Zone 4 Battery System Report 11-09-2015

BMW i3 Cost Analysis
Zone 4: Battery System
9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 1

Disclaimers
Legal Disclaimer: All company names, product names, and service names
mentioned are used for identification purposes only and may be registered
trademarks, trademarks, or service marks of their respective owners. All analyses
are done without participation, authorization, or endorsement of the
manufacturer. Any cost analyses presented in this material are estimates prepared
by Munro & Associates, Inc. from generally available data. Munro & Associates, Inc.
believe these estimates reflect the probable costs. The actual producer did not
supply the data, and therefore the actual costs may differ from these
estimates. Furthermore, Munro & Associates, Inc. extends no warranties with
respect to any information in this document, and shall bear no liability whatsoever
for the use of the information. Copyright © 2015 Munro & Associates, Inc. All rights
reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit,
download to a shared database, or otherwise copy, transfer, sell, publish, or send
this material, or any portion thereof, by any means without the express written
permission of Munro & Associates Inc. under penalty of law.
Technical Disclaimer: The goal of this analysis is to establish a should cost value
for manufacturing the vehicle and its sub-systems. These cost totals do not include
tooling, Engineering Research and Development (ER&D), testing and calibration,
logistics, or profit. Manufacturing process assumptions, such as manual assembly
vs. automation or mold cavity numbers, were selected based on an annual volume
of 20,000.
Subject Page
Disclaimers 2
Description of Report Content 17
Data Overview 18
Interpreting Data 26
Cost Analysis 32
Zone 4: Battery System Overview 33
Zone 4: Battery System 34
Battery Pack Overview 35
Battery Pack 43
Note: Munro logo in upper right of each page is a link to the front page of the report.

Subject Page
Battery Pack Asm 44
End of line Test 610
Battery Installation 612
Power Electronics Overview 614
Power Electronics 617
Power Module Asm 618
Power Module Installation 1070
Charging Module Asm 1072
Charging Module Installation 1275


Subject Page
AC/DC Inverter, Generator Asm 1277
AC/DC Inverter, Generator Installation 1467
Inverter Heat Shield 1469
Inverter Heat Shield Process 1471
Charging Module Interface Installation 1473
Battery Charger Installation 1475
Power Harnesses Overview 1477
Power Harnesses 1480
Power Module Wire Harness Installation 1481


Subject Page
HV Cable, AC/DC Inverter to Charging Installation 1483
HV Cable, Generator to AC/DC Converter Asm 1485
HV Cable, Generator to AC/DC Conv Installation 1523
HV Cable, Battery to Power Module Installation 1525
HV Cable Asm, Power Module to AC Comp Installation 1527
HV Cable, PDM to DC/DC Converter Installation 1529
HV Cable, Power Module to Charging Mo Installation 1531
HV Cable Asm, Charging Port/Charging Mod 1533
HV Cable Asm, Charging Port to Charge Installation 1554


Subject Page
HV Cable Asm, Power Module to HEX Installation 1556
HV Cable Bracket Asm, Drive Motor Installation 1558
Appendix Reports 1560
TechInsights Electronics Reports 1561
Munro & Associates Wire Harness Reports 2121
Technical References 2627

Design Profit® Process
• The Design Profit® Software is used to provide a detailed cost map analyzing every
subassembly, part, operation, & tool in the manufacturing process.
• The various symbols shown below are used in a hierarchical diagram to quantify &
compare design and manufacturing efficiencies & costs.
Parts
Subassemblies
Pre-Processed
Parts
Tools
Fastening
Operations
Parallel
Non-Value Added
Processing
Operations
Multi-Touches
Material
Modifications
Repeated
Operations
Inspections
Notes
Process
Steps

Each symbol is created by

filling out a properties window.
Penalty conditions and other
information related to the
symbol are assigned, in order
to calculate the effect of
handling difficulties on
assembly time.

Components to be
Assembled
Part to Fabricate
Assembly Operations
Fabrication
Above is a Design Profit cost map. The top horizontal line of
Operations symbols indicates the assemblies, parts, and assembly processes
used to create the above parent assembly. Each of the symbols
below a parent are analyzed in detail. Total costs are then rolled-up
to the parent symbol. The vertical string of symbols on the left
shows the details of each step and work cell in the fabrication
process. The vertical string of symbols on the right shows the
details of each step and work cell in the assembly process.
Assumptions
The following assumptions were made for the cost analysis:
• All processing was documented in the Design Profit software.
• All raw material prices are based on quotes and published information.
• All manufacturing processes include the man and machine to establish an
hourly cost for the manufacturing work cell for each process and country utilized
in creating the vehicle. These work cell rates are used along with calculation of
cycle time to generate the process costs of components. Machine rates are
developed through an internal model, accounting for all aspects of the primary
and secondary equipment for the process. Operator rates are based on the
specific country, and related industry labor rates. Adjustments are made for the
number of operators in the workcell.
• Common/basic components were costed as commodity items. These included:
bearings, seals, fasteners, and electronic components.
• Bearings/Seals/Fasteners are compared to numerous costed bills of materials
to establish a purchased price.
• Electronic component costs are based on the costed bill of materials on hand,
quote requests, and published information. Component pricing is run through
trend lines to establish a cost for the appropriate targeted volumes.
• Machining cycle times are calculated using operations based on speeds and
feeds from the standard machinist handbook.

SG&A Calculations
Sales, General, and Administration: Technology SG&A

Level Mark-Ups
• The SG&A mark-up used for commodity parts is a 1 6.0%
flat 3.0% typically used as a standard industry 2 7.0%
Low
value. This mark-up accounts for the purchasing 3 8.0%
and handling of commodity parts. 4 9.0%
5 10.0%
• The SG&A mark-up used for fabricated parts raw 6 11.0%
Medium
material and processing costs is a variable rate 7 12.0%
based on the technology level associated with the 8 13.0%
system. A table of the standard percentage mark- 9 14.0%
10 15.0%
ups is shown to the right. Low technology is 11 16.0%
typical of a system mostly consisting of simple 12 17.0%
High
parts, such as basic stampings and injection 13 18.0%
molded parts. High technology is typically a 14 19.0%
system with complex automated assembly, high 15 20.0%
tolerance machined parts, and complex electronic 16 21.0%
Cutting Edge
17 22.0%
systems, or more standard processes applied to
18 23.0%
new applications. Cutting edge is typically a 19 24.0%
system that uses first to market application of an 20 25.0%
advanced technology.
Defining Q Burden
Quality Burden (Q Burden) is the additional cost carried by each good product unit,
to account for the actions and materials used to correct defects in parts (as
received or produced) or in production processes. Q Burden is a key component of
the Cost of Quality and may be considered equivalent to failure costs. Q Burden
reflects the variable cost of poor quality. The probability of a defect can be
estimated from industry averages or can be based on company statistics.
Q Burden is calculated by adding the incident and disposition costs for each defect
and multiplying the sum by the probability of a defect occurrence. The incident is
the set of actions that are taken immediately upon the discovery of a real or
suspected defect. The disposition is the actions to deal with the defective
production after the incident.
Q Burden does not include:
• Base overhead associated with the quality organization (the amount required to
assure compliance with industry and customer standards)
• Process documentation generally needed in order to communicate requirements
and standards for production, inspection, and testing
• Inspection and test equipment depreciation and consumables (unless needed for
troubleshooting defective product)
• Defect prevention activity (investment in new equipment, process improvement,
mistake-proofing activities, redesign, lean/six sigma activities, etc.)
Die Casting Estimates
The die casting material costs and cycle

times are calculated in an internal
parametric based cost estimating sheet,
and outputs are fed into Design Profit to
develop final fabrication costs. Since die
casting is a more material driven
primary fabrication process, the cells to
the right include general dimensional
values and material selections.

Injection Molding Estimates
The injection molding material costs and

cycle times are calculated in an internal
develop final fabrication costs. Since
injection molding is a more complex
material driven primary fabrication
process, the cells to the right include
detailed dimensional values and
material selections.
Stamping Estimates
The stamping material costs and cycle

times are calculated in an internal
develop final fabrication costs. Since
stamping is a more machine driven
primary fabrication process, the cells to
the right include dimensional values
related to stations operating in the
press, along with material selections.
Description of Report Content
Zone Report Outline:

• Zone Information
– Zone Overview
– Zone Executive Summary
• Chapter Information
– Chapter Overview
– Eye Catching Features
– Executive Summary
– Repeating Series of Sets of Costing Detail Pages
• Assembly Details (Set of 3 Pages)
• Part Details (Set of 2 Pages)
• Assembly Process (Set of 2 Pages)
• Appendix Information
– TechInsights Reports
• Electronic Component Costing Details
– Munro & Associates Wire Harness Reports
• Wire Harness Costing Details
• Zones and Chapters are meant to be similar in structure to a system and sub-system breakdown,
however, they may or may not represent specific Original Equipment Manufacturer (OEM) organizations.
For example, the Zone 7: Driveline contains the chapters for Motor, Gear Box and Half Shafts.

Data Overview – Executive Summaries
At the beginning of each Zone

report and beginning of each
Chapter, there will be a
Executive Summary page.
This page provides the high
level totals of the Zone or
Chapter, based on the
following detailed data. The
upper part of the summary
table shows typical metrics
totaled from the assembly
and fabrication processes,
including part counts,
operation counts, timing, and
weights. The lower part of the
table shows the total costs
incurred from these
Executive Summary: Page 1 of 1 processes.

Data Overview – Assembly Details
As the report progresses

through the breakdown
hierarchy of the Chapter,
when an assembly is
analyzed, three detail pages
will be provided. The first
page, shown to the left, is a
high level overview. The top
left photo is the independent
assembly, placed on a grid for
a reference perspective. The
bottom left photo is the
assembly in location, once it
is assembled to its parent
assembly. The top right is a
list of the parent assemblies
of this assembly. The bottom
Assembly Details: Page 1 of 3 right is a table summarizing
total metrics and costs related
to the completed assembly.
The second assembly detail

page, shown to the left, is the
detailed breakdown of the
totals for each line item within
the current assembly. The line
items within the breakdown
will include assemblies, parts,
and assembly processes.
This makes these tables
effectively a combined Bill of
Materials (BOM) and Bill of
Process (BOP) for that
assembly. The top table
provides the typical metrics
totaled from the assembly
and fabrication process of
each line item. The bottom
Assembly Details: Page 2 of 3 table provides the total costs
• Note for large assemblies with many line items this incurred from these
page could become multiple pages. processes.
The third assembly detail

detailed summary of the totals
shown on the previous page.
The upper part of the
summary table shows typical
metrics totaled from the
assembly and fabrication
process, including part
counts, operation counts,
timing, and weights. The
lower part of the table shows
the total costs incurred from
these processes.
Assembly Details: Page 3 of 3

Data Overview – Part Details

when a part is analyzed, two
detail pages will be provided.
The first page, shown to the
left, is a high level overview.
The top left photo is the
independent part, placed on a
grid for a reference
perspective. The bottom left
photo is the part in location,
once it is assembled to its
parent assembly. The top
right is a list of the parent
assemblies of this part. The
bottom right is a table
Part Details: Page 1 of 2 summarizing total metrics and
costs related to the completed
part.
Data Overview – Part Details
The second part detail page,

shown to the left, is the
detailed breakdown of the
totals for the raw materials
and each process step to
fabricate the part. The top
table provides the typical
fabrication process metrics
and costs totaled for each
step. The bottom table
provides the total costs for
raw material or purchased
parts used in the fabrication
process.
Part Details: Page 2 of 2

• Note for complex parts with many steps this page
could become multiple pages.

Data Overview – Assembly Process Details

when an assembly process is
analyzed, two detail pages
will be provided. The first
high level overview. The top
left are photos of the
purchased parts utilized in the
process, placed on a grid for
a reference perspective. The
bottom left photo is a view of
the location, once the process
is complete. The top right is a
list of the parent assemblies
of this process. The bottom
Assembly Process Details: Page 1 of 2 right is a table summarizing
total metrics and costs related
to the process.
Data Overview – Assembly Process Details
The second assembly

process detail page, shown to
the left, is the detailed
breakdown of the totals for
the purchased parts and each
assembly process step. The
top table provides the typical
assembly process metrics
and costs totaled for each
step. The bottom table
provides the total costs for
purchased parts used in the
assembly process. If a
electronic component or wire
harness are in the list of
purchased parts, then this
page will also have a link to
Assembly Process Details: Page 2 of 2 the accompanying report in
• Note for complex processes with many steps this the Appendix.
page could become multiple pages.

Interpreting Data – Part Counts
Summary tables, include three

metrics related to part count.
The first metric, “Parts” is the
total quantity of parts. The
second metric, “Fasteners” is
the total quantity of fasteners,
within that total part count,
meaning that the fasteners
count is a sub-total of the parts
count. The third metric, “Part
Numbers” is the total unique
part instances in the total part
count (this includes numbers for
both main parts and fasteners).

Interpreting Data – Operation Counts
Summary tables, also include

two metrics related to operation
counts. The first “Steps”, is the
total count of the operations
required to complete an
assembly, part, or assembly
process. Operations counted in
this total include handling of
parts, movement of equipment
or operators, handling of tools,
fastenings of parts and
assemblies, operations to add
and remove material during the
fabrication process, etc. The
second “Fastenings” is the total
count of the operations
specifically related to fastenings
components together, meaning
that the fastening count is a
sub-total of the steps count.
Interpreting Data – Fasteners vs.
Fastenings
Often it would be expected that

the analysis would have the
same number of fasteners to
fastenings, however, that is not
always the case. One scenario
is shown to the right, where
there are less fasteners, than
fastenings. This is typical of
welding operations or the
application of sealant or
adhesive, as there is not a
standard bolt, nut, or clip to be
counted as a fastener. A second
scenario is where there are
more fasteners, than fastenings.
This is typical of a process that
engages multiple fasteners at
the same time, like a multi-head
nut runner.

Interpreting Data – Right First Time
Summary tables include “Right

First Time” (RFT). This value
states the probably that all the
steps that total to this point in
the process will be completed
without an error. Naturally, as
the number and complexity of
steps required to complete the
assembly, part, or assembly
process increase, the RFT
percentage will decrease. RFT
is calculated using typical best-
in-class PPM values for incident
rates. However, even with high
Sigma level processes, as the
steps count increases greatly,
the RFT percentage will
decrease greatly.

Interpreting Data – No Commodity Items in
Assembly Process
Some assembly processes will

not require the use of
commodity items in the process
to fasten parts and assemblies.
For example, the installation of
the half shafts to the vehicle
utilizes a press fit, and therefore
does not require commodities,
like bolts, nuts, or clips to fasten
in place. When no commodities
are required, the top left photos
will be replaced with the
standard statement shown on
the left. Additionally there will be
no weight or material cost /
purchased parts cost present in
the process summary.

Interpreting Data – Low Q Burden
Some assembly and fabrication process steps that have few operations or
operations with low PPMs of defects, will often display $0.00 in Q Burden. This
is simply because the Q Burden value for that step in the process is less than
one cent. However, this fraction of a cent of cost will be rolled-up to any parent
part or assembly for these processes and added to its totals.

Cost Analysis

Zone 4: Battery System Overview
Zone 4 includes the battery pack, battery electronics and

battery pack wiring harnesses.
All major components were costed in detail, while prices
were applied to commodity items (i.e. seals, fasteners,
latches, and seat belts).
Estimates are based on actual parts.
Photos: Background on 100mm grid paper.

Zone 4: Battery System
Summary
* Excluding tooling, ER&D, logistics, and profit margin

** Includes material cost and purchased parts cost

Battery Pack Overview
The battery pack is a self contained unit attached to the

underside of the vehicle with 27 bolts. The enclosure of the
battery pack is also used as a stiffening element for the
Aluminum frame, to which the body and drivetrain are
connected. The i3 battery pack is a self contained unit which
can be removed from the vehicle for maintenance or
replacement.
The pack contains eight (8) battery modules containing 12
individual cells. Each module is designed to be a self
contained unit, with a control board mounted on each module.
The modules can be replaced by disconnecting one (1) power
connection, one (1) communication connector and four (4)
nuts.
The battery pack components were evaluated in detail down to
the internal cell components for the batteries, the control PC
board components, connectors, pack cooling/heating system.
The cost associated with the assembly test and formation of
the cells were included in the cost evaluation.
All major components were costed in detail, while prices were
applied to commodity items (i.e. fuses, contactors, substrates,
chemicals, fasteners).


Eye Catching Features
Description:
• The battery pack is designed for easy removal from the vehicle.
Advantages:
• Remove 27 screws to drop the pack.
• Disconnect one main power cable, safety interlock, two Coolant hoses, one cable.
• Designed for easy repair or replacement.

Main battery pack controller
Onboard module & cell controller
Dedicated buss connector
Description:
• The battery pack uses a distributive control system to monitor and charge the eight 45 volt
modules.
Advantages:
• With individual controls, each of the modules can be replaced without the need for scrapping
the entire battery pack in the event of a cell failure.

Description:
• The battery pack is designed for easy removal of any of the eight 45 volt internal modules.
Advantages:
• Because of the modular design, each of the modules can be easily replaced without the need
for scrapping the entire battery pack in the event of a cell failure.

Description:
• Laser welded cell interconnections.
Advantages:
• Eliminates the possibility of coming loose.
• Provides the best possible electrical connection.
• Eliminates the use of fasteners.
• Removes the chance of having a bad connection due to corrosion.

Description:
• Epoxy covered ultrasonic welds.
Advantages:
• Eliminates the possibility of coming loose.
• Eliminates the use of fasteners.
• Removes the chance of having a bad connection due to corrosion.
• Prevents vibration issues at the weld interface.

Cooling channel
Heating element
Description:
• Battery Pack cooling and heating system for battery modules. The battery modules sit on the aluminum
cooling rack and AC refrigerant is channeled through the micro channel extrusions. A heating element is
used to heat the batteries during recharge using the same extrusions to transfer the heat.
Advantages:
No additional fans or cooling systems are required for battery temperature control. The heating
and cooling system are contained with the confines of the battery pack with only the AC lines
needing routing outside of the battery pack.

Description:
• Loose buss bar found during disassembly. The nut connecting the bar to a PC board was not
tight.
Disadvantages:
• Would lead to a failure of the high voltage power leaving the battery pack.
• A potential short hazard.

Battery Pack
Summary


Battery Pack Asm
\...
\Zone 4 Battery System
\Battery Pack
\Battery Pack Asm
Assembly Summary


Battery Pack Asm

Battery Pack Asm
Detailed Summary


Main Case Asm
\...
\Battery Pack
\Battery Pack Asm
\Main Case Asm
Assembly Summary


Main Case Asm

Main Case Asm

Main Case Asm
Detailed Summary


Case Bottom Stamping
\...
\Main Case Asm
\Case Bottom Stamping
\Case Bottom Stamping Process
Process Summary


Case Bottom Stamping

Assemble Bottom Stamping
\...
\Battery Pack Asm
\Main Case Asm
\Assemble Bottom Stamping
Process Summary


Assemble Bottom Stamping

Side Wall 1
\...
\Main Case Asm
\Side Wall 1
\Side Wall 1 Process
Process Summary


Side Wall 1

Side Wall 2
\...
\Main Case Asm
\Side Wall 2
Process Summary


Side Wall 2

Side Wall 3
\...
\Main Case Asm
\Side Wall 3
Process Summary


Side Wall 3

Side Wall 4
\...
\Main Case Asm
\Side Wall 4
Process Summary


Side Wall 4

Side Wall 5
\...
\Main Case Asm
\Side Wall 5
Process Summary


Side Wall 5

Side Wall 6
\...
\Main Case Asm
\Side Wall 6
Process Summary


Side Wall 6

Side Wall 7
\...
\Main Case Asm
\Side Wall 7
Process Summary


Side Wall 7

Side Wall 8
\...
\Main Case Asm
\Side Wall 8
Process Summary


Side Wall 8

Assemble Battery Case
\...
\Battery Pack Asm
\Main Case Asm
\Assemble Battery Case
Process Summary


Assemble Battery Case

Case, Bumper
\...
\Main Case Asm
\Case, Bumper
\Case, Bumper Process
Process Summary


Case, Bumper

Assemble Case, Bumper
\...
\Battery Pack Asm
\Main Case Asm
\Assemble Case, Bumper
Process Summary


Assemble Case, Bumper

HV Cable Brkt
\...
\Main Case Asm
\HV Cable Brkt
\HV Cable Brkt, Process
Process Summary


HV Cable Brkt

Mounting Block, Cooling Rack
\...
\Main Case Asm
\Mounting Block, Cooling Rack
\Mounting Block, Cooling Rack Process
Process Summary


Mounting Block, Cooling Rack

Assemble Case Brackets
\...
\Battery Pack Asm
\Main Case Asm
\Assemble Case Brackets
Process Summary


Assemble Case Brackets

Battery Pack Vent Asm
\...
\Battery Pack
\Battery Pack Asm
\Battery Pack Vent Asm
Assembly Summary



Detailed Summary


Vent Body Asm
\...
\Battery Pack Asm
\Vent Body Asm
Assembly Summary


Vent Body Asm

Vent Body Asm
Detailed Summary


Vent Body
\...
\Vent Body Asm
\Vent Body
\Vent Body Process
Process Summary


Vent Body

Assemble Vent Body
\...
\Vent Body Asm
\Assemble Vent Body
Process Summary


Assemble Vent Body

Vent Inner Cover
\...
\Vent Inner Cover
\Vent Inner Cover, Process
Process Summary


Vent Inner Cover

Assemble Inner Cover
\...
\Battery Pack Asm
\Assemble Inner Cover
Process Summary


Assemble Inner Cover

Vent Outer Cover
\...
\Vent Outer Cover
\Vent Outer Cover, Process
Process Summary


Vent Outer Cover

Vent Seal
\...
\Vent Seal
\Vent Seal, Process
Process Summary


Vent Seal
Assemble Cover/Seal
\...
\Battery Pack Asm
\Assemble CoverSeal
Process Summary

Assemble Cover/Seal
Cooling Rack Asm
\...
\Battery Pack
\Battery Pack Asm
\Cooling Rack Asm
Assembly Summary

Cooling Rack Asm
Cooling Rack Asm
Detailed Summary

Expansion Valve Asm
\...
\Battery Pack Asm
\Cooling Rack Asm
\Expansion Valve Asm
Assembly Summary

Expansion Valve Asm
Expansion Valve Asm
Detailed Summary

Valve Connector Asm
\...
\Cooling Rack Asm
\Valve Connector Asm
Assembly Summary

Valve Connector Asm
Valve Connector Asm
Detailed Summary

Port Seal Cap
\...
\Port Seal Cap
\Port Seal Cap Process
Process Summary

Port Seal Cap
Valve Connector Body
\...
\Valve Connector Body
\Valve Connector Body Process
Process Summary

Valve Connector Body
Assemble Valve Connector
\...
\Assemble Valve Connector
Process Summary

Assemble Valve Connector
Valve Cover, Expansion
\...
\Cooling Rack Asm
\Valve Cover, Expansion
Assembly Summary

Detailed Summary

Valve Cover Molding
\...
\Valve Cover Molding
\Valve Cover Molding Process
Process Summary

Valve Cover Molding
Assemble Valve Cover
\...
\Assemble Valve Cover
Process Summary

Assemble Valve Cover
Assemble Expansion Valve
\...
\Cooling Rack Asm
\Assemble Expansion Valve
Process Summary

Assemble Expansion Valve
Battery- Vehicle Controller Cable
\...
\Battery Pack Asm
\Cooling Rack Asm
\Battery- Vehicle Controller Cable
Assembly Summary

Detailed Summary

Vehicle Controller Cable Asm
\...
\Cooling Rack Asm
\Battery- Vehicle Controller Cable
\Vehicle Controller Cable Asm
Process Summary

Vehicle Controller Cable Asm
Click Here for Munro & Associates Wire Harness Report on Vehicle
Controller Wire Harness
Cooling Asm
\...
\Battery Pack Asm
\Cooling Rack Asm
\Cooling Asm
Assembly Summary

Cooling Asm
Cooling Asm
Detailed Summary

Recirculation Tube Asm
\...
\Cooling Rack Asm
\Cooling Asm
\Recirculation Tube Asm
Assembly Summary

Detailed Summary

Tube Cross Brace
\...
\Tube Cross Brace
\Tube Cross Brace Process
Process Summary

Tube Cross Brace
Fin Cross Tube
\...
\Fin Cross Tube
\Fin Cross Tube Process
Process Summary

Fin Cross Tube
End Plug, Tube
\...
\End Plug, Tube
\End Plug Process
Process Summary

End Plug, Tube
Assemble Recirculation Tube
\...
\Cooling Asm
\Assemble Recirculation Tube
Process Summary

Assemble Recirculation Tube
Cooling Extrusions
\...
\Cooling Asm
\Cooling Extrusions
\Cut Extrusions
Process Summary

Cooling Extrusions
Valve Tube Asm
\...
\Cooling Rack Asm
\Cooling Asm
\Valve Tube Asm
Assembly Summary

Valve Tube Asm
Valve Tube Asm
Valve Tube Asm
Detailed Summary

Tube Cross Brace
\...
\Valve Tube Asm
\Tube Cross Brace
\Tube Cross Brace Process
Process Summary

Tube Cross Brace
Cross Tube
\...
\Valve Tube Asm
\Cross Tube
\Cross Tube Process
Process Summary

Cross Tube
End Plug, Tube
\...
\Valve Tube Asm
\End Plug, Tube
\End Plug Process
Process Summary

End Plug, Tube
Assemble Cross Tubes
\...
\Cooling Asm
\Valve Tube Asm
\Assemble Cross Tubes
Process Summary

Assemble Cross Tubes
Tube Divider
\...
\Valve Tube Asm
\Tube Divider
\Tube Divider Process
Process Summary

Tube Divider
Tube Manifold
\...
\Cooling Asm
\Valve Tube Asm
\Tube Manifold
Assembly Summary

Tube Manifold
Tube Manifold
Detailed Summary

Manifold Plug
\...
\Tube Manifold
\Manifold Plug
\Manifold Plug Process
Process Summary

Manifold Plug
Manifold Block
\...
\Tube Manifold
\Manifold Block
\Manifold Block Process
Process Summary

Manifold Block
Assemble to Fixture
\...
\Valve Tube Asm
\Tube Manifold
\Assemble to Fixture
Process Summary

Assemble to Fixture
Tube Support
\...
\Valve Tube Asm
\Tube Support
\Tube Support Process
Process Summary

Tube Support
Assemble to Fixture
\...
\Cooling Asm
\Valve Tube Asm
Process Summary

Assemble to Fixture
Tube 1 & 2
\...
\Valve Tube Asm
\Tube 1 & 2
\Tube 1 & 2 Process
Process Summary

Tube 1 & 2
Tube 3 & 4
\...
\Valve Tube Asm
\Tube 3 & 4
\Tube 3 & 4 Process
Process Summary

Tube 3 & 4
Tube 5 & 6
\...
\Valve Tube Asm
\Tube 5 & 6
\Tube 5 & 6 Process
Process Summary

Tube 5 & 6
Tube 7
\...
\Valve Tube Asm
\Tube 7
\Tube 7 Process
Process Summary

Tube 7
Assemble to Fixture
\...
\Cooling Asm
\Valve Tube Asm
Process Summary

Assemble to Fixture
Assemble Rack
\...
\Cooling Rack Asm
\Cooling Asm
\Assemble Rack
Process Summary

Assemble Rack
Heater Asm
\...
\Battery Pack Asm
\Cooling Rack Asm
\Heater Asm
Assembly Summary

Heater Asm
Heater Asm
Detailed Summary

Base Extrusion
\...
\Heater Asm
\Base Extrusion
\Base Extrusion Process
Process Summary

Base Extrusion
Heating Element Asm
\...
\Cooling Rack Asm
\Heater Asm
\Heating Element Asm
Assembly Summary

Heating Element Asm
Heating Element Asm
Detailed Summary

Assemble Heating Element
\...
\Heater Asm
\Heating Element Asm
\Assemble Heating Element
Process Summary

Assemble Heating Element
Click Here for Munro & Associates Wire Harness Report on Heater
Harness
Assemble Heater
\...
\Cooling Rack Asm
\Heater Asm
\Assemble Heater
Process Summary

Assemble Heater
Assemble Cooling Rack
\...
\Battery Pack Asm
\Cooling Rack Asm
\Assemble Cooling Rack
Process Summary

Assemble Cooling Rack
Cell Control Module Asm
\...
\Battery Pack
\Battery Pack Asm
\Cell Control Module Asm
Assembly Summary

Detailed Summary

High Voltage Module Asm
\...
\Battery Pack Asm
\High Voltage Module Asm
Assembly Summary

Detailed Summary

HV Module Housing Asm
\...
\HV Module Housing Asm
Assembly Summary

Detailed Summary

Housing, HV Module
\...
\Housing, HV Module
\Housing, HV Module, Process
Process Summary

Housing, HV Module
Assemble HV Module Housing
\...
\Assemble HV Module Housing
Process Summary

Assemble HV Module Housing
Assemble Power Buss Relay
\...
\Assemble Power Buss Relay
Process Summary

Assemble Power Buss Relay
Buss PC Board Cover
\...
\Buss PC Board Cover
\Buss PC Board Cover, Process
Process Summary

Buss PC Board Cover
Assemble Buss PC Board Cover
\...
\Assemble Buss PC Board Cover
Process Summary

Assemble Buss PC Board Cover
Assemble PC Board, Buss
\...
\Assemble PC Board, Buss
Process Summary

Assemble PC Board, Buss
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Assemble PC Board, Control Module
\...
\Assemble PC Board, Control Module
Process Summary

Assemble PC Board, Control Module
Click Here for TechInsights Electronics Report on PC Board, Control

Module
Assemble Resistor - Relay 1
\...
\Assemble Resistor - Relay 1
Process Summary

Assemble Resistor - Relay 1
Terminal Retainer, Power Relay
\...
\Terminal Retainer, Power Relay
\Terminal Retainer, Process
Process Summary

Terminal Retainer, Power Relay
Assemble Terminal Retainer, Power Relay
\...
\Assemble Terminal Retainer, Power Relay
Process Summary

Assemble Terminal Retainer, Power Relay
Assemble Power Relay - 1
\...
\Assemble Power Relay - 1
Process Summary

Assemble Power Relay - 1
Cable Buss - Fuse 2 Asm
\...
\Cable Buss - Fuse 2 Asm
Assembly Summary

Detailed Summary

Main Buss Bar
\...
\Main Buss Bar
\Main Buss Bar, Process
Process Summary

Main Buss Bar
Small Spade Connector
\...
\Small Spade Connector
\Small Spade Connector, Process
Process Summary

Large Spade Connector
\...
\Large Spade Connector
\Large Spade Connector, Process
Process Summary

Large Spade Connector
Assemble Cable Buss - Fuse 2
\...
\Assemble Cable Buss - Fuse 2
Process Summary

\...
\Assemble Cable Buss - Fuse 2
Process Summary

Assemble Fuse, 350 A, 450 V
\...
\Assemble Fuse, 350 A, 450 V
Process Summary

Assemble Fuse, 350 A, 450 V
Internal Buss Bar Asm
\...
\Internal Buss Bar Asm
Assembly Summary

Detailed Summary

Buss Bar 4
\...
\Buss Bar 4
\Buss Bar 4, Process
Process Summary

Buss Bar 4
Terminal 4
\...
\Terminal 4
\Terminal 4, Process
Process Summary

Terminal 4
Assemble Internal Buss Bar
\...
\Assemble Internal Buss Bar
Process Summary

\...
Process Summary

Assemble Module Buss Cable
\...
\Assemble Module Buss Cable
Process Summary

Assemble Module Buss Cable
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Cable Asm
Fuse Buss 1 Asm
\...
\Fuse Buss 1 Asm
Assembly Summary

Fuse Buss 1 Asm
Fuse Buss 1 Asm
Detailed Summary

Main Buss F1
\...
\Fuse Buss 1 Asm
\Main Buss F1
\Main Buss F1, Process
Process Summary

Main Buss F1
\...
\Fuse Buss 1 Asm
\Small Spade Connector
\Small Spade Connector, Process
Process Summary

\...
\Fuse Buss 1 Asm
Process Summary

Assemble Fuse Buss 1
\...
\Assemble Fuse Buss 1
Process Summary

Assemble Fuse Buss 1
Module Connector Body
\...
\Module Connector Body
\Module Connector Body, Process
Process Summary

Module Connector Body
Assemble Module Connector Body
\...
\Assemble Module Connector Body
Process Summary

Assemble Module Connector Body
Main Connector Buss Asm
\...
\Main Connector Buss Asm
Assembly Summary

Detailed Summary

Main Connector Body
\...
\Main Connector Body
\Main Connector Body, Process
Process Summary

Main Connector Body
Lower Connector Buss Asm
\...
\Lower Connector Buss Asm
Assembly Summary

Detailed Summary

Lower Connector Buss
\...
\Lower Connector Buss
\Lower Connector Buss, Process
Process Summary

Lower Connector Buss
3 Spade Terminal
\...
\3 Spade Terminal
\3 Spade Terminal, Process
Process Summary

3 Spade Terminal
Connector Spade Terminal
\...
\Connector Spade Terminal
\Connector Spade Terminal, Process
Process Summary

Connector Spade Terminal
Assemble Lower Connector Buss
\...
\Assemble Lower Connector Buss
Process Summary

Assemble Lower Connector Buss
Upper Connector Buss Asm
\...
\Upper Connector Buss Asm
Assembly Summary

Detailed Summary

Upper Connector Buss
\...
\Upper Connector Buss
\Upper Connector Buss, Process
Process Summary

Upper Connector Buss
2 Spade Terminal
\...
\2 Spade Terminal
\2 Spade Terminal, Process
Process Summary

2 Spade Terminal
Connector Terminal 4
\...
\Connector Terminal 4
\Connector Terminal 4, Process
Process Summary

Connector Terminal 4
Assemble Upper Connector Buss
\...
\Assemble Upper Connector Buss
Process Summary

Assemble Upper Connector Buss
Assemble Main Connector Buss
\...
\Assemble Main Connector Buss
Process Summary

\...
\Assemble Main Connector Buss
Process Summary

Harness Tray Asm
\...
\Harness Tray Asm
Assembly Summary

Harness Tray Asm
Harness Tray Asm
Detailed Summary

Harness Tray 2
\...
\Harness Tray Asm
\Harness Tray 2
\Harness Tray 2, Process
Process Summary

Harness Tray 2
Assemble Harness Tray
\...
\Harness Tray Asm
\Assemble Harness Tray
Process Summary

Assemble Harness Tray
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Click Here for Munro & Associates Wire Harness Report on Rack Harness
Click Here for Munro & Associates Wire Harness Report on Main Connector
Assemble Harness Tray to Module
\...
\Assemble Harness Tray to Module
Process Summary

Assemble Harness Tray to Module
High Voltage Module Cover
\...
\High Voltage Module Cover
\High Voltage Module Cover, Process
Process Summary

High Voltage Module Cover
Assemble High Voltage Module Cover
\...
\Assemble High Voltage Module Cover
Process Summary

Assemble High Voltage Module Cover
Cell Control Board Asm
\...
\Battery Pack Asm
\Cell Control Board Asm
Assembly Summary

Detailed Summary

Cell Control Cover
\...
\Cell Control Cover
\Cell Control Cover. Process
Process Summary

Cell Control Cover
Bottom Cover, Cell Control
\...
\Bottom Cover, Cell Control
\Bottom Cover, Cell Control , Process
Process Summary

Bottom Cover, Cell Control
Assemble Cell Control
\...
\Assemble Cell Control
Process Summary

Assemble Cell Control
Click Here for TechInsights Electronics Report on PC Board, Cell Control

Module
Assemble Final Control Module
\...
\Battery Pack Asm
\Assemble Final Control Module
Process Summary

Assemble Final Control Module
Click Here for Munro & Associates Wire Harness Report on Main
Connector Asm, Cable
Assemble Pack Controls
\...
\Battery Pack
\Battery Pack Asm
\Assemble Pack Controls
Process Summary

Assemble Pack Controls
HV Battery Module, Asm
\...
\Battery Pack
\Battery Pack Asm
\HV Battery Module, Asm
Assembly Summary

Detailed Summary

Six Cell Stack, Asm
\...
\Battery Pack Asm
\Six Cell Stack, Asm
Assembly Summary

Six Cell Stack, Asm
Six Cell Stack, Asm
Detailed Summary

Insulator, Six Cell
\...
\Insulator, Six Cell
\Insulator, Six Cell Process
Process Summary

Insulator, Six Cell
Cell Insulated Asm
\...
\Cell Insulated Asm
Assembly Summary

Cell Insulated Asm
Cell Insulated Asm
Detailed Summary

Lithium Ion Cell Asm
\...
\Cell Insulated Asm
\Lithium Ion Cell Asm
Assembly Summary

Detailed Summary

Battery Can, Al
\...
\Battery Can, Al
\Battery Can Process
Process Summary

Battery Can, Al
Cell Stack Asm
\...
\Cell Insulated Asm
\Cell Stack Asm
Assembly Summary

Cell Stack Asm
Cell Stack Asm
Detailed Summary

Winding Stack Asm
\...
\Cell Stack Asm
\Winding Stack Asm
Assembly Summary

Winding Stack Asm
Winding Stack Asm
Detailed Summary

Outer Cell Winding Asm
\...
\Cell Stack Asm
\Winding Stack Asm
\Outer Cell Winding Asm
Assembly Summary

Detailed Summary

Outer Cell Cathode Asm
\...
\Winding Stack Asm
\Outer Cell Cathode Asm
Assembly Summary

Detailed Summary

Cathode Active Paste
\...
\Cathode Active Paste
\Assemble Cathode Paste
Process Summary

Assemble Cathode
\...
\Assemble Cathode
Process Summary

Assemble Cathode
Outer Cell Anode Asm
\...
\Winding Stack Asm
\Outer Cell Anode Asm
Assembly Summary

Detailed Summary

Anode Active Paste
\...
\Anode Active Paste
\Assemble Anode Paste
Process Summary

Anode Active Paste
Assemble Anode
\...
\Assemble Anode
Process Summary

Assemble Anode
Outer Cell Ground Protector Asm
\...
\Winding Stack Asm
\Outer Cell Ground Protector Asm
Assembly Summary

Detailed Summary

Ground Protector
\...
\Ground Protector
\Ground Protector Process
Process Summary

Ground Protector
Assemble Ground Protector
\...
\Assemble Ground Protector
Process Summary

Assemble Ground Protector
Assemble Outer Cell
\...
\Winding Stack Asm
\Assemble Outer Cell
Process Summary

Assemble Outer Cell
Inner Cell Winding Asm
\...
\Cell Stack Asm
\Winding Stack Asm
\Inner Cell Winding Asm
Assembly Summary

Detailed Summary

Inner Cell Cathode Asm
\...
\Winding Stack Asm
\Inner Cell Cathode Asm
Assembly Summary

Detailed Summary

\...
\Cathode Active Paste
\Assemble Cathode Paste
Process Summary

Assemble Cathode
\...
\Assemble Cathode
Process Summary

Assemble Cathode
Inner Cell Anode Asm
\...
\Winding Stack Asm
\Inner Cell Anode Asm
Assembly Summary

Detailed Summary

Anode Active Paste
\...
\Anode Active Paste
\Assemble Anode Paste
Process Summary

Anode Active Paste
Assemble Anode
\...
\Assemble Anode
Process Summary

Assemble Anode
Assemble Inner Cell
\...
\Winding Stack Asm
\Assemble Inner Cell
Process Summary

Assemble Inner Cell
Winding Stack Asm
\...
\Cell Stack Asm
\Winding Stack Asm
\Winding Stack Asm
Process Summary

Winding Stack Asm
Cover Asm
\...
\Cell Stack Asm
\Cover Asm
Assembly Summary

Cover Asm
Cover Asm
Cover Asm
Detailed Summary

Cathode Terminal Asm
\...
\Cell Stack Asm
\Cover Asm
\Cathode Terminal Asm
Assembly Summary

Detailed Summary

Terminal Base
\...
\Terminal Base
\Terminal Base, Process
Process Summary

Terminal Base
Terminal Al
\...
\Terminal Al
\Terminal Al, Process
Process Summary

Terminal Al
Assemble Cathode Terminal
\...
\Cover Asm
\Assemble Cathode Terminal
Process Summary

Assemble Cathode Terminal
Spacer, Cathode Terminal
\...
\Cover Asm
\Spacer, Cathode Terminal
\Spacer, Process
Process Summary

Spacer, Cathode Terminal
Anode Terminal Asm
\...
\Cell Stack Asm
\Cover Asm
\Anode Terminal Asm
Assembly Summary

Anode Terminal Asm
Anode Terminal Asm
Detailed Summary

Terminal Base
\...
\Anode Terminal Asm
\Terminal Base
\Terminal Base, Process
Process Summary

Terminal Base
Terminal Al-Cu
\...
\Cover Asm
\Anode Terminal Asm
\Terminal Al-Cu
Assembly Summary

Terminal Al-Cu
Terminal Al-Cu
Detailed Summary

Terminal Al-2
\...
\Terminal Al-Cu
\Terminal Al-2
\Terminal Al-2, Process
Process Summary

Terminal Al-2
Terminal Cu
\...
\Terminal Al-Cu
\Terminal Cu
\Terminal Cu, Process
Process Summary

Terminal Cu
Assemble Terminal Al-Cu
\...
\Anode Terminal Asm
\Terminal Al-Cu
\Assemble Terminal Al-Cu
Process Summary

Assemble Terminal Al-Cu
Assemble Anode Terminal
\...
\Cover Asm
\Anode Terminal Asm
\Assemble Anode Terminal
Process Summary

Assemble Anode Terminal
Pressure Vent Asm
\...
\Cell Stack Asm
\Cover Asm
\Pressure Vent Asm
Assembly Summary

Pressure Vent Asm
Pressure Vent Asm
Detailed Summary

Vent Cover
\...
\Pressure Vent Asm
\Vent Cover
\Vent Cover, Process
Process Summary

Vent Cover
Vent Body
\...
\Pressure Vent Asm
\Vent Body
\Vent Body Process
Process Summary

Vent Body
Assemble Pressure Vent
\...
\Cover Asm
\Pressure Vent Asm
\Assemble Pressure Vent
Process Summary

Assemble Pressure Vent
Cover Plate Welded Asm
\...
\Cell Stack Asm
\Cover Asm
\Cover Plate Welded Asm
Assembly Summary

Detailed Summary

Cover Stamping
\...
\Cover Stamping
\Cover Stamping Process
Process Summary

Cover Stamping
Safety Vent
\...
\Safety Vent
\Safety Vent, Process
Process Summary

Safety Vent
Vent Diaphragm
\...
\Vent Diaphragm
\Vent Diaphragm Process
Process Summary

Vent Diaphragm
Fill Hole Button
\...
\Fill Hole Button
\Fill Hole Button Process
Process Summary

Fill Hole Button
Assemble Cover Plate
\...
\Cover Asm
\Assemble Cover Plate
Process Summary

Assemble Cover Plate
Assemble Cover Terminals
\...
\Cell Stack Asm
\Cover Asm
\Assemble Cover Terminals
Process Summary

Assemble Cover Terminals
Cathode Pin Insulator
\...
\Cover Asm
\Cathode Pin Insulator
\Pin Insulator, Process
Process Summary

Cathode Pin Insulator
Cathode Clamp Plate
\...
\Cover Asm
\Cathode Clamp Plate
\Cathode Clamp Plate, Process
Process Summary

Cathode Clamp Plate
Cathode Rake Insulator
\...
\Cover Asm
\Cathode Rake Insulator
\Cathode Rake Insulator, Process
Process Summary

Cathode Rake Insulator
Assemble Cathode Clamp
\...
\Cell Stack Asm
\Cover Asm
\Assemble Cathode Clamp
Process Summary

Assemble Cathode Clamp
Anode Clamp Plate
\...
\Cover Asm
\Anode Clamp Plate
\Anode Clamp Plate, Process
Process Summary

Anode Clamp Plate
Anode Rake Insulator
\...
\Cover Asm
\Anode Rake Insulator
\Anode Rake Insulator, Process
Process Summary

Anode Rake Insulator
Anode Clamp Plate Asm
\...
\Cell Stack Asm
\Cover Asm
\Anode Clamp Plate Asm
Process Summary

Anode Clamp Plate Asm
Cathode Collector Rake
\...
\Cover Asm
\Cathode Collector Rake
\Cathode Collector Rake Process
Process Summary

Cathode Collector Rake
Anode Collector Rake
\...
\Cover Asm
\Anode Collector Rake
\Anode Raked, Process
Process Summary

Anode Collector Rake
Collector Rake Asm
\...
\Cell Stack Asm
\Cover Asm
\Collector Rake Asm
Process Summary

Collector Rake Asm
Anode Collector Side Insulator
\...
\Cover Asm
\Anode Collector Side Insulator
\Anode Side Insulator Process
Process Summary

Anode Collector Side Insulator
Collector Insulator
\...
\Cover Asm
\Collector Insulator
\Collector Insulator Process
Process Summary

Collector Insulator
Collector Insulator Asm
\...
\Cell Stack Asm
\Cover Asm
\Collector Insulator Asm
Process Summary

Collector Insulator Asm
Cover to Winding Weld Asm
\...
\Cell Stack Asm
\Cover to Winding Weld Asm
Process Summary

Cover to Winding Weld Asm
End and Side Insulator Asm
\...
\Cell Stack Asm
\End and Side Insulator Asm
Process Summary

End and Side Insulator Asm
Current Collector Insulator
\...
\Cell Stack Asm
\Current Collector Insulator
\Current Collector Insulator Process
Process Summary

Current Collector Insulator
Current Collector Insulator Asm
\...
\Cell Stack Asm
\Current Collector Insulator Asm
Process Summary

Current Collector Insulator Asm
Cell Stack to Can Asm
\...
\Cell Insulated Asm
\Cell Stack to Can Asm
Process Summary

Cell Stack to Can Asm
Fill, Form, and Test
\...
\Cell Insulated Asm
\Fill, Form, and Test
Process Summary

Fill, Form, and Test
Top Insulator, Label Asm
\...
\Cell Insulated Asm
\Top Insulator, Label Asm
Assembly Summary

Detailed Summary

Top Insulator, Label Process
\...
\Cell Insulated Asm
\Top Insulator, Label Asm
\Top Insulator, Label Process
Process Summary

Top Insulator, Label Process
Insulator to Cell
\...
\Cell Insulated Asm
\Insulator to Cell
Process Summary

Insulator to Cell
Stack and Insulate, 6 Cells
\...
\Stack and Insulate, 6 Cells
Process Summary

Stack and Insulate, 6 Cells
Center Cross Brace, Module
\...
\Center Cross Brace, Module
\Center Cross Brace, Process
Process Summary

Center Cross Brace, Module
Module End Plate
\...
\Module End Plate
\Module End Plate, Process
Process Summary

Module End Plate
Assemble End Plates, Cells
\...
\Battery Pack Asm
\Assemble End Plates, Cells
Process Summary

Assemble End Plates, Cells
Module Front Cover
\...
\Module Front Cover
\Module Front Cover, Process
Process Summary

Module Front Cover
Module Rear Cover
\...
\Module Rear Cover
\Module Rear Cover, Process
Process Summary

Module Rear Cover
Assemble Module Cover
\...
\Battery Pack Asm
\Assemble Module Cover
Process Summary

Assemble Module Cover
Bottom Cover Asm
\...
\Battery Pack Asm
\Bottom Cover Asm
Assembly Summary

Bottom Cover Asm
Bottom Cover Asm
Detailed Summary

Bottom Al Plate
\...
\Bottom Cover Asm
\Bottom Al Plate
\Bottom Al Plate, Process
Process Summary

Bottom Al Plate
Assemble Bottom Cover
\...
\Bottom Cover Asm
\Assemble Bottom Cover
Process Summary

\...
\Battery Pack Asm
\Assemble Bottom Cover
Process Summary

Buss and Sense Asm
\...
\Battery Pack Asm
\Buss and Sense Asm
Assembly Summary

Buss and Sense Asm
Buss and Sense Asm
Detailed Summary

Buss Frame Asm
\...
\Buss and Sense Asm
\Buss Frame Asm
Assembly Summary

Buss Frame Asm
Buss Frame Asm
Detailed Summary

Buss Frame
\...
\Buss Frame Asm
\Buss Frame
\Buss Frame Process
Process Summary

Buss Frame
Harness Frame
\...
\Buss Frame Asm
\Harness Frame
\Harness Frame Process
Process Summary

Harness Frame
Cable Clamp Half
\...
\Buss Frame Asm
\Cable Clamp Half
\Cable Clamp Half, Process
Process Summary

Cable Clamp Half
Buss Frame Asm Process
\...
\Buss and Sense Asm
\Buss Frame Asm
\Buss Frame Asm Process
Process Summary

Buss Frame Asm Process
Assemble Module Harness
\...
\Buss and Sense Asm
\Assemble Module Harness
Process Summary

Assemble Module Harness
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Harness Asm
Buss Connector 1
\...
\Buss and Sense Asm
\Buss Connector 1
\Buss Connector 1, Process
Process Summary

Buss Connector 1
Buss Connector 2
\...
\Buss and Sense Asm
\Buss Connector 2
Process Summary

Buss Connector 2
Buss Connector 3
\...
\Buss and Sense Asm
\Buss Connector 3
Process Summary

Buss Connector 3
Buss Connector 4
\...
\Buss and Sense Asm
\Buss Connector 4
Process Summary

Buss Connector 4
Assemble Buss Connector
\...
\Buss and Sense Asm
\Assemble Buss Connector
Process Summary

Assemble Buss Connector
Module Bus Terminal Asm
\...
\Buss and Sense Asm
\Module Bus Terminal Asm
Assembly Summary

Detailed Summary

Connector Body 1
\...
\Connector Body 1
\Connector Body 1, Process
Process Summary

Connector Body 1
Connector Blade 1
\...
\Connector Blade 1
\Connector Blade 1, Process
Process Summary

Connector Blade 1
Interconnect Buss 2
\...
\Interconnect Buss 2
\Interconnect Buss 2, Process
Process Summary

Interconnect Buss 2
Assemble Module Bus Terminal
\...
\Buss and Sense Asm
\Assemble Module Bus Terminal
Process Summary

Assemble Module Bus Terminal
Connection Cable Asm
\...
\Buss and Sense Asm
\Connection Cable Asm
Assembly Summary

Detailed Summary

Interconnect Buss 1
\...
\Interconnect Buss 1
\Interconnect Buss 1, Process
Process Summary

Interconnect Buss 1
Assemble Connection Cable
\...
\Buss and Sense Asm
\Assemble Connection Cable
Process Summary

Assemble Connection Cable
Click Here for Munro & Associates Wire Harness Report on Module Buss
Cable Asm
Assemble Buss Connectors
\...
\Buss and Sense Asm
\Assemble Buss Connectors
Process Summary

Assemble Buss Connectors
Assemble Thermistor Leads
\...
\Buss and Sense Asm
\Assemble Thermistor Leads
Process Summary

Assemble Thermistor Leads
Assemble Buss and Sense
\...
\Battery Pack Asm
\Assemble Buss and Sense
Process Summary

Assemble Buss and Sense
Protective Cover, Module
\...
\Protective Cover, Module
\Protective Cover, Process
Process Summary

Protective Cover, Module
Module Cell Controller Asm
\...
\Battery Pack Asm
\Module Cell Controller Asm
Assembly Summary

Detailed Summary

Front Cover, Controller
\...
\Front Cover, Controller
Assembly Summary

Detailed Summary

Front Cover
\...
\Front Cover
\Front Cover, Process
Process Summary

Front Cover
Assemble Label
\...
\Assemble Label
Process Summary

Assemble Label
Rear Cover, Controller
\...
\Rear Cover, Controller
\Rear Cover, Process
Process Summary

Rear Cover, Controller
Assemble Cell Controller
\...
\Assemble Cell Controller
Process Summary

Assemble Cell Controller
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Assemble Cover, Controller
\...
\Battery Pack Asm
\Assemble Cover, Controller
Process Summary

Assemble Cover, Controller
End Tie Bracket, Pack Asm
\...
\Battery Pack Asm
\End Tie Bracket, Pack Asm
\End Tie Bracket Process
Process Summary

End Tie Bracket, Pack Asm
Middle Tie Bracket, Pack Asm
\...
\Battery Pack Asm
\Middle Tie Bracket, Pack Asm
\MiddleTie Bracket Process
Process Summary

Middle Tie Bracket, Pack Asm
Assemble Module to Pack
\...
\Battery Pack
\Battery Pack Asm
\Assemble Module to Pack
Process Summary

Assemble Module to Pack
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Management Harness Asm
Click Here for Munro & Associates Wire Harness Report on HV
Interconnect Cable
Battery Pack Lid Asm
\...
\Battery Pack
\Battery Pack Asm
\Battery Pack Lid Asm
Assembly Summary

Detailed Summary

Pack Lid Stamping
\...
\Pack Lid Stamping
\Pack Lid Stamping, Process
Process Summary

Pack Lid Stamping
Assemble Pack Lid
\...
\Battery Pack Asm
\Assemble Pack Lid
Process Summary

Assemble Pack Lid
Assemble Lid
\...
\Battery Pack
\Battery Pack Asm
\Assemble Lid
Process Summary

Assemble Lid
End of line Test
\...
\Battery Pack
\End of line Test
Process Summary

End of line Test
Battery Installation
\...
\Battery Pack
\Battery Installation
Process Summary

Battery Installation
Power Electronics Overview
The battery electronics consist of four main control

enclosures, Convenience charging electronics (Charging
Module Asm), Electrical machine electronics (Power
Module Asm), Range Extender electrical machine
electronics (AC/DC inverter, Generator Asm), and the
Charging interface module. The Mode 2 Charging cable is
the remaining item in the battery electronics overview.
All of the modules except the charging interface module

are housed in Aluminum die cast enclosures. The high
voltage connections for the motor, extended range
generator and the battery pack are limited to these
aluminum modules. The charging interface module is a low
voltage control module interacting with the components
related to the charging of the battery pack.

Description:
• Safe connectors for high voltage cables and electronic modules.
• High voltage interlock system.
Advantages:
• Interlock loop will disconnect the high voltage before a connector is removed for service.
• All interlocks must be connected for the power to be restored, after servicing the system.
Description:
• Bridge for high-voltage interlock loop.
• Removing the mechanical locking.
Advantages:
• Before the high-voltage connector can be disconnected, the bridge for the high-voltage
interlock loop must first be removed..
Power Electronics
Summary

Power Module Asm
\...
\Power Electronics
\Power Module Asm
Assembly Summary

Power Module Asm
Power Module Asm
Detailed Summary

Inner Asm, Power Module
\...
\Power Electronics
\Power Module Asm
\Inner Asm, Power Module
Assembly Summary

Detailed Summary

Inner Plate w/Silicone Bead Asm, Inner
\...
\Power Module Asm
\Inner Plate wSilicone Bead Asm, Inner
Assembly Summary

Detailed Summary

Inner Plate, Inner Plate w/Silicone Bead
\...
\Inner Plate, Inner Plate wSilicone Bead
\Inner Plate, Inner Plate wSilicone Bead Process
Process Summary

Inner Plate, Inner Plate w/Silicone Bead
Assemble Inner Plate, Inner Plate
w/Silicone Bead
\...
\Assemble Inner Plate, Inner Plate wSilicone Bead
Process Summary

Assemble Inner Plate, Inner Plate
w/Silicone Bead
Nozzle w/Components Asm, Inner
\...
\Power Module Asm
\Nozzle wComponents Asm, Inner
Assembly Summary

Detailed Summary

Nozzle, Nozzle w/Components
\...
\Nozzle, Nozzle wComponents
\Nozzle Process
Process Summary

Nozzle, Nozzle w/Components
Assemble Nozzle
\...
\Assemble Nozzle
Process Summary

Assemble Nozzle
Assemble Nozzle w/Components
\...
\Power Module Asm
\Assemble Nozzle wComponents
Process Summary

Assemble Nozzle w/Components
DC Power Connector Asm 1, Inner
\...
\Power Module Asm
\DC Power Connector Asm 1, Inner
Assembly Summary

Detailed Summary

Power Connector Housing, DC Power
Connector
\...
\Power Connector Housing, DC Power Connector
\Power Connector Housing Process
Process Summary

Connector
Assemble DC Power Connector
\...
\Assemble DC Power Connector
Process Summary

Click Here for Munro & Associates Wire Harness Report on DC Power
Connector 1 Harness Asm
\...
\Power Module Asm
Assembly Summary

Detailed Summary

Connector
\...
Process Summary

Connector
\...
Process Summary

\...
\Power Module Asm
Assembly Summary

Detailed Summary

Connector
\...
Process Summary

Connector
\...
Process Summary

Assemble DC Power Connectors
\...
\Power Module Asm
\Assemble DC Power Connectors
Process Summary

Assemble DC Power Connectors
Assemble Bottom Board 2
\...
\Power Module Asm
\Assemble Bottom Board 2
Process Summary

Assemble Bottom Board 2
Click Here for TechInsights Electronics Report on Bottom Board Asm 2
Assemble Bottom Board 1 and 3 w/Cast
Bracket
\...
\Power Module Asm
\Assemble Bottom Board 1 and 3 wCast Bracket
Process Summary

Assemble Bottom Board 1 and 3 w/Cast
Bracket
Click Here for TechInsights Electronics Report on Bottom Board 1 and 3

with Cast Bracket
Bottom Buss Bar Asm, Power Module
\...
\Power Module Asm
\Bottom Buss Bar Asm, Power Module
Assembly Summary

Detailed Summary

Mounting Bracket, Bottom Buss Bar
\...
\Mounting Bracket, Bottom Buss Bar
\Mounting Bracket Process
Process Summary

Mounting Bracket, Bottom Buss Bar
Buss Bar 1, Bottom Buss Bar
\...
\Buss Bar 1, Bottom Buss Bar
\Buss Bar 1 Process
Process Summary

\...
\Buss Bar 2, Bottom Buss Bar
\Buss Bar 2 Process
Process Summary

Assemble Bottom Buss Bar
\...
\Assemble Bottom Buss Bar
Process Summary

Assemble Bottom Buss Bar
Assemble Buss Bar
\...
\Power Module Asm
\Assemble Buss Bar
Process Summary

Assemble Buss Bar
Assemble Top Board 4 and 5 w/Cast
Bracket
\...
\Power Module Asm
\Assemble Top Board 4 and 5 wCast Bracket
Process Summary

Assemble Top Board 4 and 5 w/Cast
Bracket
Click Here for TechInsights Electronics Report on Top Board 4 and 5 with
Cast Bracket
Top Buss Bar Asm 3, Power Module
\...
\Power Module Asm
\Top Buss Bar Asm 3, Power Module
Assembly Summary

Detailed Summary

Mounting Bracket, Top Buss Bar Asm 3
\...
\Mounting Bracket, Top Buss Bar Asm 3
Process Summary

Mounting Bracket, Top Buss Bar Asm 3
Assemble Top Buss Bar 3
\...
\Assemble Top Buss Bar 3
Process Summary

Click Here for Munro & Associates Wire Harness Report on Black Wire Asm
Click Here for Munro & Associates Wire Harness Report on White Wire Asm
Assemble Top Buss Bar Asm 3, Power
Module
\...
\Power Module Asm
\Assemble Top Buss Bar Asm 3, Power Module
Process Summary

Module
\...
\Power Module Asm
Assembly Summary

Detailed Summary

Mounting Bracket w/Inserts, Top Buss Bar
2
\...
\Mounting Bracket wInserts, Top Buss Bar 2
Assembly Summary

2
2
Detailed Summary

Mounting Bracket, Top Buss Bar 2
\...
\Mounting Bracket, Top Buss Bar 2
Process Summary

Mounting Bracket, Top Buss Bar 2
Assemble Mounting Bracket w/Inserts
\...
\Assemble Mounting Bracket wInserts
Process Summary

Assemble Mounting Bracket w/Inserts
Buss Bar 1 Asm, Top Buss Bar 2
\...
\Buss Bar 1 Asm, Top Buss Bar 2
Assembly Summary

Detailed Summary

Buss Bar 1, Buss Bar 1
\...
\Buss Bar 1, Buss Bar 1
\Buss Bar 1 Process
Process Summary

Assemble Buss Bar 1
\...
\Assemble Buss Bar 1
Process Summary

Assemble Buss Bar 1
\...
Assembly Summary

Detailed Summary

\...
\Buss Bar 2, Buss Bar 1
\Buss Bar 2 Process
Process Summary

Assemble Buss Bar 2
\...
Process Summary

Assemble Buss Bar 2
\...
Process Summary

Module
\...
\Power Module Asm
Process Summary

Module
Top Board 2 w/Heat Sink Asm, Inner Power
Module
\...
\Power Module Asm
\Top Board 2 wHeat Sink Asm, Inner Power Module
Assembly Summary

Module
Module
Detailed Summary

Board 2 Standoff, Top Board 2 w/Heat Sink
\...
\Board 2 Standoff, Top Board 2 wHeat Sink
\Top Board 2 Standoff Process
Process Summary

Board 2 Standoff, Top Board 2 w/Heat Sink
Standoff Bracket w/Inserts Asm, Top Board
2 w/Heat
\...
\Standoff Bracket wInserts Asm, Top Board 2 wHeat
Assembly Summary

2 w/Heat
2 w/Heat
Detailed Summary

Standoff Bracket, Standoff Bracket
w/Inserts
\...
\Standoff Bracket, Standoff Bracket wInserts
\Standoff Bracket Process
Process Summary

Standoff Bracket, Standoff Bracket
w/Inserts
Assemble Standoff Bracket w/Inserts
\...
\Assemble Standoff Bracket wInserts
Process Summary

Assemble Standoff Bracket w/Inserts
Assemble Top Board 2 and Heat Sink
\...
\Assemble Top Board 2 and Heat Sink
Process Summary

Assemble Top Board 2 and Heat Sink
Click Here for TechInsights Electronics Report on Heat Sink Asm
Click Here for TechInsights Electronics Report on Top Board 2 Asm
Assemble Top Board 2 w/Heat Sink, Pwr
Module
\...
\Power Module Asm
\Assemble Top Board 2 wHeat Sink, Pwr Module
Process Summary

Assemble Top Board 2 w/Heat Sink,
Pwr Module
\...
\Power Module Asm
Assembly Summary

Detailed Summary

Back Plate, Top Buss Bar 1
\...
\Back Plate, Top Buss Bar 1
\Back Plate Process
Process Summary

Back Plate, Top Buss Bar 1
Buss Bar 1 w/Insert Asm, Top Buss Bar 1
\...
\Buss Bar 1 wInsert Asm, Top Buss Bar 1
Assembly Summary

Detailed Summary

Buss Bar 1, Top Buss Bar 1
\...
\Buss Bar 1, Top Buss Bar 1
\Buss Bar 1 Process
Process Summary

Assemble Buss Bar 1
\...
Process Summary

Assemble Buss Bar 1
Buss Bar 2 w/Insert Asm, Top Buss Bar
1
\...
Assembly Summary

1
1
Detailed Summary

\...
\Buss Bar 2 Process
Process Summary

Assemble Buss Bar 2
\...
Process Summary

Assemble Buss Bar 2
1
\...
Assembly Summary

1
1
Detailed Summary

\...
\Buss Bar 3 Process
Process Summary

Assemble Buss Bar 3
\...
Process Summary

Assemble Buss Bar 3
Front Plate w/Inserts Asm, Top Buss
Bar 1
\...
\Front Plate wInserts Asm, Top Buss Bar 1
Assembly Summary

Bar 1
Bar 1
Detailed Summary

Front Plate, Front Plate w/Inserts
\...
\Front Plate, Front Plate wInserts
\Front Plate Process
Process Summary

Front Plate, Front Plate w/Inserts
Assemble Front Plate w/Inserts
\...
\Assemble Front Plate wInserts
Process Summary

Assemble Front Plate w/Inserts
\...
Process Summary

Click Here for Munro & Associates Wire Harness Report on Motor Sensor
Harness
Top Bracket, Top Buss Bar 1
\...
\Top Bracket, Top Buss Bar 1
\Top Bracket Process
Process Summary

Top Bracket, Top Buss Bar 1
Assemble Top Bracket
\...
\Assemble Top Bracket
Process Summary

Assemble Top Bracket
Top Buss Bar Backing Asm, Power
Module
\...
\Power Module Asm
\Top Buss Bar Backing Asm, Power Module
Assembly Summary

Module
Module
Detailed Summary

Buss Bar Backing, Top Buss Bar
Backing
\...
\Buss Bar Backing, Top Buss Bar Backing
\Buss Bar Backing Process
Process Summary

Buss Bar Backing, Top Buss Bar
Backing
Assemble Top Buss Bar Backing
\...
\Assemble Top Buss Bar Backing
Process Summary

Assemble Top Buss Bar Backing
Module
\...
\Power Module Asm
Process Summary

Module
Top Board Asm 3 and Cover, Inner
Power Module
\...
\Power Module Asm
\Top Board Asm 3 and Cover, Inner Power Module
Assembly Summary

Power Module
Power Module
Detailed Summary

Assemble Top Board Asm 3 and Cover
\...
\Top Board Asm 3 and Cover, Inner Power Module
\Assemble Top Board Asm 3 and Cover
Process Summary

Assemble Top Board Asm 3 and Cover
Click Here for TechInsights Electronics Report on Top Board Asm 3
Assemble Top Board Asm 3, Inner
Power Module
\...
\Power Module Asm
\Assemble Top Board Asm 3, Inner Power Module
Process Summary

Assemble Top Board Asm 3, Inner
Power Module
Top Board 1 Standoff, Power Module
\...
\Top Board 1 Standoff, Power Module
\Top Board 1 Standoff Process
Process Summary

Top Board 1 Standoff, Power Module
Assemble Capacitor Bank Asm, Power
Module
\...
\Power Module Asm
\Assemble Capacitor Bank Asm, Power Module
Process Summary

Assemble Capacitor Bank Asm, Power
Module
Click Here for TechInsights Electronics Report on Capacitor Bank Asm
Capacitor Bank Cover, Power Module
\...
\Capacitor Bank Cover, Power Module
\Capacitor Bank Cover Process
Process Summary

Capacitor Bank Cover, Power Module
Assemble Capacitor Bank Cover,
Power Module
\...
\Power Module Asm
\Assemble Capacitor Bank Cover, Power Module
Process Summary

Assemble Capacitor Bank Cover,
Power Module
Top Board 2 Cover w/Inserts Asm, Inner
Power Module
\...
\Power Module Asm
\Top Board 2 Cover wInserts Asm, Inner Power Module
Assembly Summary

Top Board 2 Cover w/Inserts Asm,
Inner Power Module
Top Board 2 Cover w/Inserts Asm,
Inner Power Module
Detailed Summary

Cover, Top Board 2 Cover w/Inserts
\...
\Cover, Top Board 2 Cover wInserts
\Cover Process
Process Summary

Cover, Top Board 2 Cover w/Inserts
Assemble Top Board 2 Cover w/Inserts
\...
\Assemble Top Board 2 Cover wInserts
Process Summary

\...
\Power Module Asm
\Assemble Top Board 2 Cover wInserts
Process Summary

Top Board 1 w/Standoff Tape Asm, Inner
Power Module
\...
\Power Module Asm
\Top Board 1 wStandoff Tape Asm, Inner Power
Module Assembly Summary

Power Module
Power Module
Detailed Summary

Assemble Top Board 1 w/Standoff Tape
\...
\Top Board 1 wStandoff Tape Asm, Inner Power Module
\Assemble Top Board 1 wStandoff Tape
Process Summary

Assemble Top Board 1 w/Standoff Tape
Click Here for TechInsights Electronics Report on Top Board 1 Asm
Assemble Top Board 1, Inner Power
Module
\...
\Power Module Asm
\Assemble Top Board 1, Inner Power Module
Process Summary

Assemble Top Board 1, Inner Power
Module
Top Shield w/Foam Asm
\...
\Power Module Asm
\Top Shield wFoam Asm
Assembly Summary

Detailed Summary

Top Shield, Top Shield w/Foam
\...
\Top Shield, Top Shield wFoam
\Top Shield Process
Process Summary

Top Shield, Top Shield w/Foam
Assemble Top Shield w/Foam
\...
\Assemble Top Shield wFoam
Process Summary

\...
\Power Module Asm
\Assemble Top Shield wFoam
Process Summary

Top Bracket w/Connectors Asm
\...
\Power Module Asm
\Top Bracket wConnectors Asm
Assembly Summary

Detailed Summary

Top Plate w/Silicone Bead Asm, Top
Bracket w/Conne
\...
\Top Plate wSilicone Bead Asm, Top Bracket wConne
Assembly Summary

Bracket w/Conne
Bracket w/Conne
Detailed Summary

Top Plate, Top Plate w/Silicone Bead
\...
\Top Plate, Top Plate wSilicone Bead
\Top Plate, Top Plate wSilicone Bead Process
Process Summary

Top Plate, Top Plate w/Silicone Bead
Assemble Top Plate w/Silicone Bead, Top
Bracket
\...
\Assemble Top Plate wSilicone Bead, Top Bracket
Process Summary

Assemble Top Plate w/Silicone Bead,
Top Bracket
Ferrite Core Unit Stud w/O-Ring, Top
Bracket w/Con
\...
\Ferrite Core Unit Stud wO-Ring, Top Bracket wCon
Assembly Summary

Bracket w/Con
Bracket w/Con
Detailed Summary

Ferrite Core Unit Stud, Top Bracket
w/Connectors
\...
\Ferrite Core Unit Stud, Top Bracket wConnectors
\Ferrite Core Unit Stud Process
Process Summary

Ferrite Core Unit Stud, Top Bracket
w/Connectors
Assemble Ferrite Core Unit Stud w/O-Ring
\...
\Assemble Ferrite Core Unit Stud wO-Ring
Process Summary

\...
\Assemble Ferrite Core Unit Stud wO-Ring
Process Summary

Buss Bar Stud w/O-Ring Asm, Top Bracket
w/Connecto
\...
\Buss Bar Stud wO-Ring Asm, Top Bracket wConnecto
Assembly Summary

w/Connecto
w/Connecto
Detailed Summary

Assemble Buss Bar Stud w/O-Ring Asm,
Top Bracket
\...
\Buss Bar Stud wO-Ring Asm, Top Bracket wConnecto
\Assemble Buss Bar Stud wO-Ring Asm, Top Bracket
Process Summary

Assemble Buss Bar Stud w/O-Ring Asm,
Top Bracket
Buss Bar Stud, Top Bracket Installation
\...
\Buss Bar Stud, Top Bracket Installation
Process Summary

Buss Bar Stud, Top Bracket Installation
HV Component Connector w/Long Wire
Asm
\...
\HV Component Connector wLong Wire Asm
Assembly Summary

Asm
Asm
Detailed Summary

HV Component Connector
\...
\HV Component Connector
Assembly Summary

Detailed Summary

Connector Body
\...
\Connector Body
\Connector Body Process
Process Summary

Connector Body
AC/DC Inv. External Connector Cover,
AC/DC Inverter
\...
\ACDC Inv. External Connector Cover, ACDC Inverter
\ACDC Inv. External Connector Housing Process
Process Summary

AC/DC Inverter
Assemble AC/DC Inv. External
Connector Cover
\...
\Assemble ACDC Inv. External Connector Cover
Process Summary

Connector Cover
Spade Terminal C Asm
\...
\Spade Terminal C Asm
Assembly Summary

Detailed Summary

Spade Terminal C
\...
\Spade Terminal C
\Spade Terminal C Process
Process Summary

Spade Terminal C
\...
Process Summary

Spade Terminal Asm
\...
\Spade Terminal Asm
Process Summary

Spade Terminal Asm
Verification Cable TPA
\...
\Verification Cable TPA
\Verification Cable TPA Process
Process Summary

Connector Cable Asm
\...
\Connector Cable Asm
Process Summary

Connector Cable Asm
Click Here for Munro & Associates Wire Harness Report on Connector
Verification Cable
Connector Seal
\...
\Connector Seal
\Connector Seal Process
Process Summary

Connector Seal
Connector Seal Asm
\...
\Connector Seal Asm
Process Summary

Connector Seal Asm
Grounding Plate
\...
\Grounding Plate
\Grounding Plate Process
Process Summary

Grounding Plate
Grounding Plate Asm
\...
\Grounding Plate Asm
Process Summary

Grounding Plate Asm
Rear Terminal Support
\...
\Rear Terminal Support
\Rear Terminal Support Process
Process Summary

Rear Terminal Support Asm
\...
\Rear Terminal Support Asm
Process Summary

Terminal Support
\...
\Terminal Support
\Terminal Support Process
Process Summary

Terminal Support
Terminal Support Asm
\...
\Terminal Support Asm
Process Summary

Ground Liner
\...
\Ground Liner
\Ground Liner Process
Process Summary

Ground Liner
Ground Liner Asm
\...
\Ground Liner Asm
Process Summary

Ground Liner Asm
Connector Label Asm
\...
\Connector Label Asm
Process Summary

Connector Label Asm
Assemble HV Component Connector
w/Long Wire Asm
\...
\Assemble HV Component Connector wLong Wire
Asm
Process Summary

w/Long Wire Asm
Click Here for Munro & Associates Wire Harness Report on Long Wire
Asm
HV Component Connector w/Short Wire
Asm
\...
\HV Component Connector wShort Wire Asm
Assembly Summary

Asm
Asm
Detailed Summary

\...
Assembly Summary

Detailed Summary

Connector Body
\...
\Connector Body
Process Summary

Connector Body
AC/DC Inverter
\...
Process Summary

AC/DC Inverter
Connector Cover
\...
Process Summary

Connector Cover
\...
Assembly Summary

Detailed Summary

Spade Terminal C
\...
\Spade Terminal C
Process Summary

Spade Terminal C
\...
Process Summary

Spade Terminal Asm
\...
\Spade Terminal Asm
Process Summary

Spade Terminal Asm
\...
Process Summary

Connector Cable Asm
\...
Process Summary

Connector Cable Asm
Verification Cable
Connector Seal
\...
\Connector Seal
Process Summary

Connector Seal
Connector Seal Asm
\...
\Connector Seal Asm
Process Summary

Connector Seal Asm
Grounding Plate
\...
\Grounding Plate
Process Summary

Grounding Plate
Grounding Plate Asm
\...
Process Summary

Grounding Plate Asm
\...
Process Summary

\...
Process Summary

Terminal Support
\...
\Terminal Support
Process Summary

Terminal Support
\...
Process Summary

Ground Liner
\...
\Ground Liner
Process Summary

Ground Liner
Ground Liner Asm
\...
\Ground Liner Asm
Process Summary

Ground Liner Asm
Connector Label Asm
\...
Process Summary

Connector Label Asm
w/Short Wire Asm
\...
\Assemble HV Component Connector wShort Wire
Asm
Process Summary

w/Short Wire Asm
Click Here for Munro & Associates Wire Harness Report on Short Wire
Asm
Assemble HV Component Connectors
with Wires
\...
\Assemble HV Component Connectors with Wires
Process Summary

Assemble HV Component Connectors
with Wires
Bottom Asm, Top Bracket
w/Connectors
\...
\Bottom Asm, Top Bracket wConnectors
Assembly Summary

w/Connectors
w/Connectors
Detailed Summary

Cover Asm, Bottom
\...
\Cover Asm, Bottom
Assembly Summary

Cover Asm, Bottom
Cover Asm, Bottom
Detailed Summary

Cover, Cover
\...
\Cover Asm, Bottom
\Cover, Cover
\Cover Process
Process Summary

Cover, Cover
Ferrite Core, Cover Asm
\...
\Cover Asm, Bottom
\Ferrite Core, Cover Asm
\Ferrite Core Process
Process Summary

Ferrite Core, Cover Asm
Assemble Cover
\...
\Cover Asm, Bottom
\Assemble Cover
Process Summary

Assemble Cover
Cover Liner, Cover
\...
\Cover Liner, Cover
\Cover Liner Process
Process Summary

Cover Liner, Cover
Assemble Converter Buss
\...
\Assemble Converter Buss
Process Summary

Assemble Converter Buss
Click Here for TechInsights Electronics Report on Converter Buss Asm
Converter Buss Filter Mounting Trim,
Bottom
\...
\Converter Buss Filter Mounting Trim, Bottom
\Converter Buss Filter Mounting Trim Process
Process Summary

Converter Buss Filter Mounting Trim,
Bottom
Converter Buss Filter w/Fasteners Asm,
Bottom
\...
\Converter Buss Filter wFasteners Asm, Bottom
Assembly Summary

Converter Buss Filter w/Fasteners Asm,
Bottom
Converter Buss Filter w/Fasteners
Asm, Bottom
Detailed Summary

Assemble Converter Buss Filter with
Fasteners
\...
\Converter Buss Filter wFasteners Asm, Bottom
\Assemble Converter Buss Filter with Fasteners
Process Summary

Assemble Converter Buss Filter with
Fasteners
Click Here for TechInsights Electronics Report on Converter Buss Filter

Asm
Converter Buss Filter Cover Asm,
Bottom
\...
\Converter Buss Filter Cover Asm, Bottom
Assembly Summary

Bottom
Bottom
Detailed Summary

Cover, Converter Buss Filter Cover
\...
\Cover, Converter Buss Filter Cover
\Cover Process
Process Summary

Cover, Converter Buss Filter Cover
Liner Trim w/Inserts, Converter Buss
Filter
\...
\Liner Trim wInserts, Converter Buss Filter
Assembly Summary

Filter
Filter
Detailed Summary

Liner Trim, Converter Buss Filter
\...
\Liner Trim, Converter Buss Filter
\Liner Trim Process
Process Summary

Liner Trim, Converter Buss Filter
Assemble Liner Trim w/Inserts
\...
\Assemble Liner Trim wInserts
Process Summary

Assemble Liner Trim w/Inserts
Assemble Converter Buss Filter
\...
\Assemble Converter Buss Filter
Process Summary

w/Fasteners
\...
\Assemble Converter Buss Filter wFasteners
Process Summary

w/Fasteners
w/Connectors Installation
\...
\Bottom Asm, Top Bracket wConnectors Installation
Process Summary

w/Connectors Installation
Ferrite Core Unit Asm, Top Bracket
w/Connectors
\...
\Ferrite Core Unit Asm, Top Bracket wConnectors
Assembly Summary

w/Connectors
w/Connectors
w/Connectors
Detailed Summary

Buss Bar w/Washer, Ferrite Core Unit
\...
\Buss Bar wWasher, Ferrite Core Unit
Assembly Summary

Detailed Summary

Buss Bar, Ferrite Core Unit
\...
\Buss Bar, Ferrite Core Unit
\Buss Bar Process
Process Summary

Buss Bar, Ferrite Core Unit
Assemble Buss Bar and Washer
\...
\Assemble Buss Bar and Washer
Process Summary

Assemble Buss Bar and Washer
Capacitor Bracket, Ferrite Core Unit
\...
\Capacitor Bracket, Ferrite Core Unit
\Capacitor Bracket Process
Process Summary

Capacitor Bracket, Ferrite Core Unit
Capacitor Retaining Clip, Ferrite Core
Unit
\...
\Capacitor Retaining Clip, Ferrite Core Unit
\Capacitor Retaining Clip Process
Process Summary

Capacitor Retaining Clip, Ferrite Core
Unit
Assemble Capacitor and Retainers
\...
\Assemble Capacitor and Retainers
Process Summary

Assemble Capacitor and Retainers
Elastic Spacer, Ferrite Core Unit
\...
\Elastic Spacer, Ferrite Core Unit
\Elastic Spacer Process
Process Summary

Elastic Spacer, Ferrite Core Unit
Ferrite Core, Ferrite Core Unit
\...
\Ferrite Core, Ferrite Core Unit
\Ferrite Core Unit Process
Process Summary

Ferrite Core, Ferrite Core Unit
Assemble Elastic Spacer and Ferrite
Cores
\...
\Assemble Elastic Spacer and Ferrite Cores
Process Summary

Assemble Elastic Spacer and Ferrite
Cores
Case 1 Asm, Ferrite Core Unit
\...
\Case 1 Asm, Ferrite Core Unit
Assembly Summary

Detailed Summary

Case 1, Case 1 Asm
\...
\Case 1, Case 1 Asm
\Case 1 Process
Process Summary

Case 1, Case 1 Asm
Assemble Case 1
\...
\Assemble Case 1
Process Summary

Assemble Case 1
\...
Assembly Summary

Detailed Summary

Case 2, Case 2 Asm
\...
\Case 2, Case 2 Asm
\Case 2 Process
Process Summary

Case 2, Case 2 Asm
Assemble Case 2
\...
\Assemble Case 2
Process Summary

Assemble Case 2
Assemble Case 1 and 2
\...
\Assemble Case 1 and 2
Process Summary

Assemble Case 1 and 2
Plate, Ferrite Core Unit
\...
\Plate, Ferrite Core Unit
\Plate, Ferrite Core Unit Process
Process Summary

Plate, Ferrite Core Unit
Assemble Plate, Ferrite Core Unit
\...
\Assemble Plate, Ferrite Core Unit
Process Summary

Assemble Plate, Ferrite Core Unit
Clip, Ferrite Core Unit
\...
\Clip, Ferrite Core Unit
\Clip, Ferrite Core Unit Process
Process Summary

Clip, Ferrite Core Unit
Assemble Clip, Ferrite Core Unit
\...
\Assemble Clip, Ferrite Core Unit
Process Summary

Assemble Clip, Ferrite Core Unit
Fastener Cover, Top Bracket
w/Connectors
\...
\Fastener Cover, Top Bracket wConnectors
\Fastener Cover Process
Process Summary

Fastener Cover, Top Bracket
w/Connectors
Assemble Ferrite Core Unit Asm, Power
Module
\...
\Assemble Ferrite Core Unit Asm, Power Module
Process Summary

Assemble Ferrite Core Unit Asm, Power
Module
Buss Bar, Top Bracket w/Connectors
\...
\Buss Bar, Top Bracket wConnectors
\Buss Bar, Top Bracket wConnectors Process
Process Summary

Buss Bar, Top Bracket w/Connectors
Buss Bar, Top Bracket Installation
\...
\Buss Bar, Top Bracket Installation
Process Summary

Buss Bar, Top Bracket Installation
Assemble Top Bracket w/Connectors
\...
\Power Module Asm
\Assemble Top Bracket wConnectors
Process Summary

Assemble Top Bracket w/Connectors
Power Module Upper Cover w/Labels Asm
\...
\Power Electronics
\Power Module Asm
\Power Module Upper Cover wLabels Asm
Assembly Summary

Detailed Summary

Power Module Upper Cover, Power Module
Upper Cover
\...
\Power Module Upper Cover, Power Module Upper
Cover \Power Module Upper Cover Process
Process Summary

Power Module Upper Cover, Power
Module Upper Cover
Assemble Power Module Upper Cover
w/Labels
\...
\Power Module Asm
\Assemble Power Module Upper Cover wLabels
Process Summary

Assemble Power Module Upper Cover
w/Labels
Power Module Cover Asm Installation
\...
\Power Electronics
\Power Module Asm
\Power Module Cover Asm Installation
Process Summary

Power Module Cover Asm Installation
Power Module Lower Cover w/Labels
Asm
\...
\Power Electronics
\Power Module Asm
\Power Module Lower Cover wLabels Asm
Assembly Summary

Asm
Asm
Detailed Summary

Power Module Lower Cover, Power
Module Lower Cover
\...
\Power Module Lower Cover, Power Module Lower
Cover \Power Module Lower Cover Process
Process Summary

Power Module Lower Cover, Power
Module Lower Cover
Assemble Power Module Lower Cover
w/Labels
\...
\Power Module Asm
\Assemble Power Module Lower Cover wLabels
Process Summary

Assemble Power Module Lower Cover
w/Labels
Power Module Lower Cover Asm
\...
\Power Electronics
\Power Module Asm
\Power Module Lower Cover Asm
Process Summary

Power Module Lower Cover Asm
Power Module Installation
\...
\Power Electronics
\Power Module Installation
Process Summary

Power Module Installation
Charging Module Asm
\...
\Power Electronics
\Charging Module Asm
Assembly Summary

Charging Module Asm
Charging Module Asm
Charging Module Asm
Charging Module Asm
Detailed Summary

Main Closure, Charging Module Asm
\...
\Main Closure, Charging Module Asm
\Main Enclosure Process
Process Summary

Main Closure, Charging Module Asm
Inner Gasket, Charging Module Asm
\...
\Inner Gasket, Charging Module Asm
\Inner Gasket Process
Process Summary

Inner Gasket, Charging Module Asm
Bottom Cover Asm, Charging Module
Asm
\...
\Power Electronics
\Bottom Cover Asm, Charging Module Asm
Assembly Summary

Asm
Asm
Detailed Summary

Bottom Cover
\...
\Bottom Cover
\Bottom Cover Process
Process Summary

Bottom Cover
Gasket, Cover
\...
\Gasket, Cover
\Gasket Process
Process Summary

Gasket, Cover
Bottom Cover, Asm
\...
\Bottom Cover, Asm
Process Summary

Bottom Cover, Asm
Charging Module Cover Installation
\...
\Power Electronics
\Charging Module Cover Installation
Process Summary

EMF Shield Asm, Charging Module
Asm
\...
\Power Electronics
\EMF Shield Asm, Charging Module Asm
Assembly Summary

Asm
Asm
Detailed Summary

EMF Shield Stamping
\...
\EMF Shield Stamping
\EMF Shield Process
Process Summary

EMF Shield Stamping
EMF Shield Asm
\...
\EMF Shield Asm
Process Summary

EMF Shield Asm
EMF Shield Installation
\...
\Power Electronics
\EMF Shield Installation
Process Summary

EMF Shield Installation
Charging Module Board 1 Installation
\...
\Power Electronics
\Charging Module Board 1 Installation
Process Summary

Click Here for TechInsights Electronics Report on Charging Module

Board 1
\...
\Power Electronics
Process Summary


Board 2
HV Connector In, Charging Module
Asm
\...
\Power Electronics
\HV Connector In, Charging Module Asm
Assembly Summary

Asm
Asm
Detailed Summary

Conduit, 90 Degree Elbow
\...
\Conduit, 90 Degree Elbow
\Conduit, 90 Degree Elbow Process
Process Summary

Assemble Gen Cable Connector-A
\...
\Assemble Gen Cable Connector-A
Process Summary

Click Here for Munro & Associates Wire Harness Report on HV Connector
In Harness
HV Connector In, 2 Pin Installation
\...
\Power Electronics
\HV Connector In, 2 Pin Installation
Process Summary

HV Connector In, 2 Pin Installation
HV Cable Out, Charging Module Asm
\...
\Power Electronics
\HV Cable Out, Charging Module Asm
Assembly Summary

Detailed Summary

\...
\Conduit, 90 Degree Elbow
\Conduit, 90 Degree Elbow Process
Process Summary

\...
Process Summary

Click Here for Munro & Associates Wire Harness Report on HV Cable Out
Harness
HV Connector Out, 2 Pin Installation
\...
\Power Electronics
\HV Connector Out, 2 Pin Installation
Process Summary

HV Connector Out, 2 Pin Installation
\...
\Power Electronics
Process Summary


Board 3
Harness, CMB 4 to CMB 1 Installation
\...
\Power Electronics
\Harness, CMB 4 to CMB 1 Installation
Process Summary

Harness, CMB 4 to CMB 1 Installation
Click Here for Munro & Associates Wire Harness Report on CMB4 to CMB
1 Harness
Charging Module Board 4 Asm
Installation
\...
\Power Electronics
\Charging Module Board 4 Asm Installation
Process Summary

Charging Module Board 4 Asm Installation
Click Here for TechInsights Electronics Report on Charging Module Asm

Board 4
Installation
\...
\Power Electronics
\Charging Module Board 5 Asm Installation
Process Summary

Charging Module Board 5 Asm Installation

Board 5 Asm
\...
\Power Electronics
Assembly Summary

Detailed Summary

Connector Body
\...
\Connector Body
Process Summary

Connector Body
AC/DC Inverter
\...
Process Summary

AC/DC Inverter
Connector Cover
\...
Process Summary

Connector Cover
\...
Assembly Summary

Detailed Summary

Spade Terminal C
\...
\Spade Terminal C
Process Summary

Spade Terminal C
\...
Process Summary

Spade Terminal Asm
\...
\Spade Terminal Asm
Process Summary

Spade Terminal Asm
\...
Process Summary

Connector Cable Asm
\...
Process Summary

Connector Cable Asm
Verification Cable
Connector Seal
\...
\Connector Seal
Process Summary

Connector Seal
Connector Seal Asm
\...
\Connector Seal Asm
Process Summary

Connector Seal Asm
Grounding Plate
\...
\Grounding Plate
Process Summary

Grounding Plate
Grounding Plate Asm
\...
Process Summary

Grounding Plate Asm
\...
Process Summary

\...
Process Summary

Terminal Support
\...
\Terminal Support
Process Summary

Terminal Support
\...
Process Summary

Ground Liner
\...
\Ground Liner
Process Summary

Ground Liner
Ground Liner Asm
\...
\Ground Liner Asm
Process Summary

Ground Liner Asm
Connector Label Asm
\...
Process Summary

Connector Label Asm
HV Connector Installation
\...
\Power Electronics
\HV Connector Installation
Process Summary

HV Connector Installation
Coolant Port Asm, Charging Module
Asm
\...
\Power Electronics
\Coolant Port Asm, Charging Module Asm
Assembly Summary

Asm
Asm
Detailed Summary

Coolant Port St
\...
\Coolant Port St
\Coolant Port St Process
Process Summary

Coolant Port St
Coolant Port St Asm
\...
\Coolant Port St Asm
Process Summary

Coolant Port St Asm
Charging Module Coolant Port Installation
\...
\Power Electronics
\Charging Module Coolant Port Installation
Process Summary

Charging Module Coolant Port Installation
90 Deg Coolant Port Asm, Charging
Module Asm
\...
\Power Electronics
\90 Deg Coolant Port Asm, Charging Module Asm
Assembly Summary

Module Asm
Module Asm
Detailed Summary

Coolant Port 90
\...
\Coolant Port 90
\Coolant Port 90 Process
Process Summary

Coolant Port 90
90 Deg Coolant Port Asm
\...
\ 90 Deg Coolant Port Asm
Process Summary

90 Deg Coolant Port Asm
Charging Module 90 Deg Coolant Port
Installation
\...
\Power Electronics
\Charging Module 90 Deg Coolant Port Installation
Process Summary

Charging Module 90 Deg Coolant Port
Installation
Breather Vent Asm, Charging Module Asm
\...
\Power Electronics
\Breather Vent Asm, Charging Module Asm
Assembly Summary

Detailed Summary

Breather Vent
\...
\Breather Vent
\Breather Vent Process
Process Summary

Breather Vent
Breather Vent Asm
\...
\Breather Vent Asm
Process Summary

Breather Vent Asm
Charging Module Breather Vent
Installation
\...
\Power Electronics
\Charging Module Breather Vent Installation
Process Summary

Charging Module Breather Vent
Installation
Cover Asm, Charging Module Asm
\...
\Power Electronics
\Cover Asm, Charging Module Asm
Assembly Summary

Detailed Summary

Front Cover, Cover Asm
\...
\Front Cover, Cover Asm
\Front Cover Process
Process Summary

Front Cover, Cover Asm
Front Cover Seal, Charging Module
Asm
\...
\Front Cover Seal, Charging Module Asm
\Front Cover Seal Process
Process Summary

Front Cover Seal, Charging Module
Asm
Front Cover Seal Asm
\...
\Front Cover Seal Asm
Process Summary

Front Cover Seal Asm
\...
Assembly Summary

Detailed Summary

Connector Body
\...
\Connector Body
Process Summary

Connector Body
AC/DC Inverter
\...
Process Summary

AC/DC Inverter
Connector Cover
\...
Process Summary

Connector Cover
\...
Assembly Summary

Detailed Summary

Spade Terminal C
\...
\Spade Terminal C
Process Summary

Spade Terminal C
\...
Process Summary

Spade Terminal Asm
\...
\Spade Terminal Asm
Process Summary

Spade Terminal Asm
\...
Process Summary

Connector Cable Asm
\...
Process Summary

Connector Cable Asm
Verification Cable
Connector Seal
\...
\Connector Seal
Process Summary

Connector Seal
Connector Seal Asm
\...
\Connector Seal Asm
Process Summary

Connector Seal Asm
Grounding Plate
\...
\Grounding Plate
Process Summary

Grounding Plate
Grounding Plate Asm
\...
Process Summary

Grounding Plate Asm
\...
Process Summary

\...
Process Summary

Terminal Support
\...
\Terminal Support
Process Summary

Terminal Support
\...
Process Summary

Ground Liner
\...
\Ground Liner
Process Summary

Ground Liner
Ground Liner Asm
\...
\Ground Liner Asm
Process Summary

Ground Liner Asm
Connector Label Asm
\...
Process Summary

Connector Label Asm
HV Connector Asm
\...
\HV Connector Asm
Process Summary

HV Connector Asm
\...
\Charging Module Board 6 Asm
Process Summary


Board 6 Asm
Charging Module Coil Asm
\...
\Charging Module Coil Asm
Process Summary

Charging Module Coil Asm
Module Harness Asm
\...
\Module Harness Asm
Process Summary

Module Harness Asm
Click Here for Munro & Associates Wire Harness Report on Charging
Module Harness Asm
Module Sub Harness Asm
\...
\Module Sub Harness Asm
Process Summary

Click Here for Munro & Associates Wire Harness Report on Charging
Harness, Coil to HV 1 Asm
\...
\Harness, Coil to HV 1 Asm
Process Summary

Click Here for Munro & Associates Wire Harness Report on Coil to HV 1
Harness
\...
\Harness, Coil to HV 2 Asm
Process Summary

Click Here for Munro & Associates Wire Harness Report on Coil to HV 2
Asm Harness
\...
\Power Electronics
\Charging Module Cover Installation
Process Summary

Charging Module Installation
\...
\Power Electronics
\Charging Module Installation
Process Summary

Charging Module Installation
AC/DC Inverter, Generator Asm
\...
\Power Electronics
\ACDC Inverter, Generator Asm
Assembly Summary

Detailed Summary

Housing Asm, AC/DC Inverter
\...
\Power Electronics
\Housing Asm, ACDC Inverter
Assembly Summary

Detailed Summary

Housing, Housing Asm
\...
\Housing, Housing Asm
\Housing Process
Process Summary

Housing, Housing Asm
Assemble Housing Glue Guide
\...
\Assemble Housing Glue Guide
Process Summary

Assemble Housing Glue Guide
Plug Asm, Housing Asm
\...
\Plug Asm, Housing Asm
Assembly Summary

Detailed Summary

Assemble Plug Asm
\...
\Plug Asm, Housing Asm
\Assemble Plug Asm
Process Summary

Assemble Plug Asm
Assemble Plug to Housing
\...
\Assemble Plug to Housing
Process Summary

Assemble Plug to Housing
Isolator, Housing Asm
\...
\Isolator, Housing Asm
\Isolator Process
Process Summary

Isolator, Housing Asm
Assemble Isolators
\...
\Assemble Isolators
Process Summary

Assemble Isolators
Mounting Bracket Small Asm, AC/DC
Inverter
\...
\Power Electronics
\Mounting Bracket Small Asm, ACDC Inverter
Assembly Summary

Inverter
Inverter
Detailed Summary

Mounting Bracket Small, Mounting Bracket
Small Asm
\...
\Mounting Bracket Small, Mounting Bracket Small Asm
\Mounting Bracket Small Process
Process Summary

Mounting Bracket Small, Mounting
Bracket Small Asm
Assemble Mounting Bracket Small
\...
\Assemble Mounting Bracket Small
Process Summary

\...
\Power Electronics
\Assemble Mounting Bracket Small
Process Summary

Mounting Bracket Large, AC/DC
Inverter
\...
\Power Electronics
\Mounting Bracket Large, ACDC Inverter
Assembly Summary

Inverter
Inverter
Detailed Summary

Mounting Bracket Large, Mounting
Bracket Large Asm
\...
\Mounting Bracket Large, Mounting Bracket Large Asm
\Mounting Bracket Large Process
Process Summary

Mounting Bracket Large, Mounting
Bracket Large Asm
Assemble Mounting Bracket Large
\...
\Assemble Mounting Bracket Large
Process Summary

\...
\Power Electronics
\Assemble Mounting Bracket Large
Process Summary

Assemble AC/DC Inverter Printed
Circuit Board
\...
\Power Electronics
\Assemble ACDC Inverter Printed Circuit Board
Process Summary

Assemble AC/DC Inverter Printed Circuit
Board
Click Here for TechInsights Electronics Report on AC/DC Inverter Printed

Circuit Board Asm
Inverter Charging Module Connector Asm,
AC/DC Inve
\...
\Power Electronics
\Inverter Charging Module Connector Asm, ACDC Inve
Assembly Summary

AC/DC Inve
AC/DC Inve
AC/DC Inve
Detailed Summary

Support Bracket, Inverter Charging Module
Connecto
\...
\Support Bracket, Inverter Charging Module Connecto
\Support Bracket Process
Process Summary

Support Bracket, Inverter Charging Module
Connecto
Buss Bar 1, Connector Asm
\...
\Buss Bar 1, Connector Asm
\Buss Bar 1 Process
Process Summary

Assemble Buss Bar 1
\...
Process Summary

Assemble Buss Bar 1
\...
\Buss Bar 2 Process
Process Summary

Assemble Buss Bar 2
\...
Process Summary

Assemble Buss Bar 2
\...
\Buss Bar 3 Process
Process Summary

Assemble Buss Bar 3
\...
Process Summary

Assemble Buss Bar 3
\...
\Buss Bar 4
Process Summary

Assemble Buss Bar 4
\...
Process Summary

Assemble Buss Bar 4
Large Capacitor Asm, Connector Asm
\...
\Large Capacitor Asm, Connector Asm
Assembly Summary

Detailed Summary

Large Capacitor Asm Process
\...
\Large Capacitor Asm, Connector Asm
\Large Capacitor Asm Process
Process Summary

Large Capacitor Asm Process
Assemble Large Capacitor
\...
\Assemble Large Capacitor
Process Summary

Assemble Large Capacitor
Small Capacitor Asm, Connector Asm
\...
\Small Capacitor Asm, Connector Asm
Assembly Summary

Detailed Summary

Small Capacitor Process
\...
\Small Capacitor Asm, Connector Asm
\Small Capacitor Process
Process Summary

Small Capacitor Process
Assemble Small Capacitor
\...
\Assemble Small Capacitor
Process Summary

Assemble Small Capacitor
Assemble Inverter Charging Module
Connector Circuit
\...
\Power Electronics
\Assemble Inverter Charging Module Connector Circuit
Process Summary

Assemble Inverter Charging Module
Connector Circuit
Generator Connector and Bracket Asm,
AC/DC Inverter
\...
\Power Electronics
\Generator Connector and Bracket Asm, ACDC
Inverter Assembly Summary

AC/DC Inverter
AC/DC Inverter
Detailed Summary

Bracket, Generator Connector and Bracket
Asm
\...
\Generator Connector and Bracket Asm, ACDC Inverter
\Bracket, Generator Connector and Bracket Asm
\Bracket Process
Process Summary

Bracket, Generator Connector and
Bracket Asm
Generator Connector Asm, Generator
Connector and B
\...
\Generator Connector Asm, Generator Connector and
B Assembly Summary

Connector and B
Connector and B
Detailed Summary

Housing, Generator Connector Asm
\...
\Generator Connector Asm, Generator Connector and B
\Housing, Generator Connector Asm
\Housing Process
Process Summary

Housing, Generator Connector Asm
Connector, Generator Connector Asm
\...
\Connector, Generator Connector Asm
\Connector Process
Process Summary

Connector, Generator Connector Asm
Assemble Generator Connector
\...
\Assemble Generator Connector
Process Summary

Assemble Generator Connector
Seal, Generator Connector Asm
\...
\Seal, Generator Connector Asm
\Seal Process
Process Summary

Seal, Generator Connector Asm
Assemble Seal
\...
\Assemble Seal
Process Summary

Assemble Seal
Click Here for Munro & Associates Wire Harness Report on Pigtail Wiring
Generator Connector
Assemble Generator Connector and
Bracket
\...
\Assemble Generator Connector and Bracket
Process Summary

Assemble Generator Connector and
Bracket
Assemble Generator Connection
\...
\Power Electronics
\Assemble Generator Connection
Process Summary

Assemble Generator Connection
Generator Connector Seal, AC/DC
Inverter
\...
\Generator Connector Seal, ACDC Inverter
\Generator Connector Seal Process
Process Summary

Generator Connector Seal, AC/DC
Inverter
Assemble Generator Seal
\...
\Power Electronics
\Assemble Generator Seal
Process Summary

Assemble Generator Seal
External Connector Retention Bracket,
AC/DC Invert
\...
\External Connector Retention Bracket, ACDC Invert
\External Connector Retention Process
Process Summary

External Connector Retention Bracket,
AC/DC Invert
Assemble External Connector
Retention Bracket
\...
\Power Electronics
\Assemble External Connector Retention Bracket
Process Summary

Assemble External Connector
Retention Bracket
HV-1 External Connector Asm
\...
\Power Electronics
\HV-1 External Connector Asm
Assembly Summary

Detailed Summary

Connector Body
\...
\Connector Body
Process Summary

Connector Body
AC/DC Inverter
\...
Process Summary

AC/DC Inverter
Connector Cover
\...
Process Summary

Connector Cover
Spade Terminal A
\...
\Spade Terminal A
\Spade Terminal A Process
Process Summary

Spade Terminal A
Spade Terminal B
\...
\Spade Terminal B
\Spade Terminal B Process
Process Summary

Spade Terminal B
Spade Terminal Asm
\...
\Spade Terminal Asm
Process Summary

Spade Terminal Asm
\...
Process Summary

Connector Cable Asm
\...
Process Summary

Connector Cable Asm
Verification Cable
Connector Seal
\...
\Connector Seal
Process Summary

Connector Seal
Connector Seal Asm
\...
\Connector Seal Asm
Process Summary

Connector Seal Asm
Grounding Plate
\...
\Grounding Plate
Process Summary

Grounding Plate
Grounding Plate Asm
\...
Process Summary

Grounding Plate Asm
Terminal Support
\...
\Terminal Support
Process Summary

Terminal Support
\...
Process Summary

Ground Liner
\...
\Ground Liner
Process Summary

Ground Liner
Ground Liner Asm
\...
\Ground Liner Asm
Process Summary

Ground Liner Asm
Connector Label Asm
\...
Process Summary

Connector Label Asm
Assemble AC/DC Inv. External Connect
\...
\Power Electronics
\Assemble ACDC Inv. External Connect
Process Summary

Assemble AC/DC Inv. External Connect
Coolant Connector, AC/DC Inverter
\...
\Power Electronics
\Coolant Connector, ACDC Inverter
Assembly Summary

Detailed Summary

Coolant Connector, Coolant Connector
Asm
\...
\Coolant Connector, Coolant Connector Asm
\Coolant Connector Process
Process Summary

Coolant Connector, Coolant Connector
Asm
Assemble Coolant Connector
\...
\Assemble Coolant Connector
Process Summary

\...
\Power Electronics
\Assemble Coolant Connector
Process Summary

AC/DC Inverter Printed Circuit Board 1
Asm, AC/DC
\...
\Power Electronics
\ ACDC Inverter Printed Circuit Board 1 Asm, ACDC
Assembly Summary

Asm, AC/DC
Asm, AC/DC
Detailed Summary

Mounting Br
\...
\ACDC Inverter Printed Circuit Board 1 Mounting Br
Assembly Summary

Mounting Br
Mounting Br
Detailed Summary

Bracket, AC/DC Inverter Printed Circuit
Board 1 Br
\...
\Bracket, ACDC Inverter Printed Circuit Board 1 Br
\Bracket Process
Process Summary

Bracket, AC/DC Inverter Printed Circuit
Board 1 Br
Assemble Bracket
\...
\Assemble Bracket
Process Summary

Assemble Bracket
Assemble Bracket
\...
\Assemble Bracket
Process Summary

Assemble Bracket
Click Here for TechInsights Electronics Report on AC/DC Inverter Printed

Circuit Board 1
Circuit Board 1
\...
\Power Electronics
\Assemble ACDC Inverter Printed Circuit Board 1
Process Summary

Circuit Board 1
AC/DC Inverter Cover Seal, AC/DC
Inverter Asm
\...
\ACDC Inverter Cover Seal, ACDC Inverter Asm
\ACDC Inverter Cover Seal Process
Process Summary

AC/DC Inverter Cover Seal, AC/DC
Inverter Asm
Assemble AC/DC Inverter Cover Seal
\...
\Power Electronics
\Assemble ACDC Inverter Cover Seal
Process Summary

Assemble AC/DC Inverter Cover Seal
AC/DC Inv. Cover
\...
\ACDC Inv. Cover
\ACDC Inv. Cover
Process Summary

AC/DC Inv. Cover
AC/DC Inv. Coolant Passage Cover
Installation
\...
\Power Electronics
\ACDC Inv. Coolant Passage Cover Installation
Process Summary

Installation
AC/DC Inv. Coolant Seal, AC/DC
Inverter Asm
\...
\ACDC Inv. Coolant Seal, ACDC Inverter Asm
\ACDC Inv. Coolant Seal
Process Summary

AC/DC Inv. Coolant Seal, AC/DC
Inverter Asm
Assemble AC/DC Inv. Coolant Seal
\...
\Power Electronics
\Assemble ACDC Inv. Coolant Seal
Process Summary

Assemble AC/DC Inv. Coolant Seal
Plate
\...
\ACDC Inv. Coolant Passage Cover Plate
\ACDC Inv. Coolant Passage Cover Process
Process Summary

Plate
AC/DC Inv. Coolant Passage Cover Plat
Installation
\...
\Power Electronics
\ACDC Inv. Coolant Passage Cover Plat Installation
Process Summary

AC/DC Inv. Coolant Passage Cover Plat
Installation
AC/DC Inverter, Generator Installation
\...
\Power Electronics
\ACDC Inverter, Generator Installation
Process Summary

AC/DC Inverter, Generator Installation
Inverter Heat Shield
\...
\Power Electronics
\Inverter Heat Shield
\Inverter Heat Shield Process
Process Summary

Inverter Heat Shield
Inverter Heat Shield Process
\...
\Power Electronics
\Inverter Heat Shield Process
Process Summary

Inverter Heat Shield Process
Charging Module Interface Installation
\...
\Power Electronics
\Charging Module Interface Installation
Process Summary

Charging Module Interface Installation
Click Here for TechInsights Electronics Report on Charging Interface

Module
Battery Charger Installation
\...
\Power Electronics
\Battery Charger Installation
Process Summary

Battery Charger Installation
Power Harnesses Overview
The Power Harnesses consist of 10 separate cable

assemblies and their associated connectors. The cables
are purchased components that support the cabling
required for the batter pack control, and the high voltage
cabling supported by the battery pack.
All of the high voltage cables have a safety termination we
have identified as the Battery Cable Lock Out.
Each of the high voltage connectors require a lock out to

be in place; or the voltage from the battery pack is shut
down upon removal of the lock out termination. Each of the
cable assemblies have been costed in detail in a special
Design Profit application and the results are detailed in the
report appendixes.
Observations:
• The high voltage power cables are
made from commercially available
cables and connectors. Connection to
Number of
Type of
Protection
Contacts from
Components Connections
• Shown is a list of the different types Voltage Type contacts
3 contacts, AC
of connections used in the high Electrical Motor
Voltage
Buss bars Motor Cover
voltage harness system. Flat high voltage Cover over the
2 contacts, DC
High Voltage Battery connector with contact blades,
Voltage
interlock interlock loop
• All of the high voltage connections
Flat high voltage Cover over the
are interlocked to provide Charging Port Electronics
2 contacts, DC
connector with contact blades,
Voltage
protection to assure that the interlock interlock loop
voltage from the battery is AC Compressor
2 contacts, DC
Voltage
Round High
Voltage
Cover over
contacts
disconnected from the harness if 2 contacts, DC Round High Cover over
Electric Heating
one of the cables are not Voltage Voltage contacts
connected.
Observations:
• The high voltage power cables are
made from commercially available
cables and connectors.
• Shown is a simplified diagram DC/AC

showing the power cable layout. Functions
DC/DC
Functions
Power Harnesses
Summary

Power Module Wire Harness Installation
\...
\Power Harnesses
\Power Module Wire Harness Installation
Process Summary

Power Module Wire Harness Installation
Click Here for Munro & Associates Wire Harness Report on Power Module
Wire Harness
HV Cable, AC/DC Inverter to Charging
Installation
\...
\Power Harnesses
\HV Cable, ACDC Inverter to Charging Installation
Process Summary

HV Cable, AC/DC Inverter to Charging
Installation
Click Here for Munro & Associates Wire Harness Report on AC/DC
Inverter to Charging Module Harness
HV Cable, Generator to AC/DC Converter
Asm
\...
\Power Harnesses
\HV Cable, Generator to ACDC Converter Asm
Assembly Summary

Asm
Asm
Asm
Detailed Summary

Generator/Converter Cable Part-D
\...
\GeneratorConverter Cable Part-D
\GeneratorConverter Cable Part-D Process
Process Summary

Generator/Converter Cable Part-D
Generator/Converter Cable Part-E
\...
\GeneratorConverter Cable Part-E
\GeneratorConverter Cable Part-E Process
Process Summary

Generator/Converter Cable Part-E
Assemble Gen Cable Parts D-E
\...
\Power Harnesses
\Assemble Gen Cable Parts D-E
Process Summary

Assemble Gen Cable Parts D-E
Click Here for Munro & Associates Wire Harness Report on Generator to
AC/DC Converter Harness
Generator/Converter Cable Part-F
\...
\GeneratorConverter Cable Part-F
\GeneratorConverter Cable Part-F Process
Process Summary

Generator/Converter Cable Part-F
Assemble Gen Cable Connector-F
\...
\Power Harnesses
\Assemble Gen Cable Connector-F
Process Summary

Assemble Gen Cable Connector-F
Generator/Converter Cable Part-G
\...
\GeneratorConverter Cable Part-G
\GeneratorConverter Cable Part-G Process
Process Summary

Generator/Converter Cable Part-G
Generator/Converter Cable Part-H
\...
\GeneratorConverter Cable Part-H
\GeneratorConverter Cable Part-H Process
Process Summary

Generator/Converter Cable Part-H
Generator/Converter Cable Part-I
\...
\GeneratorConverter Cable Part-I
\GeneratorConverter Cable Part-I Process
Process Summary

Generator/Converter Cable Part-I
Assemble Gen Cable Connector-G-I
\...
\Power Harnesses
\Assemble Gen Cable Connector-G-I
Process Summary

Assemble Gen Cable Connector-G-I
Generator/Converter Cable Part-J
\...
\GeneratorConverter Cable Part-J
\GeneratorConverter Cable Part-J Process
Process Summary

Generator/Converter Cable Part-J
Generator/Converter Cable Part-K
\...
\GeneratorConverter Cable Part-K
\GeneratorConverter Cable Part-K Process
Process Summary

Generator/Converter Cable Part-K
Assemble Gen Cable Parts J-K
\...
\Power Harnesses
\Assemble Gen Cable Parts J-K
Process Summary

Assemble Gen Cable Parts J-K
Generator/Converter Cable Part-A
\...
\GeneratorConverter Cable Part-A
\GeneratorConverter Cable Part-A Process
Process Summary

Generator/Converter Cable Part-A
\...
\Power Harnesses
Process Summary

Generator/Converter Cable Part-B
\...
\GeneratorConverter Cable Part-B
\GeneratorConverter Cable Part-B Process
Process Summary

Generator/Converter Cable Part-B
Generator/Converter Cable Part-C
\...
\GeneratorConverter Cable Part-C
\GeneratorConverter Cable Part-C Process
Process Summary

Generator/Converter Cable Part-C
Assemble Gen Cable Parts C-D
\...
\Power Harnesses
\Assemble Gen Cable Parts C-D
Process Summary

Assemble Gen Cable Parts C-D
HV Cable, Generator to AC/DC Conv
Installation
\...
\Power Harnesses
\HV Cable, Generator to ACDC Conv Installation
Process Summary

HV Cable, Generator to AC/DC Conv
Installation
HV Cable, Battery to Power Module
Installation
\...
\Power Harnesses
\HV Cable, Battery to Power Module Installation
Process Summary

HV Cable, Battery to Power Module
Installation
Click Here for Munro & Associates Wire Harness Report on Battery to
Power Module Harness
HV Cable Asm, Power Module to AC Comp
Installation
\...
\Power Harnesses
\HV Cable Asm, Power Module to AC Comp
Installation
Process Summary

HV Cable Asm, Power Module to AC Comp
Installation
to AC Compressor Harness
HV Cable, PDM to DC/DC Converter
Installation
\...
\Power Harnesses
\HV Cable, PDM to DCDC Converter Installation
Process Summary

HV Cable, PDM to DC/DC Converter
Installation
to Charging Module Harness
HV Cable, Power Module to Charging Mo
Installation
\...
\Power Harnesses
\HV Cable, Power Module to Charging Mo Installation
Process Summary

HV Cable, Power Module to Charging Mo
Installation
to Charging Module Harness
HV Cable Asm, Charging Port/Charging
Mod
\...
\Power Harnesses
\HV Cable Asm, Charging PortCharging Mod
Assembly Summary

Mod
Mod
Detailed Summary

Charging Port Part-B
\...
\Charging Port Part-B
\Charging Port Part-B Process
Process Summary

Charging Port Part-B
Charging Port Part-C
\...
\Charging Port Part-C
\Charging Port Part-C Process
Process Summary

Charging Port Part-C
Charging Port Part-D
\...
\Charging Port Part-D
\Charging Port Part-D Process
Process Summary

Charging Port Part-D
\...
\Power Harnesses
Process Summary

Click Here for Munro & Associates Wire Harness Report on Charging Port
Harness
Charging Port Part-E
\...
\Charging Port Part-E
\Charging Port Part-E Process
Process Summary

Charging Port Part-E
Charging Port Part-F
\...
\Charging Port Part-F
\Charging Port Part-F Process
Process Summary

Charging Port Part-F
Charging Port Part-G
\...
\Charging Port Part-G
\Charging Port Part-G Process
Process Summary

Charging Port Part-G
Charging Port Part-H
\...
\Charging Port Part-H
\Charging Port Part-H Process
Process Summary

Charging Port Part-H
\...
\Power Harnesses
Process Summary

HV Cable Asm, Charging Port to Charge
Installation
\...
\Power Harnesses
\HV Cable Asm, Charging Port to Charge Installation
Process Summary

HV Cable Asm, Charging Port to Charge
Installation
HV Cable Asm, Power Module to HEX
Installation
\...
\Power Harnesses
\HV Cable Asm, Power Module to HEX Installation
Process Summary

HV Cable Asm, Power Module to HEX
Installation
to Heat Exchanger Harness
HV Cable Bracket Asm, Drive Motor
Installation
\...
\Power Harnesses
\HV Cable Bracket Asm, Drive Motor Installation
Process Summary

HV Cable Bracket Asm, Drive Motor
Installation
Appendix
Reports
Appendix
TechInsights
Electronics Reports
Deep Dive Report
BMW i3 High-Voltage Module Assembly
(Munro Part No: 3047)
Report #15900-141020-KTd
Product Description
The BMW i3 High-Voltage Module features a
Freescale S9S12P64MFT 16-bit (32 MHz)
microcontroller and a Bosch CY320 power supply
ASIC for automotive engine control units. The
CY320 is described as a highly integrated power
circuit designed for supply signal processors and
motor management controllers. Isolation is
provided by two Texas Instruments low-power
dual digital isolators (ISO7241CQ & ISO7421E-
Q1). Battery monitoring is provided by an AMS
AS8510 measurement IC equipped with two 16-
bit sigma-delta A/D converters. Voltage
reference is supplied by a Linear Technology
LTC6655 low-noise precision references IC (0.25
ppm p-p; 0.1 Hz to 1 Hz).
DISCLAIMER: All company names, product names, and service names mentioned are used for identification purposes only and may be registered trademarks, trademarks, or service marks of their respective owners. All
analyses are done without participation, authorization, or endorsement of the manufacturer. Any cost analyses presented in this material are estimates prepared by TechInsights from generally available data. While
TechInsights believes that these estimates reflect the probable costs, the actual producer did not supply the data, and therefore the actual costs may be different from these estimates. Furthermore, TechInsights extends
no warranties with respect to any information in this document, and shall bear no liability whatsoever for the use of the information.
Copyright © 2014, TechInsights. All rights reserved. Do not reproduce, distribute, disseminate, photocopy, fax, transmit, download to a shared database, or otherwise copy, transfer, sell, publish, or send this material, or
any portion thereof, by any means without the express written permission of TechInsights.
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support@techinsights.com
Product Overview
Product Description Integrated Circuit Metrics
Product Type Automotive IC Die Count** 14
Brand BMW IC Package Count** 10
Product Name & Model # High-Voltage Module Assembly MC1 F1
Cost Metrics
Official Release Date 4/1/2014 ?
Weight (grams) 76.1 Retail Price
Product Dimensions (mm) 98.58 x 87.01 x 1.58 Total Manufacturing Cost* $29.40
Electronics Cost** $27.05
Product Features
Manufacturing Cost Breakdown
Operating System N/A
Integrated Circuits $16.20 55.1%
Freescale, S9S12P64MFT, 16-Bit, 32 Modules, Discretes & Connectors $7.28 24.8%
Processor
MHz Substrates $1.65 5.6%
Component Insertion $1.27 4.3%
Connectivity SPI, CAN, ISO
Non-Electronic Parts $1.27 4.3%
Final Assembly & Test $1.08 3.7%
Card Test $0.65 2.2%
Interface N/A
Total $29.40 100.0%
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Copyright © 2014, TechInsights support@techinsights.com BMW i3 High-Voltage Module Assy. #15900-141020-KTd - Page 1563
Block Diagram
Copper Shunt / Resistor

Battery Voltage, Voltage
For Current Measurement
Channel Connector
10 - Clare IXYS 8 - AMS 9 - Linear Technology

#PLA171PH #AS8510 #LTC6655
OptoMOS Relay Data Acquisition Device for Battery Sensors Precision References
3 - Texas Instruments 6 - Texas Instruments

#ISO7241CQ #ISO7421E-Q1
Quad-Channel Digital Isolators Low-Power Dual Digital Isolators
1 - Freescale
Control 2 - Bosch Sensortec #S9S12P64MFT
#CY320EA 16-Bit Microcontroller,
Power Supply ASIC for Automotive Engine Control Units CAN Communication
CAN Bus
Connector
Estimated block diagram based on observation of this specific product implementation, manufacturer’s
data sheets where available, and best engineering judgment. Certain details of the interface circuitry
are not reflected in this block diagram. Partitioning and connectivity are speculative.
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Product Label
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Exterior Features
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Exterior Features
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Main Board (Side 1)
Grid = 1 cm
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Main Board (Side 1 IC Identification)
5 - Microchip 7 - Texas Instruments
#MCP6002E #SN74LVC1G126DCK
1 MHz Low-Power Op Amp Buffer Gate w/ 3-State Output
8 - AMS
#AS8510
Data Acquisition Device
for Battery Sensors
4 - ON Semiconductor
#NCV2951ACD3.3R2G
Low-Dropout Voltage
Regulator
9 - Linear Technology
#LTC6655
Precision References
3 - Texas Instruments
#ISO7241CQ
Quad-Channel Digital
Isolators (2-Die Pkg.)
1 - Freescale
10 - Clare IXYS
#S9S12P64MFT
#PLA171PH
16-Bit Microcontroller,
Single-Pole Normally Open
CAN communication
OptoMOS Relay (3-Die Pkg.)
2 - Bosch 6 - Texas Instruments

#CY320EA #ISO7421E-Q1
Power Supply ASIC for Automotive Engine Control Units Low-Power Dual Digital Isolators (2-Die Pkg.)
Grid = 1 cm
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Main Board (Side 2)
Can Bus
Battery
Copper Shunt / Resistor
Grid = 1 cm
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Main Board Cross-Section
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Substrate Data
Substrates
Min. Min.
ThruVia ThruVia BlindVia BlindVia
Assembly Area Trace Trace Thickness Routing Estimated
Manufacturer Core Material Mfg. Technology Layers Land Dia Hole Dia Land Dia Hole Dia
Name (cm²) Pitch Width (mm) Density Costs
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board KCE FR4 6 Layer conventional FR4 / HF 6 70.5 0.45 0.15 0.85 0.45 1.6 15.7 $ 1.65
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Integrated Circuit Components
Package Info Die Info Estimated Costs
Location
Pkg Length Width Height Length Width
Pkg Ref. # Brand Name Part Number Pkg Description Form Pin Count Die Ref # Die Qty Brand Name Part Number Description Each Total
Qty (mm) (mm) (mm) (mm) (mm)
1 1 Freescale S9S12P64MFT 16-Bit Microcontroller, CAN communication QFN 48 6.67 6.67 0.85 1.1 1 Freescale M01N 16-Bit Microcontroller, CAN communication 3.06 3.06 $ 3.250 $ 3.250
2 1 Bosch Sensortec CY320EA Power Supply ASIC for Automotive Engine Control Units DFN 36 15.80 11.00 3.33 2.1 1 Bosch Sensortec CY320EA Power Suppily ASIC for Automotive Engine Control Units 6.65 4.99 $ 6.350 $ 6.350
3.1 1 Texas Instruments TI 2007 ISO7241-Ric Quad-Channel Digital Isolators 3.52 1.23 $ 1.310 $ 1.310
3 1 Texas Instruments ISO7241CQ Quad-Channel Digital Isolators MCP - 2 Chips 16 10.35 7.40 2.30
3.2 1 Texas Instruments ISO7241-Lec Quad-Channel Digital Isolators 3.52 1.23 $ 0.290 $ 0.290
4 1 ON Semiconductor NCV2951ACD3.3R2G Low-Dropout Voltage Regulator SOP 8 5.00 3.88 1.47 4.1 1 ON Semiconductor 8B.4 3.3 ADJ Low-Dropout Voltage Regulator 1.72 1.32 $ 0.170 $ 0.170
5 1 Microchip MCP6002E 1 MHz Low-Power Op Amp SOP 8 3.00 3.00 0.90 5.1 1 Microchip 600N55 1 MHz Low-Power Op Amp 1.25 0.80 $ 0.105 $ 0.105
Main Board, Side 1 6.1 1 Texas Instruments ISO7421RID Low-Power Dual Digital Isolators 3.00 0.74 $ 0.860 $ 0.860
6 1 Texas Instruments ISO7421E-Q1 Low-Power Dual Digital Isolators MCP - 2 Chips 16 10.36 7.60 2.30
6.2 1 Texas Instruments ISO7241LED Low-Power Dual Digital Isolators 3.00 0.74 $ 0.190 $ 0.190
7 1 Texas Instruments SN74LVC1G126DCK Buffer Gate w/ 3-State Output SOP 5 2.95 1.60 1.19 7.1 1 Texas Instruments L126D Buffer Gate w/ 3-State Output 0.47 0.46 $ 0.040 $ 0.040
8 1 AMS AS8510 Data Acquisition Device for Battery Sensors SOP 10 6.90 5.30 1.80 8.1 1 AMS 18320 Data Acquisition Device for Battery Sensors 3.10 2.96 $ 2.170 $ 2.170
9 1 Linear Technology LTC6655 Precision References SOP 8 3.00 3.00 0.90 9.1 1 Linear Technology LTC6655 Precision References 2.23 1.55 $ 0.256 $ 0.256
10.1 2 Clare IXYS HV801A MOSFET 1.60 1.40 $ 0.140 $ 0.280
10 1 Clare IXYS PLA171PH Single-Pole Normally Open OptoMOS Relay MCP - 3 Chips 6 10.00 6.25 2.17
10.2 1 Clare IXYS ? PV5T Photo Diode 1.10 0.83 $ 0.930 $ 0.930
Totals 10 161 14 $16.20
Note: Supplemental information, such as IC package & die markings, is included in the Excel Bill of Materials (BOM) spreadsheet.
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Modular Components
Estimated
Package
Costs
Location Qty Brand Name Part Number Description
Pin Length Width
Each Total
Count (mm) (mm)
1 TDK-EPC Unknown Transformer: Transformer 9 16.50 14.80 $ 1.320 $ 1.320
Main Board, Side 1
1 Unknown Unknown Crystal: Ceramic 4 3.30 2.50 $ 0.200 $ 0.200
TOTALS 2 13 $1.52
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Active Discrete Components
Package Estimated Costs
Location Qty Functional Description
Length Width
Form Top Marking Pin Count Each Total
(mm) (mm)
1 Small Active Diode, SMT MG7 2BA 2 4.37 3.46 $0.020 $0.020
1 Small Active Transistor, Small TLHU 3 3.00 1.20 $0.030 $0.030
1 Small Active Transistor, Small CA3A5 6 1.68 1.20 $0.030 $0.030
1 Small Active Diode, SMT B310 2 6.83 6.00 $0.060 $0.060
Main Board, Side 1
2 Small Active Transistor, Small D1 6 1.50 1.10 $0.030 $0.060
1 Small Active Transistor, Small K84 A4 3 3.00 1.45 $0.030 $0.030
5 Small Active Transistor, Small KNC 3 2.90 1.30 $0.030 $0.150
6 Small Active Diode, SMT BC t37 2 2.90 1.90 $0.015 $0.089
TOTALS 18 55 $0.47
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Passive Discrete Components
Estimated
Package
Costs
Form Pin Count Each Total
2 Small Passive Precision Resistor 8 $1.820 $3.640

1 Capacitor Electrolytic, Small 2 $0.040 $0.040
1 Coil SMT, Small 4 $0.120 $0.120
Main Board, Side 1 1 Coil SMT, Small 4 $0.050 $0.050
1 Small Passive Cap, Res, Ferrite Array 8 $0.007 $0.007
1 Coil SMT, Small 2 $0.050 $0.050
1 Coil SMT, Small 2 $0.050 $0.050
197 Small Passive Cap, Res, Ferrite 2 $0.004 $0.788
TOTALS 206 434 $4.79
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Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Connector: TE 1-1452452-1 8 35.90 14.60 $0.250 $0.250
Main Board, Side 1
1 Connector: AMP 1-963 544-1 6 20.48 22.63 $0.250 $0.250
TOTALS 2 14 $0.50
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Electronic Assembly Metrics
Electronic Assembly Metrics by Assembly
(cm of routing per sq.cm of
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
General Area Assembly Name
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Main Board 70.5 6 423.0 15.7 238 677 3.4 9.6 2.8 76.10
System Totals 70.5 6 423 238 677 3.4 9.6 2.8 76.10
NOTE: Occasional inconsistencies in totals may be present due to rounding error.

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Electronics Costs by Assembly
Small Active Components
Connector Components
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Main Board $ 27.05 $ 16.20 $ 1.52 $ 0.47 $ 4.79 $ 0.50 $ 1.65 $ 1.27 $ 0.65
System Totals $ 27.05 $ 16.20 $ 1.52 $ 0.47 $ 4.79 $ 0.50 $ 1.65 $ 1.27 $ 0.65

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Counts by Assembly

Component Connections
Small Active Component
Connector Connections
Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Main Board 10 161 2 13 18 55 206 434 2 14 915
System Totals 10 161 2 13 18 55 206 434 2 14 915

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IC Metrics
Number of Package Connections
Die Area/Package Area Ratio
per sq.cm of Package Area

(die area / substrate area)
Substrate Tiling Density
Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
Die Area
(KBytes)
(KBytes)
(sq.mm)
(sq.mm)
Main Electronics Main Board 14 10 161 77.2 0.01 514.8 0.15 31.3 0 0
System Totals 14 10 161 77.2 514.8 0.15 31.3 0 0

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Electronic Costs Breakdown
Estimated Cost
of Electronics
(Includes Subsystem Electronics)
$27.05
Card Test
Insertion 5%
Substrates 9%
12%
Connector
Components
4%
Passive
Components
Integrated Circuits
17%
45%
Small Active
Components
3%
Modular & Odd Components

5%

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Vendor IC Cost Distribution
* Includes Subsystem Vendors & Associated Costs
Pkg. Brand Cost
Bosch Sensortec $6.35
Freescale $3.25
Texas Instruments $2.69
AMS $2.17
Clare IXYS $1.21
Linear Technology $0.26
Linear Tech Other
Other 4% 4%
ON Semiconductor $0.17
Microchip $0.11
Clare IXYS
7%
Bosch Sensortec
37%
AMS
13%
Texas Instruments
16%
Freescale
19%

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Non-Electronic Cost Estimate
Part ID Weight Est'd Cost Est'd

Subsystem Qty Description Fabrication Process Material Dimensions (mm)
No. (grams) Each Extended Cost
Miscellaneous 1 1 Copper Shunt Stamped + Formed + Welded Metal (Copper) 69 x 18 x 3.03 29.80 1.270 1.270
Total 1 Estimated Cost $1.27
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Cost Summary
Estimated Cost Totals Cost Total Notes:
Main Electronic Assemblies $ 27.05 Total cost does not include Non-recurring, R&D, G&A,
IP licensing fees/royalties, software, sales &
Non-Electronic Parts $ 1.27
marketing, distribution.
Final Assembly & Test $ 1.08
Assumes fully scaled production.
Total $ 29.40
Non-Electronic Parts
8%
Main Electronic Assemblies

92%
Final Assy & Test
8%
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Cost Estimation Process
(Overview & Discussion)
Cost modeling is tricky business. Multiple variables affect the actual production costs a manufacturer will experience, including development expenses,
unit volumes, supply-and-demand in component markets, die yield-curve maturity, OEM purchasing power, and even variations in accounting practices.
Different cost modeling methods employ different assumptions about how to handle these and other variables, but we can identify two basic
approaches: that which seeks to track short-term variations in the inputs to the production process, and that which strives to maintain comparability of
the output of the model across product families and over time.
TechInsights’ philosophy in cost modeling is to emphasize consistency across products and comparability over time, rather than to track short-term
fluctuations. During the past eight years, we have developed an estimation process that, while necessarily lacking an insider’s knowledge of the cost
factors that impact any one manufacturer, is reasonably accurate in its prediction of unit costs in high-volume production environments. We do not
claim that the model will produce the “right” answer for your firm’s environment. However, TechInsights does give customers a key analytical tool with
a complete set of data in our Bill of Materials (BOM). The BOM allows readers to 1) scrutinize the assumptions behind our cost model and 2) modify the
results based on substitution of their own component cost estimates where they have better information based on inside knowledge.
Our estimation process decomposes overall system cost into three major categories: Electronics, Mechanical, and Final Assembly. We begin by creating
a complete electronics bill-of-materials (BOM). Each component from the largest ASIC to the smallest discrete resistor is entered into a BOM table with
identifying attributes such as size, pitch, I/O count, package type, manufacturer, part number, estimated placement cost, and die size (if the component
is an IC). Integrated circuit costs are calculated from measured die area. Using assumptions for wafer size, process type, number of die per wafer,
defect density, and profit margin in combination with die area, an estimate of semiconductor cost is derived. Costs for discrete components and
interconnect are derived from assumption tables which relate BOM line items to specific cost estimates by component type and estimates for part
placement costs are included. For LCD display costs, we employ a model which tabulates expected cost from measurements of glass area, LCD type,
and total pixel resolution. When market costs are available from alternative sources, LCD panel costs are taken from and referenced to these sources.
Costs of non-electronic components such as molded plastic enclosures and metallic components are measured in terms of weight, size, thickness, type
of material, and complexity to arrive at their estimated cost. Other system items such as optics, antennae, batteries and displays are costed from a set
of assumption tables derived from a combination of industry data, average high volume costs, and external sources. For final assembly, we re-build the
torn-down product, tabulating stepwise assembly times as the reconstruction proceeds, to reach a total assembly time. Using a labor rate assumption
for the country of origin, we then calculate final assembly cost.
The three major categories for system cost contributors can be broken down into the subcategories of ICs, other electronics parts, displays, batteries
(as appropriate), camera modules, electronics assembly, non-electronic elements, and final assembly. By adding the cost estimates for each of these
subcategories, an overall estimated cost is derived for the system under evaluation. Product packaging and accessories (CDs, cables, etc.) are also
documented and estimated for their contribution to total cost as appropriate.
We believe our cost estimates generally fall within 15 percent of the “right answer,” which itself can vary depending on the market and OEM-specific
factors mentioned earlier. While the TechInsights cost model is imperfect, it yields important insights into technology and business dynamics along with
good first-order contributions to system cost by component type. Additionally, the consistency of approach and gradual modification to assumptions
(smoothing out frequently-shifting pricing factors) hopefully yields a credible, but user-modifiable, view of OEM high volume cost-to-produce.
Please feel free to contact us at support@techinsights.com with any comments, questions, or proposed corrections with respect to our cost estimates.
We welcome your input.
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Metrics (Overview & Discussion)
In our product teardowns, we gather a series of metrics for product profiling and comparison. Some metrics focus on system characteristics such as
total silicon area, total system semiconductor storage capacity, and total connection count. Other metrics reflect more subtle aspects of electronics
assembly such as connection density, average component I/O count, and silicon tiling density. Taken as a whole, the metrics allow deeper
comparison and benchmarking across multiple disciplines and multiple products. Key metrics we gather on products are described below along with
their definitions and what they tend to say about the system under study. Most metrics can be used both in comparing similar products for
benchmarking purposes or for quantifying differences in levels of complexity between dissimilar product types. Data fall into two categories; either
“raw” measured data or ratios of these measured data sets.
Total Silicon Area : This metric describes the total area of silicon as measured from X-ray or direct measurement of ICs. The area is an expression of
the enclosed bare die area and excludes packaging area. The aggregate silicon area is a good benchmark to show how integrated a design might be
when making comparisons to similar systems. Total silicon area also reflects the major cost driver for most systems we examine.
Silicon Tiling Density : Ratio of Total Silicon Area to total printed circuit board “projected” area (i.e. the simple board area and not the cumulative
surface area of both sides of the board). This metric directly reflects the level of efficiency and aggressiveness in integrated circuit packing and
placement. Single digit Silicon Tiling Density is typical but silicon coverage of 10% - 20% has been seen in some of the most advanced products we
have examined. Higher Tiling Densities often correspond with the use of chip scale packaging (CSPs) or other small form-factor IC packaging
technologies. High density circuit boards are also often a supporting technology.
Number of Parts : Total component count including ICs, passives, modules, connectors, etc., each separated out in our reporting.
Number of Connections : The total number of connections corresponds to the total number of interconnects introduced by the aggregate component
set and reflects any electrical connection observed (solder joints, adhesive interconnect, or connector terminal interfaces).
Opportunity Count : Opportunity Count is the total number of parts plus the total number of connections; the name reflects that each of these
constituent elements represents an opportunity for failure. A high opportunity count means more complex and riskier electronics assembly.
Average Pin Count (APC) : Ratio of total number of component terminals to total number of parts, at the system level. This metric reflects the
‘average’ terminal complexity of the components and often provide a signature of integration level and/or “digital-ness” of the overall product. Low
APCs reflect a high number of discretes or other low-pincount devices often characteristic of analog circuitry. Conversely, high APCs are
characteristic of highly integrated, high-pincount assemblies, often those composed largely of digital integrated circuits.
Connection Density : This metric is a ratio of the total Number of Connections to total printed circuit board assembly area, in units of connections per
sq. inch. The metric provides data related to the Silicon Tiling Density above, but with an emphasis on complexity of I/O interconnect. For example,
with a fixed Connection Density, high tiling density of low-pincount memory chips is more readily achieved than comparable silicon tiling of high
pincount logic.
Part Density : This metric is a ratio of the total Number of Parts to total printed circuit board assembly area, in units of components per sq. inch. The
metric provides data related to the Silicon Tiling Density and Connection Density as described above, but with an emphasis on density and complexity
of component packing efficiency. For example, low Part Density of high-pincount devices can pose an equal challenge in Connection Density to high
Part Density of low-pincount devices. High Part Density does reflect challenges in surface mount assembly in terms of (typically) precision of
placement, number of placements, and engineering of part clearances.
Routing Density (heuristic estimate) = 3*(Average Pin Count)*√Part Density. The Routing Density metric is an empirically derived relationship that
characterizes the wiring density of the interconnect used to support the interconnection of components in a planar electronic assembly (i.e. the circuit
board). Architectural issues such as bussing or other factors affecting the regularity of wiring impact the actual Routing Density needed to support a
given application, but the metric provides a ready measure of wiring complexity.
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Appendix
Click Here to Return to

Cost Analysis Page 223
Deep Dive Report
BMW i3 High-Voltage Module Board
3045
Report #15900-141202-RBc
Product Description
The High-Voltage Module Board is an assembly from
the BMW i3 hybrid electric vehicle. This board is used
as a power supply for other devices and assemblies in
the vehicle. A Texas Instruments LM25037 pulse-width
modulation (PWM) controller performs all of the heavy-
duty voltage regulation for off-board consumption,
while a Freescale MC9S08AW16A 8-bit microcontroller
handles communications and control from external
inputs. Input protection is provided by a Texas
Instruments’ ISO7421E-Q1 dual-channel digital
isolator. Supporting logic comes in the form of an ON
Semiconductor MC74VHC1G132 2-input NAND Schmitt-
Trigger and STMicroelectronics' LM2904Y dual op-amp.
Voltage regulation for on-board devices is supplied by
an STMicroelectronics' L4993MD.
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Product Overview
Product Type Automotive IC Die Count 8
Brand BMW IC Package Count 7
Product Name & Model # i3 High-Voltage Module Board, 3045
Cost Metrics
Official Release Date Unknown
Weight (grams) 76.4 (Measured) Retail Price
Product Dimensions (mm) 125.2 x 98.8 x 12.8 (Measured at Longest/Widest/Thickest Total Manufacturing Cost $15.38
Points) Electronics Cost $15.38
Product Features
Microcontroller Freescale MC9S08AW16A 8-Bit Microcontroller
Modules, Discretes & Connectors $7.66 49.8%
Support TI ISO7421E-Q1 Dual-Channel Digital Isolator
Substrates $1.72 11.2%
STMicroelectronics LM2904Y Dual Op-Amp Component Insertion $1.48 9.6%
Logic ON Semiconductor MC74VHC1G132 2-Input NAND Schmitt- Card Test $0.86 5.6%
Trigger
TI LM25037 PWM Controller 0.0%
Voltage Regulation
STMicroelectronics L4993MD LDO Regulator Total $15.38 100.0%
Copyright © 2014, TechInsights BMW i3 High-Voltage Module Brd. 3045 #15900-141202-RBc - Page 1590
Block Diagram
#LM25037
PWM Controller
Wire
Harness 10
6 - STMicroelectronics 4 - ON Semiconductor
#LM2904Y #MC74VHC1G132
Dual Operational Amplifier 2-Input NAND Schmitt-Trigger
1 - Freescale 3 - Texas Instruments

#MC9S08AW16A #ISO7421E-Q1
8-Bit Microcontroller Dual-Channel Digital Isolator
Wire
Harness 3
2 - STMicroelectronics
#L4993MD
LDO Regulator
Product Label
Main Board (Side 1)
Wire Harness 10 Wire Harness 3
Grid = 1 cm
#ISO7421E-Q1
Dual-Channel Digital Isolator
(2-Die Pkg.)
#MC74VHC1G132
2-Input NAND Schmitt-Trigger
1 - Freescale 2 - STMicroelectronics
#MC9S08AW16A #L4993MD
8-Bit Microcontroller LDO Regulator
Grid = 1 cm
Main Board (Side 2)
Grid = 1 cm
#LM2904Y
Dual Operational Amplifier
#LM25037
PWM Controller
Grid = 1 cm
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board KCE Electronics Public Co. Ltd. FR4 4 Layer conventional FR4 / HF 4 117.5 1.10 0.45 0.75 0.39 1.8 11.9 $ 1.72
Estimated
Package Info Die Info
Costs
Location
1 1 Freescale MC9S08AW16A 8-Bit Microcontroller SOP 44 10.00 10.00 1.37 1.1 1 Freescale MC9S08AW16 8-Bit Microcontroller 2.58 2.58 $ 1.870 $ 1.870
2 1 STMicroelectronics L4993MD LDO Regulator SOP 20 12.85 7.45 2.23 2.1 1 STMicroelectronics CUH44B LDO Regulator 2.00 1.65 $ 0.320 $ 0.320
Main Board, Side 1 3.1 1 Texas Instruments ISO7421LED Dual-Channel Digital Isolator 3.01 0.73 $ 0.770 $ 0.770
3 1 Texas Instruments ISO7421E-Q1 Dual-Channel Digital Isolator MCP - 2 Chips 16 10.30 7.30 2.35
3.2 1 Texas Instruments ISO7421RID Digital Isolator 3.00 0.73 $ 0.170 $ 0.170
4 2 ON Semiconductor MC74VHC1G132 2-Input NAND Schmitt-Trigger SOP 5 3.00 1.60 0.80 4.1 1 ON Semiconductor VHC1G 132 2-Input NAND Schmitt-Trigger 0.40 0.40 $ 0.043 $ 0.087
5 1 Texas Instruments LM25037 PWM Controller TSOP 16 5.25 4.39 1.00 5.1 1 Texas Instruments LM25037 PWM Controller 2.40 2.00 $ 0.343 $ 0.343
Main Board, Side 2
6 1 STMicroelectronics LM2904Y Dual Operational Amplifier SOP 8 5.00 3.40 1.56 6.1 1 STMicroelectronics G0158B6 Dual Operational Amplifier 1.00 1.00 $ 0.095 $ 0.095
Totals 7 114 8 $3.66
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Unknown 80F Crystal: Ceramic 6 3.30 1.30 $ 0.200 $ 0.200
Main Board, Side 1 1 TDK-EPC A2192 13433C Transformer: Transformer 9 16.80 14.90 $ 0.300 $ 0.300
1 Littelfuse 150VP 505 Fuse: Fuse - 10A, 450V 2 33.80 7.00 $ 0.930 $ 0.930
TOTALS 3 17 $1.43
Length Width
(mm) (mm)
2 Small Active Diode, SMT s10 38 Vishay logo 2 4.30 2.70 $0.015 $0.030
2 Small Active Transistor, Small 8 LD3A 3 3.20 1.70 $0.030 $0.060
Main Board, Side 1
1 Small Active Diode, SMT - SFS1068G Taiwan Semiconductor logo 334Y SFS1608G 3 10.30 9.15 $0.340 $0.340
2 Small Active MOSFET 36NM60N GKOVL VL CHN 336 STMicro logo e3 3 9.88 9.20 $1.380 $2.760
Main Board, Side 2 31 Small Active Transistor, Small Various 3 3.20 1.70 $0.030 $0.927
TOTALS 38 112 $4.12
Estimated
Package
Costs

2 Coil SMT, Small 2 $0.050 $0.100
Main Board, Side 1
1 Capacitor Electrolytic, Medium 1 $0.060 $0.060
2 Coil SMT, Small 2 $0.250 $0.500

Main Board, Side 2
1 Resistor Current Sense - 3W 1 $0.160 $0.160
TOTALS 235 468 $1.74
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Connector: Wire Harness3 3 17.76 17.50 $0.170 $0.170
Main Board, Side 1
1 Connector: Wire Harness10 10 36.60 17.50 $0.220 $0.220
TOTALS 2 13 $0.39
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 117.5 4 470 285 724 2.4 6.2 2.5 76.40
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 15.38 $ 3.66 $ 1.43 $ 4.12 $ 1.74 $ 0.39 $ 1.72 $ 1.48 $ 0.86
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 7 114 3 17 38 112 235 468 2 13 1009
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
Die Area
(KBytes)
(KBytes)
(sq.mm)
(sq.mm)
Main Electronics Main Board 8 7 114 20.5 0 320.6 0.06 35.6 0 0
System Totals 8 7 114 20.5 320.6 0.06 35.6 0 0
Estimated Cost
of Electronics
$15.38
Card Test
Insertion 6%
10% Integrated Circuits
24%
Substrates
11%

Connector 9%
Components Passive
3% Components
11% Small Active
Components
26%
Pkg. Brand Cost
Freescale $1.87
STMicroelectronics $0.41
On Semi
2%
ST Micro
11%
Texas Instruments Freescale

35% 52%
Cost Summary
Estimated Cost Totals

Main Electronic Assemblies $ 15.38
Total $ 15.38
Cost Total Notes:

Estimated final assembly cost includes labor only.
Total cost does not include Non-recurring, R&D, G&A, IP
licensing fees/royalties, software, sales & marketing,
distribution.
pincount logic.
Appendix

Deep Dive Report
BMW i3 Cell Control Module Board
3019
Report #15900-141203-RBc
Product Description
The Cell Control Module Board is an assembly from
the BMW i3 hybrid electric vehicle. This board is
primarily used to drive off-board devices via two
IXYS PLA171PH solid-state relays and three
different STMicroelectronics' high-side drivers
(VN5E050AJ, VND5E050ACJ, and VN5E160S), all of
which are then controlled by a Freescale
SC667168MVZ2 32-bit microcontroller. Three
separate Infineon TLE6250GV33 CAN transceivers
communicate with other parts of the vehicle, while
a Freescale MC9S12P64 16-bit microcontroller is
implemented for overall support. Voltage regulation
is accomplished by two STMicroelectronics B5973D
DC-DC converters, ON Semiconductor’s NCV8505
and NCV85053 linear regulators (which provide 5 V
and 3.3 V, respectively), and an Analog Devices
ADR366A precision voltage reference.
www.teardown.com
Product Overview
Product Name & Model # i3 Cell Control Module Board, 3019
Cost Metrics
Product Dimensions (mm) 177 x 141 x 24.8 (Measured) Total Manufacturing Cost $59.70
Electronics Cost $59.70
Product Features
Microcontroller Freescale SC667168MVZ2 32-Bit Microcontroller
Communication Infineon TLE6250GV33 CAN Transceiver Integrated Circuits $30.30 50.8%
Freescale MC9S12P64 16-Bit Microcontroller Modules, Discretes & Connectors $20.16 33.8%
STMicroelectronics VN5E050AJ High-Side Driver Substrates $3.64 6.1%
Support STMicroelectronics VND5E050ACJ 2-Ch. High-Side Driver Component Insertion $3.78 6.3%
STMicroelectronics VN5E160S High-Side Driver Card Test $1.82 3.0%
IXYS PLA171PH Sold-State Relay
STMicroelectronics B5973D 2 A DC-DC Converter Total $59.70 100.0%

ON Semiconductor NCV8505 LDO Linear Regulator (5 V)
Voltage Regulation
ON Semiconductor NCV85053 LDO Linear Regulator (3.3 V)
Analog Devices ADR366A Voltage Reference
www.teardown.com
Copyright © 2014, TechInsights support@techinsights.com BMW i3 Cell Ctrl. Module Brd. 3019 #15900-141203-RBc - Page 1615
Block Diagram
4 - Freescale 5 - STMicroelectronics
#MC9S12P64 #VN5E050AJ
16-Bit Microcontroller 5 - STMicroelectronics
High-Side Driver
#VN5E050AJ
High-Side Driver
13 - Infineon
#TLE6250GV33
CAN Transceiver Vehicle
Wiring18
#VN5E160S
High-Side Driver
#VN5E050AJ Vehicle
High-Side Driver Wiring
White12
#VND5E050ACJ
2-Channel High-Side Driver
13 - Infineon
#TLE6250GV33
CAN Transceiver
#TPS3808G33DBV 8 - Freescale 6 - Infineon
Programmable-Delay #SC667168MVZ2 #TLE4251
Supervisory Circuit 32-Bit Microcontroller ? Low Drop Voltage Tracker
13 - Infineon
#TLE6250GV33
CAN Transceiver
Voltage Regulation Vehicle
Wiring
1 - ON Semiconductor Blue12
#NCV8505
400 mA / 5 V LDO Linear Regulator
7 - ON Semiconductor Mod2 - IXYS

#NCV85053 #PLA171PH
400 mA / 3.3 V LDO Linear Regulator Solid-State Relay
#B5973D Mod2 - IXYS
2 A DC-DC Converter #PLA171PH
Solid-State Relay Vehicle
Wiring2
12 - Analog Devices
#ADR366A
Voltage Reference data sheets where available, and best engineering judgment. Certain details of the interface circuitry ? = Unconfirmed
www.teardown.com
Main Board (Side 1)
Vehicle Wiring - White12 Vehicle Wiring18
Vehicle Wiring2 Vehicle Wiring - Blue12

Grid = 1 cm
www.teardown.com
1 - ON Semiconductor 2 - Texas Instruments
#NCV8505 #TPS3808G33DBV
400 mA / 5 V LDO Linear Regulator Programmable-Delay Supervisory Circuit
5 - STMicroelectronics 3 - STMicroelectronics
#VN5E050AJ #B5973D
High-Side Driver 2 A DC-DC Converter
#VND5E050ACJ
2-Channel High-Side Driver
4 - Freescale
#MC9S12P64
10 - NXP Semiconductor
16-Bit Microcontroller
#74AHC1G08GW
2-Input AND Gate
#MC74HC74A 5 - STMicroelectronics
Dual D-Type Flip-Flop #VN5E050AJ
High-Side Driver
8 - Freescale
#SC667168MVZ2
32-Bit Microcontroller ?
#B5973D
2 A DC-DC Converter
#NCV85053
400 mA / 3.3 V LDO Linear Regulator 6 - Infineon
#TLE4251
Low Drop Voltage Tracker
Grid = 1 cm ? = Unconfirmed
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Main Board (Side 2)
Grid = 1 cm
www.teardown.com
#LM2903YDT
Dual Comparator
12 - Analog Devices #A4565 ?
#ADR366A Unknown
Voltage Reference
13 - Infineon
#TLE6250GV33
CAN Transceiver
13 - Infineon
#TLE6250GV33
14 - STMicroelectronics CAN Transceiver
#TSV358Y ?
#VN5E160S
High-Side Driver
#LM2903YDT
Dual Comparator
#LM2904AVQ
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Chin-Poon Industrial Co Ltd FR4 6 Layer Conventional FR4 / HF 6 232.4 0.40 0.20 0.60 0.25 1.8 15.4 $ 3.64
www.teardown.com
Location
1 1 ON Semiconductor NCV8505 400 mA / 5 V LDO Linear Regulator TO 8 10.40 8.50 4.60 1.1 1 ON Semiconductor uP 400 400 mA / 5 V LDO Linear Regulator 2.80 2.30 $ 0.411 $ 0.411
2 1 Texas Instruments TPS3808G33DBV Programmable-Delay Supervisory Circuit SOP 6 3.00 2.00 1.00 2.1 1 Texas Instruments TPS3808 Programmable-Delay Supervisory Circuit 1.40 0.73 $ 0.086 $ 0.086
3 2 STMicroelectronics B5973D 2 A DC-DC Converter SOP 8 5.00 4.00 1.50 3.1 1 STMicroelectronics CUD73E 2 A DC-DC Converter 2.74 1.96 $ 0.305 $ 0.609
4 1 Freescale MC9S12P64 16-Bit Microcontroller QFP 64 10.00 10.00 2.00 4.1 1 Freescale M01N 16-Bit Microcontroller 3.00 3.00 $ 3.570 $ 3.570
5 3 STMicroelectronics VN5E050AJ High-Side Driver SOP 12 5.00 4.00 1.00 5.1 1 STMicroelectronics VNQ4A High-Side Driver 2.66 1.62 $ 0.271 $ 0.813
Main Board, Side 1 6 1 Infineon TLE4251 Low Drop Voltage Tracker TO 6 10.00 9.20 4.60 6.1 1 Infineon TLE4251 Low Drop Voltage Tracker 1.90 1.55 $ 0.240 $ 0.240
7 1 ON Semiconductor NCV85053 400 mA / 3.3 V LDO Linear Regulator TO 8 10.40 8.50 4.40 7.1 1 ON Semiconductor uP 400 400 mA / 3.3 V LDO Linear Regulator 2.80 2.30 $ 0.411 $ 0.411
8 1 Freescale SC667168MVZ2 32-Bit Microcontroller ? BGA 324 23.00 23.00 2.50 8.1 1 Freescale M14X 32-Bit Microcontroller ? 8.34 7.22 $ 21.060 $ 21.060
9 1 ON Semiconductor MC74HC74A Dual D-Type Flip-Flop SOP 14 9.00 4.00 2.00 9.1 1 ON Semiconductor BC39 Dual D-Type Flip-Flop 0.55 0.55 $ 0.116 $ 0.116
10 1 NXP Semiconductor 74AHC1G08GW 2-Input AND Gate SOP 5 2.10 1.20 0.90 10.1 1 NXP Semiconductor LPC504A 2-Input AND Gate 0.50 0.40 $ 0.040 $ 0.040
11 1 STMicroelectronics VND5E050ACJ 2-Channel High-Side Driver SOP 12 5.00 3.50 1.00 11.1 1 STMicroelectronics VNQ5B 2-Channel High-Side Driver 3.90 2.10 $ 1.240 $ 1.240
12 1 Analog Devices ADR366A Voltage Reference SOP 5 3.00 1.60 0.90 12.1 1 Analog Devices ADR366 Voltage Reference 1.27 0.83 $ 0.081 $ 0.081
13 3 Infineon TLE6250GV33 CAN Transceiver SOP 8 5.00 4.00 1.50 13.1 1 Infineon S0964 M1 CAN Transceiver 2.10 1.95 $ 0.271 $ 0.814
14 1 STMicroelectronics TSV358Y ? Dual Operational Amplifier SOP 8 5.00 3.50 1.50 14.1 1 STMicroelectronics G1872A Dual Operational Amplifier 1.50 1.40 $ 0.148 $ 0.148
Main Board, Side 2 15 1 STMicroelectronics VN5E160S High-Side Driver SOP 8 5.00 4.00 1.50 15.1 1 STMicroelectronics VNQ9B High-Side Driver 2.30 1.30 $ 0.192 $ 0.192
16 2 STMicroelectronics LM2903YDT Dual Comparator SOP 8 5.00 4.00 1.50 16.1 1 STMicroelectronics G0393B6 Dual Comparator 0.92 0.84 $ 0.092 $ 0.183
17 1 NXP Semiconductor A4565 ? Unknown SOP 14 4.50 4.00 1.50 17.1 1 NXP Semiconductor PC2126A-1 Unknown 1.60 1.20 $ 0.164 $ 0.164
18 1 Texas Instruments LM2904AVQ Dual Operational Amplifier SOP 8 5.00 4.00 1.50 18.1 1 Texas Instruments 358E Dual Operational Amplifier 1.30 1.10 $ 0.118 $ 0.118
Totals 24 582 24 $30.30
www.teardown.com
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
2 IXYS PLA171PH Relay: Solid-State - SPST 6 9.80 6.40 $ 1.740 $ 3.480
Main Board, Side 1
1 Meder LI05-1A85-BV153 Relay: Signal, SPST 4 30.00 10.00 $ 5.390 $ 5.390
TOTALS 3 16 $8.87
www.teardown.com
Length Width
(mm) (mm)
2 Small Active Transistor, Large EPO 405 GRC 408 INFINEON, VNE09 ON SEMI 2873G 3 6.50 6.10 $0.220 $0.440
Main Board, Side 1 5 Small Active Diode, SMT Various 2 4.20 3.70 $0.015 $0.075
3 Small Active Transistor, Small Various 3 3.00 1.60 $0.030 $0.090
47 Small Active Transistor, Small Various 3 2.80 1.30 $0.030 $1.405

1 Small Active Diode, SMT T0 2 1.70 1.30 $0.015 $0.015
1 Small Active Transistor, Small RZL V6423 4 6.60 3.40 $0.030 $0.030
Main Board, Side 2 5 Small Active Diode, SMT (ST Micro logo) (e3) 6 MVY Z334 2 4.00 3.50 $0.015 $0.075
1 Small Active Diode, SMT S6 41 (Vishay logo) 2 6.70 6.00 $0.015 $0.015
1 Small Active MOSFET 4P0405 GRC400 (Infineon logo) 3 6.50 6.50 $0.480 $0.480
4 Small Active Transistor, Small BL W3 3 4.30 2.40 $0.030 $0.120
TOTALS 70 199 $2.74
www.teardown.com
Estimated
Package
Costs

2 Coil SMT, Medium 2 $0.120 $0.240
Main Board, Side 1
9 Capacitor Tantalum / Niobium, Small 2 $0.050 $0.450
3 Coil SMT, Small 4 $0.050 $0.150

Main Board, Side 2 7 Capacitor Tantalum, Small 2 $0.050 $0.350
TOTALS 630 1266 $3.85
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Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Connector: Vehicle Wiring - Blue12 12 31.00 27.00 $0.970 $0.970
1 Connector: Vehicle Wiring18 18 37.00 29.00 $2.240 $2.240
Main Board, Side 1
1 Connector: Vehicle Wiring - White12 12 37.00 18.00 $0.970 $0.970
TOTALS 4 44 $4.70
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 232.4 6 1394.4 731 2107 3.1 9.1 2.9 157.70

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 59.70 $ 30.30 $ 8.87 $ 2.74 $ 3.85 $ 4.70 $ 3.64 $ 3.78 $ 1.82

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 24 582 3 16 70 199 630 1266 4 44 2838

www.teardown.com
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
Die Area
(KBytes)
(KBytes)
(sq.mm)
(sq.mm)
System Totals 24 24 582 141.8 1240.1 0.11 46.9 0 0

www.teardown.com
Estimated Cost
of Electronics
$59.70
Card Test
Insertion 3%
6%
Substrates
6%
Connector
Components
51%
Passive
Components
6%
Small Active
Components
5%
Modular & Odd

Components
15%

www.teardown.com
Pkg. Brand Cost
Freescale $8.97
Infineon $1.05
NXP Semiconductor $0.20
Analog Devices $0.08
NXP Semi Texas
1% Instruments
1%
ON Semi
3%
Infineon
3%
ST Micro
11%
Freescale
66%

www.teardown.com
Cost Summary

Total $ 59.70
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Deep Dive Report
BMW i3 Battery Module Control Board
3052
Report #15900-141104-RBe
Product Description
The Control Board is a component of the Battery Module
designed into the BMW i3 hybrid electric vehicle. The
primary function of the Control Board is to monitor
battery status and send fault messages to a central
processor located in another part of the vehicle. Its key
devices include a Freescale MC9S12P64 16-bit
microcontroller and Linear Technology's LTC6801G
battery fault monitor and LTC6802G-2 battery stack
monitor. Support consists of Texas Instruments'
LM2904AVQ dual op-amp and CD74HC4538M dual
monostable multivibrator along with an LM2903YDT dual
comparator from STMicroelectronics. An Infineon
TLE7273-2EV50 provides general voltage regulation,
while Analog Devices supplies the ADR366 precision
voltage reference.
www.teardown.com
Product Overview
Product Name & Model # i3 Battery Module Control Board 3052
Cost Metrics
Product Dimensions (mm) 116.0 x 83.8 x 20.4 (Measured) Total Manufacturing Cost $19.43
Product Features
Microcontroller Freescale MC9S12P64 16-Bit Microcontroller
Linear Technology LTC6802G-2 Battery Stack Monitor Modules, Discretes & Connectors $6.42 33.0%
Support
Linear Technology LTC6801G Battery Fault Monitor Substrates $1.37 7.1%
STMicro LM2903YDT Dual Comparator Component Insertion $1.87 9.6%
Logic TI LM2904AVQ Dual Op-Amp Card Test $0.69 3.6%
TI CD74HC4538M Dual Monostable Multivibrator 0.0%
Infineon TLE7273-2EV50 (general)
Voltage Regulation Total $19.43 100.0%
Analog Devices ADR366 (precision)
www.teardown.com
Copyright © 2014, TechInsights support@techinsights.com BMW i3 Battery Mod. Ctrl. Brd. 3052 #15900-141124-RBe - Page 1639
Block Diagram
#LM2904AVQ
#LTC6802G-2
Battery Stack Monitor
5 - Freescale
#MC9S12P64
16-Bit Microcontroller 11 - Linear Technology
#LTC6801G
Battery Fault Monitor
Vehicle
Wiring 26
#LM2903YDT
Dual Comparator
9 - Texas Instruments 1 - Renesas ?

#CD74HC4538M #PS2703-1
Dual Monostable Multivibrator Optocoupler
1 - Renesas ?
#PS2703-1
Optocoupler
8 - Silicon Labs 7 - Infineon

#Si8422 #TLE6250GV33
Dual Digital Isolator CAN Transceiver
Vehicle
Wiring 12
10 - Infineon
#TLE7273-2EV50
LDO Regulator
www.teardown.com
Main Board (Side 1)
Grid = 1 cm Vehicle Wiring12 Vehicle Wiring26
www.teardown.com
#LM2904AVQ
Dual Operational Amplifier 4 - Analog Devices
2 - STMicroelectronics #ADR366
#LM2903YDT 3.3V Voltage Reference
Dual Comparator
5 - Freescale
#MC9S12P64
1 - Renesas
#PS2703-1
Optocoupler
Grid = 1 cm
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Main Board (Side 2)
Grid = 1 cm
www.teardown.com
#LTC6802G-2
Battery Stack Monitor
7 - Infineon #LTC6801G
#TLE6250GV33 Battery Fault Monitor
CAN Transceiver
8 - Silicon Labs 10 - Infineon

#Si8422 #TLE7273-2EV50
Dual Digital Isolator LDO Regulator
(2-Die Pkg.)
#CD74HC4538M
Dual Monostable Multivibrator
Grid = 1 cm
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Chin-Poon Industrial Co LTD FR4 4 Layer conventional FR4 / HF 4 86.5 0.50 0.20 0.60 0.40 1.7 17.0 $ 1.37
www.teardown.com
Location
1 2 Renesas PS2703-1 Optocoupler SOP 4 4.00 4.00 2.00 1.1 1 Renesas PS2703-1 Optocoupler 0.60 0.60 $ 0.050 $ 0.100
2 1 STMicroelectronics LM2903YDT Dual Comparator SOP 8 5.00 4.00 1.50 2.1 1 STMicroelectronics G0393B6 Dual Comparator 0.90 0.83 $ 0.091 $ 0.091
Main Board, Side 1 3 1 Texas Instruments LM2904AVQ Dual Operational Amplifier SOP 8 5.00 4.00 1.50 3.1 1 Texas Instruments 358E Dual Operational Amplifier 1.30 1.10 $ 0.130 $ 0.130
4 1 Analog Devices ADR366A 3.3V Voltage Reference SOP 5 3.00 1.60 0.90 4.1 1 Analog Devices ADR366 Voltage Reference 1.30 0.90 $ 0.086 $ 0.086
5 1 Freescale MC9S12P64 16-Bit Microcontroller QFP 64 10.00 10.00 2.00 5.1 1 Freescale M01N 16-Bit Microcontroller 3.00 3.00 $ 3.590 $ 3.590
Main Board, Side 2 6 1 Linear Technology LTC6802G-2 Battery Stack Monitor TSOP 44 13.00 5.00 2.00 6.1 1 Linear Technology 6802B-F Battery Stack Monitor 3.10 2.70 $ 1.870 $ 1.870
Main Board, Side 1 7 1 Infineon TLE6250GV33 CAN Transceiver SOP 8 5.00 4.00 1.50 7.1 1 Infineon S0964 M1 CAN Transceiver 2.10 2.00 $ 0.770 $ 0.770
8 1 Silicon Labs Si8422 Dual Digital Isolator MCP - 2 Chips 16 10.00 7.00 2.50 8.1 2 Silicon Labs Si8271B Dual Digital Isolator 1.10 0.80 $ 0.300 $ 0.600
9 1 Texas Instruments CD74HC4538M Dual Monostable Multivibrator SOP 16 5.00 5.00 1.00 9.1 1 Texas Instruments 4538T Dual Monostable Multivibrator 1.46 1.40 $ 0.192 $ 0.192
Main Board, Side 2
10 1 Infineon TLE7273-2EV50 LDO Regulator SOP 14 5.00 4.00 1.50 10.1 1 Infineon S1757C12 LDO Regulator 1.70 1.50 $ 0.196 $ 0.196
11 1 Linear Technology LTC6801G Battery Fault Monitor TSOP 44 13.00 5.00 2.00 11.1 1 Linear Technology 6801E Battery Fault Monitor 2.77 2.07 $ 1.460 $ 1.460
Totals 12 235 13 $9.08
www.teardown.com
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
Main Board, Side 1 1 NDK NX5032 Crystal: Ceramic 2 5.00 3.20 $ 0.200 $ 0.200
TOTALS 1 2 $0.20
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Length Width
(mm) (mm)
15 Small Active Diode, SMT L4, D, DF 2 1.60 1.20 $0.015 $0.224
Main Board, Side 1
15 Small Active Transistor, Small 2P2 A0,WT6 18, WR2 38 3 3.00 1.50 $0.030 $0.449
24 Small Active Diode, SMT OF > 2 1.60 1.40 $0.015 $0.358

1 Small Active Transistor - MJD45H11 (On Semiconductor logo) NFC37 J4 5H11g 4 6.50 6.00 $0.150 $0.150
Main Board, Side 2
7 Small Active Transistor, Small A1W 3n, A4W 41, 43T 41,44S 43, 27E E 3 3.00 1.40 $0.030 $0.209
3 Small Active Transistor, Small BL W3, AK S36 4 4.00 2.00 $0.030 $0.090
TOTALS 65 160 $1.48
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Estimated
Package
Costs

Main Board, Side 1 1 Capacitor Electrolytic, Small 2 $0.040 $0.040

TOTALS 280 562 $1.52
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Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
Main Board, Side 1
TOTALS 2 38 $3.21
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 86.5 4 346 360 997 4.2 11.5 2.8 60.00

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Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 19.43 $ 9.08 $ 0.20 $ 1.48 $ 1.52 $ 3.21 $ 1.37 $ 1.87 $ 0.69

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Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 12 235 1 2 65 160 280 562 2 38 1357

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IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
Die Area
(KBytes)
(KBytes)
(sq.mm)
(sq.mm)
System Totals 13 12 235 37.7 441.8 0.09 53.2 0 0

www.teardown.com
Estimated Cost
of Electronics
$19.43
Card Test
4%
Insertion
10%
Substrates
46%
Connector
Components
16%
Passive
Components Small Active
8% Components
8%

1%

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Pkg. Brand Cost
Freescale $3.59
Infineon $0.97
Silicon Labs $0.60
Renesas $0.10
Other
Analog Devices $0.09 Renesas Other
2%
Texas Instruments 1%
4%
Silicon Labs
7%
Freescale
39%
Infineon
11%
Linear Tech
36%

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Cost Summary
Total $ 19.43
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Deep Dive Report
BMW i3 Inner Power Module
Bottom Board2
2308
Report #15900-141211-RBc
Product Description
The Bottom Board2 described in this report is an
assembly from the Inner Power Module used in the
2014 BMW i3 hybrid electric vehicle. This board has no
semiconductor content other than a varistor. The total
bill of materials consists of three inductors (two
toroidal), one 80 Ampere fuse, one varistor, ten
capacitors, two screws, and eleven threaded, turret
style connectors.
www.teardown.com
Product Overview
Product Name & Model # i3 Inner Power Module, Bottom Board2, 2308
Cost Metrics
Product Dimensions (mm) 215.0 x 152.2 x 31.6 (Measured) Total Manufacturing Cos $35.97
Product Features
Inductors Toroidal (two), unknown (one, potted)
Passive Components $27.48 76.4%
Connectors $4.03 11.2%
Protection 80 Ampere Fuse, Varistor
Capacitors Ten (10)
Hardware Threaded Turrets (eleven), Screws (two)
Total $35.97 100.0%
Copyright © 2014, TechInsights BMW i3 Inner Pwr Module Bot Brd2 2308 #15900-141211-RBc – Page
1663
Schematic Diagram
9
11
2 10
4 3
5 7
6 8
1664
Main Board (Side 1)
Turret #11
2
1
Turrets
#1-4
3 4
Turret #7
Turret #10
Turret #8
Turret #9
Turret #5
Turret #6
Grid = 1 cm
1665
Main Board (Side 2)
Grid = 1 cm
1666
1667
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board AT&S FR4 4 Layer conventional FR4 / HF 4 291.4 12.00 12.00 8.00 4.00 1.7 2.8 $ 3.03
1668
1 Coil Large - Choke 4 $3.150 $3.150

2 Coil Large - Toroid 4 $7.340 $14.680
1 Misc Varistor, Fuse - 80A 2 $5.760 $5.760
1 Misc Varistor - SNF20 2 $0.270 $0.270
3 Resistor Throughhole - CMF60 2 $0.015 $0.045
Main Board, Side 1 4 Capacitor Poly Small TH 2 $0.140 $0.560
1 Capacitor Poly Large TH 2 $0.530 $0.530
TOTALS 18 42 $27.48
1669
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
3 Connector: Turret - #9 - 11 4 19.90 12.00 $0.410 $1.230
Main Board, Side 1
8 Connector: Turret - #1 - 8 4 8.00 8.90 $0.350 $2.800
TOTALS 11 44 $4.03
1670
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 291.4 4 1165.6 29 86 0.1 0.3 3.0 725.10
1671
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Main Board $ 35.80 $ - $ - $ - $ 27.48 $ 4.03 $ 3.03 $ 0.50 $ 0.76
System Totals $ 35.80 $ - $ - $ - $ 27.48 $ 4.03 $ 3.03 $ 0.50 $ 0.76
1672
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 0 0 0 0 0 0 18 42 11 44 115
1673
Estimated Cost
of Electronics
$35.80
Insertion Card Test
3% 2%
Substrates
8%
Connector
Components
11%
Passive
Components
78%
1674
1 1 Label - QR Code Die-Cut + Printed Plastic + Adhesive 7.2 x 7.2 x 0.02 0.05 0.050 0.050
Misc
2 2 Screw, 1/4-20 Extruded Stainless Steel 19.2 x 11.6 x 3.9 13.00 0.060 0.120
1675
Cost Summary
Total $ 35.97
Cost Total Notes:

distribution.
1676
1677
pincount logic.
1678
Appendix

Deep Dive Report
BMW i3 Boards 1 & 3
Inner Power Module
#2340
Report #15900-150127-TMb
Product Description
The Inner Power Module for the 2014 BMW i3
consists of two circuit boards and contains a total
of 21 IC packages. It weighs 3285 gm, the
majority of the weight being contributed by the
machined aluminum heat sink (1338 gm). The
logic in the module is handled by an Altera
#EPM2210 MAX II CPLD and a Microchip
#1746221-07 digital signal controller, both of
which are located on the controller board. There
are a total of six transformers, four of which are
potted up in an elastomer material within the
cavities of the massive heat sink. The input/output
of the module includes four wires directly soldered
along the edge of the Main Board.
www.teardown.com
Product Overview
Product Name & Model # i3 Inner Power Module, Boards 1 & 3
Cost Metrics
Official Release Date 5/2/2014
Weight (grams) 3285 (Measured) Retail Price
Product Dimensions 278 x 220 x 61.3
Total Manufacturing Cost $201.59
(mm) (Measured at Longest/Widest/Thickest Points)
Product Features
Controller Microchip #1746221-07 Digital Signal Controller
Processor Altera #EPM2210 MAX II CPLD
Transformers Total: (6)
Heat Sink Machined Aluminum (1338 gm)
Total $201.59 100.0%
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Copyright © 2015, TechInsights Boards 1 & 3 Inner Power Mod. 2340 #15900-150127-TMb - Page 1681
Block Diagram
Main Board
Controller Board 8#AMC1204-Q1
- Texas Instruments
Isolated Delta-Sigma Modulator
8#AMC1204-Q1
- Texas Instruments
Isolated Delta-Sigma Modulator
#AMC1204-Q1
11 - Microchip 13 - Altera Isolated Delta-Sigma Modulator
#dsPIC30F ? #EPM2210 Ribbon Connector
16-bit Microcontroller MAX II CPLD
5 - Avago
#ACPL-K49T
5 - Avago
Digital #ACPL-K49T
Optocoupler
Digital Optocoupler
#TLV2374QDRG4Q1
Operational Amplifier 7 - Silicon Labs
7#Si8233
- Silicon Labs
Isolated#Si8233
Drivers
7 - Silicon Labs
Isolated#Si8233
Drivers
7 - Silicon Labs
Isolated#Si8233
Drivers
Isolated Drivers
? = Unconfirmed
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Exterior Features
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Exterior Features
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Exterior Features
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Major Components (Side 1)
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Component Arrangement
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
Four Transformers remain embedded in the elastomeric
material inside the cavities of the heat sink. They were
once soldered to the circuit board.
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Teardown Sequence
Capacitor Support
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
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Main Board (Side 1)
280.0 mm
175.0 mm
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2 - International Rectifier
#AUIR2085S
Half Bridge Driver
1 - Allegro Microsystems 3 - Texas Instruments

#ACS715T #UCC2802QDRQ1
Current Sensor IC Current-Mode PWM
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Main Board (Side 2)
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5 - Avago
#ACPL-K49T
Digital Optocoupler
#TS3021
1.8 V High-Speed Comparator
#AMC1204-Q1
Isolated Delta-Sigma Modulator (3-Die Pkg.)
#TLV2371-Q1
Operational Amplifier
7 - Silicon Labs
#Si8233
Isolated Drivers (3-Die Pkg.)
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Controller Board (Side 1)
100.9 mm
77.1 mm
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Controller Board (Side 1 IC ID)
12 - Texas Instruments 13 - Altera

#SN74AHCT1G32-Q1 #EPM2210
Single 2-Input Positive-OR Gate MAX II CPLD 14 - Microchip
#QK ?
Voltage Regulator ?
11 - Microchip
#dsPIC30F ?
16-bit Microcontroller
#TS3021
1.8 V High-Speed Comparator
#74AHCT1G125
Single Bus Buffer Gate
#TLV2374Q1
Operational Amplifier ? = Unconfirmed
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Controller Board (Side 2)
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Controller Board (Side 2 IC ID)
19 - Texas Instruments 20 - STMicroelectronics
#74AHCT1G125 #TS3021
Single Bus Buffer Gate 1.8 V High-Speed Comparator
#LTC6905IS5-100
Fixed Frequency Oscillator
#SN74AHCT1G32-Q1
Single 2-Input Positive-OR Gate 21 - Infineon
#TLE8366EV50
1.8 A DC / DC Step-Down
Voltage Regulator
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Controller Board Cross-Section
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Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Controller Board AT&S FR4 4 Layer Conventional FR4 / HF 4 56.9 0.31 0.11 0.47 0.37 1.5 24.8 $ 1.05
Main Board AT&S FR4 6 Layer Conventional FR4 / HF 6 470.3 0.47 0.20 0.74 0.50 2.2 8.0 $ 5.76
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Location
1 1 Allegro Microsystems ACS715T Current Sensor IC TSOP 8 5.99 4.86 1.53 1.1 1 Allegro Microsystems 1712 Current Sensor IC 1.94 1.23 $ 0.171 $ 0.171
Main Board, Side 1 2 2 International Rectifier AUIR2085S Half Bridge Driver TSOP 8 6.00 4.75 1.50 2.1 1 International Rectifier IR20851 Half Bridge Driver 3.28 2.15 $ 1.070 $ 2.140
3 1 Texas Instruments UCC2802QDRQ1 Current-Mode PWM TSOP 8 5.90 5.00 1.50 3.1 1 Texas Instruments UCC3802 Current-Mode PWM 1.97 1.80 $ 0.226 $ 0.226
5 2 Avago ACPL-K49T Digital Optocoupler TSOP 8 11.56 5.95 2.94 5.1 1 Avago 51885179 Digital Optocoupler 0.84 0.67 $ 0.120 $ 0.240
7.1 2 Silicon Labs Si8273A Isolated Driver 1.47 0.78 $ 0.126 $ 1.010
7 4 Silicon Labs Si8233 Isolated Drivers MCP - 3 Chips 16 10.40 10.40 2.66
7.2 1 Silicon Labs Si8271A Driver Controller 1.46 0.77 $ 0.108 $ 0.430
Main Board, Side 2 8.1 1 Texas Instruments 5234 Modulator Controller 1.92 1.34 $ 1.032 $ 3.095
8 3 Texas Instruments AMC1204-Q1 Isolated Delta-Sigma Modulator MCP - 3 Chips 16 10.38 10.34 2.45
8.2 2 Texas Instruments AMC1204-ISO Z Isolated Delta-Sigma Modulator 2.41 0.75 $ 0.146 $ 0.877
9 2 Texas Instruments TLV2371-Q1 Operational Amplifier SOP 5 2.93 3.05 1.17 9.1 1 Texas Instruments TLV2371 Operational Amplifier 0.99 0.73 $ 0.074 $ 0.148
10 1 STMicroelectronics TS3021 1.8 V High-Speed Comparator SOP 5 5.00 2.91 0.80 10.1 1 STMicroelectronics G3021C 1.8 V High-Speed Comparator 0.79 0.69 $ 0.059 $ 0.059
11 1 Microchip dsPIC30F ? 16-bit Microcontroller QFP 64 12.06 11.89 1.10 11.1 1 Microchip 1746221-07 ? 16-bit Microcontroller 5.05 4.47 $ 5.614 $ 5.614
12 1 Texas Instruments SN74AHCT1G32-Q1 Single 2-Input Positive-OR Gate SOP 5 2.32 2.08 0.92 12.1 1 Texas Instruments TA 32J Single 2-Input Positive-OR Gate 0.58 0.48 $ 0.048 $ 0.048
13 1 Altera EPM2210 MAX II CPLD BGA 256 17.00 17.00 1.76 13.1 1 Altera Z1384 MAX II CPLD 4.64 4.35 $ 11.147 $ 11.147
Controller Board, Side 1 14 1 Microchip Unknown Voltage Regulator ? SOP 5 3.00 2.98 0.80 14.1 1 Microchip M7CC1 Voltage Regulator ? 1.19 1.00 $ 0.096 $ 0.096
15 3 STMicroelectronics TS3021 1.8 V High-Speed Comparator SOP 5 2.87 2.87 0.80 15.1 1 STMicroelectronics G3021C 1.8 V High-Speed Comparator 0.79 0.68 $ 0.064 $ 0.191
16 1 Texas Instruments TLV2374Q1 Operational Amplifier TSOP 14 6.31 5.08 1.29 16.1 1 Texas Instruments TLV2374 Operational Amplifier 2.00 1.10 $ 0.189 $ 0.189
17 1 Texas Instruments 74AHCT1G125 Single Bus Buffer Gate SOP 5 2.14 2.12 0.80 17.1 1 Texas Instruments TA 125A Single Bus Buffer Gate 0.57 0.44 $ 0.050 $ 0.050
18 1 Linear Technology LTC6905IS5-100 Fixed Frequency Oscillator SOP 5 2.91 2.75 0.80 18.1 1 Linear Technology LTC6905IS5-100 Fixed Frequency Oscillator 1.47 0.94 $ 0.103 $ 0.103
19 1 Texas Instruments 74AHCT1G125 Single Bus Buffer Gate SOP 5 1.18 2.10 0.80 19.1 1 Texas Instruments TA 125A Single Bus Buffer Gate 0.57 0.44 $ 0.038 $ 0.038
Controller Board, Side 2 20 1 STMicroelectronics TS3021 1.8 V High-Speed Comparator SOP 5 3.02 2.74 0.80 20.1 1 STMicroelectronics G3021C 1.8 V High-Speed Comparator 0.79 0.69 $ 0.064 $ 0.064
21 1 Infineon TLE8366EV50 1.8 A DC / DC Step-Down Voltage Regulator SOP 8 5.86 5.07 1.14 21.1 1 Infineon S1756E12 1.8 A DC / DC Step-Down Voltage Regulator
2.40 2.15 $ 0.303 $ 0.303
23 1 Texas Instruments SN74AHCT1G32-Q1 Single 2-Input Positive-OR Gate TSOP 5 2.22 2.10 0.76 23.1 1 Texas Instruments TA 32J Single 2-Input Positive-OR Gate 0.58 0.48 $ 0.048 $ 0.048
Totals 30 567 44 $26.29
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Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Unknown 1696097-02 Relay: SPDT 4 28.06 16.18 $ 2.210 $ 2.210
1 Matsushita AJTV351 Relay: SPDT 4 31.58 26.78 $ 2.830 $ 2.830
1 Unknown 1677631-05 Transformer: Transformer 9 19.65 14.80 $ 3.530 $ 3.530
Main Board, Side 1 1 Unknown 1668402-06 Transformer: Transformer 10 38.10 34.12 $ 5.470 $ 5.470
1 TDK-EPC P2177 Transformer: Transformer 8 57.10 50.60 $ 5.720 $ 5.720
TOTALS 8 62 $34.46
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Length Width
(mm) (mm)
1 Small Active Transistor, Small Y7 5 3 2.92 2.86 $0.030 $0.030
4 Small Active Diode, Throughhole Infineon D45E60 HRB335 2 9.20 9.90 $0.590 $2.360
1 Small Active Diode, SMT L6 A9 2 3.71 1.40 $0.015 $0.015
2 Small Active Diode, SMT 64R 2 1.84 0.80 $0.015 $0.030
1 Small Active Diode, SMT Ca G3 2 3.94 1.60 $0.015 $0.015
Main Board, Side 1 2 Small Active Transistor, Large S H1346 S BSP320 4 6.84 6.58 $0.090 $0.180
1 Small Active MOSFET ST N1HNK60 F329 4 7.00 6.40 $0.230 $0.230
1 Schottky Barrier Rectifier ON Semi MBR30HI00CT 1347A 3 10.10 8.50 $0.540 $0.540
1 Small Active MOSFET Infineon 65E6600 3 16.20 10.58 $0.490 $0.490
1 Bridge Rectifier Vishay PB3506 1348G 4 30.00 20.30 $1.040 $1.040
8 Small Active MOSFET Infineon 65F6080A HBR404 3 20.90 15.80 $4.470 $35.760
1 Small Active Diode, SMT ED RK 2 3.84 1.85 $0.015 $0.015
8 Small Active Diode, SMT B2 2 1.17 0.79 $0.015 $0.119

2 Small Active Diode, SMT 24 2 2.07 1.29 $0.015 $0.030
2 Small Active Diode, SMT 5J 39 2 8.00 5.65 $0.220 $0.440
8 Small Active Diode, SMT A 122 4104 2 3.22 2.65 $0.015 $0.119
2 Small Active Diode, SMT UJ 3B 2 5.23 2.63 $0.060 $0.120
2 Small Active Transistor, Small D1s 5 2.96 2.61 $0.030 $0.060
Main Board, Side 2 8 Small Active MOSFET 951 4 4.21 4.09 $0.180 $1.440
3 Small Active Transistor, Small T3FU 3 2.96 1.40 $0.030 $0.090
2 Small Active Transistor, Small 6CT 3 2.92 1.25 $0.030 $0.060
1 Small Active Diode, SMT 346 B1100 2 4.13 2.61 $0.060 $0.060
5 Small Active Diode, SMT L6 A9 2 2.55 1.53 $0.015 $0.075
1 Small Active Diode, SMT ED RK 2 2.72 1.75 $0.015 $0.015
4 Small Active Transistor, Small T3FU 3 3.00 1.43 $0.030 $0.120

Controller Board, Side 1 2 Small Active Transistor, Small K1R A9 3 2.94 1.47 $0.030 $0.060
1 Small Active Voltage Regulator 4284V33 GRA346 Infineon R 3 6.30 6.12 $0.640 $0.640
1 Small Active MOSFET 613SPV G1337 8 5.92 5.06 $0.330 $0.330

1 Small Active Diode, SMT ON Semi pC33 B1C 2 5.32 3.69 $0.060 $0.060
Controller Board, Side 2 1 Small Active Transistor, Small KY5 AD 3 2.96 1.31 $0.030 $0.030
3 Small Active Transistor, Small K38 AO 3 2.97 1.28 $0.030 $0.090
TOTALS 101 275 $45.11
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1 Coil SMT, Large 3 $1.050 $1.050

2 Capacitor Poly Large SM 2 $0.100 $0.200
1 Capacitor Poly Small TH 2 $0.650 $0.650
9 Capacitor Electrolytic, Large 2 $1.680 $15.120
Main Board, Side 1
3 Coil Throughhole 5 $1.550 $4.650
1 Coil SMT, Large 2 $0.590 $0.590
1 Capacitor Disk 2 $0.390 $0.390
2 Coil SMT, Large 4 $1.020 $2.040

Main Board, Side 2
1 Coil SMT, Large 2 $0.590 $0.590

Controller Board, Side 1 1 Capacitor Electrolytic, Medium 2 $0.130 $0.130

Controller Board, Side 2
2 Capacitor Tantalum / Niobium, Large 2 $0.130 $0.260
TOTALS 552 1118 $34.30
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Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Bd to Bd: Male or Female, Main Board 2 11.44 4.96 $0.200 $0.200
Controller Board, Side 1
1 Bd to Bd: Male or Female, Main Board 50 35.46 5.80 $0.420 $0.420
Controller Board, Side 2 1 Bd to Bd: Male or Female 50 36.81 9.96 $0.270 $0.270
4 Cable: Wire 1 91.20 7.80 $0.070 $0.280

2 Bd to Bd: Male or Female 2 12.28 11.58 $0.200 $0.400
1 Cable: Wire, Connector Board 2 77.20 11.55 $0.440 $0.440
Main Board, Side 1
1 Bd to Bd: Male or Female, Connector Board 2 11.50 8.93 $0.200 $0.200
1 Cable: Flex 50 42.40 37.80 $0.980 $0.980
1 Bd to Bd: Male or Female, Connector Board 50 34.60 9.97 $0.420 $0.420
TOTALS 13 214 $3.61
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(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Controller Board 56.9 2 113.8 24.8 310 1097 5.5 19.3 3.5 33.50
System Totals 527.2 4 1054.4 704 2236 1.3 4.2 3.2 1509.50

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Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Controller Board $ 25.39 $ 17.89 $ - $ 1.36 $ 2.08 $ 0.89 $ 1.05 $ 1.61 $ 0.52
System Totals $ 157.85 $ 26.29 $ 34.46 $ 45.11 $ 34.30 $ 3.61 $ 6.81 $ 3.87 $ 3.40

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Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Controller Board 14 392 0 0 15 47 278 556 3 102 1407
System Totals 30 567 8 62 101 275 552 1118 13 214 2940

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IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
Main Electronics Controller Board 14 14 392 55.9 0.01 560.6 0.10 69.9 0 0
System Totals 44 30 567 111.3 1600.8 0.07 35.4 0 0

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Estimated Cost
of Electronics
$157.85
Insertion
2%
Substrates Card Test
4% 2%
Connector
Components
2%
Integrated Circuits
17%
Passive
Components
22% Modular & Odd
Components
22%
Small Active
Components
29%

www.teardown.com
Pkg. Brand Cost
Altera $11.15
Microchip $5.71
International Rectifier $2.14
Silicon Labs $1.44
Other
Infineon $0.30
Avago $0.24
Allegro Microsystems $0.17
Linear Technology $0.10 STMicro Other
1% 3%
Silicon Labs
5%
International
Rectifier
8%
Altera
Texas 43%
Instruments
18%
Microchip
22%

www.teardown.com
1 1 Heat Sink / Support Cast + Stamped + Machined + Tapped Aluminum 280 x 222 x 55.3 1338.00 30.490 30.490
2 1 Electrolytic Capacitor Support Molded + Inserts Plastic + Brass 125.7 x 92.1 x 38.1 65.10 4.070 4.070
3 1 Transformer Potting Compound Extruded Elastomer 147.6 x 143.5 x 29.5 250.00 2.360 2.360
Main Components
4 3 Stand-Offs Extruded + Stamped + Tapped Metal 39.1 x 10.5 x 10.5 40.50 0.670 2.010
5 2 Component Support Clips Stamped + Formed Stainless Steel 66.8 x 30.8 x 9.5 25.20 0.780 1.560
6 4 Component Support Clips Stamped + Formed Stainless Steel 32.5 x 31.1 x 9.4 24.80 0.390 1.560
7 3 Component Tape Die-Cut Polyimide + Adhesive 84.6 x 38.1 x 0.11 1.20 0.060 0.180
8 2 Component Tape Die-Cut Polyimide + Adhesive 43.2 x 37.9 x 0.13 0.40 0.030 0.060
Miscellaneous
9 16 Screws Machined Metal 8.5 x 5.8 x 3 9.60 0.020 0.320
10 4 Screws Machined Metal 13.15 x 7.88 x 4 6.80 0.030 0.120
www.teardown.com
Final Ass’y Labor &
Test Cost Estimate
Final Assembly & Test

Made in China
Number of parts 43
Est'd number of steps 155
Est'd time (seconds) 588
Est'd final assembly cost $ 0.51
Est'd final test cost $ 0.50
www.teardown.com
Cost Summary
Cost Total Notes:
Total cost does not include Non-recurring, R&D, G&A,
Non-Electronic Parts $ 42.73 IP licensing fees/royalties, software, sales &
Final Assembly & Test $ 1.01 marketing, distribution.
Total $ 201.59 Assumes fully scaled production.

1%
21%
78%
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Deep Dive Report
BMW i3 Boards 4 & 5
Inner Power Module
2341
Report #15900-150211-TMb
Product Description
This Inner Power Module of the 2014 BMW i3
contains boards 4 & 5. It weighs 2825 gm, with
the heat sink consuming the majority of the
weight at 1192 gm. The two boards are electrically
connected through a ribbon cable and a large
cabled transformer. The smaller metal-backed
thermal board is screwed directly to the large
aluminum heat sink. The larger power board is
attached through standoffs and screwed to the
edges of the heat-sink cavities. A total of 30
screws were used in the assembly of the module.
The heat sink has three cavities, which are molded
in, and contains three coils, a film capacitor, and
the cabled transformer. These components are
soldered to the power board and potted-up inside
the cavities of the heat sink with a polymer.
www.teardown.com
Product Overview
Product Name & Model # i3 Inner Power Module, Boards 4 & 5
Cost Metrics
Product Dimensions 260 x 205 x 65
Product Features
Microchip #dsPIC33FJ64MCX02/X04 16-Bit
Processor
Digital Signal Controller Integrated Circuits $8.18 5.6%
Total $145.71 100.0%
www.teardown.com
Copyright © 2015, TechInsights support@techinsights.com Inner Power Modules, Boards 4 & 5 #15900-150211-TMb - Page
1725
Block Diagram
MOSFET MOSFET MOSFET
5 - Silicon Labs 5 - Silicon Labs 12 - Silicon Labs

#Si8233 #Si8233 #Si8235
MOSFET Isolated Drivers MOSFET Isolated Drivers MOSFET
Isolated Drivers
#LM2903-Q1
Dual Differential Comparator 10 - Microchip
#dsPIC33FJ64MCX02/X04 Flex
16-Bit Digital Signal Controller Interconnect
Cabled
Transformer
#LM2903-Q1 Coil 1 - Allegro Microsystems
Dual Differential Comparator #ACS715
Linear Current Sensor
Coil 8 - Texas Instruments
# TLV2374-Q1
Operational Amplifier Coil 1 - Allegro Microsystems
#ACS715
15 - Silicon Labs
#Si8233 Thermal
Isolated Drivers Board
3 - Avago
#ACPL-M49T
9 - Linear Technology 2 - Linear Technology Digital Optocoupler
#LT1933 #LT6004 Film Output Wire
600 mA Step-Down Regulator Operational Amplifier Capacitors Connectors
3 - Avago
#ACPL-M49T
Digital Optocoupler
www.teardown.com
1726
Exterior Features
www.teardown.com
1727
Exterior Features
www.teardown.com
1728
Exterior Features
www.teardown.com
1729
www.teardown.com
1730
www.teardown.com
1731
www.teardown.com
1732
Teardown Sequence
Power Board
Ribbon Cable
Connector
Heat Sink
Thermal Board
www.teardown.com
1733
Teardown Sequence
Component
Clips
www.teardown.com
1734
Teardown Sequence
Note: Components that were potted-up in the polymer
within the heat sink were de-soldered prior to removal of
the board. The potted components remain in the cavities
of the heat sink.
www.teardown.com
1735
Teardown Sequence
Ribbon Connector Transformer Bus
Bar Support
www.teardown.com
1736
Teardown Sequence
www.teardown.com
1737
Teardown Sequence
Polymer material and components

removed from cavities
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1738
Power Board (Side 1)
121.9 mm
233.2 mm
www.teardown.com
1739
Power Board (Side 1 IC Identification)
2 - Linear Technology 3 - Avago 5 - Silicon Labs
#LT6004 #ACPL-M49T #Si8233
Operational Amplifier Digital Optocoupler Isolated Drivers (3-Die Pkg.)
1 - Allegro Microsystems
#ACS715
#UCC27201
MOSFET Drivers
12 - Silicon Labs
#Si8235
#74AHCT1G125
Single-Bus Buffer Gate
11 - Texas Instruments # TLV2374-Q1
#LM2903-Q1 Operational Amplifier
Dual Differential Comparator
10 - Microchip 9 - Linear Technology

#dsPIC33FJ64MCX02/X04 #LT1933
16-Bit Digital Signal Controller 600 mA Step-Down Regulator
www.teardown.com
1740
Power Board (Side 2)
www.teardown.com
1741
Power Board (Side 2 IC Identification)
#LM2903-Q1 14 - Texas Instruments
Dual Differential Comparator #TL4050B25QDCKRQ1
Voltage Reference
15 - Silicon Labs
#Si8233
www.teardown.com
1742
Thermal Board (Side 1)
119.1 mm
106.4 mm
www.teardown.com
1743
Thermal Board (Side 2)
www.teardown.com
1744
Board Cross-Section
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1745
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Power Board AT&S FR4 6 Layer Conventional FR4 / HF 6 260.0 0.50 0.25 0.80 0.35 1.6 11.0 $ 3.90
Thermal Board AT&S ? Copper 1 Layer Aluminum 1 126.1 1.10 0.65 1.1 6.6 $ 1.32
www.teardown.com
1746
Estimated
Costs
Location
1 2 Allegro Microsystems ACS715 Linear Current Sensor SOP 8 4.82 6.08 1.61 1.1 1 Allegro Microsystems ST01 Linear Current Sensor 1.94 1.19 $ 0.167 $ 0.334
2 1 Linear Technology LT6004 Operational Amplifier TSOP 8 4.88 3.15 1.03 2.1 1 Linear Technology 6004 Operational Amplifier 1.47 1.37 $ 0.142 $ 0.142
3 2 Avago ACPL-M49T Digital Optocoupler SOP 5 7.02 3.67 2.79 3.1 1 Avago S18851 Digital Optocoupler 0.85 0.66 $ 0.069 $ 0.137
5.1 2 Silicon Labs Si8273A Amplifier Isolated Drivers 1.45 0.80 $ 0.122 $ 0.488
6 1 Texas Instruments UCC27201 MOSFET Drivers SOP 8 6.02 4.94 1.75 6.1 1 Texas Instruments UCC27201A MOSFET Drivers 2.20 1.41 $ 0.205 $ 0.205
Power Board, Side 1 7 1 Texas Instruments 74AHCT1G125 Single-Bus Buffer Gate TSOP 5 2.22 2.14 0.95 7.1 1 Texas Instruments TA 125A Single-Bus Buffer Gate 0.57 0.44 $ 0.047 $ 0.047
8 1 Texas Instruments TLV2374-Q1 Operational Amplifier TSOP 14 6.33 5.10 0.96 8.1 1 Texas Instruments TLV2374 Operational Amplifier 2.00 1.10 $ 0.189 $ 0.189
9 1 Linear Technology LT1933 600 mA Step-Down Regulator TSOP 6 2.85 2.80 1.10 9.1 1 Linear Technology 19433B 600 mA Step-Down Regulator 1.46 0.84 $ 0.100 $ 0.100
10 1 Microchip dsPIC33FJ64MCX02/X04 16-Bit Digital Signal Controller QFP 64 12.00 12.00 1.05 10.1 1 Microchip 107 AO 16-Bit Digital Signal Controller 5.04 4.48 $ 5.422 $ 5.422
11 1 Texas Instruments LM2903-Q1 Dual Differential Comparator SOP 8 5.96 4.96 1.69 11.1 1 Texas Instruments TLM393A Dual Differential Comparator 1.09 0.88 $ 0.103 $ 0.103
13 1 Texas Instruments LM2903-Q1 Dual Differential Comparator SOP 8 5.95 4.92 1.77 13.1 1 Texas Instruments LM2903-Q1 Dual Differential Comparator 1.09 0.88 $ 0.103 $ 0.103
14 1 Texas Instruments TL4050B25QDCKRQ1 Voltage Reference TSOP 5 2.22 2.10 0.86 14.1 1 Texas Instruments TL4050B25QDCKRQ1 Voltage Reference 1.14 0.75 $ 0.071 $ 0.071
Power Board, Side 2
Totals 17 216 25 $8.18
www.teardown.com
1747
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Unknown i662481-06 Transformer: Transformer 11 57.80 57.30 $ 6.970 $ 6.970
Power Board, Side 1
1 Unknown i670372-03 Transformer: Transformer 13 25.46 18.74 $ 4.640 $ 4.640
Power Board, Side 2 1 Unknown i607151-04 Transformer: Transformer 5 17.85 12.81 $ 1.190 $ 1.190
TOTALS 3 29 $12.80
www.teardown.com
1748
Length Width
(mm) (mm)
1 Small Active MOSFET Infineon 65F660A HRA335 R 3 6.54 6.08 $0.320 $0.320
1 Small Active Diode, SMT UJ 3B 2 4.08 2.58 $0.050 $0.050
2 Small Active Diode, SMT LM 3AA 2 4.32 3.50 $0.050 $0.100
16 Small Active Diode, SMT F15 A6 2 2.60 1.76 $0.015 $0.238
1 Small Active Diode, SMT FHX AO 2 2.76 1.78 $0.015 $0.015
3 Small Active Transistor, Large KL3 A0 3 2.95 1.29 $0.150 $0.450
Power Board, Side 1
1 Small Active Transistor, Large k84 A9 3 2.96 1.31 $0.150 $0.150
2 Small Active Transistor, Large K38 AO 3 2.94 1.28 $0.150 $0.300
6 Small Active Diode, SMT 333 LP 2 4.22 3.40 $0.050 $0.300
2 Small Active Transistor, Large Z8 3 3.02 1.31 $0.150 $0.300
1 Small Active Transistor, Large 851 4 4.50 2.53 $0.150 $0.150
2 Small Active Transistor, Large S G 1327 2N603L 4 6.62 3.52 $0.080 $0.160
6 Small Active Transistor, Small 3006 6 3.01 2.92 $0.030 $0.179
1 Small Active Transistor, Large K23 A9 3 2.95 1.29 $0.150 $0.150
2 Small Active Diode, 600V 10A STMicro STPSC1006D GK1HL VY CHN335 2 9.87 9.35 $5.480 $10.960
6 Small Active MOSFET Infineon 65F6080A HAK351 3 20.90 15.75 $1.900 $11.400
Power Board, Side 2 2 Small Active Diode, SMT UJ 3B 2 4.10 2.50 $0.050 $0.100
1 Small Active Diode, SMT FHX AO 2 2.70 1.75 $0.015 $0.015
1 Small Active Transistor, Large K38 AO 3 2.96 1.23 $0.150 $0.150
2 Small Active Transistor, Small 3006 6 3.01 2.92 $0.030 $0.060

Thermal Board, Side 1 4 Small Active Transistor, Large Infineon 4N06H1 GRA351 7 9.60 8.70 $1.060 $4.240
2 Small Active Diode, SMT ED 33 2 6.75 5.51 $0.015 $0.030
TOTALS 68 211 $29.86
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1749

1 Coil SMT, Large 2 $0.280 $0.280
Power Board, Side 1
1 Coil SMT, Large 2 $0.280 $0.280
1 Coil SMT, Large 2 $0.280 $0.280

1 Capacitor Film 2 $0.620 $0.620
Power Board, Side 2
1 Coil SMT, Large Through-Hole 2 $2.750 $2.750
2 Coil SMT, Large Through-Hole 2 $2.330 $4.660

Thermal Board, Side 1 7 Power Resistor 3 $0.670 $4.690
1 Coil SMT, Large 2 $0.400 $0.400
TOTALS 511 1029 $21.32
www.teardown.com
1750
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
4 Connector: Power, Threaded Stud 1 10.00 10.00 $1.560 $6.240
Power Board, Side 1 1 Cable: Wire, Ribbon Cable 26 41.10 16.10 $0.430 $0.430
1 Bd to Bd: Male or Female, Socket 26 21.60 9.93 $0.150 $0.150
2 Cable: Wire 2 37.80 7.20 $0.180 $0.360

2 Cable: Wire, Single 1 106.70 9.90 $0.270 $0.540
Power Board, Side 2
1 Cable: Wire, Ribbon Cable 12 64.10 20.40 $0.360 $0.360
1 Bd to Bd: Male or Female, Socket 12 20.30 3.64 $0.080 $0.080
2 Connector: Other, Bus Bar 1 26.10 13.20 $0.340 $0.680

Thermal Board, Side 1 7 Connector: Power, Threaded Stud 1 14.96 14.96 $1.560 $10.920
2 Connector: Power, Threaded Stud 1 9.95 9.95 $1.560 $3.120
1 Bd to Bd: Male or Female, Pin Socket 12 20.00 7.07 $0.080 $0.080
1 Cable: Wire, Bar Interconnect 1 76.20 14.20 $0.900 $0.900
TOTALS 27 112 $25.79
www.teardown.com
1751
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Power Board 260.0 6 1560.0 11.0 506 1326 2.0 5.1 2.6 955.00
Main Electronics Thermal Board 126.1 1 126.1 6.6 120 271 1.0 2.2 2.3 228.80
System Totals 386.1 7 1686.1 626 1597 1.6 4.1 2.6 1183.80

www.teardown.com
1752
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Power Board $ 79.25 $ 8.18 $ 12.80 $ 25.53 $ 15.88 $ 8.16 $ 3.90 $ 2.86 $ 1.95
Main Electronics Thermal Board $ 30.04 $ - $ - $ 4.33 $ 5.45 $ 17.63 $ 1.32 $ 1.09 $ 0.22
System Totals $ 109.29 $ 8.18 $ 12.80 $ 29.86 $ 21.32 $ 25.79 $ 5.22 $ 3.95 $ 2.17

www.teardown.com
1753
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Power Board 17 216 3 29 60 167 414 828 12 86 1832
Main Electronics Thermal Board 0 0 0 0 8 44 97 201 15 26 391
System Totals 17 216 3 29 68 211 511 1029 27 112 2223

www.teardown.com
1754
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
Main Electronics Power Board 25 17 216 52.8 0 837.5 0.06 25.8 0 0
System Totals 25 17 216 52.8 837.5 0.06 25.8 0 0

www.teardown.com
1755
Estimated Cost
of Electronics
$109.29
Insertion Card Test

4% 2%
Substrates
5%
Integrated
Circuits
7% Modular & Odd
Components
12%
Connector
Components
24%
Small Active
Components
Passive 26%
Components
20%

www.teardown.com
1756
Pkg. Brand Cost
Microchip $5.42
Silicon Labs $1.32
Allegro Microsystems $0.33
Avago $0.14
Linear
Allegro Tech Avago
4% 3% 2%
TI
9%
Silicon Labs Microchip

16% 66%

www.teardown.com
1757
1 1 Heat Sink/Support Cast + Tapped + Pulls Aluminum 265 x 200 x 51.5 1192.00 23.440 23.440
2 1 Cable Filter Bracket 1 Molded + Inserts Plastic 104.4 x 12.53 x 16.6 8.60 0.430 0.430
3 1 Cable Filter Bracket 2 Molded Plastic 104.4 x 12.35 x 22.1 9.50 0.330 0.330
4 1 Ferrite Filter Block Molded Metal 35 x 12.5 x 5 6.90 0.170 0.170
5 1 Component Clip Stamped Metal 66.86 x 30.8 x 9.5 12.60 0.780 0.780
6 2 Component Clip Stamped Metal 32.5 x 31.2 x 9.4 12.80 0.400 0.800
7 3 Standoff Extruded + Machined + Tapped Metal 42 x 9 x 4.8 42.90 0.890 2.670
Mechanicals
8 2 Standoff Extruded + Machined + Tapped Metal 47.12 x 10.9 x 4.85 31.80 0.980 1.960
9 1 Standoff Extruded + Machined + Tapped Metal 40.6 x 12.85 x 4.84 17.00 1.050 1.050
10 1 Component Thermal Tape Die-Cut Plastic + Adhesive 77.6 x 38.3 x 0.11 0.40 0.060 0.060
11 1 Component Thermal Tape Die-Cut Plastic + Adhesive 102.6 x 37.3 x 0.11 0.50 0.080 0.080
12 2 Labels Printed + Die-Cut Plastic + Adhesive 12.5 x 12.5 x 0.03 0.20 0.020 0.040
13 1 Dispensed Elastomer Dispensed Rubber x 218.10 2.090 2.090
14 30 Screws Machined Metal x 1386.00 0.020 0.600
www.teardown.com
1758
Test Cost Estimate

Made in China
Number of parts 56
www.teardown.com
1759
Cost Summary

1%
24%

75%
www.teardown.com
1760
www.teardown.com
1761
pincount logic.
www.teardown.com
1762
Appendix

Deep Dive Report
BMW i3 Power Module,
Top Board 2
2345
Report #15900-150226-SBa
Product Description
The Infineon-sourced BMW i3 Power
Module contains a 3-phase motor inverter
qualified and designed for Hybrid and
Electric Vehicle applications. It is rated at
800A / 650V and is based on Infineon’s
IGBT Trench – Field – Stop technology.
www.teardown.com
Product Overview
Product Description
Product Type Automotive
Brand BMW / Infineon
Product Name & Model # Power Module FS800R07A2E3
Official Release Date
Weight (grams) 1238
Product Dimensions 213.19 x 97.21 x 4.07
Product Cost
Copyright © 2015, TechInsights www.teardown.com

support@techinsights.com BMW i3 Power Module_15900-150226-SBa– Page 1765
Product Label

Exterior Features

Exterior Features

Exterior Features

Exterior Features

Teardown Sequence

Interior Features

Interior Features
Trench/Fieldstop IGBT


pincount logic.
Appendix

Deep Dive Report
Top Board2 (2348)
Report #15900-141117-RBc
Product Description
The Top Board2 is a circuit board from the
Inner Power Module of the 2014 BMW i3.
The Top Board2 is used as a driver for
separate, off-board insulated-gate bipolar
transistors (IGBT) and uses six Infineon
1ED020I12FA IGBT driver ICs. Control
consists of three LEM HC5F700-S current
transducers. A separate loop incorporates
a Texas Instruments ADS7955-Q1 10-bit,
8-channel A-D converter, with input from a
Linear Technology LT1638 dual operational
amplifier and an STMicroelectronics
LM2901 quad comparator. Voltage
regulation is accomplished by an
STMicroelectronics VIPER16 off-line
converter and two Infineon TLE4266 150
mA LDO regulators.
www.teardown.com
Product Overview
Product Name & Model # i3 Inner Power Module Top Board2
Cost Metrics
225.0 x 95.1 x 15.8
Product Dimensions (mm) Total Manufacturing Cost $62.56
(Measured at Longest/Widest/Thickest Points)
Product Features
Sensors LEM HC5F700-S Current Transducer (3)
IGBT Driver Infineon 1ED020I12FA Single IGBT Driver (6)
Linear Technology LT1638 Dual Op-Amp, Component Insertion $2.46 3.9%
Logic
STMicroelectronics LM2901 Quad Comparator Card Test $1.69 2.7%
STMicroelectronics VIPER16 Off-Line Converter,
Voltage Regulation
Infineon TLE4266 150 mA LDO Regulator (2) Total $62.56 100.0%
www.teardown.com
Copyright © 2014, TechInsights BMW i3 Inner Pwr. Module Top Brd2 #15900-141117-RBc - Page
1778
Block Diagram
6-Pin Board-to-Board Connectors
1 - Infineon
#1ED020I12FA Transformer
Single IGBT Driver 5 - International Rectifier
#AUIR2085S
1 - Infineon Half-Bridge Driver
#1ED020I12FA
Single IGBT Driver
Ribbon Cable
Connector
1 - Infineon
Single IGBT Driver
1 - Infineon
#1ED020I12FA
Single IGBT Driver
1 - Infineon
Single IGBT Driver
1 - Infineon
#1ED020I12FA
Single IGBT Driver
#LT1638HS8#PBF

#ISO7241C #LM2901YPT
Quad Digital Isolator Quad Comparator
#ADS7955-Q1
10-Bit, 8-Channel A-D Converter
2 - Infineon
4 - LEM Transformer
#TLE4266
#HC5F700-S 150 mA LDO Regulator
4 - LEM
Current Transducer
#HC5F700-S 9 - STMicroelectronics
4 - LEM
Current Transducer #VIPER16
#HC5F700-S Off-Line Converter
Current Transducer High-Current 8 - Infineon
Input #TLE4266
150 mA LDO Regulator
www.teardown.com
1779
Main Board (Side 1)
High-Current 6-Pin Board-to-Board Connectors

Input
Ribbon Cable
Connector
Grid = 1 cm
www.teardown.com
1780
1 - Infineon
#1ED020I12FA
Single IGBT Driver
(2-Die Pkg.)
2 - Infineon 3 - STMicroelectronics
#TLE4266 #LM2901YPT
150 mA LDO Regulator Quad Comparator
4 - LEM 4 - LEM 4 - LEM

#HC5F700-S #HC5F700-S #HC5F700-S
Current Transducer Current Transducer Current Transducer
7 - Linear Technology 6 - Texas Instruments 5 - International Rectifier

#LT1638HS8#PBF #ADS7955-Q1 #AUIR2085S
Dual Operational Amplifier 10-Bit, 8-Channel A-D Converter Half-Bridge Driver
Grid = 1 cm
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1781
Main Board (Side 2 & IC Identification)
8 - Infineon
#TLE4266
9 - STMicroelectronics 10 - Texas Instruments

#VIPER16 #ISO7241C
Off-Line Converter (2-Die Pkg.) Quad Digital Isolator (2-Die Pkg.)
Grid = 1 cm
www.teardown.com
1782
www.teardown.com
1783
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main AT&S FR4 6 Layer conventional FR4 / HF 6 202.1 0.50 0.25 0.75 0.40 1.6 12.5 $ 3.37
www.teardown.com
1784
Location
1.1 1 Infineon M2180D Input Decoder 1.90 1.10 $ 1.100 $ 6.600

1 6 Infineon 1ED020I12FA Single IGBT Driver MCP - 2 Chips 20 12.70 7.50 2.30
1.2 1 Infineon M2181C IGBT Driver 2.90 1.50 $ 0.360 $ 2.160
2 1 Infineon TLE4266 150 mA LDO Regulator TO 4 6.60 3.50 1.60 2.1 1 Infineon TLE4266 150 mA LDO Regulator 1.70 1.60 $ 0.165 $ 0.165
3 1 STMicroelectronics LM2901YPT Quad Comparator TSOP 14 5.20 4.50 0.90 3.1 1 STMicroelectronics G8339B6 Quad Comparator 1.10 1.10 $ 0.145 $ 0.145
Main, Side 1
4 3 LEM HC5F700-S Current Transducer TO 7 31.70 27.70 11.80 4.1 1 LEM 16.50.00.D33.0 Current Transducer 2.60 1.10 $ 8.800 $ 26.400
5 1 International Rectifier AUIR2085S Half-Bridge Driver SOP 8 5.00 3.80 1.50 5.1 1 International Rectifier IR20851 Half-Bridge Driver 3.30 2.10 $ 0.378 $ 0.378
6 1 Texas Instruments ADS7955-Q1 10-Bit, 8-Channel A-D Converter SOP 30 7.90 4.30 1.00 6.1 1 Texas Instruments ADS7953 10-Bit, 8-Channel A-D Converter 2.60 1.10 $ 0.289 $ 0.289
7 1 Linear Technology LT1638HS8#PBF Dual Operational Amplifier SOP 8 5.10 3.80 1.50 7.1 1 Linear Technology 1638 Dual Operational Amplifier 2.10 1.50 $ 0.199 $ 0.199
9.1 1 STMicroelectronics VL 80 Input Decoder 2.60 1.20 $ 0.250 $ 0.250
9 1 STMicroelectronics VIPER16 Off-Line Converter MCP - 2 Chips 16 10.00 3.80 1.40
Main, Side 2 9.2 1 STMicroelectronics CUP40B MOSFET 1.30 1.10 $ 0.040 $ 0.040
10.1 1 Texas Instruments ISO7241_R1_ Digital Isolator 3.50 1.30 $ 1.310 $ 2.620
10 2 Texas Instruments ISO7241C Quad Digital Isolator MCP - 2 Chips 16 10.40 7.30 2.30
10.2 1 Texas Instruments ISO7241_LEc_ Digital Isolator 3.50 1.30 $ 0.290 $ 0.580
Totals 18 257 27 $39.99
www.teardown.com
1785
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
Main, Side 1
TOTALS 4 45 $8.86
www.teardown.com
1786
Length Width
(mm) (mm)
2 Small Active MOSFET - NP90N055 90N055DG 3X M 4 6.30 6.00 $0.770 $1.540
1 Small Active MOSFET - STD3NK100Z STM logo G e3 D3NK1 00Z GK0ES347 4 6.50 6.00 $1.090 $1.090
1 Small Active Transistor, Small T0HQ 3 3.00 1.30 $0.030 $0.030
Main, Side 1 12 Small Active Transistor, Small 851, 951 4 4.50 2.50 $0.030 $0.359
34 Small Active Diode, SMT 344 ES2B,R2UY Z405,pE11 LP 2 4.30 3.70 $0.015 $0.507
1 Small Active Diode, SMT BYG 22D V3B,AP 39A 2 4.10 2.60 $0.015 $0.015
3 Small Active Transistor, Small 44 Y8 V3, K1R A9, K38 A0 3 3.00 1.30 $0.030 $0.090
1 Small Active Diode, SMT AA 2 1.60 1.20 $0.015 $0.015
Main, Side 2 1 Small Active Diode, SMT FHX A0 2 2.70 1.80 $0.015 $0.015
3 Small Active Diode, SMT 344 ES2B 2 4.30 3.70 $0.015 $0.045
3 Small Active Diode, SMT AP39AUM 3B 2 4.10 2.60 $0.015 $0.045
TOTALS 66 166 $3.81
www.teardown.com
1787
Estimated
Package
Costs
1 Coil SMT, Small 2 $0.050 $0.050

Main, Side 1 36 Small Passive Res, MELF 2 $0.004 $0.144
2 Capacitor Tantalum, Small 2 $0.050 $0.100

Main, Side 2
TOTALS 353 706 $1.55
www.teardown.com
1788
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Connector: Hi-Current Input 3 25.00 25.00 $0.020 $0.020
Main, Side 1 1 Bd to Bd: Ribbon Cable 40 30.50 4.30 $0.220 $0.220
6 Bd to Bd: 6-pin 6 32.00 8.00 $0.100 $0.600
TOTALS 8 79 $0.84
www.teardown.com
1789
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Main 202.1 6 1212.6 12.5 449 1253 2.2 6.2 2.8 231.60
System Totals 202.1 6 1212.6 449 1253 2.2 6.2 2.8 231.60

www.teardown.com
1790
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Main $ 62.56 $ 39.99 $ 8.86 $ 3.81 $ 1.55 $ 0.84 $ 3.37 $ 2.46 $ 1.69
System Totals $ 62.56 $ 39.99 $ 8.86 $ 3.81 $ 1.55 $ 0.84 $ 3.37 $ 2.46 $ 1.69

www.teardown.com
1791
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Main 18 257 4 45 66 166 353 706 8 79 1702
System Totals 18 257 4 45 66 166 353 706 8 79 1702

www.teardown.com
1792
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
Die Area
(KBytes)
(KBytes)
(sq.mm)
(sq.mm)
Main Electronics Main 27 18 257 89.6 0 3537.6 0.03 7.3 0 0
System Totals 27 18 257 89.6 3537.6 0.03 7.3 0 0

www.teardown.com
1793
Estimated Cost
of Electronics
$62.56
Insertion
Substrates 4% Card Test
Connector
Components 5% 3%
1%
Passive
Components
2%
Small Active
Components
6%
Modular & Odd

Components
14%
Integrated Circuits
65%

www.teardown.com
1794
Pkg. Brand Cost
LEM $26.40
Infineon $9.09
International Rectifier $0.38
ST Micro International
1% Rectifier1%
Linear Tech
<1%
Texas
Instruments
Infineon 9%
23%
LEM
66%

www.teardown.com
1795
Cost Summary

Total $ 62.56
Cost Total Notes:

distribution.
www.teardown.com
1796
www.teardown.com
1797
pincount logic.
www.teardown.com
1798
Appendix

Deep Dive Report
BMW i3 Inner Power Module,
Top Board Assembly 3
2334
Report #15900-150211-PKb
Product Description
This report concerns the Inner Power Module
for the Top Board Assembly 3 in the 2014
BMW i3. It contains (6) EPCOS B3202
capacitors for EMI suppression.
www.teardown.com
Product Overview
Product Name & Model # i3 Top Board Assy. 3, Inner Power Module
Cost Metrics
Product Dimensions (mm) 158.5 x 34.5 x 30.8 (Measured at Longest/Widest/Thickest Points) Total Manufacturing Cost $2.35
Product Features
EMI Suppression (6) EPCOS B3202 Capacitors
Connectors $0.38 16.2%
Total $2.35 100.0%
www.teardown.com
Copyright © 2015, TechInsights BMW i3 Top Board Assy. 3, Inner Power Module #15900-150211-PKb - Page 1801
Block Diagram
Connector
Connector
Connector
Connector
www.teardown.com
Main Board (Side 1)
EMI Supression Capacitors
Connector Connector
Connector Connector
Grid = 1 cm
www.teardown.com
Main Board (Side 2)
Grid = 1 cm
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board AT&S FR4 4 Layer conventional FR4 / HF 4 25.0 2.90 0.85 1.80 0.90 1.6 5.1 $ 0.46
www.teardown.com
Estimated
Package
Costs

Main Board, Side 1
6 Capacitor EMI Suppression 2 $0.190 $1.140
TOTALS 18 36 $1.19
www.teardown.com
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
2 Connector: Turret 1 14.90 14.00 $0.100 $0.200
Main Board, Side 1
2 Connector: Metal 1 23.00 12.10 $0.090 $0.180
TOTALS 4 4 $0.38
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 25.0 4 100 22 40 0.9 1.6 1.8 57.20

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 2.35 $ - $ - $ - $ 1.19 $ 0.38 $ 0.46 $ 0.17 $ 0.15

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 0 0 0 0 0 0 18 36 4 4 62

www.teardown.com
Estimated Cost
of Electronics
$2.35
Card Test
Insertion 6%
7%
Substrates Passive
20% Components
51%
Connector
Components
16%

www.teardown.com
Cost Summary
Total $ 2.35
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Deep Dive Report
BMW i3 Capacitor Bank
#2329
Report #15900-022615-DHa
www.teardown.com
Product Overview
Product Description
Product Type Automotive
Brand BMW / AVX - Kyocera
Product Name & Model # Capacitor Bank FHC06-0009-E
Weight (grams) 981.3 (Measured)
Capacitor Type Custom Design, Medium Power, Film
Product Features / Cost
Manufacturing Cost $20

BMW i3 Capacitor Bank 15900-022615-DHa – Page 1818
Product Label

Exterior Features


pincount logic.
Appendix

Deep Dive Report
Top Board1
2318
Report #15900-141215-RBc
Product Description
The Top Board1 is a circuit board from the Inner Power
Module in the 2014 BMW i3. Two Infineon TC1797
microcontrollers along with an Altera EPM570T100 MAX II
complex programmable logic device (CPLD) provide the
brains on the board. Communication is from two NXP
Semiconductor TJA1051T/3 CAN transceivers, while an
Analog Devices AD2S1210 Resolver-to-Digital Converter
provides the angular position of a motor somewhere within
the vehicle. Power control is assisted with input from a LEM
HC5F700-S current transducer.
www.teardown.com
Product Overview
Product Name & Model # i3 Inner Power Module, Top Board1, 2318
Cost Metrics
Product Dimensions 232.0 x 190.0 x 56.4 (Measured) Total Manufacturing Cost $125.24
(mm) Electronics Cost $125.24
Product Features
Infineon TC1797 32-bit Microcontroller (2)
Processor
Altera EPM570T100 MAX II CPLD Integrated Circuits $80.93 64.6%
Communications NXP Semiconductor TJA1051T/3 CAN Transceiver
Data Analog Devices AD2S1210 R/D Converter
Sensors LEM HC5F700-S Current Transducer

Total $125.24 100.0%
Copyright © 2014, TechInsights BMW i3 Inner Pwr Module Top Brd1 2318 #15900-141215-RBc – Page 1825
Block Diagram
#74LVC245A
16 - Bus
Octal NXPTransceiver
Semiconductor
#74LVC245A
Connector2a 16 - NXP Semiconductor
Octal Bus Transceiver
#74LVC245A
Connector2b 16
#74LVC245A
- NXP Semiconductor
#74LVC245A
10 - Analog Devices 1 - Infineon

#AD2S1210 #TC1797
1 - Infineon 26 - NXP Semiconductor
R/D Converter 32-Bit Microcontroller
Harness12 #TC1797 #TJA1051T/3
26 - NXP
CAN Semiconductor
Transceiver
#TJA1051T/3
CAN Transceiver
9 - Altera
#EPM570T100
MAX II CPLD
Vehicle
5 - LEM Wiring
#HC5F700-S
Ribbon Current Transducer
Cable26
7 - Infineon
#TLE7230R
Octal Low-Side Switch
#VN5050AJ
High Side Driver
Ribbon #INA193AQDBVRQ1
Cable40 Current Shunt Monitor
13 - Infineon
#TLE4266
13 - Infineon
150 mA LDO Regulator 14 - Linear Technology
#TLE4266 #LTC4412
150 mA LDO Regulator 14 - Path
Power Linear Technology
Controller 2 - Bosch Sensortec
#LTC4412 #CY320
Power Path Controller 2 - Bosch
Power SupplySensortec
ASIC
#CY320
Power Supply ASIC
#LT3757
DC-DC Converter
Ribbon
Cable50
Main Board (Side 1)
Ribbon Cable40
Ribbon Cable50
Connector2a
Harness12
Connector2b
Vehicle Wiring
Ribbon Cable26
Grid = 1 cm
Turret Connectors
1 - Infineon
#TC1797
32-Bit Microcontroller 2 - Bosch Sensortec
4 - Texas Instruments #CY320
#LM2903AVQ Power Supply ASIC
Dual Comparator
#TLV2374QPWR
Quad Operational Amplifier
10 - Analog Devices
#AD2S1210
R/D Converter
9 - Altera
#EPM570T100
MAX II CPLD

#TI TL082QDRQ1.pdf #LM2902KAVQPWRQ1
Operational Amplifier Quad Operational Amplifier
#LM2903AVQ
Dual Comparator
1 - Infineon
#TC1797
5 - LEM
#HC5F700-S
Transducer
7 - Infineon 6 - STMicroelectronics
#TLE7230R #VN5050AJ
Grid = 1 cm Octal Low-Side Switch High Side Driver
#74AHCT541
Octal Buffer / Line Driver
13 - Infineon
#TLE4266-2
14 - Linear Technology 17 - Linear Technology

#LTC4412 #LT3757
Power Path Controller DC-DC Converter
15 - STMicroelectronics 14 - Linear Technology

#LM2904WYPT #LTC4412
Dual Operational Amplifier Power Path Controller
#74LVC245A
#LM2904WYPT
#INA193AQDBVRQ1
Current Shunt Monitor
13 - Infineon
#TLE4266-2
#74LVC245A
#74AHCT541
Grid = 1 cm
Main Board (Side 2)
Grid = 1 cm
#LM2904WYPT
27 - Analog Devices
#AD8202
Differential Amplifier
#SN74HC14QPWR
Hex Schmitt-Trigger Inverters 26 - NXP Semiconductor
#TJA1051T/3
CAN Transceiver
#MC74VHCT132A
Quad 2-Input NAND
#74HCT74
Dual D-Type Flip-Flop
#LM2903AVQ
21 - STMicroelectronics Dual Comparator
#LM2901YPT
Quad Comparator
22 - NXP Semiconductor #LM2904WYPT
#74AHCT541 Dual Operational Amplifier
#LM2903AVQ
Dual Comparator
#LM2901YPT
Quad Comparator
#74HCT30
Grid = 1 cm 8-Input NAND Gate
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board AT&S FR4 6 Layer Conventional FR4 / HF 6 411.4 0.40 0.20 0.60 0.30 1.5 18.2 $ 5.23
Location
1 2 Infineon TC1797 32-Bit Microcontroller BGA 416 27.00 27.00 1.70 1.1 1 Infineon TC1797 32-Bit Microcontroller 9.00 8.70 $ 22.390 $ 44.780
2 2 Bosch Sensortec CY320 Power Supply ASIC SOP 36 16.10 10.90 3.30 2.1 1 Bosch Sensortec CY320 Power Supply ASIC 6.60 5.00 $ 5.860 $ 11.720
3 1 Texas Instruments LM2902KAVQPWRQ1 Quad Operational Amplifier SOP 14 5.00 4.50 1.00 3.1 1 Texas Instruments LM2902KAVQPWRQ1 Quad Operational Amplifier 1.70 1.50 $ 0.198 $ 0.198
4 2 Texas Instruments LM2903AVQ Dual Comparator SOP 8 5.00 4.00 1.80 4.1 1 Texas Instruments LM2903AVQ Dual Comparator 1.20 0.90 $ 0.105 $ 0.209
5 1 LEM HC5F700-S Current Transducer TO 7 31.70 27.70 11.80 5.1 1 LEM 16.50.00.023.0 Current Transducer 2.60 1.10 $ 8.800 $ 8.800
6 1 STMicroelectronics VN5050AJ High Side Driver SOP 12 4.90 3.90 1.10 6.1 1 STMicroelectronics VN5050AJ High-Side Driver 2.80 1.60 $ 0.279 $ 0.279
7 1 Infineon TLE7230R Octal Low-Side Switch SOP 36 15.90 11.00 3.50 7.1 1 Infineon TLE7230R Octal Low-Side Switch 3.80 2.00 $ 2.060 $ 2.060
8 2 Texas Instruments TL082QDRQ1 Operational Amplifier SOP 8 5.00 4.00 1.50 8.1 1 Texas Instruments TL082 Operational Amplifier 2.00 1.80 $ 0.221 $ 0.441
Main Board, Side 1 9 1 Altera EPM570T100 MAX II CPLD QFP 100 14.00 14.00 1.50 9.1 1 Altera EPM570T100 MAX II CPLD 3.20 3.10 $ 4.590 $ 4.590
10 1 Analog Devices AD2S1210 R/D Converter QFP 48 7.00 7.00 1.40 10.1 1 Analog Devices AD2S1210 R/D Converter 4.00 3.90 $ 3.250 $ 3.250
11 1 Texas Instruments TLV2374QPWR Quad Operational Amplifier SOP 14 5.00 4.50 1.20 11.1 1 Texas Instruments TLV2374QPWR Quad Operational Amplifier 2.00 1.10 $ 0.181 $ 0.181
12 2 NXP Semiconductor 74AHCT541 Octal Buffer / Line Driver SOP 20 6.50 4.30 1.00 12.1 1 NXP Semiconductor 74AHCT541 Octal Buffer / Line Driver 1.10 0.70 $ 0.161 $ 0.322
14 2 Linear Technology LTC4412 Power Path Controller SOP 6 3.00 1.50 1.00 14.1 1 Linear Technology LTC4412 Power Path Controller 1.50 0.80 $ 0.110 $ 0.220
15 3 STMicroelectronics LM2904WYPT Dual Operational Amplifier SOP 8 4.50 3.20 0.80 15.1 1 STMicroelectronics LM2904WYPT Dual Operational Amplifier 1.30 1.20 $ 0.119 $ 0.358
16 5 NXP Semiconductor 74LVC245A Octal Bus Transceiver SOP 20 6.50 4.50 1.00 16.1 1 NXP Semiconductor LVC245 Octal Bus Transceiver 1.10 0.70 $ 0.162 $ 0.812
17 1 Linear Technology LT3757 DC-DC Converter SOP 10 3.00 3.00 1.00 17.1 1 Linear Technology LT3757 DC-DC Converter 1.50 1.10 $ 0.150 $ 0.150
18 1 Texas Instruments SN74HC14QPWR Hex Schmitt-Trigger Inverters SOP 14 5.00 4.50 1.00 18.1 1 Texas Instruments SN74HC14QPWR Hex Schmitt-Trigger Inverters 1.40 1.30 $ 0.170 $ 0.170
19 1 ON Semiconductor MC74VHCT132A Quad 2-Input NAND SOP 14 8.60 4.00 1.50 19.1 1 ON Semiconductor MC74VHCT132A Quad 2-Input NAND 0.80 0.70 $ 0.126 $ 0.126
20 1 NXP Semiconductor 74HCT74 Dual D-Type Flip-Flop SOP 14 5.00 4.50 1.00 20.1 1 NXP Semiconductor 74HCT74 Dual D-Type Flip-Flop 0.70 0.60 $ 0.110 $ 0.110
21 1 STMicroelectronics LM2901YPT Quad Comparator SOP 14 5.00 4.50 1.00 21.1 1 STMicroelectronics G8339R6 Quad Comparator 1.10 1.10 $ 0.134 $ 0.134
22 1 NXP Semiconductor 74AHCT541 Octal Buffer / Line Driver SOP 20 6.50 4.30 1.00 22.1 1 NXP Semiconductor 74AHCT541 Octal Buffer / Line Driver 1.10 0.70 $ 0.161 $ 0.161
Main Board, Side 2
23 2 Texas Instruments LM2903AVQ Dual Comparator SOP 8 5.00 4.00 1.80 23.1 1 Texas Instruments LM2903AVQ Dual Comparator 1.20 0.90 $ 0.105 $ 0.209
24 2 NXP Semiconductor 74HCT30 8-Input NAND Gate SOP 14 5.00 4.30 0.90 24.1 1 NXP Semiconductor 74HCT30 8-Input NAND Gate 1.30 1.10 $ 0.153 $ 0.305
25 2 STMicroelectronics LM2904WYPT Dual Operational Amplifier SOP 8 4.50 3.20 0.80 25.1 1 STMicroelectronics LM2904WYPT Dual Operational Amplifier 1.30 1.20 $ 0.119 $ 0.238
26 2 NXP Semiconductor TJA1051T/3 CAN Transceiver SOP 8 5.00 4.00 1.30 26.1 1 NXP Semiconductor TJA1051T/3 CAN Transceiver 2.00 1.50 $ 0.211 $ 0.423
27 1 Analog Devices AD8202 Differential Amplifier SOP 8 4.00 4.00 1.00 27.1 1 Analog Devices AD8202 Differential Amplifier 1.10 1.10 $ 0.104 $ 0.104
Main Board, Side 1 28 1 Texas Instruments INA193AQDBVRQ1 Current Shunt Monitor SOP 5 2.90 1.60 1.10 28.1 1 Texas Instruments INA193AQDBVRQ1 Current Shunt Monitor 1.30 0.80 $ 0.080 $ 0.080
Totals 46 1530 46 $80.93
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
2 Unknown R40.0 OD3M Crystal: Ceramic 4 3.00 2.00 $ 0.200 $ 0.400
Main Board, Side 1 2 Unknown Unknown Misc: Studs 4 13.10 8.00 $ 0.150 $ 0.300
2 Infineon BTN7930B Misc: Half-Bridge 8 10.00 8.90 $ 2.070 $ 4.140
Main Board, Side 2 1 Unknown R40.0 OD3M Crystal: Ceramic 4 3.20 2.50 $ 0.200 $ 0.200
TOTALS 7 36 $5.04
Length Width
(mm) (mm)
1 Small Active MOSFET - BSO613SPVG 613SPV G1336 8 4.00 3.50 $0.310 $0.310
1 Small Active Diode, SMT S6 3A 2 8.00 6.00 $0.015 $0.015
15 Small Active Diode, SMT BYG 22D V41 2 4.50 2.80 $0.015 $0.224
4 Small Active Transistor, Large FZT 491A 4 6.00 3.00 $0.150 $0.600
Main Board, Side 1
14 Small Active Transistor, Small 3BW, K1R A9, 33 Y2 V3, 3 3.00 1.00 $0.030 $0.419
4 Small Active MOSFET - NP90N055 90N055 DG 3X M 3 6.50 6.00 $0.090 $0.360
1 Small Active Transistor, Small S PC 36 6 2.50 1.50 $0.030 $0.030
5 Small Active MOSFET 75P04 LG 402 029 8 5.00 4.50 $0.310 $1.550
4 Small Active Diode, SMT (ST Micro logo) (e3) R2UY Z351, (logo) 325 LK, LTP 2 4.00 3.50 $0.015 $0.060
Main Board, Side 2 13 Small Active Transistor, Small K1R A9, 33 Y2 V3, EAN 38, K84 A0, K38 A0 3 2.50 1.50 $0.030 $0.389
6 Small Active Diode, SMT AA,T4,GJ 2 1.70 1.30 $0.015 $0.089
TOTALS 68 215 $4.04
1 Coil SMT, Small - C513 4141 07 4 $0.050 $0.050

1 Resistor Throughhole, MELF 2 $0.480 $0.480
5 Coil SMT 2 $0.760 $3.800
Main Board, Side 1

1 Coil SMT, Small 2 $0.050 $0.050
4 Coil SMT, Small 2 $0.050 $0.200
9 Capacitor Tantalum, Large 2 $0.150 $1.350
TOTALS 1408 2818 $13.02
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
11 Connector: Turret 4 10.00 10.00 $0.070 $0.770
1 Bd to Bd: Male - Ribbon Cable26 26 20.00 10.00 $0.150 $0.150
1 Bd to Bd: Male - Harness12 12 19.00 4.00 $0.080 $0.080
Main Board, Side 1 2 Connector: Connector2 2 10.00 9.00 $0.040 $0.080
1 Connector: Vehicle Wiring 58 65.00 42.00 $4.650 $4.650
TOTALS 18 234 $6.22
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 411.4 6 2468.4 1547 4833 3.8 11.7 3.1 336.30
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 125.24 $ 80.93 $ 5.04 $ 4.04 $ 13.02 $ 6.22 $ 5.23 $ 8.14 $ 2.61
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 46 1530 7 36 68 215 1408 2818 18 234 6380
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
System Totals 46 46 1530 320.6 3886.0 0.08 39.4 0 0
Estimated Cost
of Electronics
$125.24
Card Test
2%
Substrates
4%
Connector Insertion
Components 7%
5%
Passive
Components
10%
Integrated Circuits
65%
Small Active
Components
3%
Modular & Odd

Components
4%
Pkg. Brand Cost
Infineon $47.33
LEM $8.80
Altera $4.59
Other
Linear Technology $0.37 NXP Semi
ON Semiconductor $0.13 3%
Analog Devices
4%
Altera
6% Other
4%
LEM
11%
Infineon
58%
Bosch
Sensortech
14%
Cost Summary
Total $ 125.24
Cost Total Notes:

distribution.
pincount logic.
Appendix

Deep Dive Report
BMW i3 Converter Bus Asm,
Bottom
2438
Report #15900-150225-SBb
Product Description
This report pertains to the Bus assembly for
the 2014 BMW i3 Converter.
www.teardown.com
Product Overview
Product Name & Model # i3 Converter Bus Assembly Bottom
Cost Metrics
Weight (grams) 482.1 Retail Price
Product Features
Total $21.29 100.0%
Copyright © 2015, TechInsights www.teardown.com BMW_i3_Converter_Bus_Asm_Bottom_15900-150225-SBb – Page 1850

Exterior Features

Exterior Features




Teardown Sequence

Teardown Sequence

Teardown Sequence

Main Board (Side 1)
3 Capacitors
Grid = 1cm

Xray
One of 3
Capacitors
Grid = 1cm

Main Board (Side 2)
Grid = 1cm


Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board SUNTAK MULTILAYER PCB CO LTD FR4 2 Layer Conventional FR4 / HF 2 20.2 1.3 2.5 $ 0.30

Estimated
Package
Costs
3 Capacitor Film, EMI Suppression 2 $1.920 $5.760

TOTALS 3 6 $5.76

Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Connector: Attach Point 1 48.60 20.20 $0.320 $0.320
Main Board, Side 1 1 Connector: Attach point 1 14.30 11.00 $0.140 $0.140
2 Connector: PEM Nut 1 8.00 8.00 $0.050 $0.100
TOTALS 4 4 $0.56

(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 20.2 2 40.4 7 10 0.3 0.5 1.4 51.20

Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 6.82 $ - $ - $ - $ 5.76 $ 0.56 $ 0.30 $ 0.05 $ 0.15

Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 0 0 0 0 0 0 3 6 4 4 17

Estimated Cost
of Electronics
$6.82
Insertion
1%
Substrates Card Test
4% 2%
Connector
Components
8%
Passive
Components
85%

Enclosures x 0.000
1 2 Screws Cast + Threaded Stainless Steel x 2.80 0.025 0.050

2 2 Nuts Cast + Tapped Stainless Steel x 1.30 0.020 0.040
3 1 Frame, Ferrite Molded + Pulls PA66 + GF25 31.24 x 28.11 x 15.11 1.00 0.060 0.060
4 1 Frame, Ferrite Molded PA66 + GF25 31.94 x 19.38 x 3.88 1.10 0.040 0.040
Misc. 5 2 Metal Clip Cast + Coated + Stamped Metal 16.78 x 12.07 x 4.43 1.80 0.060 0.120
6 1 Rubber Pad Die-Cut Plastic + Adhesive 10.73 x 10.07 x 0.08 0.01 0.010 0.010
7 1 Ferrite Core Cast Metal (Ferrous) 26.86 x 26.69 x 8.1 14.60 0.250 0.250
8 1 Bus Bar Stamped + Formed + Coated + Inserts Metal (Copper) 193.66 x 174.48 x 44.85 186.70 5.120 5.120
9 1 Insulated Bus Bar Stamped + Formed + Coated + Comolded Metal (Copper) + PA66+GF25 187 x 164.72 x 6.29 194.40 8.430 8.430

Test Cost Estimate

Made in China
Number of parts 15

Cost Summary

2%

32%
66%


pincount logic.
Appendix

Deep Dive Report
BMW i3 Converter Bus Filter Assembly
2442
Report #15200-150209
Product Description
This report concerns the Converter Bus Filter
Assembly for the 2014 BMW i3. An X-ray of its
interior appears on p. 7.
www.teardown.com
Product Overview
Brand BMW i3 IC Package Count 0
Product Name & Model # Converter Bus Filter Assembly
Cost Metrics
Product Features
Communications N/A
Connectivity N/A Total $3.81 100.0%
www.teardown.com
Copyright © 2015, TechInsights BMW i3 Converter Bus Filter Assembly #15200-150209-SBb - Page 1877
Exterior Features
Connection
Connection
www.teardown.com
Exterior Features
Connection
Connection
www.teardown.com
X-Ray (Side 1)
www.teardown.com
Main Board (Side 1)
Grid = 1 cm
www.teardown.com
Main Board (Side 2)
Grid = 1 cm
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Schaffner FR4 2 Layer Conventional FR4 / HF 2 17.7 1.6 2.9 $ 0.27
www.teardown.com
Estimated
Package
Costs
1 Filter Large,Power Line Filter Module 4 $3.410 $3.410

TOTALS 1 4 $3.41
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 17.7 2 35.42 1 4 0.1 0.2 4.0 85.50

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Main Board $ 3.81 $ - $ - $ - $ 3.41 $ - $ 0.27 $ 0.00 $ 0.13
System Totals $ 3.81 $ - $ - $ - $ 3.41 $ - $ 0.27 $ 0.00 $ 0.13

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 0 0 0 0 0 0 1 4 0 0 5

www.teardown.com
Cost Summary

Total $ 3.81
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Deep Dive Report
BMW i3 Charging Module Board 1
0307
Report #15900-150202-RRb
Product Description
The Interface Connector Board (0307)
for the 2014 BMW i3 interfaces to the
Charging Module. It consists of two
connectors with coils to suppress noise.
www.teardown.com
Product Overview
Product Name & Model # BMW i3 Charging Module Board 1
Cost Metrics
Product Dimensions 68 x 29.93 x 47.49
Product Features
Connector Components $2.80 33.8%
Communications N/A
Connectivity N/A
Battery Life N/A Final Assembly & Test $0.67 8.1%
Total $8.28 100.0%
www.teardown.com
Copyright © 2015, TechInsights support@techinsights.com Charging Module Board 1_0307 #15900-150202-RRb - Page 1894
Block Diagram
P1 P2
www.teardown.com
Exterior Features
www.teardown.com
Exterior Features
www.teardown.com
Exterior Features
www.teardown.com
Main Board (Side 1)
P2
P1
Grid = 1 cm
www.teardown.com
Main Board (Side 2)
Grid = 1 cm
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Printed Circuit Board MetaSystem FR4 4 Layer Conventional FR4 / HF 4 20.4 2.00 1.00 0.90 0.60 1.5 9.8 $ 0.37
www.teardown.com
Estimated
Package
Costs
2 Coil SMT, Small 2 $0.460 $0.920

3 Coil SMT, Small 2 $0.350 $1.050
Printed Circuit Board, Side 1
1 Choke SMT, Common Mode 4 $0.420 $0.420
TOTALS 28 58 $2.48
www.teardown.com
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
2 Contact: P1 Mount 1 12.13 12.13 $0.050 $0.100
Printed Circuit Board, Side 1 1 Connector: LIF, P2 12 27.99 6.25 $0.940 $0.940
1 Connector: P1 11 18.45 9.20 $1.760 $1.760
TOTALS 4 25 $2.80
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Printed Circuit Board 20.4 4 81.4 9.8 32 83 1.6 4.1 2.6 39.40
System Totals 20.4 4 81.4 32 83 1.6 4.1 2.6 39.40

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Printed Circuit Board $ 6.02 $ - $ - $ - $ 2.48 $ 2.80 $ 0.37 $ 0.19 $ 0.19
System Totals $ 6.02 $ - $ - $ - $ 2.48 $ 2.80 $ 0.37 $ 0.19 $ 0.19

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Printed Circuit Board 0 0 0 0 0 0 28 58 4 25 115
System Totals 0 0 0 0 0 0 28 58 4 25 115

www.teardown.com
Estimated Cost
of Electronics
$6.02
Insertion Card Test

3% 3%
Substrates
6%
Passive
Components
41%
Connector
Components
47%

www.teardown.com
1 1 Housing, For Connector P1 Co-Molded + Pull + Machined PA66 + GF30 + Brass 52.66 x 37.4 x 24.5 10.30 1.500 1.500
Miscellaneous
2 1 Gasket, For P1 Molded Rubber 50.3 x 21.6 1.60 0.080 0.080
www.teardown.com
Test Cost Estimate

Made in UK ?
Number of parts 5
www.teardown.com
Cost Summary

8%
19%

73%
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Cost Analysis Page
1102
Deep Dive Report
0310
Report #15900-150203-RRb
Product Description
The Interface Connector Board for the 2014
BMW i3 interfaces to the Charging Module. It
consists of two connectors with coils to
suppress noise.
www.teardown.com
Product Overview
Product Name & Model # BMW i3 Charging Module Board 2
Cost Metrics
Product Features
Connector Components $2.80 39.3%
Communications N/A
Connectivity N/A
Battery Life N/A
Total $7.12 100.0%
www.teardown.com
Copyright © 2015, TechInsights Charging Module Board 2 #15900-150203-RRb - Page 1916
Block Diagram
P2
P1
100 Ohms
www.teardown.com
Exterior Features
www.teardown.com
Exterior Features
www.teardown.com
Main Board (Side 1)
P2
P1
Grid = 1 cm
www.teardown.com
Main Board (Side 2)
Grid = 1 cm
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Printed Circuit Board MetaSystem FR4 4 Layer Conventional FR4 / HF 4 19.5 2.00 1.00 0.90 0.60 1.5 9.5 $ 0.36
www.teardown.com
Estimated
Package
Costs
2 Coil SMT, Small 2 $0.460 $0.920

Printed Circuit Board, Side 1 1 Coil SMT, Small 2 $0.350 $0.350
TOTALS 25 50 $1.36
www.teardown.com
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
2 Contact: P1 Mount 1 12.13 12.13 $0.050 $0.100
Printed Circuit Board, Side 1 1 Connector: LIF, P2 12 27.99 6.47 $0.940 $0.940
1 Connector: P1 11 18.45 9.20 $1.760 $1.760
TOTALS 4 25 $2.80
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 19.5 4 77.8 29 75 1.5 3.9 2.6 38.20

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Printed Circuit Board $ 4.87 $ - $ - $ - $ 1.36 $ 2.80 $ 0.36 $ 0.17 $ 0.18
System Totals $ 4.87 $ - $ - $ - $ 1.36 $ 2.80 $ 0.36 $ 0.17 $ 0.18

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 0 0 0 0 0 0 25 50 4 25 104

www.teardown.com
Estimated Cost
of Electronics
$4.87
Card Test
Insertion 4%
4%
Substrates
7%
Passive
Components
28%
Connector
Components
57%

www.teardown.com
1 1 Housing, For Connector P1 Co-Molded + Pull + Machined PA66 + GF30 + Brass 52.66 x 37.4 x 24.5 10.30 1.500 1.500
Miscellaneous
2 1 Gasket, For P1 Molded Rubber 50.3 x 21.6 1.60 0.080 0.080
www.teardown.com
Test Cost Estimate

Made in UK ?
Number of parts 5
www.teardown.com
Cost Summary
Cost Total Notes:

9%
22%

69%
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Cost Analysis Page
1104
Deep Dive Report
BMW i3 Charging Module Board3
0312
Report #15900-150127-RBb
Product Description
The subject of this report is Board3 from the 2014
BMW i3 Charging Module. The bulk of the components
on this board are passive devices such as resistors,
capacitors, and inductors. Semiconductor content
includes a Texas Instruments #AMC1200 isolation
amplifier, two STMicroelectronics #TS393IYDT dual
comparators, and two Avago #ACPL-M49T
optocouplers. Also included is a LEM #CKSR50
current transducer, which uses a Texas Instruments
#DRV401 sensor signal conditioning IC for closed-
loop magnetic current sensors.
www.teardown.com
Product Overview
Product Name & Model # i3 Charging Module, Board3 0312
Cost Metrics
Product Dimensions (mm) 248.0 x 197.0 x 54.8 (Measured) Total Manufacturing Cost $67.78
Product Features
Isolation Amplifier Texas Instruments AMC1200
Logic STMicroelectronics TS393IYDT Dual Comparators
Isolation Avago ACPL-M49T Optocouplers
Sensor LEM CKSR50 Current Transducer

Total $67.78 100.0%
www.teardown.com
Copyright © 2015, TechInsights support@techinsights.com BMW i3 Charging Module Brd3 0312 #15900-150127-RBb - Page 1937
Block Diagram
+ LEM CKSR50
EC8 Current Transducer
EC9
-
EC12 EC11
N L
1 – Texas Instruments
G4 #AMC1200 OUT +T° G7
Isolation Amplifier
2 – STMicroelectronics 3 – Agago
#TS393IYDT #ACPL-M49T
Dual Comparator Optocoupler
DIS
2 – STMicroelectronics 3 – Agago
+ #TS393IYDT #ACPL-M49T
EC30 Dual Comparator Optocoupler 2
EC31
-
EC20
EC3 EC21
EC22
EC23
EC18
RESCAP 2
EC10
EC37 N L EC36
EC39 EC32
+ ACHVIN ACHVOUT
EC5 EC7 EC2 INTERLOCK INTERLOCK
DC G2
G1
EC6 EC4 EC1
-
www.teardown.com
Main Board (Side 1)
Connector: QD, Male
Connector: QD, Female EC20 G7
Connector: Screw G2 EC11
Board-to-Board: Female6 Interlock
EC12
Board-to-Board: Female8
EC1
EC2
EC10 EC4
EC8 EC3 EC5 EC6 EC7
EC21
EC9
EC36 & 37
G4
EC18
EC30
EC32 & 39
EC31
ACHVOUT
OUT RESCAP DIS G1 EC22 Interlock EC23
Grid = 1 cm DC ACHVIN
www.teardown.com
3 - Avago
#ACPL-M49T
Optocoupler
#TS393IYDT
Dual Comparator
#AMC1200
Isolation Amplifier (2-Die Pkg.)
Grid = 1 cm
www.teardown.com
Main Board (Side 2)
Grid = 1 cm
www.teardown.com
www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board GOLDEN SHINE ELECTRONICS FR4 4 Layer Conventional FR4 / HF 4 315.5 0.60 0.15 0.60 0.40 2.0 6.7 $ 3.19
www.teardown.com
Estimated
Costs
Location
1.1 1 Texas Instruments AMC1200-M0D Isolation Amplifier 1.90 1.33 $ 0.444 $ 0.444
1 1 Texas Instruments AMC1200 Isolation Amplifier MCP - 2 Chips 8 9.50 6.62 3.30
1.2 1 Texas Instruments AMC1200RQ1 Isolation Amplifier 2.50 1.30 $ 0.576 $ 0.576
Main Board, Side 1
2 2 STMicroelectronics TS393IYDT Dual Comparator SOP 8 4.80 3.80 1.25 2.1 1 STMicroelectronics TS393 Dual Comparator 1.33 0.97 $ 0.120 $ 0.240
3 2 Avago ACPL-M49T Optocoupler SOP 5 4.40 3.60 2.50 3.1 1 Avago 51885179 Optocoupler 0.83 0.64 $ 0.070 $ 0.140
Totals 5 34 6 $1.40
www.teardown.com
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 LEM CKSR50 Sensor: Current Transducer - CKSR50 12 21.90 13.40 $ 8.120 $ 8.120
1 Hongfa HF102F-P Relay: SPST - Hongfa HF102F-P 2 30.50 26.50 $ 1.480 $ 1.480
Main Board, Side 1
1 Unknown C0565 1404 Transformer: Transformer 10 13.00 13.00 $ 0.870 $ 0.870
2 BEL 3AB Fuse: 20A, 250V, 3AB 2 33.00 6.88 $ 0.270 $ 0.540
TOTALS 5 28 $11.01
www.teardown.com
Length Width
(mm) (mm)
1 Small Active Diode, SMT Diodes Inc 344 S1G 2 4.20 2.00 $0.015 $0.015
Main Board, Side 1 1 Small Active MOSFET - BSP300 H1334 BSP300 4 6.00 3.00 $0.300 $0.300
10 Small Active Transistor, Small KL7 B1, K52, Z8, KL6, SFW 3 3.00 1.50 $0.030 $0.299
TOTALS 12 36 $0.61
www.teardown.com
1 Resistor 0-ohm 1 $0.210 $0.210

1 Misc Varistor - S20K275 2 $0.400 $0.400
9 Capacitor Film Small TH 2 $0.220 $1.980
3 Capacitor Disk - EPCOS 2 $0.140 $0.420
1 Misc PTC Thermistor - J107 2 $1.320 $1.320
Main Board, Side 1 3 Capacitor Electrolytic, Large, 470uF 2 $6.870 $20.610
2 Resistor Throughhole 2 $0.320 $0.640
5 Coil Toroid 2 $2.120 $10.600
7 Capacitor Film Small TH 2 $0.230 $1.610
6 Capacitor Film Large TH 2 $0.420 $2.520
5 Capacitor Electrolytic, Large, 56uF 2 $0.580 $2.900
TOTALS 174 347 $43.89
www.teardown.com
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
2 Connector: Screw: EC32, EC39 6 13.00 8.50 $0.050 $0.100
1 Connector: Interlock DC 4 10.00 7.50 $0.510 $0.510
2 Connector: ACHV In / Out 2 10.00 4.00 $0.340 $0.680
Main Board, Side 1 4 Connector: QD, Male: EC30,31,36,37 3 8.00 1.50 $0.030 $0.120
4 Bd to Bd: Female8: EC18, DIS, OUT, RESCAP 8 10.00 5.00 $0.310 $1.240
4 Bd to Bd: Female6: G1, G2 Interlock, G4, G7 6 7.50 4.50 $0.310 $1.240
16 Connector: QD, Female: EC1-12, EC20-23 4 7.00 2.50 $0.030 $0.480
TOTALS 33 152 $4.37
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 315.5 4 1262 229 597 0.7 1.9 2.6 804.30

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 67.78 $ 1.40 $ 11.01 $ 0.61 $ 43.89 $ 4.37 $ 3.19 $ 1.71 $ 1.60

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 5 34 5 28 12 36 174 347 33 152 826

www.teardown.com
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
System Totals 6 5 34 9.4 131.1 0.07 25.9 0 0

www.teardown.com
Estimated Cost
of Electronics
$67.78
Modular & Odd

Integrated Circuits Components Small Active
2% 16% Components
Card Test 1%
2%
Insertion
3%
Substrates
5%
Connector Passive
Components Components
6% 65%

www.teardown.com
Pkg. Brand Cost
Avago $0.14
Avago
10%
ST Micro
17%
Texas Instruments
73%

www.teardown.com
Cost Summary

Total $ 67.78
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Cost Analysis Page
1124
Deep Dive Report
BMW i3 Charging Module Board
0359
Report #15900-140111-RRb
Product Description
The Charging Module Board is the battery
charging control module for the 2014 BMW
i3. It monitors various voltage levels during
charging and discharging. It uses a TI
TMS320F28035PNQ digital signal processor
and two quad-channel digital isolators from
Analog Devices (ADuM1402W &
ADuM1400W) to interface with a Freescale
MC9S12XET256MAA 16-Bit automotive
microcontroller.
www.teardown.com
Product Overview
Brand BMW i3 IC Package Count 26
Product Name & Model # Charging Module Board
Cost Metrics
Product Features
Freescale MC9S12XET256MAA 16-Bit Automotive
Processor
Microcontroller Integrated Circuits $21.23 37.3%
TI TMS320F28035PNQ Digital Signal Processor;
Key ICs Analog Devices Quad-Channel Digital Isolators
(ADuM1402W & ADuM1400W) Component Insertion $3.71 6.5%
Total $56.92 100.0%
www.teardown.com
Copyright © 2015, TechInsights BMW i3 Charging Module Board 0359 #15900-140111-RRb - Page
1960
Block Diagram
EC13 2 - NXP Semiconductor
#TJA1043T
HALO High-Speed CAN transceiver
TGMR-
450V8
10 - Maxim
1 - Freescale
#MAX256
#MC9S12XET256MAA
Transformer H-Bridge Driver
16-Bit Automotive Microcontroller
4 - Analog Devices 5 - Analog Devices

#ADuM1402W #ADuM1400W
Quad-Channel Digital Isolator (3-Die Pkg.) Quad-Channel Digital Isolator (3-Die Pkg.)
16 - Infineon
CSB #TLE42764 To: Analog Devices
Low-Dropout Linear Voltage Regulator ADuM3221
#TMS320F28035PNQ
Digital Signal Processor
PFC #UCC28070-Q1 ? 13 VDC
Automotive PFC Controller
7 - STMicroelectronics 8 - ON Semiconductor
#S393IY #NL27WZ08 ?
Micropower Dual CMOS Voltage Comparator Dual 2-Input AND Gate
#27324Q
QA Dual 4-A Peak High-Speed, Low-Side
QB Power MOSFET Driver VBUS
data sheets where available, and best engineering judgment. Certain details of the interface circuitry ? = Unconfirmed
www.teardown.com
1961
Block Diagram
HALO
TGMR- 13 - Maxim
450V8 #MAX253
Isolated RS-485/RS-232 Transformer Driver
HALO
TGMR- 13 - Maxim
450V8 #MAX253
9 - Analog Devices
H1 #ADuM3221 ?
9 - Analog Devices
Isolated, Dual-Channel Gate Drivers (2-Die Pkg.)
#ADuM3221 ?
9 - Analog Devices
H2 Isolated, Dual-Channel Gate Drivers (2-Die Pkg.)
#ADuM3221 ?
9 - Analog Devices
#ADuM3221
?
INS
FALCO –X CL-F
#LM3488
N-Channel Controller for Switching Regulators
#85015 ? 5 VA
Unknown To: Texas Instruments
TMS320F28035PNQ
data sheets where available, and best engineering judgment. Certain details of the interface circuitry ? = Unconfirmed
www.teardown.com
1962
Product Label
www.teardown.com
1963
Exterior Features
www.teardown.com
1964
Exterior Features
www.teardown.com
1965
Main Board (Side 1)
Grid = 1 cm
www.teardown.com
1966
4 - Analog Devices 1 - Freescale 2 - NXP Semiconductor 3 - ON Semiconductor
#ADuM1402W #MC9S12XET256MAA #TJA1043T #85015 ?
Quad-Channel Digital Isolator (3-Die Pkg.) 16-Bit Automotive Microcontroller High-Speed CAN transceiver Unknown
10 - Maxim
#MAX256
Transformer H-Bridge Driver
9 - Analog Devices
#ADuM3221
3 - Unknown 5 - Analog Devices

#85015 ? #ADuM1400W
Unknown Quad-Channel Digital Isolator (3-Die Pkg.)

#UCC28070-Q1 ? #TMS20
Grid = 1 cm Automotive PFC Controller Digital Signal Processor
? = Unconfirmed
www.teardown.com
1967
#MC33375
300 mA, 3.3V Output LDO
16 - Infineon
#TLE42764
Low-Dropout Linear Voltage Regulator
#LT3481IDD
Step-Down Regulator
14 - Texas Instruments #NL27WZ08 ?
#LM3488 Dual 2-Input AND Gate
N-Channel Controller for Switching Regulators
13 - Maxim
#MAX253
#27324Q #S393IY
Dual 4-A Peak High-Speed, Low-Side Micropower Dual CMOS Voltage Comparator
Power MOSFET Driver
www.teardown.com
1968
Main Board (Side 2)
Grid = 1 cm
www.teardown.com
1969
www.teardown.com
1970
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board MetaSystem FR4 6 Layer conventional FR4 / HF 6 245.7 0.38 0.17 0.58 0.32 2.0 13.7 $ 3.77
www.teardown.com
1971
Estimated
Costs
Location
1 1 Freescale MC9S12XET256MAA 16-Bit Automotive Microcontroller QFP 80 13.80 13.80 2.00 1.1 1 Freescale M53J 16-Bit Automotive Microcontroller 4.84 4.63 $ 5.640 $ 5.640
2 1 NXP Semiconductor TJA1043T High-Speed CAN transceiver SOP 14 8.75 4.00 1.45 2.1 1 NXP Semiconductor cF1381E High-Speed CAN transceiver 2.50 1.60 $ 0.280 $ 0.280
3 2 ON Semiconductor 85015 ? Unknown SOP 8 5.00 3.80 1.45 3.1 1 ON Semiconductor D8139 Unknown 2.50 1.60 $ 0.239 $ 0.477
4.1 2 Analog Devices ADuM140x Digital Isolator 2.00 1.00 $ 0.530 $ 1.060
4 1 Analog Devices ADuM1402W Quad-Channel Digital Isolator MCP - 3 Chips 16 10.50 7.60 2.35
4.2 1 Analog Devices Unknown Digital Isolator 2.70 1.20 $ 0.200 $ 0.200
5.1 2 Analog Devices ADuM140x Quad-Channel 2.00 1.00 $ 0.531 $ 1.062
5 1 Analog Devices ADuM1400W Quad-Channel Digital Isolator MCP - 3 Chips 16 10.50 7.60 2.35
5.2 1 Analog Devices Unknown Digital Isolator 2.70 1.20 $ 0.206 $ 0.206
6 1 Texas Instruments TMS320F28035PNQ Digital Signal Processor QFP 80 12.00 12.00 1.45 6.1 1 Texas Instruments F741804A Digital Signal Processor 5.00 4.30 $ 7.540 $ 7.540
7 1 STMicroelectronics S393IY Micropower Dual CMOS Voltage Comparator SOP 8 5.00 4.00 1.75 7.1 1 STMicroelectronics S393IY Micropower Dual CMOS Voltage Comparator 1.40 1.00 $ 0.118 $ 0.118
8 1 ON Semiconductor NL27WZ08 ? Dual 2-Input AND Gate SOP 8 2.70 1.95 0.50 8.1 1 ON Semiconductor AJ24 WZ08 Dual 2-Input AND Gate 0.80 0.50 $ 0.060 $ 0.060
Main Board, Side 1
9.1 1 Analog Devices Unknown Gate 2.90 1.10 $ 0.190 $ 0.760
9 4 Analog Devices ADuM3221 Isolated, Dual-Channel Gate Drivers MCP - 2 Chips 8 5.00 3.80 1.50
9.2 1 Analog Devices ADM2485IC Gate Control 1.70 1.00 $ 0.110 $ 0.440
10 1 Maxim MAX256 Transformer H-Bridge Driver SOP 8 5.00 3.80 1.50 10.1 1 Maxim MAX256 Transformer H-Bridge Driver 1.50 1.50 $ 0.212 $ 0.212
11 1 Texas Instruments UCC28070-Q1 ? Automotive PFC Controller SOP 20 6.60 4.50 1.20 11.1 1 Texas Instruments UVV28070 Automotive PFC Controller 1.60 1.60 $ 0.990 $ 0.990
12 1 Texas Instruments 27324Q Dual 4-A Peak High-Speed, Low-Side Power MOSFET Driver SOP 8 5.00 4.00 1.65 12.1 1 Texas Instruments 27324Q Dual 4-A Peak High-Speed, Low-Side Power MOSFET1.50
Driver 1.50 $ 0.157 $ 0.157
13 2 Maxim MAX253 Isolated RS-485/RS-232 Transformer DriverIsolated RS-485/RS-232
SOPTransformer Driver
8 5.00 3.80 1.50 13.1 1 Maxim MAX253 Isolated RS-485/RS-232 Transformer Driver 1.60 1.10 $ 0.175 $ 0.349
14 1 Texas Instruments LM3488QMMX ? N-Channel Controller for Switching Regulators SOP 8 3.05 3.00 0.90 14.1 1 Texas Instruments LM3478A N-Channel Controller for Switching Regulators 2.20 1.40 $ 0.220 $ 0.220
15 1 Linear Technology LT3481IDD Step-Down Regulator DFN 10 3.00 3.00 0.80 15.1 1 Linear Technology 3481 Step-Down Regulator 1.60 1.40 $ 0.167 $ 0.167
16 5 Infineon TLE42764 Low-Dropout Linear Voltage Regulator TO 5 6.40 6.00 4.30 16.1 1 Infineon TLE42764 Low-Dropout Linear Voltage Regulator 1.90 1.90 $ 0.224 $ 1.119
17 1 ON Semiconductor MC33375 300 mA, 3.3V Output LDO TO 4 6.50 3.60 1.60 17.1 1 ON Semiconductor MC33375 300 mA, 3.3V Output LDO 2.40 1.00 $ 0.170 $ 0.170
Totals 26 369 34 $21.23
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1972
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Crystal: Metal 4 3.00 2.50 $ 0.170 $ 0.170
1 Crystal: Metal 4 4.88 3.01 $ 0.170 $ 0.170
Main Board, Side 1
3 HALO TGMR-450V8 Transformer: Pulse 8 14.80 11.80 $ 0.860 $ 2.580
1 Falco Transformer: Transformer 12 22.50 22.50 $ 2.440 $ 2.440
TOTALS 6 44 $5.36
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1973
Length Width
(mm) (mm)
1 MOSFET ON RAC 2955 4 7.00 3.50 $0.090 $0.090
9 Diode S6 43, A5W42, ED 3C, J1F 2 4.10 2.50 $0.040 $0.359
1 MOSFET BUK9275 100A 9425 PEM1350B6 3 6.00 5.00 $0.090 $0.090
Main Board, Side 1
30 Transistor C07, 1FW41, A4, Dt2, KL8AN, 807, R31F. GRT43, SKS4 3 2.80 1.60 $0.030 $0.897
3 Transistor Dt2 6 2.70 1.90 $0.030 $0.090
9 Transistor AS18, OTNQ, LCGRAK 5 2.90 1.60 $0.030 $0.269
TOTALS 53 178 $1.79
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1974
Estimated
Package
Costs
1 Rectifier 2 $0.040 $0.040

1 Rectifier 2 $0.040 $0.040
1 Rectifier 2 $0.040 $0.040
Main Board, Side 1 1 Coil 4 $0.050 $0.050
3 Coil 2 $0.050 $0.150
19 Capacitor 2 $0.080 $1.520
TOTALS 583 1168 $4.07
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1975
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
6 Connector: Other 6 7.50 5.00 $1.270 $7.620
2 Connector: Other 8 10.10 5.00 $1.330 $2.660
Main Board, Side 1 1 Bd to Bd: Male or Female 12 21.80 7.40 $1.810 $1.810
3 Connector: Header, Male 6 7.50 3.00 $0.470 $1.410
4 Connector: Header, Male 8 8.30 5.00 $0.560 $2.240
TOTALS 16 114 $15.74
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1976
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 245.7 6 1474.2 684 1873 2.8 7.6 2.7 155.60

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1977
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 56.92 $ 21.23 $ 5.36 $ 1.79 $ 4.07 $ 15.74 $ 3.77 $ 3.71 $ 1.25

www.teardown.com
1978
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 26 369 6 44 53 178 583 1168 16 114 2557

www.teardown.com
1979
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
System Totals 34 26 369 128.1 1008.6 0.13 36.6 0 0

www.teardown.com
1980
Estimated Cost
of Electronics
$56.92 Card Test
2%
Insertion
Substrates 7%
7%
Integrated Circuits
37%
Connector
Components
28%
Modular & Odd

Passive Components
Components 9%
7%

3%
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1981
Pkg. Brand Cost
Freescale $5.64
Infineon $1.12
Maxim $0.56
Other
STMicroelectronics $0.12 Maxim Other
On Semi 3% 3%
3%
Infineon
5%
Analog Devices Texas Instruments

18% 41%
Freescale
27%

www.teardown.com
1982
Cost Summary

Total $ 56.92
Cost Total Notes:

distribution.
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1983
www.teardown.com
1984
pincount logic.
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1985
Appendix

Cost Analysis Page
1128
Deep Dive Report
0315
Report # 15900-141117-SBb
Product Description
This report concerns the charging
module board 5 for the battery in the
2014 BMW i3. This board includes (15)
connectors (input & output), (4)
charging coils, (1) large transformer, (2)
small transformers, (12) fast switching
rectifiers, and (4) input rectifiers. It has
no integrated circuits (ICs).
www.teardown.com
Product Overview
Product Type Charging Module Board 5 IC Die Count 0
Product Name & Model # BMW i3 0315
Cost Metrics
243.05 x 157.95 x 55.9 (Measured at
Product Dimensions (mm) Total Manufacturing Cost $56.81
Longest/Widest/Thickest Points)
Product Features
Connectivity (15) Connectors (Input & Output)
Modules $9.44 16.6%
Small Actives $28.62 50.4%
Voltage (4) Charging Coils
Passives $4.63 8.1%
(1) Large Transformer + (2) Small Connectors $3.96 7.0%
Signal Conditioning Transformers; (12) Fast Switching
Rectifiers + (4) Input Rectifiers Substrate $7.13 12.6%
Insertion $0.43 0.8%

Total $56.81 100.0%
www.teardown.com
Copyright © 2015, TechInsights BMW i3 Charging Module Board 0315 #15900-141117-SBb - Page
1988
Block Diagram
Input
XFMR Coil Coil
Input Input
Rect. Rect.
Output Input Input

Rect. Rect.
Fast Switching Fast Switching

Coil Coil
Rec. Rec. Input
Fast Switching Fast Switching Fast Switching Fast Switching

Rec. Rec. Rec. Rec.
XFRM Fast Switching Fast Switching
Rec. Rec.
XFRM
Fast Switching Fast Switching

Rec. Rec.
Output Fast Switching

Fast Switching
Rec.
Rec.
Output
Output
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1989
Exterior Features
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1990
Exterior Features
www.teardown.com
1991
Main Board (Side 1)
Connectors
Input
Connector
Connector Connector
Output
Output
Connector Output Connector Connector

Grid = 1 cm
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1992
Main Board (Side 2)
Grid = 1 cm
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1993
Copper
Layer
Aluminum
Substrate
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1994
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Charging Module Board Assembly BMW FR4 1 Layer Aluminum 1 380.0 1.00 0.55 3.1 4.0 $ 7.13
www.teardown.com
1995
Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Falco 1610015800 1352 Transformer: Transformer 6 50.93 41.80 $ 6.500 $ 6.500
Charging Module Board Assembly, Side 1 1 Unknown Unknown Fuse: Fuse 2 6.67 3.07 $ 0.040 $ 0.040
2 TDK EPCOS C0565 1404 Transformer: Transformer 10 12.70 12.70 $ 1.450 $ 2.900
TOTALS 4 28 $9.44
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1996
Length Width
(mm) (mm)
2 Schotthy Diode Infineon logo D10S60C HRA348 3 10.31 9.45 $1.540 $3.080
4 Voltage Rectifier ST Micro logo STTH15LO6G 3 10.40 9.15 $0.590 $2.360
Charging Module Board Assembly, Side 1 2 MOSFET ST Micro logo 42N65M5 GKDA BV5 CHN 351 3G 3 10.40 9.15 $4.290 $8.580
4 Input Rectifier Diode 20ETS12S P354X A B 3 10.50 8.10 $0.760 $3.040
4 MOSFET Infineon logo 65F6110A HRB 345 3 10.30 9.45 $2.890 $11.560
TOTALS 16 48 $28.62
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1997
Estimated
Package
Costs

2 Capacitor 2 $0.004 $0.008
Charging Module Board Assembly, Side 1 20 Resistor 2 $0.004 $0.080
2 Coil SMT, Large,Coil: Large - Toroid 2 $0.280 $0.560
2 Coil SMT, Large,Coil: Large - Toroid 6 $1.890 $3.780
TOTALS 30 68 $4.63
www.teardown.com
1998
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
6 Connector: Accessory 6 8.20 6.00 $0.080 $0.479
Charging Module Board Assembly, Side 1 2 Connector: Accessory 8 11.40 6.00 $0.090 $0.180
TOTALS 14 64 $3.96
www.teardown.com
1999
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Charging Module Board Assembly 380.0 1 380.0 4.0 64 208 0.2 0.6 3.3 1434.00
System Totals 380.0 1 380 64 208 0.2 0.5 3.3 1434.00

www.teardown.com
2000
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Charging Module Board Assembly $ 56.81 $ - $ 9.44 $ 28.62 $ 4.63 $ 3.96 $ 7.13 $ 0.43 $ 2.60
System Totals $ 56.81 $ - $ 9.44 $ 28.62 $ 4.63 $ 3.96 $ 7.13 $ 0.43 $ 2.60

www.teardown.com
2001
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Charging Module Board Assembly 0 0 4 28 16 48 30 68 14 64 272
System Totals 0 0 4 28 16 48 30 68 14 64 272

www.teardown.com
2002
Estimated Cost
of Electronics
$56.81
Card Test
Insertion 5%
1%
Substrates Modular & Odd

13% Components
Connector 17%
Components
7%
Passive
Components
8% Small Active
Components
49%

www.teardown.com
2003
Cost Summary

Total $ 56.81
Cost Total Notes:

marketing, distribution.
www.teardown.com
2004
www.teardown.com
2005
pincount logic.
www.teardown.com
2006
Appendix

Cost Analysis Page
1130
Deep Dive Report
BMW i3 Charging Module
Board 6 Assembly
0325
Report #15900-150128-PKb
Product Description
This report concerns the Charging Module Board 6
Assembly (0325) for the 2014 BMW i3. This board
features an STMicroelectronics #STM8AF6288
automotive 8-bit MCU with 128 Kb flash as well as
operational amplifiers, voltage references, and a
power supply.
www.teardown.com
Product Overview
Product Name & Model # i3 Charging Module Board 6 Assembly
Cost Metrics
Product Dimensions (mm) 101.12 x 55 x 12.5 (Measured at Longest/Widest/Thickest Points) Total Manufacturing Cost $8.17
Product Features
STMicroelectronics #STM8AF6288 Automotive 8-Bit MCU w/ 128
Microcontroller
Kb Flash Integrated Circuits $3.22 39.4%
Voltage Regulation Texas Instruments #LP2951-N
Op Amps (3) Texas Instruments #OPA365 High-CMRR Operational Amplifiers
Current Sensing Texas Instruments #LMP8601-Q1

Total $8.17 100.0%
www.teardown.com
Copyright © 2015, TechInsights support@techinsights.comBMW i3 Charging Module Brd. 6 Assy. #15900-150128-PKb - Page 2009
Block Diagram
Connector
#OPA365
High-CMRR Operational Amplifier
1 - Texas Instruments #LMP8601-Q1
#OPA365 Current Sensing Amplifier
High-CMRR Operational Amplifier
8 - Texas Instruments #OPA365
#AMC1200-Q1 High-CMRR Operational Amplifier
Fully Differential Isolation Amplifier
#STM8AF6288 Connector
Connector
Automotive 8-Bit MCU w/ 128 Kb Flash
www.teardown.com
Main Board (Side 1)
Connector
Connector
Connector
Connector
Connector
Connector
Connector
Grid = 1 cm
www.teardown.com

#OPA365 #LMP8601-Q1
High-CMRR Operational Amplifier Current Sensing Amplifier
#REF3133
Voltage Reference
#AMC1200-Q1
Fully Differential Isolation Amplifier 5 - Texas Instruments ?
#LP2951-N ?
3 - NXP Semiconductor Voltage Regulator
#NCV551
LDO Regulator
4 - STMicroelectronics 7 - Texas Instruments

#STM8AF6288 #LM3478
Automotive 8-Bit MCU w/ 128 Kb Flash Switching Regulator
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Main Board (Side 2)
Grid = 1 cm
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www.teardown.com
Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Metasystem FR4 4 Layer conventional FR4 / HF 4 52.9 0.50 0.20 0.60 0.30 1.5 14.4 $ 0.97
www.teardown.com
Estimated
Costs
Location
1 3 Texas Instruments OPA365 High-CMRR Operational Amplifier SOP 5 2.95 2.80 1.45 1.1 1 Texas Instruments Unknown High-CMRR Operational Amplifier 1.45 1.00 $ 0.107 $ 0.321
2 1 Texas Instruments REF3133 Voltage Reference SOP 3 2.90 2.30 1.10 2.1 1 Texas Instruments ICC03233 Voltage Reference 1.41 0.76 $ 0.080 $ 0.080
3 1 NXP Semiconductor NCV551 LDO Regulator TSOP 5 3.00 2.60 1.00 3.1 1 NXP Semiconductor NCV551 LDO Regulator 1.48 1.05 $ 0.110 $ 0.110
4 1 STMicroelectronics STM8AF6288 Automotive 8-Bit MCU w/ 128 Kb Flash QFP 48 8.90 8.90 1.50 4.1 1 STMicroelectronics 79A88 Automotive 8-Bit MCU w/ 128 Kb Flash 2.96 2.43 $ 1.950 $ 1.950
Main Board, Side 1
5 1 Texas Instruments ? LP2951-N ? Voltage Regulator SOP 8 6.50 5.00 1.80 5.1 1 Texas Instruments ? 5ADJ LP2951-N 1.75 1.36 $ 0.173 $ 0.173
6 1 Texas Instruments LMP8601-Q1 Current Sensing Amplifier SOP 8 6.70 5.00 1.80 6.1 1 Texas Instruments LMP8601D Current Sensing Amplifier 1.70 1.13 $ 0.152 $ 0.152
7 1 Texas Instruments LM3478 Switching Regulator TSOP 8 5.60 3.10 1.80 7.1 1 Texas Instruments LM3478A Switching Regulator 2.20 1.43 $ 0.197 $ 0.197
8 1 Texas Instruments AMC1200-Q1 Fully Differential Isolation Amplifier SOP 8 9.60 9.30 4.60 8.1 1 Texas Instruments AMC1200-MCD Fully Differential Isolation Amplifier 1.94 1.41 $ 0.236 $ 0.236
Totals 10 103 10 $3.22
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Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Falco Unknown Transformer: Transformer 8 12.00 11.40 $ 0.300 $ 0.300
Main Board, Side 1
TOTALS 2 14 $0.50
www.teardown.com
Length Width
(mm) (mm)
1 Small Active Transistor, Large BCP 5316 4 7.20 6.50 $0.060 $0.060
1 Small Active Transistor, Small 8 MFAA 3 3.30 3.00 $0.030 $0.030
1 Small Active Diode, SMT CC83 2 2.60 1.70 $0.015 $0.015
1 Small Active Transistor, Small A4t 3 2.40 2.10 $0.030 $0.030
2 Small Active Diode, SMT S6 42 Vishay logo 2 4.00 2.60 $0.040 $0.080
Main Board, Side 1
3 Small Active Diode, SMT EPCOS logo H 470K 4146 2 3.20 2.50 $0.040 $0.120
2 Small Active Diode, SMT F14 AD 2 3.90 1.70 $0.040 $0.080
1 Small Active Transistor, Small A7 Z 3 2.70 2.00 $0.030 $0.030
1 Small Active Transistor, Small Dt0 3 2.90 2.10 $0.030 $0.030
1 Small Active Transistor, Small Dt0 3 2.44 2.10 $0.030 $0.030
TOTALS 14 35 $0.50
www.teardown.com
Estimated
Package
Costs

Main Board, Side 1 131 Small Passive Cap, Res, Ferrite 2 $0.004 $0.524
1 Coil SMT, Small 2 $0.050 $0.050
TOTALS 134 268 $0.65
www.teardown.com
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
Main Board, Side 1
TOTALS 7 32 $0.86
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 52.9 4 211.6 167 452 3.2 8.5 2.7 28.60

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 8.17 $ 3.22 $ 0.50 $ 0.50 $ 0.65 $ 0.86 $ 0.97 $ 0.97 $ 0.49

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 10 103 2 14 14 35 134 268 7 32 619

www.teardown.com
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
System Totals 10 10 103 24.4 291.1 0.08 35.4 0 0

www.teardown.com
Estimated Cost
of Electronics
$8.17
Card Test
6%
Insertion
Substrates 12%
Connector 12%
Components
11%
Integrated Circuits
39%
Passive
Components
8%
Small Active
Components
6%
Modular & Odd
Components
6%

www.teardown.com
Cost Summary

Total $ 8.17
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Cost Analysis Page
1262
Deep Dive Report
BMW i3 AC/DC Inverter
5946
Report #15900-021915-DHb
Product Description
The AC/DC Inverter for the 2014 BMW i3 takes
AC current and converts it to DC. The Inverter
uses three heating elements to maintain
operating temperatures and ensure the longevity
of the module. It features a Texas Instruments
ADS7841-Q1 12-bit 4-channel analog to digital
converter, (2) Analog Devices ADuM1401WTRWZ
quad-channel digital isolator, a
STMicroelectronics LM2903YDT low-power dual
voltage comparator, and a Fairchild
Semiconductor FAN3216T dual 2 A gate driver.
Infineon supplies (3) 2ED020I12FA dual channel
IGBT drivers, (6) AUIR0815S buffer gate drivers,
and (2) TLE4264-2 5V LDO regulators. There’s
also a 50-pin ribbon cable connector on the
board for module interfacing.
www.teardown.com
Product Overview
Product Name & Model # i3 AC / DC Inverter V40292
Cost Metrics
Product Features
Three Bus Bar Configuration; Ribbon Cable
Connectivity
Interconnect Integrated Circuits $16.93 10.6%
Analog Devices ADuM1401WTRWZ; Infineon Modules, Discretes & Connectors $130.55 81.9%
Major ICs
2ED020I12FA Substrates $3.62 2.3%
Key Component 420 uF, 450 Vdc Bulk Capacitor
Total $159.46 100.0%
www.teardown.com
Copyright © 2015, TechInsights BMW i3 AC/DC Inverter #15900-150219-DHb - Page 2031
Block Diagram
4 - Analog Devices
#ADuM1401WTRWZ 2 - Infineon
Quad-Channel Digital Isolator (3-Die Pkg.) #AUIR0815S
1 - Infineon Buffer Gate Driver
#2ED020I12FA
Dual Channel IGBT Driver
2 - Infineon
5 - STMicroelectronics #AUIR0815S
#LM2903YDT Transducer Buffer Gate Driver
Low-Power Dual Voltage Comparator
Bus Bar
2 - Infineon
Transducer #AUIR0815S
1 - Infineon Buffer Gate Driver
Bus Bar #2ED020I12FA
2 - Infineon
4 - Analog Devices #AUIR0815S
#ADuM1401WTRWZ Transducer Buffer Gate Driver
Quad-Channel Digital Isolator (3-Die Pkg.)
Bus Bar
6 - Texas Instruments 2 - Infineon
#AUIR0815S
#ADS7841-Q1 Ribbon 1 - Infineon Buffer Gate Driver
12-Bit 4-Channel Analog to Digital Converter Cable (to #2ED020I12FA
External Dual Channel IGBT Driver
Board) 2 - Infineon
#AUIR0815S
Buffer Gate Driver
420 uF
Capacitor
450 Vdc
3 - Fairchild Semiconductor
#FAN3216T
Dual 2 A Gate Driver
B: Base
C: Collector
E: Emitter
Heating Elements Estimated block diagram based on observation of this specific product implementation, manufacturer’s
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Product Label
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Exterior Features
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Teardown Sequence
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Teardown Sequence
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Teardown Sequence
Connector: 43-POS MS 1.0

Header
Bus Bars
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Teardown Sequence
High Power
Capacitor
Thermal Heaters ?
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Main Board (Side 1)
Ribbon Cable Connector
Grid = 1 cm
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2 - Infineon
#AUIR0815S
Buffer Gate Driver
1 - Infineon
#2ED020I12FA
Grid = 1 cm
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3 - Fairchild Semiconductor
#FAN3216T
Dual 2 A Gate Driver
Grid = 1 cm
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Isolator Board (Side 1)
Grid = 1 cm
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Isolator Board (Side 2 IC Identification)
4 - Analog Devices
#ADuM1401WTRWZ
Quad-Channel Digital Isolator (3-Die Pkg.)
5 - STMicroelectronics 7 - Infineon 6 - Texas Instruments

#LM2903YDT #TLE4264-2 #ADS7841-Q1
Low-Power Dual Voltage Comparator 5 V LDO Regulator 12-Bit 4-Channel Analog to Digital Converter
Grid = 1 cm
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Board Cross-Section
Main Board
Isolator Board
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Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Unknown FR4 6 Layer Conventional FR4 / HF 6 86.6 0.20 0.10 0.50 0.22 1.8 18.7 $ 1.90
Isolation Board Bosch FR4 6 Layer Conventional FR4 / HF 6 74.8 0.25 0.15 0.60 0.40 1.7 10.9 $ 1.72
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Estimated
Costs
Location
1.1 2 Infineon M2181D1 IGBT Driver 2.88 1.50 $ 1.194 $ 7.165

1 3 Infineon 2ED020I12FA Dual Channel IGBT Driver MCP - 4 Chips 32 12.91 10.48 2.44
Main Board, Side 1 1.2 2 Infineon M2180C Miller Clamp 1.85 1.12 $ 0.142 $ 0.851
2 6 Infineon AUIR0815S Buffer Gate Driver TSOP 8 6.12 5.01 1.50 2.1 1 Infineon AUIR0815_ROD Buffer Gate Driver 2.95 2.13 $ 0.745 $ 4.471
Main Board, Side 2 3 1 Fairchild Semiconductor FAN3216T Dual 2 A Gate Driver TSOP 8 6.14 5.05 1.55 3.1 1 Fairchild Semiconductor FAN3226TZ Dual 2 A Gate Driver 1.47 1.14 $ 0.453 $ 0.453
4.1 2 Analog Devices ADuM148x Quad-Channel Digital Isolator 2.13 1.10 $ 0.707 $ 2.830
4 2 Analog Devices ADuM1401WTRWZ Quad-Channel Digital Isolator MCP - 3 Chips 16 10.68 10.18 2.44
4.2 1 Analog Devices Unknown Coil Pack 2.75 1.18 $ 0.222 $ 0.445
Isolation Board, Side 2 5 1 STMicroelectronics LM2903YDT Low-Power Dual Voltage Comparator TSOP 8 6.44 3.16 1.07 5.1 1 STMicroelectronics C0393B6 Low-Power Dual Voltage Comparator0.93 0.84 $ 0.087 $ 0.087
6 1 Texas Instruments ADS7841-Q1 12-Bit 4-Channel Analog to Digital Converter
TSOP 16 6.07 5.04 1.69 6.1 1 Texas Instruments TM5414B 12-Bit 4-Channel Analog to Digital Converter
1.85 1.56 $ 0.261 $ 0.261
7 2 Infineon TLE4264-2 5 V LDO Regulator SOP 4 6.99 6.63 1.46 7.1 1 Infineon Unknown 5 V LDO Regulator 1.71 1.57 $ 0.182 $ 0.364
Totals 16 216 29 $16.93
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Modular Components
Pin Length Width
Each Total
Count (mm) (mm)
Main Board, Side 1 3 Unknown P1277322007 1T43000914103 V103804 S00509 Module: Thermal Heater ? 7 63.18 57.00 $ 16.500 $ 49.500
Main Board, Side 2 3 TDK-EPC A2132 Transformer: Transformer 12 21.60 16.67 $ 2.450 $ 7.350
5 TDK-EPC PTC T1622 Thermistor: PTC SMD 4 9.87 8.45 $ 1.200 $ 6.000
Isolation Board, Side 1
3 LEM HC6H800-S Transducer: Open Loop 5 29.42 8.50 $ 6.180 $ 18.540
TOTALS 14 92 $81.39
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Length Width
(mm) (mm)
3 Small Active Transistor, Small WYB 43, WN7 43 3 2.79 2.31 $0.030 $0.090
3 Small Active Transistor, Small GVt, KP 3 2.10 1.84 $0.030 $0.090
9 Small Active Diode, SMT Vishay logo UM 44, UM 43, 2 5.31 2.48 $0.060 $0.540
15 Small Active Diode, SMT Vishay logo 18C 43A, 20C 43A, 510A 44A, 2 5.37 3.39 $0.060 $0.900
Main Board, Side 1 7 Small Active Diode, SMT ST logo G U12 Z419 2 5.29 2.75 $0.060 $0.420
3 Small Active MOSFET Infineon logo 7N60S5A HRB412 R 3 10.13 6.46 $0.440 $1.320
2 Small Active Transistor, Small Infineon logo 3N10L26 GRP416 R 3 10.13 6.46 $0.440 $0.880
6 Small Active MOSFET 615N G1416 8 6.03 5.05 $0.380 $2.280
5 Small Active Transistor, Small YBs 44, 45s 43 3 2.84 1.97 $0.030 $0.150
3 Small Active Diode, SMT Vishay logo UM 43 2 5.31 2.48 $0.060 $0.180
10 Small Active Transistor, Small GVt, KP 3 2.10 1.84 $0.030 $0.299
Main Board, Side 2 3 Small Active Diode, SMT Vishay logo 20C 44A 2 5.37 3.39 $0.060 $0.180
17 Small Active Diode, SMT ST logo G U12 Z419 2 5.29 2.75 $0.060 $1.020
5 Small Active Transistor, Small WYB 43, WN7 43 3 2.79 2.31 $0.030 $0.150
3 Small Active Transistor, Small TAQU, WWY 3d, 3 2.92 2.14 $0.030 $0.090
3 Small Active Transistor, Small GXt, GYt 3 2.10 1.84 $0.030 $0.090
4 Small Active MOSFET Infineon logo 7N60S5A HRB412 R 3 10.13 6.46 $0.440 $1.760
1 Small Active Diode, SMT Vishay logo UM 43 2 5.31 2.48 $0.060 $0.060
4 Small Active Transistor, Small GYt, KP 3 2.10 1.84 $0.030 $0.120
1 Small Active Transistor, Small 45s 43, 3 2.84 1.97 $0.030 $0.030
1 Small Active Transistor, Small WYB 43 3 2.79 2.31 $0.030 $0.030
1 Small Active Transistor, Small TAQU 3 2.92 2.14 $0.030 $0.030
TOTALS 109 302 $10.71
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23 Resistor SMD, MELF 2 $0.060 $1.380

Main Board, Side 1 169 Small Passive Cap, Res, Ferrite 2 $0.004 $0.676
1 Capacitor High Power 3 $18.500 $18.500

Main Board, Side 2


TOTALS 449 899 $24.21
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Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
1 Connector: Bus Bar 3 1 60.45 53.05 $1.160 $1.160
1 Connector: Bus Bar 2 1 117.58 22.06 $1.270 $1.270
Main Board, Side 1 1 Connector: Bus Bar 1 1 177.91 26.56 $1.420 $1.420
1 Connector: 43-POS MS 1.0 Header 43 197.33 37.36 $7.780 $7.780
1 Connector: Ribbon Cable 50 34.50 4.55 $2.620 $2.620
TOTALS 5 96 $14.25
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(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
Main Electronics Isolation Board 74.8 6 449.0 10.9 147 382 2.0 5.1 2.6 103.40
System Totals 161.4 12 968.34 593 1605 3.7 9.9 2.7 178.50

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Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Isolation Board $ 35.44 $ 3.99 $ 24.54 $ 2.21 $ 1.41 $ - $ 1.72 $ 0.91 $ 0.66
System Totals $ 156.01 $ 16.93 $ 81.39 $ 10.71 $ 24.21 $ 14.25 $ 3.62 $ 3.30 $ 1.61

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Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
Main Electronics Isolation Board 6 64 8 35 18 53 115 230 0 0 529
System Totals 16 216 14 92 109 302 449 899 5 96 2198

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IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
Main Electronics Isolation Board 10 6 64 24.9 0 361.1 0.07 17.7 0 0
System Totals 29 16 216 102.6 981.9 0.10 22.0 0 0

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Estimated Cost
of Electronics
$156.01
Insertion
Substrates 2% Card Test
2% 1%
Integrated
Connector
Circuits
Components
11%
9%
Passive
Components
16%
Modular & Odd
Components
52%
Small Active
Components
7%

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Pkg. Brand Cost
Infineon $12.85
Fairchild Semiconductor $0.45
Texas
Instruments
2%
Fairchild STMicro
3% 1%
Analog Devices
19%
Infineon
75%

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1 1 Gasket - Red Molded VMQ-LSR 177.24 x 42.56 x 3.39 17.00 2.100 2.100
Miscellaneous 2 1 Mounting Bracket Molded + Inserts PBT-GF30 28.8 x 18.68 x 18.03 6.70 0.570 0.570
3 2 Screws Stamped Metal 6.2 x 6.2 x 10.44 0.00 0.020 0.040
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Test Cost Estimate

Made in China
Number of parts 25
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Cost Summary
Non-Electronic Final Assembly

Parts & Test
2% <1%

98%
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pincount logic.
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Appendix

Cost Analysis Page
1319
Deep Dive Report
BMW i3 AC/DC Inverter PCB1
5924
Report #15900-141204-RRa
Product Description
The BMW AC/DC Inverter Module controls AC
power into DC power during charging. The
Inverter Module manages the charging the
Infineon TC1797 microcontroller and the Altera
EPM570T100A5N Max II complex programmable
logic device. The Inverter Module uses the Bosch
CY320 to monitor multiple -power supplies.
www.teardown.com
Product Overview
Product Name & Model # AC/DC Inverter, PCB1
Cost Metrics
Total Manufacturing Cost* $60.71
Product Features
Processor Infineon TC1797 32-bit Microcontroller
CPLD Altera EPM570T100A5N
Bosch Sensortec CY320, Linear Technology Component Insertion $3.25 5.4%
Power Regulation
LTC1871, Card Test $0.85 1.4%
Connectivity Vehicle wiring connector

Total $60.71 100.0%

BMW i3 ACDC Inverter PCB1 15900-141204–RRa Page 2067
Block Diagram
Vehicle Wiring Interface

Connector Connector
1 - Altera
#EPM570T100A5N
MAX II CPLD
12 - Analog Devices
12#AD8209
- Analog Devices
Difference Amplifier
#AD8209
Difference Amplifier 2 - Analog Devices 8 - Infineon
#AD2S1210 #TC1797
R/D Converter 32-bit Microcontroller
11 #LM2903Q1
- Texas Instruments
Differential Comparator
11 #LM2903Q1
- Texas Instruments
11 #LM2903Q1
- Texas Instruments
11 #LM2903Q1
- Texas Instruments
#LM2903Q1
#LTC1871
Flyback and SEPIC Controller
3 - Bosch Sensortec
#CY320
Power Supply ASIC
? = Unconfirmed

Exterior Features

Exterior Features

Main Board (Side 1)
Vehicle Wiring
Interface
Connector
Grid = 1cm

#MC33078
Op Amp
2 - Analog Devices
#AD2S1210
R/D Converter
1 - Altera
#EPM570T100A5N
MAX II CPLD 5 - Linear Technology
#LTC1871
Flyback and SEPIC Controller
3 - Bosch Sensortec
#CY320
Power Supply ASIC
#LM2903-Q1
Grid = 1cm

Main Board (Side 2)
Grid = 1cm

#MC33204VDG
Op Amp
#LM2901-Q1 11 - Texas Instruments
Quad Differential Comparator #LM2903Q1
8 - Infineon
#TC1797
32-bit Microcontroller
12 - Analog Devices
#AD8209
Precision Difference Amplifier, High Voltage
Grid = 1cm


Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Printed Circuit Board Unknown FR4 4 Layer conventional FR4 / HF 4 166.3 0.20 0.10 0.53 0.31 1.9 19.7 $ 1.47

Location
1 1 Altera EPM570T100A5N MAX II CPLD QFP 100 14.40 14.40 1.00 1.1 1 Altera EPM570T100A5N MAX II CPLD 3.15 3.15 $ 3.850 $ 3.850
2 1 Analog Devices AD2S1210 R/D Converter QFP 48 7.00 7.00 1.40 2.1 1 Analog Devices AD2S1210 R/D Converter 3.96 3.87 $ 3.250 $ 3.250
3 1 Bosch Sensortec CY320 Power Supply ASIC SOP 36 16.10 10.90 3.70 3.1 1 Bosch Sensortec CY320EA Power Supply ASIC 6.60 5.00 $ 5.860 $ 5.860
4 1 STMicroelectronics MC33078 Op Amp SOP 8 5.02 3.80 2.10 4.1 1 STMicroelectronics MC33078 Op Amp 1.61 1.41 $ 0.170 $ 0.170
5 1 Linear Technology LTC1871 Flyback and SEPIC Controller SOP 10 3.00 3.00 0.80 5.1 1 Linear Technology LTC1871 Flyback and SEPIC Controller 2.09 1.54 $ 0.255 $ 0.255
7 1 Texas Instruments LM2903-Q1 Dual Differential Comparator SOP 8 4.30 3.00 1.10 7.1 1 Texas Instruments LM2903-Q1 Dual Differential Comparator 1.10 0.89 $ 0.090 $ 0.090
8 1 Infineon TC1797 32-bit Microcontroller BGA 416 27.00 27.00 2.20 8.1 1 Infineon SAK-TC1797-512F180E 32-bit Microcontroller 8.99 8.69 $ 26.760 $ 26.760
9 1 ON Semiconductor MC33204VDG Op Amp SOP 14 8.80 3.70 1.60 9.1 1 ON Semiconductor MC33204VDG Op Amp 2.34 1.85 $ 0.310 $ 0.310
Printed Circuit Board, Side 2 10 1 Texas Instruments LM2901-Q1 Quad Differential Comparator SOP 14 5.05 4.00 1.70 10.1 1 Texas Instruments 339 Quad Differential comparator 1.20 1.20 $ 0.150 $ 0.150
11 5 Texas Instruments LM2903Q1 Dual Differential Comparator SOP 8 4.30 3.00 1.10 11.1 1 Texas Instruments LM2903Q1 Dual Differential Comparator 1.00 0.90 $ 0.090 $ 0.450
12 2 Analog Devices AD8209 Precision Difference Amplifier, High Voltage
SOP 8 2.90 2.90 1.00 12.1 1 Analog Devices AD8209 Precision Difference Amplifier, High Voltage
2.20 1.50 $ 0.210 $ 0.420
Totals 16 710 16 $41.57

Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 EPCOS A2122 Transformer: Transformer 8 16.08 16.28 $ 1.640 $ 1.640
3 Epcos C223H Choke: Common Mode 4 3.95 3.42 $ 0.610 $ 1.830

TOTALS 6 26 $3.87

Length Width
(mm) (mm)
1 Small Active MOSFET Fairchild logo PE3AE FDS 9958 8 4.70 3.80 $0.290 $0.290
1 Small Active MOSFET W43 5610DG 4 6.90 3.40 $0.350 $0.350
4 Small Active Transistor, Small -VG= 5 2.00 1.50 $0.030 $0.120
2 Small Active Transistor, Small R6t 6 2.00 1.50 $0.030 $0.060
1 Small Active MOSFET BUK9222 55A 3150 REm1406A1 3 6.25 5.75 $0.350 $0.350
2 Small Active MOSFET ON E12 702 G 3 6.11 5.80 $0.350 $0.700
2 Small Active Complimentary Power Transistor ON E13 J4 4H11G 3 6.11 5.80 $0.180 $0.360
26 Small Active Transistor, Small JSW43, GRtm R6L, GXt, WW930, GYt, WW&30, 3 2.87 1.28 $0.030 $0.777
6 Small Active Transistor, Small KP. TAQO.WWZ 3 0.00 0.00 $0.030 $0.179
Printed Circuit Board, Side 2 3 Small Active Transistor, Small R6L 6 2.00 1.50 $0.030 $0.090
9 Small Active Transistor, Small -VJ-, -VF- 5 2.00 1.50 $0.030 $0.269
TOTALS 57 218 $3.55

Estimated
Package
Costs

1 Coil SMT, Small 2 $0.050 $0.050
Printed Circuit Board, Side 1 2 Capacitor Electrolytic, Medium 2 $0.060 $0.120
143 Small Passive Cap 2 $0.004 $0.572
127 Small Passive Res 2 $0.004 $0.508

Printed Circuit Board, Side 2 168 Small Passive Res 2 $0.004 $0.672
82 Small Passive Cap 2 $0.004 $0.328
TOTALS 532 1064 $2.68

Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
Printed Circuit Board, Side 1 1 Bd to Bd: Male or Female 50 34.46 4.06 $0.270 $0.270
1 Connector: Vehicle Wiring 24 83.36 24.65 $3.100 $3.100
TOTALS 4 78 $3.49

(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Connections
Metal Layers
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 166.3 4 665.2 615 2096 3.7 12.6 3.4 130.70

Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
Main Electronics Printed Circuit Board $ 60.71 $ 41.57 $ 3.87 $ 3.55 $ 2.68 $ 3.49 $ 1.47 $ 3.25 $ 0.85
System Totals $ 60.71 $ 41.57 $ 3.87 $ 3.55 $ 2.68 $ 3.49 $ 1.47 $ 3.25 $ 0.85

Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 16 710 6 26 57 218 532 1064 4 78 2711

IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
(KBytes)
(KBytes)
Die Area
(sq.mm)
(sq.mm)
Main Electronics Printed Circuit Board 16 16 710 159.7 0.01 1335.9 0.12 53.2 0 0
System Totals 16 16 710 159.7 1335.9 0.12 53.1 0 0

Estimated Cost
of Electronics
$60.71
Insertion Card Test

Substrates 5% 1%
Connector 2%
Components
Passive 6%
Components
4%
Small Active
Components
6%
Integrated Circuits
69%
Modular & Odd
Components
7%

Pkg. Brand Cost
Infineon $26.76
Altera $3.85
Other
Linear Technology $0.26 OnSemi
STMicroelectronics $0.17 1%
Texas Other
Instruments 1%
2%
Analog
Devices
Altera 9%
9%
Bosch Infineon
Sensortec 64%
14%

Cost Summary

Total $ 60.71
Cost Total Notes:

distribution.


pincount logic.
Appendix

Cost Analysis Page
1448
Deep Dive Report
BMW i3 Charging Interface Module
5804
Report #15900-150130-PKb
Product Description
The Charging Interface Module for the 2014 BMW i3
controls the locking mechanism for the charging
plug and also the charging port cover lock. It
contains a Renesas V850E2/FG4 32-bit single-chip
microcontroller, a Qualcomm Atheros QCA7005
powerline communication IC, and an Infineon
TLE7263E HS CAN/LIN transceiver with dual-voltage
regulator. An STMicroelectronics L9951XP actuator
driver controls the locking features in the charging
port of the vehicle.
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Product Overview
Product Name & Model # i3 Charging Interface Module
Cost Metrics
Product Dimensions (mm) 160.7 x 68.9 x 10.3 (Measured at Longest/Widest/Thickest Points) Total Manufacturing Cost $48.47
Product Features
Microcontroller Renesas #V850E2/FG4 32-Bit Single-Chip Microcontroller
Communication Qualcomm Atheros #QCA7005 Powerline Communication IC
Logic STMicroelectronics #L9951XP Actuator Driver
Voltage Regulation Infineon #TLE7263E HS CAN/LIN Transceiver w/ Regulator Non-Electronics $10.33 21.3%
Final Test & Assembly $0.68 1.4%
Total $48.47 100.0%
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Copyright © 2015, TechInsights BMW i3 Charging Interface Module #15900-150130-PKb - Page 2093
Block Diagram
1 - Qualcomm Atheros 11 - Texas Instruments

#QCA7005 #SN74LVC2T45-Q1
Powerline Communication IC Dual Supply Bus Transceiver
10 - Infineon
#TLE7263E
HS CAN/LIN Transceiver w/ Dual-Voltage Regulator
#74LVC1T45
Dual Supply Translating
12 - NXP Transceiver
Semiconductor
#74LVC1T45 4 - STMicroelectronics
Dual Supply Translating Transceiver #L9951XP
Actuator Driver
#TS321
Operational Amplifier 9 - Texas Instruments
#LM2902-Q1
Quadruple Operational Amplifier
5 - Renesas
#V850E2/FG4
32-Bit Single-Chip Microcontroller
#VNQ5E250AJ-E
Quad Channel Driver
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Product Label
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Exterior Features
Note: Connector Pins not included in this report
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Exterior Features
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Main Board (Side 1)
Grid = 1 cm
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1 - Qualcomm Atheros 2 - Texas Instruments

#QCA7005 #TPS54160
Powerline Communication IC DC-DC Converter

#TPS62290 #L9951XP
1 A Step-Down Converter Rear Door Actuator Driver
Grid = 1 cm
Grid = 1cm
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Main Board (Side 2)
Grid = 1 cm
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12 - NXP Semiconductor 9 - Texas Instruments 6 - STMicroelectronics

#74LVC1T45 #LM2902-Q1 #VNQ5E250AJ-E
Dual Supply Translating Transceiver Quad Operational Amplifier Quad Channel Driver
#SN74LVC2T45-Q1
Dual Supply Bus Transceiver
10 - Infineon
#TLE7263E
System Basis Chip w / CAN/ LIN Transceiver 5 - Renesas
& Dual-Voltage Regulator #V850E2/FG4
32-Bit Single-Chip Microcontroller
#TS321 7 - Linear Technology
Operational Amplifier #LT6703HV-3
Micropower Comparator
Grid = 1cm
Grid = 1 cm
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Substrate Data
Substrates
Min. Min.
(mm) (mm) (mm) (mm)
(mm) (mm)
Main Board Onpress Printed Circuits? FR4 2 Layer conventional FR4 / HF 2 109.1 0.36 0.16 0.70 0.25 1.4 17.3 $ 1.33
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Estimated
Costs
Location
1 1 Qualcomm Atheros QCA7005 Powerline Communication IC TQFP 68 7.65 7.65 0.90 1.1 1 Qualcomm Atheros QCA7005 Powerline Communication IC 4.71 4.15 $ 5.580 $ 5.580
2 1 Texas Instruments TPS54160 1.5 A DC-DC Converter SOP 10 4.00 3.10 0.91 2.1 1 Texas Instruments Unknown 1.5 A DC-DC Converter 1.42 1.37 $ 0.160 $ 0.160
Main Board, Side 1
3 1 Texas Instruments TPS62290 1 A Step-Down Converter DFN 6 2.00 2.00 0.81 3.1 1 Texas Instruments TPS62290 1 A Step-Down Converter 1.43 0.83 $ 0.090 $ 0.090
4 1 STMicroelectronics L9951XP Rear Door Actuator Driver SOP 36 10.50 9.00 2.42 4.1 1 STMicroelectronics CUH31B Rear Door Actuator Driver 5.44 3.33 $ 4.070 $ 4.070
5 1 Renesas V850E2/FG4 32-Bit Single-Chip Microcontroller TQFP 100 16.00 16.00 1.40 5.1 1 Renesas 70F 4002 32-Bit Single-Chip Microcontroller 6.52 5.50 $10.810 $10.810
6 1 STMicroelectronics VNQ5E250AJ-E Quad Channel Driver SOP 16 5.10 4.90 1.63 6.1 1 STMicroelectronics Unknown Quad Channel Driver 4.00 1.60 $ 1.180 $ 1.180
7 1 Linear Technology LT6703HV-3 Micropower Comparator SOP 5 2.90 2.80 0.89 7.1 1 Linear Technology 6700-3 Micropower Comparator 1.45 0.79 $ 0.092 $ 0.092
8 1 STMicroelectronics TS321 Operational Amplifier SOP 5 3.10 3.00 1.28 8.1 1 STMicroelectronics G0321A6 Operational Amplifier 1.26 0.74 $ 0.085 $ 0.085
Main Board, Side 2
9 1 Texas Instruments LM2902-Q1 Quad Operational Amplifier SOP 14 8.60 6.00 1.85 9.1 1 Texas Instruments TL3241 Quad Operational Amplifier 1.69 1.44 $ 0.216 $ 0.216
10 1 Infineon TLE7263E System Basis Chip w / CAN/ LIN Transceiver &SOP
Dual-Voltage Regulator
36 12.90 9.80 2.46 10.1 1 Infineon Unknown System Basis Chip w / CAN/ LIN Transceiver
4.08
& Dual-Voltage
3.53 Regulator
$ 3.410 $ 3.410
11 1 Texas Instruments SN74LVC2T45-Q1 Dual Supply Bus Transceiver SOP 8 3.10 1.95 0.79 11.1 1 Texas Instruments LVC 2T45 Dual Supply Bus Transceiver 0.99 0.52 $ 0.070 $ 0.070
12 2 NXP Semiconductor 74LVC1T45 Dual Supply Translating Transceiver SOP 6 2.20 2.10 0.93 12.1 1 NXP Semiconductor 451A Dual Supply Translating Transceiver 0.53 0.40 $ 0.060 $ 0.120
Totals 13 316 13 $25.88
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Modular Components
Estimated
Package
Costs
Pin Length Width
Each Total
Count (mm) (mm)
1 Unknown Unknown Transformer: Transformer 6 7.80 6.50 $ 0.300 $ 0.300
1 Epcos C413? Transformer: Transformer 4 4.90 3.40 $ 0.300 $ 0.300
Main Board, Side 1
1 Unknown Unknown Shielding: Large 1 40.60 43.30 $ 0.350 $ 0.350
Main Board, Side 2 1 Unknown Unknown Crystal: Ceramic 6 3.22 1.30 $ 0.200 $ 0.200
TOTALS 5 21 $1.35
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Length Width
(mm) (mm)
4 Small Active OptiMOS Power Transistor SG1411 2N603L 4 6.80 6.20 $0.270 $1.080
4 Small Active Diode, SMT 14L M43 2 3.30 1.90 $0.015 $0.060
3 Small Active Diode, SMT Vishay logo CK 43A 2 5.30 3.50 $0.040 $0.120
3 Small Active Transistor, Small 1FW 43 3 3.10 2.80 $0.030 $0.090
2 Small Active Diode, SMT 44t 3 2.00 2.00 $0.015 $0.030
2 Small Active Transistor, Small 5CW 42 3 3.70 2.80 $0.030 $0.060
1 Small Active Schottky Diode STMicroelectronics logo S26Y Z346 2 5.20 2.60 $0.130 $0.130
Main Board, Side 1
1 Small Active Diode, SMT SW 2 1.60 1.10 $0.060 $0.060
1 Small Active Diode, SMT MS10 42 Vishay logo 2 5.00 3.50 $0.060 $0.060
3 Small Active Transistor, Small JSt 43 3 3.10 2.80 $0.030 $0.090
1 Small Active Diode, SMT WR1 43 3 2.90 2.20 $0.015 $0.015
1 Small Active Transistor, Small 11 H 6 2.40 2.10 $0.030 $0.030
2 Small Active Diode, SMT 27 37A Vishay logo 2 5.10 2.60 $0.060 $0.120
4 Small Active Transistor, Small 11 H 6 2.40 2.10 $0.030 $0.120

1 Small Active Diode, SMT Y6W 3d 3 2.70 1.80 $0.015 $0.015
1 Small Active MOSFET STMicroelectronics logo 18NF0 3L GK0X0406 3 8.50 6.50 $0.210 $0.210
1 Small Active Diode, SMT CK 43A Vishay logo 2 5.30 3.50 $0.060 $0.060
4 Small Active Transistor, Small 1FW 43 3 2.80 2.80 $0.030 $0.120
1 Small Active Diode, SMT tAN 41 3 2.80 2.80 $0.015 $0.015
Main Board, Side 2 7 Small Active Transistor, Small JSW 42 3 3.10 2.90 $0.030 $0.209
1 Small Active Diode, SMT WR1 43 3 3.10 2.90 $0.015 $0.015
2 Small Active Diode, SMT L4FV 2 2.60 1.50 $0.015 $0.030
1 Small Active MOSFET SG 1333 P BSP613 4 6.90 6.60 $0.300 $0.300
2 Small Active Diode, SMT S1J logo 3UY 2 5.10 2.70 $0.060 $0.120
TOTALS 58 177 $3.31
www.teardown.com
Estimated
Package
Costs
4 Small Passive Coil, Inductor 2 $0.008 $0.032

Main Board, Side 1
3 Coil SMT, Small 2 $0.050 $0.150

Main Board, Side 2 1 Coil SMT, Large 2 $0.280 $0.280
TOTALS 408 816 $2.30
www.teardown.com
Connectors
Estimated
Package
Costs
Location Qty Form
Pin Length Width
Each Total
Count (mm) (mm)
Main Board, Side 1 7 Connector: Spring - Formed 1 $0.010 $0.070
TOTALS 7 7 $0.07
www.teardown.com
(Components/sq.cm)
(Connections/sq.cm)
Component Density
Connection Density
Assembly Weight
Routing Density
Avg. Pin Count

Substrate Area
Components
Metal Layers
Connections
Circuit Area
Number of
Number of
substrate)
(grams)
(sq.cm)
(sq.cm)
System Totals 109.1 2 218.2 491 1337 4.5 12.3 2.7 61.20

www.teardown.com
Passive Components
Modular & Odd Form
Integrated Circuits
Components
Substrates
Card Test
Insertion
Total
System Totals $ 37.45 $ 25.88 $ 1.35 $ 3.31 $ 2.30 $ 0.07 $ 1.33 $ 2.56 $ 0.66

www.teardown.com
Counts by Assembly

Passive Components
Passive Component
Modular/Odd Form
Modular/Odd Form
IC Package Count
IC Connections
Opportunities
Components
Connections
Connections
Connectors
System Totals 13 316 5 21 58 177 408 816 7 7 1828

www.teardown.com
IC Metrics

Package Connections
Non-Volatile Memory
IC Package Count
Volatile Memory
Package Area
IC Die Count
Die Area
(KBytes)
(KBytes)
(sq.mm)
(sq.mm)
System Totals 13 13 316 102.9 661.1 0.16 47.8 0 0

www.teardown.com
Estimated Cost
of Electronics
$37.45
Insertion Card Test

Connector 7% 2%
Components Substrates
<1% 4%
Passive
Components
6%
Small Active
Components
9%
Integrated Circuits
68%
Modular & Odd

Components
4%

www.teardown.com
Pkg. Brand Cost
Renesas $10.81
Qualcomm Atheros $5.58
Infineon $3.41
NXP
<1%
Texas Linear
Instruments Technology
2% <1%
Infineon
13%
Renesas
STMicro 42%
21%
Qualcomm
Atheros
22%

www.teardown.com
Non-Electronics
1 1 Housing Molded + Pulls PA6 + GF30 217 x 102.55 x 43 142.60 6.660 6.660
Housing 2 1 Housing, Connector end Molded + Pulls PP/H-GF25+MX15 170 x 39.9 x 37 41.30 3.590 3.590
3 1 Label Die Cut + Printed Plastic + Adhesive 60.1 x 50.1 0.01 0.080 0.080
www.teardown.com

Made in Ireland
Number of parts 5
www.teardown.com
Cost Summary
Final Assembly & Test $ 0.68
Total $ 48.47
Cost Total Notes:

distribution.
www.teardown.com
www.teardown.com
pincount logic.
www.teardown.com
Appendix

Cost Analysis Page
1474
Appendix
Munro & Associates

Wire Harness Reports
Wire Harness Cost Analysis
Vehicle Controller Wire Harness
Overview
• The Design Profit® based Wire Harness Coster generates cost estimates of
various components and assembly processes for the majority of wire
harnesses found in today’s manufactured products. The Wire Harness Coster
rolls up these costs to deliver an estimate of the total manufactured cost.
• Costs are based on several factors including: commodity items, components,
burdened machine rates, processing speeds, burdened labor rates, and cost
of poor quality drivers.
• The Wire Harness Coster consistently generates a cost estimate for a given
wire harness without the need to completely disassemble or destroy the wire
harness. Minimal disassembly may be required to capture various attributes
and identify overall circuit routing. Inputs to the coster include: connector data
(size, cavity count, locking mechanisms and sealing attributes), wire data
(sizes quantities and lengths), coverings (type, size and length), fasteners,
brackets, troughs, etc.
• The Wire Harness Coster separates the parts and processes to more easily
delineate Bill of Material (BOM) costs and build processing costs.
Overview
Factors Influencing Cost:

1. Wire count is the primary factor driving
cost as it affects the amount of wire, the
size of connectors, and the number of
assembly processes.
2. Wire selection (wire OD, strand size,
strand count / wire) is significant as it
directly relates to conductor cross
section, and therefore the amount of
copper or aluminum used in the
harness.
3. Wire length is another major cost factor
as it both relates to material cost and to
assembly time, as longer lengths
require more handling.
4. The total physical connector size is a Relative influence of factors on harness costs
major cost factor as connectors are a (Data based on L32 two-level Taguchi analysis
large portion of harness part costs. of the Wire Harness Coster)
Total physical connector size also tends
to drive assembly costs.
Battery, Vehicle Control Cable, Overview
• The Battery Vehicle Control Cable Assembly, consists of 13 wires joining 4 connectors. There is one
twisted wire pair in the harness.
• All wires are 1.2 mm and 1.5mm in diameter with twisted copper strands. The overall weight of the
harness is 0.0725 kg.
• All of the connectors are unsealed connectors with multiple terminal cavities.
• The largest connector has 12 cavities and is a two part design to function as a pass through at the
battery box.
• The harness is fully covered by cloth tape with 4 zip-tie clips and 1 tape on clip. A 9 cm length of
convolute tube is used near the end of the harness.
• All major components are analyzed in detail, while prices are applied to commodity items (i.e. clips,
terminals).
• Estimates are based on actual parts.
• Photos: Background on 100mm grid paper.
Wire Harness Totals
Wire, Cable, & Splice Sub-Totals
Connector & Terminal Sub-Totals
Label, Clip, Tape, & Covering Sub-Totals
Miscellaneous Parts Sub-Totals
Wire Harness Costed Bill of Materials
Wire Harness Costed Bill of Process
Appendix

Heater Wire Harness
Overview
Overview

assembly processes.
harness.
Heater Harness Overview
• The Heater Harness Assembly consists of 9 wires, two of which joined to a single connector.
• Wires are all 2.1 mm in diameter. All wire conductors are twisted copper strands. The overall
weight of the harness is 0.0315 kg.
• The connector is a sealed 3 cavity connector.
• The harness is uncovered with no tape or clips.
• All major components are analyzed in detail, while prices are applied to commodity items (i.e.
clips, terminals).
Wire Harness Totals
Appendix

Module Buss Wire Harness
Overview
Overview

assembly processes.
harness.
Module Buss Cable Assembly Overview
• The Module Buss Cable Assembly, consists of 1 cable joining 1 spade connector to a 6mm eyelet
terminal.
• The cable is 13.4 mm in diameter and composed of 289 aluminum strands. The overall weight of the
• The connector is unsealed with one spade terminal.
• The harness has no covering.
terminals).
Wire Harness Totals
Appendix

Voltage Sense Wire Harness
Overview
Overview

assembly processes.
harness.
Voltage Sense Harness Overview
• The Voltage Sense Harness Assembly consists of 9 wires

joining 2 connectors and 7 bare spade terminals.
• 5 wires are 1.7 mm in diameter and 1 wire is 2.2 mm in
diameter. All wire conductors are twisted copper strands. The
overall weight of the harness is 0.0261 kg.
• Both connectors are unsealed connectors with 8 cavities. One
connector has 2 terminals while the other connector has 3
terminals.
• The harness is largely uncovered with 9 cloth based tape tacks
and one 12.3 cm portion of full taping.
• All major components are analyzed in detail, while prices are
applied to commodity items (i.e. clips, terminals).
Wire Harness Totals
Appendix

Cooling Rack Wire Harness
Overview
Overview

assembly processes.
harness.
Cooling Rack Harness Overview
• The Cooling Rack Harness Assembly consists of 9 wires joining

2 connectors and 2 bare spade terminals. There are 2 splices;
one with 3 conductors, the other with 4 conductors.
• 6 wires are 1.5 mm in diameter and 3 wires are 1.85 mm in
diameter. All wire conductors are twisted copper strands. The
• All of the connectors are unsealed connectors with multiple
terminal cavities.
• The largest connector has 10 cavities populated with 6
terminals and has a lever lock to ensure full engagement.
• The harness is largely uncovered with multiple cloth based tape
tacks and one 10 cm portion of full taping. Heat shrink with
adhesive covers the splices.
Wire Harness Totals
Appendix

Main Connector Wire Harness
Overview
Overview

assembly processes.
harness.
Main Connector Harness Overview
• The Main Connector Harness Assembly, consists of

15 wires joining 5 connectors and two bare spade
terminals. There are four twisted pairs in the harness.
There are two splices with three conductors each.
• 9 wires are 1.3 mm in diameter and 6 wires are 1.5
mm in diameter. All wire conductors are twisted
copper strands. The overall weight of the harness is
0.0470 kg.
• All of the connectors are unsealed connectors with
multiple terminal cavities.
• The largest connector has 12 cavities populated with
10 terminals and has a lever lock to ensure full
engagement.
• The harness is largely uncovered with only a vinyl
tube 11 cm long and multiple cloth based tape tacks.
Heat shrink with adhesive covers the splices.
• All major components are analyzed in detail, while
prices are applied to commodity items (i.e. clips,
terminals).
Wire Harness Totals
Appendix

Main Connector Wire Harness
Overview
Overview

assembly processes.
harness.
Main Connector Cable Assembly Overview
• The Main Connector Cable Assembly, consists of 1 cable joining 2 female spade connectors.
• The cable is 13.4 mm in diameter and composed of 1096 copper strands. The overall weight of the
• Both connectors are unsealed.
• The cable assembly has no covering.
terminals).
Wire Harness Totals
Appendix

Module Wire Harness
Overview
Overview

assembly processes.
harness.
Module Harness Assembly Overview
• The Module Harness Assembly consists of 15 wires and 4

thermistors with a total of 8 leads terminated at one end only in
a single connector.
• The 15 wires are 1.5 mm in diameter. All wire conductors are
twisted copper strands. The overall weight of the harness is
0.0485 kg.
• The unsealed connector has 26 cavities populated with 23
terminals and has a lever lock to ensure full engagement.
• The harness is uncovered with one tape tack only.
Wire Harness Totals
Appendix

Module Buss Wire Harness
Overview
Overview

assembly processes.
harness.
• The Module Buss Cable Assembly, consists of 1 cable joining 1 spade connector in a flying lead
configuration.
• The connector is unsealed with one female spade terminal.
• The cable assembly has no covering.
terminals).
Wire Harness Totals
Appendix

Battery Management Wire Harness
Overview
Overview

assembly processes.
harness.
Battery Management Harness Overview
• The Battery Management Harness Assembly, consists of 43 wires joining 9 connectors. There are two
twisted wire pairs in the harness.
• All wires are 1.3 mm in diameter and are twisted copper strands. The overall weight of the harness is
0.1580 kg.
• All of the connectors are unsealed connectors with multiple terminal cavities.
• Each connector has 12 cavities populated with either 8 or 10 terminals and a lever lock to ensure full
engagement.
• The harness is fully covered with cloth tape and has 4 tape on clips. A 10 cm length of convolute tube is
used near the beginning of the harness.
terminals).
Wire Harness Totals
Appendix

HV Interconnect Wire Harness
Overview
Overview

assembly processes.
harness.
• The Module Buss Cable Assembly, consists of 1 cable joining with one female and one male spade
connector.
• Both connectors are unsealed.
• The cable assembly has one bracket at the male connector and no coverings.
terminals).
Wire Harness Totals
Appendix

DC Power Connector 1 Wire
Harness
Overview
Overview

assembly processes.
harness.
Connector Harness Assembly 1 Overview
• The Connector Harness Assembly 1, DC Power Connector consists of two 3.4

mm wires with ring terminals and two 1.5 mm wires in a black plastic connector.
All four wires join a white plastic connector. All wires are copper stranded. There
are no twisted pairs.
• The overall weight of the harness is 0.0273 kg.
• All connectors are unsealed.
• There are no unpopulated terminal cavities.
• The harness has no additional covering beyond wire insulation and one tape
tack.
• There are no clips or labels.
• All major components are analyzed in detail, while prices are applied to
commodity items (i.e. clips, terminals).
Wire Harness Totals
Appendix

Harness
Overview
Overview

assembly processes.
harness.
• The Connector Harness Assembly 2, DC Power Connector consists of two 3.4

mm wires with ring terminals and two 1.5 mm wires in a black plastic connector.
All four wires join a blue plastic connector. All wires are copper stranded. There
are no twisted pairs.
• The harness has no additional covering beyond wire insulation and one tape
tack.
Wire Harness Totals
Appendix

Harness
Overview
Overview

assembly processes.
harness.
• The Connector Harness Assembly 3, DC Power Connector consists of two

3.4 mm wires joining one black plastic connector to two ring terminals. Both
wires are copper stranded. There are no twisted pairs.
• The connector is unsealed.
• Two of four terminal cavities in the black plastic connector are unpopulated.
• The harness has no additional covering beyond wire insulation and one
tape tack.
Wire Harness Totals
Appendix

Top Buss Bar 3 Black Wire
Harness
Overview
Overview

assembly processes.
harness.
Black Wire Asm, Top Buss Bar 3 Overview
• The Black Wire Assembly, Top Buss Bar 3 consists of

one 2.8 mm wire joining two ring terminals. The wire is
copper stranded.
• The harness has no coverings.
terminals).
Wire Harness Totals
Appendix

Top Buss Bar 3 White Wire
Harness
Overview
Overview

assembly processes.
harness.
White Wire Asm, Top Buss Bar 3 Overview
• The White Wire Assembly, Top Buss Bar 3 consists of

one 2.8 mm wire joining two ring terminals. The wire is
copper stranded.
• The harness has no coverings.
terminals).
Wire Harness Totals
Appendix

Top Buss Bar 1 Motor Sensor Wire
Harness
Overview
Overview

assembly processes.
harness.
Motor Sensor Harness, Top Buss Bar 1,
Overview
• The Motor Sense Harness, Top Buss Bar 1 harness consists of three connectors joined by 12 1.3 OD
wires which are loosely twisted into 6 wire pairs. All wire conductors are twisted copper strands.
• Two of the three connectors are sealed and connected to pass-thru connections.
• The overall weight of the harness assembly is 0.0221 kg.
• The largest connecter is a ribbon wire style connector with 12 terminals. The harness was covered with
fabric cloth tape.
terminals).
Wire Harness Totals
Appendix

Connector Verification Cable
Overview
Overview

assembly processes.
harness.
Connector Verification Cable Overview
• The Connector Verification Cable Assembly consists of 2 wires terminated at one end with a connector
and bare terminals at the other end.
• Both wires are 1.3 mm in diameter with twisted copper strands. The overall weight of the harness is
0.0029 kg.
• The unsealed connector has 2 cavities populated with 2 terminals.
• The harness is covered with braided convolute.
terminals).
Wire Harness Totals
Appendix
Click Here to Return to Cost Analysis Page 877
HV Component Connector with
Long Wire Harness
Overview
Overview

assembly processes.
harness.
Long Wire Asm, HV Component Connector
Overview
• The Long Wire Asm, HV Component Connector consists of two 1.5 mm

wires joining one black plastic connector to two pin terminals. Both wires
are copper stranded. There are no twisted pairs.
• No terminal cavities in the black plastic connector are unpopulated.
• The harness is uncovered and there are no clips or labels.
Wire Harness Totals
Appendix

HV Component Connector with
Short Wire Harness
Overview
Overview

assembly processes.
harness.
Short Wire Asm, HV Component Connector
Overview
• The Short Wire Asm, HV Component Connector consists of two 1.5 mm wires
joining one black plastic connector to two pin terminals. Both wires are copper
stranded. There are no twisted pairs.
• The harness is uncovered and there are no clips or labels.
Wire Harness Totals
Appendix

HV Connector In Wire Harness
Overview
Overview

assembly processes.
harness.
Harness, HV Connector In Assembly
Overview
• The Harness, HV Connector In assembly consists of two 4.3 mm wires with ring terminals and two 1.5
mm wires in a black plastic connector. All four wires join a white plastic connector. All wires are copper
stranded. There are no twisted pairs.
• The harness has no additional covering beyond wire insulation and heat shrink tube.
• There is one label.
terminals).
Wire Harness Totals
Appendix

HV Cable Out Wire Harness
Overview
Overview

assembly processes.
harness.
Harness, HV Cable Out Assembly Overview
• The Harness, HV Cable Out assembly consists of two 3.4 mm wires and two 1.5 mm wires joining 4
connectors. All wires are copper stranded. There are no twisted pairs.
• All connectors are unsealed. There are no unpopulated terminal cavities.
• The harness is fully covered with heat shrink tubing.
• There is one label.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1120
CMB 4 to CMB 1 Wire Harness
Overview
Overview

assembly processes.
harness.
Harness, CMB 4 to CMB 1 Overview
• The Wire Harness, CMB 4 to CMB 1 consists two connectors joined by 9 wires. All wire conductors are
twisted copper strands.
• The connectors are not sealed and have 12 cavities each.
• The overall weight of the harness assembly is 0.0124 kg.
• The harness was covered with vinyl tubing, and had one end split in two and taped. A parts label was
applied to the taped end.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1126
Charging Module Wire Harness
Overview
Overview

assembly processes.
harness.
Charging Module Harness Asm Overview
• The Charging Module Harness Assembly consists of

seven separate harnesses (labeled A thru G) which
are zip-tied into the Charging Module Cover
Assembly during that component’s assembly
process.
• The overall weight of the harness assembly is
0.4404 kg.
• All eight plastic connectors are unsealed. There are
six bare terminals crimped onto 1.5mm OD wires.
• There are two heavy cables with three terminals
each. The terminals are plated copper sleeves that
have been mechanically compressed onto the
braided copper cables and eyelets stamped to allow
mounting to the terminal studs. Two of the terminals
have right angle bends. The end terminals have
been sheared so the braided cable and the terminal
are flush at each end.
• The harness covering consists of heat shrink tubing
along with heat shrink at two eyelet terminals.
terminals).
Charging Module Cover with Harness Assembly • Estimates are based on actual parts.
Wire Harness Totals
Appendix

Cost Analysis Page
1266
Charging Module Sub Wire
Harness
Overview
Overview

assembly processes.
harness.
Charging Module Sub Harness Overview
• The Charging Module Sub Harness consists of 2

wires joining one connector to two ring terminals.
Both wires are 1.5mm OD.
• Both wires are copper stranded.
• The black plastic connector has four cavities with only
two terminals and is unsealed.
• The harness covering consists vinyl tubing along with
heat shrink at the eyelet terminal leads.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1268
Coil to HV 1 Wire Harness
Overview
Overview

assembly processes.
harness.
Harness, Coil to HV 1 Asm Overview
• The Harness, Coil to HV 1 Assembly

consists of one 7mm OD stranded
copper cable terminated by ring
terminals.
• The terminals are plated copper
sleeves that have been mechanically
compressed onto the braided copper
cables and eyelets stamped to allow
mounting to the terminal studs. Two of
the terminals have right angle bends.
The end terminals have been sheared
so the braided cable and the terminal
• The harness covering consists of heat
shrink tubing along with heat shrink at
two eyelet terminals.
• The overall weight of the harness
assembly is 0.0426 kg.
• All major components are analyzed in
detail, while prices are applied to
• Photos: Background on 100mm grid
paper.
Wire Harness Totals
Appendix

Cost Analysis Page
1270
Coil to HV 2 Wire Harness
Overview
Overview

assembly processes.
harness.
Harness, Coil to HV 2 Asm Overview
• The Harness, Coil to HV 2 Assembly

consists of one 7mm OD stranded
copper cable terminated by ring
terminals.
• The terminals are plated copper
sleeves that have been mechanically
compressed onto the braided copper
cables and eyelets stamped to allow
mounting to the terminal studs. Two of
the terminals have right angle bends.
The end terminals have been sheared
so the braided cable and the terminal
• The harness covering consists of heat
shrink tubing along with heat shrink at
two eyelet terminals.
• The overall weight of the harness
assembly is 0.0495 kg.
paper.
Wire Harness Totals
Appendix

Cost Analysis Page
1272
Generator Connector Wire
Harness
Overview
Overview

assembly processes.
harness.
Pigtail Wiring Generator Connector
• The Pigtail Wiring Generator Connector consists of two 1.2 mm wires joining one black and red plastic
connector to two pin terminals. Both wires are copper stranded. There are no twisted pairs.
• The harness has no additional covering beyond wire Insulation.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1375
Power Module Wire Harness
Overview
Overview

assembly processes.
harness.
Power Module Wire Harness Overview
• The Power Module Wire Harness consists of 26 wires joining six connectors.
Six of the wires are in three twisted pairs.
• Wires range from 1.5 mm to 2.9 mm in diameter and are twisted copper
strands. The overall weight of the harness is 0.3144 kg.
• Five of the connectors are sealed connectors with multiple terminal cavities.
One of the connectors is an eyelet.
• The largest connector has 58 cavities populated with 23 terminals and has a
sliding lock to ensure full engagement.
• The harness covering consists primarily of stock convolute and cloth tape.
• The only tool required for installation is to drive the bolt attaching the eyelet
connector.
Wire Harness Totals
Appendix

Cost Analysis Page
1482
AC/DC Inverter to Charging
Module Wire Harness
Overview
Overview

assembly processes.
harness.
AC/DC Invertor to Charging Asm Overview
• The AC/DC Invertor to Charging Module Assembly, consists of 2 shielded cables joining two shielded
female spade connectors.
• Both connectors are sealed.
• The cable assembly is fully covered with convolute. A molded mounting bracket is mounted central to the
harness
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1484
Generator to AC/DC Converter
Wire Harness
Overview
Overview

assembly processes.
harness.
HV Cable, Generator to AC/DC Convertor
Asm Overview
• The HV Cable, Generator to AC/DC Convertor Module Assembly, consists of three unshielded cables
joining a 3 cavity sealed connector to 3 individual pin terminals.
• The cable assembly is fully covered with braided metal sleeve, then covered with a second layer of
silicone coated fiberglass sleeve. A molded mounting bracket is mounted central to the harness
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1494
Battery to Power Module Wire
Harness
Overview
Overview

assembly processes.
harness.
HV Cable, Battery to Power Module Asm
Overview
• The HV Cable, Battery to Power Module

Assembly, consists of 2 shielded cables joining
two shielded female spade connectors.
• The cable is 14.1 mm in diameter and composed
of 1096 copper strands. The overall weight of
the harness is 1.920 kg.
• The cable assembly is covered with convolute
and molded brackets.
• All major components are analyzed in detail,
while prices are applied to commodity items (i.e.
clips, terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1526
Power Module to AC Compressor
Wire Harness
Overview
Overview

assembly processes.
harness.
HV Cable, Power Module to AC
Compressor Assembly Overview
• The HV Cable, Power Module to AC Compressor Assembly, consists of a shielded cable with two
conductors and two separate 1.3 mm diameter wires. The two smaller gauge wires are each in a
connector to signal when the connector is disconnected.
• The cable is 9.8 mm in diameter and composed of two conductors with 132 copper strands each. The
• The cable assembly is covered with convolute and has three clips for mounting.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1528
Power Module to Charging Module
Wire Harness
Overview
Overview

assembly processes.
harness.
HV Cable, Power Module to Charging
Module Assembly Overview
• The HV Cable, Power Module to Charging Module Assembly, consists of a shielded cable with two
• The cable is 9.8 mm in diameter and composed of two conductors of 132 copper strands each. The
• The cable assembly is covered with convolute and has two clips for mounting.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1530
Power Module to Charging Module
Wire Harness
Overview
Overview

assembly processes.
harness.
Power Module to Charging Module Asm
Overview
• The HV Cable, Power Module to Charging Module Assembly, consists of 2 shielded cables joining two
shielded female spade connectors.
• The cable assembly is fully covered with convolute. A molded mounting bracket is mounted central to the
harness
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1532
Charging Port Wire Harness
Overview
Overview

assembly processes.
harness.
HV Cable, Charging Port Asm Overview
• The HV Cable, Charging Port

Assembly, consists of 3 shielded
cables and 11 wires joining 5
connectors and 2 ring terminals.
• Two shielded cables are 14.1 mm in
diameter and composed of 1096
copper strands. The remaining shielded
cable has two conductors composed of
126 strands each. The wire diameter of
the remaining circuits are 1.3, 1.5, 1.7,
4.0, and 8.0 mm.
• All five connectors are sealed while the
eyelets have heat shrink over the
crimps.
• The overall weight of the harness is
2.7140 kg.
• The cable assembly is covered with a
combination of convolute, heatproof
tubing, braided tubing, tape, and a
molded trough.
paper.
Wire Harness Totals
Appendix

Cost Analysis Page
1543
Power Module to Heat Exchanger
Wire Harness
Overview
Overview

assembly processes.
harness.
HV Cable, Power Module to Heat
Exchanger Assembly Overview
• The HV Cable, Power Module to Heat Exchanger Assembly, consists of a shielded cable with two
• The cable is 9.8 mm in diameter and composed of two conductors with 132 copper strands each. The
• The cable assembly is covered primarily with convolute. A small section at one end of the cable is
covered with a foil covered heat proof tube. There are 20 mounting clips and one label.
terminals).
Wire Harness Totals
Appendix

Cost Analysis Page
1557
Technical References
BMW i3 Plant Assembly Line Videos:

• https://www.youtube.com/watch?v=gt1k3BLN7pw
• https://www.youtube.com/watch?v=1u7XiBnwPCw
• https://www.youtube.com/watch?v=htuVoxuMQFQ
• https://www.youtube.com/watch?v=kfISmVGCjxg
• https://www.youtube.com/watch?v=29VHdcOvnK8
• https://www.youtube.com/watch?v=x3brfAEs_RY
• https://www.youtube.com/watch?v=Zyf9JhfXu5k
Car & Driver Article Discussing BMW i3 with REx System:
• http://www.caranddriver.com/bmw/i3
SAE Article Discussing BMW i3:
• http://articles.sae.org/12056/
Articles on Anode and Cathode Materials:
• http://www.targray.com/li-ion-battery/anode-materials
• http://www.targray.com/li-ion-battery/cathode-materials
Technical References
Discussion of Lithium Battery Chemistry:

• http://www.fmclithium.com/Home/LiChemistry.aspx
Discussion of Samsung SDI Battery Cells in BMW i3:
• http://www.samsungsdi.com/automotive-battery/battery-
cells
Article on Samsung SDI Batteries & New Production Plant:
• http://evnewsreport.com/samsung-sdi-showcases-eco-
friendly-automotive-batteries-and-materials/31358/
Discussion of Battery Coating Lines:
• http://www.megtec.com/complete-production-lines
Discussion of Battery Management Electronics:
• http://www.greencarcongress.com/2008/12/lg-chem-and-
stm.html
Article on Battery Manufacturing Process:
• http://www.mpoweruk.com/battery_manufacturing.htm

Zone 4 Battery System Report 11-09-2015

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BMW i3 Cost Analysis

Zone 4: Battery System

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 1

Description of Report Content 17

Zone 4: Battery System Overview 33

Zone 4: Battery System 34

Battery Pack Overview 35

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 3

End of line Test 610

Battery Installation 612

Power Electronics Overview 614

Power Electronics 617

Power Module Asm 618

Power Module Installation 1070

Charging Module Asm 1072

Charging Module Installation 1275

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 4

AC/DC Inverter, Generator Installation 1467

Inverter Heat Shield 1469

Inverter Heat Shield Process 1471

Charging Module Interface Installation 1473

Battery Charger Installation 1475

Power Harnesses Overview 1477

Power Harnesses 1480

Power Module Wire Harness Installation 1481

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 5

HV Cable, Generator to AC/DC Converter Asm 1485

HV Cable, Generator to AC/DC Conv Installation 1523

HV Cable, Battery to Power Module Installation 1525

HV Cable Asm, Power Module to AC Comp Installation 1527

HV Cable, PDM to DC/DC Converter Installation 1529

HV Cable, Power Module to Charging Mo Installation 1531

HV Cable Asm, Charging Port/Charging Mod 1533

HV Cable Asm, Charging Port to Charge Installation 1554

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 6

HV Cable Bracket Asm, Drive Motor Installation 1558

Appendix Reports 1560

TechInsights Electronics Reports 1561

Munro & Associates Wire Harness Reports 2121

Technical References 2627

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 7

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 8

Each symbol is created by

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 9

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 11

Sales, General, and Administration: Technology SG&A

The die casting material costs and cycle

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 14

The injection molding material costs and

The stamping material costs and cycle

Zone Report Outline:

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 17

At the beginning of each Zone

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 18

As the report progresses

The second assembly detail

The third assembly detail

Assembly Details: Page 3 of 3

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 21

As the report progresses

The second part detail page,

Part Details: Page 2 of 2

9 November 2015 Copyright © Munro & Associates, Inc. 2015 www.LeanDesign.com 23

As the report progresses