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Mini-flat Package,
PC357N Series General Purpose Photocoupler
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A00101EN
1 Date Sep. 30. 2003
© SHARP Corporation
PC357N Series
3.6±0.3
2.54±0.25
4 3
Date code
SHARP mark
"S"
4.4±0.2
Anode mark
357
Rank mark
Factory identification mark
1 2
±0.1
0.4
5.3±0.3
Epoxy resin
45˚
0.2±0.05
2.6±0.2
0.1±0.1
6˚ 0.5+0.4
−0.2
7.0+0.2
−0.7
2
PC357N Series
Indonesia
Philippines
China
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see
the actual status of the production
Rank mark
Refer to the Model Line-up table
3
PC357N Series
4
PC357N Series
■ Model Line-up
Taping IC [mA]
Package Rank mark
3 000pcs/reel 750pcs/reel (IF=5mA, VCE=5V, Ta=25˚C)
PC357N PC357NT with or without 2.5 to 30.0
PC357N1 PC357N1T A 4.0 to 8.0
PC357N2 PC357N2T B 6.5 to 13.0
PC357N3 PC357N3T C 10.0 to 20.0
PC357N4 PC357N4T D 15.0 to 30.0
Model No.
PC357N5 PC357N5T A or B 4.0 to 13.0
PC357N6 PC357N6T B or C 6.5 to 20.0
PC357N7 PC357N7T C or D 10.0 to 30.0
PC357N8 PC357N8T A, B or C 4.0 to 20.0
PC357N9 PC357N9T B, C or D 6.5 to 30.0
PC357N0 PC357N0T A, B, C or D 4.0 to 30.0
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.
5
PC357N Series
Fig.1 Forward Current vs. Ambient Fig.2 Diode Power Dissipation vs. Ambient
Temperature Temperature
70
60 100
50
80
70
40
60
30
40
20
20
10
0 0
−30 0 25 50 75 100 125 −30 0 50 55 100
Ambient temperature Ta(˚C) Ambient temperature Ta (˚C)
Fig.3 Collector Power Dissipation vs. Fig.4 Total Power Dissipation vs. Ambient
Ambient Temperature Temperature
200 300
Collector power dissipation PC (mW)
170
100 150
100
50
50
0 0
−30 0 25 50 75 100 125 −30 0 25 50 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Forward Current vs. Forward Voltage
10 000
Pulse width≤100µs 500
5 000 Ta=75˚C
Ta=25˚C
200
50˚C
Peak forward current IFM (mA)
2 000 25˚C
100
Forward current IF (mA)
0˚C
1 000
50 −25˚C
500
20
200
100 10
50 5
20 2
10 1
5
5 10− 3 2 5 10− 2 2 5 10− 1 2 5 1 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Duty ratio Forward voltage VF (V)
6
PC357N Series
Fig.7 Current Transfer Ratio vs. Forward Fig.8 Collector Current vs. Collector-emitter
Current Voltage
500 50
VCE=5V Ta=25˚C
Ta=25˚C
400 40
Current transfer ratio CTR (%)
IF=30mA
mA
PC(MAX.)
300 30
20
mA
10
200 20
5mA
100 10
0 0
0.1 1 10 100 0 2 4 6 8 10
Forward current IF (mA) Collector-emitter voltage VCE (V)
Fig.9 Relative Current Transfer Ratio vs. Fig.10 Collector - emitter Saturation Voltage
Ambient Temperature vs. Ambient Temperature
150 0.16
IF=5mA
VCE=5V IF=20mA
0.14
IC=1mA
Collector-emitter saturation voltage
Relative current transfer ratio(%)
0.12
100
0.10
VCE (sat) (V)
0.08
0.06
50
0.04
0.02
0 0
−30 0 20 40 60 80 100 −30 0 20 40 60 80 100
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Fig.11 Collector Dark Current vs. Ambient Fig.12 Response Time vs. Load Resistance
Temperature
10−5 500
5 VCE=2V
VCE=50V
200 IC=2mA
10−6 Ta=25˚C
100
Collector dark current ICEO (A)
5
50 tr
−7
10
Response time (µs)
tf
5 20
10
10−8
5 5
2 td
10−9 ts
5 1
10−10 0.5
5
0.2
10−11 0.1
−30 0 20 40 60 80 100 0.01 0.1 1 10 50
Ambient temperature Ta (˚C) Load resistance RL (kΩ)
Fig.13 Test Circuit for Response Time Fig.14 Collector-emitter Saturation Voltage
vs. Forward Current
8
VCC
Ta=25˚C
Input 7
2
Please refer to the conditions in Fig.12
1
0
0 3 6 9 12 15
Forward current IF (mA)
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
PC357N Series
■ Design Considerations
● Design guide
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)
into the design consideration.
6.3
2.54
0.8
1.5
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
PC357N Series
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
200
Reflow
220˚C or more, 60s or less
Preheat
100
150 to 180˚C, 120s or less
0
0 1 2 3 4 (min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
PC357N Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
11
PC357N Series
■ Package specification
● Tape and Reel package
1. 3 000pcs/reel
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F E D G J
I
C
B
A
H
H
.
MAX
K
5˚
Dimensions List (Unit : mm)
A B C D E F G
12.0 ±0.3 5.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 φ1.5−0
+0.1
H I J K
7.4 ±0.1 0.3±0.05 3.1±0.1 4.0±0.1
e d
g
c
Pull-out direction
[Packing : 3 000pcs/reel]
12
PC357N Series
2. 750pcs/reel
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F E D G J
I
C
B
A
H
H
.
MAX
5˚
K
Dimensions List (Unit : mm)
A B C D E F G
12.0±0.3 5.5±0.1 1.75±0.1 8.0±0.1 2.0±0.1 4.0±0.1 φ1.5−0
+0.1
H I J K
7.4 ±0.1 0.3±0.05 3.1±0.1 4.0±0.1
e d
g
c
Pull-out direction
[Packing : 750pcs/reel]
13
PC357N Series
■ Important Notices
· The circuit application examples in this publication are with equipment that requires higher reliability such as:
provided to explain representative applications of --- Transportation control and safety equipment (i.e.,
SHARP devices and are not intended to guarantee any aircraft, trains, automobiles, etc.)
circuit design or license any intellectual property rights. --- Traffic signals
SHARP takes no responsibility for any problems rela- --- Gas leakage sensor breakers
ted to any intellectual property right of a third party re- --- Alarm equipment
sulting from the use of SHARP's devices. --- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
· Contact SHARP in order to obtain the latest device tion with equipment that requires an extremely high lev-
specification sheets before using any SHARP device. el of reliability and safety such as:
SHARP reserves the right to make changes in the spec- --- Space applications
ifications, characteristics, data, materials, structure, --- Telecommunication equipment [trunk lines]
and other contents described herein at any time without --- Nuclear power control equipment
notice in order to improve design or reliability. Manufac- --- Medical and other life support equipment (e.g.,
turing locations are also subject to change without no- scuba).
tice.
· If the SHARP devices listed in this publication fall with-
· Observe the following points when using any devices in the scope of strategic products described in the For-
in this publication. SHARP takes no responsibility for eign Exchange and Foreign Trade Law of Japan, it is
damage caused by improper use of the devices which necessary to obtain approval to export such SHARP de-
does not meet the conditions and absolute maximum vices.
ratings to be used specified in the relevant specification
sheet nor meet the following conditions: · This publication is the proprietary product of SHARP
(i) The devices in this publication are designed for use and is copyrighted, with all rights reserved. Under the
in general electronic equipment designs such as: copyright laws, no part of this publication may be repro-
--- Personal computers duced or transmitted in any form or by any means, elec-
--- Office automation equipment tronic or mechanical, for any purpose, in whole or in
--- Telecommunication equipment [terminal] part, without the express written permission of SHARP.
--- Test and measurement equipment Express written permission is also required before any
--- Industrial control use of this publication may be made by a third party.
--- Audio visual equipment
--- Consumer electronics · Contact and consult with a SHARP representative if
(ii) Measures such as fail-safe function and redundant there are any questions about the contents of this pub-
design should be taken to ensure reliability and safety lication.
when SHARP devices are used for or in connection
14