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ASUS

L3-L4 Service Manual


1: Product Appearance

ZC553KL

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2: Technical Specifications
project index

Cell phone type Touch screen smart phone

Size (length * width *


151.4*76.24*8.3mm
thickness)
GSM: 850/900/1800/1900
WCDMA: Band 1/2/5/8
Working frequency band
FDD-LTE Band 1/2/3/5/7/8/20
TDD-LTE: B38/B41 (2545~2655MHz only)

External interface Standard USB 3.5mm; Micro earphone interface

SIM Card interface Micro sim+Nano/T

Extended card maximum


128GB
support capacity

USB USB2.0 High Speed; 480Mbps

Battery capacity:4000mAh

display FHD 1920*1080, IPS 2.5D GFF

antenna Built in antenna

camera 8M 4P F2.2FOV84 1/4inch+16MPDAF,5P,f2.0, blue glass,1/3inch

The sense of distance, light, gravity, gyroscope, compass,


Sensors
Holzer sense of induction

Bluetooth Bluetooth v4.0

WIFI 802.11 2.4G b/g/n

GPS GPS/AGPS/Glonass/The Big Dipper

Power parameter 100V-240V, 50/60Hz,2A

working temperature: 0°C ~ + 40°C


temperature
Storage temperature: -40°C ~ +70°C

humidity Working humidity 5% - 95%

Environmental
protection  ROHS、REACH、No halogen
requirements

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3: CAUTIONS
I. Flashing & Servicing must be undertaken by qualified personnel only.
II. Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
III. Use only approved Tools & components as specified in the parts list.
IV. Ensure all components, modules, screws, and insulators are correctly re-fitted after servicing and
alignment
V. Ensure all cables and wires are repositioned correctly if Handset disassembled
VI. Electrostatic discharge can easily damage the sensitive components of electronic products.
Therefore, Service Centre must adhere the precautions which mentioned above.

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4: service Details

SUB camera rear camera


light sensor IC LED
connector connector

headphone TP
jack connector

Div.PA CPU MSM8937

flash
PM QFE2101

SIM/SD card
cassette Crystal 19.2M PM8937

M-sensor SUB mic

WIFI/BT/FM
RF Transceive
r
Key pad
connector RF PA for
LTE
Gyro sensor
IC RF PA for
GSM
Charger IC
finger
connector
Audio PA

battery LCD connector Main FPC


connector connector

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5: Maintenance Tools

Name: Constant-temperature Hot Air Gun


Purpose: Heat component.

Name: Constant-temperature Hot Air Gun


Purpose: Heat component.

Name: Soldering Iron


Purpose : Repair soldering

Name: DC Power Supply


Purpose: Supply voltage and current.

Name: Soldering Station


Purpose: Fix main board.

Name: Pb-free Solder Wire


Purpose: Join component.

Name: Digital Multimeter


Purpose: Service measure

Name: Oscilloscope
Purpose: Service measure

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Name: Tool kit


Purpose : Assemble and Disassemble tool

Name: Electronic Screw Driver


Purpose : Assemble and Disassemble tool

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6: Principle Instruction
System Module Work Principle

MSM8937 functional Work Principle

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7:PM8937 Work Principle

PM8937 DC power supply

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PM8937 regulators and their intended uses

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8.PM8937 Power on squence

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Power on timing specifications

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9:Does not power on

Schematic Diagram

Circuit analysis:
boot keys is pressed, PWRKEY detect low latency 30ms, CPU power management in the area to
open the brightest LDO baseband circuits, delay 200ms after power management chip the reset
signal reset output baseband, baseband chip boot into the software boot process has finished booting.

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Key pad
connector

battery
connector

Crystal 19.2M PM8937

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Repair flow:

Power on failed , and use outside


power supply to PCBA , and observe
the change of the current.

If the value of current is on the The current is normal , and its If the value of current is on
low side , about 10mA. value is about 20mA. side , about several hund

Check some voltage whether


Check if the
check 26MHz
if the they are normal , for example , Check all of components w
crystal is work. VBAT,VA_PMU correlative with VBAT , an
19.2M crystal
those broken compon

N
N Y

change
Changethe
the19.2M
26MHzcrystal
crystalororsolder
solder
Check the CPU whether they Y
ititagain
again. Change the CPU or solder
are soldered empty or broken.

N
N

Solder the CPU , if the handset is


not normal still , change the CPU.
Y Download software N According to the downloa
again , check whether the repair the handset when
handset is normal. download softwar

Y
Y

The end.

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10.Display issue

Schematic Diagram

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LCD blank screen and backlight broken:


Repair process: boot and test U901 output VLED_P whether it is high, the signal for
LCD backlighting lamp anode, LCD normal lit VLED_P is high, and check LCD welding is
good; inspection VBOOST whether there is voltage (VBAT on this signal is received), Check if
LCD_BL_EN is high.

 Circuit Analysis:
The display of ZB553KL used 5.0 FHD LCD. Its data interface include MIPIport and signal
controlled lines , The digital port of LCD is driven by BBIC MSM8937, and its power supplied by
VIO 2.8V of PMU IC, and its driven circuit of backlight is supplied by the four commonanode and
backlight cycles of U901.

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LCD display issue repair flow:
Display
abnormal

Check theLCD Replace or


connector clean the

Check socket Replace or re


beside all EMI weld IC EMI

reweld or
replace the

End

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No display repair flow :

No display

Check theLCD Replace or


connector clean the

Check the reweld or


backlight LED replace U901

reweld or
replace the

End

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11:Touch panel issue
Schematic Diagram

TP Shrapnel

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TP TVS
components

TP Issue repair flow:

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cleaning and finishing


the TP Shrapnels

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12:Charging
Schematic Diagram

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Can’t charge repair flow:

not charging

check the reweld or


TVS IC wether replace TVS IC

check the reweld or


vbat Voltage replace

Check U13 reweld or


and J4 replace U13

reweld or
replace CPU

End

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13:Camera
Schematic Diagram

Main_ camera

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Failure analysis is as follows:
After the replacement camera, a camera to eliminate ontology failure problem; Check the connector
J2401/J2402 welding problem again.
So camera function could not be opened:
1. Check the power supply voltage 'VDDCAMMOT', 'VDDCAMCORE', 'VDDCAMIO', is normal, such as
abnormal change - PMU - 2.
2. Review the control signal of cameras' CMMCLK ', 'REAR_CAM_ID0', 'CCIR_RET', voltage and the circuit
is normal.
All the examination without exception are to add welding/change the CPU.
So camera image display abnormal:
Check camera and transmission of data between the CPU signaling pathways conduction, whether there are
abnormal check pathway on the EMI welding device and the performance is normal, if there is no exception to
welding the CPU.

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Camera issue repair flow:

camera abnormal

Check Cleaning or re
whether the welding or

Check and reweld or replace


measure IC EMI IC
EMI is normal

On boot reweld or replace


camer check PM IC
and measure

add or
replace CPU

END

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14:Vibrator
Schematic Diagram

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General analysis process is as follows:


1. Check if motor is negative resistance between 33 Ω, such as abnormal need to be replaced; Check the
motor of the welding is reliable.
2. Check whether the motor working voltage 'VPH PER' normal loaded into the small plate 'MOTOR DRV'
this point, the motor whether the cathode and the mainboard of ground conduction;
If the above are no obvious problems, check - PMU - 2, or to replace it.

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Vibrato issue repair flow:

No vibrato

check clean or replace the


shrapnel shrapnel

On working reweld or replace


mode PM8937

On working reweld or replace


mode CPU

reweld or
replace

end

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15:WiFi/BT/GPS
WiFi&BT&GPS Schematic diagram

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Wifi&BT&GPS Issue repair flow:

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WIFI,BT,GPS
abnormal

check ant. clean or replace


shrapnel shrapnel

On boot rewled or replace


mode check PM8937

Check rewled or replace


FL4505 the abnormal

Check clock Welding or


circuit replacement of
crystal &CPU

rewled or
replace the

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The GPS signal to be transmitted through the U3000, so when a separate GPS emission exception in addition to
confirm the U4901, but also to confirm the U3000

16: Receiver
Schematic Diagram

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Receive Issue repair flow:

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receiver
abnormal

Check Cleaning or
whether the removing

Check the The measurement


PCB board path is good
receiver ends connecting

Re welding or
replacing
power supply

End

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17: Speaker
Schematic Diagram

Speaker function have a differential circuit on the sub plate.

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Speaker Issue repair flow:
Speaker
abnormal

Check the Clean or


main cable replace

Check audio Add or


PA peripheral replace

Measuring rewled or
the VPH replace the

End

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18:SIM card issue
Schematic Diagram

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SIM1 and SIM2 power supply and signal is separated, when the SIM does not recognize the SIM card can check
the relevant circuit. Fault, not read card analysis process is as follows:
1. The first SIM booth of welding and exaemine whether the pin height consistent.
2. Review the working voltage of SIM card 'VDDSIM' is normal.
3. Check the SIM card control signals' SIM_SCLK ', 'SIM_DA', lines is normal.
4. No problem with the above checks, the CPU is replaced.

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SIM card Issue repair flow:

Undetectable SIM
card

Check Reweld or replace


whether the

Check Add or replace


whether the power supply IC
power supply

Check Add or replace


whether the CPU
foot of the

End

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19:SD card issue
Schematic Diagram

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SD card analysis process is as follows:


1. Check if the working voltage of T card 'VDDSD' normal and abnormal check line device on the welding is
normal, then check the driver circuit ,then check the PM IC.
2. Review the SD card control signals' SD0 ', 'SD1' and 'CLK' on a line welding device is normal.
3. No problem with the above checks, the CPU is reweld or replaced.

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SD card Issue repair flow:

SD card abnormal

Check SD card re welding or


all pins replace the card

Check the SD check the driver


card power circuit and the PM

check the reweld or replace


D0,D1,CLK the CPU

End

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