SIMATIC Compact Field Unit

… Lower price compared to conventional fieldbus technology

Current fieldbus solution SIMATIC Compact Field Unit – PA Edition

Quantity Component Quantity Component

2× Interface module IM 153-2 SIMATIC CFU PA bundle

1×
witch aluminum housing
1× Bus module IM/IM
2× Coupler FDC157
Bus module pair BM DP/PA
1×
(for ring redundancy)

1× AFD8

➔ 8 × PROFIBUS PA ➔ 8 × configurable DI/DQ + 8 × PROFIBUS PA

Savings of up to 25% and more functionality by using SIMATIC CFU!

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 Information on the life cycle ET 200M

https://new.siemens.com/global/en/products/automation/systems/industrial/io-systems/simatic-et-200m.html https://new.siemens.com/global/en/products/automation/process-control/simatic-pcs-7/distributed-peripheral.html

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SIMATIC Compact Field Unit
… Process automation integrated into the TIA Portal

TIA – Totally Integrated Automation

Customer benefits through:

Flexibility through distributed installation
• Approved for Ex-Zone 2/22
• Extended temperature range: -40 °C …70 °C
• Conformal coating
• Use at altitudes up to 4000 meters
• NAMUR NE21 compliant
• Pressure die cast aluminum housing
Smart and easy PROFIBUS PA integration into the TIA Portal
• Commissioning wizard for quick and error-free installation
• Less work required for device integration and device replacement
Plug-and-Produce
• Automatic addressing of the PROFIBUS PA devices

PROFINET BusAdapter concept

• Modular PROFINET connection for various topologies
Standard CPU 1500
• PROFINET S2 certified for maximum availability
SIPLUS CPU 1500
Redundant CPU 1500 • Interfaces for copper and fiber-glass technology

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Compact Field Unit PA Edition

Quantity Description Article number

SIMATIC CFU PA bundle

1× 6ES7655-5PX11-1AX0
with aluminum housing

Product note: https://support.industry.siemens.com/cs/ww/en/view/109749357

Manual: https://support.industry.siemens.com/cs/ww/en/view/1142696
FAQ: https://support.industry.siemens.com/cs/en/de/view/51678187
Application example: https://support.industry.siemens.com/cs/ww/en/view/109766570

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Compact Field Unit (PA): Top-Down Engineering

Application example 1 –
Engineering System (HW config) “Top-Down Engineering”
For easy installation, preset track with specified I/O (PA
➢ Configuration of the standard PA profiles (Top-Down Engineering) profile) and TAG
• Reading back of the devices connected to the CFU (Bottom-Up
Engineering) Track 1
Profile: 1 × Analog input
TAG: PT01_150

Field installation (new device)

➢ Configuration of the standard PA profiles (Top-Down Engineering)

• Reading back of the devices connected to the CFU (Bottom-Up I am
I am
Engineering) PT01_150 with
TT01_210
1 × AI and
with 2 × AI
1 × Flow

Replacing a device: Replacing a PA sensor
• Vendor-independent replacement possible through standard PA
profiles
• No adaptation of the hardware configuration required
1| Compare preset profile (and TAG) with device
profile
2| Block device and signal error
3| Configure device based on the profile

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Compact Field Unit: Top-Down Engineering

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Compact Field Unit (PA): Bottom-Up Engineering

Application example 2 –
Engineering System (HW config) “Bottom-Up Engineering & Plug-and-Produce”
Automatic device detection and activation
• Configuration of the standard PA profiles (Top-Down Engineering)
➢ Reading back of the devices connected to the CFU (Bottom-Up
Track 2
Engineering) Profile: 2 × Analog input
TAG: TT01_210

Field installation (new device)

• Configuration of the standard PA profiles (Top-Down Engineering)

➢ Reading back of the devices connected to the CFU (Bottom-Up
Engineering) I am
TT01_210 with
2 × AI

Replacing a device: Replacing a PA sensor
• Vendor-independent replacement possible through standard PA
profiles
• No adaptation of the hardware configuration required
1| Automatic device configuration based on the profile
2| Automatic address mapping for PN communication
3| Start communication; transfer configuration in HWC

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 Compact Field Unit: Bottom-Up Engineering

Standard sensor profiles already loaded to matching slot

Select CFU with IP address and PN name

Hardware identification

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Compact Field Unit (PA): Device replacement

Application example 3 –
Engineering System (HW config) “Device replacement”
Guided device replacement
• Configuration of the standard PA profiles (Top-Down Engineering)
• Reading back of the devices connected to the CFU (Bottom-Up
Engineering) Track 1
Profile: 1 × Analog input

Field installation (new device)

• Configuration of the standard PA profiles (Top-Down Engineering)

• Reading back of the devices connected to the CFU (Bottom-Up
Engineering) I support
1 × AI

Replacing a device: Replacing a PA sensor 1| Setting the alarm

2| Check new device based on the profile
➢ Vendor-independent replacement possible through standard PA 3| Configure new device and integrate into
profiles existing address; start communication
➢ No adaptation of the hardware configuration required

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PA-Link

Quantity Description Article number

1x CP 1542-5 6GK7542-5FX00-0XE0

1x Bundle: ET 200M Rack 6ES7654-0XX10-1XA0

1x Power Supply PS 307 6ES7307-1...

1x DP/PA Coupler FDC 157-0 6ES7157-0AC85-0XA0

or: or:
DP/PA Coupler Ex [i] 6ES7157-0AD82-0XA0
Optional AFD4 6ES7157-0AG81-0XA0
or: or:
AFD8 6ES7157-0AG82-0XA0
or: or:
AFDiSD6 6ES7 655-5DX60-1BB0
Optional Bus module pair 6ES7195-7HG80-0XA0
BM DP/PA for inclusion of
two DP/PA-Couplers

Manual: https://support.industry.siemens.com/cs/ww/de/view/1142696
FAQ: https://support.industry.siemens.com/cs/de/de/view/51678187
GSD tool: https://support.industry.siemens.com/cs/de/de/view/26562190

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PA-Link: Integration of PROFIBUS PA sensors

Merge GSD files of the PA sensors using the GSD tool to create
new GSD file

Installation of merged GSD file in hardware

configuration

Assignment of the I/O

addresses

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PA Coupler

Quantity Description Article number

1x CP 1542-5 6GK7542-5FX00-0XE0

1x Mounting rail 6ES7390-1AE80-0AA0

1x Powersupply PS 307 6ES7307-1...

1x DP/PA Coupler FDC 157-0 6ES7157-0AC85-0XA0

or: or:
DP/PA Coupler Ex [i] 6ES7157-0AD82-0XA0
Optional AFD4 6ES7157-0AG81-0XA0
or: or:
AFD8 6ES7157-0AG82-0XA0
or: or:
AFDiSD6 6ES7 655-5DX60-1BB0
Optional Bus modulepair BM DP/PA 6ES7195-7HG80-0XA0
for inclusion of two DP/PA-
Couplers

Manual: https://support.industry.siemens.com/cs/ww/de/view/1142696
FAQ: https://support.industry.siemens.com/cs/de/de/view/51678187

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PA Coupler: Integration PROFIBUS PA Sensoren

Configuring PA devices without

coupler

Adjustment of the I/O addresses

Adjusting the transmission speed:

45.45 kbps

Optional: For diagnostic

purposes, the FDC 157-0 can
also be configured.

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Function overview:
Compact Field Unit, PA-Link und PA-Koppler

6 Compact Field Unit (PA) PA Link PA Coupler

Connection to controller PROFINET PROFIBUS PROFIBUS

(supports: S2, S1, MRP)

Transmission speed to 100 Mbit/s 12 Mbit/s 45,45 kBit/s

controller

Identification of PA devices Yes No No

(„Readback function“)

Addressing of PROFIBUS Automatically Manually Manually

PA devices

Current / voltage monitoring Yes No No

of spur lines

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