Int J Mech Mater Des
https://doi.org/10.1007/s10999-018-9410-0 (0123456789().,-volV)
(0123456789().,-volV)
Crack interaction study in piezoelectric materials
under thermo-electro-mechanical loading environment
Ranjan Mishra . Ramesh Gupta Burela . Himanshu Pathak
Received: 25 February 2018 / Accepted: 3 August 2018
 Springer Nature B.V. 2018
Abstract Multiple voids and cracks were generated
during material processing techniques, which interact
with each other and affects the service performance of
piezoelectric components. This work aims to study the
behavior of piezoelectric components in presence of
multiple cracks under thermo-electro-mechanical
loading environment. Extended finite element method
has been implemented to model geometrical discon-
tinuities with crack interaction phenomenon. In this
work, thermo-electro- mechanical problem has been
decoupled into thermal and electro-elastic problems.
Temperature distribution has been obtained by solving
heat conduction equation and then used as an input to
the electro-elastic problem. In post processing phase,
interaction integral method and generalized Stroh
formalism were used to predict the stress intensity
factors. The methodology has been implemented with
in-house developed MATLAB code. Set of cases for
crack interaction studies were presented using the
proposed approach.
Keywords Crack interaction  Piezoelectric 
Thermo-electro-mechanical loading  SIFs  XFEM
R. Mishra  R. G. Burela
Department of Mechanical Engineering, Shiv Nadar
University, Gautam Buddha Nagar, Uttar Pradesh, India
H. Pathak (&)
School of Engineering, IIT Mandi, VPO Kamand, Mandi,
Himachal Pradesh, India
e-mail: himanshu@iitmandi.ac.in
1 Introduction
With the growing applications of engineering smart
materials in electronic devices such as electro-me-
chanical actuators/transducers/smart sensors/ultra-
sonic generators, aircraft industry and so forth, the
study of piezoelectric materials has been reported
considerable attention in recent years. Due to effective
intrinsic electro-mechanical coupling features, smart
piezoelectric materials are used for fabrication of such
devices. Piezoelectric materials are inherently inho-
mogeneous and brittle in nature with low fracture
toughness (Pasharavesh 2017). As a result of hetero-
geneity, field coupling effects, geometrical imperfec-
tions (flaws, edges and electrodes) or defects such as
voids, cracks, inclusions resulting from manufacturing
and in-service loading, smart piezoelectric materials
may be exposed to high thermo-electro-mechanical
field concentrations during operation and these may
experience high stresses and high electric field con-
centrations and as a result of which they may fail
because of dielectric breakdown. However, stress
concentration at the defects such as cracks, voids,
holes and inclusions that can give rise to critical crack-
growth and often induce subsequent failure of such
smart materials. Thermal effects such as pyroelectric
effect and temperature-induced deformation in piezo-
electric solids are very much important for the
fabrication of such devices like micro-electro-me-
chanical systems (MEMS) and so forth. Consequently,
123

the concern of structural integrity of such smart
piezoelectric structures demands better understanding
of the facture mechanism due to thermo-electro-
mechanical loading so that durability, reliability and
strength of the piezoelectric structures can be
improved which are generally important for the better
performance of these smart materials.
Crack interaction study in piezoelectric solids
under coupled thermo-electro-mechanical loading
conditions has drawn serious attention to many
research people in the last two decade. Wang and
Noda (2001) investigated fracture behavior of ther-
mally induced crack in a smart functionally graded
composite structures where they solved numerically
and calculated stresses, thermal flow and electric
displacement intensity factors (Shi 2014) for different
crack positions. Wang and Mai (2002a, b) solved
cracked-piezoelectric problem numerically under
transient thermal loading. Niraula and Noda (2002)
have done the analysis on thermal stress in trans-
versely isotropic thermo-piezoelectric strips with an
edge crack under thermal and electric loading condi-
tions. Ueda (2003) investigated the problem involving
thermally induced fracture in piezo-electric laminate
under uniform temperature and electric fields. Wang
and Noda (2004) found the solutions for a penny-
shaped crack in an electro-elastic material under
uniform heat flow loading conditions applied far away
from crack. They found exact solution for electric
displacements and field stresses. Ueda (2004) did
many theoretical studies on thermo-electro-elasticity
problem in a functionally graded piezoelectric layer
under the effect of combined thermal, electrical and
mechanical loading condition. Recently, a novel and
robust approach has been developed and implemented
to extract mixed-mode fracture parameter using
domain-independent interaction integral (Yu et al.
2012, 2014; Guo et al. 2014).
Fracture toughness plays a vital role for the better
and efficient design of these smart structures. Hence, it
is essential to perform numerical simulation of prob-
lems involving fracture mechanism of smart piezo-
electric materials in order to predict the response of
these smart structures during their service conditions.
However, there are various methods for the numerical
simulation like finite element method, mesh-free
method and boundary element method. Over many
years, a finite element technique has been used to
simulate the piezoelectric problems. Firstly, Allik and
123
R. Mishra et al.
Hughes (1970) applied finite element techniques to
study vibrations in piezo-electric ceramic materials.
Kumar and Singh (1996) analyzed the double-edged
crack propagation problem for piezoelectric solids
under the effect of combined electrical and mechanical
loading environment. Kuna (2010) also presented
many results on piezoelectric fracture mechanics
problems using different techniques. Later, extended
finite element method (XFEM) has been grown as the
most versatile, efficient and accurate numerical tech-
niques to model multiple geometrical discontinuities.
Mo/s et al. (1999), Belytschko and Black (1999)
proposed the XFEM which is versatile and efficient
numerical tool for the accurate simulation of cracks in
linear elastic fracture mechanics (LEFM). Asadpoure
and Mohammadi (2007) proposed XFEM for model-
ing of cracks in orthotropic composite materials using
six new enrichment functions. More recently, Bhar-
gava and Sharma (2012) proposed six crack-tip
enrichment functions for modeling of different cracks
for piezoelectric solids by XFEM approach.
The domain with two cracks creates the significant
effect over the induced stress field singularity. The
cracks interact with each other which change the
effective stress intensity factor, stress distribution and
crack growth direction. Therefore the study of crack
interaction becomes more important to understand the
effect of double cracks on strength of piezo-electric
components, nature of crack propagation and crack
branching. According to the author’s knowledge, it is
observed that there is no such work on crack interac-
tion study in piezoelectric material under coupled
thermo-electro-mechanical loading conditions using
XFEM approach. Thus, the present authors paid
attention on the fracture behavior in piezoelectric
materials with multiple cracks under combined
thermo-electro-mechanical loading conditions using
extended finite element method (XFEM).
The XFEM has many advantages over FEM such
as:
• Geometric discontinuities (cracks, inclusions, and
holes) are not considered a part of finite element
mesh/domain;
• Crack discontinuity tracked by level set function
and nodal data only;
• Complex geometries and moving domain prob-
lems can be easily handled;
Crack interaction study in piezoelectric materials

• Geometrical discontinuities can be modeled by mechanical environment. The conclusions are drawn
adding additional functions in primary variable in Sect. 5.
approximation;
• No need of tedious and time consuming re-
meshing process; 2 Mathematical formulation
• XFEM with coarse mesh can give good accuracy
and high convergence rate; The governing equations and the boundary conditions
• Classical FEM can be used as XFEM after minor for the thermo-piezoelectric continuum which are
modification in formulation; shown below:
• Post-processing for the fracture results is quite
easy and smooth. 2.1 Field equations
These advantages of XFEM methodology and
Consider a two-dimensional homogeneous, linear and
importance of crack interaction phenomenon in
isotropic thermo-piezoelectric body. The set of field
piezo-electric materials have motivated to investigate
equations for a thermo-piezoelectric continuum sub-
crack interaction behaviour under thermo-electro-
jected to thermo-electro-mechanical loads with con-
mechanical loading environment. The main objectives
stitutive equations and kinematic equations are given
of the present study are:
below:
• Mesh-independent XFEM approach has been
• Constitutive equations
implemented to simulate crack interaction phe-
rij ¼ Cijkl ekl  elij El  kij DT ð1Þ
nomenon in piezoelectric domain;
• Crack interaction effect has been studied in
homogeneous piezoelectric plate under combined Di ¼ eikl ekl þ 2il El þ vi DT ð2Þ
thermo-electro-mechanical loading environment;
• A modified interaction integral approach has been
used to extract thermal-elasto-electric stress inten- g ¼ kij eij þ vi El þ av DT ð3Þ
sity factors.
where (i, j, k, l = 1, 2, 3)
In this work, few crack interaction problems are
• Kinematic
 equations

simulated for two-dimensional coupled thermo-elec-
1 oui ouj ou
tro-mechanical analysis in piezoelectric structures eij ¼ þ ; Ei ¼  ð4Þ
using XFEM. Numerical results are obtained by using 2 oxj oxi oxi
XFEM technique to illustrate the manner in which
mechanical stress and electric displacement intensity 2.2 Governing equations
factors for multiple cracks in the piezoelectric domain
are influenced by the poling direction, the crack The set of governing equations for the case of thermo-
position and crack orientation. Thermal interaction piezoelectricity comprises equations of elasticity, the
integral method and generalized Stroh’s formalism are heat conduction equation, and the equation of quasi
used to calculate the stress intensity factors. The paper stationary electric field. Therefore, the system of
has been constructed in the following manner: Math- differential equations for a quasi-static case is given
ematical formulation for thermo-electro-mechanical by:
problem is discussed in Sect. 2. The fracture mechan-
ics and crack modelling technique in piezoelectric o2 T o2 T
kx þ k y ¼ 0; ð5Þ
domain are described in Sect. 3. This section also ox2 oy2
describes the enrichment techniques for crack mod- whereas kx and ky are the coefficients of thermal
elling and interaction integral approach for SIFs conductivity along X and Y directions. As given in
calculation. Several numerical problems are illustrated Fig. 1, the applied boundary conditions are
in Sect. 4 for evaluating the SIFs of the multiple edge
cracked piezoelectric under thermal and electro-

123
 R. Mishra et al.

Fig. 1 Piezoelectric
domain with multiple cracks

 
T ð0  X  W;Y¼0Þ ¼ T1 ; T ð0  X  W;Y¼LÞ ¼ T2 ð6Þ
  ui ¼ u on Cu ; rij :ni ¼ ti on Ct ; rij :ni ¼ 0 on Cþ
c;
oT  oT 
¼ 0; ¼ 0: ð7Þ rij :ni ¼ 0 on C
c ui ¼ u on Cu ; Di :ni ¼  Q on CD ;
ox ð0  Y  L; X¼0Þ ox ð0  Y  L; X¼W Þ
Di :ni ¼ 0 on Cc ; Di :ni ¼ 0 on C
þ
c
rij;j ¼ 0; Di;i ¼ 0; ð8Þ T ¼ T on CT ; qi :ni ¼ q on Cq

Here qi = - kij DT, qi is the heat flux and kij is the
coefficients of heat conduction. Additionally, DT is the
temperature change of the absolute temperature T
from a stress free reference temperature T0. In above
Eq. (8), a comma denotes partial differentiation and
also the repeated indices denote summation. In above
Eqs. (1–5), rij, eij, Di, kij, kij, vi, Cijkl, elij, eij, g and Ei
denote stress, strain, electric displacement, heat con-
duction coefficient, temperature stress constants,
pyroelectric constant, elastic constants, piezoelectric
constants, dielectric constants, entropy, electric field
and av is a scalar of constitutive coefficients.
• Boundary conditions for cracked domain
The boundary conditions of the field equations for
cracked domain are given by:
ð9Þ
where ui ; u; t denote mechanical displacement vec-
tor, scalar electric potential, and traction force which
are prescribed on respective boundary Cu, Cu, Ct and
ni is the direction cosine component.
3 Fracture mechanics of piezoelectric continuum
The asymptotic characteristics of all electromechan-
ical fields are approaching to the crack-tip in two-
dimensional domain. The following Eqs. (10–13) are
the near-tip fields given in polar coordinates system (r,
h). The mechanical stresses and the electric fluxes both
show singular behavior as (r-1/2) and the mechanical
displacements and the electric potential both show
parabolic shape & (r1/2). Mutual interdependence
between the mechanical and the electrical parameters
at the crack-tip can be given by:

123
Crack interaction study in piezoelectric materials

1 h X
4 n pffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffio
rij ðr; hÞ ¼ pffiffiffiffiffiffiffiffi KI fijI ðhÞ þ KII fijII ðhÞ diN ¼ Re Aia NaN cos h þ Pa sin h ð18Þ
2pr ð10Þ
i a¼1
þKIII fijIII ðhÞ þ KIV fijIV ðhÞ
X
4 n pffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffio
h vN ¼ Re A4a NaN cos h þ Pa sin h ð19Þ
1
Di ðr; hÞ ¼ pffiffiffiffiffiffiffiffi KI gIij ðhÞ þ KII gIIij ðhÞ a¼1
2pr ð11Þ
i Here Re {…} in the bracket indicates the real part of
þKIII gIIIij ðhÞ þ K g IV
IV ij ðhÞ the entity, where Pa are the four conjugate pairs of
rffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi eigenvalues, and AMa are (4 9 4) eigenvectors, that
2r may be extracted by solving the following quadratic
ui ðr; hÞ ¼ ½KI diI ðhÞ þ KII diII ðhÞ
p ð12Þ eigenvalue problems.
 " ! !
þKIII diIII ðhÞ þ KIV diIV ðhÞ tip
Ci1k1 etip
i11
tip
Ci2k1 tip
þ Ci1k2 etip tip
i21 þ ei12
þ
etip
1k1  2tip
11 etip tip
2k1 þ e1k2  2tip12  221
tip

rffiffiffiffiffi tip
! #

2r  I Ci2k2 etip
i22 2 Ai
uðr; hÞ ¼ KI v ðhÞ þ KII vII ðhÞ Pþ P ¼0
p ð13Þ etip
2k2  2 tip
22
A4

þKIII vIII ðhÞ þ KIV vIV ðhÞ ð20Þ
whereas (i, j = 1 and2), and {I, II, III, IV} comprises of Since Pa are the non-zero complex roots or
all the four modes of fracture. eigenvalues which are evaluated from equations of
The coefficients KI, KII, KIII are the mechanical material properties and only four eigenvalues with
stress-intensity factors (SIFs) that are complemented positive imaginary part and its corresponding eigen-
by new forth ‘‘electric displacement intensity factor’’ vectors are used in matrix A. The (4 9 4) matrices
KIV (EDIF) that characterizes electric field singularity MMa and NaNcan be derived by (Park and Sun 1993)
at a crack-tip. The standard angular functions 1
NaN ¼ MMa
fNij (h), gNij (h), dNij (h), vNij (h) for homogeneous and linear " #
tip tip
cracked thermo-piezoelectric media are depend on ðCi2k1 þ Ci2k2 Pa ÞAka ðetip tip
1i2 þ e2i2 Pa ÞA4a
¼
material characteristics and can be calculated from the ðetip
2k1 þ e tip
2k2 a ÞAka
P ð 2tip tip
21  222 Pa ÞA4a
semi-analytical and generalized Stroh formalism
ð21Þ
approach. Their values can be given in terms of
materials eigenvalues Pa, matrices MMa and NaN and 3.1 Definition of crack configuration
eigenvectors AMa [Kuna (2006); Rao and Kuna
(2008)] as For defining the cracks face geometry in a piezoelec-
 tric domain, a numerical method called level set
X 4
Mia NaN Pa
fi1N ¼  Re pffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi ð14Þ method (LSM) suggested by Osher and Sethian (1988)
a¼1 cos h þ Pa sin h is being applied for many years in fracture mechanics
simulation and later adopted for use in XFEM. Further
X
4 
Mia NaN LSM proposed by Stolarska has been used for the
fi2N ¼ Re pffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi ð15Þ representation of open boundaries. In a 2-D domain,
a¼1 cos h þ Pa sin h
the crack is essentially outlined by incorporating two
X
4  level set functions, firstly the normal level set (w1) i.e.
M4a NaN Pa
gN1 ¼  Re pffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi ð16Þ a signed distance to the surface of the crack and
a¼1 cos h þ Pa sin h
secondly the tangent level set (w2), i.e. a signed
 distance to the plane and perpendicular to the surface
X
4
M4a NaN
gN2 ¼ Re pffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi ð17Þ of the crack associated with the level set method. Thus,
a¼1 cos h þ Pa sin h zero normal level set and negative of the tangent level
set altogether represent the crack surface whereas

123
 R. Mishra et al.

X    
intersection of two zero level sets define the crack u h ð xÞ ¼ Nj ðxÞ uj ðxÞ þ H ðxÞ  H xj aj
front. j2N
6 h 
X 
ðreÞ ðimÞ
3.2 XFEM approximation for cracks þ bc r, h; lk ; lk
c¼1
 i
In XFEM (Pathak 2012; Singh et al. 2011; Kumar ðreÞ ðimÞ
bc xj ; lk ; lk bcj 
2014; Yu 2016) framework, the partition of unity
enrichment is applied on the selected nodes by ð24Þ
incorporating local enrichment functions within the In the above equation, Nj ðxÞ is the isoparametric
finite element approximation. The set of nodes for the linear quadrilateral FEM shape function associated
discretized piezoelectric domain selected for enrich- with node j. Here, Tj, uj, uj are the vectors of nodal
ment are shown in Fig. 2. Crack surface are assumed degree of freedom containing the nodal temperatures,
to be impermeable. XFEM enriched approximation for nodal displacements and nodal electric potentials
the adiabatic temperature, displacement and electric while aj and bcj are the enriched additional degree of
potential can be expressed as given below: freedom in the elements associated with the crack.
X    
T h ð xÞ ¼ Nj ðxÞ Tj ðxÞ þ H ðxÞ  H xj aj H ðxÞ is the Heaviside enrichment function that model
j2N the crack strong discontinuity. This function is used
6 h 
X  for the element which has been completed cut by crack
ðreÞ ðimÞ
þ bc r, h; lk ; lk surface.
 
c¼1 ðreÞ ðimÞ
 i i bc r,h; lk ; lk are the six asymptotic near
ðreÞ ðimÞ
bc xj ; lk ; lk bcj crack-tip enrichment functions where origin lies at the
ð22Þ crack-tip with ðr; hÞ being the polar coordinate
ðreÞ ðimÞ
X     system. While r ¼ jjx  xtip jj and lk ; lk repre-
h
u ð xÞ ¼ Nj ðxÞ uj ðxÞ þ H ðxÞ  H xj aj sents the real part and the imaginary part of a complex
j2N number lk .
6 h 
X  Thus, standard discrete systems of equations can be
ðreÞ ðimÞ
þ bc r, h; lk ; lk ð23Þ
obtained on further substitution of approximate func-
f dC
 i i tions Eqs. (22–24) into the weak form (Piefort 2001)
ðreÞ ðimÞ
bc xj ; lk ; lk bcj of governing equations as shown below:

Fig. 2 Discretized
piezoelectric domain with
multiple edge cracks

123
Crack interaction study in piezoelectric materials

Z
½K fT g ¼ f f g ð25Þ
fia ¼ Ni ðH ð xÞ  H ðxi ÞÞ t dC
½K fug ¼ f f g ð26Þ oX e
Z
Here K, f are the global conduction/stiffness matrix, þ Ni ðH ð xÞ  H ðxi ÞÞ f dC ð34Þ
and the external heat/force vector while u and T are oXe

global nodal displacement vector and global nodal

temperature vector. Using the approximation function Z   
ðreÞ ðimÞ
defined in Eqs. (22–24), the elemental stiffness matrix fib ¼ Ni bc r; h; lk ; lk
and global elemental force vector for the enriched
oXe
elements are defined as:  
ðreÞ ðimÞ
2 UU 3  bc xi ; lk ; lk t dC
Kij KijUa KijUb Z  ð35Þ
6 7 ðreÞ ðimÞ
Kije ¼ 4 KijaU Kijaa Kijab 5 ð27Þ þ Ni bc ðr; h; lk ; lk Þ
KijbU Kijba Kijbb oXe

ðreÞ ðimÞ
n oT bc ðxi ; lk ; lk Þ f dC
b b b b b b
fie ¼ fiU ; fia ; fi 1 ; fi 2 ; fi 3 ; fi 4 ; fi 5 ; fi 6 ð28Þ
whereas t and f represent the prescribed extended
tractions and the extended forces per unit volume,
Z   respectively. BU a c b
 r T i , Bi and Bi are defined as the
Kijrs ¼ Bi case C Bsj dX ð29Þ matrices of shape functions derivatives given by:
case
X e
2 3
Si;x 0 0
where {(r, s = U, a, b) is the case and defined as 60 Si;y 0 7
6 7
(case = thermal, electro-elastic)}. Bi ¼ 6 Si;y Si;x 0 7
s 6
7; s ¼ U; a ð36Þ
( 40 0 Si;x 5
Cek for electro  elastic equation 0 0 Si;y
C¼
Cth for heat conduction equation
ð30Þ h i
b b b b b b
Bbi ¼ Bi 1 Bi 2 Bi 3 Bi 4 Bi 5 Bi 6 ð37Þ
The generalized constitutive matrix Cek for 2-D
homogeneous and linear isotropic piezoelectric solids whereas it is given in Eq. (36) that the term S is different
under plane strain state can be given as for BU a
as S = N when Bsi = BU
i and Bi i , and
2 3
C11 C12 C16 e11 e21 S = N[H(x) - H(xi)]when Bsi = Bai , while the other term
6 C21 C22 C26 e12 e22 7 b
Bi c has the same form as the matrices BU a
6 7 i and Bi in
6
Cek ¼ 6 C61 C62 C66 e16 e26 7 ð31Þ (re) (im)
7 Eq. (24), thus S = N[bc(r, h, lk , lk ) -
4 e11 e12 e16  211  212 5
bc(xi, l(re)
k , l (im)
k )].
e21 e22 e26  221  222 In XFEM framework, discontinuous elements

 imply sub-triangulation for the purpose of numerical
k11 0 integration. This scheme adopts element sub-division
Cth ¼ ð32Þ
0 k22
method by triangulation of the split element and tip
Z Z element. Hence, accurate numerical integration
fiU ¼ Ni t dC þ Ni f dC ð33Þ achieved through the discontinuous element by imple-
oX e
oX e menting sub-triangulation and higher order Gaussian
quadrature rules.

123
 R. Mishra et al.

3.3 Enrichment functions for cracked The transformed form of the radius and angle can
piezoelectric domain be written in the form as:

H(x) is the Heaviside enrichment function that model   p  

ðreÞ ðimÞ h
the crack strong discontinuity and can be defined as wk h; lk ; lk ¼ þ p int
2 p
follows: 0 1
   h ðreÞ   h
þ1 if ðx  x*Þ  n  0 B cos h  p int þ l k sin h  p int p C
 arctan@  p   A
HðxÞ ¼ ð38Þ  ðimÞ 
1 otherwise lk  sin h  p int ph

Six near crack-tip enrichment functions as given by ð43Þ

the term bc(r, h, l(re) (im)
k , lk ) in Eqs. (22–24) proposed
In the above Eqs. (42) and (43), three distinguished
by Béchet et al. (2009) were implemented in this work
values of the transformed radii and angles are corre-
for piezoelectric solids, those are obtained from the
sponding to their eigenvalue and the remaining values
general solution of a semi-infinite crack in an infinite
are their conjugates only.
domain by using the general power functions which are
extended in Laurent series expansion as shown below:
  pffiffi 3.4 SIF calculation
ðreÞ ðimÞ
bc r; h; lk ; lk ¼ r fd1 ðhÞ; d2 ðhÞ; d3 ðhÞ;
In the present work, domain based interaction integral
d4 ðhÞ; d5 ðhÞ; d6 ðhÞg approach is used to extract the numerical SIFs. In this
ð39Þ approach, a contour integral is expressed in terms of
8   volume integral over a finite domain surrounding the
ðreÞ ðimÞ
>
>   wk ; lk ; lk crack front. Two states of the stress are superimposed
>
> ðreÞ ðimÞ ðimÞ
< qk h; lk ; lk cos if lk [0
dk ðhÞ ¼  2  with each other to extract the individual SIFs. The
>
>   w l
ðreÞ ðimÞ
>
> k ; k ; lk path-independent electro-mechanical J-integral given
: ðreÞ ðimÞ
qk h; lk ; lk sin if lk
ðimÞ
0
2 by Kuna (2010, 2006) for piezoelectric materials is
ð40Þ given as:
Z  
Characteristic equation for piezoelectric material oui ou
can be written as (Béchet et al. 2009): J¼ Hd1j  rij  Dj nj dC ð44Þ
ox1 ox1
C
C11 211 l6k þ ½C11 222 þð2C12 þ C33 Þ 211
 whereas H = (rijem m
ij - DiEi ), which is the electric
þ e12 ðe12 þ 2e13 Þ þ e213 l4k
enthalpy density defined for the thermo-electro-me-
þ ½C22 211 þð2C12 þ C33 Þ 222
 chanical boundary conditions, nj is the outward unit
þ 2e22 ðe12 þ e13 Þ l2k þ C22 222 þ e222 ¼ 0 normal vector to the arbitrary contour C which
ð41Þ encloses the tip of the crack and dij is the kronecker
delta. Crack surfaces are considered to be mechani-
The complex numbers lk = l(re)
k ? il(im)
k are the
cally traction-free and also electrically-insulated as
numbers having the six roots of the characteristic
given as a boundary condition. Here, the terms emij and
Eq. (41).
Em
j are the electro-mechanical part of the strain and

 
ðreÞ ðimÞ
qk h; lk ; lk
sffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi


1 4  ðreÞ 2  ðimÞ 2  ðreÞ 2 2  2  ð42Þ
ðreÞ ðimÞ
¼ pffiffiffi lk þ lk þ lk sin 2h  lk þ lk 1 cos 2h
2

123
Crack interaction study in piezoelectric materials

electrical field are given by em ij = (eij - aijDT) and calculations in the above equation, one can write the J-
Emj = (E j - g jDT) where a ijand gj are the coefficients integral for the combination of both the states 1, 2 as:
of thermal expansion tensor and pyroelectric field
J ðsÞ ¼ J ð1Þ þ J ð2Þ þ I ð1;2Þ ð48Þ
constants that are further related with temperature
stress coefficients kij and pyroelectric displacement Here J ð1Þ and J ð2Þ is the J-integrals of state 1 and
constants vi. state 2 for the thermo-electro-mechanical problem.
( )
( ) Therefore, the thermo-electro-mechanical interaction
aks Cijks eiks kij integral I(1,2) can be written in elaborate form as given
¼ ð45Þ
gs e ijs 2is vi below:
Z ð1Þ ð2Þ ð2Þ
After implementing the Gauss-divergence theorem, ð2Þ oui ð1Þ oui ð1Þ ou
I ð1;2Þ ¼ rij þ rij þ Dj
contour integral can be converted into area integral as: ox1 ox1 ox1
Z   A

oui ou oq ð1Þ
J¼ rij þ Dj  Hd1j dA ð46Þ ð2Þ ou oq
ox1 ox1 oxj þDj  H ð1;2Þ d1j dA
A
ox1 oxj
Z  
whereas q is an arbitrary scalar smooth weight ð2Þ oDT ð2Þ oDT
þ rij aij þ D j gj q dA
function where the value of q is 1 at the tip of the ox1 ox1
A
crack and zero along the domain boundary.
ð49Þ
The Eq. (46) has been obtained by implementation
orij oDi where
of equilibrium conditions as oxj ¼ 0; oxi ¼ 0 and
compatibility
  
conditions

as 1  ð2Þ m ð1Þ ð2Þ ð1Þ ð2Þ ð2Þ

ouj ou
H ð1;2Þ ¼ rij eij þ rij eij  Dj Ej  Dj Ejm
1 oui 2
eij ¼ 2 oxj þ oxi ; Ei ¼  oxi , noting that
  ð50Þ
oCijkl oeikl o2im
ox1 ¼ 0; ox1 ¼ 0 ; and ox1 ¼ 0 for homogeneous
For piezoelectric materials, according to Rao and
piezoelectric materials; further, the domain form of
Kuna (2010), the electro-mechanical interaction-inte-
contour integral for the homogeneous thermo-piezo-
gral can be expressed as:
electric media (Rao and Kuna 2010) can be written as:
1 T
Z   J¼ K YNM KM ð51Þ
oui ou oq 2 N
J¼ rij þ Dj  Hd1j dA
ox1 ox1 oxj
A whereas KM is defined as f KI KII KIII KIV gT ,
Z  
oDT oDT which is the vector of SIFs of all fracture modes, and
þ rij aij þ Dj gj q dA ð47Þ
oxj ox1 the matrix YNM is the generalized Irwin matrix that
A relies only on elastic moduli, piezoelectric constants
Let us consider state 1 related to actual state of and dielectric materials constants and can be
displacement, strain, stress fields coming from the expressed as (Rao and Kuna 2010):
solution of boundary value problem of attention, and X
4
state 2 is related to auxiliary state that is the near crack YNM ¼  Im fAMa NaN g ð52Þ
tip electro-mechanical fields of fracture given in a¼1
Eqs. (10–13). The equation of interaction energy
Here Im represents the imaginary part of the
integral can be derived by considering the addition
quantity in bracket. Therefore, the interaction integral
of the actual and auxiliary state fields in the equation
for two dimensional piezoelectric domain problem
of the domain based form of thermo-electro-mechan-
may be expressed as
ical J-integral as given in Eq. (47). Further expanding
and manipulating the J-integral by doing algebraic

123
 R. Mishra et al.

ð1Þ ð2Þ ð1Þ ð2Þ

I ð1;2Þ ¼ KII KII Y11 þ KI KI Y22 þ KIV KIV Y44
ð1Þ ð2Þ 4.1 Benchmark problem study
 
ð1Þ ð2Þ ð1Þ ð2Þ
þ KI KII þ KII KI Y12 First, consider a finite two-dimensional piezoelectric
  plate as shown in Fig. 3 which is subjected to uniform
ð1Þ ð2Þ ð1Þ ð2Þ
þ KII KIV þ KIV KII Y14 in-plane mechanical tensile loading ryy = 1 MPa and
 
ð1Þ ð2Þ ð1Þ ð2Þ
þ KI KIV þ KIV KI Y24 also applying electric displacement loading Dy-
= 0.001 C/m2 on the remote boundary. Polarization
ð53Þ direction is considered along the Y-axis. Let us
assume, crack surface to be mechanically traction-
free and also impermeable (electrically insulated). As
shown in the Fig. 3, a 2-D homogeneous piezoelectric
4 Numerical results and discussion
plate with an edge crack of crack length a = 0.4 mm,
width of specimen W = 2 mm and height of the
Numerical solution of the thermo-electro-mechanical
specimen is taken as L = 2 9 W = 4 mm. All the
fracture problems considered in the current study
boundary conditions are given in the Fig. 3.
needs calculation of temperature, displacement and
The obtained results are compared with analytical
stress fields in piezoelectric materials. Therefore, for
values given by Liu (2009), Wang and Mai. (2002a, b)
the purpose of validating the accuracy of the XFEM
and presented in Tables 2, 3, 4 and 5. Wang and Mai
approach, some numerical cases were presented. In
have implemented Fourier transforms technique to
this study, piezoelectric material PZT-5H have been
reduce the problem to the solution of singular integral
taken throughout the paper, their material properties
equations. This analytical technique is much more
are provided in the Table 1 (Bhargava and Jangid
accurate and robust to solve impermeable crack
2014). Crack faces are considered to be impermeable
problems in piezo-electric domain (Fulton and Gao
and all the numerical results have been calculated for
2001; Sih and Zuo 2000; Soh et al. 2001; Wang 2000;
impermeable crack face boundary conditions in this
Wang and Noda 2000). Considering the accuracy and
work.
effectiveness of reference results (Wang and Mai.
2002a, b), accuracy of obtained XFEM results have
been checked and presented in tabular form. The
numerically calculated results in the form of intensity

Table 1 Material Parameter Numerical value

properties of piezoelectric
material (PZT-5H) for Elastic constants C110 12.6 9 1010 Pa
numerical simulation
C220 11.7 9 1010 Pa
C120 5.3 9 1010 Pa
C130 5.5 9 1010 Pa
C440 3.53 9 1010 Pa
Piezoelectric constants e210 - 6.5 9 109 N/(GVm)
e220 23.3 9 109 N/(GVm)
e160 17.0 9 109 N/(GVm)
Dielectric permittivities e110 15.1 9 109 N/(GV)2
e220 13.0 9 109 N/(GV)2
Temperature stress coefficients k10 1.9738 9 106 Pa/K
k20 1.4165 9 106 Pa/K
Pyroelectric displacement constants v10 0 N/(GVmK)
v20 - 5.4831 9 103 N/(GVmK)
Coefficients of thermal conductivity k10 50 W/(km)
k20 75 W/(km)

123
Crack interaction study in piezoelectric materials

Fig. 3 Model geometry of

the specimen with an edge
crack

Table 2 Normalized SIFs a/W Analytical result (Liu 2009) XFEM result Normalized value KI % error in KI
pffiffiffiffiffiffi
(KI =r pa) for different
crack size 0.1 0.0250 0.0234 0.936 - 6.4
0.2 0.0354 0.0355 1.002 0.28
0.3 0.0434 0.0431 0.993 - 0.69
0.4 0.0501 0.0500 0.998 - 0.10
0.5 0.0560 0.0591 1.055 5.5
0.6 0.0613 0.0632 1.030 3.0

 pffiffiffi 
Table 3 Normalized SIFs KI ryy a for different crack size for Dy ðe22 =c22 Þryy ¼ 0

a/W Normalized value KI (Wang and Mai 2002a, b) Normalized value KI (XFEM) % error in KI

0.1 1.2012 1.1757 - 2.12

0.2 1.3547 1.2975 - 4.22
0.3 1.6589 1.5973 - 3.71
0.4 2.2552 2.1785 - 3.40
0.5 2.8184 2.7214 - 3.44
0.6 3.9011 3.8040 - 2.49

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 R. Mishra et al.

pffiffiffiffiffiffi
Table 4 Normalized SIFs (KIV =D pa) for different crack size
a/ Analytical result (Liu XFEM result Normalized value % error in KIV % error in KIV (Bhargava and
W 2009) (present) KIV (present) Sharma 2011)

0.1 0.0250e-3 0.028e-3 1.12 12.0 12.44

0.2 0.0354e-3 0.045e-3 1.27 26.97 27.64
0.3 0.0434e-3 0.061e-3 1.41 40.55 41.78
0.4 0.0501e-3 0.070e-3 1.40 39.72 40.45
0.5 0.0560e-3 0.078e-3 1.39 39.28 40.21
0.6 0.0613e-3 0.081e-3 1.32 32.14 32.88

 pffiffiffi depicted in Table 5. It is observed that our proposed

Table 5 Normalized SIFs KIV ðe22 =c22 Þryy a for different

crack size for Dy ðe22 =c22 Þryy ¼ 0 XFEM results are in good agreement with the
analytical solution.
a/ Normalized value KIV Normalized % error
W (Wang and Mai 2002a, b) value KIV in KIV
Further, the same finite two-dimensional piezo-
(present) electric plate as shown in Fig. 3 is simulated with
different geometrical parameter and obtained results
0.1 0.4274 0.4366 2.15 compared with analytical results. The problem geom-
0.2 0.8419 0.8670 2.98 etry is subjected to uniform in-plane mechanical
0.3 1.2257 1.2722 3.79 tensile loading ryy = 1 MPa and also applying elec-
0.4 2.1074 2.1758 3.24 tric displacement loading Dy = 0.001 C/m2 on the
0.5 3.4841 3.5937 3.14 remote boundary. Polarization direction is considered
0.6 6.1190 6.4122 4.79 along the Y-axis. Let us assume, crack surface to be
mechanically traction-free and also impermeable
(electrically insulated). As shown in the Fig. 3, a
factors (KI and KIV) are normalized and presented in 2-D homogeneous piezoelectric plate with an edge
the form of normalized value of intensity factors with crack of crack length a = 1.6 mm, width of specimen
respect to crack size to specimen width ratio a/W as W = 8 mm and height of the specimen is taken as
given in the Table. The comparative difference of L = 2 9 W = 16 mm. All the boundary conditions
presented XFEM results (KIV) with Liu (2009) are are shown as given in the Fig. 3.
relatively higher but agrees well with the existing The comparative analyses of SIFs are shown in
literature (Bhargava and Sharma 2011) as presented in Tables 6 and 7. The comparative difference of
Table 4. Bhargava and Sharma have reported XFEM presented XFEM results (KIV) with Liu (2009) are
solutions for impermeable crack in piezo-electric relatively higher but agrees well with the existing
domain. To check the numerical results rigorously, literature (Bhargava and Sharma 2011) as presented in
the obtained XFEM results for (KIV) are also com- Table 7. Bhargava and Sharma have reported XFEM
pared with Wang and Mai (2002a, b) solutions as solutions for impermeable crack in piezo-electric
domain.

Table 6 Normalized SIFs a/W Analytical result (Liu 2009) XFEM result Normalized value KI % error in KI
pffiffiffiffiffiffi
(KI =r pa) for different
crack size 0.1 0.0501 0.0454 0.9061 - 9.3
0.2 0.0708 0.0709 1.0014 0.14
0.3 0.0868 0.0862 0.9930 - 0.69
0.4 0.1002 0.1000 0.9980 - 0.19
0.5 0.1120 0.1211 1.0815 8.12
0.6 0.1227 0.1229 1.0016 0.016

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Crack interaction study in piezoelectric materials

pffiffiffiffiffiffi
Table 7 Normalized SIFs (KIV =D pa) for different crack size
a/ Analytical result (Liu XFEM result Normalized value % error in KIV % error in KIV (Bhargava and
W 2009) (present) KIV (present) Sharma 2011)

0.1 0.0501e-3 0.056e-3 1.11 11.77 12.19

0.2 0.0708e-3 0.090e-3 1.27 27.11 27.91
0.3 0.0868e-3 0.111e-3 1.28 27.88 28.57
0.4 0.1002e-3 0.131e-3 1.30 30.73 31.20
0.5 0.1120e-3 0.160e-3 1.42 42.85 43.02
0.6 0.1227e-3 0.153e-3 1.24 24.69 25.28

Further, XFEM results are also validated for
thermal response in single edge cracked piezo-electric
domain. For this purpose, a temperature gradient has
been imposed at cracked piezo-domain. In post-
processing stage, normalized KI and KIV have been
obtained at different crack length and compared with
existing results of Ueda and Ikawa (2008) as shown in
Tables 8 and 9.
After the comparative analyses, crack interaction
cases were solved by using proposed approach.
Description of the considered problem domains are
presented in the Figs. 4, 5, 6 and 7. These crack
interactions have been studied under three different
phases of loading environment. (a) Only mechanical
loading (b) Only electrical loading (c) Combined
thermo-electro-mechanical loading. Geometry of the
piezoelectric plate taken throughout the study has
dimension of 100 9 200 mm. In our current study,
polarization direction is considered along the y-axis.
Let us assume, crack surface to be mechanically
traction-free and also impermeable (electrically insu-
lated). Here, the following data are used for the crack
interaction study in piezoelectric material throughout
this paper:
• Plate loading:
(a) Uniform mechanical tensile load, ryy= 1 MPa.
(b) Uniform electrical displacement load,
Dy= 0.001 C/m2.
(c) Adiabatic thermal load, T1 = 0 C and
T1 = 50 C.
• FEM mesh: 100 9 200 nodes.
• Enrichment functions: six fold basis enrichment
functions.
The piezoelectric material considered in this paper
for the crack interaction study is PZT-5H used
throughout the paper are listed in Table 1. A plane
strain condition is considered in all simulations.
A generalized MATLAB code has been developed
for crack interaction study in 2-D homogeneous
piezoelectric solids using XFEM approach to obtain
the results in terms of SIFs and stress contours. In
order to capture the effect of discontinuities, extrinsic
enrichment scheme has been employed for the piezo-
electric material. Standard Gauss quadrature numer-
ical integration scheme of two by two gauss
quadrature has been performed for all non-enriched
elements, whereas 4th order for the Gauss quadrature
has been used for enriched elements. In order to
calculate the SIFs, Gaussian quadrature scheme of 8th
order is implemented by incorporating into the
domain-based J-integral. Here, thermo-electro-me-
chanical crack problem is solved by decoupling the
problem into the thermal and electro-mechanical
problem. Firstly, unknown temperature field is
extracted for the thermal fracture problems in piezo-
electric materials by solving the 2-D steady state
Fourier heat conduction equation and then the
extracted temperature field is further employed as an
input load for the electro-mechanical problem in order
to find the electric potential, displacement and the
stress field. Finally, the stress intensity factors are
extracted by implementing thermal interaction-inte-
gral technique for the thermal fracture problem in
piezoelectric materials. In thermal simulations, adia-
batic crack problem is solved for the thermal fracture
analysis of piezoelectric materials. According to the
nature of the thermal boundary conditions that is
applied on the piezoelectric plate in all the simula-
tions, temperature, the electric potential and displace-
ment fields are discontinuous across the crack-faces
for the adiabatic crack problem. Here, heat fluxes are
appeared to be singular at the tip of crack. In this

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 R. Mishra et al.

pffiffiffiffiffiffi
Table 8 Normalized intensity factors KI =ðk220 DT paÞ for different crack size
a/W Analytical results (Ueda and Ikawa 2008) XFEM result Normalized value KI % error in KIV

0.06 1.3587 1.3855 1.0197 1.97

0.08 1.5689 1.5883 1.0123 1.23
0.1 1.7541 1.8033 1.0280 2.80
0.12 1.9216 1.9571 1.0184 1.84
0.14 2.0752 2.1124 1.0179 1.79
0.16 2.2189 2.3011 1.0370 3.70

pffiffiffiffiffiffi
Table 9 Normalized intensity factors KIV =ðv20 DT paÞ for different crack size
a/W Analytical results (Ueda and Ikawa 2008) XFEM result Normalized value KIV % error in KIV

0.06 1.3587e-3 1.4007e-3 1.0309 3.09

0.08 1.5689e-3 1.6192e-3 1.0320 3.20
0.1 1.7541e-3 1.8223e-3 1.0388 3.88
0.12 1.9216e-3 1.9943e-3 1.0378 3.78
0.14 2.0752e-3 2.1744e-3 1.0478 4.78
0.16 2.2189e-3 2.3271e-3 1.0487 4.87

approach, Heaviside enrichment function is employed
in order to take the effect of discontinuities for the
electric potential field, the temperature field and the
displacement field while six crack tip enrichment
functions are incorporated in the for modeling the
singularity for the heat fluxes and the stress field. In all
the simulations, cracks are assumed to be thermally
insulated, electrically impermeable and traction-free
whereas thermally insulated crack creates discontinu-
ity in temperature field. The temperature based
essential boundary conditions are imposed based on
Lagrange-multiplier techniques for quasi-static crack
propagation in piezoelectric materials.
4.2 Mechanical loading
A homogeneous piezoelectric cracked plate of dimen-
sion 100 mm 9 200 mm has been simulated for
mechanical loading conditions. FEM mesh with
uniformly distributed 100 9 200 nodes (total 20,000
nodes) have been created within the rectangular
piezoelectric domain. In this phase, the applied
loadings on the remote boundary of a finite piezo-
electric plate are ryy = 1 MPa and Dy = 0 C/m2.
4.2.1 Double-edged crack on same side
In this case, a piezo-electric plate containing two equal
edge cracks of length, A = 30 mm (crack1) and
a = 30 mm (crack2); both cracks are positioned at
left edge. It can be seen from the Fig. 5 that the
mechanical, the electrical and the thermal loadings
applied on the piezoelectric plate are considered for
the crack interaction study. Polarization direction is
considered along the Y-axis. Crack1 is a horizontal
edge crack positioned at the half height of the domain.
Crack2 is an inclined edge crack, spaced at a distance
of 30 mm from crack2. The geometric configuration
of the specimen with crack2 of orientation angle
h = - 30–70 are shown in the Fig. 4 and the value
of orientation angle h is assigned with the increment of
10 at each simulation.
The initial crack2 orientation is kept at - 30 with
the horizontal and an increment of 10 is assigned at
every step i.e. - 30 B h B 70. The analysis is done
by considering eleven different values of crack2
inclination angle h, e.g. - 30 B h B 70. The vari-
ation in intensity factors (SIFs) values at crack tips of
two edge cracks with respect to crack2 inclination
angle h are presented in the Fig. 8a, b, c. From Fig. 8a,
b, c, it is concluded that the SIFs KI and KIV at tip1 of
crack1 decrease for the values of - 30 B h B - 10

123
Crack interaction study in piezoelectric materials
Fig. 4 Homogeneous
piezoelectric plate with
double-edged crack on same
side
and then increase for values of - 10 B h B 70 with
crack2 orientation h; while KII at tip1 of crack1
increases for the values of - 30 B h B 0 and then
decreases for values of 0 B h B 70 in crack2
orientation h. The SIFs KI and KIV at tip2 of crack2
slightly increase for the values of - 30 B h B 0 and
then decrease for the values of 0 B h B 70 in crack2
orientation h while KII at tip2 of crack2 slightly
increases for values of - 30 B h B - 10 and then
it follows sine curve for values of 0 B h B 70 in
crack2 orientation h. From the above discussion, it can
be marked that KI value for crack1 displays an
increasing fashion with the increasing crack2 inclina-
tion angle. For maximum values of crack2 inclination
angle h, the tip of crack1 goes away from crack2 tip,
thereby the value of KI remains unaffected. Thus,
when the value of h is less, KI value of crack1 is
minimized due to existence of crack2 tip.
From the above discussion for the SIFs variation
with crack inclination angle (h), it is concluded that
SIFs values are maximum when crack inclination
angle h = 08 because the in-plane applied mechanical
loading are perpendicular to the crack plane and it
induces mode-I (opening mode) loading to cracked
geometry. Further, the inclined crack geometry
induces mixed mode loading condition which reduced
the KI and increases KII.
Further, the same plate with double edge crack on
same side has been studied for crack offset distance.
The geometric configuration of the specimen with
multiple cracks is shown in the Fig. 7 and the value of
their separation d is assigned with the increment of
10 mm at each simulation. The initial distance of their
separation d between the two cracks is kept as 60 mm
and a decrement of 10 mm is assigned at every step i.e.
60 C d C10 mm. The analysis is done by considering
six different values of d. The variation in the values of
SIFs (Intensity Factors) at two different tips of double
edge cracks with respect to d is presented in the
Fig. 9a, b, c. From the Fig. 9a, b, c, it is concluded that
123

Fig. 5 Homogeneous
piezoelectric plate with
double-edged crack on
opposite side
the SIFs KI and KIV at tip1 of crack1 decrease for the
values of 60 C d C 10 mm while KII at tip1 of crack1
increase for the values of 60 C d C 30 mm and then
decrease for the values of 30 C d C 10 mm. The SIFs
KI and KIV at tip2 of crack2 decrease for values of
60 C d C 10 mm while KII at tip2 of crack2 also
decrease for the values of 60 C d C 30 mm.
From these numerical results, it is concluded that
SIFs values at the higher inter-crack distance are
maximum because the crack shielding effect of crack-
tips. The existence of crack2 lowers the value of KI of
crack1, whereas KII value becomes nonzero. There-
fore, there is remarkable shielding effect on KI value of
crack1 because of the presence of crack2.
4.2.2 Double-edged crack on opposite side
A homogeneous piezoelectric plate of dimension
100 mm 9 00 mm containing two equal edge cracks
of length, A = 30 mm (crack 1) and a = 30 mm
123
R. Mishra et al.
(crack2); positioned at opposite side is investigated
in this section. The geometric configuration of the
specimen is shown in the Fig. 5. The initial crack2
orientation is kept at -708 with the horizontal and an
increment of 108 is assigned at every step i.e.
- 70 B h B 70. The analysis is done by consider-
ing eleven different values of crack2 inclination angle
h, e.g. - 70 B h B 70. The variation in the values
of SIFs (Intensity Factors) at two different tips of
double edge cracks with respect to crack2 inclination
angle h is presented in the Fig. 10a, b, c. From the 10a,
b, c, it is concluded that the SIFs KI and KIV at tip1 of
crack1 decrease for the values of - 70 B h B - 10
and 50 B h B 70 and then increase for the values of
- 10 B h B 50 in crack2 orientation h; while KII at
tip1 of crack1 decreases for the values of - 70 B h
B - 10 and then increases for values of - 10 B h
B 70. The SIFs KI and KIV at tip2 of crack2 slightly
increase for the values of - 70 B h B 0 and
10 B h B 20 and then decrease for the values of
Crack interaction study in piezoelectric materials
Fig. 6 Homogeneous
piezoelectric plate with
double-edged crack on
opposite side
0 B h B 10 and 20 B h B 70. For crack2 orien-
tation h, KII at tip2 slightly decreases for the values of
- 70 B h B - 40 and increases for values of
- 40 B h B 20 then it follows sine curve for values
of 20 B h B 70 in crack2 orientation h.
From the above discussion it may be concluded
that, SIFs values are maximum when crack inclination
angle h = 08 because the in-plane applied mechanical
loading are perpendicular to the crack plane.
Further, the cracked geometry has been investi-
gated for crack length effect. For this purpose,
piezoelectric plate of size with dimension 100 mm 9
200 mm containing double-edged cracks of crack1
length, A = 20 mm and crack2 length, a = 20 mm has
been conceded at opposite side. The geometric
configuration of the specimen with double-edged
cracks is shown in the Fig. 6. Initially crack2 length
is kept as 20 mm and an increment of 5 mm is
assigned at every simulation steps i.e. 20 B a B 70
mm. The analysis is done by considering eleven
different values of crack2 length (a). The variation in
the values of intensity factors (SIFs) at both crack tips
is presented in the Fig. 11a, b, c. From the Fig. 11a, b,
c, it is concluded that KI and KIV at tip1 of crack1
decrease for the values of 20 B a B 70 with crack2
length, while KII at tip1 of crack1 also decreases for
the values of 20 B a B 70 with crack2 length. The
SIFs KI and KIV at tip2 of crack2 slightly increase for
the values of 20 B aB70 in crack2 length, whereas KII
at tip2 of crack2 slightly decreases for the values of
20 B a B70. From the above discussion, it is con-
cluded that SIFs values at the crack are maximum
when its crack length is increased and the values are
minimum where the crack length is less.
4.3 Electrical loading
In this phase, the cracked piezo-electric plate has been
simulated under electrical loading environment. For
123

Fig. 7 Homogeneous
piezoelectric plate with
double-edged crack on same
side
the simulation cases, a finite piezoelectric plate are
subjected to ryy = 0 MPa and Dy = 0.001 C/m2.
4.3.1 Double-edged crack on same side
In this case, a piezo-electric plate containing two equal
edge cracks of length, A = 30 mm (crack1) and
a = 30 mm (crack2); both cracks are positioned at
left edge. The applied polarization direction is
considered along the Y-axis. Crack1 is a horizontal
edge crack positioned at the half height of the domain.
Crack2 is an inclined edge crack, spaced at a distance
of 30 mm from crack2. The geometric configuration
of the specimen with crack2 of orientation angle
123
R. Mishra et al.
h = - 30–70 are shown in the Fig. 4 and the value
of orientation angle h is assigned with the increment of
10 at each simulation results.
The initial crack2 orientation is kept at - 30 with
the horizontal and an increment of 108 is considered at
every step i.e. - 30 B h B 70. The analysis is done
by considering eleven different values of crack2
inclination angle h, e.g. - 30 B h B 70. The vari-
ation in the values of SIFs (Intensity factors) at two
different tips of two edge cracks with respect to crack2
inclination angle h is presented in Fig. 12a, b, c. From
the Fig. 12a, b, c, it is concluded that the SIFs (KI and
KIV) at tip1 of crack1 decrease for values of - 30 B
h B - 20 and further increase for the values of
Crack interaction study in piezoelectric materials

Fig. 8 a Variation of KI (a)

with crack orientation for
double-edged crack on same
side under mechanical
tensile load. b Variation of
KII with crack orientation
for double-edged crack on
same side under mechanical
tensile load. c Variation of
KIV with crack orientation
for double-edged crack on
same side under mechanical
tensile load

(b)

(c)

123
 R. Mishra et al.

Fig. 9 a Variation of KI (a)

with inter-crack distance
d for double-edged crack on
same side under mechanical
tensile load. b Variation of
KII with inter-crack distance
d for double-edged crack on
same side under mechanical
tensile load. c Variation of
KIV with inter-crack
distance d for double-edged
crack on same side under
mechanical tensile load

(b)

(c)

123
Crack interaction study in piezoelectric materials

Fig. 10 a Variation of KI
with crack orientation for
(a)
double-edged crack on
opposite side under
mechanical tensile load.
b Variation of KII with crack
orientation for double-edged
crack on opposite side under
mechanical tensile load.
c Variation of KIV with
crack orientation for double-
edged crack on opposite side
under mechanical tensile
load

(b)

(c)

123
 R. Mishra et al.

Fig. 11 a Variation of KI
with crack2 length for
(a)
double-edged crack on
opposite side under
mechanical tensile load.
b Variation of KII with
crack2 length for double-
edged crack on opposite side
under mechanical tensile
load. c Variation of KIV with
crack2 length for double-
edged crack on opposite side
under mechanical tensile
load

(b)

(c)

123
Crack interaction study in piezoelectric materials

Fig. 12 a Variation of KI
with crack orientation for
(a)
double-edged crack on same
side under electrical load.
b Variation of KII with crack
orientation for double-edged
crack on same side under
electrical load. c Variation
of KIV with crack orientation
for double-edged crack on
same side under electrical
load

(b)

(c)

123
 R. Mishra et al.

Fig. 13 a Variation of KI
with inter-crack distance
(a)
d for double-edged crack on
same side under electrical
loading. b Variation of KII
with inter-crack distance
d for double-edged crack on
same side under electrical
loading. c Variation of KIV
with inter-crack distance
d for double-edged crack on
same side under electrical
loading

(b)

(c)

123
Crack interaction study in piezoelectric materials
- 20 B h B 70 in crack2 orientation h while KII at
tip1 of crack1 increases for the values of - 30 B h
B - 20 and then decreases for the values of
- 20 B h B 70 in crack2 orientation h. The SIFs
KI and KIV at tip2 of crack2 decrease for the values of
- 30 B h B 70 in crack2 orientation h while KII at
tip2 of crack2 slightly increases for the values
- 30 B h B - 10 and then it follows sine curve
for the values of 0 B h B 70 in crack2 orientation.
Therefore, it is concluded that SIFs values are
maximum when crack inclination angle h = 0
because the in-plane applied electrical loading are
perpendicular to the crack plane and induce mode-I
effect.
Further, the same plate with double edge crack on
same side has been studied for crack offset distance.
The geometric configuration of the specimen with
multiple cracks is shown in the Fig. 7 and the value of
their separation d is assigned with the increment of
10 mm at each simulation. The initial distance of their
separation d between the two cracks is kept as 60 mm
and a decrement of 10 mm is assigned at every step i.e.
60 C d C 10 mm. The analysis is done by consider-
ing six different values of d. The variation in the values
of SIFs (Intensity Factors) at two different tips of
double edge cracks with respect to d is presented in the
Fig. 13a, b, c. From the Fig. 13a, b, c, it is concluded
that the SIFs KI and KIV at tip1 of crack1 decrease for
the values of 60 C d C 10 mm while KII at tip1 of
crack1 increase for the values of 60 C d C 10 mm.
The SIFs KI and KIV at tip2 of crack2 decrease for
values of 60 C d C 10 mm while KII at tip2 of crack2
increase for the values of 60 C d C 10 mm. From
these numerical results, it is concluded that SIFs
values at the higher inter-crack distance are maximum
because the crack shielding effect of crack-tips.
4.3.2 Double-edged crack on opposite side
A homogeneous piezoelectric plate of dimension
100 mm 9 200 mm containing two equal edge cracks
of length, A = 30 mm (crack 1) and a = 30 mm
(crack2); positioned at opposite side is investigated
in this section. The geometric configuration of the
specimen is shown in the Fig. 5.
The initial crack2 orientation is kept at - 70 with
the horizontal and an increment of 10 is applied at
every step i.e. - 70 B h B 70. The analysis is done
by considering eleven different values of crack2
inclination angle h, e.g. - 70 B h B 70. The vari-
ation in the values of intensity factors (SIFs) at two
different tips of two edge cracks with respect to crack2
inclination angle h is presented in Fig. 14a, b, c. From
the Fig. 14a, b, c, it is concluded that the SIFs KI and
KIV at tip1 of crack1 increase for values of - 70 B
h B 0 and then decrease for the values of 0 B h
B 70 in crack2 orientation h while KII at tip1 of
crack1 decreases for the values of - 70 B h B 10
and then increases for the values of 10 B h B 70 in
crack2 orientation h. The SIFs KI and KIV at tip2 of
crack2 increase for the values of - 70 B h B 20
and 30 B h B 40 and then decreases for the values
of 20 B h B 30 and 40 B h B 70 in crack2
orientation h while KII at tip2 of crack2 slightly
decreases for the values - 70 B h B - 40,
- 30 B h B - 20, 10 B h B 30, 40 B h
B 50, 60 B h B 70 and then increases for the
values of - 40 B h B - 30, -20 B h B 10,
30 B h B 40 and 50 B h B 60 in crack2 orienta-
tion h.
From the above discussion for the SIFs variation
with crack inclination angle (h), it is concluded that
SIFs values are maximum when crack inclination
angle h = 0, because the crack configuration induces
mode-I loading at geometry, whereas, if the crack
inclination increases, mixed-mode effect has been
induces in the crack geometry which is responsible for
the decrement in KI.
Further, the cracked geometry has been investi-
gated for crack length effect. For this purpose,
piezoelectric plate of size with dimension 100 mm 9
200 mm containing double-edged cracks of crack1
length, A = 20 mm and crack2 length, a = 20 mm has
been conceded at opposite side. The geometric
configuration of the specimen with double-edged
cracks is shown in the Fig. 6. Initially crack2 length
is kept as 20 mm and an increment of 5 mm is
assigned at every simulation steps i.e. 20 B a B 70
mm. The analysis is done by considering eleven
different values of crack2 length, a. The variation in
the values of intensity factors (SIFs) at two different
tips of double edge cracks with respect to crack2
length, a are presented in the Fig. 15a, b, c. From the
Fig. 15a, b, c, it is concluded that the SIFs KI and KIV
at tip1 of crack1 increase for the values of 20 B a
B 70 in crack2 length, a while KII at tip1 of crack1
also decreases for the values of 20 B a B 70 in crack2
length, a. The SIFs KI and KIV at tip2 of crack2 slightly
123
 R. Mishra et al.

Fig. 14 a Variation of KI
with crack orientation for
(a)
double-edged crack on
opposite side under
electrical load. b Variation
of KII with crack orientation
for double-edged crack on
opposite side under
electrical load. c Variation
of KIV with crack orientation
for double-edged crack on
opposite side under
electrical load

(b)

(c)

123
Crack interaction study in piezoelectric materials

Fig. 15 a Variation of KI
with crack2 length for
(a)
double-edged crack on
opposite side under
electrical load. b Variation
of KII with crack2 length for
double-edged crack on
opposite side under
electrical load. c Variation
of KIV with crack2 length for
double-edged crack on
opposite side under
electrical load

(b)

(c)

123

Fig. 16 Variation of SIFs
with crack orientation for
double-edged crack on same
side under thermo-electro-
mechanical load
increase for the values of 20 B a B 70 in crack2
length, a while KII at tip2 of crack2 slightly decreases
for the values of 20 B a B 70.
From the above discussion, it is concluded that SIFs
values at the crack are maximum when its crack length
is increased and the values are minimum where the
crack length is less. But it is not dependent on the
direction of electrical loading.
4.4 Combined thermo-electro-mechanical loading
A homogeneous piezoelectric cracked plate of dimen-
sion 100 mm 9 200 mm has been simulated for
combined thermo-electro-mechanical loading condi-
tions. In this phase, the applied loadings on the remote
boundary of a finite piezoelectric plate are ryy-
= 1 MPa and Dy = 0.001 C/m2and temperature
T1 = 0 C is applied on the bottom edge and temper-
ature T2 = 50 C is applied on the top edge of the
piezoelectric plate. Top and bottom edge of the
piezoelectric plate is constrained in Y-direction.
4.4.1 Double-edged crack on same side
In this case, a piezo-electric plate containing two equal
edge cracks of length, A = 30 mm (crack1) and
a = 30 mm (crack2); both cracks are positioned at
left edge. It can be seen from the Fig. 4 that the
mechanical, the electrical and the thermal loadings
applied on the piezoelectric plate are considered for
123
R. Mishra et al.
the crack interaction study. Polarization direction is
considered along the Y-axis. Crack1 is a horizontal
edge crack positioned at the half height of the domain.
Crack2 is an inclined edge crack, spaced at a distance
of 30 mm from crack2. The geometric configuration
of the specimen with crack2 of orientation angle
h = - 30–70 are shown in the Fig. 4 and the value
of orientation angle, h is assigned with the increment
of 10 at each simulation.
The initial crack2 orientation is kept at - 30 with
the horizontal and an increment of 10 is applied at
every step i.e. - 30 B h B 70. The analysis is done
by considering eleven different values of crack2
inclination angle h, e.g. - 30 B h B 70. The vari-
ation in the values of SIFs (Intensity factors) at two
different tips of two edge cracks with respect to crack2
inclination angle h is presented in the Fig. 16. From
the Fig. 16, it is concluded that SIFs KI and KIV at tip1
of crack1 decrease for values of - 30 B h B 0 and
then increases for the values of 0 B h B 70 in
crack2 orientation h while KII at tip1 of crack1
increases for the values of - 30 B h B - 10 and
then decreases for the values of - 10 B h B 70 in
crack2 orientation h. The SIFs KI and KIV at tip2 of
crack2 increase for values of - 30 B h B - 20 and
then it follows sine curve for values of - 20 B h
B 70 in crack2 orientation h while KII at tip2 of
crack2 slightly increases for the values - 30 B h
B - 10 and then it follows sine curve for the values
Crack interaction study in piezoelectric materials
Fig. 17 Temperature contour T for double-edged crack on
same side under adiabatic thermal load
of - 10 B h B 70 in crack2 orientation h. Temper-
ature contour are presented in the Fig. 17.
From this analysis, it may be concluded that SIFs
values are maximum when crack inclination angle
h = 0 because the combined in-plane applied thermo-
electro-mechanical loading are perpendicular to the
crack plane.
Further, the same plate with double edge crack on
same side has been studied for crack offset distance.
The geometric configuration of the specimen with
multiple cracks is shown in the Fig. 7 and the value of
their separation d is assigned with the increment of
10 mm at each simulation. The initial distance of their
separation d between the two cracks is kept as 60 mm
and a decrement of 10 mm is assigned at every step i.e.
60 C d C 10 mm. The analysis is done by consider-
ing six different values of d. The variation in the values
of intensity factors (SIFs) at two different tips of
double edge cracks with respect to d is presented in the
Fig. 18. From the Fig. 18, it is concluded that the SIFs
KI and KIV at tip1 of crack1 decrease for values of
60 C d C 50 mm, 40 C d C 10 mm and increase for
the values 50 C d C 40 mm while KII at tip1 of
crack1 increase for the values of 60 C d C 10 mm.
The SIFs KI and KIV at tip2 of crack2 decrease for
values of 60 C d C 40 mm, 30 C d C 10 mm and
increase for the values of 40 C d C 30 mm while KII
at tip2 of crack2 decrease for the values of 60 C d
C 10 mm. Temperature contour are presented in the
Fig. 19.
From these numerical results, it is concluded that
SIFs values at the higher inter-crack distance are
maximum because the crack shielding effect of crack-
tips. The amplification of crack-tip stress field near the
tip of crack1 is accountable for the rise in the value of
KI. The existence of equal length crack2 i.e. top crack
minimizes the value of KI and KII value becomes
nonzero because of the change in direction of applied
loading for the bottom crack.
4.4.2 Double-edged crack on opposite side
A homogeneous piezoelectric plate of dimension
100 mm 9 200 mm containing two equal edge cracks
of length, A = 30 mm (crack 1) and a = 30 mm
(crack2); positioned at opposite side is investigated
in this section. The geometric configuration of the
specimen is shown in the Fig. 5. The initial crack2
orientation is kept at - 70 with the horizontal and an
increment of 10 is applied at every step i.e. - 70 B
h B 70. The analysis is done by considering fifteen
different values of crack2 inclination angle h, e.g.
- 70 B h B 70. The variation in the values of
intensity factors (SIFs) at two different tips of two
edge cracks with respect to crack2 inclination angle h
is presented in the Fig. 20. From the Fig. 20, it is
concluded that SIFs KI and KIV at tip1 of crack1
decrease for values of - 70 B h B 0 and then
increase for values of 0 B h B 70 in crack2 orien-
tation h while KII at tip1 of crack1 decreases for the
values of - 70 B h B - 40, 20 B h B 70 and
then increases for the values of - 40 B h B 20 in
crack2 orientation h. The SIFs KI and KIV at tip2 of
crack2 increase for the values of - 70 B h B 10
and then decrease for the values of 10 B h B 70 in
crack2 orientation h while KII at tip2 of crack2 slightly
decreases for values of - 70 B h B - 60, - 50 B
h B - 40, 40 B h B 50, 60 B h B 70 and then
increases for values of - 60 B h B - 50, - 40 B
123
 R. Mishra et al.

Fig. 18 Variation of SIFs

w.r.t. inter-crack distance d
for double-edged crack on
same side under thermo-
electro-mechanical loading

concluded that SIFs values are maximum when crack

Fig. 19 Temperature contour T for double-edged crack on
same side under adiabatic thermal load
h B 40 and 50 B h B 60 in crack2 orientation h.
Temperature contour are shown in the Fig. 21. It is
inclination angle h = 0 because the combined in-
plane applied thermo-electro-mechanical loading are
perpendicular to the crack plane. However, the
existence of crack2 generates mixed-mode loading
conditions that produce a finite value of mode-II SIFs
for crack1.
Further, the cracked geometry has been investi-
gated for crack length effect. For this purpose,
piezoelectric plate of size with dimension 100 mm 9
200 mm containing double-edged cracks of crack1
length, A = 20 mm and crack2 length, a = 20 mm has
been conceded at opposite side. The geometric
configuration of the specimen with double-edged
cracks is shown in the Fig. 6. Initially crack2 length
is kept as 20 mm and an increment of 5 mm is
assigned at every simulation steps i.e. 20 B a B 70
mm. The analysis is done by considering eleven
different values of crack2 length, a. The variation in
the values of intensity factors (SIFs) at two different
tips of double edge cracks with respect to crack2
length, a are presented in the Fig. 22a, b, c. From the
Fig. 22a, b, c, it is depicted that the SIFs KI and KIV at
tip1 of crack1 decrease for the values of 20 B a B 50
and then increase for the values of 50 B a B 70 in
crack2 length, a while KII at tip1 of crack1 increases
for the values of 20 B a B 50 and then decreases for
the values of 20 B a B 50. The SIFs KI and KIV at tip2
of crack2 slightly increase for the values of 20 B a
B 35, 40 B a B 60 and then decrease for the values of

123
Crack interaction study in piezoelectric materials

Fig. 20 Variation of SIFs

with crack orientation for
double-edged crack on
opposite side under thermo-
electro-mechanical load

35 B a B 40 and 60 B a B 70 in crack2 length, a

while KII at tip2 of crack2 slightly decreases for the
values of 20 B a B 30 and 35 B a B 65 and then
increases for the values of 30 B a B 35 and 65 B a
B 70. Temperature contour are given in the Fig. 23.
From the above discussion, it is concluded that SIFs
values at the crack are maximum when its crack length
is increased and the values are minimum where the
crack length is less.
The thermal stresses are generated under the
applied coupled thermo-electro-mechanical loadings
due to the change in temperature.

5 Conclusions

This work presents 2-D crack interaction simulations

Fig. 21 Temperature contour T for double-edged crack on
opposite side under adiabatic thermal load
using XFEM approach under mechanical, electrical
and combined thermo-electro-mechanical loading
environment. Two benchmark examples have been
solved using XFEM approach to check the accuracy of
the proposed methodology. A generalized MATLAB
code has been developed to obtain the numerical
results in terms of SIFs and stress contours. In order to
capture the effect of discontinuities, extrinsic enrich-
ment scheme has been employed in the problem
domain for the piezoelectric material. In the presented
simulations, adiabatic crack problem is solved for the
thermal fracture analysis in piezoelectric materials.

123
 R. Mishra et al.

Fig. 22 a Variation of KI
with crack2 length for
(a)
double-edged crack on
opposite side under thermo-
electro-mechanical loading.
b Variation of KII with
crack2 length for double-
edged crack on opposite side
under thermo-electro-
mechanical loading.
c Variation of KIV with
crack2 length for double-
edged crack on opposite side
under thermo-electro-
mechanical loading

(b)

(c)

123
Crack interaction study in piezoelectric materials
Fig. 23 Temperature contour T for double-edged crack on
opposite side under adiabatic thermal load
The following conclusions have been observed from
the present work:
• SIFs values are maximum when crack inclination
angle h = 0 because the in-plane applied loading
are perpendicular to the crack plane and SIFs
values are minimum when the crack is aligned at a
greater inclination angle. The inclined crack
configuration induced mixed-mode loading envi-
ronment which is responsible for SIFs change with
inclination angle.
• SIFs values of the comparatively bigger cracks are
more than the smaller cracks.
• SIFs values at the higher inter-crack distance are
found maximum because crack shielding effects.
• SIFs KI and KII are strongly dependent on
mechanical loading and KIV strongly depends on
electrical loading.
• Combined thermo-electro-mechanical loading
exhibits more stresses at the crack-tip and more
SIFs as compared to individual mechanical and
individual electrical loading.
• Coupled thermo-electro-mechanical loadings
plays a vital role in the failure of piezoelectric
components.
Acknowledgements The authors are grateful for the support
received from Indian Institute of Technology Mandi (IIT
Mandi) through grant file no. IITM/SG/HP/54.
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