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H510M S2H V2 (rev. 1.0) H410M S2H V2 (rev. 1.1)

LGA1200 package:

1. 11th Generation Intel® Core™ i

9 processors / Intel® Core™ i7
processors / Intel® Core™ i5 p
1. Support for 10th Generation Int
rocessors
el® Core™ i9 processors/Intel®
2. 10th Generation Intel® Core™
Core™ i7 processors/Intel® Co
i9 processors / Intel® Core™ i7
re™ i5 processors/Intel® Core
processors / Intel® Core™ i5 p
™ i3 processors/Intel® Pentiu
CPU rocessors / Intel® Core™ i3 pr
m® processors/Intel® Celeron®
ocessors/
Intel® Pentium® proc
processors in the LGA1200 pa
essors / Intel® Celeron® proce ckage
ssors*
2. L3 cache varies with CPU
* Limited to processors with 4
MB Intel® Smart Cache, Intel® (Please refer "CPU Support List" for
Celeron® G5xx5 family. more information.)
3. L3 cache varies with CPU

(Please refer to "CPU Support List" fo

r more information.)

Socket Socket 1200 Socket 1200

Chipset 1. Intel® H510 Express Chipset 1. Intel® H470 Express Chipset

Memory
1. 11th Generation Intel® Core™ i 1. Intel® Core™ i9/i7 processors:

9/i7/i5 processors:
Support for DDR4 2933/2666/2
Support for DDR4 3200/3000/2 400/2133 MHz memory modul
933/2666/2400/2133 MHz me es
mory modules 2. Intel® Core™ i5/i3/Pentium®/C
2. 10th Generation Intel® Core™ eleron® processors:

i9/i7 processors:
Support for DDR4 2666/2400/2
Support for DDR4 2933/2666/2
400/2133 MHz memory modul
es
3. 10th Generation Intel® Core™
i5/i3/Pentium®/Celeron® proce
ssors:
4. Dual channel memory architect
Support for DDR4 2666/2400/2
133 MHz memory modules
https://www.gigabyte.com/Comparison/Result/2?pids=7993,8074
133 MHz memory modules
3. 2 x DDR4 DIMM sockets supp
orting up to 64 GB (32 GB sing
le DIMM capacity) of system m
emory
ure
5. Support for ECC Un-buffered
DIMM 1Rx8/2Rx8 memory mo
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4. 2 x DDR4 DIMM sockets supp dules (operate in non-ECC mo
orting up to 64 GB (32 GB sing de)
le DIMM capacity) of system m 6. Support for non-ECC Un-buffer
emory ed DIMM 1Rx8/2Rx8/1Rx16 m
5. Dual channel memory architect emory modules
ure 7. Support for Extreme Memory P
6. Support for ECC Un-buffered rofile (XMP) memory modules
DIMM 1Rx8/2Rx8 memory mo
dules (operate in non-ECC mo (Please refer "Memory Support List" f
de) or more information.)
7. Support for non-ECC Un-buffer
ed DIMM 1Rx8/2Rx8/1Rx16 m
emory modules
8. Support for Extreme Memory P
rofile (XMP) memory modules

(Please refer "Memory Support List" f

or more information.)
Integrated Graphics Processor-Intel®
HD Graphics support: Integrated Graphics Processor-Intel®
HD Graphics support:
1. 1 x DVI-D port, supporting a m
aximum resolution of 1920x12 1. 1 x D-Sub port, supporting a m
00@60 Hz
aximum resolution of 1920x12
* The DVI-D port does not sup 00@60 Hz
port D-Sub connection by adap 2. 1 x DVI-D port, supporting a m
ter. aximum resolution of 1920x12
2. 1 x HDMI ports, supporting a m 00@60 Hz

aximum resolution of 4096x21 * The DVI-D port does not sup

60@30 Hz
port D-Sub connection by adap
Onboard Graphics
* Support for HDMI 1.4 version ter.
and HDCP 2.3. 3. 1 x HDMI port, supporting a m
3. 1 x DisplayPort, supporting a aximum resolution of 4096x21
maximum resolution of 4096x2 60@30 Hz

304@60 Hz
* Support for HDMI 1.4 version
* Support for DisplayPort 1.2 v and HDCP 2.3.
ersion and HDCP 2.3 Support for up to dual-display
at the same time

Support for up to 2 displays at the sa Maximum shared memory of 5

me time
12 MB
(Graphics specifications may vary dep
ending on CPU support.)

1. Realtek® Audio CODEC 1. Realtek® Audio CODEC

2. High Definition Audio 2. High Definition Audio
3. 2/4/5.1/7.1-channel
3. 2/4/5.1/7.1-channel

* To configure 7.1-channel audi * To configure 7.1-channel audi

o, you need to open the audio
Audio software and select Device adv
anced settings > Playback Dev
ice to change the default settin
g first. Please visit GIGABYT
E's website for details on confi
guring the audio software.
o, you need to open the audio
software and select Device adv
anced settings > Playback Dev
ice to change the default settin
g first. Please visit GIGABYT
E's website for details on confi
guring the audio software.

1. Realtek® GbE LAN chip (1 Gbi 1. Gigabit Ethernet Chip (1 Gbps/

LAN 100 Mbps)
t/100 Mbit)

Expansion Slots
1. 1 x PCI Express x16 slot, runni 1. 1 x PCI Express x16 slot, runni
ng at x16
ng at x16
(The PCI Express x16 slot conf 2. 2 x PCI Express x1 slot

orms to PCI Express 4.0 stand (The PCI Express slots confor
ard.)*

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11/11/21, 6:11 PM Compare Result | Motherboard | GIGABYTE

* Supported by 11th Generatio m to PCI Express 3.0 standar

n processors only. d.)
2. 2 x PCI Express x1 slots

(The PCI Express x1 slots conf Supports up to ASPM L1.2 power ma

orm to PCI Express 3.0 standa nagement protocols.
rd.)

Chipset:

1. 1 x M.2 connector (Socket 3, M 1. 1 x M.2 connector (Socket 3, M

key, type 2260/2280 SATA and key, type 2242/2260/2280 SAT
PCIe 3.0 x4/x2 SSD support)
A and PCIe x4/x2 SSD suppor
* The PCIEX1_1 slot shares ba t)
ndwidth with the M.2 connecto 2. 4 x SATA 6Gb/s connectors
r. When the PCIEX1_1 slot is p 3. Support for RAID 0, RAID 1, R
Storage Interface opulated, the M.2 connector su AID 5, and RAID 10
pports up to PCIe 3.0 x2 SSD
only. 4. Intel® Optane™ Memory Read
2. 4 x SATA 6Gb/s connectors
y
* Refer to "1-7 Internal Connec
M.2 connectors support up to ASPM L
tors," for the installation notice
1.2 PCIe power management protocol
s for the M.2 and SATA connec
s.
tors.

Chipset:
Chipset:
1. 4 x USB 3.2 Gen 1 ports (2 por
ts on the back panel, 2 ports a
vailable through the internal U
SB header)
USB Chipset+USB 2.0 Hub:
1. 8 x USB 2.0/1.1 ports (4 ports
on the back panel, 4 ports avail
able through the internal USB
header)
1. 4 x USB 3.2 Gen 1 ports (2 por
ts on the back panel, 2 ports a
vailable through the internal U
SB header)
2. 6 x USB 2.0/1.1 ports (4 ports
on the back panel, 2 ports avail
able through the internal USB
header)

1. 1 x 24-pin ATX main power co

nnector
1. 1 x 24-pin ATX main power co
2. 1 x 8-pin ATX 12V power conn
nnector
ector
2. 1 x 8-pin ATX 12V power conn
3. 4 x SATA 6Gb/s connectors
ector
4. 1 x CPU fan header
3. 4 x SATA 6Gb/s connectors
5. 2 x system fan headers
4. 1 x CPU fan header
6. 1 x RGB LED strip header
5. 1 x system fan header
7. 1 x front panel header
6. 1 x RGB LED strip header
8. 1 x front panel audio header
7. 1 x front panel header
9. 1 x USB 3.2 Gen 1 header
Internal I/O Connectors 10. 2 x USB 2.0/1.1 headers
8. 1 x front panel audio header
9. 1 x speaker header
11. 1 x Trusted Platform Module h
10. 1 x USB 3.2 Gen 1 header
eader (For the GC-TPM2.0 SP
11. 1 x USB 2.0/1.1 header
I/GC-TPM2.0 SPI 2.0 module o
12. 1 x Trusted Platform Module h
nly)
eader (For the GC-TPM2.0 SP
12. 1 x serial port header
I/GC-TPM2.0 SPI 2.0 module o
13. 1 x Clear CMOS jumper
nly)
13. 1 x serial port header
＊All fan headers are subject to supp
14. 1 x Clear CMOS jumper
ort AIO_Pump, Pump and high perfor
mance fan with the capability of delive
ring up to 2A/12V @ 24W.
Back Panel Connectors
1. 1 x PS/2 keyboard port 1. 1 x PS/2 keyboard port
2. 1 x PS/2 mouse port 2. 1 x PS/2 mouse port
3. 1 x DVI-D port 3. 1 x D-Sub port
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11/11/21, 6:11 PM Compare Result | Motherboard | GIGABYTE
4. 1 x DisplayPorts 4. 1 x DVI-D port
5. 1 x HDMI port 5. 1 x HDMI port
6. 2 x USB 3.2 Gen 1 ports 6. 2 x USB 3.2 Gen 1 ports
7. 4 x USB 2.0/1.1 ports 7. 4 x USB 2.0/1.1 ports
8. 1 x RJ-45 port 8. 1 x RJ-45 port
9. 3 x audio jacks 9. 3 x audio jacks

Operating System 1. Support for Windows 10 64-bit 1. Support for Windows 10 64-bit

1. Micro ATX Form Factor; 24.4c 1. Micro ATX Form Factor; 22.6c
Form Factor m x 21.0cm m x 18.5cm

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