Professional Documents
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124]
Original Research
Abstract
The purpose of this study was to assess the shear bond strength of Total etch Prime and Bond NT and self etch newer dentin bond-
ing agents Clearfil S3, Xeno III Bond, Clearfil Protect Bond and G Bond used to bond composite resin to dentin, and to compare
the difference in the shear bond strengths of the self etch newer dentin bonding agents. Hundred freshly extracted noncarious
human maxillary premolar teeth were selected. The occlusal surfaces of each tooth were ground to prepare flat dentin surfaces at
a depth of 1.5 mm and were randomly grouped, with twenty specimens in each: Group I - Prime and Bond NT, Group II - Clearfil
Protect Bond, Group III - Xeno III Bond, Group IV - Clearfil S3 Bond, Group V - G Bond. Each group was treated with its respec-
tive bonding agents, as per the manufacturers’ instructions Clearfill – Kuraray , Japan, G bond – GC Tokyo, Japan, Xeno- De
Trey Densply, Germany. Blocks or Cylinders of composite resin were built up using Teflon mold and cured. Shear bond strengths
were tested using Instron Universal testing machine and recorded in Mpa. The results were statistically analyzed using One-way
anova and Tukeys HSD test. The total etch adhesive showed higher shear bond strength than self etching adhesives (P<0.001).
Within the limitations of this in vitro study, it can be concluded that all the adhesive agents evaluated showed optimal shear bond
strength 17-20 Mpa, except G bond. However, shear bond strength of composite resin to dentin is better with one bottle total etch
adhesive than with the newer self etching bonding agents.
Keywords: Dentin bonding agents; self etch adhesives; total etch adhesives.
Figure 1: Bonding agents used for the study Figure 2: Teflon mold of dimension 2mm x 2mm
Mounting of specimens that the two groups had comparable bond strength
The prepared specimens were mounted on metal to dentin. Whereas, comparison of Group II with
cylinders, using dental stone to embed the root Group IV (Clearfil protect bond) and Group V (G bond)
portion. The study was conducted by placing the showed statistically significant results, leading to the
specimens in a distilled water bath for 24 hours, the inference that Clearfil S3 has a comparatively higher
temperature maintained at a controlled 37°C. All bond strength to dentin.
specimens were transferred to the Instron universal
machine individually and subjected to shear bond When intergroup comparison was done between Group
strength analysis at crosshead speed of 1.0mm/minute III and Groups IV and V using Tukeys HSD test, the results
[Figure 3]. proved to be significant statistically, showing that Xeno
III had better bond strength than Clearfil protect bond
RESULTS and G bond. Whereas, when Group IV and Group V were
studied in comparison, the probability was < 0.001,
When a comparison of the shear bond strength of which signifies that Clearfil protect bond has higher
total etch with newer self etch adhesives was made shear bond strength than G bond [Figure 4].
using one-Way ANOVA, it showed statistically significant
results. [Table 1]. DISCUSSION
P < 0.001. Hence multigroup comparison was done It has been postulated that minimum bond strength
using Tukeys HSD test. of 17-20 Mpa is needed to resist contraction forces
of resin composite materials, for enamel and dentin.
The shear bond strength values of the control group Clinical experiences confirm that this bond strength is
(Group I), when compared with that of the experimental sufficient for successful retention of resin restoration.[4]
group (Group II, Group III, Group IV and Group V), All adhesive systems used in the present study achieved
showed statistically high significance. This indicated the optimal bond strength values for both enamel and
that total etch adhesives have better bonding capability dentin (except G Bond, which showed a slightly lower
than the newer self etching adhesives [Table 2]. value). However, the total etch system Prime and Bond
NT showed better bond strength, as compared to the
Intercomparison was done between the self etch self etching adhesives - Clearfil S3, Xeno III, Clearfil
adhesives using Tukeys HSD test. Comparison between protect bond and G bond.
Group II (Clearfil S3) and Group III (Xeno III) showed no
statistically significant Figs. (P>0.05), which indicates This result was in accordance with Bouillaguet et al.,
Chuang et al., Kerby et al., who stated that self etching
Table 1: Mean and standard deviation values for shear adhesives have lower bond strength as compared to
bond strength total etch bonding systems.[5-7] Senawongse et al., also
Value N Mean Std. deviation Minimum Maximum demonstrated that two self etching systems, One-up
Group I 20 26.092 .557 25.155 27.150 bond and Clearfil SE bond demonstrated lower bond
Group II 20 24.526 .534 23.555 25.545
Group III 20 24.858 .596 23.788 25.783
Group IV 20 22.060 1.148 20.050 23.785
Group V 20 16.378 .642 15.233 17.334 26.092
24.526 24.858
a. F=558.235 P<0.001 vhs 25.000
22.060
strength than the total etch system Single bond.[8] evaluating the adhesive ability of adhesive/restorative
However, Kiremitci et al. concluded that self etching materials. With the simple technique and relevant
adhesive systems produced higher bond strength results, it is considered a benefit for the purposes of
than conventional total etch systems, especially the ranking and marketing.[7]
all-in-one system, which produced the highest bond
strength.[9] Whereas, Sensi et al., stated that self etch The lowest bond strength was obtained by the self
and total etch primer showed comparable dentin bond etching HEMA-free adhesive, G bond. In a recent
strength.[9] study, phase separation among adhesive compositions
was confirmed, as droplets entrapped during
According to Hashimato et al., self etch adhesives solvent evaporation from HEMA-free adhesives. This
produced thinner and shorter resin tags than those phenomenon could be explained by the evaporation of
produced by phosphoric acid etching and thus resulted solvents such as ethanol and acetone, which affected
in inferior bond strength as compared to total etch the balance of solvents and resin monomer and caused
adhesive systems.[7] water to separate from other compositions of the
adhesive.[11] Spherical blisters within the resin film may
Self etching adhesive systems rely on acidic monomers be the outcome of residual, free water, not completely
to simultaneously demineralize and infiltrate enamel evaporated and entrapped at the interfacial level. The
and dentin. This acidity must be neutralized by the convergence of small blisters into larger ones tends to
mineral content of the tooth structure, to allow produce honeycomb structures that may jeopardize
complete polymerization of the adhesive film. With the bonded interface.[12]
total etch adhesive, smear layer and dissolved mineral
are removed during the rinsing step. Because of some Clearfil protect bond, which is antibacterial two-step self
questions about residual acidity and the fact that the etching adhesive, has a bond strength comparable with
smear layer is not removed, the issue of long term other self etch adhesives, even though it showed low
hydrolytic stability of the self etching adhesive systems bond strength when compared with Clearfil S3 and Xeno
still remains unresolved.[2] III. This is in accordance with study done by Imazato et
al. in 1996, who found no decrease in bond strength by
Most single-step self etch adhesives contain hydroxyethyl incorporating MDPB at any concentration. Imazato and
methacrylate, which can polymerize in the presence of Mc cabe (1994) demonstrated that a small improvement
water to form microporous hydrogel with pore size in the curing behavior of a Bis-GMA based resin was
ranging from 10-100nm. Differential water movement caused by incorporation of MDPB. It is well-known that
across the cured adhesive layer may occur in the the penetration of resin monomer into dentin surface
presence of increased concentration of dissolved and formation of a hybrid layer are important for resin
inorganic ions, uncured, water soluble, hydrophilic dentin bonding (Nakabayashi et al. 1982).
resin monomers or dissolved collagen proteoglycans
components within the oxygen inhibition layer of the Achievement of strong micromechanical bonding
cured adhesive. This concentration difference may depends on the depth of monomer penetration into
establish an osmotic pressure gradient, causing water demineralized dentin (Erikson 1992). It is possible that
movement from a region of low solute concentration MDPB aids monomer penetration that generates good
to a region of high solute concentration. This may bond strength.[13] Clearfil S3 shows a comparatively
cause water blisters, which act as weak spots along the higher bond strength among the self etching adhesives,
adhesive interface.[3] but slightly lower than Xeno III (P>0.05). The reason
attributed to this is the presence of MDP. This
Shear bond strength test is a simple evaluation functional phosphate monomer determines its actual
procedure used to test the adhesion of dental adhesive performance, to a large extent.
adhesives Barkmeier and Cooley (1992). In vitro bond
strength tests are useful and essential for predicting These self etch adhesives partially demineralize dentin,
the performance of adhesive systems and possible leaving hydroxyapatite partially attached to collagen.
correlation with clinical issues.[10] So shear bond The residual hydroxyapatite chemically interacts
strength testing is done with a universal testing with the functional monomer, determining the actual
machine, Instron, which is conventionally popular for bonding efficiency and stability.[14]
According to a study done by sauro et al., Clearfil S3 and except G Bond. However, the one bottle total etch
G Bond showed reduced bond strength as compared to adhesive Prime and Bond NT recorded higher bond
Clearfil protect bond, due to its increased permeability. strength than the newer self etching bonding agents.
Clearfil protect bond exhibited the lowest permeability In this study, it was seen that among the self etching
and the fewest number of fluid droplets on the surface adhesives, Xeno III showed the highest bond strength
of the bonded surface. This inference is in contrast to and G bond showed the lowest shear bond strength.
the result obtained in this study in relation to Clearfil
S3, because the simulated pulpal pressure effect was REFERENCES
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