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Recent Development of Amorphous Selenium-


Based X-ray Detectors: A Review
Huang. Heyuan, Abbaszadeh. Shiva, Member, IEEE

Abstract—Amorphous selenium (a-Se) is a photoconductor stationary models for oblique X-ray have been proposed as
material that has been intensively investigated from its early well [17,18]. Additionally, because of its high resistivity, a-Se
application in xerography to its present application in flat panel
X-ray imagers. It can be deposited up to a few millimeters thick intrinsically has low dark current (<10 pA/mm2 under an
over a large area. Its high vapor pressure yields uniform electric field of 10V/µm) and thermal noise compared with
coverage in novel device structures for low-cost and large-area other candidates [19, 20]. With high bias voltage (typically
applications. The evidence of avalanche multiplication in a-Se higher than 70 to 80 V/µm), a-Se can also undergo an
and application of a-Se in high-gain avalanche rushing
photoconductor video-tubes goes back to the early 1980s. Over avalanche process, which dramatically increases conversion
the past decade there has been increasing research interest in gain [1,21,22]. Last, but not least, a-Se direct detectors have
novel detector structures and integration of a-Se with new been proven to have superior spatial resolution [23].
materials to leverage the avalanche properties. We summarize
These advantages have kept researchers working to develop
some of the shortcomings of a-Se such as low charge carrier
mobility, low charge conversion efficiency, depth dependence, better a-Se-based X-ray imagers. With advances in electronics,
and high dark current at high electric fields. We then highlight the discovery of new materials, and the refinement of
recent developments in a-Se-based devices to address these manufacturing techniques, many detectors with superior
shortcomings and enable picosecond timing performance and
properties have been developed.
high detection efficiency.

Index Terms—amorphous selenium, X-ray image sensor, II. CHALLENGES OF AMORPHOUS SELENIUM-BASED X-RAY
direct conversion, indirect conversion DETECTORS
Although a-Se has many advantages when used in X-ray
I. INTRODUCTION imagers, it possesses intrinsic shortcomings as well. To

A MORPHOUS selenium has a low melting point and


high vapor pressure which makes it less complex and
improve a-Se-based X-ray detectors, we must understand the
limitations of a-Se.
more economical to deposit thick and uniform layers over a A. Low Charge Carrier Mobility
large area by for example thermal evaporation. Besides this
One of the most undesirable properties of a-Se is low charge
advantage, amorphous selenium (a-Se) has good X-ray
carrier mobility. The hole drift mobility is around 0.13-0.14
photoconductivity, discovered in the 1940s, and therefore can
cm2/V-s, and the electron mobility is around 5-7×10-3 cm2/V-s,
be used in X-ray imaging. a-Se was heavily used in the
which are orders of magnitude smaller than those of other
photocopy industry until it was replaced by inexpensive
common semiconductor materials like silicon (480 cm2/V-s
organic photoconductors in the late 1980s [1]. However, the
and 1400 cm2/V-s for holes and electrons respectively) [1,24].
combination of a-Se and thin film transistor (TFT) based
Traditional a-Se X-ray design has a sandwich structure: two
active matrix arrays (AMA) brought a-Se back into the focus
electrodes with an a-Se layer in between. Conventionally, both
of the X-ray imaging industry. In fact, a-Se-based flat panel
electrodes will be collecting charges. This implies that the
X-ray imagers (FPXI) have been studied extensively since the
complete charge collection needs the lifetime for both carriers
late 1990s [2-8].
to exceed the transit-time across the entire material thickness.
There are several advantages of using a-Se for X-ray
But inside a-Se, only the primary charge carriers (holes), the
imaging. First, with a strong electric field applied (10 V/µm or
one with the greater mobility-lifetime product, can meet this
higher) [9], a-Se exhibits excellent X-ray photoconductivity,
condition. Additionally, because the photon interaction depth
especially in the energy range used for mammography.
can vary across the bulk layer of a-Se, the slow signal-rise
Second, a-Se can be deposited uniformly over a large area up
time of slower carriers can cause ballistic deficit and depth-
to 1000 µm thick. Third, unlike many other amorphous
dependent variations. All these effects eventually lead to low
materials, charge transport in a-Se is non-dispersive over the
time resolution and high depth-dependent noise [21]. In
time scale of interest at room temperature, which allows
practice, these limitations can hinder the complete charge
engineers and researchers to model and predict charge
collection of X-ray interactions, especially for breast imaging
behavior in a-Se-based devices relatively more easily [1]. In
applications where a-Se is used widely because of its excellent
fact, cascade linear systems have been developed to evaluate
spatial resolution [24].
the performance of a-Se detectors [10-16] and recently non-

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B. Low Charge Conversion Efficiency ray imaging, however, a-Se is in contact with two metal
As reported by previous studies [24,25], the charge electrodes with a strong bias electric field applied in order to
conversion efficiency of a-Se is not ideal, mostly because of achieve sufficient X-ray photogeneration efficiency. The
its high ionization energy. The electron-hole pair creation strong field will inevitably increase the dark current inside a-
energy of a-Se at an applied field of 10 V/µm is 45-50 eV Se by hole injections from the positive electrode, which is
[26,27], while other semiconductor materials, such as HgI2 especially evident for direct conversion detectors [36]. The
and silicon, have electron-hole pair creation energy equal or resulting high dark current will reduce the dynamic range of
less 5 eV under the same electric field [28]. Additionally, the the device [37]. In medical imaging applications, the dark
charge conversion of a-Se is highly dependent on the applied current of a-Se should be reduced to less than 10 pA/mm2
field [29-31], and therefore an a-Se-based detector is typically [38].
operated at 10 V/µm or higher to generate desirable readout.
But the high applied field will inevitably cause charge III. DEVELOPMENT AND EMERGING TECHNOLOGIES
injections and therefore increase dark current. If not addressed Recent studies have focused on the development of better a-
properly, the low charge conversion of a-Se will result in a Se X-ray detectors by taking advantage of the intrinsic
small signal to noise ratio and hence low energy resolution. properties of a-Se, designing novel detector structures and
C. Depth Dependence combining a-Se with other materials and better pixel sensors
to overcome the downside of a-Se and provide better detector
There are two places where the depth dependence can have
performance.
influence: the charge collection process and the avalanche
process (if the detector involves an avalanche process). During A. The Use of the Avalanche Process
the charge collection process, both the charge collection One advantage of a-Se is its ability to undergo an avalanche
efficiency and the time needed for maximum collection are process if a strong electric field is applied (normally higher
dependent on the thickness of the detector or the interaction than 70 V/µm [25] to 80 V/µm) [1,21]. Above the voltage
depth. Previous studies regarding the X-ray sensitivity of a-Se, threshold the effective quantum efficiency can increase several
which is defined as the charge collected per unit area per unit orders of magnitude, while the multiplication factor depends
exposure of radiation, have suggested a dependence of X-ray on the thickness of a-Se layer. According to the data from
sensitivity on the thickness of detectors [32,33]. Another study previous studies [1,39], four testing a-Se devices with
provided simulated results of a 200-µm a-Se traditional planar thicknesses of 35 µm, 25 µm, 15 µm and 8 µm have all shown
parallel-plate detector with an applied field of 13 V/µm [21] to a significant increase in effective quantum efficiency once the
demonstrate the time dependence. The results showed that a bias voltage passed 80 V/µm. At 100 V/µm, the effective
shorter distance between interaction and the collecting quantum efficiency reached about 1000 for a 35 µm thick a-Se
electrode (negative electrode for a-Se detectors) will lead to layer, 300 for 25 µm, 200 for 15 µm, and 100 for 8 µm. A
less time needed for complete charge collection: with the separate study also achieved maximum gain of 1000 for a
thickness of the detector being L, when the interaction is 0.9L 35 µm thick a-Se layer with a field of 92 V/µm [40]. The
away from the collecting electrode, the complete charge avalanche process occurs when the holes (primary charge
collection time is 1.2 µs, and the time reduces to about 0.7 µs carriers) inside the a-Se gain energy faster than losing it to
if the distance is 0.5L and approximately 0.2 µs at 0.1L. phonons and hence produce impact ionization [41,34]. There
In the avalanche process, the farther the initial charge are two important features of the avalanche process inside a-
travels, the more energy it will accumulate and the more Se: firstly, the slow charge carriers inside a-Se, i.e. electrons,
secondary charges will be induced. Therefore, it is possible are not involved in this process [1,40,42-45]; secondly, the
that interactions with the same amount of energy but at avalanche process is non-Markovian and, with a design that
different depths will produce different energy readouts. The suppresses depth-dependent gain, the additional noise from the
depth dependence can hence undermine both time and energy avalanche has limited impact on the signal to noise ratio
resolution. A previous study has shown that a huge avalanche [42,46,47].
gain fluctuation existed when X-rays are absorbed over a thick The avalanche process can increase the charge conversion
layer [25]. Generally, the multiplication factor M depends gain and hence solve the low charge conversion issue. It can
exponentially on the thickness of the photoconductor layer also mitigate the dark current problem by boosting the signal
[34,35]. This suggests that the avalanche layer should be both and hence the signal to noise ratio.
thin and separated from the absorption layer. One early application of the avalanche process inside a-Se
D. Dark Current was the High Avalanche Rushing Photoconductor (HARP)
camera [48-50]. The original HARP detector (shown in Fig. 1)
Intrinsically, a-Se has a relatively small dark current at room
worked with visible light and was used for commercial TV
temperature compared to competing photoconductors. In X-
pickup tubes. It was deposited on a glass substrate with indium

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tin oxide (ITO) as a transparent anode, facing the incoming also have large dynamic range and reduction of the electronic
signal and biased positively. The entire target is around 25-35 noise produced by very high gain. However, the photon-to-
µm thick. CeO2 and a-Se doped with LiF (a-Se:LiF) are placed charge conversion and carrier mobility issue are very evident
between a-Se and the anode to serve as hole injection blocking for direct conversion detectors and thus this detector is limited
layer. There is also an additional layer of a-Se doped with Te by low X-ray quantum efficiency and depth-dependent
(a-Se:Te) as photogeneration layer. Readout consists of a avalanche gain (𝑔𝑎𝑣), which also reduces the Swank factor
cathode with scanning electron bean and a porous Sb2S3 layer [54]. To mitigate the unwanted depth dependence, the
as an electron injection blocker. thickness of a-Se is supposed to be larger than is required for
X-ray absorption. Therefore, HARP-AMPFI is best suited for
very low energy X-rays, such as 6-8 keV for protein
crystallography [55].

Fig. 1. HARP video tube with avalanche gain (adapted from [1]).
The HARP concept is still widely used by many types of X-
ray imagers. With developments in readout electronics and
crystal manufacturing, new HARP modalities have been
created. One type of detector has a scintillator layer between
the X-ray source and the a-Se layer so that the a-Se layer with
avalanche process serves a similar purpose as conventional
photomultiplier tubes and silicon photomultipliers. This type
of indirect conversion imager is referred to as Scintillator
HARP Active Matrix Flat Panel Imager (SHARP-AMFPI), as
shown in Fig.2(a). The other type of HARP detector shares
similar designs, except that the scintillator layer is not
included, and the detector therefore employs direct
conversion, which means that the X-ray photon generates
electron-hole pairs inside a-Se directly. This type is called
HARP-AMFPI [51], as shown in Fig.2(b).
Indirect conversion has been suggested to be more suitable
for avalanche X-ray imagers [52,53]. Visible photons emitted
by scintillators are mostly absorbed by a-Se at the surface of
the photoconductor, while diagnostic X-rays require an a-Se
thickness of 200-1000 µm to reach sufficient quantum
efficiency. Therefore, not only will the applied voltage have to Fig. 2. (a) SHARP-AMFPI and (b) HARP-AMFPI design (adapted from [26]).

be significantly high in order to achieve avalanche field, but To summarize, incorporating a-Se HARP structures is the
also avalanche gain fluctuation due to depth dependence will proper direction of development for both direct conversion
be problematic. SHARP-AMPFI performs well for different detectors for low energy applications and indirect conversion
medical imaging applications, such as breast imaging and detectors for fluoroscopic applications [27,35,56].
radiography-fluoroscopy. Nonetheless, because of the omni- Several studies have investigated the use of the avalanche
directional propagation of light, indirect conversion detectors process of a-Se in medical imaging applications [56,47,54,57-
have inferior resolution in terms of the modulation transfer 60] as well as crystallography [55,61]. Yet these studies did
function (MTF) compared to direct conversion detectors. The not fully extend to large area FPXI. A later study assessed the
MTF is the Fourier transform of the point spread function and feasibility of large area FPXI with avalanche gain and
is a measure of how the system translates details of the objects concluded such a structure could achieve fully quantum noise
being imaged to the images themselves. limited X-ray imaging with high resolution [53]. The
On the other hand, direct conversion X-ray imagers, feasibility of depositing HARP structure on a TFT array was
including HARP-AMPFI, not only provide better MTF, but practically demonstrated in 2015 [62,63]. A year later,
Scheuermann and coworkers have successfully deposited

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HARP structure onto a TFT panel with an area of 24×30 cm2 [68]. The near-field/small-pixel effect occurs when the pixel
and pixel pitch of 85 µm [51]. Under an electric field of 105 pitch is equal to or less than one tenth of the thickness of the
V/µm, the detector achieved an avalanche gain of 15±3 for detector [69], and such small pixel will sense the movement of
direct conversion and 76±5 for indirect conversion. The study carriers only when they are very close to the pixel. However,
also demonstrated that with high 𝑔𝑎𝑣, the effect of electronic in some a-Se devices the near-field effect is not practically
noise can be substantially reduced because of the increased achievable because the thickness of the a-Se layer is relatively
signal to noise ratio provided by the increased quantum small (e.g., 200 µm for mammography panels) compared to
detection efficiency. The group proposed that improving the the pixel pitch (e.g., 85 µm in regular mammography panels)
optical coupling efficiency between the scintillator and HARP [64]. Nonetheless, the equation (1) suggests that the
can reduce the required avalanche again for quantum noise instantaneous weighting potential sensed by the carrier is
limited detector operation at low dose. dependent on the instantaneous position of that carrier, and
In 2017, the first prototype SHARP-AMPFI was fabricated because the position is determined by the applied field and
by Scheuermann’s team [64]. The prototype was deposited on time, the near-field effect inside a-Se detector can still be
a 24×30 cm2 TFT array with a pixel pitch of 85 µm and created by manipulating the electric field.
consisted of a 16-µm a-Se layer and a 105-µm CsI:Tl Goldan and Karim proposed to insert a Frisch grid (or mesh)
scintillator layer. The applied field reached 105 V/µm without electrode in front of the collecting (pixel) electrode to shape
breaking down the a-Se and an avalanche gain of 76±5 was the electric field inside the a-Se [67], as shown in Fig.3. The
measured under that field, which was demonstrated to be able simulation results demonstrated that the desired weighting
to amplify the signal enough to overcome the electronic noise. potential for the near-field effect (i.e. raising rapidly only near
Yet, this system has poor optical transparency of the high- the collection electrode) can be created by a Frisch grid. This
voltage electrode and long integrating time which leads to was confirmed by later studies [70,71]. Recently, this design
dark current noise. The combined effect was the dominance of has been further improved and prototyped [21]. In addition,
high-spatial frequency noise in imaging performance. they have successfully implemented unipolar time differential
B. The Manipulation of Electric Field (UTD) charge sensing, where the impulse function is
proportional to the time derivative of that in a conventional
The electric field inside a-Se materials plays a decisive role
planar detector design. With UTD charge sensing, the transit-
in the charge carrier transport and collection. A properly
time of secondary charges will no longer limit the signal rise
shaped electric field inside the a-Se can mitigate the poor
time for 100% charge collection efficiency. Therefore, the
charge transport issue and therefore improve time resolution.
UTD can enable the detector to approach the theoretical limit
Weighting potential is an important concept describing the
of time resolution. The team has successfully achieved ultra-
relationship between the charge collection and instantaneous
fast signal rise time which is limited only by the size of the
position of carriers. As provided by Shockley [65] and Ramo
primary charge carrier (hole) cloud. The prototyped device is
[66], the induced charge 𝑄(𝑡) due to the motion of a single
referred as the Multi-Well Solid-state Detector (MWSD),
electron can be calculated as:
shown in Fig.4. The MWSD has been tested and shown a
𝑄 𝑡 = 𝑞𝑉! 𝑧 = 𝑞𝑉! 𝜇𝐹𝑡 (1)
reduction in signal rise time by a factor of ~300, compared
where 𝑞 is the charge of an electron, 𝑉! 𝑧 is the weighting
with conventional planar parallel-plate detectors.
potential in the bulk, 𝑧 is the carrier displacement, 𝜇 is the
effective drift/hopping mobility, 𝐹 is the applied electric field,
and hence within time 𝑡, 𝑧=𝜇𝐹𝑡.
The induced current can be expressed as:
!! !!
𝑖 𝑡 = 𝑞𝑣 ∙ 𝐹! = 𝑞 ! = 𝑞𝜇𝐹 ! (2)
!" !"
where 𝑣 is the instantaneous velocity and 𝐹! is the conceptual
weighting field vector. Equations (1) and (2) indicate that the
detected signal is related to the weighting potential.
Unipolar charge sensing is another crucial principle where
the detector preferentially senses the charge carriers with a
higher mobility-lifetime product while remaining insensitive
towards the movement, trapping, and release of slower carriers Fig. 3. The electric field and weighting potential that created the near-field
[21]. This preferential sensing can be realized by the effect (adapted from [21]).
weighting potential which has a strong increasing gradient
only in the region near the collecting electrode while increases
very gradually elsewhere [67]. Achieving such weighting
potential is possible with near-field effect or small pixel effect

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by introducing an additional Frisch grid layer. Hence, the two


separate regions within SWAD become: (1) bulk region (up to
1 mm thick for X-ray absorption) with relatively weak field
(~10 V/µm) where the X-ray interaction happens and produces
electron-hole pairs, (2) avalanche region with strong field
(~80 V/µm) inside wells where the primary charge carriers
(holes) get multiplied [25].
When the detector is exposed to an X-ray source, the
incoming radiation will be absorbed in the bulk region,
producing electron-hole pairs. Then the primary charge
Fig. 4. The schematic diagram of the prototyped MWSD (adapted from [21]). carriers (holes), will drift into the well regions where they
Another detector concept achieving unipolar charge sensing undergo the avalanche process. The multiplied signal will
is the three-terminal design [72]. As the name suggests, this eventually be collected by the collector electrode. The two
design differs from conventional structure by having three Frisch grids provide more precise control of the field inside
terminals instead of two, which are denoted as gate G (VG), the detector. By properly biasing the grids, field lines inside
source S (VS) and drain (VD). The structure is demonstrated well regions can terminate on the collecting electrode instead
in Fig.5. of well walls, which resolves the high dark current issue found
The three-terminal design also seeks to enhance the electric in previous MWSD design because of charge injection [73].
field near the collecting electrode, but unlike the MWSD Currently, the SWAD has not been manufactured. However,
(where the boosted electric field is still in the vertical two successive studies [24,25] have used simulations to
direction), the three-terminal detector increases the field in the evaluate the performance of the SWAD and revealed its
lateral direction with terminals S and D. The G terminal is potential of becoming a photon-counting detector. The energy
used to shape the electric field so that an evenly increasing resolution of the SWAD is expected to be comparable to
vertical field still exists in order to facilitate the drifting of current CdTe detectors [25,74]. Another recent simulation
induced charges. Therefore, the detector is virtually divided study also concluded that the SWAD is capable of attaining
into two layers: the top charge generation layer with a the necessary count rate linearity to achieve photon counting
gradually increasing vertical electric field and the bottom performance while obtaining energy resolution which is
charge collection layer with a very strong lateral field. The comparable to that of the CdTe based detectors for a 1 mm2
simulation analysis showed a weighting potential fits the pixel [75].
profile needed for unipolar charge sensing. Although the
weighting potential was not as perfect as the one achieved by
MWSD, the simulation was still able to demonstrate the
unipolar charge sensing capability of this design. An
additional advantage of the three-terminal design is that the G
terminal can control the current between the S and D
terminals, and therefore the transfer and output characteristics
of the detector can be readily controlled. This advantage can
potentially help avoid using a TFT switch at the pixel level.
However, this design is yet to be fabricated or prototyped.

Fig. 6. The schematic diagram of the SWAD multi-grid structure (adapted


from [25]).
Another recently prototyped design combining UTD and
HARP with the insertion of Frisch grid was fabricated using
Fig. 5. The of the three-terminal design and the achieved weighting
nanoscale structures [42]. The detector has a high-density
potential.
Goldan and coworkers later combined the concept of multiwell geometry with nanoscale pillars and one layer of
MWSD with HARP and proposed another design called field- nano-Frisch grid. The experiment was carried out with a
Shaping multi-Well Avalanche Detector (SWAD), shown in picosecond laser, and the results showed that the detector
Fig.6. It implements an avalanche zone inside the well region improved the temporal performance of a-Se by nearly 4 orders

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of magnitude, allowing the detector to reach picosecond utilizes a Frisch grid to help shape the electric field, along
resolution. The experiment and detector design are shown in with a SiNx layer to prevent charge injection. A major
Fig.7. This nano structure design also has the potential difference between MPPC and SWAD is that MPPC operates
application in positron emission tomography (PET) scanners in two phases: accumulation and collection. The accumulation
as a replacement of silicon optical sensors, because the gaps of phase is where all the primary charge carriers (holes) will
optical sensing can be avoided by using selenium and the accumulate on the insulator layer surrounding the negatively
calculated coincidence timing resolution can therefore be biased Frisch grid. The insulator also prevents charge
improved. injections at the same time. During the collection phase, the
The improvement on the time resolution of a-Se-based X- grid voltage is reversed, and electric field lines will bend
ray detectors has shown enough potential that the application towards the pixel electrodes. The pixel electrodes possess a
of a-Se detectors for real-time imaging has been investigated. unique octagonal well structure so that the convergence of the
A recent study proposed and prototyped a design called the electric field occurs near the pixel electrodes where the
Multi Pixel Proportional Counter (MPPC) [76, 77], shown in avalanche process will happen.
Fig.8. The MPPC was intended to overcome two major issues The prototyped MPPC device has shown a significantly
that keep a-Se from real-time imaging use [39]: 1) X-ray reduced lag: only around 20% of that found in conventional a-
sensitivity needs to be further improved or the noise further Se devices. The device was also observed to have substantially
reduced so that the quantum noise limit can be satisfied even improved temporal performance.
at extremely low exposure, which is true for real-time imaging
where essentially several images need to be taken within a
second. 2) the detector should operate at a high frame rate
(30fps) without suffering from memory artifacts.
Compared to regular imaging, real time imaging usually
involves high energy photons and thus requires a-Se to be
relatively thick to achieve the desired absorption of incoming
photons. For example, photons with mean energy of 60 keV
require the thickness of the photoconductor to be about 1000
µm. Although a-Se has the advantage of convenient and
uniform deposition as a thick film, the sensitivity will be
limited by Schubweg which is defined as a carrier drift range
before being deeply trapped. Plus, as mentioned before, in
conventional a-Se detector structure the depth dependence can Fig. 7. The schematic diagram of the picosecond multiwell selenium
noticeably influence both time and energy resolution, and it detector experiment (adapted from [42]).
will inevitably be worsened with a thicker layer of a-Se.
Therefore, simply depositing a very thick layer of a-Se to
match the requirement for high energy X-ray absorption is not
practical.
Memory artifacts arise primarily from two sources: lag and
ghosting. Lag is the residual signal after an x-ray exposure and
ghosting is the change in x-ray sensitivity as a result of
previous exposures [78]. Normally, the sensitivity reduction is
insignificant if operated under proper conditions [79].
However, in real-time imaging lag will cause the subsequent
frame to carry spillover from the previous exposure and
therefore produce inaccurate or misleading images, especially
for a thick layer of a-Se where lag is increased by poor charge
transportation. As suggested by a previous study, the main
source of photocurrent lag is the release of the trapped charge,
i.e. electrons inside a-Se [77].
Similar to SWAD, MPPC utilizes avalanche gain and
unipolar charge sensing to overcome the two problems
mentioned above. Avalanche gain helps increase the signal
gain while unipolar charge sensing reduces the temporal
artifacts by ignoring the behavior of electrons. MPPC also Fig. 8. The Schematic diagram MPPC detectors (adapted from [76]).

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C. Charge Injection Blocking been showed to push the limit of MTF toward the material
The major reason for the increased dark current within a-Se limit.
under high biased voltage is charge injection, primarily the As mentioned before, a-Se can also be used as an indirect
injection of holes from positive electrodes [73]. Therefore, conversion X-ray detector or as an optical detector. In these
dark current can be significantly reduced by placing an applications, the thickness of the a-Se layer can be less than
injection blocking layer between the electrodes and a-Se. A 1 µm. As a consequence, the voltage drop across PI, an
common approach is to place n-type and/or p-type layers insulator hole blocking layer, will not be trivial. Therefore, it
between the a-Se and corresponding electrodes, forming an n- is better to use metal oxide as the hole blocking layer under
i, i-p or even n-i-p multiplayer structure [80,1]. This method these circumstances [87]. Abbaszadeh and her team showed
can effectively reduce the dark current to an acceptable level that Indium Gallium Zinc Oxide (IGZO) is an appealing
with an applied field of 10 V/µm. However, emerging choice [88]. The IGZO provides an exceptional reduction of
applications and design advancements of a-Se detectors dark current. Even with 60 V/µm of biased voltage, a 375-nm
normally can benefit from increased signal gain, usually IGZO layer still managed to maintain a dark current under 1
achieved by the increase of bias voltage. For example, the pA/mm2.
HARP, SWAD, and MPPC detectors mentioned above all take Another group showed that aluminum oxide and hafnium
advantage of the avalanche process inside a-Se, which requires oxide (ALD-HfO2) is a good candidate as well [89]. At 15
an electric field higher than 70-80 V/µm. Considering the dark V/µm, the addition of an ALD-HfO2 blocking layer inside the
current limit of 10 pA/mm2 for medical imaging applications, metal-insulator-semiconductor-insulator-metal photodetector
n-type and/or p-type layers may no longer provide the desired improved the optimal signal contrast to more than 500 times
dark current reduction under such high voltage. Consequently, the contrast of a photodetector without any blocking layer.
many studies have investigated proper charge injection D. Impurities
blocking material. Aside from C60 [81], perylene
Normally, commercial selenium is well-purified, primarily
tetracarboxylic bisbenzimidazole (PTCBI) [82], CeO2 [83] and
because impurities can create point defects, acting as points
zinc oxide (ZnO) [84], more promising materials have been
for charge trapping and recombination. They can also cause
studied recently.
charge build-up, influence electric field and limit the detector
Abbaszadeh and her team investigated multiple types of
performance. However, the addition of certain impurities can
material for a hole injection blocking layer for indirect X-ray
also help stabilize a-Se and improve both physical and electric
conversion [82], including CeO2, TiO2, PTCBI and polyimide
properties. For instance, Arsenic (As) can be added to prevent
(PI). CeO2 has been used already as a blocking layer in some
crystallization [38,36], and Chlorine (Cl) can improve charge
high voltage detectors such as HARP, with TiO2 sharing
transport properties [90]. Studies have reported that the
similar properties. Both PTCBI and PI are promising materials
presence of Cl inside a-Se will compensate for hole traps and
with very low hole mobility and industrial insulating
enhance electron trapping and therefore increase the lifetime
properties respectively. It was reported that the dark current
of holes while decreasing electron lifetime [91,92]. The basic
with CeO2 and TiO2 is high when the electric field exceeds 40
mechanism of Cl in a-Se is that Cl involves a series of two
V/µm, indicating that they might not be the ultimate choice of
reactions that transform under-coordinated charge defects 𝑆𝑒1−
blocking layer for detectors operating under high voltage.
into over-coordinated ones 𝑆𝑒3+ [91].
Additionally, these two materials are very sensitive to
𝑆𝑒!! + 𝐶𝑙!! → 𝑆𝑒!! + 𝐶𝑙!!
deposition conditions, which complicates the fabrication
𝑆𝑒!! + 𝐶𝑙!! → 𝑆𝑒!! + 𝐶𝑙!!
process. The PTCBI could have been a good candidate
The most straightforward way of introducing an impurity
because of the proportionality between its thickness and
into a-Se is through synthesis of Selenium alloys or doping
reduction of dark current, but it is found to have less blocking
[93-95]. Recently, Chowdhury’s group has synthesized a high
capability than CeO2 and TiO2. On the other hand, PI is found
resistivity a-Se (As, Cl) alloy through a custom deposition
to have the most desirable properties among all four tested
setup [96]. Tests have shown that the synthesized a-Se alloy
materials. PI can maintain sufficiently low dark current (less
(As 0.52%, Cl 5ppm) has resistivity of 2×10!" Ω ∙ 𝑐𝑚, which
than 10 pA/mm2) even under voltage as high as 92 V/µm, and
is suitable for high resolution radiation detection and dark
strong charge accumulation is not found in the detector. A
current of only a few pA/mm2, which fulfills the requirement
later study also confirms that PI does not degrade the
for medical imaging use. The bulk properties and physical
performance of a-Se. Instead, it helps to improve the lag issue,
properties, including melting point and crystallization
despite the trade-off between ghosting and dark current [85].
temperature, were also reported to be improved.
Moreover, PI is subsequently found to be suitable as a buffer
Another way of introducing Cl impurities is through
between a CMOS panel and a-Se, which inhibits the problem
electrolysis [97,98]. During the electrolysis process, a-Se is
of crystallization and improves the stability of the detector
used as the anode to electrolyze a saturated NaCl solution.
[86]. The PI layer between CMOS and a-Se has successfully

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Through the attraction of the positive anode, the anion Cl- will Additionally, although both sensors have tradeoffs between
be introduced into the a-Se. A previous study has shown that spatial resolution and image noise, each of them is suited
Cl can submerge for more than 60% of the a-Se film thickness better for different scenarios [109]: the a-Si:H flat panel
[97]. The process is demonstrated in Fig.9. detectors have slightly better performance for low-contrast
Another study has investigated the combination of visualization, i.e. emphasizing low-frequency response, while
heterostructure and electrolysis to “design” the transportation the CMOS flat panel detectors perform better for high-contrast
properties of multilayer a-Se films [90]. The heterostructure is visualization or emphasizing high-frequency response.
typically used in high performance photoelectronics because Because a-Se intrinsically has good spatial resolution,
of its energy gap variations allowing the control of charge combining a-Se with high-resolution pixel sensors is one
carrier flow [99]. One example of heterostructure usage for a- direct way to improve the spatial resolution of the detector as a
Se is the HARP detector [100,101]. After electrolysis, the whole. Several studies have investigated the integration of a-
device showed higher conduction current and better Se with high-resolution CMOS panels. Scott, Abbaszadeh et al
photoresponse. have successfully manufactured an a-Se-based direct
One advantage of electrolysis is that it can be used on a-Se conversion CMOS X-ray detector with pixel pitch of 25 µm
films that have already been deposited. Therefore, it can be a [86]. The fabricated device was shown to approach the
very flexible and effective way of modifying the property of a- fundamental material limit of MTF, i.e. the MTF is limited
Se panels. only by a-Se properties instead of the pixel sensors. Later,
Scott, Parsafar et al fabricated a high-dose CMOS a-Se direct
conversion X-ray detector with 5.6 µm×6.25 µm pixel pitch
and a much higher gain in DQE compared with existing
scintillator-based imagers [110,111]. Another recent study by
Camlica et al has reported a prototype direct conversion X-ray
detector with 11 µm×11 µm pixel pitch and single-photon-
counting ability [112]. The prototype detector combined a-Se
with CMOS and overcame the count-rate limit of a-Se by
unipolar charge sensing, which is achieved by the unique pixel
geometry enabling the small pixel effect.
As for TFT sensors, studies have been focused on
developing better pixel structure to improve their performance
and functionality. An intelligent pixel architecture was
developed by Karim et al in 2007, which enabled on-pixel
amplification and therefore reduced the effect of external
readout noise [113]. Later Wang and coworkers successfully
prototyped a large-area indirect conversion detector based on
a-Se and a-Si:H TFT [114]. The fabricated 32×32 micro-pixel
detector was reported to have very fast integration and showed
Fig. 9. Illustration of typical a-Se electrolysis (adapted from [97]). great promise for low light detection. Another team from
E. Combination with Advanced Pixel Sensors Taiwan created a mechanically flexible direct conversion X-
ray detector consisting of a micropillar structured a-Se layer
As the final component to convert charges into digital
and a flexible TFT backplane [115]. The detector was
signals, pixel sensors are the key to ensure that the
suggested to be bendable, i.e. it was able to capture an X-ray
improvement of the performance of a-Se translates properly
image when it was curved.
into better image quality. In fact, as mentioned before, the
comeback of a-Se into the X-ray imaging industry can be IV. CONCLUSION
attributed to the application of a-Si:H TFT based AMA in the
Recent development of a-Se X-ray detectors focuses on
medical imaging industry to manufacture FPXIs. Since the
alleviating its intrinsic limitations. Taking advantage of the
first a-Se-based FPXI was prototyped in the mid-nighties
avalanche properties amplifies the signal and increases the
[102-108], digital sensor industry has made significant
signal to noise ratio. Shaping the electric field properly allows
progress, including the invention and improvement of CMOS
only the primary charge carriers to be sensed and improves the
imager sensors. For a-Se FPXIs, both a-Si:H TFT-AMA and
time resolution. Using the right blocking materials reduces
CMOS based detectors are of interests. While CMOS can
charge injection and mitigates the dark current problem.
offer additional functionalities and faster speed, a-Si:H TFT-
Introducing impurities modifies the physical and electrical
AMA is better for large area applications and costs less [27].
properties of a-Se and makes it more suitable for imaging

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[113] Karim, K. S., Izadi, M. H., Taghibakhsh, F., & Sanaie, G. (2007). Heyuan Huang is currently pursuing his B.S.
Intelligent Pixel Architectures for Digital Medical Imaging degree at the University of Illinois at Urbana-
Applications. ECS Transactions. doi:10.1149/1.2767322 Champaign. He is in a dual-degree program of
[114] Wang, K., Yazdandoost, M. Y., Keshavarzi, R., Shin, K., Hristovski, Physics and Nuclear Engineering with the
C., Abbaszadeh, S., . . . Karim, K. S. (2011). Integration of an concentration on Radiological, Medical and
amorphous silicon passive pixel sensor array with a lateral amorphous Instrumentation Applications. In 2017, he joined
selenium detector for large area indirect conversion X-ray imaging Shiva Abbaszadeh’s research group and has
applications. Medical Imaging 2011: Physics of Medical Imaging. participated in researches concerning PET
doi:10.1117/12.877592 scanners and X-ray imagers. In 2018, he worked
[115] Kuo, T., Wu, C., Lu, H., Chan, I., Wang, K., & Leou, K. (2014). for GE Healthcare during the summer as Physics
Flexible X-ray imaging detector based on direct conversion in Intern, helping improve the manufacturing process
amorphous selenium. Journal of Vacuum Science & Technology A: of X-ray panels.
Vacuum, Surfaces, and Films,32(4), 041507. doi:10.1116/1.4882835
Shiva Abbaszadeh is currently an Assistant
Professor at the University of California, Santa
Cruz in the Electrical and Computer Engineering
Department (ECE). She was previously an
Assistant Professor at University of Illinois at
Urbana Champaign. She received her PhD in ECE
at the University of Waterloo (Ontario, Canada).
Her research interests include radiation detection
and instrumentation for molecular imaging,
computational problem solving, and quantitative
characterization of biological processes.

This work is licensed under a Creative Commons Attribution 4.0 License. For more information, see https://creativecommons.org/licenses/by/4.0/.

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