GE

Sensing & Inspection Technologies

Document No. MAI 1

Prepared by: Richard J Mills
Rev. 4 April 9, 2010

MAI LEVEL III TRAINING GENERAL TOPICS OUTLINE

1. Scope

1.1 Purpose: This outline documents the subjects covered, approximate time for each subject,
references utilized and specific requirements and exceptions.

1.2 Applicability: This outline has been developed utilizing the subjects required by the MAI Level
III Training General Topics Outline. It is intended for use for the MAI Level III training course.

1.3 Course Specifics and Exceptions: This outline is prepared in accordance with NAS 410
revision 3, paragraph 6.1.1 to the maximum extent possible. Terminology used within this
outline shall be in accordance with NAS 410 revision 3, section 3. It is to be required that all
candidates shall have successfully completed the necessary formal training and have the
required experience equivalent to that required for a Level II in the RT test method in
accordance with NAS 410 Tables 1 and 2 respectively. It shall be required that each
candidate has successfully completed all safety requirements of their employer and specific
State requirements in regards to x-ray and radiographic operations. It shall be required that
each candidate has successfully completed training in accordance with NAS 410 revision 3
paragraph 6.1.1 and this is documented in accordance with their employers Written Practice.
Therefore this Outline specifies the minimum training required for this course and modifies
the requirements of NAS 410 paragraph 6.1.1 as noted below. Each candidate shall be
required to have previously successfully completed NAS 410 paragraph 6.1.1 requirements
prior to this course as documented by their respective employer.
• Basic theory for digital radiology and modalities
• Equipment operation and standardization
• The importance of process controls
• Applicable techniques and the advantages and disadvantages
• Limitations and capabilities of each digital modality and technique covered
• Applicable specifications and codes
• Evaluation, interpretation and documentation of inspection samples utilized in the course

2. Reference Documents

2.1 Publications
2.1.1 ASNT NDT Handbook Volume 4 Third Edition
2.1.2 GE Inspection Technologies Industrial Radiography Image Forming Techniques, 2006
2.1.3 ASNT Level III Study Guide RT Method Second Edition
2.1.4 Image Processing Gonzales and Wood 2008
General Electric Company
2.2 Standards
2.2.1 ASTM E 2007 Standard Guide for Computed Radiology
2.2.2 ASTM E 2033 Standard Practice for Computed Radiology
2.2.3 ASTM 2445 Standard Practice for Qualification and Long –Term Stability of Computed
Radiology Systems
2.2.4 ASTM E 2446 Standard Practice for Classification of Computed Radiology systems
2.2.5 ASTM E 2339 Standard Practice for DICONDT
2.2.6 ASTM E 2597 Standard Practice for Manufacturing Characterization of DDA’s
2.2.7 ASTM WK 16413 Standard Practice for Qualification and Long – Term Stability of DDA’s
2.2.8 ASTM WK 13186 Standard Practice for Radiological Examination Using DDA’s
2.2.9 ASTM WK 7492 Standard guide for DDA Radiology
2.2.10 NAVSEA – MAI CR – DR Qualification Document dated 03-12-2009

2.3 White Papers

2.3.1 Weld defect detection in industrial radiography based image processing 2005

2.4 Acknowledgments and Contributions

2.4.1 Sprawls Educational Foundation Physical Principles of Medical Imaging
2.4.2 Clifford Bueno - GE Global Research, Niskayuna, NY
2.4.3 Rajashekar Venkatachalam - GE Global Research, Bangalore, India
2.4.4 Debasish Mishra - GE Global Research, Bangalore, India
2.4.5 Tina Bowden – GE Sensing and Inspection Technologies, Hampton, VA
2.4.6 Klaus Bavendiek – Yxlon Intl, Hamburg, Germany
2.4.7 Richard Mills – GE Sensing and Inspection, Newport News, VA
2.4.8 Jeff Urbanski – GE Sensing and Inspection, Lewistown, PA
2.4.9 Uwe Ewert – BAM Institute, Berlin, Germany
2.4.10 Joe Portaz – GE Aviation, Cincinnati, OH
2.4.11 Trey Gordon – Boeing Phantom Works, Seattle, WA
2.4.12 Mike Horky – Boeing Commercial Aircraft, Seattle, WA
2.4.13 William Meade – Boeing Commercial Aircraft, Seattle, WA
2.4.14 Mark Aziz – GE Sensing and Inspection, Baltimore, MD
2.4.15 Mark McAnally – GE Sensing and Inspection, Philadelphia, PA
2.4.16 Fred Morro – Fujifilm NDT
2.4.17 Richard Kochakin - GE Sensing and Inspection, Lewistown, PA
2.4.18 Dan Wysnewski - GE Sensing and Inspection, Philadelphia, PA
2.4.19 Sue Clendening - GE Sensing and Inspection, Philadelphia, PA
2.4.20 Charles Rowe - GE Sensing and Inspection, Lewistown, PA
2.4.21 Steve Zahorodny - GE Sensing and Inspection, Atlanta, GA
2.4.22 Shana Telesz - GE Sensing and Inspection, Lewistown, PA

3. Duration
The course shall be a 40-hour course consisting of instruction in both the classroom and
laboratory environments.

4. Examination
4.1 Examination: Shall be in accordance with NAS 410 revision 3 paragraph 7.1.2 with the
exception that it is required that the candidate shall have previously completed requirements for a
basic examination to the satisfaction of the respective employer. Other NDT methods utilized at
the employer site are not within the scope of this course.
4.2 Scoring: Shall be in accordance with NAS 410 revision 3 paragraph 7.2.2. A minimum score
of 70 percent shall be required for successful completion .
4.3 Re-Examination: Shall be in accordance with NAS 410 revision 3 paragraph 7.2.3.
Candidates that fail to meet the minimum score shall be required to receive additional training
before an additional attempt at the examination. The examination shall require a minimum of 25
percent new questions. The Employer shall document the additional training in accordance with
their Written Practice.

5. Documentation and Notification

5.1 GE shall notify the candidates in writing of their results with in 5 business days following the
completion of the course.
5.2 Candidates meeting the course requirements shall receive a certificate of successful
completion referencing the requirements of this Outline.
GE Inspection Technologies

Topics

1) Non Film Radiology Overview

a) Computed Radiography

b) DDA Radiography

c) Radioscopy

d) Computed Tomography

e) X-ray Sources for digital radiography

(1) Conventional sources

(2) Mini, & micro focus sources

(3) Linear accelerators

2) Common Digital System Elements and Digital Image Properties

a) Digital Image Properties

(1) Bits / Bytes

(2) Pixels / Voxels

b) Image file formats and compression (JPEG, TIFF, DICONDE)

(1) Advantages/disadvantages

(2) Lossy vs. lossless

c) Sampling Theory (Digitizing)

(1) Pixel size (Aperture)

(2) Pixel pitch

(3) Bit depth

(4) Nyquist Theory

d) Digital System Components

(1) Computer

(2) Operator Interface

(3) System Controller

(4) Image Processor

(5) Image display monitors

(i) Flat panel displays (LCD,LED,OLED)

(ii) Display bit depth

 (iii) Monitor resolution

(iv) Monitor testing

(v) Monitor Brightness and Contrast

(vi) Test Patterns

(vii) Monitor calibration

e) Data Archive & Retrieval

(1) Removable Media - Single media (CD, DVD, tape)

(2) Redundant Array of Inexpensive Disks (RAID)

(3) Central archive

(4) Image retrieval

f) Digital System Specific Image Processing Topics

(1) Region of Interest (ROI) and Measurements

(2) Line Profiles

(3) Histograms (Mean / Standard Deviations)

(4) Discontinuity Sizing

(i) Length

(ii) Area

(iii) Wall thickness

(iv) Blob / Cluster Analysis

(5) Gray scale display adjustments

(i) Window Width and Level

(ii) Look Up Tables (LUT)

(iii) Thresholding

(iv) Histogram equalization

(v) Pseudo color

(6) Arithmetic

(i) Addition (integration)

(ii) Subtraction

(iii) Division

(iv) Multiplication

(v) Averaging

(7) Filtering (kernels)

(i) Convolution
 (ii) Low pass

(iii) High pass

(iv) Median

(v) Un-sharp mask

g) System characterization

(1) Measuring Image Fidelity

(i) Contrast & Resolution

(ii) Modulation Transfer Function (MTF)

(iii) Signal-to-Noise Ratio (SNR)

(2) Image Fidelity Indicators

(i) Image Quality Indicators (IQI): Hole and Wire types

(ii) Line pair gauges
(iii) Phantoms
(iv) Reference Quality Indicators (RQI)
3) Computed Radiography Testing:

a) CR System Overview

(1) CR vs. film procedural steps

(2) Film vs. CR Images

(3) Linearity &Latitude

(4) Image Plate Classifications

b) CR Technical Requirements

(1) Qualification of CR systems

(2) Classification of CR systems

(3) Maintenance of CR systems

(4) Hard / Soft Cassette Usage

(5) Image Plate Wear and Damage

(6) Image Plate Artifacts

(7) CR Image optimization

(8) Laser spot size optimization

(9) Use of Lead Screens

c) Qualification of CR Systems

(i) Qualification plan

(ii) System Performance Characterization

 (a) Process Controls
(b) Technique Documentation
(c) Technique Validation
4) Digital Detector Array Testing:

a) DR System Overview

(1) DR System Capabilities

(2) 2.2. DR vs. film procedural steps

(3) 2.3. Cost and environmental issues

(4) 2.4. Film vs. DR Images

(5) 2.5. Linearity & Latitude

(6) 2.6. Contrast & Resolution

b) Detector Selection

(1) ASTM E2597 Data Interpretation

(2) Frame Rate, Resolution, Ghosting/Lag, Bit Depth

(3) Basic Spatial Resolution

(4) Bad Pixel Characterization

(5) Contrast Sensitivity

(6) Efficiency

(7) Frame Rate

(8) Blooming

(9) Ghosting/Latent Image/Lag

(10)Scatter Sensitivity

(11)Bit Depth

(12)Fabrication anomalies (i.e. bad pixels, chip grades, etc.)

(13)Radiation Exposure Tolerance

c) DR Image Quality Topics

(1) Calibration optimization

(2) Setting bad pixel limits vs. application

(3) Image Un-sharpness & Geometric Magnification

(4) Frame Rate & averaging

(5) Binning

(6) Determining required geometric magnification

(i) Geometry and geometric un-sharpness

 (ii) Focal spot size measurement method

(iii) Total Image Un-sharpness

(iv) SNR compensation for spatial resolution

(v) Frame averaging

(vi) Binning

(7) X-ray spectrum optimization

(i) Filtering

(ii) Beam collimation

(iii) Beam energy

(8) Radiation damage management

d) Qualification of DR Systems

(i) Qualification plan

(ii) System Performance Characterization

(a) Process Controls

(b) Technique Documentation

(c) Technique Validation

e) System Performance Characterization & Monitoring

(i) Monitor Brightness and Contrast

(ii) Test Patterns

(iii) Monitor calibration

5) Computed Tomography Testing

a) Difference between CT and conventional radiography

b) Benefits and Advantages

c) Limitations

d) Industrial imaging examples

e) Basic Hardware Configuration

f) Scan geometries – general configurations by generation

g) Radiation sources

h) Detection systems
i) Convolution/Back projections

j) Fourier Reconstructions

k) Fan / Cone Beam

l) Advanced Image Processing and Algorithm Analysis

m) Fundamental CT Performance Parameters

n) System performance analysis

o) Fundamental scan plan parameters

p) Basic system tradeoffs for spatial resolution/noise/slice thickness

q) Basic Image Interpretation

r) Artifacts – definitions, detection and basic causes

 Reference Topic Modality
Guidelines Section Paragraph CR DR Both
Section 5 5.1.3 Performance evaluation and performance
Guidelines for DDA requirements of ASTM E2033 and ASTM E2445 10
and CR System 5.1.4 Performance evaluation and performance
Performance requirements of WK-16413 and WK-13186 10
Evaluation for 5.2 Technique card requirements 5
Casting Inspection 5.2.2 - 5.2.10 IQI selection, placement, and usage 5
5.4 Bad Pixel Management (How bad pixels are to
be handled) 10
5.5 Artifact Management (How to handle artifacts for
CR / BPM for DDA's per ASTM Docs. Ghosting
for both) 10
5.6 Minimum Bit Depth (Discussion of bit depth and
minimum requirements) 5
5.7 Gain & Offset Correction (Calibration of DDA's) 10
Section 6 6.3 System process controls & performance
Guidelines for measurements per ASTM E2033 ASTM E2445 10
Implementation 6.3 System process controls & performance
measurements per ASTM WK-16413 &WK-
13186 10
6.4 Environmental Conditions 3
6.5 Inspection Room Cleanliness 2
6.6 Handling DDAs and IP's 5
6.7 System Preventative Maintenance 10
Section 7 7.2 Magnification (geometric) Technique 5
Guidelines for 7.3 Measurement Procedure for Basic Spatial
Controlling Image Resolution (SRb) 10
Quality 7.4 Normalized Image Unsharpness Requirements 10
7.5 Contrast to Noise Measurement 5
Section 8 Image 8.1 Window Width and Level 5
Viewing Protocol 8.2 Image Filtering (Software) 10
8.3 Ambient Viewing Conditions 2
8.4 Digital Magnification or Zoom 3
8.5 Software Tools for Casting Inspection 10
8.6 Use of Digital Reference Radiographs 10

NOTE: Many of these Guidelines topics will also be covered in the

main training sessions for CR/DR, etc.