Motor Drives

Power Electronics for Motor Drives

 SERVO
PERFORMANCE RANGE DRIVES

0.2kW - 75kW

Since the first appearance of motor drives, - Robotics

- Material handling
SEMIKRON has been committed to supplying - Machine tools

solutions for every power range. Starting with

the first insulated power module, the SEMIPACK Compact designs and high power density
High peak overload capabilities
rectifier module series more than 40 years ago,
Multiple axis in one drive or modular drives
the MiniSKiiP in particular has revolutionised the with common DC bus
Decentralized high IP grade drives
motor drive design for low and medium power
systems. Products
SEMITOP E1/E2
MiniSKiiP
Today SEMIKRON offers the complete industrial SEMiX 6 Press-Fit
standard power module portfolio that serves SEMIPACK

a power range of 0.2kW to several megawatts. Drivers

The portfolio is completed with high power

IPMs, power electronic stacks and a compre-
hensive product line of driver electronics that
help to reduce development effort and time-
to-market. The latest Generation 7 IGBTs of
two different suppliers, optimized for motor
drive applications, boost performance and
power density.
LOW/MID MID/HIGH
POWER DRIVES POWER DRIVES

0.2kW - 300kW 300kW - 10MW

- Pumps and fans - Oil, gas and mining industry

- Process automation - Chemical industry
- Cranes and lifts
- Marine drives

Compact designs and high power density Compact designs and high power density
Platform designs, covering wide power High reliability in harsh environments
range with the same mounting concept
Products
Products
SEMiX 3 Press-Fit
SEMITOP E1/E2
SEMITRANS 10
MiniSKiiP
SEMITRANS 20
SEMiX 3 Press-Fit
SKiiP 3/4 IPM
SEMiX 6 Press-Fit
SEMiSTART
SEMITRANS
SEMIPACK
SEMiSTART
Drivers
SKiiP 3/4 IPM
Power Electronics Stacks
SEMIPACK
Drivers
Power Electronics Stacks
Technology Highlight

The Latest IGBT Generation from Two Suppliers

for Highest Supply Chain Safety

The Generation 7 IGBT chips T7 and M7 enable higher power Additionally the Generation 7 IGBTs share the
density and higher performance. Thanks to a new IGBT cell design following features:
technology the chip size could be reduced by approximately 25% 20% lower on-state voltage Vce,sat
compared to the previous generation. Operation junction temperature of 175°C during overload
High humidity robustness
The features translate into up to 20% higher output power in
About 25% smaller chip size
given power package sizes and motor drive applications. Thanks
to the higher allowed operation temperature an overload of Up to 20% higher output power or 20% lower losses
e.g. 110% can be covered without the need of additional design Up to 35% smaller housing
reserves.

Half-Bridge
SEMiX 3 Press-Fit 220A - 700A

MiniSKiiP 150A - 400A

Sixpack
SEMiX 6 Press-Fit 100A - 250A
SEMITOP E1/E2 25A - 100A
MiniSKiiP 10A - 200A

CIB
SEMiX 6 Press-Fit 75A - 200A

SEMITOP E1/E2 10A - 50A

MiniSKiiP 10A - 150A

= Extension thanks to IGBT 7

0 10 50 100 150 200 500 700

Nominal IGBT current

SEMITOP® E1/E2 SEMiX® 6 Press-Fit SEMiX ® 3 Press-Fit MiniSKiiP®

0.4kW up to 30kW 15kW up to 75kW 55kW up to 350kW 0.4kW up to 110kW

SEMIKRON 5
Product Highlight

IGBT and Rectifier Module Family for

Complete Motor Drive Solutions

SEMiX 3 Press-Fit features IGBT and rectifier modules in the Industry standard package with optional
same housing design for a complete medium/high power drive Integrated current shunts
solution. As an industry standard power module available Plug-and-Play gate driver
with the latest generation IGBT chips from different suppliers,
Pre-applied phase change material
it gives a full supply chain safety.

Available for a complete 17mm high solution

It‘s your choice: SEMiX 3 Press-Fit is available with optional ...
Rectifier, brake chopper and half-bridge
... integrated current measurement shunts.
The integration of the current measurement into the power 650V / 1200V / 1700V: 225A to 700A
module replaces expensive and bulky current sensors 55kW up to 350kW
(i.e. Hall sensors) . Full second source thanks to several IGBT suppliers
This reduces size and cost of the motor drive system
Hybrid Silicon Carbide version offers highest efficiency
... P
 lug-and-Play driver SKYPER 12 Press-Fit. and power density
Simply pressed onto the power module’s press-fit pins, the
driver reduces time-to-market thanks to a ready-to-go solution The latest Generation M7 IGBT
... p
 re-applied phase change material (PCM).
25% higher output power thanks to the new Generation 7 IGBT M7
The choice between two different materials optimises either
the thermal performance or the allowed heatsink temperature.

SEMiX® 3 Press-Fit
55kW up to 350kW

6 SEMIKRON
Product Highlight

The Power Density Master: New Levels Utilizing

the Latest Generation 7 IGBT Chips

Baseplate, PCB mounted Baseplate, screwed busbar mounted

Competitor
No baseplate, PCB mounted

Competitor – no scalable module concept

Without baseplate + Fast PCB mounting + New High Performance Thermal Paste

MiniSKiiP – one module concept up to 110kW

MiniSKiiP

MiniSKiiP 1 MiniSKiiP 2 MiniSKiiP 3 MiniSKiiP 2 Dual MiniSKiiP 3 Dual

IC nom in A 4 50 100 150 200 300 400

Pout in kW 0.4 11 22 45 55 75 110

One continuous mounting concept from 0.4 to 110kW
PCB based assembly concept with only 1 or 2 mounting screws
High productivity mounting thanks to automatable production lines
No additional tools required:
No soldering, no press-in process required
High vibration resistance
Benchmark thermal resistance with High Performance
Thermal Paste (HPTP).
One continuous module concept for all voltages and topologies
600/650V, 1200V, 1700V
Available as CIB, sixpack, rectifier, brake chopper, twelvepack
Hybrid Silicon Carbide version offers highest efficiency
and power density
First SEMIKRON module to provide Generation 7 IGBT
Generation 7 IGBT T7 increases output power by up to 20%

MiniSKiiP®
0.4kW up to 110kW

SEMIKRON 7
SEMiX® 3 Press-Fit
55kW up to 350kW
Exceeding the standard for superior performance
Industry standard press-fit design with 17mm high housing
650V / 1200V /1700V IGBT: 225A to 700A
1200V Hybrid SiC: 600A
Complete motor drive topologies available: Half-Bridge,
Rectifier and Brake Chopper Direct driver assembly
Available with integrated shunt resistor
8 SEMIKRON
MiniSKiiP®
0.4kW up to 110kW
Solder-free spring technology for minimum assembly time
Full family of power modules up to 110kW
650V / 1200V / 1700V IGBT: 4A to 400A
1200V Hybrid SiC: 50A to 150A
Comprehensive set of topologies: CIB, sixpack, twelvepacks,
H-bridge, half-bridge, 3-level, bridge rectifiers with brake chopper
Easy and flexible PCB routing without pin holes
Product Portfolio
Power Modules
SEMIPACK®
800V to 2200V
Bipolar modules from the
market leader
6 housing sizes SEMIPACK 1 to 6
800V to 2200V: 20A to 1360A
SEMIKRON diode and thyristor chips
Diode and thyristor in un-, half- and
full-controlled topologies
Different technologies for certain packages:
high reliability pressure contact or
cost-effective wire bonded modules
Enhanced isolation voltage of 4.8kV/1s
available on request
SEMITRANS®
25kW up to 500kW
The proven power electronics package
Robust industry standard package for
multiple sourcing in 6 housing sizes
600V / 650V / 1200V / 1700V
IGBT: 50A to 900A
1200V Hybrid and Full SiC: 125 to 500A
Half-bridge, single switch and brake
chopper topology
Multiple IGBT sources including
Generation 7 IGBT M7
Increased power range in 62mm thanks
to portfolio extension in 1200V and 1700V
half-bridges:
1200V / 600A
1700V / 500A
SEMITOP® E1/E2
0.4kW up to 30kW
Exceeding the standard for
superior performance
PCB based and press-fit connected
baseplate-less industry standard power
module in two housing sizes
650V and 1200V: 10A to 100A
IGBT 4 and IGBT T7
CIB and sixpack topologies
Optimised mounting concept and pre-applied
High Performance Thermal Paste provide
lowest thermal resistance in class
Increased power density thanks to
Generation 7 IGBT T7
Hybrid and full SiC modules up to 1200V/250A
SEMITRANS® 10
300kW up to 1MW
Robust high power module
Established high power module package
1200V IGBT: 1400A
1700V IGBT: 1000A and 1400A
Half-bridge and split NPC topologies
Full second source thanks to alternative
1700V chip source and Generation 7 IGBT M7
SEMiX® 6 Press-Fit
15kW up to 75kW
The complete press-fit standard
PCB based and press-fit based industry
standard baseplate power module.
650V and 1200V: 75A to 250A
IGBT 4 and IGBT M7
1600V and 2200V rectifier diodes:
200A and 300A
Bridge rectifier (B6U),
CIB and sixpack topologies
Latest press-fit pin technology for optimal
assembly and connection reliability
IGBT 4 and Generation 7 IGBT M7 ensure
high supply chain safety.
SEMITRANS® 20
300kW up to 1MW
The new standard in high power
The latest industry standard power module
for high power applications
1200V: 1400A
1700V: 1000A and 1200A
Half-bridge topology
Low stray inductance,
high power density package
Increased reliability thanks to the latest
packaging technology
SEMIKRON 9
Intelligent Power Modules – IPMs

For Maximum Reliability

The SKiiP IPM product line sets a benchmark for high performance
and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high
power densities combined with flexible cooling options such as air
and water cooling, also with customized heatsinks. Reliable driver
technology, integrated current sensors and comprehensive protec-
tion functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment.
With its sixpack or half-bridge topologies, it covers a current range
from 500A up to 2400A.
Key features
1200V and 1700V
Half-bridge and sixpack
500A to 3600A
Flexible cooling options: air, water or customized cooling
options, high performance cooling, single and double side
mounting water coolers
Paralleled operation for even higher output power possible
The SKiiP 4, available in half-bridge topology, has been optimized
for highest power cycling requirements and covers the higher
power range up to 3600A.
To ensure highest reliability and service life, the power circuitry
is 100% solder-free. Sinter technology as die attach replaces the
solder layer, which usually causes the limitation in lifetime.
Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in
terms of reliability and enhanced functionality through its CAN
interface. The digital driver guarantees safe isolation between
the primary and secondary side for both switching signals and
parameter measurement. The CAN interface allows setting the
SKiiP 4 configuration parameter and reading application parameter.
High performance cooling (HPC) technology has been introduced
providing approximately 25% more output capability compared
to standard water cooling. A double side mounting HPC water
cooler is also available and enables an even higher power density.

SKiiP®4
100kW up to 3MW
The most powerful IPM in the market
SEMIKRON 11
Power Electronic Stack Platforms

Fully Qualified Inverter Assemblies

Tailored to Your Specific Needs

Standard Stacks Customised Stacks

SEMIKRON’s Power Electronic Stacks enable our customers to In addition to standard stacks, SEMIKRON has vast experience
succeed in dynamic markets and meet any global challenge. We in developing customer-specific solutions. Engineers are available
deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from in our stack centres around the globe to offer specific solutions
380V to 690V. Our standard stacks cover an output current range by adapting existing platforms or designing customized converters.
from 70A to 4000A.
Four key factors for your success
Water-Cooled IGBT Stacks Shortest time to market
SKiiPRACK Cost savings in R&D, production and qualification
Global SEMIKRON stack production footprint
Air-Cooled IGBT Stacks
Highly experienced engineering team
SEMIKUBE
SEMIKUBE SlimLine

Diode/Thyristor Stacks
SEMISTACK CLASSIC B6U/B6C/W3C

SEMIKUBE®
Air-cooled IGBT Power Stack

SEMIKRON 13
Product Portfolio IGBT Driver

Above the Standard

SEMIKRON’s unique product portfolio enables access to all esta- Reliable

blished industries with a one-stop solution that combines state-
of-the-art power modules and driver electronics.
SEMIKRON’s IGBT drivers are available as two- channel driver
cores suitable for any standard semiconductor power module or
as Plug-and-Play solutions, which perfectly fit the SEMiX 3 Press-Fit,
SEMITRANS 10 and compatible modules.
SEMIKRON’s SKYPER and SKHI are well-known, highly robust and
reliable IGBT driver solutions under demanding environmental
conditions.
Over many years of field operation experience the proprietary IGBT
driver technology has been relentlessly developed further. This
technology sets new standards for the essential features of safe
gate control, reliable gate protection and reinforced insulation.

Cost Efficient Key factors

Achieve outstanding system compactness and create space- and Reinforced insulation for signal and power transmission
cost-effective inverter designs with SEMIKRON’s drivers, utilizing
Two-channel driver
highly integrated ASIC technology. Isolated DC-link voltage and
Up to 1700V transients
temperature sensor signals at the driver’s interface along with
over-voltage and over-temperature lockout also help to reduce Up to 1500V continuous DC bus voltage

system costs significantly. 8Apk to 35Apk per channel

1W to 4.2W peak per channel
Time Efficient Suitable for multi-level topologies and Generation 7 IGBT
More than 25 years of experience in developing innovative IGBT
driver electronics enables SEMIKRON to have a short-term
solution for almost every challenge related to driver electronics.
SEMIKRON’s Plug-and-Play drivers connect directly to most
common standard IGBT modules. The IGBT driver cores fit with
SEMIKRON’s adapter boards or application sample PCBs. For the
latter, SEMIKRON shares the entire manufacturing data to
decrease development time, speeding up the time-to-market.

SKYPER & SKHI SKYPER SKYPER & SKHI

Driver Cores Plug-and-Play Driver Adapter Board and Application Samples

Two-channel driver cores for PCB Two-channel drivers for direct Adapter boards for driver core mounting
integration with SEMIKRON ASIC module mounting with electrical to SEMIKRON IGBT and SiC modules
technology and integrated safety or optical interface
functions

SEMIKRON 15
Thermal Interface Materials

Stay Cool – Heat Dissipation is Our Job

SEMIKRON was the first power module manufacturer on the Key features
market to offer power modules with pre-applied thermal Increased productivity thanks to reduced handling costs and
interface material. With more than two decades of field experi- improved logistics
ence and more than 17 million pre-printed modules in the field, Low thermal resistance with optimised TIM layer thickness
benchmarks are being set. The modules with pre-applied TIM Improved lifetime and reliability
are printed in a clean environment on an automated and SPC
Improved assembly robustness
controlled silkscreen and stencil printing line.
Modules can be shipped directly to the assembly line without
any additional treatment processes
For each requirement, SEMIKRON offers the right choice of
Lower overall costs
material. In addition to the standard silicone thermal grease,
phase change materials and high performance thermal paste
with improved thermal performance are also available. Portfolio
P8: Phase Change Material for highest performance
SEMIKRON offers either thermal grease or phase change mate- HT: Phase Change Material for highest sink temperature
rials depending on customer requirements (e.g. performance HPTP: High Performance Thermal Paste
increase, reduced handling effort) and module type (with or P12: Standard Thermal Paste
without baseplate). Phase change materials have a solid consis-
tency at room temperature, fully exploiting the advantages a
non-smearing TIM layer offers, with no drawbacks. Baseplate-
less modules, on the other hand, usually require a lower-viscosity
material to help improve robustness during assembly. Here,
thermal grease is the preferred solution.

Baseplate-less Baseplate
Power Modules Power Modules

www.semikron.com/thermal-interface-materials
SEMIKRON 17
Service

Your 24/7 Online Service

SemiSel Simulation Online Shop

Have you ever asked yourself “Have I selected the right Our specialty lies in the delivery of expert support to small
power semiconductors?” Then you should check out SemiSel – and medium-sized enterprises by offering them the following
SEMIKRON’s simulation tool for losses and temperatures, the services:
perfect tool to help you select the right power semiconductors
for the specific needs of your application. The first of its kind Technical & sales support
almost 20 years ago, SemiSel has been continually improved
- Reply within 24 hours
and now boasts lots of new features and functions.
- Multilingual sales and support
Product range - Design-in-support directly from manufacturers’ specialists
Available for all SEMIKRON products:
Worldwide shipping
- Rectifier diode and thyristor modules
- Fast shipping to more than 100 countries
- IGBT and fast diode modules
- Low-volume purchases also possible
- SiC Schotty diodes and SiC MOSFET modules
- Shipping directly from manufacturer’s warehouse
- From 3A to 6000A rated current
- Over 600 conventional SCRs, IGBT modules, bridge rectifiers
- From 55V to 3300V devices
and IPMs in stock

Transparency & efficiency

Key features
- Transparent price breakdowns online
27 different power electronic circuits can be simulated
- Updated information
Simulations with different degrees of complexity, from simple
nominal conditions to complex mission profiles - Instant quotes using the online quotation tool

Cooling conditions for air and liquid cooled systems proposed Cross reference search
to match the housing and devices selected
- Find a fully compatible SEMIKRON device for any other brand:
Efficiency and temperatures at a glance shop.semikron.com/en/Cross-Reference-Search/

Visit us at Visit us at
www.semikron.com/semisel shop.semikron.com

SEMIKRON 19
 Note: All information is based on our present knowledge and is to be used for information purposes only. The specifications of our components may not be considered as an assurance of component characteristics.
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03/2021

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