BTX Specification v1.0b

Balanced Technology Extended
(BTX) Interface Specification
Version 1.0b
Balanced Technology Extended (BTX) Interface Specification
Version 1.0b
IMPORTANT INFORMATION AND DISCLAIMERS

1. INTEL CORPORATION MAKES NO WARRANTIES WITH REGARD TO THIS
BALANCED TECHNOLOGY EXTENDED (BTX) SPECIFICATION (“SPECIFICATION”),
AND IN PARTICULAR DOES NOT WARRANT OR REPRESENT THAT THIS
SPECIFICATION OR ANY PRODUCTS MADE IN CONFORMANCE WITH IT WILL WORK
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Intel is a trademark or registered trademark of Intel Corporation or its subsidiaries in the United States and other countries.
Version 1.0b, July 2005

† Other names and brands may be claimed as the property of others.
Copyright © 2003-2005 Intel Corporation. All rights reserved.
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Version 1.0b
Revision History
Version Description Date

1.0 Initial release. September 2003
1.0a Incorporated Errata A and other editorial changes. February 2004
1.0b Added nanoBTX form factor. July 2005
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Version 1.0b
Contents
1. Introduction ...................................................................................................................7
1.1 Terminology ....................................................................................................................................... 8
1.2 Related Documents ........................................................................................................................... 8
2. Form Factor Overview .................................................................................................. 9
3. Mechanical Requirements............................................................................................ 11
3.1 Motherboard Size and Mounting Hole Placement............................................................................. 11
3.2 Volumetric Zones............................................................................................................................... 13
3.2.1 Motherboard Volumetric Zones ............................................................................................ 14
3.2.2 Chassis Volumetric Zones.................................................................................................... 17
3.3 Chassis Mechanical Interfaces.......................................................................................................... 19
3.3.1 Chassis Interface for EMC Grounding.................................................................................. 19
3.3.2 Chassis Interface to Support and Retention Module............................................................ 19
3.3.3 Chassis Interface to Thermal Module................................................................................... 22
3.3.4 Chassis Rear Panel I/O Interface Requirements ................................................................. 24
3.4 Motherboard Mechanical Interfaces .................................................................................................. 25
3.4.1 Motherboard Rear Panel Interface Requirements ............................................................... 25
4. Electrical Interface Requirements ............................................................................... 27
4.1 Motherboard Power Supply Connectors ........................................................................................... 27
4.2 Motherboard Power and Control Signal Definitions .......................................................................... 28
4.2.1 +5VSB................................................................................................................................... 28
4.2.2 PS_ON#................................................................................................................................ 28
4.2.3 PWR_OK .............................................................................................................................. 28
4.2.4 Voltage Tolerances............................................................................................................... 29
5. Additional Information.................................................................................................. 31
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Figures
Figure 1. Example BTX Board and System Layouts.................................................................................. 9
Figure 2. BTX Form Factor Board and Mounting Hole Dimensions........................................................... 12
Figure 3. Chassis and Motherboard Volumetric Zones (not all zones are shown) .................................... 13
Figure 4. Motherboard Primary Side Volumetric Zone............................................................................... 15
Figure 5. Motherboard Secondary Side Volumetric Zones ........................................................................ 16
Figure 6. Chassis Volumetric Zones .......................................................................................................... 18
Figure 7. Chassis Interface to SRM Requirements.................................................................................... 20
Figure 8. Chassis Interface to SRM Requirement Details ......................................................................... 21
Figure 9. Chassis to Thermal Module Interface and Relation to Chassis and Motherboard Zones .......... 22
Figure 10. Chassis Requirements for Thermal Module Interface Definition .............................................. 23
Figure 11. Chassis Rear Panel I/O Aperture Requirements ...................................................................... 24
Figure 12. Motherboard Rear Panel I/O Aperture Requirements .............................................................. 25
Figure 13. Power Supply Connectors......................................................................................................... 27
Figure 14. Power Timing ............................................................................................................................ 29
Tables
Table 1. BTX Feature Summary................................................................................................................. 7
Table 2. Specification Quick Reference ..................................................................................................... 7
Table 3. Terminology.................................................................................................................................. 8
Table 4. Related Documents ...................................................................................................................... 8
Table 5. Reference Datums ....................................................................................................................... 11
Table 6. Board Size Options....................................................................................................................... 11
Table 7. Categories and Requirements for Motherboard Volumetric Zones ............................................. 14
Table 8. Categories and Requirements for Chassis Zones ....................................................................... 17
Table 9. Chassis Mechanical Interface Requirements............................................................................... 19
Table 10. Power Supply Connectors.......................................................................................................... 27
Table 11. PS_ON# Signal Characteristics ................................................................................................. 28
Table 12. PWR_OK Signal Characteristics ................................................................................................ 29
Table 13. DC Output Voltage Tolerances .................................................................................................. 29
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1. Introduction
The Balanced Technology Extended (BTX) interface specification was developed to provide
standard interfaces and form factor definitions to address the electrical, thermal, and mechanical
attributes of desktop computer systems. The specification is intended to allow for a wide variety of
product differentiation that can be adapted to multiple applications and usage models.
This specification describes the critical mechanical and electrical interfaces for the design of
chassis, motherboard, power supply, and other system components necessary for hardware vendors
and integrators to build and integrate compliant components, systems, and devices that are
interoperable with each other. The intention of this document is not to provide all requirements
necessary to design any one of these components, but instead to provide standard interfaces for the
components to be designed around.
Table 1 summarizes some of the key features enabled by the BTX specification.
Table 1. BTX Feature Summary
Features Benefits
Low profile options Easy integration in small, thin form factor systems
In-line core layout Optimized for efficient system cooling
Scaleable board Multiple system sizes and configurations
dimensions
Structural board support Mechanical characteristics to support high-mass motherboard components
mechanisms
Table 2 details the interfaces defined in this specification and the section(s) that address each.
Table 2. Specification Quick Reference
Interfaces Features Defining Interface Related Section(s)
Board/Chassis Interfaces Motherboard geometry and mounting hole Section 3.1
locations (mechanical)
Motherboard volumetric zones (mechanical) Section 3.2
Chassis volumetric zones (mechanical) Section 3.2.2

Rear panel chassis I/O locations and Section 3.3.4 and Section 3.4.1
openings (mechanical)
Board/Power Supply Main power connector (electrical and Section 4
Interfaces mechanical)
+12V power connector (electrical and Section 4
mechanical)
Chassis interfaces to Chassis interface to SRM (mechanical) Section 3.3.2
other components
Chassis interface to Thermal Module Section 3.3.3
(mechanical)
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1.1 Terminology
Table 3 explains terms introduced in this specification.
Table 3. Terminology
Term Definition
Support and Retention Module System component that is assembled to the chassis beneath the
(SRM) motherboard to provide structural support for motherboard and components
as well as retention for a thermal module.
Thermal Module A system component with the primary role of dissipating heat from the core
components. A typical thermal module includes a heatsink for the
processor, an air mover such as an axial fan, and a duct to isolate and
direct airflow through the system. The flexibility to adapt to many
applications is offered through the option to integrate a range of cooling
technologies and components to create a thermal module. Modules will be
one of two types based on which Zone A component height maximum (see
Figure 4, page 15) is selected: Type I (Standard Height ) or Type II (Low
Profile).
1.2 Related Documents

Table 4 lists documents related to this specification.
Table 4. Related Documents
Specification Location
PCI Express* Specifications http://www.pcisig.com/specifications/pciexpress/
Conventional PCI Specifications http://www.pcisig.com/specifications/conventional/
ATX and microATX Specifications http://www.formfactors.org
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2. Form Factor Overview

This specification allows the processor, chipset, memory, add-in cards, and other components to be
designed and located in a way that facilitates both efficient motherboard routing and cooling of the
components. It also allows options for system layouts that can accommodate a range of profiles
and sizes – from compact systems and devices to large, very expandable systems.
The power supply connectors and interfaces are defined to be compatible with those defined for the
ATX family of form factors. For more information on standard power supply definitions and the
ATX form factor family, see the references listed in Chapter 5.
Figure 1 shows three examples of the many layouts possible with the BTX form factor.
Expandable Tower (Side View) Desktop (Top View)
Rear Panel I/O

Optical Disk Drive I/O Card Slots
Power Supply
Unit Power Supply Unit
Optical Disk Drive
System Memory I/O Card on Riser

Floppy Disk Drive
Hard Disk Drive

System Memory
Rear Panel I/O
Chassis
System/Processor Fan(s)
Optical
Chassis
Disk Drive Processor

Processor
Thermal Module
Thermal Module
Front Side I/O
System/Processor Fan(s) Peripherals
I/O Card Slots
Front Side I/O Small Form Factor (Top View)

Peripherals
Rear Panel I/O
Power Hard Drive

Supply
Unit
System Memory
Chassis
Processor
Thermal Module
Mobile Optical System/
Drive Processor Fan(s)
Note: Illustrations not to scale

OM16305
Figure 1. Example BTX Board and System Layouts
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3. Mechanical Requirements
This chapter describes the mechanical requirements of BTX system components and the associated
interfaces.
Reference Datums are maintained throughout the drawings in this chapter. Table 5 lists the Datums
and the figure in which they are defined.
Table 5. Reference Datums
Datum Defined
A Figure 2
B Figure 2
C Figure 2
E Figure 7
G Figure 6
H Figure 6
J Figure 6
P Figure 7
3.1 Motherboard Size and Mounting Hole Placement

A BTX board must adhere to the mechanical details depicted in Figure 2. All boards must be
266.70 mm deep. The board width may range from 203.20 mm to 325.12 mm per Table 6.
Table 6 lists typical board sizes and the mounting holes required for the motherboard. A BTX
chassis must provide mounting points and should provide add-in card apertures in the rear panel for
the largest board that it is intended to support.
Table 6. Board Size Options
Board Maximum Maximum Required Mounting Notes
Designation Board Number of Add- Hole Locations
Width in Card Slots
Available
picoBTX 203.20 mm 1 A, B, C, D
nanoBTX 223.52 mm 2 A, B, C, D
microBTX 264.16 mm 4 A, B, C, D, E, F, G
BTX 325.12 mm 7 A, B, C, D, E, F, G, H, J, K
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[0.200 ± 0.005]
5.08 ± 0.13
[12.350] 1
[7.550] 1
[8.350] 1
[10.750]
[11.550]
0.000
B
191.77
212.09
232.41
[9.150]
252.73
[9.950]
273.05
293.37
313.69
A Rear Panel I/O
6.35 ± 0.13
[0.250 ± 0.005]
0.000
A Y C E H
(39.09) X (35.04)
[1.539] 3 [1.380] 3
(50.59)
[1.992] 2
(97.91)
[3.855] 2
266.70
[10.500] 124.00
F J [4.882]
Example PCI Express Example PCI

Connectors Connectors
+ 0.05
10X Ø 3.96 - 0.03
+ 0.002
[0.156 - 0.001 ]
254.00 B D G K
[10.000] Ø 0.20 [0.008] A B C
Mounting Holes
191.77
[7.550]
[11.550]
232.41
[9.150]
293.37
+ 0.20 C
1.58 - 0.13 203.20
+ 0.008 [8.000] 4
[0.062 - 0.005 ] 223.52
[8.800] 5
264.16
[10.400] 6
325.12
[12.800] 7
Notes:
Add-in Card Connector X Direction Location
1 Card connector slot centerline
2 Connector key centerline Card type X 2 X 3
3 Connector pin 1 reference PCI 5V 97.91 [3.855] (35.04) [1.380]
4 picoBTX board (maximum 1 slot) PCI 3.3V 49.64 [1.954] (35.04) [1.380]
5 nanoBTX board (maximum 2 slots) AGP 3.3V 83.11 [3.272] (60.61) [2.386]
6 microBTX board (maximum 4 slots) AGP 1.5V 103.11 [4.059] (60.61) [2.386]
PCI Express 50.59 [1.992] (39.09) [1.539]
7 BTX board (maximum 7 slots)
8 Tolerance unless otherwise noted ± 0.25 [0.010]
View Orientation Defined by

Third Angle Projection
OM16309A
Figure 2. BTX Form Factor Board and Mounting Hole Dimensions
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3.2 Volumetric Zones

Volumetric zones are defined to provide a definition for mechanical requirements for each of the
key system components areas. These definitions allow components in these areas to be designed
separately and integrated without interference.
This section describes volumetric zones based from the motherboard planar (referred to as
motherboard zones – Section 3.2.1), volumetric zones based from the chassis (referred to as chassis
zones – Section 3.2.2), and the placement requirements for all system components with respect to
the zones. These requirements ensure that key system components do not mechanically interfere
when they are integrated into a system.
Figure 3 shows some of these zones. Zones A, B, C, and D are motherboard zones and Zones F, G,
and H are chassis zones. Not shown in this figure are chassis zones J and K (under the
motherboard).
Note that some zones, like Zone A and Zone F, have two heights associated with them. This is to
accommodate the two types (heights) of thermal modules and the corresponding system designs.
Type I (Standard Height) is intended to be utilized where space is available to maximize the volume
available for the thermal module solution design, while Type II (Low Profile) is included as an
option for designs where lower profile components in this area are highly valued.
eD
Zon
eB
Zon
eA
Zon
eF
Zon
eC
Zon
Motherboard
Zone H
Type I
Zone H Type II
Zone G
OM16311
Figure 3. Chassis and Motherboard Volumetric Zones (not all zones are shown)
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3.2.1 Motherboard Volumetric Zones

Sections 3.2.1.1 and 3.2.1.2 define the footprint and height constraints that comprise the overall
motherboard volumetric zones. All components in a BTX-compatible system must adhere to the
motherboard volumetric zones according to the requirements in Table 7.
Table 7. Categories and Requirements for Motherboard Volumetric Zones
Category Examples Requirements
Motherboard Memory modules, processors, Must fit completely within the motherboard
components rear panel motherboard volumetric zones (primary and secondary side)
connectors, rigid portions of
motherboard-terminated cable
assemblies, component
heatsinks, components
soldered to motherboard
Chassis Chassis walls, chassis pan, Must not intersect the motherboard volumetric zone
components motherboard mounting at any point. In addition, adequate clearance
features, peripheral mounting should be provided between the chassis, the
brackets motherboard volumetric and installed system
components to avoid component interference
and/or damage during shipping or other dynamic
conditions.
Transition Add-in cards, air ducts, May cross the outer boundary of the motherboard
components Thermal Module, SRM, flexible volumetric zone. Some of these components, such
cabling from the motherboard as add-in cards, may have their own mechanical
to other system components, volumetric specifications which should be
motherboard EMC grounding considered by the designer in addition to those
features specified in this document. The Thermal Module
can reside across multiple zones (typically Zones A,
C, F, G, and H. The Thermal Module should not
intersect the top boundaries of any of the
volumetric zones.
Other System Disk drives, front panel cards, Must not intersect the motherboard volumetric zone
components system power supply, and at any point. In addition, adequate clearance
other system components not should be provided between installed system
listed above components and the motherboard volumetric zone
to avoid component interference and/or damage
during shipping or other dynamic conditions.
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3.2.1.1 Motherboard Primary Side Volumetric Zones

Motherboard primary side volumetric zones are defined in Figure 4 . All areas are defined from the
top surface of the motherboard.
(325.12)
[12.800]
[2.000]
176.50
[6.949]
0.000
50.80
A
B
0.000
Zone C Zone B
38.10 [1.500] 34.30 [1.350]
(266.70)
[10.500]
162.80
[6.409]
Zone D 2
34.30 [1.350]
Zone A
86.00 [3.386] - Type I
60.60 [2.386] - Type II
C
10X Ø 10.92
62.50
[2.461]
[0.430]
Notes:
1. No components or traces allowed in the crosshatched areas.
2. To avoid mechanical interference, motherboard and chassis designers
who choose to support add-in cards in zone "D" should observe additional
mechanical constraints imposed by the add-in card specifications.

OM16304
Figure 4. Motherboard Primary Side Volumetric Zone
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3.2.1.2 Motherboard Secondary Side Zones

Motherboard secondary side volumetric zones are defined in Figure 5. All areas are defined from
the bottom surface of the motherboard.
Also defined in Figure 5 are areas for inclusion of optional EMC features. If needed, EMC
grounding features extending from the motherboard to the chassis should only be designed within
these areas to ensure contact with the corresponding areas reserved in the chassis below the board
for this purpose.
All zone boundaries are defined to avoid interference with components in the assembled condition.
Additional clearances based on target assembly processes may need to be incorporated.
(325.12)
[12.800]
(232.41)
[9.150]
[7.776] 193.02
[7.599]
[7.550] 191.20
[7.528]
[7.324] 177.17
[6.975]
149.17
[5.873]
[4.672] 108.67
[4.278]
[1.975]
34.32 [1.378]
[0.512]
50.17
35.00
13.00
0.64
(293.37)
(191.77)
[11.550]
197.50
186.02
157.00
[6.181]
118.67
[3.078]
[1.627]
[1.351]
[0.025]
78.17
41.32
0.000
See Detail A A
B
0.000
11.70
[0.461]
(266.70) 2X 62.65
[10.500] [2.467] 2X 72.53
2X 82.65 [2.856]
[3.254]
2X 97.00
2X 102.53 [3.819]
[4.037] 110.00
(124.00) [4.331]
[4.882] 122.00
[4.803]
10X Ø 25.00
[0.984] 2X 157.00
[6.181]
0.64
[0.025]
(254.00)
[10.000]
5.50 10X Ø 10.16 C
[0.217] [0.400]
10X (Ø 3.96)
[0.156]
No components or traces allowed
10.16
(Ø 10.16) [0.400]
4.50 [0.177] height [0.400]
No components allowed A
(cone shape volume, Ref section A-A)
(Ø 25.00)
7.00 [0.276] height [0.984]
Section A-A
7.00 [0.276] height. Height restriction does not apply
to components maintaining conductive path between
motherboard and chassis for EMI purposes. Refer to
corresponding chassis requirements in Figure 6.
A A
Third Angle Projection 10X Detail A
8X Truncated Zones Near Board Edge
Note: Main view as viewed from motherboard secondary side.
OM16301
Figure 5. Motherboard Secondary Side Volumetric Zones
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3.2.2 Chassis Volumetric Zones

Figure 6 defines the footprint and heights that comprise the chassis volumetric zones as referenced
from the top surface of the chassis pan. All components in a BTX-compatible system must adhere
to the chassis volumetric zones according to the requirements in Table 8. Note that although
Figure 6 shows the zones for the widest motherboard (seven slot board), rules for the portion of
Zone K under Zone D scale according to the width of the motherboard being used. Requirements
in this section do not affect the volume beyond the extensible edge of the motherboard that the
system is designed to accommodate.
Table 8. Categories and Requirements for Chassis Zones
Category Examples Requirements
Motherboard Memory modules, processors, Must not intersect any of the chassis volumetric
Components rear panel motherboard zones at any point. In addition, adequate clearance
connectors and rigid portions should be provided between installed system
of motherboard-terminated components and the chassis volumetric to avoid
cable assemblies, component component interference and/or damage during
heatsinks, and components shipping or other dynamic conditions.
soldered to motherboard
Chassis Chassis pan, board mounting Must not intersect volumetric zones F, G, or H.
Components features, and drive bays Chassis features in Zone K must not cross the
upper boundary of Zone K.
Only the interface features called out in Figure 7
and Figure 8 are allowed in Zones F, G, H, and J.
No other chassis features should intersect this
zone.
Board mounting features should stay within the
zones specified for these features.
Transition SRM and Thermal Module May cross the outer boundary of some chassis
Components zones. Components such as an SRM may have
their own requirements which should be considered
by the designer in addition to those specified in this
document.
Other System Disk drives and system power Must not intersect any of the chassis volumetric
Components supply zones at any point. In addition, adequate clearance
should be provided between installed system
components and the chassis volumetric to avoid
component interference and/or damage during
shipping or other dynamic conditions.
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(191.77)
(232.41)
(293.37)
[11.550]
[12.600]
(29.21)
[0.200]
[1.150]
[7.550]
198.12
[7.800]
[9.150]
320.04
0.000
5.08
6.35
0.000 [0.250]
Zone K
(124.00)
Zone K Zone J [4.882]
Chassis Pan See Detail A
Planar
(260.35) 260.35
[10.250] [10.250]
Zone H
Zone H
Zone G
Zone F 10X Ø 25.00

[0.984]
2X 302.85
[11.923] 10X Ø 10.16
(5.50) [0.400]
305.35
J [12.022] Interface Plane [0.217]
41.03
[1.615]
50.80
[2.000]
62.50
[2.461]
176.50
[6.949]
186.27
[7.333]
(Ø 25.00)
[0.984]
10.16
[0.400]
97.75 [3.848] height off datum J : Type I thermal module J
Zone F
72.35 [2.848] height off datum J : Type II thermal module
Zone G 50.09 [1.972] height off datum J
11.75 [0.463] height off datum J (Ø 10.16)

Zone H Volume shared with chassis pan guide features [0.400]
as specified in Figure 7 (Ref Detail A). Section A-A
3.16 [0.124] height off datum J
Zone J No feature placement with exception of those
features defined in Figure 7.
Zone K 3.16 [0.124] height off datum J

A A
Denotes cone shape chassis keep-in volume as depicted in Detail A.
Motherboard mounting feature must stay within this volume. 10X Detail A
8X Truncated Volumes
OM16302
Figure 6. Chassis Volumetric Zones
Page 18
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3.3 Chassis Mechanical Interfaces

In addition to the other mechanical requirements in this specification, a BTX chassis should provide
the interface features listed in Table 9.
Table 9. Chassis Mechanical Interface Requirements
Mechanical Interface Features Reference
Areas on the chassis pan for interface with board EMC grounding Figure 7
features
Attach features for a Support and Retention Module (SRM) Figure 7 and Figure 8.
Common interface to a thermal module Section 3.3.3, Figure 10
Rear panel aperture for interface with the motherboard rear panel Section 3.3.4, Figure 11
connectors
3.3.1 Chassis Interface for EMC Grounding

The chassis should allow areas as shown in Figure 7 to interface with the grounding features on the
motherboard. These areas must be unpainted and allow conduction to chassis for grounding.
3.3.2 Chassis Interface to Support and Retention Module

A Support and Retention Module, or SRM, is a system component that can be used to support an
area of the motherboard and loads upon the motherboard such as loads associated with a Thermal
Module. An SRM can reside in chassis volumetric zone J and also may share chassis zone K as
well as the secondary side motherboard zone. A BTX chassis must include interfaces as defined by
the features shown in Figure 7 to provide a standard interface for SRMs. Accordingly, an SRM for
a BTX chassis and motherboard should be designed to fit into and mate with these features. The
interface between the SRM and the motherboard will vary depending on the motherboard and
thermal module design.
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191.20
[7.528]
197.50
[7.776]
[0.175]
[0.512]
13.00
6.38 99.00
4.45
[0.251] [3.898]
(191.77)
(232.41)
[1.378]
157.00
[6.181]
[7.550]
[9.150]
Chassis Rear
0.000
35.00
Panel
G
5.72
0.000 [0.225]
11.70
Motherboard [0.461]
Elevation See Detail B,
Figure 8
2X 97.00
[3.819]
(124.00)
See Detail C, [4.882]
200.00 ± 0.50
[7.874 ± 0.020] Figure 8 2X 157.00
[6.181]
160.10 ± 0.30
[6.303 ± 0.012]
185.00
[7.283]
153.00 ± 0.30
[6.024 ± 0.012]
(254.00)
[10.000]
272.53
[10.730]
H
10.16 ± 0.10 10.00 ± 0.50 55.88

[0.400 ± 0.004] See Detail A, [0.394 ± 0.020] [2.200] 2X 7.91 ± 0.30
Figure 8 [0.311 ± 0.012]
2X 16.97
J E [0.668]
2X 2 111.76
Ø 0.25 [0.010] J G H [4.400]
[2.275]
57.79
P
2X 145.70 ± 0.25 [5.736 ± 0.010]
Ø 0.25 [0.010] J P
Flat EMI contact area at elevation of datum J to be free of paint and coatings
that would prevent electrical contact with motherboard enabled feature[s].
Notes:
1. Chassis datum axes G and H are coincident to 2. 6-32 threaded standoff with height of 3.00 ± 0.15
motherboard datum axes B and C and simulated [0.118 ± 0.006] above datum J and Ø 7.11 ± 0.12
by chassis to motherboard fastening features. [0.280 ± 0.005] required.
Chassis datum axis E corresponds to motherboard 3. All critical interface features are dimensioned.
elevation plane as simulated by chassis fastening All other features shown for reference only.
features. 4. Implement only on two front guide features.
Omit on two rear guide features.
OM16310
Figure 7. Chassis Interface to SRM Requirements
Page 20
Version 1.0b
C
5.63 ± 0.20 [0.222 ± 0.008]
0.40 [0.016] J P
3.50 ± 1.00
(2.32) [0.138 ± 0.039] 6.00 Max
[0.091] [0.236]
2.50 ± 0.25 4
[0.098 ± 0.010] A
3.00 ± 0.50 [0.118 ± 0.020]

(7.91)
0.50 [0.020] J P [0.311]
B B
20.00 Max
[0.787] 16.00 Max
[0.630]
26.00 Max
[1.024] 2X R1.0 Max 4
[0.039]
2.20 ± 0.20 4
[0.087 ± 0.008]
J A
3.80 Max 4X Detail A
[0.150] Section A-A
Guide
J C
26.00 Max 3.00 ± 0.25
Section C-C [1.024] [0.118 ± 0.010]
J
2X Detail B
Retainer Slot
Notes:
1. Chassis datum axes G and H are coincident to R0.50 Max
[0.020]
motherboard datum axes B and C and simulated (5.63)
[0.222] Section D-D
by chassis to motherboard fastening features. J
Chassis datum axis E corresponds to motherboard 2X 2.32 ± 0.20 4X R0.75 Max
[0.091 ± 0.008] [0.030]
elevation plane as simulated by chassis fastening
features.
2. 6-32 threaded standoff with height of 3.00 ± 0.15
[0.118 ± 0.006] above datum J and Ø 7.11 ± 0.12
J
[0.280 ± 0.005] required. 2X 3.69 ± 0.30
3. All critical interface features are dimensioned. [0.145 ± 0.012] D D
All other features shown for reference only. (13.00)
[0.512] 7.10 ± 0.30
4. Implement only on two front guide features. [0.280 ± 0.012]
Section B-B 7.10 [0.280] Max
Omit on two rear guide features.
1.00 [0.039] M J P 2X 2.00 ± 0.25
View Orientation Defined by [0.079 ± 0.010]
Third Angle Projection (55.88)
[2.200]
Detail C
Retainer Tab
OM16313
Figure 8. Chassis Interface to SRM Requirement Details
Page 21
Version 1.0b
3.3.3 Chassis Interface to Thermal Module

In order to provide a standard interface between a thermal module and the chassis, a common
physical interface plane and geometry are required. Figure 9 shows the relationship between the
motherboard zones (Section 3.2.1), the thermal module, the chassis/thermal module interface, and
the chassis zones (Section 3.2.2).
Thermal Module
eB
Zon eD
A Zon
Zone
one
C eF
Z Zon
Zone H
Chassis
Duct Interface
To Chassis
Inlet Vent
Zone H
Zone G
OM16312
Figure 9. Chassis to Thermal Module Interface and Relation to Chassis and Motherboard Zones
Page 22
Version 1.0b
Figure 10 defines both a plane relative to the motherboard datums as well as the surface geometry
that should be provided on that plane by the chassis (and designed for the thermal module). The
surface consists of a frame of minimum width around the window defined for airflow to the thermal
module.
The primary purpose for this interface and connection is to provide external air from a vent in the
chassis to the thermal module. For this reason, the air channel and the chassis vent should be
designed so that there is minimal impedance to airflow from outside the chassis to the defined
interface.
[12.022 ± 0.020]
305.35 ± 0.50
(98.00)
[3.858]
2X 3.00 92.00 67.67
[0.118] [3.622] [2.664]
Interface area to
System Front
thermal module 3
(97.25)
[3.829] 5
(71.85)
Interface Plane Airflow Inlet Area 2 [2.829] 6
0.000
87.25
[3.435] 5
Motherboard Elevation E (2.00) 61.85 E
[0.079] [2.435] 6
H Chassis Bottom G J J 2X 4.00 6.00 G

[0.157] [0.236]
Notes: 2. Airflow volume between interface plane and chassis airflow inlet shall be isolated from
1. Chassis datum axis G and H are coincident to motherboard datum axis internal chassis volume to prevent re-circulation of air.
B and C as simulated by chassis to motherboard fastening features. 3. Do not place any topographical features in this area on the thermal module interface plane side.
Chassis datum plane E corresponds to bottom side of motherboard 4. All dimensions basic unless indicated otherwise.
as simulated by chassis to motherboard fastening features. Chassis 5. Applicable to Type I system.
datum plane J corresponds to the top surface of the chassis bottom. 6. Applicable to Type II system.

OM16303
Figure 10. Chassis Requirements for Thermal Module Interface Definition
Page 23
Version 1.0b
3.3.4 Chassis Rear Panel I/O Interface Requirements

Figure 11 defines the chassis cutout window and associated margins for interface with the rear
panel I/O shield.
Chassis I/O aperture should be a simple cutout of the

chassis rear panel. Recessing the I/O aperture will
prevent the case from accepting compliant I/O shields. 8.46 ± 0.25
[0.333 ± 0.010]
2.29 [0.090] Min keepout 4X R1.0 [0.039] Max 1.32 [0.052]
around opening 1 Typ 0.79 [0.031]
Allowable wall thickness
(10.16)
39.45 ± 0.20 Chassis I/O Aperture [0.400] E
[1.553 ± 0.008] E
J
169.54 ± 0.20 2.47 ± 0.25

J [6.675 ± 0.008] [0.097 ± 0.010] Motherboard
2.16 ± 0.25 G mount feature
[0.085 ± 0.010]
G
Notes:
1. Do not place any topographical features in this area on either the inside or the outside
surface of chassis rear panel. Do not paint this area.
2. Datum axis G is coincident to datum B of motherboard.
3. Chassis datum plane E corresponds to bottom side of motherboard as simulated by
chassis fastening features. Chassis datum plane J corresponds to the top surface
of the chassis bottom.

OM16307
Figure 11. Chassis Rear Panel I/O Aperture Requirements
Page 24
Version 1.0b
3.4 Motherboard Mechanical Interfaces
3.4.1 Motherboard Rear Panel Interface Requirements

All rear panel external motherboard connectors (and their mating cable connectors) must pass
through the motherboard rear panel I/O shield within the shaded window depicted in Figure 12.
Connector Face
B 2
Connector's Protruding Feature
7.49 ± 0.20
[0.295 ± 0.008]
B 2
A 32.47 [1.278] Max I/O Connector A
Protrusion Area
5.08 Min (6.35)

1 [0.200] [0.250]
168.78 Max
Motherboard [6.645]
Notes:
1. Bottom of motherboard is coincident with datum E .
2. Datum B is coincident with datum G .

OM16306
Figure 12. Motherboard Rear Panel I/O Aperture Requirements
Page 25
Version 1.0b
Page 26
Version 1.0b
4. Electrical Interface Requirements
4.1 Motherboard Power Supply Connectors

Figure 13 defines the required pinout for the required connectors listed in Table 10. The connectors
provide a standard interface between a BTX motherboard and a compatible system power supply.
Further information on critical signals is defined in Section 4.2. For additional information on the
design of compatible system power supplies, refer to the design guides at the location listed in
Section 5.
Table 10. Power Supply Connectors
Connector Status Board-mounted Mating Power Electrical Signal
Description Header Supply Implementation
Receptacle
Main Power Connector Required on all Molex† 44206-0007 Molex† 39-01-2240 or Per Figure 13 and
motherboards or equivalent equivalent Section 4.2
+12V Power Connector Required on all Molex† 39-29-9042 Molex† 39-01-2040 or Per Figure 13 and
motherboards or equivalent equivalent Section 4.2
Pin 13 Pin 1
+3/3VDC +3.3VDC
-12VDC +3.3VDC
COM COM
PS_ON# +5VDC Pin 3 Pin 1
COM COM +12VDC COM

COM +5VDC +12VDC COM
COM COM
+12V Power Connector
NC PWR_OK
+5VDC +5VSB
+5VDC +12VDC
+5VDC +12VDC
COM +3.3VDC
Main Power Connector

OM16308
Figure 13. Power Supply Connectors
Page 27
Version 1.0b
4.2 Motherboard Power and Control Signal Definitions
4.2.1 +5VSB
+5VSB is a standby voltage supply that is active whenever AC power is present to the system
power supply. It provides a power source for circuits that must remain operational when the three
main DC outputs (+12VDC, +5VDC, +3.3VDC) are in a disabled state. Example uses include soft
power control, Wake on LAN technology, wake-on-modem, intrusion detection, or suspend (sleep)
state activities. The maximum current available from the +5VSB output depends on the design of
the system power supply.
4.2.2 PS_ON#
PS_ON# is an active low, TTL-compatible signal that allows the motherboard to enable the three
main system power supply DC output rails (+3.3VDC, +5VDC, +12VDC). PS_ON# is pulled up to
+5VSB via a 10 kΩ resistor internal to the system power supply.
When PS_ON# is pulled to TTL low, the DC outputs are enabled by the system power supply.
When PS_ON# is held to TTL high by the motherboard or left open circuited, the system power
supply shall not deliver current at the main DC outputs and shall hold them at zero potential with
respect to ground.
Table 11. PS_ON# Signal Characteristics
Min. Max.
VIL, Input Low Voltage 0.1 V 0.8 V
IIL, Input Low Current, Vin = 0.4 V -1.6 mA
VIH, Input High Voltage, Iin = -200 µA 2.0 V
VIH open circuit, Iin = 0 5.25 V
4.2.3 PWR_OK
PWR_OK is a power good signal asserted by the system power supply to indicate that the +5VDC,
+3.3VDC, and +12VDC outputs are above the undervoltage thresholds of the power supply. When
this signal is asserted high, the system power supply has sufficient energy stored by the converter to
guarantee continuous power operation for a minimum hold-up time per the system power supply’s
specification. Conversely, when one or more of the output voltages fall below their undervoltage
threshold, or when mains power has been removed for a time sufficiently long so that power supply
operation is no longer guaranteed beyond the hold up time, PWR_OK will be de-asserted to a low
state by the power supply.
Page 28
Version 1.0b
Table 12. PWR_OK Signal Characteristics
Parameter Value
Signal type +5 V TTL compatible
Logic level low < 0.4 V while sinking 4 mA
Logic level high Between 2.4 V and 5 V output while sourcing 200 µA
High-state output impedance 1 kΩ from output to common
PWR_OK delay 100 ms < T3 < 500 ms
PWR_OK rise time T4 ≤ 10 ms
AC loss to PWR_OK hold-up time T5 ≥ 16 ms
Power-down warning T6 ≥ 1 ms
T1 T5
VAC
PS_ON#
+12VDC 95%
+5VDC O/P's
+3.3VDC 10%
T2
T3
PWR_OK
T4 T6
OM16314
Figure 14. Power Timing
4.2.4 Voltage Tolerances

The system power supply shall guarantee that the tolerances for the main DC outputs comply with
the values listed in Table 13, subject to the limits of the system power supply’s specified
capabilities.
Table 13. DC Output Voltage Tolerances
Voltage Rail Tolerance
+3.3VDC ± 5%
+5VDC ± 5%
+12VDC ± 5%
-12VDC ± 10%
+5VSB ± 5%
Page 29
Version 1.0b
Page 30
Version 1.0b
5. Additional Information
For additional information beyond the requirements of this specification, refer to:
http:\\www.formfactors.org
Page 31
Version 1.0b
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BTX Specification v1.0b

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Balanced Technology Extended

(BTX) Interface Specification

IMPORTANT INFORMATION AND DISCLAIMERS

Version 1.0b, July 2005

Copyright © 2003-2005 Intel Corporation. All rights reserved.

Version Description Date

This page is intentionally left blank.

Chassis volumetric zones (mechanical) Section 3.2.2

1.2 Related Documents

2. Form Factor Overview

Expandable Tower (Side View) Desktop (Top View)

Rear Panel I/O

System Memory I/O Card on Riser

Hard Disk Drive

Disk Drive Processor

Front Side I/O Small Form Factor (Top View)

Power Hard Drive

Note: Illustrations not to scale

Figure 1. Example BTX Board and System Layouts

This page is intentionally left blank.

3.1 Motherboard Size and Mounting Hole Placement

Example PCI Express Example PCI

View Orientation Defined by

Figure 2. BTX Form Factor Board and Mounting Hole Dimensions

3.2 Volumetric Zones

3.2.1 Motherboard Volumetric Zones

3.2.1.1 Motherboard Primary Side Volumetric Zones

View Orientation Defined by

Figure 4. Motherboard Primary Side Volumetric Zone

3.2.1.2 Motherboard Secondary Side Zones

Figure 5. Motherboard Secondary Side Volumetric Zones

3.2.2 Chassis Volumetric Zones

Zone F 10X Ø 25.00

Zone G 50.09 [1.972] height off datum J

11.75 [0.463] height off datum J (Ø 10.16)

Zone K 3.16 [0.124] height off datum J

Figure 6. Chassis Volumetric Zones

3.3 Chassis Mechanical Interfaces

3.3.1 Chassis Interface for EMC Grounding

3.3.2 Chassis Interface to Support and Retention Module

10.16 ± 0.10 10.00 ± 0.50 55.88

Figure 7. Chassis Interface to SRM Requirements

3.00 ± 0.50 [0.118 ± 0.020]

Figure 8. Chassis Interface to SRM Requirement Details

3.3.3 Chassis Interface to Thermal Module

H Chassis Bottom G J J 2X 4.00 6.00 G

View Orientation Defined by

Figure 10. Chassis Requirements for Thermal Module Interface Definition

3.3.4 Chassis Rear Panel I/O Interface Requirements

Chassis I/O aperture should be a simple cutout of the

169.54 ± 0.20 2.47 ± 0.25

View Orientation Defined by

Figure 11. Chassis Rear Panel I/O Aperture Requirements

3.4 Motherboard Mechanical Interfaces

3.4.1 Motherboard Rear Panel Interface Requirements

5.08 Min (6.35)

View Orientation Defined by

Figure 12. Motherboard Rear Panel I/O Aperture Requirements

This page is intentionally left blank.

4. Electrical Interface Requirements

4.1 Motherboard Power Supply Connectors

COM COM +12VDC COM

Main Power Connector

Figure 13. Power Supply Connectors