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Intel Flash Memory®

Embedded Competitive Product Conversion Guide

Manufacturer Part No. Vcc Vccq Density Bus Width Block Available Package Types Temp (C) Recommended Intel® Grade† Document for
(I/O voltage) Organization Access Time(s) Device for Migration Conversion Information
AMD* AM29LV800B 3V 3V 8Mb x8, x16 Asymmetrical 70ns,90ns, 48-pin TSOP; 48-ball FBGA, -40° to 85° C 28F800C3 B AP-747
AM29LV800D (boot block) 120ns 44-pin SO
Atmel* AT49BV802A 3V 3V 8Mb x8, x16 Asymmetrical 70ns, 90ns 48-pin TSOP, 48-ball CBA -40° to 85° C 28F800C3 B AP-747
(boot block)
Macronix* MX29LV800B 3V 3V 8Mb x8, x16 Asymmetrical 70ns, 90ns 48-pin TSOP, 48-ball CSP, -40° to 85° C 28F800C3 B AP-747
(boot block) 44-pin SOP

8Mbit
Micron* MT28F800B3 3V 3V 8Mb x8, x16 Asymmetrical 90ns 48-pin TSOP -40° to 85° C 28F800C3 B
(boot block)
SST* SST39LF800A, 3V 3V 8Mb x16 Asymmetrical 70ns, 90ns 48-pin TSOP, 48-ball TFBGA -40° to 85° C 28F800C3 B
SST39VF800A (boot block)
STMicro* M29W800D 3V 3V 8Mb x8, x16 Asymmetrical 70ns, 85ns, 48-pin TSOP; 48-ball TFBGA, -40° to 85° C 28F800C3 B AP-747
(boot block) 90ns, 120ns 44-pin SO
STMicro M29W800C 3V 1.8V, 3V 8Mb x16 Asymmetrical 70ns, 85ns, 46-pin TSOP, 48-ball TFBGA -40° to 85° C 28F800C3 A Drop-in capable
(boot block) 90ns, 100ns (See Intel C3 Datasheet)
AMD AM29LV160B 3V 3V 16Mb x8, x16 Asymmetrical 70ns, 80ns, 48-ball FBGA; 48-pin TSOP; -40° to 85°C 28F160C3 B AP-747
(boot block) 90ns, 120ns 44-pin SO -55° to 125°C
AMD AM29LV160M 3V 3V 16Mb x8, x16 Asymmetrical 70ns, 85ns, 48-ball FBGA; 48-pin TSOP; -40° to 85°C 28F160C3 B AP-747
(boot block) 90ns, 100ns 64-ball FBGA

16Mbit
Micron MT28F160C3FD-9 3V 1.8V, 3V 16Mb x16 Asymmetrical 90ns, 110ns 46-ball FBGA -40° to 85°C 28F160C3 A- Drop-in capable
BET/TET (boot block) (See Intel C3 Datasheet)
STMicro M28W160CT/ 3V 3V 16Mb x16 Asymmetrical 70ns, 85ns, 48-pin TSOP; 46-ball TFBGA -40° to 85°C 28F160C3 A- Drop-in capable
M28W160CB (boot block) 90ns, 100ns (See Intel C3 Datasheet)
STMicro M29W160DT/ 3V 3V 16Mb x8, x16 Asymmetrical 70ns, 90ns 48-lead TSOP; 48-ball FBGA -40° to 85°C 28F160C3 B AP-747
M28W160DB (boot block)
AMD AM29LV320MT/B 3V 3V 32Mb x8, x16 Asymmetrical 90ns, 100ns, 48-ball FBGA; 48-pin TSOP; -40° to 85°C 28F320C3 B AP-747
(boot block) 110ns, 120ns 64-ball
AMD AM29LV320D 3V 3V 32Mb x8, x16 Asymmetrical 90ns, 120ns 48-pin TSOP; 48-ball FBGA 0° to 70°C 28F320C3 B AP-747
(boot block) -40° to 85°C
Micron MT28F320J3 3V 3V 32Mb x8, x16 Symmetrical 110ns 56-lead TSOP; -40° to 85°C 28F320J3 A+ Drop-in capable

32Mbit
(uniform block) 64-ball Easy BGA (See Intel J3 Datasheet)
Micron MT28F320J3-M 3V 3V 32Mb x8, x16 Symmetrical 110ns 56-lead TSOP; -40° to 85°C 28F320J3 A Drop-in capable
(uniform block) 64-ball Easy BGA (See Intel J3 Datasheet)
STMicro M29W320DT/ 3V 3V 32Mb x8, x16 Asymmetrical 70ns, 90ns 48-lead TSOP; TFBGA63 -40° to 85°C 28F320C3 B AP-747
M29W320DB (boot block)
STMicro M58LW032D 3V 3V 32Mb x8, x16 Symmetrical 90ns, 110ns 56-lead TSOP; 64-ball TBGA 0 to 70°C 28F320J3 A+ Drop-in capable
(uniform block) -40° to 85°C (See Intel J3 Datasheet)
AMD Am29LV640D/ 3V 1.8V, 3V 64Mb x16 Symmetrical 90ns, 120ns 48-lead TSOP; 63-ball FBGA; -40° to 85°C 28F640J3 C AP-797
Am29LV641D (uniform block) 56-lead TSOP
AMD AM29LV065D 3V 1.8V, 3V 64Mb x16 Symmetrical 90ns, 100ns, 48-lead TSOP; 63-ball FBGA -40° to 85°C 28F640J3 C AP-797
(uniform block) 120ns -55° to 125°C
AMD AM29LV640MU 3V 1.8V, 3V 64Mb x8, x16 Symmetrical 90ns, 100ns, 56-lead TSOP; -40° to 85°C 28F640J3 C AP-797

64Mbit
(uniform block) 110ns, 120ns 64-ball fortified
Micron M28F640J3 3V 3V 64Mb x8, x16 Symmetrical 115ns, 120ns 56-lead TSOP; -40° to 85°C 28F640J3 A+ Drop-in capable
(uniform block) 64-ball Easy BGA (See Intel J3 Datasheet)
Micron MT28F640J3 3V 3V 64Mb x8, x16 Symmetrical 115ns 56-lead TSOP, 64-ball FBGA -40° to 85°C 28F640P30 C AP-812
(uniform block)
Micron MT28F640J3-M 3V 3V 64Mb x8, x16 Symmetrical 115ns, 120ns 56-lead TSOP; -40° to 85°C 28F640J3 A Drop-in capable
(uniform block) 64-ball Easy BGA (See Intel J3 Datasheet)

†
See back for Conversion Grade Legend (continued on back)
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Vccq Recommended Intel®

Manufacturer Part No. Vcc (I/O voltage) Density Bus Width Block Organization Available Access Time(s) Package Types Temp (C) Device for Migration Grade† Document for Conversion Information
STMicro M29W640DT/ 3V 3V 64Mb x8, x16 Asymmetrical (boot block) 70ns, 90ns 48-lead TSOP; TFBGA63 -40° to 85C 28F640J3 C AP-797
M29W640DB

64Mbit (cont.)
STMicro M29W641DH/ 3V 1.8V, 3V 64Mb x8, x16 Symmetrical (uniform block) 70ns, 90ns 48-lead TSOP; TFBGA63 -40° to 85°C 28F640J3 or above C AP-797
M29W641DL/
M29W641DU
STMicro M58LW064D 3V 3V 64Mb x8, x16 Symmetrical (uniform block) 110ns 56-lead TSOP, 64-ball TBGA -40° to 85°C 28F640P30 C AP-812
STMicro M58LW064D 3V 3V 64Mb x8, x16 Symmetrical (uniform block) 110ns 56-lead TSOP; 64TBGA 0° to 70°C 28F640J3 A+ Drop-in capable
-40° to 85°C (See Intel J3 Datasheet)
AMD AM29LV128M 3V 1.8V, 3V 128Mb x8, x16 Symmetrical (uniform block) 90ns, 100ns, 110ns, 120ns 56-lead TSOP; 64-ball FBGA -40° to 85°C 28F128J3 C AP-797
AMD S29GL128N 3V 1.8V, 3V 128Mb x8, x16 Symmetrical (uniform block) 80ns 56-lead TSOP, 64-ball FBGA -40° to 85°C 28F128P30 C AP-813
Micron MT28F128J3 3V 3V 128Mb x8, x16 Symmetrical (uniform block) 120ns, 150ns 56-lead TSOP; 64-ball FBGA -40° to 85°C 28F128J3 A+ Drop-in capable (See Intel J3 Datasheet)

128Mbit
Micron MT28F128J3 3V 3V 128Mb x8, x16 Symmetrical (uniform block) 120ns 56-lead TSOP, 64-ball FBGA -40° to 85°C 28F128P30 C AP-812
Micron MT28F128J3-M 3V 3V 128Mb x8, x16 Symmetrical (uniform block) 120ns, 150ns 56-lead TSOP; 64-ball FBGA -40° to 85°C 28F128J3 A Drop-in capable (See Intel J3 Datasheet)
STMicro M30LOR7000x0 1.8V 1.8V 128Mb x16 Asymmetrical (boot block) 85ns TFBGA88 -25° to 85°C 48F3000P0 A- Drop-in capable (See Intel P30 Datasheet)
STMicro M58LW128D 3V 3V 128Mb x8, x16 Symmetrical (uniform block) 110ns 56-lead TSOP, 64-ball TBGA -40° to 85°C 28F128P30 C AP-812
STMicro M58LW128H 3V 1.8V - 3V 128Mb x16 Symmetrical (uniform block) 115ns 56-ball VF BGA, 64-ball TBGA -40° to 85°C 28F128P30 A- AP-825
AMD AM29LV256M 3V 1.8V, 3V 256Mb x8, x16 Symmetrical (uniform block) 100ns 56-lead TSOP; 64-ball FBGA -40° to 85°C 28F256J3 C AP-797

256Mbit
AMD S29GL256N 3V 1.8V, 3V 256Mb x8, x16 Symmetrical (uniform block) 80ns 56-lead TSOP, 64-ball FBGA -40° to 85°C 28F256P30 C AP-813
STMicro M30LOR8000x0 1.8V 1.8V 256Mb x16 Asymmetrical (boot block) 85ns TFBGA88 -25° to 85°C 48F4000P0 A- Drop-in capable (See Intel P30 Datasheet)

Mbit
AMD S29GL512N 3V 1.8V, 3V 512Mb x8, x16 Symmetrical (uniform block) 90ns 56-lead TSOP, 64-ball FBGA -40° to 85°C 48F4400P0 C AP-813

512
AMD AM29DL Family 3V 3V 4, 16, 32, x8, x16 Asymmetrical (boot block) 70ns 48TSOP, 63FBGA, 48FBGA, -40° to 85°C GE28F320/640 C AP-797

WHILE WRITE
BURST/READ
64 Mb 64FBGA W18/W30
STMicro M58WR032/ 1.8V 1.8V, 3V 32Mb, x16 Asymmetrical (boot block) 70ns, 80ns 56-ball VFBGA -40° to 85°C GE28F320W18/W30/ A- Drop-in Capable (See W18/W30 Datasheet)
M58WR064 ET/EB 64Mb GE28F640W18/W30
Micron MT28FxxxW18/ 1.8V 1.8V, 3V 64Mb, x16 Asymmetrical (boot block) 60ns (1.8V), 70ns (3.0V) 56-ball VFBGA -40° to 85°C GE28F640W18/W30/ A Drop-in Capable (See W18/W30 Datasheet)
MT28FxxxW30 BET/TET 128Mb GE28F128W18/W30

†Conversion Grade Legend (Grades refer to ease of conversion from a competitve product to an Intel® Flash device only and are in no way intended as marks on quality or other features of these products.)
A+ Drop in compatible, no software or hardware changes required A- Minimal software changes, no hardware changes C Extensive software changes required. Board layout will need to change to accompany
A Drop in compatible, manufacturer id change required B Minimal software changes, several pin differences between devices (approximately 4–5) different package profile (e.g., Going from a 48-lead TSOP to a 56-lead TSOP)

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