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(2) The hot spot temperature of the half-chip module assembly is lower than the temperature of the
same-type full-piece module
assembly by about 25 ° C, which can effectively reduce the hot spot effect of the component.
(3) Half-cut module components meet the 1500V system voltage design requirements, which can reduce
the system-side cost by about 10%;
(4) Effectively reduce the loss of power generation caused by occlusion when there is shadow occlusion
and ash accumulation or snow accumulation.
(5) Reduce the first year and the average photoinduced attenuation;