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BT151-800R

SCR
22 February 2018 Product data sheet

1. General description
Planar passivated Silicon Controlled Rectifier (SCR) in a SOT78 plastic package intended for use
in applications requiring high bidirectional blocking voltage capability, high surge current capability
and high thermal cycling performance.

2. Features and benefits


• High bidirectional blocking voltage capability
• High surge current capability
• High thermal cycling performance

3. Applications
• Ignition circuits
• Motor control
• Protection circuits
• Voltage regulation

4. Quick reference data


Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off- - - 800 V
state voltage
VRRM repetitive peak reverse - - 800 V
voltage
ITSM non-repetitive peak on- half sine wave; Tj(init) = 25 °C; - - 120 A
state current tp = 10 ms; Fig. 4; Fig. 5
half sine wave; Tj(init) = 25 °C; - - 132 A
tp = 8.3 ms
Tj junction temperature - - 125 °C
IT(AV) average on-state half sine wave; Tmb ≤ 109 °C; Fig. 1 - - 7.5 A
current
IT(RMS) RMS on-state current half sine wave; Tmb ≤ 109 °C; Fig. 2; - - 12 A
Fig. 3
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 7 - 2 15 mA
Dynamic characteristics

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SCR

Symbol Parameter Conditions Min Typ Max Unit


dVD/dt rate of rise of off-state VDM = 536 V; Tj = 125 °C; RGK = 100 Ω; 200 1000 - V/µs
voltage (VDM = 67% of VDRM); exponential
waveform; Fig. 12

5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode mb A K

2 A anode G
sym037
3 G gate
mb A mounting base; connected to
anode

1 2 3
TO-220AB (SOT78)

6. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BT151-800R TO-220AB plastic single-ended package; heatsink mounted; 1 mounting SOT78
hole; 3-lead TO-220AB

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SCR

7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state - 800 V
voltage
VRRM repetitive peak reverse - 800 V
voltage
IT(AV) average on-state current half sine wave; Tmb ≤ 109 °C; Fig. 1 - 7.5 A
IT(RMS) RMS on-state current half sine wave; Tmb ≤ 109 °C; Fig. 2; - 12 A
Fig. 3
ITSM non-repetitive peak on- half sine wave; Tj(init) = 25 °C; tp = 10 ms; - 120 A
state current Fig. 4; Fig. 5
half sine wave; Tj(init) = 25 °C; tp = 8.3 ms - 132 A
2 2
I t I t for fusing tp = 10 ms; SIN - 72 A²s
dIT/dt rate of rise of on-state IG = 30 mA - 50 A/µs
current
IGM peak gate current - 2 A
VRGM peak reverse gate - 5 V
voltage
PGM peak gate power - 5 W
PG(AV) average gate power over any 20 ms period - 0.5 W
Tstg storage temperature -40 150 °C
Tj junction temperature - 125 °C

003aab830 105.5
15
Tmb(max)
Ptot (°C)
a = 1.57 108.8
(W)
1.9
2.2
10 112.0
2.8
4
115.3
conduction form
angle factor
(degrees) a 118.5
5
30 4
60 2.8
αα 121.8
90 2.2
120 1.9
180 1.57
0 125
0 2 4 6 8
IT(AV) (A)

Fig. 1. Total power dissipation as a function of average on-state current; maximum values

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SCR

001aaa999 001aaa954
16 25
IT(RMS)
IT(RMS)
(A)
(A)
20
12

15

10

4
5

0 0
- 50 0 50 100 150 10- 2 10- 1 1 10
Tmb (°C) surge duration (s)

Fig. 2. RMS on-state current as a function of mounting


base temperature; maximum values Fig. 3. RMS on-state current as a function of surge
duration; maximum values
001aaa956
103

ITSM dlT/dt limit


(A)

102

IT ITSM

tp t
Tj initial = 25 °C max
10
10- 5 10- 4 10- 3 10- 2
tp (s)

Fig. 4. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values

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SCR

003aab829
160

ITSM
(A)

120

80

IT ITSM
40

tp t
Tj initial = 25 °C max
0
1 10 102 103
number of cycles

Fig. 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values

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SCR

8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance Fig. 6 - - 1.3 K/W
from junction to
mounting base
Rth(j-a) thermal resistance in free air - 60 - K/W
from junction to
ambient free air

001aaa962
10

Zth(j-mb)
(K/W)

10-1

10-2

10-3
10-5 10-4 10-3 10-2 10-1 1 10
tp (s)

Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width

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9. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 7 - 2 15 mA
IL latching current VD = 12 V; IG = 0.1 A; Tj = 25 °C; Fig. 8 - 10 40 mA
IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - 7 20 mA
VT on-state voltage IT = 23 A; Tj = 25 °C; Fig. 10 - 1.4 1.75 V
VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.6 1.5 V
Fig. 11
VD = 800 V; IT = 0.1 A; Tj = 125 °C; 0.25 0.4 - V
Fig. 11
ID off-state current VD = 800 V; Tj = 125 °C - 0.1 0.5 mA
IR reverse current VR = 800 V; Tj = 125 °C - 0.1 0.5 mA
Dynamic characteristics
dVD/dt rate of rise of off-state VDM = 536 V; Tj = 125 °C; RGK = 100 Ω; 200 1000 - V/µs
voltage (VDM = 67% of VDRM); exponential
waveform; Fig. 12
VDM = 536 V; Tj = 125 °C; (VDM = 67% 50 130 - V/µs
of VDRM); exponential waveform; gate
open circuit; Fig. 12
tgt gate-controlled turn-on ITM = 40 A; VD = 800 V; IG = 0.1 A; dIG/ - 2 - µs
time dt = 5 A/µs; Tj = 25 °C
tq commutated turn-off VDM = 536 V; Tj = 125 °C; ITM = 20 A; - 70 - µs
time VR = 25 V; (dIT/dt)M = 30 A/µs; dVD/
dt = 50 V/µs; RGK(ext) = 100 Ω; (VDM =
67% of VDRM)

001aaa952 001aaa951
3 3

IGT IL
IGT(25°C) IL(25°C)

2 2

1 1

0 0
- 50 0 50 100 150 - 50 0 50 100 150
Tj (°C) Tj (°C)

Fig. 7. Normalized gate trigger current as a function of Fig. 8. Normalized latching current as a function of
junction temperature junction temperature

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SCR

001aaa950 001aaa959
3 30

IH
IT
IH(25°C)
(A)

2 20

(1) (2) (3)

1 10

0 0
- 50 0 50 100 150 0 0.5 1 1.5 2
Tj (°C) VT (V)

Vo = 1.06 V; Rs = 0.0304 Ω
Fig. 9. Normalized holding current as a function of
(1) Tj = 125 °C; typical values
junction temperature
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 10. On-state current as a function of on-state
voltage
001aaa953 001aaa949
1.6 104

VGT dVD/dt
VGT(25°C) (V/µs)

(1)
1.2 103

(2)

0.8 102

0.4 10
- 50 0 50 100 150 0 50 100 150
Tj (°C) Tj (°C)

(1) RGK = 100 Ω;


Fig. 11. Normalized gate trigger voltage as a function of
(2) gate open circuit
junction temperature
Fig. 12. Critical rate of rise of off-state voltage as a
function of junction temperature; minimum values

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SCR

10. Package outline

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78

E A
p A1

q mounting
D1 base

L1(1) L2(1)

Q
b1(2)
L (3×)

b2(2)
(2×)
1 2 3

b(3×) c

e e

0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
L2(1)
UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) p q Q
max.
4.7 1.40 0.9 1.6 1.3 0.7 16.0 6.6 10.3 15.0 3.30 3.8 3.0 2.6
mm 2.54 3.0
4.1 1.25 0.6 1.0 1.0 0.4 15.2 5.9 9.7 12.8 2.79 3.5 2.7 2.2

Notes
1. Lead shoulder designs may vary.
2. Dimension includes excess dambar.

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
08-04-23
SOT78 3-lead TO-220AB SC-46
08-06-13

Fig. 13. Package outline TO-220AB (SOT78)

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SCR

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make changes to information published in this document, including without
11. Legal information limitation specifications and product descriptions, at any time and without
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Translations — A non-English (translated) version of a document is for


reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.

Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.

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12. Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Limiting values............................................................. 3
8. Thermal characteristics............................................... 6
9. Characteristics..............................................................7
10. Package outline.......................................................... 9
11. Legal information..................................................... 10

© WeEn Semiconductors Co., Ltd. 2018. All rights reserved


For more information, please visit: http://www.ween-semi.com
For sales office addresses, please send an email to: salesaddresses@ween-semi.com
Date of release: 22 February 2018

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