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SOT363

plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2


mm x 1.25 mm x 0.95 mm body
9 May 2018 Package information

1. Package summary
Terminal position code D (double)
Package type descriptive code TSSOP6
Package type industry code TSSOP6
Package style descriptive code TSSOP (thin shrink small outline package)
Package body material type P (plastic)
JEITA package outline code SC-88
Mounting method type S (surface mount)
Issue date 16-3-2006
Manufacturer package code SOT363

Table 1. Package summary


Parameter Min Typ Nom Max Unit
package length 1.8 - 2 2.2 mm
package width 1.15 - 1.25 1.35 mm
seated height 0.8 - 0.95 1.1 mm
nominal pitch - - 0.65 - mm
actual quantity of termination - - 6 - A/A
NXP Semiconductors SOT363
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body

2. Package outline

Plastic surface-mounted package; 6 leads SOT363

D B E A X

y HE v M A

6 5 4

pin 1
index A

A1
1 2 3 c

e1 bp w M B Lp

e
detail X

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)


A1
UNIT A bp c D E e e1 HE Lp Q v w y
max
1.1 0.30 0.25 2.2 1.35 2.2 0.45 0.25
mm 0.1 1.3 0.65 0.2 0.2 0.1
0.8 0.20 0.10 1.8 1.15 2.0 0.15 0.15

OUTLINE REFERENCES EUROPEAN


ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION

04-11-08
SOT363 SC-88
06-03-16

Fig. 1. Package outline TSSOP6 (SOT363)

SOT363 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved

Package information 9 May 2018 2/5


NXP Semiconductors SOT363
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body

3. Soldering
2.65

solder lands
2.35 1.5 0.6 0.5 0.4 (2×)
(4×) (4×) solder resist

solder paste

0.5 0.6 occupied area


(4×) (2×)
0.6 Dimensions in mm
(4×)
1.8 sot363_fr

Fig. 2. Reflow soldering footprint for TSSOP6 (SOT363)

1.5

solder lands
4.5 0.3 2.5
solder resist

occupied area
1.5
Dimensions in mm

preferred transport
1.3 1.3 direction during soldering

2.45

5.3 sot363_fw

Fig. 3. Wave soldering footprint for TSSOP6 (SOT363)

SOT363 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved

Package information 9 May 2018 3/5


NXP Semiconductors SOT363
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body

4. Legal information

Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.

SOT363 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved

Package information 9 May 2018 4/5


NXP Semiconductors SOT363
plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body

5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4

© NXP B.V. 2018. All rights reserved


For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 May 2018

SOT363 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved

Package information 9 May 2018 5/5

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