3W Hi-Power Led Specification: HPA8b-44K3Yx

3W HI-POWER LED
SPECIFICATION
HPA8b-44K3Yx
Drawn by Checked by Approved by
Ro H S
Co n f o r m i ty
DATE:2013/4/12 REV:A
HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

No.27 Line 466 Sec.2,Canng-nan Rd. Wu-chi Town Taichung Shien, Taiwan, R.O.C.
TEL:+886-4-26393976 FAX:+886-4-26393125
2DEVICE NO:HPA8b-44K3Yx
HUEY JANN High Power 3W LED is made of hi-eff AS/TS AlInGaP and
GaInN chips with precise package technique which makes excellent heat
dissipation to reach the advantages of high luminous efficiency, low decay, and
long endurance. Now we have these colors available: red, green, blue, white,
yellow and infrared.
2FEATERUS
Ø Instant light
Ø Long operating life
Ø Superior ESD defense
Ø Low voltage DC operated
Ø More energy efficient than incandescent and most halogen lamps
2TYPICAL APPLICATIONS
Ø Architectural detail lighting
Ø Portable flashlight
Ø Reading lights
Ø Medical applications
Ø LCD backlights
Ø Beacon lights
Ø Decoration lights

TEL:+886-4-26393976 FAX:+886-4-26393125
1
2PACKAGE DIMENSIONS:
Emitter Type
LED Dice 2.0
Cathode Mark
1.2
6.4
7.9
2.3
1.5
0.3
2.8
0.8
Slug 7.25
14.5
Slug
- +
Star Type
LED Dice
Cathode Mark
3.2
7.25
- +
-
6.4
7.4
0.3
2.8
+ 1.6
- +
20.0 ± 0.3
NOTE:
1.All dimensions are in millimeter.
2.Lead spacing in measured where the lead emerge from the package.
3.prodruded resin under flange is 1.5mm max.
4.specifications are subject to change without notice.
5.Tolerance is +/-0.3mm unless otherwise noted.
6.Driving LED without heat sinking device is forbidden.
o
7.It is strongly recommended that the temperature of lead be not higher than 55 C.
8.Proper current derating must be observed to maintain junction temperature below the maximum.
9.LEDs are not designed to be driven in reserve bias.

TEL:+886-4-26393976 FAX:+886-4-26393125
2
2ABSOLUTE MAXIMUM RATINGS

TA=25°C
PARAMETER SYMBOL MAX. RATING UNIT
Continuous Forward Current IF 700 mA
Peak Forward Current *1 IFM 1000 mA
Electrostatic Discharge (HBM) ESD 4000 V
LED Junction Temperature Tj 125 °C
Operating Temperature Topr -40 ~ +110 °C
Storage Temperature Tstg -40 ~ +120 °C
Reflow Soldering (preheat 150-180°C 60-120sec, soldering temp 260°C 10sec)
*1.Duty Ratio=0.1%,Pulse Width=10us.

*2.Iron soldering high temperature will not cause damage to the dice. But be aware of the high temperature
will not only make the epoxy soften but also cause the lead moving and the gold wire broken and even open.
So before returning to the normal temperatures PLEASE AVOID any serious pressure on the top of epoxy
and lead.

TEL:+886-4-26393976 FAX:+886-4-26393125
3
2ELECTRIC-OPTICAL CHARACTERISTICS
o
TA=25 C
TEST
PARAMETER SYMBOL MIN TYP MAX UNIT
CONDITION
View Angle of Half Power 2q1/2 35 deg

IF=700mA
Forward Voltage VF 2.3 2.8 V
Reverse Current IR VR=5V 15 μA
Luminous Intensity IV 80 lm
Peak Emission Wavelength λp 595 nm
Dominate Wave Length * λd(HUE) 590 nm
Spectrum Width Of Half Valve △λ 25 nm

IF=700mA
o
Thermal Resistance Junction To Case RθJ-C 13 C/W
Thermal Resistance Junction To Case With o

RθJ-C 17 C/W
Star Type Heat Sink
o
mV/
Temperature Coefficient Of Forward Voltage △VF/△T -2
C
*.The dominate wavelength ,λd, is derived from the CIE Chromaticity Diagram and represents the color of
the device.

TEL:+886-4-26393976 FAX:+886-4-26393125
4
2RELIABILITY TEST
Ø Endurance Test
Test Item Reference Standard Test Conditions Result
MIL-STD-750:1026 Connect with a power if=700mA
Operation Life MIL-STD-883:1005 Ta=Under room temperature 0/22
JIS-C-7021 :B-1 Test Time=1,000hrs
High
Ta=+85℃+/-5℃
Temperature MIL-STD-202:103B
RH=80% ~ 85% 0/22
High Humidity JIS-C-7021 :B-11
Test Time=1,000hrs
Storage
High
MIL-STD-883:1008 High Ta=+120℃+/-5℃
Temperature 0/22
JIS-C-7021 :B-10 Test Time=1,000hrs
Storage
Low
Low Ta=-40℃+/-5℃
Temperature JIS-C-7021 :B-12 0/22
Test Time=1,000hrs
Storage
*Failure Criteria:
1. VF arise ≧10%
2. IV decline ≧30%
3. A failure is an LED that is open or shorted

TEL:+886-4-26393976 FAX:+886-4-26393125
5
2RELIABILITY TEST
Ø Environmental Test
Test Item Reference Standard Test Conditions Result
MIL-STD-202:107D
-40℃ ~ +25℃ ~ +85℃ ~ +25℃
Temperature MIL-STD-750:1051
60min 20min 60min 20min 0/22
Cycling MIL-STD-883:1010
Test Time=200cycle
JIS-C-7021 :A-4
MIL-STD-202:107D -40℃+/-5℃ ~ +110℃+/-5℃
Thermal
MIL-STD-750:1051 20min 20min 0/22
Shock
MIL-STD-883:1010 Test Time=200cycle
*Failure Criteria:
1. VF arise ≧10%
2. IV decline ≧30%
3. A failure is an LED that is open or shorted

TEL:+886-4-26393976 FAX:+886-4-26393125
6
2TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES
1000 800
FORWARD CURRENT (mA)
FORWARD CURRENT (mA)

800
600
600
400 RθJ-A=60 oC/W
o
400 RθJ-A=50 C/W
o
RθJ-A=40 C/W
o
200 RθJ-A=30 C/W
200
0 0
1.0 2.0 3.0 4.0 5.0 6.0 20 40 60 80 100 120 140 160
O
FORWARD VOLTAGE (V) AMBIENT TEMPERATURE( C)
1.2 1.4
1.2
Relative luminousity
1.0
Relative luminousity
1.0
0.8
0.8
0.6
0.6
0.4
0.4
0.2 0.2
0 0
0 200 400 600 800 1000 -20 0 20 40 60 80 100 120
Forward current (mA) Ambient temperature( O C)

TEL:+886-4-26393976 FAX:+886-4-26393125
7
2TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES
O
Ta=25 C
0.03 0.008
0.006
0.02
Chromaticity Coordinate
Chromaticity Coordinate
0.004
Cy 0.002
0.01
0
Cx
0 -0.002
-0.004
-0.01
-0.006
-0.008
-0.02
-0.010
-0.03 -0.012
0 300 600 900 1200 1500 -40 -20 0 20 40 60 80 100
o
Forward Current Ambient Temperature( C)
O
Ta=25 C 0 10 20
1.2
RELATIVE RADIANT INTENSITY
30
1.0
0.8
40
0.6
1.0 50
0.4 60
70
0.2 0.8
80
0 90
540 590 640 0.5 0.2
1/2 POWER
WAVELENGTH (nm)
O
VIEW ANGLE Ta=25 C

TEL:+886-4-26393976 FAX:+886-4-26393125
8
2 Brightness Bin Selection

IF=700mA
Brightness in lm
BIN CODE
Minimum Maximum
K 65 85
L 85 110

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9
2 Color Bin Selection

IF=700mA
Dominate Wavelength
Bin Code
Minimum Maximum
4 589.5 592.0
5 592.0 594.5
6 594.5 597.0

TEL:+886-4-26393976 FAX:+886-4-26393125
10
2 Package Dimension For Emitter Type
420
18
10
NOTE:
1. Dimensions are specified as follows: mm.
2. Tolerance is +/-0.3mm unless otherwise noted.
3. 50 pcs emitters per tube.
4. 80 tubes per inside box.
5. 4 inside box per outside box.

TEL:+886-4-26393976 FAX:+886-4-26393125
11
2 Package Dimension For Star Type
300
26
110
310
315
9 30
16.5
NOTE:
2. Tolerance is +/-0.3mm unless otherwise noted.
3. 100pcs star per tray.
4. 10 trays per box.

TEL:+886-4-26393976 FAX:+886-4-26393125
12
2 Requirements to user For Emitter Type

The LED products by HUEY-JANN is designed, manufactured, and sold aiming at high standard quality
and reliability, however, reliability of electronic apparatus is seen as a product of reliability superior to
HUEY-JANN and using status at users. From this point, HUEY-JANN requests user’s for following things.
2 Recommended Solder Pad Design For Emitter Type
Slug Independent
ψ6.8
Solder Pad
2.5
Solder Mark
3.0
9.0
Note: 15.6
1.All dimensions are in millimeters.

2.Electrical isolation is required between Slug and Solder Pad.

TEL:+886-4-26393976 FAX:+886-4-26393125
13
2 Heat Plate Soldering Condition For Emitter Type
a. Soldering Process for Solder Paste
solder paste Heat conduction rubber
Heat Plate
PCB
Use Solder Mask to print Solder Place Emitter on PCB. Put PCB on Heat Plate until
Paste on PCB. Solder Paste melt.
1.The Solder Paste sould be melted within 10 seconds.

2.Take out PCB out from Heat Plate within 15 seconds.
b. Soldering Process for Solder Wire
Solder Wire
PCB
Heat Plate Heat Plate Heat Plate
Put PCB on Heat Plate. Place Solder Wire to the solder Put Emitter on PCB. Take the
pad of PCB. PCB out from Heat Plate within
10 seconds.
NOTE:
o o
1.Heat plate temperature: 230 C max for Lead Solder and 260 C max for Lead-Free Solder.
2.When soldering, do not put stress on the LEDs during heating.
3.After soldering, do not warp the circuit board.

TEL:+886-4-26393976 FAX:+886-4-26393125
14
2 Soldering Process For Hot Bar For Emitter Type
Hot Bar
PCB
Thermal Conductive Glue Put Emitter on the PCB. Hot Bar soldering of High
Dispensing Power Emitter
NOTE:
o o
1.Hot Bar temperature: 230 C max for Lead Solder and 260 C max for Lead-Free Solder.
2.When soldering, do not put stress on the LEDs during heating.
3.After soldering, do not warp the circuit board.
2 Manual Hand Soldering For Emitter Type
Thermal Conductive Glue
PCB
Heat conduction rubber

solder paste Solder Wire
Soldering Lron
Place Thermal Conductive Glue Place Emitter on the PCB. Use Soldering Iron to solder the leads
on the PCB. of Emitter within 5 seconds.
1.Solder tip temperature: 230°C max for Lead Solder and 260°C max for Lead-Free Solder.
2.Avoiding damage to the emitter or to the PCB dielectric layer. Damage to the epoxy layer can cause
3.Do not let the solder contact from solder pad to back-side of PCB. This one will cause a short circuit and
damage emitter.

TEL:+886-4-26393976 FAX:+886-4-26393125
15
2 Conclusion
Huey Jann provide simple comparison table for High Power LED, you could find your
request heat dissipation area from the following table.
Free Convection Horizontal Free Convection Free Convection

Flat Heat Dissipation-Set-up Vertical Flat Heat Dissipation-Set-up Finned Heat Dissipation-Set-up
2 2 2
( Area Require mm ) ( Area Require mm ) ( Area Require mm )
3,300 2,700 4,500

o
*TAB in this table is according to highest operating temperature 65 C.
*Different materials of second heat dissipation device, the surface area of heat sink will be different. Thus, this document
is for reference only.

TEL:+886-4-26393976 FAX:+886-4-26393125
16
2 TAB Temperature - Life Characteristics Curves
High Power LED
TAB(Board Ambient Temperature )
Tboard Tboard
second heat dissipation apparatus second heat dissipation apparatus
Star Type Emitter Type
60000
50000
Life (hrs)-Light Hold Out 70%
40000
30000
20000
10000
0
40 60 80 100 120
o
Board Ambient Temperature ( C )
o
*Board Ambient Temperature Tolerance +/-5 C.
o
*TAB in this table is according to highest operating temperature 65 C.
*The TAB is the stable testing value for the product lighted 100% after one hour.
*Different materials of second heat dissipation device, the surface area of heat sink will be different. Thus, this
document is for reference only.

TEL:+886-4-26393976 FAX:+886-4-26393125
17
2 Remarks:
1. Brightness values are measured during a current pulse of typical 25 ms, the
brightness tolerance is +/-15%.
2. Dominant wavelength are measured during a current pulse of typical 200 ms, the
chromaticity tolerance is +/-1.0nm.
3. Forward voltage are measured during a current pulse of typical 5 ms, the VF tolerance
is +/-0.15V.
5. Related technical parameters of LED are average value resulted from statistic. The
actual parameters of LED could be slightly different from average and characteristic
curve.
6. The average value of LED will be changed by technical improvement and elevation,
and subject to change without prior notice.
7. Hi-Power LED can not be operated without second heat dissipating structure.
8. Poor or damaged second heat dissipating structure could lead to defective electrical
characteristic of High Power LED, CCT escalation, brightness drop, lifetime
shortening or burn out. Following instructions of Huey Jann Hi-Power LED series
document can avoid LED burn out and electrical defectiveness due to improper usage,
and maintain normal performance of the products.

TEL:+886-4-26393976 FAX:+886-4-26393125
18

3W Hi-Power Led Specification: HPA8b-44K3Yx

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3W HI-POWER LED

Drawn by Checked by Approved by

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL MAX. RATING UNIT

Continuous Forward Current IF 700 mA

Peak Forward Current *1 IFM 1000 mA

Electrostatic Discharge (HBM) ESD 4000 V

LED Junction Temperature Tj 125 °C

Operating Temperature Topr -40 ~ +110 °C

Storage Temperature Tstg -40 ~ +120 °C

Reflow Soldering (preheat 150-180°C 60-120sec, soldering temp 260°C 10sec)

*1.Duty Ratio=0.1%,Pulse Width=10us.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

View Angle of Half Power 2q1/2 35 deg

Reverse Current IR VR=5V 15 μA

Peak Emission Wavelength λp 595 nm

Dominate Wave Length * λd(HUE) 590 nm

Spectrum Width Of Half Valve △λ 25 nm

Thermal Resistance Junction To Case With o

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES

FORWARD CURRENT (mA)

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2TYPICAL ELECTRICAL OPTICAL CHARACTERISTICS CURVES

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Brightness Bin Selection

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Color Bin Selection

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Package Dimension For Emitter Type

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Package Dimension For Star Type

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Requirements to user For Emitter Type

2 Recommended Solder Pad Design For Emitter Type

1.All dimensions are in millimeters.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Heat Plate Soldering Condition For Emitter Type

a. Soldering Process for Solder Paste

solder paste Heat conduction rubber

Paste on PCB. Solder Paste melt.

1.The Solder Paste sould be melted within 10 seconds.

b. Soldering Process for Solder Wire

solder paste Heat conduction rubber

pad of PCB. PCB out from Heat Plate within

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

2 Soldering Process For Hot Bar For Emitter Type

solder paste Heat conduction rubber

Dispensing Power Emitter

2 Manual Hand Soldering For Emitter Type

Thermal Conductive Glue

Heat conduction rubber

on the PCB. of Emitter within 5 seconds.

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.

Free Convection Horizontal Free Convection Free Convection

3,300 2,700 4,500

HUEY JANN ELECTRONICS INDUSTRY CO., LTD.