap of equipment categories in or verification of the manufacturing process. These reflect progressive increases in the
different classes. The user has the responsibility to specify in the contract or purchase sophistication of tooling, materials and/or processing and therefore, progressive increases in
order, the performance class required for each product and shall indicate any fabrication cost.
exceptions to specific parameters, where appropriate.
These levels are:
Level A: General Design Producibility — Preferred
IPC Class 1: Level B: Moderate Design Producibility — Standard
General Electronic Products — Includes consumer products and some computer and Level C: High Design Producibility — Reduced
computer peripherals suitable for applications where cosmetic imperfections are not The producibility levels are not to be interpreted as a design requirement, but a method of
important and the major requirement is function of the completed printed board. communicating the degree of difficulty of a feature between design and fabrication/assembly
facilities. The use of one level for a specific feature does not mean that other features must be
IPC Class 2: of the same level. Selection should always be based on the minimum need, while recognizing
that the precision, performance, conductive pattern density, equipment, assembly and testing
Dedicated Service Electronic Products — Includes communications equipment,
requirements determine the design producibility level. The numbers listed within the numerous
sophisticated business machines, instruments where high performance and extended
tables are to be used as a guide in determining what the level of producibility will be for any
life are required and for which uninterrupted service is desired but not critical. Certain
feature. The specific requirement for any feature that must be controlled on the end item
cosmetic imperfections are allowed.
shall be specified on the master drawing of the printed board or the printed board assembly
drawing.
IPC Class 3:
High Reliability or Harsh Operating Environment Electronic Products — Includes the
equipment and products where continued performance or performance on demand
is critical. Equipment downtime cannot be tolerated and must function when required
such as in life support items or flight control systems. Printed boards in this class are
suitable for applications where high levels of assurance are required and service is
essential.
Please NOTE that the final performance class for printed board assemblies
(assembled, soldered, cleaned and tested) cannot be any greater than the
performance class called out for the bare printed board.
That is, in order to obtain a Class 3 with the assembly printed board assembly,
an IPC Class 3 recognition of the bare printed board (anything with a Class 2 or 1
with the bare printed board prevents obtaining a Class 3 with the printed board
assembly) must be first obtained.

Association Connecting Electronics Industries

6 ®
7
 Checklist at the Project Start Level Notes
____________________________________________________________________________________
E E Responsible
Responsible Demand Demand on Assembly
on Assembly IPC IPC Standard
Standard Information
Information Check
Check
1 1 Project
Project
Leader
LeaderIPC Class
IPC Class
1, 2 1,or 23?or 3? IPC-2221B
IPC-2221B Any Any Additional/Exceptions
Additional/Exceptions ____________________________________________________________________________________
2 2 Project
Project
Leader
LeaderIPC Level
IPC Level
A, BA, or BC?or C? IPC-2221B
IPC-2221B Any Any Additional/Exceptions
Additional/Exceptions
____________________________________________________________________________________
3 3 Project
Project
Leader
LeaderIPC Level
IPC Level
A, B,A,C B, or CD?or D? IPC-1752A
IPC-1752A Material MaterialDeclaration
Declaration
4 4 Project
Project
Leader
LeaderRoHS RoHS
1 or 1RoHS
or RoHS2? 2? ____________________________________________________________________________________
ValidValid
for both
for both
printed
printed
boardboard
and and
printed
printed
5 5 Project
Project
Leader
LeaderTouchTouch
up and up and
Repair Repair
allowed?
allowed?
IPC-7711/21B
IPC-7711/21B
boardboard
assembly?
assembly? ____________________________________________________________________________________
Different
Differentsurfaces
surfaces
havehavedifferent
different
wetting.
wetting.
Surface
Surface
finishfinish
on on
6 6 Project
Project
Leader
Leader
components?
components?
J-STD-002D
J-STD-002D Can Can be ofbeimportance
of importance for achieving
for achieving
IPC IPC ____________________________________________________________________________________
ClassClass
3. 3.
7 7 Project
Project
Leader
LeaderProcess
Process
Sensitivity
SensitivityLevelLevel
IPC-020
(PSL)(PSL)
IPC-020
and and MaxMax Temp, Temp,
ThermalThermal
gradient
gradient
and and
H2OH2O ____________________________________________________________________________________
IPC-075
IPC-075 Sensitivity.
Sensitivity.
IPC-4552,
IPC-4552,
Different
DifferentSurface
Surface
Finishes
Finishes
havehave
Different
Different
____________________________________________________________________________________
Surface
Surface
finishfinish
on Printed
on Printed
8 8 Project
Project
Leader
Leader IPC-4553A
IPC-4553A
and and
Boards?
Boards? wetting
wettingand and
durability.
durability.
IPC-4554
IPC-4554 ____________________________________________________________________________________
Moisture
Moisture Sensitive
SensitiveLevelLevel
of more
of more
9 9 Project
Project
Leader
LeaderMSLMSL on components
on components J-STD-033C
J-STD-033C ____________________________________________________________________________________
importance
importance for afor
Pb-a Free
Pb- Free
process.
process.
Marking
Marking
and and Labeling
Labeling
of of
Components,
Components, printedprinted
boards boards ____________________________________________________________________________________
10 10 Project
Project
Leader
Leaderand and
Printed
Printed
board’s
board’s
to to J-STD-609A
J-STD-609A
Identify
Identify
Pb, Pb-Free
Pb, Pb-Free and andOtherOther ____________________________________________________________________________________
Attributes.
Attributes.
11 11 Project
Project
Leader
LeaderVoids?
Voids? IPC-7095C
IPC-7095C In the In balls
the balls
of BGA of BGA
and and
CSP CSP
components
components ____________________________________________________________________________________
12 12 Project
Project
Leader
LeaderUL class?
UL class? Underwriters
Underwriters Laboratories
Laboratories
Cleaning
Cleaning
and andConformal
Conformal
____________________________________________________________________________________
13 13 Project
Project
Leader
Leader IPC-CH-65
IPC-CH-65 See See Checklist
Checklist
I, page
I, page
19. 19.
Coating
Coating
EMCEMC on the
on printed
the printedboard board Needed
and and Needed
for CE
for CEDifferent
DifferentStandards/Demands
Standards/Demands in different
in different
____________________________________________________________________________________
14 14
Electronic
Electronic
Designer
Designer
components?
components? marking
marking countries?
countries?
____________________________________________________________________________________
15 15
Electronic
Electronic
Designer
Designer
Impedance?
Impedance? IPC-2141A
IPC-2141A
16 16
Electronic
Electronic
Designer
Designer
HighHigh
speed/frequency?
speed/frequency? IPC-2251
IPC-2251 ____________________________________________________________________________________
17 17
Electronic
Electronic
Designer
Designer
HighHigh
amperes?
amperes? IPC-2152
IPC-2152
BaseBase
material
material properties
propertiesfor for ____________________________________________________________________________________
All Base
All BaseMaterial
Material
havehave
different
different
valuesvalues
for for
18 18
Electronic
Electronic
Designer
Designer
mechanical,
mechanical, electrical and and IPC-4101
electrical IPC-4101
Tg, Td,
Tg, DkTd,and
Dk and
CTE.CTE. ____________________________________________________________________________________
thermal?
thermal?
Cooling
Cooling
in- &in-outside
& outsideprinted
printed
19 19 Project
Project
Leader
Leader IPC-2221
IPC-2221 ____________________________________________________________________________________
boards?
boards?
20 20
Electronic
Electronic
Designer
Designer
Cu foil
Cu quality?
foil quality? IPC-4562A
IPC-4562A Different DifferentCu Foils
Cu Foils
in thein market
the market
21 21
Electronic
Electronic
Designer
Designer
CAF CAF
basebase
material?
material? IPC-9691A
IPC-9691A ConductiveConductive Anodic Anodic
Filament
Filament ____________________________________________________________________________________
22 22
Electronic
Electronic
Designer
Designer
BGA/CSP
BGA/CSP on the on Assembly?
the Assembly?IPC-7095C IPC-7095C ____________________________________________________________________________________
23 23
Electronic
Electronic
Designer
Designer
QFNQFNon theon Assembly?
the Assembly? IPC-7093
IPC-7093
24 24
Electronic
Electronic
Designer
Designer
Flip Chip
Flip Chip
on the on Assembly?
the Assembly? IPC-7094 IPC-7094 ____________________________________________________________________________________
Minimum
Minimum isolation
isolation
distances
distances IPC-2221B
IPC-2221B
and and
25 25
Electronic
Electronic
Designer
Designer
between
betweenholesholesand and tracks? IPC-2222A
tracks? IPC-2222A ____________________________________________________________________________________
26 26
Electronic
Electronic
Designer
Designer
FinalFinal
size size
(LxWxT)?
(LxWxT)?
27 27
Electronic
Electronic
Designer
Designer
Number
Numberof layers?
of layers? IPC-4121
IPC-4121 Buildup
Buildup
of anofMultilayer
an Multilayer Printed
Printed
boardboard ____________________________________________________________________________________
28 28
Electronic
Electronic
Designer
Designer
Mechanical
Mechanical tolerances? IPC-2615
tolerances? IPC-2615 Mechanical
Mechanical Drawings
DrawingsStandard
Standard
____________________________________________________________________________________
Assembly
Assembly SMDx1, SMDx1, SMDx2 SMDx2
29 29
Electronic
Electronic
Designer
Designer
THT THT
or inorcombination?
in combination? ____________________________________________________________________________________
Predestinated
Predestinated component
component
Electronic
Electronic
30 30 placements
placements and and forbidden IPC-7351
forbidden IPC-7351 ____________________________________________________________________________________
Designer
Designer
areas?
areas?
IPC-2611,
IPC-2611, ____________________________________________________________________________________
If notIf all
notneeded
all neededdatadata
are included,
are included,
the the
Project
Project
Leader
Leader IPC-2612
IPC-2612 Association Connecting Electronics Industries
Documentation
Documentation requests
requests interface
interfacebetween
between CADCAD and and
CAMCAM at the
at the
31 31
& Electronic
& Electronic IPC-2612-1,
IPC-2612-1,
material
material
declaration
declaration printed
printed
board board
and andprinted
printed
boardboard
assembly
assembly
Designer
Designer IPC-2614
IPC-2614
and and
8 IPC-2615
IPC-2615
supplier
supplierwill will
be unclear.
be unclear. ®
9
 Checklist at the CAD Level
Demand on printed
F Responsible
board assembly
1 CAD Department IPC Class 1, 2 or 3?
2 CAD Department IPC Level A, B or C?
Footprints Level Density A,
3 CAD Department
B or C?
Marking and labeling
of Components, Printed
4 CAD Department Boards and Printed Board
Assemblies to Identify Pb,
Pb-Free and Other Attributes.
5 CAD Department Voids?
6 CAD Department EMC on the printed board?
7 CAD Department Impedance?
8 CAD Department High speed/frequency?
9 CAD Department High amperes?
Base material properties for
10 CAD Department mechanical, electrical and
thermal?
Minimum isolation distances
11 CAD Department
between holes and tracks?
12 CAD Department Number of layers?
13 CAD Department CAF base material?
BGA/CSP on the printed
14 CAD Department
board assembly?
QFN on the printed board
15 CAD Department
assembly?
Flip Chip On The Printed
16 CAD Department
Board Assembly?
17 CAD Department Mechanical Tolerances?
Solder Paste Application
18 CAD Department By Screen Printing With A
Stencil Or Via Dispensing?
Component Placement And
19 CAD Department
Routing
Cleaning & Conformal
20 CAD Department
Coating
21 CAD Department Format Of The Data Files
Are all needed data for
printed board and printed
board assembly included?
22 CAD Department
Mechanical and electrical
drawings understandable?
Complete BOM list?
10
Notes
____________________________________________________________________________________
IPC Standard Information Check
____________________________________________________________________________________
IPC-2221 Any Additional/Exceptions
IPC-2221 and IPC-2222 Any Additional/Exceptions ____________________________________________________________________________________
IPC-7351 Footprint = Land ____________________________________________________________________________________
Where the Marking and ____________________________________________________________________________________
Labeling shall be done.
J-STD-609
Place, in the Cu or in the ____________________________________________________________________________________
Solder Mask
In the balls of BGA and
____________________________________________________________________________________
IPC-7095
CSP components
____________________________________________________________________________________
To solve the EMC on the
printed board level is
preferable.
____________________________________________________________________________________
IPC-2141 Tolerances? ____________________________________________________________________________________
IPC-2251
IPC-2152 ____________________________________________________________________________________
All Base Material have
IPC-4101 different values for Tg, Td, ____________________________________________________________________________________
Dk and CTE.
____________________________________________________________________________________
IPC-2221 and IPC-2222
Guideline for Selecting ____________________________________________________________________________________
IPC-4121 Core Construction for
Multilayer Applications ____________________________________________________________________________________
Conductive Anodic
IPC-9691 ____________________________________________________________________________________
Filament
IPC-7095 ____________________________________________________________________________________
IPC-7093 ____________________________________________________________________________________
IPC-7094 ____________________________________________________________________________________
Mechanical Drawings
IPC-2615
Standard
____________________________________________________________________________________
____________________________________________________________________________________
IPC-7525 and IPC-7527
____________________________________________________________________________________
Does the operators have
valid IPC CID and/or CID+ ____________________________________________________________________________________
Certification
____________________________________________________________________________________
IPC-2221 See Checklist I page 18
Gerber, ODB+++ or ____________________________________________________________________________________
IPC-2581
GenCam
If not all needed data are ____________________________________________________________________________________
included, the interface
IPC-2611, IPC-2612
between CAD and CAM ____________________________________________________________________________________
IPC-2612-1, IPC-2614
at the printed board and
and IPC-2615
printed board assembly ____________________________________________________________________________________
supplier will be unclear.
____________________________________________________________________________________
Association Connecting Electronics Industries
®
11
 Checklist at the Printed Board Notes
Ordering Level ____________________________________________________________________________________
Demand on Printed
G Responsible IPC Standard Information Check
Board ____________________________________________________________________________________
Any Additional/Exceptions
Performance according to 3/A See Appendix A in ____________________________________________________________________________________
1 Purchasing Department IPC-6011 and IPC-6012C
IPC Class 1, 2, 3 or 3/A? 6012C See Appendix B in
6012C ____________________________________________________________________________________
Base Material Properties
Must be a number like ____________________________________________________________________________________
2 Purchasing Department for Mechanical, Electrical IPC-4101C
IPC-4101C/xx
and Thermal?
3 Purchasing Department Impedance? IPC-2141A Tolerances? ____________________________________________________________________________________
Guideline for Selecting
4 Purchasing Department Number of Layers? IPC-4121 Core Construction for ____________________________________________________________________________________
Multilayer Applications
Conductive Anodic ____________________________________________________________________________________
5 Purchasing Department CAF Base Material? IPC-9691A
Filament
Different Surface Finishes ____________________________________________________________________________________
IPC-4552, IPC-4553A,
6 Purchasing Department Surface Finish? have Different wetting
IPC-4554 and IPC-4556 ____________________________________________________________________________________
and durability.
Mechanical Drawings
7 Purchasing Department Mechanical Tolerances? IPC-2615 ____________________________________________________________________________________
Standard
If not all needed data are
Are all needed data included, the interface ____________________________________________________________________________________
Purchasing Department IPC-2611, IPC-2612
8 for printed board between CAD and CAM at
and CAD IPC-2612-1 and IPC-2614 ____________________________________________________________________________________
manufacturing included? the printed board supplier
will be unclear.
Purchasing Department Does the operators have ____________________________________________________________________________________
Acceptability of printed
Plus at the delivery IPC-6011, IPC-6012 and valid IPC-A-600 CIS
9
department at the printed
board according to IPC
IPC-A-600H and/or CIT Training and ____________________________________________________________________________________
Class 1, 2 or 3?
board fabricator Certification
The wetting of the printed ____________________________________________________________________________________
Solderability of printed board is essential for
10 Purchasing Department
board
J-STD-003
achieving the perfect ____________________________________________________________________________________
solder joint.
Are the Printed boards IPC-6012, IPC-A-600 and ____________________________________________________________________________________
11 Purchasing Department See Checklist I, page 19.
clean and dry? IPC-5703
Printed Board Handling
____________________________________________________________________________________
12 Purchasing Department IPC-1601
and Storage?
____________________________________________________________________________________
IPC-A-600 CIS and CIT
Training and Certification.
Incoming department Acceptability of printed
Routines for studying
____________________________________________________________________________________
13 at the printed board board according to IPC IPC-A-600H
and saving printed board
assembly operation Class 1, 2 or 3?
protocols and micro ____________________________________________________________________________________
sections.
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
Association Connecting Electronics Industries

12 ®
13
 Checklist at Printed Board Notes
Assembly Ordering Level ____________________________________________________________________________________
Demand on Printed
H Responsible
board assembly
IPC Standard Information Check ____________________________________________________________________________________
Does responsible staff ____________________________________________________________________________________
Performance according to have valid J-STD-001 CIS
1 Purchasing Department J-STD-001
IPC Class 1, 2 or 3? and/or CIT Training and
Certification
____________________________________________________________________________________
Which requirements ____________________________________________________________________________________
Requirements for
J-STD-001 are valid/demanded for
2 Purchasing Department Soldered Electronic
IPC-HDBK-001 article X? Handbook
Assemblies
available!
____________________________________________________________________________________
Does the EMS/OEM ____________________________________________________________________________________
IPC DVD-55C, 74C, 75C, have a ESD plan, control
3 Purchasing Department ESD Demands? 76C, 77C AND 78C routines and education to
IEC-61340C/ANSI 20.20 fulfill the necessary ESD
____________________________________________________________________________________
level?
____________________________________________________________________________________
Demands for Moisture
MSL on components in J-STD-033, J-STD-020 Sensitive Level? Shall
4 Purchasing Department
the factory? and J-STD-075
____________________________________________________________________________________
printed board also be
included?
____________________________________________________________________________________
Solderability Tests on Not all Surfaces Finishes
5 Purchasing Department J-STD-002
Component Terminations have the same wetting. ____________________________________________________________________________________
The wetting of the printed
Solderability of printed J-STD-003 board is essential for ____________________________________________________________________________________
6 Purchasing Department
board IPC-1601 achieving the perfect
solder joint. ____________________________________________________________________________________
Choices of this
J-STD-004
parameters have ____________________________________________________________________________________
7 Purchasing Department Flux, Paste, Solder J-STD-005
influence for the solder
J-STD-006
joint and cleaning ____________________________________________________________________________________
8 Purchasing Department Type of Stencil? IPC-7525 Fluxofobic Coatings?
Stencil Printing ____________________________________________________________________________________
9 Purchasing Department IPC-7527 SPI Parameters
Tolerances?
Stencil and Misprinted ____________________________________________________________________________________
10 Purchasing Department IPC-7526 Handbook!
Board Cleaning?
Moisture/Reflow
____________________________________________________________________________________
J-STD-033, J-STD-020 More important in a Lead
11 Purchasing Department Sensitivity Classification
of Components
and J-STD-075 (Pb) free process ____________________________________________________________________________________
12 Purchasing Department Assembly and Joining IPC-AJ-820 Handbook available!
____________________________________________________________________________________
Does the operators have
Acceptability of printed
valid IPC-A-610 CIS
13 Purchasing Department board assembly acc. to IPC-A-610
and/or CIT Training and
____________________________________________________________________________________
IPC Class 1, 2 or 3?
Certification
____________________________________________________________________________________
Is it allowed to do Touch
Rework, Modifications
up and Repair? Does
14 Purchasing Department
and Repair of printed
IPC-7711/21 the operators have valid
____________________________________________________________________________________
board and printed board
IPC-7711/21 CIS and CIT
assembly?
Training and Certification
____________________________________________________________________________________
IPC-CH-65 Many parameters to
15 Purchasing Department
Cleaning and Conformal
IPC-CC-830 control to get the printed
____________________________________________________________________________________
Coating?
IPC-HDBK-830 board assembly clean.
____________________________________________________________________________________
Does the operators have
valid IPC-A-620 CIS
16 Purchasing Department Cabling IPC/WHMA-A-620
and/or CIT Training and
____________________________________________________________________________________
Certification
____________________________________________________________________________________
IPC-1752 Level A, B, C Different regulations in
17 Purchasing Department Material Declaration Association Connecting Electronics Industries
or D? different countries.

14 ®
15
 Checklist for Cleaning and
Conformal Coating
I Responsible
1 Project Leader
2 Project Leader
3 Electronic Designer
4 Project Leader
5 Electronic Designer
Electronic Designer and
6 IPC-2221
CAD Department
7 CAD Department
8 Purchasing Department
9 Purchasing Department
10 Purchasing Department
11 Purchasing Department
12 Purchasing Department
13 Purchasing Department
14 Purchasing Department
16
Notes
____________________________________________________________________________________
Demand on printed
IPC Standard Information Check
board assembly ____________________________________________________________________________________
Is cleaning a demand? If Does responsible staff
IPC-6012, J-STD-001, ____________________________________________________________________________________
yes, which type alcohol, have valid IPC-6012 and
IPC-AJ-820 and
solvent, semi aqueous or J-STD-001 CIS and/or CIT
IPC-TM-650 ____________________________________________________________________________________
aqueous? Training and Certification
Which requirements
Which cleaning levels J-STD-001 are valid/demanded for ____________________________________________________________________________________
shall apply? IPC-HDBK-001 article X? Handbook
available! ____________________________________________________________________________________
Are the compatible with
cleaning?
Define a test procedure. ____________________________________________________________________________________
Process Sensitivity Level
Max Temp, Temperature ____________________________________________________________________________________
IPC-020 and IPC-075 gradient and H2O
(PSL)
Sensitivity. ____________________________________________________________________________________
Do components need
IPC-2221
stand off? ____________________________________________________________________________________
Component placement
It must be possible for the ____________________________________________________________________________________
considerations due to
cleaning agent to reach
cleaning and Conformal
all surfaces.
Coating ____________________________________________________________________________________
Printed board thickness Aspect Ratio < 5 are
IPC-2221 ____________________________________________________________________________________
to PTH Ø Tenting? preferred
Cleanliness of IPC-5701, IPC-5702, Printed boards need
unpopulated printed IPC-5703 and IPC-5704 to be clean when they ____________________________________________________________________________________
boards bare printed arrive from printed board
boards fabricator. ____________________________________________________________________________________
Test methods of IPC-9201, IPC-9202 and Which methods will be
____________________________________________________________________________________
cleanliness IPC-9203 needed?
IPC-CH-65 and Type of cleaning method?
Assembling and cleaning ____________________________________________________________________________________
IPC-AJ-820 Handbook!
Does the printed board
assembly include optical IPC-8497 ____________________________________________________________________________________
Assembly?
IPC-CC830 and More important in a Lead ____________________________________________________________________________________
Conformal Coating
IPC-HDBK-830 (Pb) free process
IPC-1752 Level A, B, C Different regulations in ____________________________________________________________________________________
Material Declaration
or D? different countries.
Does the operators have ____________________________________________________________________________________
Acceptability of printed
valid IPC-A-610 CIS
board assembly acc. to IPC-A-610
and/or CIT Training and ____________________________________________________________________________________
IPC Class 1, 2 or 3?
Certification
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
____________________________________________________________________________________
Association Connecting Electronics Industries
®
17
 Association Connecting Electronics Industries

Terms and Definitions IPC STANDARDS —

Everything You Need IPC STANDARDS
from
®

Start — Finish
to
EVERYTHING YOU NEED FROM START TO FINISH
PCB Printed Circuit Board (Bare Board)
PCBA Printed Circuit Board Assembly End-Product
BGA, CSP, HDI
QFN Quad Flatpack - No Lead Flip Chip
Repair Acceptability Standard for IPC J-STD-030
BGA Ball Grid Array Manufacture, Inspection, & Testing
IPC-7711/21 of Electronic Enclosures IPC-7093
BTC Bottom Termination Component IPC-A-630 IPC-7094
CE Conformité Européenne (In accordance with EU Directives) Solderability IPC-7095
IPC J-STD-002 Requirements and Acceptance for
CSP Chip Scale Package IPC J-STD-003 Cable and Wire Harness Assemblies Storage
ESD Electrostatic Discharge IPC-A-620 & Handling
IPC J-STD-020
EMC Electromagnetic Compatibility Stencil Design
Guidelines IPC J-STD-033
Acceptability of
LCC Leadless Chip Carrier IPC-7525 Electronic Assemblies IPC J-STD-075
IPC-7526 IPC-A-610 IPC-1601
LCCC Leadless Ceramic Chip Carrier
JEDEC Joint Electron Device Engineering Council
IPC-7527 Test Methods
Requirements for Soldered
Electronic Assemblies IPC-TM-650
CAF Conductive Anodic Filament Assembly
IPC J-STD-001/IPC-HDBK-001 IPC-9691
UL Underwriters Laboratories Materials
IPC J-STD-004 Electrical Test
Tg Glass Transition Temperature IPC J-STD-005 IPC-9252
Acceptability of Printed Boards
Td Laminate Temperature of Decomposition IPC-HDBK-005 IPC-A-600
IPC J-STD-006 Surface
CTE Coefficient of Thermal Expansion Finishes
IPC-SM-817
Dk Dielectric Constant
Qualifications for Printed Boards IPC-4552
IPC-CC-830
IPC-6011, 6012, 6013, 6017, 6018 IPC-4553
CID Certified Interconnect Designer (Basic) HDBK-830
HDBK-850 IPC-4554
CID+ Certified Interconnect Designer (Advanced) Base Materials for Printed Boards IPC-4556
CIS Certified IPC Application Specialist IPC-4101, 4104, 4202, 4203, & 4204
Solder Mask High Speed/
CIT Certified IPC Trainer IPC-SM-840 Frequency
Design & Land Patterns IPC-2141
Copper Foils IPC-2221, 2222 & 2223 + 7351 IPC-2251
IPC-4562 Materials
Data Transfer and Electronic Declaration
Marking and Product Documentation IPC-1751
Labeling
IPC-2581 Series, IPC-2610 Series IPC-1752
IPC J-STD-609
IPC-1755
Learn about IPC standards at www.ipc.org/standards
July 2014
Association Connecting Electronics Industries

18 ®
19
 20
Phenomena in Cross Section of Plated Through Holes
henomena
Productin C
spec Cross Section of Plated Through Holes
32
A
Electronic 6
Design 33
1
Component data 20
B
CAD

A Undercut
C 20 Burr Pushed Into Hole
B Outgrowth 32 CAD 21 Glass Fiber Protrusion
A 6 21
3433
Plated

C Overhang 1 10 20 22 Innerlayer (Post) Separation

B 7 Gerber files on all copper layer 23 Wicking
ndercut 1 (Resin) Blistering 2 11 20 Burr Pushed
24 OverInto Plating
HoleResist Void
22Gerber files on solder mask
utgrowth2 Laminate Electronic
Void scheme 34 21 Glass25Fiber
CAM (Positive)
Protrusion Etchback
verhang3 (Resin) Delamination 10
12 21
Routing 23Gerber files on legend print 22 26 Barrel
Innerlayer (Post)Crack
Separation
4 Pad Cratering 7 13 24Drill file & Drill information 36 23 27 Shadowing
Wicking
Rigid

5 Lifted Land Crack

esin) Blistering 2 3 11 24 Over28PlatingNodule Resist Void
Burr 14 22 25Bare Board Specification 29 Resin Smear
aminate 6 Void 12 25 (Positive) Etchback
7 Bond Enhancement
esin) Delamination 23 26Mechanical drawing 35 26 Barrel30CrackCopper & Over Plate Void
— “Pink Ring”
Net list 36 31 Burned Plating
ad Crateringremoved
8 Negative 13 15 24 27Coordinates for SMD assembly 27 Shadowing
ifted Land CrackBOMEtchback 3 37 28 Nodule32 Copper Foil Contamination
9 Foil Crack 14 16 25 Gerber file for solder Lifted Land
urr
10 Hole Plating Void 28paste stencil 38 29 Resin33Smear
ond Enhancement 8 26 35 30 Copper34 &ResinOver Crack Delamination
Plate Void
Through

moved11 Wedge
— “Pink Void
Ring” 35 Crazing
15 27 29 37 31 Burned Plating
12 Glass
egative Etchback Fiber Void 4 Footprints 32 Copper36 FoilForeign Inclusion
Contamination
13 Glass Bundle Void 30 37 37 Prepreg Void
oil Crack IPC standard 33 Lifted Land
ole Plating Severe Etchback
14 Void 9 16 38 Copper Clad Laminate Void
15 Nail Heading 8 17 28 40 39 34 Resin38Crack Delamination
edge Void1 IPC-2141A 35 39 Measling
Crazing
16 Drill Wall Tear/Wicking 29 Program for: 40 Resin Recession
lass Fiber Void
IPC-2251
17 Hole Wall Pull Away
4 18 37• Laser plotter 36 Foreign Inclusion
2
lass Bundle Void 5 Component
30 placement 37
41 Glass-Weave Texture
Prepreg Void
18 Corner Crack 9 31 • Drilling 42 Glass-Weave Exposure
evere Etchback J-STD-002D
19 (Copper) Blistering 40 • Routing 41 4238 Copper Clad Laminate Void
3 17 39
Holes

ail Heading • AOI 39 Measling

rill Wall Tear/Wicking
IPC-7093 19 40 Resin Recession
4 18 • Electrical test
ole Wall Pull Away Originally Designed by
5 41 Glass-Weave
Viasystems
Texture
ToMommers Netherlands
BareBV.Printed
orner Crack
5 IPC-7094 31 42 Glass-Weave Exposure
opper) Blistering 41 42 Board Production
Reviewed by BTT-PTH
6 IPC-7095C IPC standard Atotech Deutschland GmbH. Berlin
19
Updated to Industry Standard Terminology
Text Standards

7 J-STD-609A 1 IPC-2221B Originally Designed

©IPC 2010,
by 3000 Lakeside Drive,
Viasystems Mommers
Suite 309
BV.S,Netherlands
Bannockburn, IL 60015-1249
Tel. 847 615-7100 • Fax 847 615-7105
8 IPC-1752A 2 IPC-2222A Reviewed by BTT-PTH
www.ipc.org • e-mail: orderipc.org
IPC standard Atotech Deutschland GmbH. Berlin
9 IPC-2610(15) 3 IPC-2152 Updated to Industry Standard Terminology
rights reserved
©IPC 2010, 3000AllLakeside under both international and Pan-Amerian copyright conventions.
Drive,
1 IPC-2581A Any copying, scanning or there reproductions of these materials without the prior
4 IPC-7351B Suite 309 S, Bannockburn, IL 60015-1249
written consent of the copyright holder is strictly prohibited and constitutes
infringement
Tel. 847 615-7100 • Faxunder Copyright Law of the United States.
847the615-7105
P-MICRO
2 www.ipc.org • e-mail: orderipc.org
Phenomena in Cross Section of

5 IPC-7525B
6 IPC-7527
All rights reserved under both international and Pan-Amerian copyright conventions.
Any copying, scanning or there reproductions of these materials without the prior
7 written consent of the copyright holder is strictly prohibited and constitutes
Copyright IPC infringement under the Copyright Law of the United States.
P-MICRO
ED/CAD/CAM rev 07/14
21
2
 Product spec

Component data
Electronic Design
CAD
Gerber files on all copper layer

Electronic scheme Gerber files on solder mask CAM

Routing Gerber files on legend print
Drill file & Drill information
Bare Board Specification
Mechanical drawing
Net list
Coordinates for SMD assembly
BOM
Gerber file for solder
paste stencil

Footprints
IPC standard
1 IPC-2141A Program for:
2 IPC-2251 • Laser plotter
Component placement • Drilling
3 J-STD-002D • Routing
• AOI
4 IPC-7093 • Electrical test
To Bare Printed
5 IPC-7094 Board Production
6 IPC-7095C IPC standard
CAD Rigid Text Standards

7 J-STD-609A 1 IPC-2221B
8 IPC-1752A 2 IPC-2222A
IPC standard
9 IPC-2610(15) 3 IPC-2152
4 IPC-7351B 1 IPC-2581A
5 IPC-7525B 2
6 IPC-7527
Copyright IPC
7
ED/CAD/CAM rev 07/14
23
2
22
Product spec IPC-9691A IPC-4562A IPC-4563 IPC-4121
BT
Epoxy Laser
plotter
IPC-4101DElectronic
? Design
Component data PTFE
Exposure
FR4
CAD

FR4 FR4 innerlayer

High Tg BFR Free CAD
FR4 Data from CAM Mylar removal

Gerber files on all copper layer Developing PTH OUT

Stacking Gerber files on solder mask
Electronic scheme CAM
Chemical Gerber files on legend print Etch Cu
MK Rigid

Drilling
Routing Plating 2-3µm
PH
control Drill file & Drill information Stripping
Bare Board Specification
Lamination
To waste
water system Mechanical drawing
Net list
Coordinates for SMD assembly
BOM
RigidText

Gerber file for solder

Inspect Stripping
paste stencil Sn resist
El Test Probe El Plating
Pressing Cu 25µm
Footprints El Plating
waste Sn 4-5µm
IPC Custandard
Stripping AOI
1 IPC-2141A Etch Cu
Program for:
2 IPC-2251 • Laser plotter Optical
Component placement
Black- • Drilling registration

3 J-STD-002D oxide • Routing

Scoring • AOI
4 IPC-7093 Routing • Electrical test Soldermask
Inspect
Etch & To Bareapplication
Printed
5 IPC-7094 Delivery Flux
Legend printing Board Production
TextStandards

6 IPC-7095C IPC standard H2O wash

IPC-SM-840E
Standards

J-STD-609A
7 IPC-1601 1 IPC-2221B Exposure
8 IPC-1752A 2 IPC-2222A
IPC standard
9 IPC-2610(15) 3 IPC-2152IPC standard 1. HASL SnPb 1-40 µm
2. HASL1
IPC-2581A
SnCu 1-40 µm
4 IPC-7351BIPC-6011 3. ENIG
IPC-6012C 2 HASL Developing
5 IPC-7525BIPC-600H 4. Immersion Ag
5. Immersion Sn
6 IPC-7527IPC-SM-840E 6. OSP
7. ASIG Cure
7 J-STD-003C
Copyright
Copyright IPC IPC 8. ENIPIG
ED/CAD/CAM
BB Rigidrev 07/14
rev07/14 9. Nano
IPC-4552 IPC-4553A IPC-4554 IPC-4556
25
2
 IPC-9691A IPC-4562A IPC-4563 IPC-4121
BT
Epoxy Laser
IPC-4101D ? plotter
PTFE
Exposure
FR4
FR4 FR4 innerlayer
High Tg BFR Free
FR4 Data from CAM Mylar removal

Developing PTH OUT

Stacking
Chemical Etch Cu
Drilling Plating 2-3µm
PH
control Stripping
Lamination
To waste
water system

Inspect Stripping
Sn resist
El Test Probe El Plating
Pressing Cu 25µm
El Plating
Cu waste Sn 4-5µm

Stripping AOI
Etch Cu

Optical
Black- registration
oxide
Scoring
Routing Soldermask
Inspect application
Etch &
Delivery Flux
Legend printing
H2O wash
IPC-SM-840E
IPC-1601
Exposure

IPC standard 1. HASL SnPb 1-40 µm

IPC-6011 2. HASL SnCu 1-40 µm
IPC-6012C 3. ENIG
HASL Developing
4. Immersion Ag
IPC-600H
5. Immersion Sn
IPC-SM-840E 6. OSP
7. ASIG Cure
J-STD-003C
Copyright IPC 8. ENIPIG
BB Rigid rev 07/14 9. Nano
IPC-4552 IPC-4553A IPC-4554 IPC-4556

IPC-A-600H IPC-2221B/2222A J-STD-003C

IPC-7351B IPC-840E
J-STD-075 IPC-4101C IPC-4552
J-STD-020D IPC-4562A IPC-4553A Wave Soldering
J-STD-033C IPC-6012C IPC-4554
J-STD-002D IPC-1601 IPC-4556
IPC-7525B
Components Manual AOI Unload
L
TOGE
CINOR
Assy
J-STD-004B Dryer
IPC-A-620B
321
7 654
PWB
00 98
J-STD-005A Reflow
J-STD-006C
IPC-2581A Stencil Paste
IPC-7711/21B

@ Pick & Place Unload

IPC-7526
Cleaning of stencil IPC-7527
Digital Data Screen print
L
OGE
ORT
CIN
SPI
321
654
987
00
IPC-7095C

Vapor
Phase

X-Ray
KK Rigid Text Standards

Pick & Place

Repair
J-STD-002D Loading of BGA
J-STD-003C
Pick & Place
Soldability tester
IPC-A-610E J-STD-001E
IPC-7093 J-STD-002D
Jet printer
IPC-7095C J-STD-003C
IPC-AJ-820A IPC-7711/21B J-STD-004B
Loading IPC-A-620B
IPC-HDBK-001E J-STD-005A
IPC-HDBK-005 J-STD-006C
Copyright IPC
IPC-HDBK-830
AST Rigid rev 10/13
27
2
24
Product spec
IPC-6012C IPC-5701 IPC-CC-830B
Visual Inspection
J-STD-001E IPC-5702 Conformal Coating IPC-HDBK-830 acc to IPC-A-610E
data
Electronic Design
IPC-AJ-8 20A
ComponentIPC-5703
CAD

IPC-TM-650 IPC-5704 Test

Ionic Contamination CAD
Solvent Gerber files on all copper layer

Electronic scheme Gerber files on solder mask CAM

Cleaning

Batch cleaning RoutingTest Gerber files on legend print

Alcohol Surface Insulation
Drill
Resistance file & Drill information
(SIR)
Bare Board Specification
Mechanical drawing
Net list
Coordinates for SMD assembly
Conformal Coating
RigidText

BOM
Gerber file for solder
Semi aqueous paste stencil

Batch cleaning Footprints

IPC standard Conformal Coating

1 IPC-2141A Program for:

2 IPC-2251 • Laser plotter
Batch cleaning Component placement • Drilling
3 J-STD-002D Visual• Inspection
Routing
acc to• IPC-A-610E
AOI
4 IPC-7093 • Electrical test
To Bare Printed
5 IPC-7094 Board Production
TextStandards

6 IPC-7095C IPC standard Aqueous

Standards

1 IPC-2221B IPC-CH-65B IPC-9201A

7 J-STD-609A IPC-8497-1 IPC-9202
8 IPC-1752A 2 IPC-2222A J-STD-001E IPC-9203
IPC standard IPC-HDBK-001E
9 IPC-2610(15) 3 IPC-2152
1 IPC-2581A IPC-AJ-820A
4 InlineIPC-7351B IPC-TM-650
2 IPC-PE-740
Association Connecting Electronics Industries 5 IPC-7525B
6 IPC-7527 IPC-A-610E
®

Copyright IPC
7
Copyright
ED/CAD/CAM
IPC rev 07/14
Cleaning rev 08/13
29
2
 IPC-6012C IPC-5701 IPC-CC-830B
IPC-CC-830B Visual Inspection
IPC-6012C IPC-5701 Conformal Coating IPC-HDBK-830 Visual
acc Inspection
to IPC-A-610E
J-STD-001E IPC-5702 Conformal Coating IPC-HDBK-830
J-STD-001E IPC-5702 acc to IPC-A-610E
IPC-AJ-8 20A IPC-5703
IPC-AJ-8 20A IPC-5703
IPC-TM-650 IPC-5704 Test
IPC-TM-650 IPC-5704 Ionic
Test Contamination
Ionic Contamination
Solvent
Solvent
Batch cleaning Test
Alcohol Batch cleaning Test
Surface Insulation
Alcohol Surface Insulation
Resistance (SIR)
Resistance (SIR)

Conformal Coating
Conformal Coating
Semi aqueous
Semi aqueous
Batch cleaning
Batch cleaning Conformal Coating
Conformal Coating

Batch cleaning
Batch cleaning
Visual Inspection
Visual Inspection
acc to IPC-A-610E
acc to IPC-A-610E

Aqueous
Aqueous IPC-CH-65B IPC-9201A
IPC-CH-65B IPC-9201A
IPC-8497-1 IPC-9202
IPC-8497-1 IPC-9202
J-STD-001E IPC-9203
J-STD-001E IPC-9203
IPC-HDBK-001E
IPC-HDBK-001E
Inline IPC-AJ-820A
Inline IPC-AJ-820A
IPC-TM-650
IPC-TM-650
Association Connecting Electronics Industries IPC-PE-740
Association Connecting Electronics Industries IPC-PE-740
IPC-A-610E
IPC-A-610E
®
®

Copyright IPC
Copyright IPC
Cleaning rev 08/13
Cleaning rev 08/13
Association

®®
AssociationConnecting

OF

the
ConnectingElectronics

OFJOINING
ElectronicsIndustries
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JOININGTHE
Experience
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influence
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IPC
company

31
If your company …
designs and manufactures
printed boards
provides electronics
manufacturing/assembly
services
supplies materials or services
to the electronic interconnect
industry
designs and distributes
today’s electronic products
“Being a part of the fast-changing
global electronics marketplace
requires constant intelligence
about market trends, standards
and solutions to the challenges
throughout the supply chain.
IPC is an invaluable partner
in providing that intelligence
through conferences, white
papers and technical standards.”
Andy Hyatt
Executive Vice President
Business Development
Creation Technologies
“Graphic PLC has enjoyed
the privilege of being an IPC
member for more than 30
years and the technical benefits
derived to focus us as a world
player in the manufacture of
PCBs have superceded the cost
of membership many times.”
Rex Rozario, OBE
Chairman
Graphic Plc.,UK
“I have a responsibility to
my customers and my
shareholders. Between the
savings on standards, training
materials, APEX and industry
data, IPC membership provides
immediate 100% return on
investment for us. It would
be irresponsible not to be a
member.”
Joseph F. O’Neil
President
Hunter Technology Corp
26
32
Put
Put IPC
IPCMEMBERSHIP
MEMBERSHIP to WORK for your COMPANY
A trusted leader for more than 50 years, IPC is the leading source for industry standards, Choose the Best Membership Option for Your Company
training, market research and public policy advocacy — supporting the needs of the With a growing portfolio of member benefits and products and services, IPC provides membership
estimated $2.0 trillion global electronics industry. IPC members enjoy unlimited access to the options that deliver savings on key products and services. Whether you prefer IPC’s Classic
tools, information and forums needed to thrive in an ever-changing electronic interconnect Membership, or need the added focus of technology or business-related products and services,
industry. IPC has a membership option for you.
Classic Membership
IPC’s Classic Membership provides core benefits to all employees at the company site or facility:
• 24/7 online access to members-only resources, including original articles and presentations on
the latest technical issues and industry/market trends
• One single-user download of each new/revised IPC standard within 90 days of publication
• 50% discount on IPC standards
• Significant discounts on IPC publications and training materials
• Significant discount on exhibiting at IPC events, including IPC APEX EXPO
• Reduced registration rates on IPC conferences and other educational events
• Access to participate in IPC market research studies (free reports to participating companies)
Keep on top of industry developments and train your people
• Enjoy 24/7 online access to members-only resources, including original articles and Business Package
presentations on the latest technical issues and industry/market trends.
• Get access to take part in IPC market research studies (and receive a complimentary
Offering all of the benefits of IPC’s Classic Membership, the Business Package Membership provides
additional benefits valued at more than $2,300: Why upgrade now?
report for each study in which your company participates). • One All Access Package registration to IPC APEX EXPO® When you upgrade your
• Stay abreast of global environmental directives, legislation and regulations. • One registration to IPC’s annual Capitol Hill event membership, you receive
• Enroll in IPC’s training and certification programs for a cost-effective, industry- • One registration to an IPC management/business conference complimentary access
recognized way to demonstrate your commitment to quality. • One copy of a Fast Facts market research study to key IPC events and
• Get world-class instruction at IPC’s conferences and other educational events. relevant technology or
Technology Package market information that
Save enough money to easily pay for your membership Offering all of the benefits of IPC’s Classic Membership, the Technology Package Membership
can help you advance your
• Get one single-user download of each new or revised IPC standard within 90 days of provides additional benefits valued at more than $2,300:
publication. With approximately 50 standards documents developed annually, that business goals and enhance
• One All Access Package registration to IPC APEX EXPO®
represents an average savings of more than $2,400 each year. competitiveness — all at
• Choice of one registration to IPC TechSummit or two registrations to other IPC conferences
• Save 50% on the purchase of IPC standards. a savings of more than
• One copy of IPC International Technology Roadmap for Electronic Interconnections
• Enjoy significant discounts on IPC publications and training materials. $1,000 compared to à la
• Two registrations to IPC technology webinars
• Receive discounts on registration fees for IPC conferences and other educational events.
carte pricing. Plus, because
• Benefit from a significant discount on exhibiting at IPC events.
Business & Technology Package events are bundled into
Get the most value from your IPC membership with the Business & Technology Package that builds your membership, you can
Help shape the industry on IPC’s Classic Membership, plus: enjoy the convenience of
• Participate in developing or updating the global industry standards your company, • Two All Access Package registrations to IPC APEX EXPO going through the budgetary
customers, competitors and suppliers use. • Choice of one registration to IPC TechSummit or two registrations to other IPC conferences approval process only one
• Make your voice heard by participating in IPC-organized environmental and public • One registration to IPC’s annual Capitol Hill event time instead of several times
policy initiatives on regulations that affect your company. • One copy of IPC International Technology Roadmap for Electronic Interconnections a year.
Expand your network and build your company’s visibility • One registration to an IPC management/business conference Even if your membership
• Two registrations to IPC technology webinars
• Network with your peers, and industry experts and leaders. anniversary is months away,
• Participate in interactive problem-solving exchanges through IPC’s online forums. • One copy of a Fast Facts market research study you can take advantage
of the added value of
• Build your brand visibility through IPC’s Products and Services Index (PCB and EMS Enterprise Package
companies only). IPC’s new membership
For companies that recognize the importance of giving multiple company locations access to IPC
• Gain valuable exposure for your company by exhibiting at or sponsoring IPC events. membership benefits, the Enterprise Package provides Classic Membership to all employees at select packages today! Your current
locations, plus: membership will be prorated
• Additional membership discounts beyond Classic Membership and applied to your new
www.ipc.org/membership • Unlimited complimentary admission to quarterly webinars
• 50% registration discount to all official IPC events in North America and Europe
membership package.
Put the resources of the entire industry behind your company by joining IPC today!
Learn more at www.ipc.org/membership. 27
33
 Notes
MEMBERSHIP
MEMBERSHIP
MEMBERSHIP OPTIONS
OPTIONS
OPTIONS -GLANCE
at-a
at-a -GLANCE
at-a-GLANCE
____________________________________________________________________________________
____________________________________________________________________________________
Use this
Usehelpful
this helpful
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to compare
to compare
the features
the features
of IPC’s
of membership
IPC’s membership
bundles;
bundles;
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bestfor
one
your
forcompany.
your company.
____________________________________________________________________________________
Features
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Membership
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____________________________________________________________________________________
Significant
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____________________________________________________________________________________
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IPC of
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IPC International
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Rex Rozario,
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for Electronic
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Enterprise
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that recognize
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the importance
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more information
about IPC’s
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and packages,
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visit www.ipc.org/membership
or contact
or contact
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the Member
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team atteam at ____________________________________________________________________________________
membership@ipc.org.
membership@ipc.org.
____________________________________________________________________________________
“Juki “gets
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whichwhich
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3000 Lakeside
3000 Lakeside
Drive, Drive,
Suite 309
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S,309
Bannockburn,
S, Bannockburn,
IL 60015
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(Headquarters)
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to design
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www.ipc.org
www.ipc.org meet industry
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Visit www.IPC.org/offices
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President
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Juki Automation
Juki Automation
Systems
Systems
Inc. Inc. Association Connecting Electronics Industries

34 ®
29
35

Get Ahead...
with IPC Training & Certification Programs
Smart decisions and top-notch quality are critical to success
— particularly in the highly competitive, ever-changing
electronic interconnection industry. Training alone may
help with your quality initiatives, but when key employees
actually have an industry-recognized certification on
industry standards, you can leverage that additional
credibility as you pursue new customers and contracts.
Through its international network of licensed and audited training centers, IPC — Association Connecting
Electronics Industries® offers globally recognized, industry-traceable training and certification programs
on key industry standards. Developed by users, academics and professional trainers, IPC programs reflect
a standardized industry consensus. In addition, the programs are current: Periodic recertification is required,
and course materials are updated for each document revision with support from the same industry experts
who contributed to the standard.
Why Pursue Certification?
Investing in IPC training and certification programs can help you:
• Demonstrate to current and potential customers that your company
considers rigorous quality control practices very important.
• Meet the requirements of OEMs and electronics manufacturing
companies that expect their suppliers to have these important credentials.
• Gain valuable industry recognition for your company and yourself.
• Facilitate quality assurance initiatives that have become important
in international trading.
30
36
Choose From Two Levels of Certification
Two types of certification are available, each of which is a portable credential
granted to the individual in the same manner as a degree from a college
or trade school.
Certified IPC Trainer (CIT) — Available exclusively through IPC authorized training centers,
CIT certification is recommended for individuals in companies, independent consultants and faculty
members of education and training institutions. Upon successful completion of this train-the-trainer
program, candidates are eligible to deliver CIS training (described below). They also receive materials
for conducting application-level (CIS) training.
Certified IPC Application Specialist (CIS) — CIS training and certification is recommended for
any individual who uses a standard, including operators, inspectors, buyers and management.
Earn Credentials on Five Key IPC Standards
Programs focused on understanding and applying criteria, reinforcing discrimination
skills and supporting visual acceptance criteria in key standards include:
• IPC-A-610, Acceptability of Electronic Assemblies
• IPC-A-600, Acceptability of Printed Boards
• IPC/WHMA-A-620, Requirements and Acceptance for Cable and
Wire Harness Assemblies
Programs covering standards knowledge plus development of hands-on skills include:
• J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies
• IPC-7711/IPC-7721, Rework of Electronic Assemblies/Repair and Modification
of Printed Boards and Electronic Assemblies
Get Started by Contacting Us Today
More than 250,000 individuals at thousands of companies worldwide have
earned IPC certification. Now it’s your turn! For more information, including
detailed course information, schedules and course fees, please visit
www.ipc.org/certification to find the closest authorized training center.
“Participation in IPC programs has been crucial for providing standardized, industry-accepted skills as fast and
efficiently as possible. Our customers expect our operators to be certified to IPC standards and that our product
is assembled to the quality levels defined by IPC standards. It is simply not an option to not be engaged with
IPC. Our success with defect prevention and elimination, process control and methodology, and technology
leadership is closely aligned with the success of our IPC program implementation.”
Zenaida Valianu, Operations Training Analyst,
Celestica, Inc.
Association Connecting Electronics Industries
®
31
37