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DOI:10.1557/s43578-020-00029-w
Received: 2 November 2020; accepted: 3 December 2020; published online: 13 January 2021
Microwave (MW) dielectric ceramics are used in numerous electronic components for modern wireless
communication systems, including antennas, resonators, capacitors and filters. However, to date,
MW ceramics are manufactured by an energy-intensive, conventional high-temperature (> 1000 °C)
sintering technology and thus cannot be co-sintered with low melting point and base electrodes (Ag, Al,
etc., < 1000 °C), nor directly integrated with polymers (< 200 °C). Cold sintering is able to densify ceramics
at < 200 °C via a combination of external pressure and a transient liquid phase, reducing the energy
consumed and facilitating greater integration with dissimilar materials. This review outlines the basics
of MW ceramics alongside the mechanism of cold sintering. Recent developments in cold sintering of
MW ceramics, composites and devices are described, emphasizing new materials and progress towards
component/device fabrication. Future prospects and critical issues for advancing cold-sintered MW
materials and devices, such as unclear mechanism, low Q × f values and poor mechanical properties, are
discussed.
√
MW dielectrics play important roles in the Internet of Things tional to the εr , according to the equation [2]:
(IoT), fifth-generation (5G) mobile communication technol-
0 c
ogy and global navigation satellite systems (GNSS), as filters, d = √ = √ , (1)
εr ν εr
resonators, antennas and substrates [1, 2]. The three selective
Vol.:(0123456789)
where λd and λ0 is the wavelength in the dielectric and vacuum, [8], niobates [9, 10], silicates [11–13], which cannot be co-fired
respectively, c is the speed of light and ν is frequency. At f0, ν = f0 with base-metal or low melting temperature electrodes (e.g.
and λd is approximately the diameter of the resonating body (D), Ag, Cu, Al) and whose manufacture is energy intensive [14].
depending on the resonant mode, such that [1, 2] Further miniaturization and integration of MW devices have
c driven the development of LTCCs and ULTCCs, which may be
f0 ≈ √ .
D εr (2) co-fired with base-metal electrodes without melting and interac-
tion [15–20]. The family of LTCCs and ULTCCs mainly includes
Circuit miniaturization for low-frequency applications glass–ceramics [21–23], tellurates [24, 25], molybdates [26–31],
(2–6 GHz), therefore, requires larger εr, whereas higher work- vanadates [32–35], tungstates [36–38] and borates [39–41].
ing frequencies (e.g. mm-wave communication) need smaller Despite recent advances, the sintering temperatures of
values. For 4G and the current generation of 5G (2–6 GHz) tel- LTCCs and ULTCCs are still much higher than can be withstood
ecommunications, ceramics with medium εr (20 < εr < 50) are by a polymer-based printed circuit boards (PCBs < 200 °C),
typically used for resonators and filters in mobile phone net- which inhibits the development of integrated, directly pack-
works (e.g. base stations) [1, 2]. As the 5G network expands aged RF devices and systems. CSCCs are a series of ceram-
however, mm-wave technology will dominate and lower values ics or ceramic composites that can be densified at ultralow
of εr are required with ultralow loss (Q × f > 100,000 GHz). temperatures < 200 °C by the cold sintering process (CSP) [3,
Q is the reciprocal of the dielectric loss (tanδ) and indicates 42–49], which enables not only co-firing with base-metal elec-
the quantitative dissipation of the electrical energy within a trodes [3, 50, 51] but also PCBs [52] and polymers [43, 53].
dielectric. In a MW ceramic, it is a function of the width of the Along with CSCCs for RF applications, cold sintering has also
resonant peak, measured at 3 dB below peak height (∆f0) and is been employed to densify ferroelectrics [54–58], piezoelectrics
given by f0/∆f0. tanδ is the summation of intrinsic and extrinsic [59–63], thermoelectrics [64], semiconductors [65–70], electro-
losses; intrinsic losses relate to the crystal structure and are lytes [71–75], cathodes [76, 77] and oxides [78–82], which are
described by the interaction of the phonons with the EM field widely used in many applications, Fig. 1.
and define the lower limit of tanδ and the upper limit of Q in a
defect-free single crystal, whereas extrinsic losses are associ-
ated with imperfections in the crystal lattice such as impuri- Cold sintering
ties, defects, grain boundaries, pores, microcracks, order–dis- MW ceramics are discussed in detail in section “Microwave
order, random crystallite orientation, dislocations, vacancies Dielectric Materials and Devices by Cold Sintering” but here we
and dopant atoms [1, 2]. Extrinsic losses can be eliminated present a brief overview of a broader range of functional ceram-
or minimized by optimizing material processing. Generally ics that have been shown to cold sinter, alongside a detailed
speaking, Q linearly decreases with increasing frequency [1]. description of the process and its mechanism.
The TCF or τf indicates the thermal stability of a resonating body
and describes the drift of f0 as a function of temperature. It is given by [1]
Overview of cold sintering of functional ceramics Different sintering methods possess different mass transport
Guo et al. [58] demonstrated that ferroelectric B aTiO3 (BT) mechanisms/routes which ultimately lead to different energy
ceramics could be densified (relative density, ρr ~ 93%) at 180 °C (temperature) requirements. Sintering temperature may be
with the help of Ba(OH)2/TiO2 suspension, which was further reduced by the application of external pressure (e.g. hot press-
increased to 95% after post-annealing treatment. More recently, ing) or the addition of a component that forms a liquid at the
dense BT nanoceramics (ρr ~ 92–95%, grain size ~ 75–150 nm) sintering temperature. Effectively, these two factors act in com-
were successfully cold sintered in a single step at 300 °C for bination in cold sintering, leading to a dramatic lowering of the
12 h at 520 MPa with the aid of a molten hydroxide flux sintering temperature for specific materials [42].
(NaOH:KOH = 1:1) [55]. Piezoelectric ceramics, such as lead Randall et al. [47] utilized ZnO to study the mechanism(s)
zirconate titanate (Pb(Zr,Ti)O 3, PZT), potassium-sodium of cold sintering, revealing that the gradient of the densification
niobate (K0.5Na0.5NbO3, KNN) and sodium bismuth titanate rate varied from 1 to 1/3. They also noticed that the rate of both
(Na0.5Bi0.5TiO3), have been successfully densified by cold sin- stages remains almost unchanged with applied pressure, suggest-
tering with the help of transient liquid-phase (Pb(NO3)2 solu- ing similar mechanisms are valid over a range of densification
tion for PZT, NaCl aqueous solution for KNN and Bi(NO3)3/ conditions. The two different densification rates are attributed
NaOH/TiO2 suspension for NBT [59–63]. Semiconductor V 2O5 to two stages of densification. The first is dominated by parti-
as well as V2O5-poly(3,4-ethylenedioxythiophene) poly(styrene cle compaction and rearrangement, whereas the second, with a
sulfonate) (PEDOT:PSS) composites have been cold sintered lower densification rate, relates to a “dissolution–precipitation”
at 120 °C [66]; the electrical conductivity (4.8 × 10−4 S/cm at mechanism.
25 °C), activation energy (0.25 eV at 25 °C) and Seebeck coef-
ficient (− 990 μV/K at 50 °C) of cold-sintered V 2O5 were com- Stage 1: particle compaction
parable to conventionally sintered samples and were further
At the beginning of stage 1, particles are separated with a
increased by the addition of 1–2 vol% PEDOT:PSS. The cur-
solution/void. Densification at this stage is mainly from the
rent status of cold sintering of Z rO2 has been reviewed by Guo
compaction (i.e. external pressure pushes particles closer
et al.; ρr ~ 85% is achieved by a one-step cold-sintered process
to each other) and rearrangement of particles, as shown in
at 180 °C which increased to ρr ~ 95% with comparable Vickers
Fig. 2. The solution will also redistribute at this stage due
hardness after annealing at 1100 °C, much lower than conven-
to the combination of external and capillary pressure [88].
tional sintering process (~ 1400 °C) [79]. The application of
Generally speaking, this stage is similar to dry uniaxial press-
cold sintering to solid-state lithium batteries has been reviewed
ing but with three extra factors: transient solution, elevated
by Liu et al. [46], in which recent progress in different solid
temperature and higher pressure, which help the process
electrolytes and electrodes is summarized. Li ion electrolytes
individually and collectively.
and electrodes may be densified but the electrochemical prop-
The transient solution contributes to the particle rear-
erties of the cold-sintered electrolytes and electrodes required
rangement by (i) acting as a lubricant between particles and
improvement.
assists the rearrangement and sliding process, (ii) exert-
The high pressure is the main driving force to the com- the concentration rises, the solution becomes super-saturated to
paction/rearrangement of particles, but in cold sintering, the the point where precipitation begins. With the help of external
solubility of particles also increases according to [89] and capillary pressure to keep the particles in close proximity,
dissolution–precipitation initially leads to necking, similar to
∂ ln N Vaq − Vcr
=− , (5) that observed in solid-state sintering, Fig. 2. As the aqueous
∂P T RT
solution evaporates, coarsening of particles occurs through pre-
where N is the mole fraction of the component in the solution, P cipitation on their surface or alternatively new particles nucle-
is the pressure, T is temperature, Vaq is the partial molar volume ate [65], Fig. 2. An amorphous rather than crystalline phase
of component in the solution, Vcr is the partial molar volume can form if the solute is strongly bonded with solution [3, 56,
of component in the dissolving solid, and R is the universal gas 68]. The crystalline phase may, however, be recovered through
constant. The pressure is concentrated at acicular points of con- post-annealing [57, 58]. We note that the gel/glass phase may
tact and sharp edges (GPa can be realized), which promotes be beneficial for the cold sintering process by facilitating plastic
preferential dissolution [90], smoothing particles and helping flow, thereby filling voids.
rearrangement. The elevated temperature is not as critical as the
transient solution and high pressure at this stage but increases
the solubility and accelerates the dissolution. At the end of stage Incongruent dissolution and limited dissolution
1, a relatively rigid skeleton is formed with further particle rear- Incongruent dissolution means the composition of the solute in
rangement giving only a minor contribution to densification. solution does not match that of the solid. An inert surface (pas-
sive) layer forms from oxide component(s) which is(are) least
aTiO3, Ba2+ ions possess a much higher
soluble. In the case of B
Stage 2: dissolution–precipitation and grain coarsening 4+
solubility than T
i [54] and a Ba-depleted layer (i.e. amorphous
Stage 2 relies on filling of gaps/voids between grains. In TiO2) forms on the surface of particles. To overcome this issue,
solid-state sintering, mass transport is achieved via two a pre-saturated Ba(OH)2 water solution with TiO2 nanoparti-
main mechanisms, evaporation–condensation and diffusion cle suspension is introduced [57, 58]. Hydrothermal synthesis
through different routes (e.g. surface, grain boundary). In takes place at the particle interfaces, densifying the ceramic
most cases, the contribution from the former is negligible due body, through the formation of a nanocrystalline or amorphous
to low vapour pressure in air, and mass transport is domi- BaTiO3 phase with uniformly distributed Ba and Ti ions. The
nated by solid-state diffusion. However, in cold sintering, the ρr of the composite is ~ 93% which can be improved to 96% by
temperature is remarkably lower than that of conventional post-annealing at 900 °C to recrystallize the glass phases [57,
solid state and solid-state diffusion is unlikely. The solid–gas 58]. For low solubility compounds such as Pb(Zr,Ti)O3, there
interface is replaced with a solid–liquid interface and dissolu- is less chance of the formation of a depletion layer and aqueous
tion–precipitation is possible, since the energy required for Pb(NO3)2 has been used as the transient solution to achieve 89%
liquid-phase transport is significantly lower than for solid- theoretical density [59].
state diffusion. Dissolution–precipitation is only viable for
trated at the contact points. As a result, the solubility is higher temperature and particle size (i.e. specific surface area) [94].
which creates a concentration gradient. Solute is then redistrib- The effect of pressure has already been discussed above but
uted by diffusion to other locations with lower concentration
Journal of Materials Research
γ Am
log (∗KA ) = log (∗KA→0 ) + , (6)
3.454RT
where *KA is the solubility constant for the solute particles with
the molar surface area A, *KA→0 is the solubility constant for
substance with molar surface area tending to zero, γ is the sur-
face tension of the solute particle in the solvent, Am is the molar
surface area of the solute, R is the universal gas constant, and T
is the absolute temperature. However, this effect only becomes
significant when the particle size is at the nanoscale.
Finally, we note the solubility can increase through chemical
reaction. When water is used as solvent, the solubility of ZnO is
only 0.0004% at room temperature [96]. Yet when hydrochloric
acid is used as solvent, the following reaction takes place:
sintered MW ceramics, Fig. 4, including NaCl, LMO, N a2Mo2O7 sure (350 MPa) are required.
(NMO), K2Mo2O7, Li2WO4, Na2WO4, BiVO4. With the help of The following year, Guo et al. [3] proposed that the ‘cold
85% relative humidity, NaCl ceramics could be densified to 90% sintering offered a new era for ceramic packaging and micro-
Journal of Materials Research
density at room temperature without applying uniaxial pres- wave device development’. To illustrate this point, (Li,Bi)0.5MoO4
sure, as shown in Fig. 4b), and was denser than samples sin- (LBMO) was cold sintered at 120 °C, Fig. S1, with ρr of 88.5%,
tered at 600 °C and 700 °C (ρr = 84%). Significant grain growth εr of 33.7, Q × f of 2300 and τf of +184 ppm/ °C. The grain size
(initially 3 μm to 20–30 μm, Fig. 4b) was observed due to the of cold-sintered LBMO was limited to the initial particle size of
Figure 4: SEM images of NaCl sintered at (a) room temperature and 75% relative humidity for 24 h, (b) room temperature and 85% relative humidity for
2Mo2O7 ceramics cold sintered at 120 °C
10 h, (c) 600 °C for 50 min and (d) 700 °C for 10 min. Cross-section SEM images of (e) LMO, (f ) NMO and (g) K
and 350 MPa for 15 min [42].
ceramic powders, since most systems were coarse-grained and and AgNaMoO 4 (ANMO, ρ r ~ 90.8%, ε r ~ 9.3, Q × f ~ 7078,
do not achieve > 92% density and grain growth is suppressed. τf ~ − 120 ppm/ °C) [101], as listed in Table S1. The major-
Hong et al. [92, 99] systematically studied the effect of ity of the above are based on molybdates but recently, lower
applied pressure and water on cold sintering of NaCl ceramics cost L iMgPO 4 (LMP, ρ r ~ 93%, ε r ~ 6.5, Q × f ~ 16,000) MW
at room temperature. As applied uniaxial pressure increased, ceramics were also successfully cold sintered [102], Fig. 5. In
ρr of dry NaCl water increased from 80% (50 MPa) to 99.3% this work, with the increase of cold sintering temperature and
(300 MPa), which is due to the plastic deformation [92]. time, ρr and εr were enhanced (Fig. 5a, b) and slightly higher
They found that the addition of 4% water promoted the dis- than conventionally sintered samples (ρr ~ 92% and εr ~ 6.4).
MW ceramics with 4.7 < ε r < 30, such as N a 0.5 Bi 0.5 MoO 4 to the increase of εr and loss tangent (Table S2). The effect of dif-
(NBMO, ρr ~ 84.9%, εr ~ 20.7, Q × f ~ 1500, τf ~ + 46 ppm/ °C) ferent amounts of TiO2 on the microstructure and MW dielectric
[100], (Bi0.95Li0.05)(V0.9Mo0.1)O4 (BLVMO, ρr ~ 73%, εr ~ 30, properties of LMO was also investigated in a related study [103].
Journal of Materials Research
Q × f ~ 1300, τf ~ + 61 ppm/ °C) [101], KCl (ρr ~ 98%, εr ~ 4.74, εr increased from 5.1 (0 vol% T iO2) to 10.1 (30 vol% T
iO2), as
Q × f ~ 7738, τ f ~ − 149 ppm/ °C) [101], K 2 MoO 4 (KMO, listed in Table S3 [98], but τf (+20 ppm/oC) remained stubbornly,
ρr ~ 100%, εr ~ 6.37, Q × f ~ 26,500, τf ~ − 70 ppm/ °C) [101], high even with 20 vol% TiO2 (Table S3) [103].
Figure 5: ρ and ρr of LMP ceramics as a function of (a) sintering temperature and (b) sintering time. (c) The schematic crystal structure of LMP. XRD
patterns of LMP ceramics cold sintered at different (d) sintering temperatures and (e) sintering times. (f ) Rietveld refinement of cold-sintered LMP
ceramics [102].
Figure 7: (a) Schematic of cold-co-sintered ceramic-polymer composites with different amounts of polymer. BSE images of (b) 0.9LMO-0.1PTFE and (c)
0.4LMO-0.6PTFE composites cold sintered at 120 °C and 350 MPa for 20 min [43].
Figure 8: (a) Schematic of integrated material properties by balancing ceramic/polymer ratio. Electrical and mechanical properties of LMO-PTFE
composites as a function of PTFE volume fraction: (b) εr, (c) (Q × f, (d) TCF (τf ), (e) elastic modulus and (f ) shear modulus [43].
cooling. These issues are completely resolved by cold sintering To demonstrate the potential of cold sintering for RF applica-
either due to the ultralow sintering temperatures or the absence tions, different devices have been designed and fabricated. In
of lateral shrinkage. Wang et al. demonstrated using NBMO- 2016, Baker et al. printed LMO monolithic capacitors on PET/
xLMO (Fig. 9A), a three-layered macroscopic ceramic–ceramic Ni foil substrates with Ag internal electrodes [53], as shown in
Figure 9: (A) BSE and SEM images of cold-sintered (a, b) 90 wt%NBMO–10 wt%LMO and (c, d) 20 wt%NBMO–80 wt%LMO composite samples; (B) (a)
schematic illustration and (b) optical picture of the NBMO-LMO three-layered composite ceramics [100].
Figure 10: Photograph of (A) printed LMO capacitors on PET films and (B) printed LMO capacitors on Ni foils; (c) cross-sectional SEM images of a cold-
sintered single-layered LMO capacitor [53].
Fig. 10, thereby demonstrating a facile and flexible method for S6a). A high total efficiency of 88.4% was obtained in this
the production of single and multilayer capacitors using cold antenna at the frequency of 5.2 GHz with an antenna gain of
sintering, Fig. S4 [3]. 5.7 dBi (Fig. S6c), again suggesting CaSnSiO5-KMO composi-
Simultaneously, the first microstrip patch antenna was tions are suitable for antenna applications.
designed and fabricated using a cold-sintered LMO disk as a Most importantly from a manufacturing perspective, Wang
substrate, Fig. 11 [112]. Lateral dimensions were controlled by et al. [52] have demonstrated that cold-sintered, temperature sta-
the mould, simplifying the design/modelling of the antenna per- ble 0.9BMO–0.1KMO (30 × 30 × 7 mm, εr ~ 31) could be directly
formance. However, due to high relative humidity (80%) and pressed onto PCBs (TM < 200 °C) with a satellite navigation
water absorption, a lower f0 and a reduced antenna efficiency antenna subsequently fabricated using the standard Cu metalliza-
were observed compared to the simulated results, which was tion as the ground plane, as shown in Fig. 14A [52]. No chemi-
subsequently resolved using a silicone conformal coating. cal reaction/delamination was observed at the interface between
Wang et al. also designed and simulated a novel dielectric ceramic and Cu layers, as shown in the SEM images and EDS ele-
GRIN lens based on cold-sintered NBMO-xLMO [100] and mental line-scans in Fig. 14B. An S11 of − 10 dB and a bandwidth
BLVMO-xNMO [101] ceramic systems (Fig. S5) which exhib- of 59 MHz was measured in the antenna with an axial ratio < 3 dB
ited good aperture efficiencies of 78% and 70%, respectively. (Fig. 14C), which covered the desired frequency bands 1561 MHz
Furthermore, BLVMO-NMO-based multilayer ceramic capaci- for BeiDou and 1575 MHz for GPS/Galileo with high efficiencies
tors (MLCCs) were successfully cold sintered at 150 °C with of 87–88%, as shown in Fig. 14D. This latter contribution demon-
Ag internal electrodes without evidence of interfacial reaction, strates the potential of cold sintering for the fabrication of low-cost
delamination and wrapping (Fig. 12); [50] the dielectric prop- integrated ceramic-polymer substrate technology, opening up new
of ~ 2.5 GHz (Fig. 13a) and the realized gain was 2.73 dBi at Summary and perspectives
2.5 GHz, leading to a radiation efficiency of 62% [51]. In this contribution, the underpinning principles of MW
ceramic technology and cold sintering have been reviewed.
Journal of Materials Research
at high temperatures and are expensive due to the large amount range of cold-sintered ceramics but also improve the
of energy required for densification in addition to the high raw interparticle interface and thus Q × f.
materials costs. Cold sintering, particularly for congruent dis- (4) Sensitivity to atmospheric moisture due to the partially
Journal of Materials Research
solving ceramics and composites, offers, through its unique soluble nature of cold-sintered ceramics may also pose
“dissolution–precipitation” process, a feasible and sustainable issues for long-term usage. In addition, mechanical
technology to realize ultralow-temperature and low-carbon properties (and thus handling characteristics) have
manufacturing of MW devices. Temperature stable cold-sintered been reported to be significantly worse than their con-
Figure 12: (a) SEM image for the cross section of BLVMO-NMO MLCCs; EDS elemental mapping: (b) elemental layered image, (c) Ag, (d) Na, (e) Bi, (f ) Mo,
(g) V and (h) O [50].
ventionally sintered counterparts. Humidity sensitiv- shape can be uniaxially pressed prior to conventional
ity may well be resolved through a low-cost polymer sintering, then it is feasible that it can fabricated by cold
encapsulation process [112] but how to mitigate against sintering.
low mechanical strength remains unclear and could
Volume 36
have relatively simple geometries (rectangular blocks cal Sciences Research Council (EPSRC) funded through Grant
or cylinders). Further work required to understand Nos. EP/L017563/1 and EP/N010493/1; Henry Royce Institute
and control the cold-sintered process in more complex for Advanced Materials funded through EPSRC Grants EP/
pressed or moulded shapes. In principle however, if a R00661X/1, EP/S019367/1, EP/P02470X/1 and EP/P025285/1.
Figure 14: (A) Schematic diagram of cold sintering ceramic substrate for antennas; (B) SEM images and EDS elemental line-scans of a cross section of
cold-sintered BMO-KMO on a Cu-metallized PCB; (C) measured S11 curve of the antenna and (D) measured antenna performance of the fabricated
ceramic antenna at two frequency bands [52].
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