L T P C

ELECTIVE MEMS
3 0 0 3

UNIT I: INTRODUCTION TO MEMS 9

MEMS and Microsystems, Miniaturization, Typical products, Micro sensors, Micro

actuation, MEMS with micro actuators, Microaccelorometers and Micro fluidics, MEMS
materials, Micro fabrication

UNIT II: MECHANICS FOR MEMS DESIGN 9

Elasticity, Stress, strain and material properties, Bending of thin plates, Spring
configurations, torsional deflection, Mechanical vibration, Resonance, Thermo mechanics –
actuators, force and response time, Fracture and thin film mechanics.

UNIT III: ELECTRO STATIC DESIGN AND SYSTEM ISSUES 9

Electrostatics: basic theory, electro static instability. Surface tension, gap and finger pull up,
Electro static actuators, Comb generators, gap closers, rotary motors, inch worms,
Electromagnetic actuators. bistable actuators. Electronic Interfaces, Feed back systems,
Noise, Circuit and system issues,

UNIT IV : MEMS APLLICATION 9

Case studies – Capacitive accelerometer, Peizo electric pressure sensor, Microfluidics

application, Modeling of MEMS systems, CAD for MEMS.

UNIT V: INTRODUCTION TO OPTICAL AND RF MEMS 9

Optical MEMS, - System design basics – Gaussian optics, matrix operations, resolution. Case
studies, MEMS scanners and retinal scanning display, Digital Micro mirror devices. RF
Memes – design basics, case study – Capacitive RF MEMS switch, performance issues.

TotalHours : 45

TEXT BOOKS:
1. Stephen Santeria,” Microsystems Design”, Kluwer publishers, 2000.
2. N.P.Mahalik, “MEMS”,Tata McGraw hill, 2007

REFERENCES:
1. NadimMaluf,” An introduction to Micro electro mechanical system design”, Artech
House, 2000.
2. Mohamed Gad-el-Hak, editor,” The MEMS Handbook”, CRC press Baco Raton,2000.
3. Tai Ran Hsu,” MEMS & Micro systems Design and Manufacture” Tata McGraw Hill,
New Delhi, 2002. Liu,”MEMS”, Pearson education, 2007.
 AARUPADAI VEEDU INSTITUTE OF TECHNOLOGY, CHENNAI
VINAYAKA MISSIONS RESEARCH FOUNDATION
(DEEMED TO BE UNIVERSITY)
&
VMKV ENGINEERING COLLEGE, SALEM
DEPARTMENT OF ELECTRICAL & ELECTRONICS ENGINEERING
QUESTION BANK
DEGREE / BRANCH : B.E. - MECHATRONICS
SUBJECT NAME : MEMS (Elective-II)
SUBJECT CODE :
YEAR & SEMESTER : III/VI
REGULATION : CBCS R 2015

UNIT-I
INTRODUCTION TO MEMS
PART-A

1. Give any three application of Microsystems

2. What is MEMS?
3. Enumerate Micro-actuators
4. Enumerate Micro-sensors.
5. Write the advantages of micro-sensors.
6. Name some micro-sensors.
7. Define Micro systems
8. Define Micro accelerometers
9. Write a note on Bio-MEMS
10. Write some microactuating forces.
11. Write the principle of optical sensors.
12. Define Diffusion process.
14. Name some Microactuators.
15. Mention the principles of Engineering Mechanisms
16. Write a note on Micro accelerometer.
17. Write the design procedure of Micro accelerometer.
18. Define Electric field
19. Describe: MEMS Cantilever
20. Acoustic sensors are used to detect a) sound, b) temperature, c) chemical composition
in gas medium

PART-B

1. Describe the working principle of MEMS microaccelerometers.

2. With a neat sketch Explain the construction and working principle of Micro valve.
3. With a neat sketch Explain the construction and working principle of Micro motor.
4. Explain in detail the steps involved in Surface micromachining.
5. Explain the fabrication steps of micro structures using polymeric compounds.
6. Explain Silicon Piezoresistors.
7. Write a note on
a)Micro sensors
b)Micro actuators.
8. With a neat sketch Explain the working principle of Microccelerometers.
9. Explain the properties any 4 MEMS materials.
10. Describe electrostatic forces in parallel plates. Explain how electrostatic forces are
used in MEMS micro-gripper Device

UNIT-II
MECHANICS FOR MEMS DESIGN
PART-A

1. Mention the maximum stresses associated for the static bending of thin plates.
2. Mention the maximum stress generated at the centre of the circular plates.
3. Mention the maximum stress generated at the rectangular plates
4. Mention the maximum deflection induced at the centre of the circulating plates.
5. Write the need for mechanical vibration analysis
6. How damping effect is generated in microaccelerometer?
7. Write the need for thermodynamics.
8. What is creep deformation?
9. Which compounds have strong creep resistance.
10. What type of transducers are used in micro accelerometer.
11. Write the physical phenomenon used in stress analysis.
12. At what condition thermal stresses and strains are induced in the solid structure?
13. Write the application of fracture mechanics in MEMS and microsystem design.
14. Define fracture toughness.
15 Which component exhibit Inter facial fracture mechanics.
16. What is thin film mechanics?
17. Write a note on finite element analysis.
18. Distinguish between compressive stress and Tensile stress
19. What is Thermal Expansion Coefficient ?
20. Define Hooke’s law of Elasticity

PART-B

1. Explain a) Elasticity
b) Stress
c) Strain
d) material properties.
2. Analyse the static bending of thin plates with fixed edges subject to lateral pressure.
3. Prove that the square diaphragm has highest induced stresses compared to circular
and rectangle.
4. Analyse mechanical vibration with simple mechanical vibration systems.
5. With a neat sketch design the different configurations of microaccelerometers.
6. Explain the fracture mechanics in MEMS and microsystem design..
7. Explain the design theory of accelerometers and write the formula for calculating the
natural frequency.
8. Write a note on a) Spring constants of simple beam.
b) Damping Coefficients.
9. Explain briefly about thermomechanics. Also explain thermal stress and strain
analysis.
10. With a schematic diagram discuss the principle operation of MEMS
cantilever structured magnetic bidirectional micro-actuator
 UNIT-III
ELECTRO STATIC DESIGN AND SYSTEM ISSUES
PART-A

1. Name some of the actuators using electrostatic forces.

2. Write the application of microactuation.
3. Write the pumping rate of electrostatically actuated pump.
4. What is Digital micro mirror device
5. Write the basic microfabrication techniques.
6. Write the working principle of Inch worm motor.
7. Write the use of inch worm motor.
8. Write the advantages of magnetic actuator.
9. How the magnets are fabricated in MEMS?
10. What is comb drive actuator?
11. Why do we reduce the finger gap distance in MEMS comb drive?
12. Write the application of microgripper in biomedical field.
13. Why is electrostatic actuation popular in MEMS?
14. Write the drawback of Electrostatic actuation.
15. What is a piezoelectric sensor?
16. How pressure is measured using piezoelectric sensor?
17. Write any two sensing material used in piezoelectric sensors.
18. Write the components present in magnetic actuator integrated with feedback circuit.
19. Define Surface Tension
20. Name two different types of micromotors.

PART-B

1. With neat diagram explain two types of capacitive electrode configuration.

2. Explain different configurations of integrated finger capacitors and their relative pros
and cons in terms of maximum displacement, linear/angular displacement and force
output. Explain equilibrium position of electrostatic actuator under bias. .
3.. With neat diagram explain (a) comb drive, (b) transverse comb drive and (c)
longitudinal comb drive.
4. Explain the basic principle of Micro motor and also explain the construction and
working of rotary motors.
5. Explain any one Electrostatic actuators with a neat diagram.
6. Explain any one Electromagnetic actuators with a neat diagram.
7. Write the fabrication steps of bi directional cantilever beam magnetic actuator.
8. .Draw the architecture and signal conditioning circuit for MEMS based feedback
circuit integrated magnetic actuator.
9. Write the importance of Piezo-electric crystals in MEMS devices.
10. Describe the working principle of any two principal signal transduction methods for
micro-pressure sensors.
 UNIT-IV
MEMS APLLICATION
PART-A

1. What is modeling?
2. Why modelling is necessary?
3. Name some basic modelling elements .
4. What is the use of capacitive actuator in accelerometers?
5. Write a note on parallel plate capacitive Accelerometer.
6. Write a note on piezoelectric pressure sensor.
7. Name some applications of piezoelectric sensors.
8. Write a note on acoustic sensor.
9. List the source for fluid driving force.
10. What is electrokinetic flow?
11. Define electrical double layer?
12. Write the important aspects to be considered for selecting channel materials and
fabrication methods.
13. List the important data base required for the CAD package for microsystem.
14. Write the important steps involved in the design of CAD.
15. Write the materials used in microfluidics.
16. Write a note on piezoelectric resistors.
17. Write the steps involved in fabrication process of Capacitive accelerometer.
18. Describe the Aspect ratio in MEMS device fabrication
19. One nanometer is a) 10-6 m, b) 10-9 m, c) 10-10 m.
20. The working principle used for micro-flow in a minute capillary tube is 1)
conventional pumping, 2) pizeelectric pumping.

PART-B

1. With neat diagram explain torsional parallel plate capacitive accelerometer.

2. Explain the fabrication process of piezoelectric pressure sensor with sealed cavity.
3. Explain the design considerations for any microsystem.
4. Design a silicon die for a micro pressure sensor.
5. Explain the simulation of microfabrication process using FE method.
6. Explain in detail the capillary Electrophoresis network system.
7. What is CAD? Why CAD package for Microsystems?
8. Explain any one case Study for usind CAD package.
9. Draw and explain the general structure of CAD for microsystem design.
10. Describe surface micromachining. Explain in details the steps involved
in surface micromachining process in the MEMS design.
 UNIT –V
INTRODUCTION TO OPTICAL AND RF MEMS
PART-A

1. On what factor electrical isolation of the capacitve switch depends ?

2. Write the fabrication steps of RF Capacitor switch.
3. Write the advantages of optical sensing for MEMS sensor application
4. Write the types of switches.
5. Write the importance of RF MEMS.
6. Write the different types of capacitive coupled switch.
7. Which material can be used as the dielectric material?
8. Write a note Retinal scanning Display.
9. Mention the application of MEMS scanner.
10. Write the drawbacks of bidirectional scanning.
11. What is unidirectional scanning.
12. Write the basics of optical MEMS.
13. Name some optical MEMS sensor.
14. Write the working principle of optical Sensors.
15. Write the materials used in thye design of optical MEMS sensors.
16. Define Resolution.
17. Write the limitations of Gaussian optics.
18. Write a note on fiber optic switches.
19. What is DMD?
20. Write the application of Digital micro Mirror Devices.

PART-B

1. Write in detail about the Gaussian optics in MEMS applications.

2. Write a note on MEMS scanners for display applications
3. Explain retinal scanning display.
4. Explain the fabrication process of basic DMD.
5. Analyse DMD and find the value of capacitance.
6. Comparison of RSD, GLV, and DMD display technologies.
7. Write in detail about the design basics of optical MEMS
8. Write in detail about the design basics of RF MEMS
9. Write the fabrication steps involved in capacitive RF MEMS switch.
10. Explain the various performance issues of capacitive RF MEMS switch.

PREPARED BY VERIFIED BY HOD