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Manual Del Monitor de Grosor
Manual Del Monitor de Grosor
MODEL TM-350/400
MAXTEK THICKNESS MONITOR
MAXTEK, INC.
http://www.maxtekinc.com
5980 Lakeshore Drive, Cypress, CA 90630-3371
Tel: (714) 828-4200 • Fax: (714) 828-4443
Email: sales@maxtekinc.com • support@maxtekinc.com
OPERATION AND SERVICE MANUAL
MODEL TM-350/400
MAXTEK THICKNESS MONITOR
P/N 178800
S/N _____________
MAXTEK, INC
http://www.maxtekinc.com
5980 Lakeshore Drive, Cypress, CA 90630-3371
Tel: (714) 828-4200 • Fax: (714) 828-4443
Email: sales@maxtekinc.com • support@maxtekinc.com
©1998-2005 MAXTEK, INC. All rights reserved.
First Edition, February 1998
Second Edition, July 1998
Third Edition, October 1998
Fourth Edition, January 1999
Fifth Edition, May 2000
Sixth Edition, October 2000
Seventh Edition, June 2002
Eighth Edition, February 2003
Ninth Edition, December 2003
Tenth Edition, October 2004
Revised January 2005
Revised July 2005
Eleventh Edition, August 2005
ii
WARRANTY
Maxtek, Inc. warrants the product to be free of functional defects in material and
workmanship and that it will perform in accordance with its published
specification for a period of (twenty-four) 24 months.
The foregoing warranty is subject to the condition that the product be properly
operated in accordance with instructions provided by Maxtek, Inc. or has not been
subjected to improper installation or abuse, misuse, negligence, accident,
corrosion, or damage during shipment.
Purchaser's sole and exclusive remedy under the above warranty is limited to, at
Maxtek's option, repair or replacement of defective equipment or return to
purchaser of the original purchase price. Transportation charges must be prepaid
and upon examination by Maxtek the equipment must be found not to comply
with the above warranty. In the event that Maxtek elects to refund the purchase
price, the equipment shall be the property of Maxtek.
DISCLOSURE
The disclosure of this information is to assist owners of Maxtek equipment to
properly operate and maintain their equipment, and does not constitute the release
of rights thereof. Reproduction of this information and equipment described
herein is prohibited without prior written consent from Maxtek, Inc., 5980
Lakeshore Drive, Cypress, California, 90630.
SAFETY WARNING
All standard safety procedures associated with the safe handling of
electrical equipment must be observed. Always disconnect power when
working inside the monitor. Only properly trained personnel should
attempt to service the instrument.
iii
Safety Precaution and Preparation for Use
Power Cord
WARNING: To avoid electrical shock, always connect the power cord to an
AC outlet which has a proper protective ground.
The TM Series Thickness Monitor comes with a detachable, three-wire power
cord for connection to a power source with protective ground.
The TM chassis is connected to the power ground to protect against electrical
shock. Always connect to an AC outlet which has a properly connected
protective ground. If necessary, or when in doubt, consult a certified electrician.
Grounding
A grounding lug is located on the rear panel, near the power entry module. Use
heavy ground wire, wire braid, or copper strap of #12 AWG or larger to connect
this grounding lug directly to a facility protective earth ground to provide
additional protection against electrical shock.
Line Fuses
There are two 5 x 20 mm fuses mounted inside the power entry module. They are
accessible via the snap-in cover. Replace with the correct fuse rating: IEC T Type
(Slow), 4/10 A, 250 VAC. Refer to Section 3.2.6 for instruction to replace the
fuse.
Power Switch
WARNING: Do NOT use the power switch as a disconnecting device;
disconnect the power cord from the power entry module to fully remove
hazardous voltage from inside the TM monitor.
The power switch is located on the front of the TM monitor. The switch is a
toggle type, marked with I and O. The I (on) position applies the power to the
unit. The O (off) position cuts off the power to the unit. However, turning the
power switch off does not fully remove the AC power from inside the unit.
Always disconnect the power cord from the power entry module to fully remove
AC power from inside the unit.
iv
Table of Contents
Safety Precaution and Preparation for Use……………………..……………iv
1 GENERAL DESCRIPTION .............................................................................................. 1-1
1.1 FEATURES .................................................................................................................... 1-1
1.1.1 INDEPENDENT FILM DENSITY AND TOOLING FACTOR PARAMETERS .... 1-1
1.1.2 ACOUSTIC IMPEDANCE CORRECTION........................................................... 1-1
1.1.3 PARAMETER DISPLAY........................................................................................ 1-1
1.1.4 HIGH RESOLUTION AUTORANGED DISPLAY ................................................ 1-1
1.1.5 LONG-TERM PARAMETER STORAGE............................................................... 1-2
1.1.6 MULTIPLE COMPUTER INTERFACES.............................................................. 1-2
1.1.7 COMPACT CASE.................................................................................................. 1-2
1.1.8 DAC OUTPUT ...................................................................................................... 1-2
1.1.9 MULTIPLE CRYSTAL FREQUENCIES ............................................................... 1-2
1.1.10 BUILT IN TEST..................................................................................................... 1-2
1.1.11 DYNAMIC MEASUREMENT UPDATE RATE ..................................................... 1-2
1.1.12 AUTOMATIC CRYSTAL SWITCHING (TM-400 ONLY)...................................... 1-2
1.2 SPECIFICATIONS......................................................................................................... 1-3
1.2.1 MEASUREMENT .................................................................................................. 1-3
1.2.2 DISPLAY ............................................................................................................... 1-3
1.2.3 COMPUTER INTERFACES ................................................................................. 1-3
1.2.4 PROGRAM PARAMETERS .................................................................................. 1-3
1.2.5 INPUT CAPABILITY ............................................................................................ 1-3
1.2.6 OUTPUT CAPABILITY......................................................................................... 1-3
1.2.7 OTHER.................................................................................................................. 1-4
1.3 ACCESSORIES.............................................................................................................. 1-7
2 UNPACKING & INSPECTION ........................................................................................ 2-1
2.1 BENCH CHECK-OUT................................................................................................... 2-1
2.2 INSTALLING OPTIONS ............................................................................................... 2-2
2.2.1 IEEE-488 OPTION BOARD ................................................................................. 2-2
2.2.2 RS-485 OPTION.................................................................................................... 2-2
2.3 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT...................................... 2-2
3 MONITOR INSTALLATION ........................................................................................... 3-1
3.1 MONITOR INSTALLATION PRECAUTIONS............................................................ 3-1
3.1.1 PROPER GROUNDING ....................................................................................... 3-1
3.1.2 HEAT DISSIPATION ............................................................................................ 3-1
3.2 REAR PANEL CONNECTIONS ................................................................................... 3-1
3.2.1 OSCILLATOR CONNECTOR(S) .......................................................................... 3-1
3.2.2 IEEE-488 OPTION BOARD (optional)................................................................. 3-1
3.2.3 DIGITAL TO ANALOG CONVERTER (DAC) CONNECTION............................ 3-2
3.2.4 REMOTE TTL INPUTS......................................................................................... 3-2
3.2.5 RELAY OUTPUTS ................................................................................................ 3-2
3.2.6 LINE VOLTAGE SELECTION AND FUSE REPLACEMENT.............................. 3-2
3.3 INTERNAL DIP SWITCHES ........................................................................................ 3-3
3.3.1 CRYSTAL TYPE SELECTION .............................................................................. 3-4
3.3.2 COMPUTER INTERFACE ADDRESS.................................................................. 3-4
3.3.3 DAC....................................................................................................................... 3-5
3.3.4 DISABLE NEGATIVE THICKNESS/RATE READINGS ....................................... 3-5
3.3.5 ALLOW CRYSTAL SWITCHING TO A FAILED SENSOR (TM-400 only)........... 3-5
3.3.6 PULSE SWITCH AT THICKNESS ENDPOINT (TM-350 Only) .......................... 3-6
3.3.7 S16 SWITCH SETTINGS....................................................................................... 3-6
3.3.8 DAC RANGE SETTINGS ...................................................................................... 3-6
3.4 MONITOR COVER REMOVAL................................................................................... 3-7
4 SENSOR, FEEDTHROUGH AND OSCILLATOR ........................................................ 4-1
v
4.1 SENSOR HEAD DESCRIPTION................................................................................... 4-1
4.2 SENSOR HEAD INSTALLATION................................................................................ 4-1
4.3 INSTRUMENTATION FEEDTHROUGH INSTALLATION....................................... 4-2
4.4 SENSOR OSCILLATOR INSTALLATION .................................................................. 4-2
5 SENSOR CRYSTAL REPLACEMENT ........................................................................... 5-1
6 OPERATION....................................................................................................................... 6-1
6.1 FRONT PANEL DISPLAYS .......................................................................................... 6-1
6.2 FRONT PANEL CONTROLS ........................................................................................ 6-1
6.3 DISPLAY AND MODIFICATION OF PARAMETERS ............................................... 6-2
6.4 THICKNESS SET POINT SHUTTER CONTROL ........................................................ 6-2
6.5 CRYSTAL TEST DISPLAY .......................................................................................... 6-3
6.6 CRYSTAL FAIL INDICATION..................................................................................... 6-3
6.7 POWER FAIL INDICATION......................................................................................... 6-3
6.8 DAC OPERATION......................................................................................................... 6-4
7 THEORY OF OPERATION .............................................................................................. 7-1
7.1 BASIC MEASUREMENT.............................................................................................. 7-1
7.2 FILM THICKNESS CALCULATION ........................................................................... 7-1
7.3 CRYSTAL HEALTH CALCULATION......................................................................... 7-3
7.4 RATE CALCULATION ................................................................................................. 7-3
8 ESTABLISHING THE DEPOSITION PARAMETERS................................................. 8-1
8.1 TOOLING FACTOR ...................................................................................................... 8-1
8.2 SENSOR NUMBER (TM-400 ONLY) .............................................................................. 8-1
8.3 DENSITY ....................................................................................................................... 8-1
8.4 ACOUSTIC IMPEDANCE............................................................................................. 8-1
8.5 EMPIRICAL CALIBRATION ....................................................................................... 8-2
8.5.1 MATERIAL DENSITY CALIBRATION.................................................................. 8-2
8.5.2 TOOLING FACTOR CALIBRATION .................................................................... 8-3
8.5.3 ACOUSTIC IMPEDANCE .................................................................................... 8-3
9 COMPUTER INTERFACE ............................................................................................... 9-1
9.1 GENERAL...................................................................................................................... 9-1
9.2 RS-232 SERIAL INTERFACE ....................................................................................... 9-1
9.3 RS-485 SERIAL INTERFACE ....................................................................................... 9-1
9.4 IEEE-488 PARALLEL INTERFACE............................................................................. 9-2
9.5 PROTOCOL ................................................................................................................... 9-2
9.6 DATA TYPES ................................................................................................................ 9-2
9.7 MESSAGE RECEIVED STATUS.................................................................................. 9-3
9.8 INSTRUCTION SUMMARY......................................................................................... 9-4
9.9 INSTRUCTION DESCRIPTIONS ................................................................................. 9-4
10 REPAIR AND MAINTENANCE .............................................................................. 10-1
10.1 HANDLING PRECAUTIONS................................................................................. 10-1
10.2 MAINTENANCE PHILOSOPHY ........................................................................... 10-1
10.3 SELF TEST FAILURE DETECTION ..................................................................... 10-1
10.3.1 EPROM FAILURE (E FAIL)............................................................................... 10-2
10.3.2 RAM FAILURE (I FAIL) ..................................................................................... 10-2
10.3.3 FILM DATA FAILURE (C-FAIL)........................................................................ 10-2
10.3.4 POWER FAILURE (P-FAIL)............................................................................... 10-3
10.3.5 OSCILLATOR FAILURE (O-FAIL) .................................................................... 10-3
10.3.6 SENSOR CARD FAILURE (S FAIL) ................................................................... 10-3
10.4 TROUBLESHOOTING AIDS TO ISOLATE INSTALLATION FAULTS ............ 10-3
10.5 RETURNING THE TM-350/400 TO THE FACTORY ........................................... 10-4
vi
Table of Figures
FIGURE 1-1 TM-400 OUTLINE ................................................................................................ 1-5
FIGURE 1-2 TM-400R OUTLINE.............................................................................................. 1-6
FIGURE 2-1 TM-350 FRONT PANEL........................................................................................ 2-4
FIGURE 2-2 TM-400 FRONT PANEL WITH DESCRIPTIONS ............................................... 2-5
FIGURE 2-3 TM-400 REAR PANEL WITH DESCRIPTIONS.................................................. 2-6
FIGURE 2-4 OUTPUT CONNECTOR....................................................................................... 2-7
FIGURE 2-5 INPUT CONNECTOR............................................................................................ 2-7
FIGURE 2-6 IEEE-488 CONNECTOR........................................................................................ 2-8
FIGURE 2-7 D9S DTE REAR-PANEL RS-232 MALE CONNECTOR..................................... 2-9
FIGURE 2-8 DAC SOCKET CONNECTOR............................................................................... 2-9
FIGURE 2-9 TM-400 TOP VIEW (COVER REMOVED) .........................................................2-10
FIGURE 3-1 POWER ENTRY MODULE................................................................................... 3-2
FIGURE 3-2 TYPICAL SYSTEM INSTALLATION.................................................................. 3-8
vii
List of Tables
TABLE 2-1 OUTPUT CONNECTOR PIN ASSIGNMENTS..................................................... 2-7
TABLE 2-2 INPUT CONNECTOR PIN ASSIGNMENTS.......................................................... 2-7
TABLE 2-3 IEEE-488 PIN ASSIGNMENTS.............................................................................. 2-8
TABLE 2-4 D9 REAR PANEL RS-232/RS-485 CONNECTOR PIN ASSIGNMENTS............. 2-9
TABLE 2-5 DAC SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS. .................... 2-9
TABLE 8-1 CALIBRATION ADJUSTMENT............................................................................ 8-3
TABLE 8-2 DENSITY AND ACOUSTIC IMPEDANCE VALUES FOR SELECTED
MATERIALS ...................................................................................................................... 8-4
TABLE 10-1 TROUBLESHOOTING AIDS............................................................................. 10-4
viii
TM-350/400 THICKNESS MONITOR
1 GENERAL DESCRIPTION
The Thickness Monitor allows improved manual control of the vacuum film
deposition process by providing a direct display of film thickness and deposition
rate during deposition.
Semiautomatic control of film thickness can be accomplished by utilization of the
shutter control relay in the Monitor. The shutter control relay allows for direct
operator control of the systems shutter and will also automatically close the
shutter when the deposition thickness equals a preprogrammed value.
The Monitor requires 4 (6 in a TM-400 using crystal switching) operator-supplied
parameters in order to provide direct readout and shutter control. Entry,
modification and display of these parameters are easy and straightforward.
Parameter storage is not dependent on continuous AC power. An internal, self-
charging, Lithium battery provides parameter storage for a minimum of five years
without external power.
1.1 FEATURES
1.1.1 INDEPENDENT FILM DENSITY AND TOOLING FACTOR PARAMETERS
The tooling factor parameter allows the Monitor to compensate for deposition
geometry effects such as different source to sensor and source to substrate
distances, which result in proportional but not equal film thicknesses at the sensor
and the substrates. By utilizing the tooling factor, the Monitor can calculate and
display film thickness and rate at the substrate rather than at the sensor.
1.2 SPECIFICATIONS
1.2.1 MEASUREMENT
Frequency Resolution 0.03 Hz @6.0 MHz (TM-400)
0.5 Hz @6.0 MHz (TM-350)
Mass Resolution 0.375 ng/cm2 (TM-400)
6.0 ng/cm^2 (TM-350)
Thickness Accuracy 0.5% + 1 count
Measurement Update Rate Dynamically adjusted, 0.5 to 10 Hz
Display Update Rate 10 Hz
Sensor Crystal Frequency 2.5, 3, 5, 6, 9, 10 MHz
1.2.2 DISPLAY
Thickness Display Autoranging: 0.000 to ± 999.9 KÅ
Rate Display Autoranging: 000.0 to ± 999.9 Å/sec
Frequency 0,000,000.0 to 9,999,999.9 MHz
1.2.7 OTHER
Input Power Requirements 100, 120, 200, 240 VAC; 50/60 Hz;
25 watts
Fuse Rating IEC T-Type (Slow), 4/10 A, 250 VAC
Operating Temperature Range 0 to 50°C
Physical Size Instrument Case
3.47” H × 8.4” W × 9.7”D
19” Rack-mount case
3.47” H × 19” W × 9.7” D
1.3 ACCESSORIES
Part Number Description
179217 IEEE-488 Communication Board
179219 RS-232 to RS-485 conversion
123200-5 SH-102 Sensor Head, cables, and
carousel of 10 each 6MHz Gold SC-
101 sensor crystals
124201-4 SO-100 Oscillator with 6" and 10'
BNC Cables.
130200-2 IF-111 Instrument Feedthrough, 1" O-
Ring with 1 electrical connector and
dual 3/16" water tubes.
130204-2 IF-276 Instrumentation Feedthrough,
2 3/4" Conflat® Flange seal with 1
electrical connector and dual 3/16"
water tubes.
150902 SF-120 Combination Sensor Head,
Feedthrough, Cables, Crystals and
Oscillator.
123204-1 Internal Coax Cable 30".
123204-2 Internal Coax Cable 60".
124202-1 BNC Cable Assembly 10'.
124202-2 BNC Cable Assembly 20'
124204 BNC Cable Assembly 6".
103220 SC-101 Carousel of 10 each 6MHz
gold sensor crystals.
103221 SC-102 Carousel of 10 each 6MHz
silver sensor crystals.
Refer to Maxtek’s Price List for more accessories and other products.
to condensed water vapor on the crystal. The "O FAIL" message may be
reactivated if excessive water on the crystal causes it to fail. Pressing the Stop
key after sufficient water has evaporated from the surface of the crystal should
clear the failure. The displayed thickness should then decrease as additional
water vapor evaporates from the surface. If operation seems abnormal, check to
see that the stored parameter values are reasonable. The following parameter
values are suggested.
Set Point Thickness 10.00 KÅ
Material Density 2.650 gm/cubic cm
Acoustic Impedance 8.830
Tooling Factor 100.0%
If everything responds as described above the total system is OK. If not, refer to
Section 10, REPAIR AND MAINTENANCE.
In addition to the individual channel output pins there are two control pins that are
common to both channels and are intended to simplify the process of setting up
analog recorders. Connecting the Zero control line to ground will drive both
channel outputs to zero, allowing the recorder zero reference to be easily set.
Releasing the Zero line and connecting the Full Scale line to ground will drive
both channel outputs to full scale for establishing the recorder full scale
calibration.
Each channel can be set independently to convert either the two or the three least
significant digits of the displayed Rate and Thickness to a proportional analog
signal, corresponding to the DAC setup option chosen. With the three-digit
setting, a thickness of 0.500 KÅ would result in an analog output of 2.50 volts, or
a scale factor of 5 mV/Å. If more resolution is desired, either channel can be
configured, using the switches shown in Figure 2-9, to convert only the last two
digits of the parameter, thus the analog output would achieve full scale at 99Å.
The output scale factor in this configuration is 50 mV/Å.
The above scale factors are based on the assumption that the thickness display is
in the 0 - 9.999 KÅ range. Because the thickness and rate displays are
autoranging, the analog output of these variables will also autorange. In the above
example, if the thickness were in the range of 10 KÅ to 99.9 KÅ, the analog scale
factor would be 50 mV per 10 Å, also ten times larger.
Pin Signal
Number RS-232 RS-485
1 Not used Rx- Input
2 Tx Output Rx+ Input
3 Rx Input Tx+ Output
4 Not used Tx- Output
5 GND GND
6 Not used CTS- Input
7 CTS Input CTS+ Input
8 RTS Output RTS+ Output
9 Not used RTS- Output
Table 2-4 D9 Rear Panel RS-232/RS-485 Connector Pin Assignments.
3 MONITOR INSTALLATION
3.1 MONITOR INSTALLATION PRECAUTIONS
3.1.1 PROPER GROUNDING
The Monitor was designed to operate in electrically noisy environments. In many
cases no special grounding precautions will be required. Where noise
susceptibility is suspected, use a short length of wire, wire braid or copper strap is
recommended, to connect the Monitor to the equipment on which, or in which, the
unit is mounted. Use the grounding lug provided on the back of the Monitor for
this purpose. If trouble still persists, make sure that the equipment on which the
Monitor is mounted, or the equipment rack in which the unit is mounted is
adequately grounded to the vacuum frame. Use short copper straps or braid. It is
a good idea to use several grounding straps attached to widely separated points on
the vacuum system and equipment frame in order to minimize the inductance of
the ground path.
power module exposing the two fuses and the voltage selection wheel.
3. Insert the tool into the voltage selection slot and remove the wheel from
the module.
4. Select the desired voltage. Replace the wheel back into the module.
5. If fuse replacement is needed, pull out the fuse holders. Check and
replace fuse(s) with the correct type. Replace the fuse holders back into
the module.
6. Close the module cover, making sure the selected voltage shows through
the window.
3.3.3 DAC
The TM-350/400 has two DAC output channels. One output is for rate and one is
for thickness. Each DAC channel has a selectable range, which is used to convert
the appropriate display to a 0 to 5-volt analog signal (for more information see
Section 6.8 DAC OPERATION).
Five screws located on the top of the unit and 1 screw on the rear panel secures
the cover of the Monitor. Remove the 6 screws, and slide the top cover toward
the rear.
To reinstall the cover, slide it into the groove created by the front and side panels,
then replace the screws.
Use a shutter to shield the sensor head during initial soak periods to protect the
crystal from any sputtering that may occur. If a small droplet of molten material
hits the crystal, the crystal may be damaged and oscillation will cease.
6 OPERATION
6.1 FRONT PANEL DISPLAYS
The TM-350 display consists of a 4 digit Thickness display, a 4 digit Rate display,
a Source Shutter LED, a Frequency LED, a Test LED, and a Sensor status LED.
The TM-400 also has a Sensor Shutter LED and a second Sensor Status LED.
When the Source Shutter LED is on, the Source Shutter relay is activated.
The tricolor Sensor Status LED is Green when the sensor is good and is the active
sensor, yellow when the sensor is good and is the inactive sensor (on the TM-400
only), and red when the sensor is failed.
When the Sensor Shutter LED is on, the Sensor Shutter relay is activated.
The rate and thickness displays can display rate and thickness, active sensor
frequency or sensor 1&2 test values. The FREQ and TEST LED’s indicate what
values are being displayed and the Display key increments to the next display
value. If the FREQ and the TEST LED’s are both off, the Rate and Thickness
displays show Rate and Thickness, respectively. If the FREQ LED is on, the rate
display shows the frequency of the active sensor in MHz and the thickness display
shows the remaining digits of frequency in hertz. If the Test LED is on, the first
digit of the Rate display shows the current frequency setting (2=2.5, 3=3.0, 5-5.0,
6=6.0, 9=9.0 or 1=10.0 MHz). The next digit is a dash [-] where a blinking dash
indicates the active sensor. For the TEST display, the last two digits of the rate
shows the crystal health for Sensor 1. The TM-400, will show the same
information for Sensor 2 in the Thickness display.
OPERATION 6-1
TM-350/400 THICKNESS MONITOR
SHUTTER KEY
Toggles the source shutter relay output.
DISPLAY KEY
Switches the rate and thickness displays between Rate and Thickness, Frequency
and TEST display modes
FILM NUMBER KEY
Used to display and modify the current film number. When pressed, current film
number is displayed in the rate display and is changed by pressing the Modify up
and Modify down keys. Each film can be individually programmed by setting the
film number and programming as described in paragraph 6.3. Note: Any failures
must be cleared in order to advance to the next film.
SENSOR SWAP KEY (TM-400 only)
Toggles the active sensor between sensor 1 and sensor 2. The Sensor shutter will
also toggle so that it is closed when sensor #2 is the active sensor and open when
sensor #1 is the active sensor. Use this key with caution because you can switch
to a failed sensor during a deposit thereby aborting the run and causing and "O
FAIL" message.
6-2 OPERATION
TM-350/400 THICKNESS MONITOR
the shutter is not desired the Thickness End Point parameter can be programmed
at a value much greater than can reasonably be achieved.
OPERATION 6-3
TM-350/400 THICKNESS MONITOR
film thickness at the time of power failure and flashes the "P FAIL" message to
indicate to the operator that power was down during their absence. The operator
then has the option of continuing the deposition if desired by restarting the
Monitor.
With the range set to 999, a thickness of 0.999 KÅ would correspond to an output
of 999/999x5 volts or 5 volts. A thickness of 0.900 would correspond to an
output of 900/999x5 volts or 4.5 volts. With the range set to 5000, a thickness of
1.000 KÅ would correspond to an output of 1000/5000x5 volts or 1.0 volts.
6-4 OPERATION
TM-350/400 THICKNESS MONITOR
To select between two or three digit conversion, a set of DIP switches (S16
switches 1 and 2) are provided on the back of the front panel. With J2 (Rate) or
J3 (Thickness) installed (default), the DAC is set for three digit conversion. If the
jumper is removed, the DAC is set for two-digit conversion.
OPERATION 6-5
TM-350/400 THICKNESS MONITOR
7 THEORY OF OPERATION
7.1 BASIC MEASUREMENT
The TM-350/400 uses a quartz crystal as the basic transducing element. The
quartz crystal itself is a flat circular plate approximately 0.55 in. (1.40 cm) in
diameter and 0.011-0.013 in. (28-33mm) thick for 6 and 5 MHz. The crystal
thickness is inversely proportional to the crystal frequency. The crystal is excited
into mechanical motion by means of an external oscillator. The unloaded crystal
vibrates in the thickness shear mode at approximately the frequency of the
specified crystal. The frequency at which the quartz crystal oscillates is lowered
by the addition of material to its surface.
Nq ⋅ ρq
TK f = ( f −f
ρf ⋅ f 2 q
) (1)
where:
Nq= Frequency constant for an “AT” cut quartz crystal vibrating in thickness
shear (Hz x cm).
This equation proved to be adequate in most cases, however, note that the
constant of proportionality is not actually constant because the equation contains
the crystal frequency, which of course changes as the film builds up. Because the
achievable frequency change was small enough, the change in scale factor fell
within acceptable limits.
Improvements in sensor crystals and oscillator circuits resulted in a significant
increase in achievable frequency shift. Low cost integrated digital circuits
Nq ⋅ ρq
TK f =
ρf
(τ − τ )
q
(2)
where:
⎛ ρq ⎞ ⎛ τ ⎞ ⎡ ⎛τ − τ q ⎞⎤
TK f = ⎜⎜ ⎟⎟ ⋅ N q ⋅ ⎜ ⎟ ⋅ arctan ⎢ Rz tan π ⎜ ⎟⎥ (3)
⎝ρf ⎠ ⎝ πRz ⎠ ⎣ ⎝ τ ⎠⎦
where:
Rz is referred to as the Acoustic Impedance Ratio and is obtained by dividing the
acoustic impedance of quartz by the acoustic impedance of the deposited film.
This equation introduces another term into the relationship, which is the ratio of
the acoustic impedance of quartz to the acoustic impedance of the deposited film.
The acoustic impedance is that associated with the transmission of a shear wave
in the material. Note that if the acoustic impedance ratio is equal to one, quartz
on quartz, equation 3 reduces to equation 2.
an effective time constant of about 2 seconds. Following a step the displayed rate
will settle to 95% of the final value in 5 sec.
8.3 DENSITY
The Density parameter provides the Monitor with the density of the material
being deposited so that it can calculate and display the physical film thickness. If
the film density is known, it should be used. A list of the more commonly used
film densities is presented in Table 7.1. As a first approximation, bulk material
density can be used in programming this parameter. Empirical calibration of this
parameter is described in Section 8.5.1.
impedance can be calculated from the shear modulus or the shear wave velocity
and the density by using the following equation:
acoustic impedance = PC = PG
where:
P = Density (gm/cm3).
C = Transverse (shear) wave velocity (cm/sec).
G = Shear modulus (dynes/cm2).
A list of the acoustic impedance and density of the more commonly deposited
materials is presented in Table 8-2, and a technique for empirically determining
this parameter is presented in Section 8.5.3.
In many cases, and particularly if the sensor crystal is not heavily loaded,
sufficient accuracy can be achieved by using the acoustic impedance of quartz:
8.83 X 100,000 gm/sq. cm sec.
Table 8-2 Density and Acoustic Impedance Values for Selected Materials
Material Symbol Density Impedance
gm/cm^2 10^5gm/(cm^2sec)
Aluminum Al 2.70 8.17
Aluminum Oxide Al2O3 3.97 26.28
Antimony Sb 6.62 11.49
Arsenic As 5.73 9.14
Barium Ba 3.5 4.20
Beryllium Be 1.85 16.26
Bismuth Bi 9.8 11.18
Boron B 2.54 22.70
Cadmium Cd 8.64 12.95
Cadmium Sulfide CdS 4.83 8.66
Cadmium Telluride CdTe 5.85 9.01
Calcium Ca 1.55 3.37
Calcium Fluoride CaF2 3.18 11.39
Carbon (Diamond) C 3.52 40.14
Carbon (Graphite) C 2.25 2.71
Chromium Cr 7.20 28.95
Cobalt Co 8.71 25.74
Copper Cu 8.93 20.21
Copper (I) Sulfide (alpha) Cu2S 5.6 12.80
Copper (I) Sulfide (beta) Cu2S 5.8 13.18
Copper (II) Sulfide CuS 4.6 10.77
Dysprosium Dy 8.54 14.72
Erbium Er 9.05 11.93
Europium Eu 5.244 ----
Gadolinium Gd 7.89 13.18
Gallium Ga 5.93 14.89
Gallium Arsenide GaAs 5.31 5.55
Germanium Ge 5.35 17.11
Gold Au 19.30 23.18
Hafnium Hf 13.09 24.53
Holnium Ho 8.8 15.2
Indium In 7.30 10.50
Indium Antimonide InSb 5.76 11.48
Iridium Ir 22.40 68.45
Iron Fe 7.86 25.30
Lanthanum La 6.17 9.59
Lead Pb 11.30 7.81
Lead Sulfide PbS 7.50 15.60
Lithium Li 0.53 1.50
Lithium Fluoride LiF 2.64 11.41
Magnesium Mg 1.74 5.48
Magnesium Fluoride MgF2 3.0 13.86
9 COMPUTER INTERFACE
9.1 GENERAL
The various computer interfaces of the Maxtek TM-350/400 Deposition Monitors
permit complete remote control using a personal computer. There are three types
of computer interfaces offered. The TM-350/400 comes standard with an RS-232
serial interface. Both RS-485 and IEEE-488 interfaces are available as options.
9.5 PROTOCOL
All communications between the computer and the TM-350/400 are in the form of
message character strings with the format:
* Two byte header - (FFh, FEh i.e. Chr$(255), Chr$(254)) The header indicates
the beginning of a message.
*One byte device address - (0 to 32) The device address byte defines the bus
address of the instrument that sent or should receive the message. The device
address will range from 0 to 32. See Section 3.3.2 for instructions on setting the
TM's device address. A message sent to a device address of zero will be received
by all TMs except in the case of the IEEE-488 interface. With this interface, only
the addressed device will receive the message.
*One byte instruction code - (0 to 6) Defines the code number of the message.
*One byte message length - (0 to 249) Indicates the number of data bytes
contained in the message.
* One byte checksum - (0 to 255) The checksum byte is used for transmission
error detection. If the TM receives a message with an incorrect checksum, it will
disregard the message. The checksum is the compliment of the one-byte sum of
all bytes from, and including, the instruction code to the end of the message. If
the one-byte sum of all these bytes is added to the checksum, the result should
equal 255.
If the sum of all bytes occupies more than one byte, a single byte checksum can
be generated using the expression: checksum=! (Sum MOD 256), i.e. the
checksum is the complement of the remainder byte, which results from dividing
the sum of all bytes by 256.
numeric values (0-255), or 8 bit registers. Some of the multiple byte data types
are decimal values stored as integers. To convert these values to their decimal
equivalent, use the following equation:
Decimal Value = (Integer Value)/(10*DP)
Where:
DP = the value’s decimal point position.
The decimal point positions for all the parameters are constant and are given in
tables along with the parameters’ range.
Example: To instruct the monitor to send the hardware configuration data the
computer would send:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(1)+Chr$(0)+Chr$(254)
3. Send film parameters (Code #2)
Instructs the monitor to send the parameters for film # n to the host computer. A
description of the film parameter list is in the table below:
Parameter name Len Byte Decimal Pt. Range Units
Bytes Offset Position
Film Number 1 0 * 1-99 None
Endpoint Thickness 3 1 * 0 - 999,999 Ang
Primary Sensor # 1 4 * 1-2 None
Material Density 2 5 2 80-9999 0.01
gm/cm3
Acoustic Impedance 2 7 2 50-5999 0.01
gm/cm2/s
ec
Tooling Factor #1 2 9 1 100-4999 0.1%
Tooling Factor #2 2 11 1 100-4999 0.1%
Total 13 bytes
* - Indicates decimal point position is not applicable.
Format: Header, Address, Instruction=2, Length=1, Film#(1-100), Checksum.
Example: To instruct the monitor to send the parameter list for material #15 the
computer would send:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(2)+Chr$(1)+Chr$(15)+Chr$(237)
4. Receive film parameters (Code #3)
Instructs the monitor to enter all the incoming film parameters for film # n into
memory. The parameters must be in the same order and format as the above film
parameter list.
Format: Header, Address, Instruction=3, Length=13, 1 byte, Film# (1-100), 12
bytes film parameter data, Checksum.
Example: To instruct the monitor to send the status data the computer would
send:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(4)+Chr$(0)+Chr$(251)
All values are in ASCII format including decimal points, commas and negative
signs.
For example, to instruct the TM to output rate, thickness and frequency for
sensors 1&2, the computer would send the following message:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(5)+Chr$(2)+Chr$(248)+Chr$(1)+
Chr$(255)
Data logging is stopped by sending the following message:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(5)+Chr$(2)+Chr$(0)+Chr$(0)+Chr$(248)
All values are sent in Binary format with the most significant byte first. To
convert this to decimal, use the following formula:
Decimal Value = Sum of Byte[n]*256^(Y-1) where n goes from 1 to Y and Y is
the total number of bytes that make up the value.
For example, say you receive the four following bytes representing the mass per
unit area: 0,10,250,76
This equals (0*256^3 + 10*256^2 + 250*256 + 76)*0.137 ng/cm^2 = 98,562.7
ng/cm^2
The rate and thickness values are in the normal units of Ang and Ang/sec. Sensor
period however, is in special units. Use the following formula to convert period
to frequency.
Frequency (Hz) = (3.221E15)/Period
Where the period value is converted from the four byte binary data as shown in
the example above.
To instruct the TM to output sensor #1 and sensor #2 period, the computer would
send the following message:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(6)+Chr$(2)+Chr$(128)+Chr$(1)+
Chr$(118)
The TM will return two, four byte values containing sensors #1&2 period.
Data logging is stopped by sending the following message:
Chr$(255)+Chr$(254)+Chr$(1)+Chr$(6)+Chr$(2)+Chr$(0)+Chr$(0)+Chr$(247)
8. Internal command (Code #7)
9. Internal command (Code #8)
10. Internal command (Code #9)
11. Set active film # (Code #10)
This instruction allows the computer to set the active film number. The message
must be in the following format:
Format: Header, Address, Instruction=10, Length=1, 1 byte Film# (1-100),
Checksum.
is displayed. There are basically two types of system failures: failures that may
not be reset by the operator and those that may. You cannot reset the E FAIL or I
FAIL messages. They may be cleared only by the replacement of the defective
components. These failures are displayed continuously and ALL OTHER
SYSTEM OPERATIONS ARE DISABLED. For these internal failures, it is
recommended that the unit be returned to the factory for repair. On failures that
may be reset, the front panel display alternates the particular failure message and
the Rate and Thickness values prior to the failure. The display continues to
alternate the failure until the fault has been reset.
The following is a summary of detected failures, the displayed messages and the
necessary actions to reset them.
Detected Failure Failure Message Reset by:
EPROM Failure E FAIL Replacement of defective ROM
RAM Failure I FAIL Replacement of defective RAM
Film Data Failure C FAIL Press STOP button
Power Failure P FAIL Press STOP button
Oscillator Failure O FAIL Press STOP button
Sensor Card S FAIL Replacement of sensor measurement
Failure card
Any long-term failures can cause serious thickness errors if they occur during a
run. To save any materials, which may be in process, the shutter is automatically
closed. The process can be continued only after the fault has been corrected and
the message has been reset as described above. If there is more than one failure,
the other failure will then be displayed. When no failures exist, only current
display values will be displayed. A description of the conditions of the individual
failures follows.
if out of range. The monitor should not be started until the user has checked all of
the parameters for the desired film.
In the event of a C-Fail, the shutter is automatically closed since reliable operation
of the Monitor is impossible until the bad data is corrected.
WARNING: All standard safety procedures associated with the safe handling
of electrical equipment must be observed. Only properly trained personnel
should attempt to service the instrument.