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PCM1794A
SLES117B – AUGUST 2004 – REVISED DECEMBER 2015
I/V Stage
Data
L Analog Out
LRCK
Differential Output or
BCK PCM1794A Differential to SE
DSP
MCLK Stage
R Analog Out
I/V Stage
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
PCM1794A
SLES117B – AUGUST 2004 – REVISED DECEMBER 2015 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................. 13
2 Applications ........................................................... 1 7.4 Device Functional Modes........................................ 18
3 Description ............................................................. 1 8 Application and Implementation ........................ 19
4 Revision History..................................................... 2 8.1 Application Information............................................ 19
8.2 Typical Application ................................................. 25
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 26
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 26
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 26
6.3 Recommended Operating Conditions....................... 5 10.2 Layout Example .................................................... 27
6.4 Thermal Information .................................................. 5 11 Device and Documentation Support ................. 28
6.5 Electrical Characteristics........................................... 5 11.1 Documentation Support ........................................ 28
6.6 Timing Requirements ................................................ 7 11.2 Community Resources.......................................... 28
6.7 Typical Characteristics .............................................. 9 11.3 Trademarks ........................................................... 28
7 Detailed Description ............................................ 12 11.4 Electrostatic Discharge Caution ............................ 28
7.1 Overview ................................................................. 12 11.5 Glossary ................................................................ 28
7.2 Functional Block Diagram ....................................... 12 12 Mechanical, Packaging, and Orderable
Information ........................................................... 28
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
DB Package
28-Pin SSOP
Top View
MONO 1 28 VCC2L
CHSL 2 27 AGND3L
DEM 3 26 IOUTL–
LRCK 4 25 IOUTL+
DATA 5 24 AGND2
BCK 6 23 VCC1
SCK 7 22 VCOML
DGND 8 21 VCOMR
VDD 9 20 IREF
MUTE 10 19 AGND1
FMT0 11 18 IOUTR–
FMT1 12 17 IOUTR+
ZERO 13 16 AGND3R
RST 14 15 VCC2R
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
1 MONO I Monaural mode enable (1)
2 CHSL I L-channel, R-channel select (1)
3 DEM I De-emphasis enable (1)
4 LRCK I Left and right clock (fS) input (1)
5 DATA I Serial audio data input (1)
6 BCK I Bit clock input (1)
7 SCK I System clock input (1)
8 DGND — Digital ground
9 VDD — Digital power supply, 3.3 V
10 MUTE I Mute control (1)
11 FMT0 I Audio data format select (1)
12 FMT1 I Audio data format select (1)
13 ZERO O Zero flag
14 RST I Reset (1)
15 VCC2R — Analog power supply (R-channel DAC), 5 V
16 AGND3R — Analog ground (R-channel DAC)
17 IOUTR+ O R-channel analog current output +
18 IOUTR– O R-channel analog current output –
19 AGND1 — Analog ground (internal bias)
20 IREF — Output current reference bias pin
21 VCOMR — R-channel internal bias decoupling pin
22 VCOML — L-channel internal bias decoupling pin
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC1, VCC2L, VCC2R –0.3 6.5
Supply Voltage V
VDD –0.3 4
Supply voltage differences: VCC1, VCC2L, VCC2R ±0.1 V
Ground voltage differences: AGND1, AGND2, AGND3L, AGND3R, DGND ±0.1 V
LRCK, DATA, BCK, SCK, FMT1,
FMT0, MONO, CHSL, DEM, MUTE, –0.3 6.5
Digital input voltage RST V
ZERO –0.3 (VDD + 0.3 V) < 4
Analog input voltage –0.3 (VCC + 0.3 V) < 6.5 V
Input current (any pins except supplies) ±10 mA
Ambient temperature under bias –40 125 °C
Junction temperature 150 °C
Lead temperature (soldering, 5 s) 260 °C
Package temperature (IR reflow, peak) 250 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(3) Dynamic performance and dc accuracy are specified at the output of the postamplifier as shown in Figure 26.
6 Submit Documentation Feedback Copyright © 2004–2015, Texas Instruments Incorporated
t(SCKH)
H
2V
System Clock (SCK)
0.8 V
L
t(SCKL)
t(SCY)
t (RST)
Reset Reset Removal
Internal Reset
System Clock
LRCK 50% of V DD
BCK 50% of V DD
t (BCY) t (BL)
DATA 50% of V DD
t (DS) t (DH)
0
2
0.00002
−50
1
0.00001
Amplitude – dB
Amplitude – dB
−100
0
−150
−1
–0.00001
−200
0 1 2 3 4 −2
–0.00002
0.0 0.1 0.2 0.3 0.4 0.5
Frequency [× fS]
Frequency [× fS]
−2
−4
−50
−6
Amplitude – dB
Amplitude – dB
−8
−100 −10
−12
−14
−150
−16
−18
−200 −20
0 1 2 3 4 0.0 0.1 0.2 0.3 0.4 0.5 0.6
Frequency [× fS] Frequency [× fS]
15
0.015
−2
10
0.010
De-Emphasis Error – dB
De-Emphasis Level – dB
5
0.005
−4
−6 −5
–0.005
−10
–0.010
−8
−15
–0.015
−20
–0.020
−10 0 2 4 6 8 10 12 14 16 18 20
0 2 4 6 8 10 12 14 16 18 20
f – Frequency – kHz
f – Frequency – kHz
fS = 44.1 kHz
fS = 44.1 kHz
130
fS = 96 kHz
Dynamic Range – dB
128 fS = 48 kHz
fS = 192 kHz
fS = 192 kHz
0.001
126
fS = 96 kHz
124
fS = 48 kHz
0.0001 122
4.50 4.75 5.00 5.25 5.50 4.50 4.75 5.00 5.25 5.50
VCC – Supply Voltage – V VCC – Supply Voltage – V
Figure 10. Total Harmonic Distortion + Noise vs Supply Figure 11. Dynamic Range vs Supply Voltage
Voltage
132 130
SNR – Signal-to-Noise Ratio – dB
130 128
Channel Separation – dB
fS = 96 kHz
124 122
122 120
4.50 4.75 5.00 5.25 5.50 4.50 4.75 5.00 5.25 5.50
VCC – Supply Voltage – V VCC – Supply Voltage – V
TA = 25°C VOUT = 4.5 VRMS
VDD = 3.3 V Measurement circuit is Figure 26
Figure 12. Signal-to-Noise Ratio vs Supply Voltage Figure 13. Channel Separation vs Supply Voltage
132
0.01
THD+N – Total Harmonic Distortion + Noise – %
130
fS = 96 kHz
Dynamic Range – dB
fS = 48 kHz
128 fS = 192 kHz
fS = 192 kHz
0.001
126
fS = 96 kHz
124
fS = 48 kHz
122
0.0001 −50 −25 0 25 50 75 100
−50 −25 0 25 50 75 100
TA – Free-Air Temperature – °C
TA – Free-Air Temperature – °C
130 128
fS = 96 kHz
Channel Separation – dB
128 126
fS = 192 kHz
fS = 48 kHz fS = 48 kHz
fS = 96 kHz
124 122
122 120
−50 −25 0 25 50 75 100 −50 −25 0 25 50 75 100
TA – Free-Air Temperature – °C TA – Free-Air Temperature – °C
VCC = 5 V VOUT = 4.5 VRMS
VDD = 3.3 V Measurement circuit is Figure 26.
Figure 16. Signal-to-Noise Ratio vs Free-Air Temperature Figure 17. Channel Separation vs Free-Air Temperature
0 0
−20 −20
−40
−40
−60
Amplitude – dB
Amplitude – dB
−60
−80
−80
−100
−100
−120
−120
−140
−160 −140
−180 −160
0 2 4 6 8 10 12 14 16 18 20 0 10 20 30 40 50 60 70 80 90 100
f – Frequency – kHz f – Frequency – kHz
VCC = 5 V Measurement circuit is Figure 26 VCC = 5 V Measurement circuit is Figure 26
TA = 25°C VDD = 3.3 V fS = 48 kHz, 32768 point 8 TA = 25°C VDD = 3.3 V fS = 48 kHz, 32768 point 8
average average
0.1
0.01
0.001
0.0001
−100 −80 −60 −40 −20 0
Input Level – dBFS
VCC = 5 V Measurement circuit is Figure 26
VDD = 3.3 V fS = 48 kHz, TA = 25°C
7 Detailed Description
7.1 Overview
The PCM1794A device is a 24-bit, 192-kHz, differential-current, output digital-to-analog converter (DAC) that
comes in a 28-pin SSOP package. The PCM1794AA device is hardware controlled and uses the advanced-
segment DAC architecture from TI to perform with a Stereo Dynamic Range of 129 dB (132 dB Mono) and with a
THD of 0.0004% at 44.1 kHz. The PCM1794AA device uses the SCK input as the system clock and
automatically detects the sampling rate of the Digital Audio input when valid BCK and LRCK clocks are supplied.
To bypass the internal filter, use an external digital filter.
LRCK IOUTL–
BCK Audio
Data Input Current VOUTL
DATA I/F Segment
DAC
IOUTL+
Current VOUTR
DEM Segment
DAC
RST IOUTR+
VCC2L
AGND3R
AGND1
AGND2
AGND3L
(1) This system clock rate is not supported for the given sampling frequency.
Internal Reset
System Clock
(1) Standard Data Format (Right Justified); L-Channel = HIGH, R-Channel = LOW
1/f S
BCK
DATA 14 15 16 1 2 15 16 1 2 15 16
MSB LSB
DATA 22 23 24 1 2 23 24 1 2 23 24
MSB LSB
BCK
DATA 1 2 23 24 1 2 23 24 1 2
MSB LSB
1/f S
LRCK
L-Channel R-Channel
BCK
DATA 1 2 23 24 1 2 23 24 1 2
MSB LSB
7.3.6 De-Emphasis
The PCM1794A device has a de-emphasis filter for the sampling frequency of 44.1 kHz. The de-emphasis filter is
controlled using DEM (pin 3).
The PCM1794A device uses TI’s advanced segment DAC architecture to achieve excellent dynamic
performance and improved tolerance to clock jitter. The PCM1794A device provides balanced current outputs.
Digital input data using the digital filter is separated into 6 upper bits and 18 lower bits. The 6 upper bits are
converted to inverted complementary offset binary (ICOB) code. The lower 18 bits, associated with the MSB, are
processed by a five-level, third-order delta-sigma modulator operated at 64 fS by default. The 1 level of the
modulator is equivalent to the 1 LSB of the ICOB code converter. The data groups processed in the ICOB
converter and third-order delta-sigma modulator are summed together to create an up-to-66-level digital code,
and then processed by data-weighted averaging (DWA) to reduce the noise produced by element mismatch. The
data of up to 66 levels from the DWA is converted to an analog output in the differential-current segment section.
This architecture has overcome the various drawbacks of conventional multibit processing, and also achieves
excellent dynamic performance.
(1) VOUTN is the output of U1, VOUTP is the output of U2, and VOUT is the output of U3 in the measurement circuit of Figure 25.
−2
IOUTN
IO – Output Current – mA
−4
−6
−8
IOUTP
−10
−12
800000(–FS) 000000(BPZ) 7FFFFF(+FS)
Input Code – Hex
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
C1
2200 pF
R1
750 Ω
VCC
VCC
C11 C3
0.1 µF R5 2700 pF
C15
270 Ω 0.1 µF
C17
7 22 pF C19
5 33 pF
2 8 R3 7
IOUT– – 560 Ω 5
6 2 R7
– 100 Ω
3 6
+ U1
3
4 NE5534 + U3
4 LT1028
C12 R4
0.1 µF 560 Ω R6 C16
270 Ω 0.1 µF
C4
VEE 2700 pF
VEE
C2
2200 pF
R2
750 Ω
VCC
C13
0.1 µF VCC = 15 V
C18 VEE = –15 V
22 pF fC = 217 kHz
7
5
2 8
IOUT+ –
6
3
+ U2
4 NE5534
C14
0.1 µF
VEE
C1
2200 pF
R1
820 Ω
VCC
VCC
C11 C3
0.1 µF R5 2700 pF
C15
360 Ω 0.1 µF
C17
7 22 pF C19
5 33 pF
2 8 R3 7
IOUT– – 360 Ω 5
6 2 R7
– 100 Ω
3 6
+ U1
3
4 NE5534 + U3
4 LT1028
C12 R4
0.1 µF 360 Ω R6 C16
360 Ω 0.1 µF
C4
VEE 2700 pF
VEE
C2
2200 pF
R2
820 Ω
VCC
VCC = 15 V
C13 VEE = –15 V
0.1 µF
fC = 162 kHz
C18
7 22 pF
5
2 8
IOUT+ –
6
3
+ U2
4 NE5534
C14
0.1 µF
VEE
2
IOUTR– (Pin 18) IOUT–
Figure 25 OUT–
Circuit Balanced Out
IOUTR+ (Pin 17) IOUT+
VDD
External 1 MONO VCC2L 28
Filter
2 CHSL AGND3L 27
Device
3 DEM IOUTL– 26
9 VDD IREF 20
10 MUTE AGND1 19
11 FMT0 IOUTR– 18
12 FMT1 IOUTR+ 17
13 ZERO AGND3R 16
14 RST VCC2R 15
Figure 28. Connection Diagram for External Digital Filter (Internal DF Bypass Mode) Application
WDCK 50% of V DD
BCK 50% of V DD
t (BCY) t (BL)
DATA 50% of V DD
t (DS) t (DH)
Figure 29. Audio Interface Timing for External Digital Filter (Internal DF Bypass Mode) Application
Table 5 shows the timing requirements for an application using an external digital filter in internal DF bypass
mode.
WDCK
BCK
DATA 23 24 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
MSB LSB
Figure 30. Audio Data Input Format for External Digital Filter (Internal DF Bypass Mode) Application
0.1 µF Rf
1 MONO VCC2L 28 + 10 µF
–
Controller 2 CHSL AGND3L 27
+ Differential
DEM IOUTL– to
3 26 Cf
Single
VOUT
4 LRCK IOUTL+ 25 Converter
Rf L-Channel
With
PCM 5 DATA AGND2 24 5V Low-Pass
Audio Data – Filter
Source 6 BCK VCC1 23
+
+ 47 µF
7 SCK VCOML 22 Cf
+ 10 µF
PCM1794A +
8 DGND VCOMR 21
0.1 µF 47 µF Rf
9 VDD IREF 20
10 kΩ –
10 MUTE AGND1 19 Differential
+
to
11 FMT0 IOUTR– 18 Cf
Single
VOUT
Controller 12 FMT1 IOUTR+ 17 Converter
Rf R-Channel
0.1 µF 5V With
13 ZERO AGND3R 16 Low-Pass
– Filter
14 RST VCC2R 15
10 µF +
+
3.3 V
+
10 µF
0 10
−60
0.1
−80
−100 0.01
−120
0.001
−140
−160 0.0001
0 10 20 30 40 50 60 70 80 90 100 −100 −80 −60 −40 −20 0
f – Frequency – kHz Input Level – dBFS
VCC = 5 V Measurement circuit is Figure 26 VCC = 5 V Measurement circuit is Figure 26
TA = 25°C fS = 48 kHz, 32768 point 8 average VDD = 3.3 V fS = 48 kHz, TA = 25°C
VDD = 3.3 V –60-db Output Spectrum, BW = 100 kHz
Figure 32. Amplitude vs Frequency Figure 33. Total Harmonic Distortion + Noise vs Input
Level
10 Layout
5V
1 +
MONO VCC2L 28
Hardware select
pins or Host 0.1 F 10 F
2 CHSL AGND3L 27
control
3 DEM IOUTL± 26 Left I/V
Output
4 circuit
LRCK IOUTL+L+ 25
5 DATA AGND2 24
(2)
See
6 BCK VCC1 23 5V
47 F+ +
7 SCK VCOML 22
PCM1794A 10 F
3.3 V 8 DGND VCOMR 21
+
10 K
10 F 0.1 F 9 VDD IREF 20
10 MUTE AGND1 19
13 ZERO AGND3R 16
14 RST VCC2R 15 5V
+
0.1 F 10 F
(1) TI recommends to place a top layer ground pour for shielding around device and connect it to the lower main PCB
ground plane with multiple vias.
(2) These resistors help prevent overshoot and reduce coupling. Begin with a value of 10 Ω for the MCLK resistor and
27 Ω for the other resistors.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
Audio Precision is a trademark of Audio Precision.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
PCM1794ADB ACTIVE SSOP DB 28 47 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 PCM1794
A
PCM1794ADBR ACTIVE SSOP DB 28 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -25 to 85 PCM1794
A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
• Automotive: PCM1794A-Q1
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
TUBE
Pack Materials-Page 3
PACKAGE OUTLINE
DB0028A SCALE 1.500
SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
C
8.2
TYP
A 7.4
0.1 C SEATING
PIN 1 INDEX AREA
PLANE
26X 0.65
28
1
2X
10.5
8.45
9.9
NOTE 3
14
15
0.38
28X
0.22
5.6 0.15 C A B
B
5.0
NOTE 4
2 MAX
(0.15) TYP 0.25
SEE DETAIL A GAGE PLANE
DETAIL A
A 15
TYPICAL
4214853/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-150.
www.ti.com
EXAMPLE BOARD LAYOUT
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
1 (R0.05) TYP
28X (0.45) 28
26X (0.65)
SYMM
14 15
(7)
4214853/B 03/2018
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DB0028A SSOP - 2 mm max height
SMALL OUTLINE PACKAGE
26X (0.65)
SYMM
14 15
(7)
4214853/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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