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SPECIFICATION
HPG8-48KBIx
RoHS
Conformity
DATE:2013/3/5 REV:A
HUEY JANN High Power 1W LED is made of hi-eff AS/TS GaInN chips with
precise package technique which makes excellent heat dissipation to reach the
advantages of high luminous efficiency, low decay, and long endurance. Now
we have these colors available: red, green, blue, white, yellow and infrared.
2FEATERUS
Ø Instant light
Ø Long operating life
Ø Superior ESD defense
Ø Low voltage DC operated
Ø More energy efficient than incandescent and most halogen lamps
2TYPICAL APPLICATIONS
Ø Architectural detail lighting
Ø Portable flashlight
Ø Medical applications
Ø Beacon lights
Ø Decoration lights
Ø Spotlight
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2DEVICE NO:HPG8-48KBIx
2PACKAGE DIMENSIONS:
Emitter Type
6.4
7.9
2.3
1.5
0.3
2.8
0.8
Slug 7.25
14.5
Star Type
LED Dice
Cathode Mark
3.2
7.25
- +
-
6.4
7.4
0.3
2.8
+ 1.6
- +
20.0 ± 0.3
NOTE:
1.All dimensions are in millimeter.
2.Lead spacing in measured where the lead emerge from the package.
3.prodruded resin under flange is 1.5mm max.
4.specifications are subject to change without notice.
5.Tolerance is +/-0.3mm unless otherwise noted.
6.Driving LED without heat sinking device is forbidden.
o
7.It is strongly recommended that the temperature of lead be not higher than 55 C.
8.Proper current derating must be observed to maintain junction temperature below the maximum.
9.LEDs are not designed to be driven in reserve bias.
2
2DEVICE NO:HPG8-48KBIx
2DEVICES
HPG8-48KBI
Water Clear GaInN/GaN Blue
HPG8-48KBI/WPCB
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2DEVICE NO:HPG8-48KBIx
2ELECTRIC-OPTICAL CHARACTERISTICS
TA=25°C
TEST
PARAMETER SYMBOL TYP MAX UNIT
CONDITION
Luminous Intensity IV 38 lm
4
2DEVICE NO:HPG8-48KBIx
2RELIABILITY TEST
Ø Endurance Test
*Failure Criteria:
1. VF arise ≧10%
2. IV decline ≧30%
3. A failure is an LED that is open or shorted
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2DEVICE NO:HPG8-48KBIx
2RELIABILITY TEST
Ø Environmental Test
*Failure Criteria:
1. VF arise ≧10%
2. IV decline ≧30%
3. A failure is an LED that is open or shorted
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2DEVICE NO:HPG8-48KBIx
500 400
FORWARD CURRENT (mA)
300
200 RθJ-A=60 oC/W
o
200 RθJ-A=50 C/W
o
RθJ-A=40 C/W
o
100 RθJ-A=30 C/W
100
0 0
2.6 2.8 3.0 3.2 3.4 3.6 20 40 60 80 100 120 140 160
O
FORWARD VOLTAGE (V) AMBIENT TEMPERATURE( C)
1.2 1.4
1.2
Relative luminousity
1.0
Relative luminousity
1.0
0.8
0.8
0.6
0.6
0.4
0.4
0.2 0.2
0 0
0 100 200 300 400 500 -20 0 20 40 60 80 100 120
Forward current (mA) Ambient temperature( O C)
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2DEVICE NO:HPG8-48KBIx
O
Ta=25 C 0 10 20
1.2
RELATIVE RADIANT INTENSITY
30
1.0
0.8 40
0.6
1.0 50
0.4 60
70
0.2 0.8
80
90
0
400 450 500 0.5 0.2
1/2 POWER
WAVELENGTH (nm) O
VIEW ANGLE Ta=25 C
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2DEVICE NO:HPG8-48KBIx
Forward Voltage
BIN CODE
Minimum Maximum
i 2.8 3.0
j 3.0 3.2
k 3.2 3.4
NOTE:
1. Test Condition at IF=350mA.
Brightness in lm
BIN CODE
Minimum Maximum
G 29 38
H 38 50
NOTE:
1. Test Condition at IF=350mA.
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2DEVICE NO:HPG8-48KBIx
420
18
10
NOTE:
1. Dimensions are specified as follows: mm.
2. Tolerance is +/-0.3mm unless otherwise noted.
3. 50 pcs emitters per tube.
4. 80 tubes per inside box.
5. 4 inside box per outside box.
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2DEVICE NO:HPG8-48KBIx
300
26
110
310
315
9 30
16.5
NOTE:
1. Dimensions are specified as follows: mm.
2. Tolerance is +/-0.3mm unless otherwise noted.
3. 100pcs star per tray.
4. 10 trays per box.
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2DEVICE NO:HPG8-48KBIx
Slug Independent
ψ6.8
Solder Pad
2.5
Solder Mark
3.3
Note: 9.0
15.6
1.All dimensions are in millimeters.
2.Electrical isolation is required between Slug and Solder Pad.
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2DEVICE NO:HPG8-48KBIx
Heat Plate
PCB
Use Solder Mask to print Solder Place Emitter on PCB. Put PCB on Heat Plate until
Solder Wire
PCB
Heat Plate Heat Plate Heat Plate
Put PCB on Heat Plate. Place Solder Wire to the solder Put Emitter on PCB. Take the
10 seconds.
NOTE:
o o
1.Heat plate temperature: 230 C max for Lead Solder and 260 C max for Lead-Free Solder.
2.When soldering, do not put stress on the LEDs during heating.
3.After soldering, do not warp the circuit board.
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2DEVICE NO:HPG8-48KBIx
Hot Bar
PCB
Thermal Conductive Glue Put Emitter on the PCB. Hot Bar soldering of High
NOTE:
o o
1.Hot Bar temperature: 230 C max for Lead Solder and 260 C max for Lead-Free Solder.
2.When soldering, do not put stress on the LEDs during heating.
3.After soldering, do not warp the circuit board.
PCB
Soldering Lron
Place Thermal Conductive Glue Place Emitter on the PCB. Use Soldering Iron to solder the leads
o o
1.Solder tip temperature: 230 C max for Lead Solder and 260 C max for Lead-Free Solder.
2.Avoiding damage to the emitter or to the PCB dielectric layer. Damage to the epoxy layer can cause
3.Do not let the solder contact from solder pad to back-side of PCB. This one will cause a short circuit and
damage emitter.
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2DEVICE NO:HPG8-48KBIx
2 Conclusion
Huey Jann provide simple comparison table for High Power LED, you could find your
request heat dissipation area from the following table.
Flat Heat Dissipation-Set-up Vertical Flat Heat Dissipation-Set-up Finned Heat Dissipation-Set-up
2 2 2
( Area Require mm ) ( Area Require mm ) ( Area Require mm )
*Different materials of second heat dissipation device, the surface area of heat sink will be different. Thus, this document
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2DEVICE NO:HPG8-48KBIx
Tboard Tboard
second heat dissipation apparatus second heat dissipation apparatus
60000
50000
Life (hrs)-Light Hold Out 70%
40000
30000
20000
10000
0
40 60 80 100 120
o
Board Ambient Temperature ( C )
o
*Board Ambient Temperature Tolerance +/-5 C.
o
*TAB in this table is according to highest operating temperature 65 C.
*The TAB is the stable testing value for the product lighted 100% after one hour.
*Different materials of second heat dissipation device, the surface area of heat sink will be different. Thus, this
document is for reference only.
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2DEVICE NO:HPG8-48KBIx
2 Remarks:
1. Brightness values are measured during a current pulse of typical 25 ms, the
brightness tolerance is +/-15%.
2. Dominant wavelength are measured during a current pulse of typical 200 ms, the
chromaticity tolerance is +/-1.0nm.
3. Forward voltage are measured during a current pulse of typical 5 ms, the VF
tolerance is +/-0.15V.
5. Related technical parameters of LED are average value resulted from statistic. The
actual parameters of LED could be slightly different from average and characteristic
curve.
6. The average value of LED will be changed by technical improvement and elevation,
and subject to change without prior notice.
7. Hi-Power LED can not be operated without second heat dissipating structure.
8. Poor or damaged second heat dissipating structure could lead to defective electrical
characteristic of High Power LED, CCT(Wavelength) escalation, brightness drop,
lifetime shortening or burn out. Following instructions of Huey Jann Hi-Power LED
series document can avoid LED burn out and electrical defectiveness due to
improper usage, and maintain normal performance of the products.
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