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Home > Defining the Via Types for Use with Your Board in Altium Designer
Vias are used to create the vertical, or layer-to-layer connections in a printed circuit board.
In the early days of board fabrication, all of the vias passed all the way through the board, from one side to the other. These thruhole vias are drilled after the layers are
fabricated and the routing etched. The conductive via barrels are formed in the drilled holes using an electro-less plating process, completing the layer-to-layer
connections.
The development of PCB fabrication technology saw the introduction of multilayer boards, and with it, the ability to drill vias between other pairs of layers. By drilling
vias at certain points during the fabrication process, it was possible to create vias that only spanned two adjacent signal layers. These are referred to as blind vias (from
a surface layer to the next layer in) and buried vias (between two internal layers).
Improvements in fabrication techniques and the introduction of laser drilling gave the ability to create very small (<10 mil) vias, formed from a surface layer to the next
signal layer down. These are referred to as µVias. By creating µVias as the layers are built-up during the fabrication process (referred to as sequential lamination, or
sequential build-up), it is now possible to form a stack of µVias that deliver seamless layer-to-layer signal transitions.
Vias placed in the workspace include a Name property, which lists all of the Via Types defined in the Layer Stack Manager. All vias used in the board must be
one of the Via Types defined in the Layer Stack Manager.
Vias that are placed during interactive routing or ActiveRouting have their size properties controlled by the applicable Routing Via Style design rule. To help target vias
in the design rule, there is a set of via-related query keywords that you can use in the rule scope (Where the Object Matches), these are detailed below.
When you perform a layer change as you route, the software looks at the start and stop layers for this layer change, and chooses an allowed Via Type from the Layer
Stack Manager. It then identifies the highest priority applicable Routing Via Style design rule and applies the via size settings from the Constraints section of that rule,
to the via about to be placed.
For example, you might have a set of DRAM_DATA nets that require µVias for the TopLayer - to - S2 layer transition and the S2 - to - S3 layer transition, and a drilled thru
hole via for all other layer transitions (which is also different to the via required by other nets). This can be handled by creating two Routing Via Style design rules to
target these DRAM_DATA nets. An example of a suitable µVia design rule is shown below, hover the cursor over the image to show the thruhole design rule.
Query Keywords
To simplify the process of scoping Routing Via Style design rules, the following via-related query keywords are available:
Use the Mask feature in the Query Helper to find available via-related keywords ( show me ). Press F1 when a query keyword is selected in the list for help
about that keyword.
The available Via Type(s) for the layers being spanned in the layer change.
The applicable Routing Via Style design rule for the Via Type selected for that layer change.
Press the * key on the numeric keypad to step to the next signal layer.
Use the Ctrl+Shift+WheelRoll combination to step up or down through the layers.
processes now allow µVias to be stacked directly on top of each other.
Buried µVias are required to be filled, while blind µVias on the external layers do not require filling. Stacked µVias are usually filled with electroplated copper to make
electrical interconnections between the multiple HDI layers and provide structural support for the outer level(s) of the µVia.
Definition of a µVia
IPC-2226A - Microvia: (build-up via) defined as a blind structure with a maximum aspect ratio of 1:1 when measured in accordance with the image below,
terminating on or penetrating a Target Land, with a total depth (X) of no more than 0.25 mm [9.84 mil], measured from the structure's Capture Land foil to the
Target Land.
The PCB drill table and drill-type output files support µVias.
Drill Table
The drill table identifies each hole by size, if the same size
is used on multiple drill pair layers it is flagged as mixed.
Because µVias use a different hole-creation technique (laser drilled), the hole-detail for µVias is output to a separate drill file for each layer pair being drilled.
NC Drill - a separate file is created for each µVia drill pair.
ODB++ - a separate drill fabrication file created for each µVia drill pair.
Back drilling, which is also known as Controlled Depth Drilling (CDD), is a technique used to remove the unused portion, or stub, of copper barrel from a thru-hole in a
printed circuit board. When a high-speed signal travels between PCB layers through a copper barrel, it can be distorted. If the signal layer usage results in a stub being
present, and the stub is long, then that distortion can become significant.
These stubs can be removed by re-drilling those holes after the fabrication is complete, with a slightly larger drill. The holes are back drilled to a controlled depth, close
to, but not touching, the last layer used by the via. Allowing for fabrication and material variations, a good fabricator can back drill holes to leave a 7 mil stub, ideally the
remaining stub will be less than 10 mil.
By re-drilling the hole with an oversized drill bit to a specific depth the unused portion of the via barrel is removed, improving the integrity of this signal path.
Back Drilling is enabled in the Layer Stack Manager's Tools menu, and then configured in the Back Drills tab of the Layer Stack Manager.
In printed circuit board design, a via stub is a length of copper barrel that projects beyond the signal layers used to route that signal. This unused portion of
copper barrel acts as a stub (a short, unterminated signal pathway), creating reflections if the signal switches at high speeds. These stubs can be removed by
performing a second drill pass, where the barrel is drilled out to an exact depth, as shown above.