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3AL 75131 AAAA iii
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Contents
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Upgrade configurations
Upgrading legacy equipment ................................................................................................................... 1-43
Line Terminal (LT) .................................................................................................................................. 1-43
Network architectures
Point to point links .................................................................................................................................. 1-49
(Multi)point-to-multipoint links .............................................................................................................. 1-49
Linear (multipoint to multipoint) links ................................................................................................... 1-50
Ring (multipoint to multipoint) networks ............................................................................................... 1-50
Meshed networks ..................................................................................................................................... 1-51
Host systems (ADM..) ............................................................................................................................. 1-51
Protection scenario .................................................................................................................................. 1-53
2 Physical configuration
Rack design ............................................................................................................................................... 2-2
3 Functional Description
Optics
The Optical Signal Process ....................................................................................................................... 3-2
Transmission Rates/Mode and Standard Compliance ............................................................................... 3-4
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Performance Monitoring
Performance Monitoring Points on transmission boards .........................................................................3-20
Transmission Frame
Introduction ..............................................................................................................................................3-28
Wavelength division multiplexing ...........................................................................................................3-28
Optical channel transport unit (OTUk) description .................................................................................3-31
Loopbacks
TRBC & TRBD Loopbacks .....................................................................................................................3-32
2xGBE_FC & ETHC Loopbacks ............................................................................................................3-34
Equipment Control
Equipment Controller function ................................................................................................................3-36
Management buses/interfaces ..................................................................................................................3-37
Example of control interfaces scheme .....................................................................................................3-40
Power supply
Functional description .............................................................................................................................3-41
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B Abbreviations
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vi 3AL 75131 AAAA
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List of tables
4 Technical specifications
4-1 AEL at 980 and 1480 nm for Hazard Levels 1 and 1M ............................................................. 4-11
4-2 ALCT1010 wavelengths list ....................................................................................................... 4-41
4-3 Relation between Alarm severity terminology displayed onC.T./O.S. and alarm severity
terminology used for the ESCT leds and ETSI market racks (TRU). 4-55
4-4 Environmental Operating Conditions[1] .................................................................................... 4-66
4-5 Transportation climatic .............................................................................................................. 4-70
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List of tables
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B Abbreviations
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List of figures
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2-20 OADM on 100GHz grid: master shelf configuration with vertical amplifiers .......................... 2-23
2-21 OADM on 100GHz grid: master shelf configuration with horizontal amplifiers ...................... 2-24
2-22 Double MU optical connector .................................................................................................... 2-37
2-23 Example of intra-shelf links (10Base-T interface) ..................................................................... 2-39
2-24 Release 5.0 Board Faceplates (1/2) ............................................................................................ 2-45
2-25 Release 5.0 Board Faceplates (2/2) ............................................................................................ 2-46
2-26 TRBD1111, TRBD1121, TRBD1131 boards front panel .......................................................... 2-48
2-27 TRBD1191 board front panel ..................................................................................................... 2-49
2-28 TRBC1111 board front panel ..................................................................................................... 2-50
2-29 2xGE_FC board front panel ....................................................................................................... 2-51
2-30 ETHC1000 board front panel ..................................................................................................... 2-52
2-31 SFP optical module .................................................................................................................... 2-53
2-32 XFP optical module .................................................................................................................... 2-54
2-33 CMDX1010 board front panel ................................................................................................... 2-55
2-34 BMDX1X00 board front panel .................................................................................................. 2-56
2-35 ALCT1010 front panel ............................................................................................................... 2-57
2-36 OMDX8100_L1_X board front panel ........................................................................................ 2-58
2-37 OMDX8100_xx front panel ....................................................................................................... 2-59
2-38 OMDX4100 front panel ............................................................................................................. 2-60
2-39 OCPU2104 front panel ............................................................................................................... 2-61
2-40 LOFA11xx front panel ............................................................................................................... 2-62
2-41 ESCT2000 front panel ................................................................................................................ 2-63
2-42 OSCU1010 front panel ............................................................................................................... 2-64
2-43 OSCU1011 front panel ............................................................................................................... 2-65
2-44 HSKU1000 and HSKU1100 front panel .................................................................................... 2-66
2-45 RAIU1000 front panel ................................................................................................................ 2-67
2-46 USIB1000 front panel ................................................................................................................ 2-68
2-47 PSUP1000 front panel ................................................................................................................ 2-69
2-48 FANS1000 front panel ............................................................................................................... 2-70
3 Functional Description
3-1 Remote supervision through OSC .............................................................................................. 3-14
3-2 OSCU Implementation in OADM Configuration ...................................................................... 3-15
3-3 OSNCP: supported configurations ............................................................................................. 3-17
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4 Technical specifications
4-1 AEL for Class 1 between 1500 nm and 1800 nm ...................................................................... 4-10
4-2 AEL for Class 1M between 1500 nm and 1800 nm ................................................................... 4-11
4-3 Example of line failure between two LRs with unidirectional amplifiers ................................. 4-14
4-4 Example of line failure between a LR and a LT with unidirectional amplifiers ........................ 4-15
4-5 Example of line failure between a LR and a LT with bidirectional amplifiers .......................... 4-15
4-6 Climatogram for Class 3.2: Partly temperature controlled locations ......................................... 4-65
4-7 Climatogram for Class 1.2: not temperature controlled storage location .................................. 4-68
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5-7 Optical fiber duct, guides and contact spring removing ............................................................. 5-10
5-8 Side coverplate removal ............................................................................................................. 5-11
5-9 Levers removal ........................................................................................................................... 5-12
5-10 Optical connectors support removal ........................................................................................... 5-13
5-11 Side coverplate and contact spring removal ............................................................................... 5-15
5-12 Internal connectors removal ....................................................................................................... 5-17
5-13 Dissipator removal ..................................................................................................................... 5-18
5-14 Modules removal from dissipator .............................................................................................. 5-19
5-15 Daughter board removal ............................................................................................................. 5-20
5-16 Gold connector removal ............................................................................................................. 5-21
5-17 Internal cables removal .............................................................................................................. 5-22
5-18 Connector metal support removal .............................................................................................. 5-23
B Abbreviations
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xiv 3AL 75131 AAAA
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About this document
Purpose
The 1626 LM Technical Handbook presents a detailed overview of applications, planning,
and technical specifications for the 1626 LM product.
Intended audience
Network planners, analysts, managers, and engineers comprise the primary audience for
the Technical Handbook. However, the Alcatel-Lucent Account Team as well as anyone
who needs information about the features, applications, operation, and engineering, of the
1626 LM will find this document useful.
Supported systems
This document covers the features of 1626 LM Release 5.0.
Prerequisite knowledge
This document assumes that readers have the following required skills:
• Basic principles of optical telecommunication transmission
• Common optical telecommunication and system terminology
• Telecommunications test set operations
• Local operational and functional procedures
• Personal computer (PC) operation, common PC terminology, and navigational tasks in
a Windows-style user interface
Safety information
For safety information, please refer to Appendix A in this document.
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3AL 75131 AAAA xv
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About this document
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Related documentation
Alcatel-Lucent also provides the following documents to help you plan, install, and
operate your 1626 LM equipment:
• 1626 LM Operator Handbook - 3AL 75131 BAAA
• 1626 LM/SPLM Operator Handbook - 3AL 75131 FAAA
• 1626 LM Installation Handbook - 3AL 75131 CAAA
• 1626 LM Turn-On and Commissioning Handbook - 3AL 75131 DAAA
• 1626 LM Maintenance and Troubleshooting Handbook - 3AL 75131 EAAA
Related training
Alcatel-Lucent University provides courses to train telecommunication technicians in
installation, operations, and maintenance personnel. Contact Alcatel-Lucent at1-888-582-
3688 to enroll in training classes.
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xvi 3AL 75131 AAAA
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About this document
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Technical support
For technical support, contact your local customer support team. Reach them via the web
at http://alcatel-lucent.com/support or through the telephone number listed under the
Technical Assistance Center menu at https://support.lucent.com/portal/olcsHome.do.
How to order
To order Alcatel-Lucent documents, use the following website:
https://support.lucent.com/portal/olcsHome.do
How to comment
You can send your feedback to your local Alcatel-Lucent Technical Assistance Center at
https://support.lucent.com/portal/olcsHome.do. Your feedback will be forwarded to the
appropriate documentation team for evaluation and action, as appropriate. Be sure to cite
the relevant information such as product name, document title, document ID, release, issue
number, date, page number, etc. in your feedback.
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xviii 3AL 75131 AAAA
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1 Product Configurations
& Environment General
Overview
• Tributary Direct transponders with 10 Gbps and 40 Gbps line rates, optimized for Very
Long Haul applications, G. 709 compliant
• 4x2.5Gbps Tributary Concentrator with 10 Gbps line rate, optimized for Very Long
Haul applications, G. 709 compliant
• 2 x Gbe/FC aggregator with 2.5 Gbps line rate, SFP interface
• ETHC concentrator, with 10 Gbps line rate, SFP/XFP interface
In accordance with ITU-T Rec. G.709, UNI signals at 2.488/9.95/10.31/39.813 Gbps are
supported by the client side interface of the transponder platform. Completion of G.709
support is insured via software or firmware upgrades.
Details of supported client rates and types is delivered in Chapter 3, “Tributary sub-
system” on page 3-10 and Chapter 5, “Tributaries optical characteristics” on page 5-19.
The Alcatel-Lucent 1626 LM Line Terminal or Optical Add Drop NE (Fixed, Tunable and
Reconfigurable configurations consist of modular Mux/Demux architectures.
Three main Mux/Demux architectures are supported depending on the target grid and
application:
• 50 GHz based architecture supporting up to 96
• 100 GHz based architecture supporting up to 32 chs
• 100 GHz and 50 GHz mixed architecture supporting up to 48 chs.
The 50 GHz grid architecture is based on sub-bands that can be equipped with up to 8
channels. The system capacity can be scaled up to a maximum of 12 bands for a total
capacity of 96 channels. Release 5.0 supports Tunable and Reconfigurable OADM
architectures (T and R-OADM). They deliver a fully configurable flexibility to access any
wavelength in any site in point-to-point, ring or meshed networks.
The 100 GHz grid architecture is based on sub-bands that can be equipped with up to 8
channels. The system capacity can be scaled up to a maximum of 4 bands for a total
capacity of 32 channels. They deliver the full flexibility to access any wavelength in any
site in point-to-point, ring or meshed networks.
The 100 GHz and 50 GHz mixed architecture is based on sub-bands that can be equipped
with up to 8 channels. Up to 16 channels are supported into the 100 GHz grid sub-bands
and up to further 32 channels can be supported into the 50 GHz sub-bands for a total
capacity of up to 48 channels. They deliver the fully flexibility to access any wavelength in
any site in point-to-point, ring or meshed networks.
Details on system configuration are delivered in Chapter 3, “Functional description” on
page 3-1.
The Alcatel-Lucent 1626 LM supports Line Optical Fiber Amplifiers (LOFA) in Line
Terminal, OADM (fixed and Tunable/Reconfigurable configurations) and Line Repeater
sites. Line Optical Fiber Amplifiers are based on Erbium Doped Fiber Amplifier (EDFA)
technology and they are designed to amplify the aggregate/line signal, in the extended C-
band.
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Band Optical Fiber Amplifiers (BOFA) Band Optical Fiber Amplifiers are designed to
amplify one band (8-ch).
Other main features
• G.709/G.798 Optical Layer Management
• Future proof platform moving from pre-OTN system to OTN thanks to the G.709
transponders and concentrators
• Gradual G.709 feature support through simple SW upgrades
• Same Transponder HW delivering UNI B&W interfaces toward the client side
• Enhanced FEC algorithm on colored 10 Gbps interface to boost span reach
• Ingress and egress PM and TCA based on B1; Ingress and egress J0 non-intrusive
monitoring
• L1 and L2 PM on ETHC board, on both client and line sides
• L1 PM on TRBC/TRBD and 2xGE_FC, client side
• PM and TCA at transmission section level based on FEC corrected/uncorrected errors
• Full transparent concentration functionality for TRBC/TRBD boards.
• Transparency functionality for ETHC boards with respect to MAC frame integrity.
• G.709 maintenance signal
• G.709 Generic Communication Channels managed inside the WDM line providing
2Mbps clear channel per 10 Gbps transmitted channel.
• In-service upgrade of already installed DWDM links and of legacy DWDM platforms
The Alcatel-Lucent 1626 LM supports optimized configuration to upgrade legacy
platforms (more details in 3AL 94720 AAAA (REL.1.0), 3AL 94799 AAAA, (rel.1.2)
technical handbooks). This allows to provide new features on legacy platforms in an
easy and traffic hitless way. Single shelf configuration hosting different types of
tributaries is supported to optimize the upgrade of the legacy networks.
• Multiple configurations and multiple network architectures
The 1626 LM can be configured as
• Line terminal (LT)
• Line repeater (LR)
• Tunable and Reconfigurable Add & Drop Multiplexer (T/R OADM)
• Optical Add & Drop Multiplexer (OADM)
These basic configurations address all the different optical network applications. It
covers both point-to-point and point-to-multipoint applications in mesh contexts as
well as in ring scenarios.
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• on OSCU
– an audio (phone) interface
• on USIB
– 2 x 64 kbps digital channel (E1 west and E1 east),
– a phone extension connection (to interconnect two different links)
• on TRBD and TRBC
– a 2Mbps digital channel, a G.703 interface on RJ45 connector
• CPE: two types of CPE configurations can be supported by the 1626 LM
• a 8-channels multiplexed subsystem able to perform a first traffic aggregation step in
sites far from the system terminals (in a future release)
• a remote tributary shelf delivering up to a maximum of 16 single channel outputs
• Firmware download
In-service upgrade providing an automatic firmware update of the slave boards after
each software update. As firmware download may be traffic affecting for some boards,
the operator can decide when this operation is the most convenient.
Different configurations are available depending on the addressed application and grid.
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Configurations are reported into three subsections addressing the applicable grid schemes:
• 50 GHz grid supported configurations
• 100 GHz grid supported configurations
• 50 and 100 GHz mixed grid supported configurations
In the next paragraphs/figures
• OMDXn100 stands for Optical Multiplexer and Demultiplexer supporting the 100
GHz grid. It supports up to 8 wavelengths multiplexing and demultiplexing.
Additional upgrades port maybe present depending on the OMDX version (see codes
in Table 2-1, “1626 LM boards and units list1626 LM explanatory notes” (p. 2-20) for
more details). The parameter n can be 4 or 8 depending on the number of maximum
multiplexed channels:
• OMDX4100 is a 4:1 channel multiplexer & demultiplexer 100 GHz grid compliant
unit
• OMDX8100 is a 8:1 channel multiplexer & demultiplexer 100 GHz grid compliant
unit.
• CMDX stands for Channel Mux/Demux (8:1/1:8 mux/demux). It supports up to 8
wavelengths multiplexing and demultiplexing in the 50 GHz grid.
• BMDX stands for Band Mux/Demux (BMDX1000) in line terminal and back-to-back
terminal configuration or Band OADM (BMDX1100) in OADM configuration
compliant to the 50 GHz grid
• the BMDX1000 supports up to 8 wavelengths per band but does not allow the band
pass-thru (in back-to-back configuration) functionality
• the BMDX1100 supports up to 7 wavelengths per band and allows the full transparent
pass-thru at band level
• LOFA stands for Line Optical Fiber Amplifier, designed to amplify the aggregate
signal (all the extended C-band)
• BOFA stands for Band Optical Fiber Amplifier. Provides one or two gain blocks. A
gain block may be used for a single channel amplification or between CMDX and
BMDX.
• OSCU stands for Optical Supervisory Channel Unit, allowing the NE management:
OSC is extracted (inside LOFA) from the aggregate signal before entering the pre-
amplifier and then added after the optical amplification of the aggregate signal,
allowing to remotely manage the NE also in case of optical amplifier failure. The
added/dropped signal is coming from/sent to OSCU communicating with ESCT.
• OCPU stands for Optical Channel Protection Unit. Contributes to O-SNCP client
signal 1+1 optical protection. Depending on the OCPU model, 1 or 2 channels can be
protected.
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In the next block schemes, only Tributary Direct Transponders with one 10Gbps B&W
client signal and one colored 10Gbps signal, are taken into account.
The Tributary Concentrator, TRBC (with 4 x 2.5Gbps B&W client interfaces and a
colored 10Gbps one) and the 2xGE_FC (with 2 x GbE or FC B&W client interfaces and a
colored 2.5 Gbps one) are also available, but they are not shown in the following figures,
for simplicity reasons.
In the following are detailed the various configurations.
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• Add_drop_2
The channel from direction two is dropped and the same channel is added to direction
two.
• Add_Drop_1&2
The channel is added and dropped for both directions.
• Blocked
The channel is blocked.
At anytime the R-OADM operator is able to modify the state of any channel via a
Graphical User Interface. If the channel is in express state, the operator is able modify its
attenuation in order to perform power gain equalization.
The following figure illustrates a R-OADM configuration.
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2
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• Up to 22 CMDX1010
11 per direction, 1 band is reserved by ALCT, as default B5.
• 2 BMDX1000
• Transponders
• ALCT (optional)
Enables system loading (optional board).
• OSCU
Provides supervision.
Each channel of the T-OADM configuration may be in any of the 5 following states:
• Express
The channel is transmitted from one line to the other
• Add_drop_1
The channel from direction one is dropped and the same channel is added to direction
one.
• Add_Drop_2
The channel from direction two is dropped and the same channel is added to direction
two.
• Add_Drop_1&2
The channel is added and dropped for both directions.
• Blocked
The channel is blocked.
At anytime the T-OADM operator is able to modify the state of any channel via a
Graphical Usier Interface. If the channel is in express state, the operator is able modify its
attenuation in order to perform power gain equalization.
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Degree 3 or Y node
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For T-OADM configuration, for each Add & Drop channel, the operator is able to choose
the transponder to perform the Add & Drop. As a consequence, in such configuration all
transponders are able to transmit/receive all of the 96 possible channels.
Y node configuration brings the capability to add and drop one or more wavelengths
to/from the aggregate signal in any of the three directions. It provides the ability to
establish a connection for any wavelength from one to any of the other two directions.
Thus each channel of the Y node configuration may be in one or more of the following
states:
• Express_XY
The channel is transmitted from direction X to direction Y (and from direction Y to
direction X)
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• Add_drop_X
The channel from direction X is dropped and the same channel is added to direction X.
• Blocked_X
The channel from line X is blocked. There is no transmission whatever the channel
state is.
At anytime the Y node operator is able to modify the state of any channel via a Graphical
User Interface. If the channel is in express state, the operator is able modify its attenuation
in order to perform power gain equalization.
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Degree 3 or Y node
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Example of a Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid
Figure 1-10 Long Haul Optical Add and Drop Multiplexer Repeater, 50 GHz grid
In OADM repeater configuration, up to 11 wavelength bands per direction can be sent to
the line (1 band is occupied by ALCT).
A maximum of 77 channels (11 bands) can be sent/received to/from the line, per each side
(it is mandatory to keep one band for the ALCT in an OADM, to protect the transmission)
A 7-wavelength at 50 GHz granularity per band, is used per band.
These wavelength are: 195900 (1530.33nm); 195500 (1533.46nm); 195100 (1536.61nm);
194700 (1539.76nm); 194300 (1542.93nm); 193900 (1546.12nm); 193500 (1549.31nm);
193100 (1552.52nm); 192700 (1555.74nm); 192300 (1558.98nm); 191900 (1562.23nm);
191500 (1565.49nm).
Up to 100% of the wavelengths can be added/dropped. The non-added/dropped channels
are in complete pass-through and reamplified.
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ALCT is used to ensure a protection of the added/dropped channels against a line failure
affecting the pass-through. It also facilitates the loading of the system. The ALCT band is
specified according to the link design . Typically two boards are used in OADM (but a
higher number may be used), in order to substitute the relevant missing CMDXs (2
ALCTs have always to be plugged in OADM).
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Product Configurations & Environment General Overview Line Terminal
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Line Terminal
In Line Terminal configuration (LT), the 1626 LM connects up to 32 x 10 B&W client
signals, using TRBD transponders. For Gigabit Ethernet or Fiber Channel clients
aggregation, combination of ETHC/TRBD or 2 GBE_FC/TRBC can be implemented.
Up to 32 colored WDM signals are multiplexed in the line/aggregate signal.
The fully equipped LT configuration requires a single rack.
In the LT configuration the equipment is placed at both ends of point-to-point links. The
schematic representation of the LT configuration is reported in Figure 1-13, “1626 LM
line terminal configuration on a 100GHz grid” (p. 1-27). It consists of
• one or two line amplifier boards (LOFA), with the extraction/insertion of the OSC
before/after the double-stage amplifier
• up to 4 OMDX providing the 1626 LM mux/demux scheme
• transponders (TPD)
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Product Configurations & Environment General Overview Line Terminal
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3AL 75131 AAAA 1-27
Edition 1 March, 14th, 2008
Product Configurations & Environment General Overview Line Repeater (LR)
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Product Configurations & Environment General Overview Optical Add and Drop Multiplexer (OADM)
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Figure 1-15 1626 LM OADM / back to back configuration on a 100 GHz grid
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3AL 75131 AAAA 1-29
Edition 1 March, 14th, 2008
Product Configurations & Environment General Overview Line Terminal (LT)
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Figure 1-16 Line terminal configuration on a 50 and 100GHz mixed grid + 2 stages
amplifier
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3AL 75131 AAAA 1-31
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Product Configurations & Environment General Overview Optical Add and Drop Multiplexer (OADM)
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Product Configurations & Environment General Overview MUX/DMUX Configurations
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MUX/DMUX Configurations
Example of MUX and DMUX functions
Line Terminal configurations
In a 4 or 8-channels Line Terminal, multiplexing and demultiplexing are performed in one
step. The extra input of the MUX and the extra output of the DMUX are not connected.
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3AL 75131 AAAA 1-33
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Product Configurations & Environment General Overview MUX/DMUX Configurations
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OADM configurations
The example of Figure 1-21, “MUX and DMUX functions of an 8 channels OADM”
(p. 1-35) is an 8-channels OADM. 8 channels are dropped and added on both east and
west lines. In this configuration, the extra output of each DMUX is connected to the extra
input of the MUX of the opposite transmission direction. This allows to place the other 24
channels in pass through.
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3AL 75131 AAAA 1-35
Edition 1 March, 14th, 2008
Product Configurations & Environment General Overview MUX/DMUX Configurations
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Pass-through
Optical pass-through can be performed at the expansion and extra level.
It is also possible to perform non-regenerative optical pass-through at the channel level in
case the design and the performances allow it.
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Product Configurations & Environment General Overview Amplification Configurations
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Amplification Configurations
The amplifiers used are LOFA11xx: they are EDFA (Erbium Doped Fiber Amplifier)
aggregate amplifiers able to amplify all the Extended C-band.
Optical Amplifiers are based on a two-stage optical gain block which provides optical
access between the two stages (interstage), used to insert a passive DCU (either DCF or
any other technologies); if no DCU is used, an attenuator may be installed or the VOA
may be tuned to perform the inter-stage loss.
The LOFA serves as
• in-line amplifier when it is used in a regenerator capacity
• terminal pre-amplifier when it is used as the front-end of an optical receiver
• post-amplifier (booster) when it boosts the output signal of a laser transmitter.
LOFA1110 and LOFA1120 provide up to 20 dBm output power without external pump
module.
These two boards also provide connection to an external pump module to increase the
output power up to 23 dBm (future release).
LOFA1111 and LOFA1121 provide up to 17 dBm output power. These boards do not have
a connection for upgrades with an external pump module.
The 1510 nm OSC wavelength is extracted from the aggregate signal at the input of the
first stage of the amplifier and it is added to the aggregate signal at the output of the
second stage.
LOFA contains an internal VOA in order to optimize the gain flatness during the system
lifetime and to avoid non-linear effects in DCF that can fill the interstage.
It is also able to automatically tune its VOA and its 1st stage output power.
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Product Configurations & Environment General Overview Amplification Configurations
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Product Configurations & Environment General Overview Amplification Configurations
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See Figure 1-27, “Optical amplification in Line Repeater configuration” (p. 1-41).
A Line Repeater is made up of two LOFAs in In-Line Amplifier configuration.
If no DCU are used, an attenuator may be installed or the VOA may be tuned to perform
the inter-stage loss.
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3AL 75131 AAAA 1-41
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Product Configurations & Environment General Overview Amplification Configurations
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Product Configurations & Environment General Overview Upgrading legacy equipment
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Upgrade configurations
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3AL 75131 AAAA 1-43
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Product Configurations & Environment General Overview Line Terminal (LT)
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3AL 75131 AAAA 1-45
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Product Configurations & Environment General Overview Line Terminal (LT)
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It is not allowed to upgrade an already installed 1640 WM system (with MDX4x1 and
MDX3x2 boards) with the 1626 LM mux/demux scheme (instead of MDX3x3)
connected to the MDX4x1 board.
Figure 1-31 Upgrade of the 1640 WM based on MDX in line terminal configuration
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This upgrade is always possible, whatever the actual number “N" of installed channels.
The remaining 32-“N" channels can be filled with 1626 LM transponders directly
connected to the OMDX16 boards of the 1686 WM mux/demux scheme.
Figure 1-32 1686 WM system upgrade with 1626 LM transponders in Line Terminal
configuration
Figure 1-33, “1686 WM system upgrade with the 1626 LM mux/demux scheme in LT
configuration” (p. 1-48) shows the 1686 WM upgrade scheme with the 1626 LM
mux/demux scheme connected to the expansion board of the 1686 WM.
This configuration is possible when only one 1686 WM Mux/Demux is installed (up to 16
chs), allowing the connection of the 1626 LM mux/demux to the unused port of the 1686
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3AL 75131 AAAA 1-47
Edition 1 March, 14th, 2008
Product Configurations & Environment General Overview Line Terminal (LT)
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WM EXP board. Hence it is possible to increase the channels number to more than 32
filling the available band with 50GHz spaced chs. The maximum supported configuration
is 52 wavelengths by upgrading the red band with up to 36 x 1626 LM channels.
Figure 1-33 1686 WM system upgrade with the 1626 LM mux/demux scheme in LT
configuration
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Product Configurations & Environment General Overview Point to point links
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Network architectures
The following architectures are foreseen:
• point-to-point
• (multi)point-to-multipoint, both in linear, ring and meshed topologies
(Multi)point-to-multipoint links
(Multi)point-to-multipoint links can be performed by means of some of the following
configurations
• line terminal, located at each end of the link, that multiplexes/de-multiplexes the
tributary signals
• line repeater, that amplifies the aggregate signal without the need of optical to
electrical conversion
• OADM repeater, able to add/drop a part (up to 100%) of the traffic
• Back-to-back terminal, able to add/drop up to 100% of the aggregate signal.
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3AL 75131 AAAA 1-49
Edition 1 March, 14th, 2008
Product Configurations & Environment General Overview Linear (multipoint to multipoint) links
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Product Configurations & Environment General Overview Meshed networks
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Meshed networks
Meshed networks can be typically implemented via Y or degree 3 nodes.
The following figure illustrates an example of meshed network.
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3AL 75131 AAAA 1-51
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Product Configurations & Environment General Overview Host systems (ADM..)
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Tx1 Rx1
Tx Rx Tx Rx3
GbE Rx1 Tx1
CLIENT ETHC1000 TRBD1191
Tx9 Rx9
SYSTEMS Rx Tx Rx Tx3
Rx9 Tx9 10Gps
1.25Gbps B&W 10Gbps B&W
COLORED
SIGNAL
Tx1 Rx1
GbE/FC Rx1 Tx1 Tx Rx2
CLIENT 2xGE_FC
Tx2 Rx2 Rx Tx2
SYSTEMS Rx2 Tx2 2.5Gps
1.0625Gbps / 1.25Gbps B&W COLORED SIGNAL
Tx
Tx1 Rx1 Rx
GbE/FC Rx1 Tx1
CLIENT 2xGE_FC Tx Rx4 AGGREGATE
Tx2 Rx2 MULTIPLEXED
SYSTEMS Rx2 Rx Tx4
Tx2 2.5Gbps B&W SIGNAL
(UP TO 96 λ)
2.5Gbps Tx Rx3
SDH/SONET
CLIENT SYSTEM Rx Tx3
2.5Gbps B&W
STM1/4, OC3/12,
FC/ESCON/ Tx Rx4 TRBC
GBE/FICON
CLIENT SYSTEM Rx Tx4 Tx Rx1
UP TO FOUR Rx Tx1
10Gbps
4 x ANY Tx Rx2
COLORED SIGNAL
STM1/4, OC3/12, Rx Tx2
FC/ESCON/ 2.5Gbps B&W
Tx Rx1
GBE/FICON
CLIENT SYSTEM Rx Tx1
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Product Configurations & Environment General Overview Protection scenario
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Protection scenario
In 1626 LM the optical protections are managed by means of dedicated protection coupler
boards integrated into the 1626 LM universal shelf. The 1626 LM is able to provide to a
generic host tributary system both linear and ring optical channel (OCh) protections. In
previous releases an additional (1660 OCP) equipment supported this kind of
configuration and 1626 LM in current release is supporting the interworking with 1660
OCP equipment.
Optical Channel (OCh) protection
The channel protection is provided with the Optical SNCP (O-SNCP) performed by means
of the OCPU2104 and transponders (TRBD, TRBC).
The tributary signal is bridged over two different lines (working and protecting line). In
this way the signal is delivered towards two different paths. At the receiver side the
selection between the two diversely routed signals is performed. The protection switching
is triggered by the following switching criteria: LOS, OTU-LOF, OTU-LOM, OTU-TIM,
ODU-AIS, Generic-AIS, FEC uncorrected errors.
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This kind of protection can be used on two different topologies: linear links and ring
topologies, as shown in Figure 1-38 and Figure 1-39, “Optical SNCP protection scheme:
with back-to-back terminals or OADM” (p. 1-55)respectively.
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Figure 1-39 Optical SNCP protection scheme: with back-to-back terminals or OADM
The split and select functions are optically performed, by means of passive optical
couplers and splitters.
The selection is done by shutting-down the user Tx corresponding to the path in failure
and activating the protecting one (see Figure 1-40).
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3AL 75131 AAAA 1-55
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2 Physical configuration
The 1626 LM has been designed to offer a record size integration to meet the challenging
requirements of the backbone environment.
A fully loaded 1626LM system with 96 channels (Line Terminal configuration on a
50GHz grid) is housed by three standard ETSI racks.
A fully loaded 1626LM system with 32 channels (Line Terminal configuration on a
100GHz grid) is housed by one standard ETSI rack.
The 1626 LM employs a common shelf type for the different network elements.
The NE composition, when the 1626 LM R.1.X is used with 1640 WM or 1686 WM line
sections, is described in release 1.0 and release 1.2 technical handbooks, code 3AL 94720
AAAA and 3AL 94799 AAAA and it will not be considered in this document.
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3AL 75131 AAAA 2 -1
Edition 1 March, 14th, 2008
Physical configuration Rack design
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Rack design
The 1626 LM mechanical design allows to put up to three shelves in current release.
Up to six racks are managed.
It is compatible with the following mechanical standard
• 2200 mm high ETSI rack.
The depth is compliant with the 300 mm deep ETSI racks.
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Physical configuration 1626 LM generic empty shelf
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3AL 75131 AAAA 2-3
Edition 1 March, 14th, 2008
Physical configuration 1626 LM generic empty shelf
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WIDTH = 532 mm
DEPTH = 288 mm
73 mm
21 22 39 40
HEIGHT = 466 mm
338 mm
23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
41 FANS
20 mm wide, small height slots (21, 22, 39, 40)
20 mm wide, medium height slot (1, 2, 19, 20)
Logical Slot Numbers
25 mm wide, small height slot (23 to 38)
25 mm wide, medium height slot (3 to 18)
A medium plus a small 25 mm width slots (3+23, 4+24,...,18+38) are required to install a tall height board.
20mm wide units can be fit into 25mm wide slots with the 5mm reductor plate.
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3AL 75131 AAAA 2-5
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Physical configuration 1626 LM generic empty shelf
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Physical configuration 1626 LM Compact Shelf
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3AL 75131 AAAA 2-7
Edition 1 March, 14th, 2008
Physical configuration T-OADM Complete Rack View Example
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(recommended) configurations
Note: Channel upgrades are not performed according to the usual way. You will not
proceed by addition of single shelf/rack. In this specific context, will require 3 racks
for 3 shelves at once.
The following table summarizes the capacity of a T-OADM degree 3 (Y node)
configuration, 10 Gbps rate, unprotected, in comparison with shelves/racks number.
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Physical configuration T-OADM Line Shelf per OTS Example
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3AL 75131 AAAA 2-9
Edition 1 March, 14th, 2008
Physical configuration T-OADM Line Shelf per OTS Example
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Physical configuration T-OADM Transponder Shelf per OTS Example
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Figure 2-9 T-OADM Transponder Shelf Example (From 9th to 72nd channel)
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3AL 75131 AAAA 2-11
Edition 1 March, 14th, 2008
Physical configuration T-OADM Transponder Shelf per OTS Example
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Good To Know
• For a 72 channels configuration, 9 transponder shelves are required per direction.
• In case of a configuration with 8 channels, the amplifier is optional. It becomes
mandatory as soon as you insert a 9th channel.
The following table summarizes the 10 Gbps transponder shelf organization for T-OADM
degree 3 configuration, depending on the number of channels.
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3AL 75131 AAAA 2-13
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Physical configuration Line Terminal Configuration
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3AL 75131 AAAA 2-15
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Physical configuration Line Terminal Configuration
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Figure 2-13 Example of transponder shelf with TRBD and ETHC optically connected
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Figure 2-14 Example of tributary shelf with TRBD and ETHC electrically connected
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3AL 75131 AAAA 2-17
Edition 1 March, 14th, 2008
Physical configuration Line Terminal Configuration
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Physical configuration OADM Configuration
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OADM Configuration
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3AL 75131 AAAA 2-19
Edition 1 March, 14th, 2008
Physical configuration OADM Configuration
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Figure 2-18 LT on 100GHz grid: master shelf configuration, one LOFA per direction
(Unidirectional)
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3AL 75131 AAAA 2-21
Edition 1 March, 14th, 2008
Physical configuration OADM Configuration
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Figure 2-20 OADM on 100GHz grid: master shelf configuration with vertical
amplifiers
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3AL 75131 AAAA 2-23
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Physical configuration 1626 LM Part list
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Figure 2-21 OADM on 100GHz grid: master shelf configuration with horizontal
amplifiers
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3AL 75131 AAAA 2-33
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Physical configuration 1626 LM Part list
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OPTO-BIDI-XCVR*1.31um 1AB350870001
OPTO-BIDI-XCVR*1.49um 1AB350870002
Switching Protection
OCPU1104 3AL94736AAAA
DUAL OCPU 2104 - 1+1 PROTECTION 3AL95529BCAA
Test Services
ACI-1626LM FAT STANDARD 3AL94623AAAA
ACI-1626LM DIR.SHIP.STANDARD 3AL94734AAAA
ACI-1626LM DIR.SHIP.EXTRA TEST 3AL94734ABAA
ACI-1626LM DIR.SHIP.EXTRA TEMP. 3AL94734ACA
ACI-1626LM DIR.SHIP.EXTRA TIME 3AL94734ADAA
Tributaries
12XGBETH (ETHC1000) 3AL94970AAAA
2XGBETH_FC 3AL97800BAAA
Tributaries - Full Band
TRBD1111 /I-64.1 STD 3AL94207ABAC
TRBD1121 /S-64.2 STD 3AL94207ACAC
TRBD1131 /10BASE-LR STD 3AL94207AEAC
TRBD1111 /I-64.1 ENH 3AL94207DBAC
TRBD1121 /S-64.2 ENH 3AL94207DCAC
TRBD1131 /10GBASE-LR ENH 3AL94207DEAC
TRBD1111 /I-64.1 3AL94207EBAC
TRBD1121 /S-64.2 3AL94207ECAC
TRBC1111 4X2.5GB /SFP STD 3AL94452ABAB
TRBC1111 4X2.5GB /SFP ENH 3AL94452DBAB
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3AL 75131 AAAA 2-35
Edition 1 March, 14th, 2008
Physical configuration Equipment connections
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Equipment connections
The external connections of the 1626 LM may fall into the following categories:
• optical
• management
• maintenance
• power supply
• user interfaces.
All the equipment connection are detailed in the Installation Handbook.
The next section, Chapter 2, “Units front view” on page 2-41 presents the front view of all
the cards, where the connection points can be identified.
In the following, some general indication and reference to the relevant front view are
given.
Optical connections
MU/SPC connectors
See Figure 2-22, “Double MU optical connector” (p. 2-37) The optical connections are
made with double MU/PC connectors on:
• TRBD1111, TRBD1121, TRBD1131 either on Client or WDM interface, TRBD1191
on WDM interface, see Figure 2-26, “TRBD1111, TRBD1121, TRBD1131 boards
front panel” (p. 2-48)
• TRBC boards, on WDM interface, see Figure 2-28, “TRBC1111 board front panel”
(p. 2-50)
• CMDX boards, see Figure 2-33, “CMDX1010 board front panel” (p. 2-55)
• BMDX boards, see Figure 2-34, “BMDX1X00 board front panel” (p. 2-56)
• ALCT boards, see Figure 2-35, “ALCT1010 front panel” (p. 2-57)
• OMDX boards, see Figure 2-36, “OMDX8100_L1_X board front panel” (p. 2-58),
Figure 2-37, “OMDX8100_xx front panel” (p. 2-59), and Figure 2-38, “OMDX4100
front panel” (p. 2-60)
• LOFA boards, see Figure 2-40, “LOFA11xx front panel” (p. 2-62).
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LC/PC connectors
Refer to Figure 2-31, “SFP optical module” (p. 2-53) and Figure 2-32, “XFP optical
module” (p. 2-54).
The optical connections are made with LC/PC connectors on all the SFP modules plugged
on:
• TRBC1111 boards, client side, see Figure 2-28, “TRBC1111 board front panel”
(p. 2-50)
• 2xGE_FC boards, either on Client or WDM interfaces, see Figure 2-29, “2xGE_FC
board front panel” (p. 2-51)
• ETHC1000 boards, on Client interfaces, see Figure 2-30, “ETHC1000 board front
panel” (p. 2-52).
The optical connections are made with LC/PC connectors on all the XFP modules plugged
on:
• ETHC1000 boards, on WDM interface, see Figure 2-30, “ETHC1000 board front
panel” (p. 2-52)
• TRBD1191 on client interface, see Figure 2-26, “TRBD1111, TRBD1121,
TRBD1131 boards front panel” (p. 2-48).
NMS Interface
It is the Q3 interface toward the Network Management System (NMS). It is a 10 / 100
Mbps Ethernet interface provided by two RJ45 connectors (10/100 Base-T interface),
located on the ESCT front panel.
See Figure 2-41, “ESCT2000 front panel” (p. 2-63).
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Inter-shelf link
Inter-shelf link (IS-LINK) allow the communication between the EC and all the SCs of the
NE. It is a 100Mbps Ethernet bus, allowing the communication between EC and SCs
located in separate shelves (communication between EC and the local SC is performed on
a local serial bus named ISSB).
The connections can be performed by means of RJ45 connectors, located on the ESCT
front panel.
Using RJ45 connectors (10Base-T interface) each shelf is connected to the adjacent one
(bus topology). Figure 2-23, “Example of intra-shelf links (10Base-T interface)” (p. 2-39)
shows the topology.
In master shelf only, the above RJ45 connector can be connected to the 1353NM.
Figure 2-41, “ESCT2000 front panel” (p. 2-63) shows the ESCT front panel.
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3AL 75131 AAAA 2-39
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Physical configuration Equipment connections
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Housekeeping
The housekeeping alarm signals are available on the front panel connector of the
HSKU1x00 board. It is a 25 pin SUB-D Female connector.
See Figure 2-44, “HSKU1000 and HSKU1100 front panel” (p. 2-66).
DL interface
It is the Direct Link, to connect USB key or disk, available on the front panel of the
ESCT2000.
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Physical configuration Overview
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Refer to this chapter if you want to know how to understand the behavior of a board when
you perform a visual checking
Contents
This chapter covers the following:
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Physical configuration Release 5.0 Board LED
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Physical configuration Release 5.0 Board Faceplates
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Physical configuration The Legacy Boards
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Contents
This section covers the following:
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3 Functional Description
Overview
Purpose
This chapter describes the main function delivered by the 1626 LM.
Contents
This chapter covers the following functions:
Optics 3-2
Protection 3-17
Loopbacks 3-32
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3AL 75131 AAAA 3 -1
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Functional Description The Optical Signal Process
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Optics
This section describes:
• the main characteristics of the entities involved in:
• the optical signal process,
• the 1626 LM operation management services.
• the optical channels used for the various application.
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Functional Description The Optical Signal Process
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Note: For Tunable and Reconfigurable OADM configurations, WMAN carries out
channel
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3AL 75131 AAAA 3-3
Edition 1 March, 14th, 2008
Functional Description Transmission Rates/Mode and Standard Compliance
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Functional Description The Optical Channels
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Table 3-4 Nominal frequencies allocation plan in C-Band for long haul applications
(50GHz grid)
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Functional Description The Optical Channels
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Functional Description The Optical Channels
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Functional Description The Optical Channels
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Functional Description The Optical Channels
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Note
Band sequence (both G.652 and G.655 fiber)
• Band 6, Band 7, Band 8, Band 4, Band 9, Band 3, Band 2, Band 10, Band 5, Band 1,
Band 11, Band 12
• ALC in B5 until the band is loaded, then turned off.
Channel sequence inside each band
• G.652: from the most internal channel (i.e. the closest to 1546nm) to the most external,
with 50GHz spacing
• G.655, designed for 100GHz spacing: from the most internal to the most external, with
100GHz spacing
• G.655, designed for 50GHz spacing: from the most internal to the most external,
starting with 100GHz spacing, then passing to 50GHz spacing (after loading at
100GHz is complete).
Links without OADMs
• ALC can be turned off after 32 channels (100GHz loading) or 64 (50GHz loading).
Links with OADMs
• ALC cannot be removed if the traffic add/dropped at an OADM needs to be protected:
Band 5 is generally reserved for ALCT insertion
Maximum number of channels: 7 x 11bands = 77.
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Functional Description The Optical Channels
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Functional Description The Optical Channels
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Functional Description The Optical Channels
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Table 3-6 Frequencies plan for Metropolitan applications (50 and 100GHz mixed
grid)
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Functional Description The Optical Channels
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Functional Description Optical Supervision
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Optical Supervision
The optional out-of-band Optical Supervisory Channel allows the supervision of all the
NEs along the WDM path; moreover it gives some order-wires (data channel and voice
channel) to the users.
From current release this function is managed by 1626 LM equipment, by means of
the OSCU1010 supervision unit. This board provides two optical transmitters and two
optical receivers to enable to supervise two directions.
Remotely, from a Craft Terminal or 1353 SH, it is possible to access the status of a distant
NE and send commands to it by means of the OSC.
12 D-channels are extracted from the OSC to build a communication stream at 64 kbps per
D-channel.
It is added/dropped in each NE along the transmission line, providing a communication
link within the system. In this way the external DCN, necessary to connect the WDM
system to the NMS, can reach any NE, receiving the supervision information concerning
the whole transmission path through the OSC.
CT/N
NE NE
OSC OSC
generation generation
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Functional Description Optical Supervision
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At first, the 4Mbps signal on a 1510 nm wavelength, is extracted from the optical
aggregate signal with an optical filter, in amplifier or mux/demux board. Then it is
received by the OSCU board and electrically demultiplexed in two 2 Mbps streams: the 2
Mbps OSC stream and the additional 2 Mbps stream.
The additional 2 Mbps stream is sent to the USIB board through back panel links to be
dropped to the client.
The 64 Kbps E2 byte carrying the voice channel, is dropped towards the board front panel
on which a telephone handset is plugged.
The DCCs are sent with the entire 32 bytes frame through back panel TDM links to the
ESCT board located in slot #1. The FPGA extracts the DCC bytes and stores them in
registers. All the processing are performed by the microprocessor.
In the reverse way, the microprocessor generates the information to be sent, gives it to the
FPGA that builds the 32 bytes frame. This frame is sent to the OSCU board through TDM
links.
The OSCU board fills the 64 kb/s E2 voice channel.
It fills the 2Mbps with the stream coming from the USIB. Then it multiplexes the 2 Mbps
supervisory channel with the additional 2 Mbps stream. The laser emits the 4 Mbps OSC
frame that is multiplexed through an optical filter in an amplifier board (LOFA) or
Mux/Demux (BMDX).
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Functional Description Protection
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Protection
In the 1626 LM, the optical protection (channel protection) is provided with the Optical
SNCP (O-SNCP) performed by means of a dedicated protection coupler (OCPU2104) and
transponders (TRBD and TRBC, in current release).
OCPU2104 provides O-SNCP for TRBD and TRBC clients. 2 clients are 1+1 protected,
by means of 2 optical couplers and splitters, as shown in Figure 3-3, “OSNCP: supported
configurations” (p. 3-17). It is a medium height board.
.
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Functional Description Protection
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The split and select functions are optically performed, by means of passive optical
couplers and splitters, hosted in the OCPUx104 board).
The selection is done by shutting-down the user Tx corresponding to the path in failure
thus activating the protecting one (an example is given in Figure 1-22, “Optical protection
way of working” (p. 1-30)).
This kind of protection can be used on two different topologies: linear links and ring
topologies, as shown in Figure 1-20, “Optical channel protection in linear links” (p. 1-29)
and Figure 1-21, “Optical SNCP protection scheme: with back-to-back terminals or
OADM” (p. 1-30), respectively.
In the following is detailed the O-SNCP way of working:
• two transponders/boards (main and protecting) exchange information, via dedicated
backplane links, on the quality of the signal that they have to deliver at the client B&W
interface
• the two transponders arbitrate between them with the target of choosing the best
signal, and decide the transponder that has to shutdown the BW laser, and the one that
has to activate it
• the inputs of the two B&W interfaces of the transponders are connected (via optical
cables) to the outputs of a 50/50 splitter
• the outputs of the two B&W interfaces of the transponders are connected (via optical
cables) to the inputs of a coupler; since only one B&W laser is active at a given time, a
switch is in fact realized by shutting down the current active laser and activating the
current inactive laser
• the working and the protecting transponder must be allocated in adjacent twin slots
(slots 3-4, 5-6, ..but not 4-5) to perform the protection switch. Figure 3-5, “O-SNCP:
shelf configuration examples” (p. 3-19) shows slot relationship between OCPU2104
and TRBD/C.
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3AL 75131 AAAA 3-19
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Functional Description Performance Monitoring Points on transmission boards
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Performance Monitoring
Performance Monitoring is a function which provides the operator with the ability to
constantly monitor the quality of the signal flowing through his WDM network. This
function is available at selected Performance Monitoring Points, it is performed through
an accumulation of information during fixed time windows (granularity periods: 15min or
24h) and it provides consistent information to the management interface (end-to-end
monitoring).
When PM is activated, for each PM Point, the following processes are automatically
performed
• Continuous monitoring by transmission boards of the quality of the signal flowing
through the PM Point and generation of raw PM information, known as 1s PM
primitives (1s stands for 1 second)
• Correlation between 1s PM primitives by the system, with periodic collection of 1s
PM primitives and accumulation of corresponding PM counters (PM events) during
the current monitoring period.
N.B. PM primitives are raw information, internally used, but not made available at
NMS; PM counters are the significant values resulting of correlations between PM
primitives. These values are made available to the NMS.
• Generation of PM current data related to the current monitoring period (15min / 24h),
based on PM counters accumulated during the current monitoring period
• Comparison of PM counters of the current monitoring period with related PM
Threshold profile (TCA)
• Generation of PM history data, with storing of PM information related to past 15min /
24h periods
From the management interface, it is possible to manage PM data (clear PM counters,
activate or deactivate Performance Monitoring...) and PM Thresholds (profile
assignment/modification...).The latter is used to generate Threshold Crossed Alarms
(TCA).
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Functional Description Performance Monitoring Points on transmission boards
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Functional Description Performance Monitoring Points on transmission boards
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PM counters (PM events) accumulation by the Shelf Controller for 15min/24h granularity
period
Starting from 1s PM primitives collected with the polling mechanism, SC evaluates
corresponding PM counters (also known in standards as PM events) increments, that are
accumulated over the current monitoring period to which they are related (15min or
24hours) for PM purposes (Current Data generation).
The performance monitoring is supported at the following layers:
• SDH Regenerator Section (RS) layer, both for STM-16 (2.5 Gbps) and STM-64/10
GbE WAN signals
• FEC layer, for 10 Gbps signals
• layer 1 PM, for 1.250 Gbps (GbE) and 1.0625 Gbps (FC) signals
For the SDH-RS layer, the following performance counters are supported:
• ES (Erroneous Second): Count of seconds with at least one B1 code violation or with
at least one RS defect
• SES (Severely Erroneous Second): Count of seconds which contains more than 2400
(approximately > 30%) B1 code violation, or at least one RS defect. A SES is also
counted as an ES
• BBE (Background Block Error): Count of B1 code violations which occur outside a
SES.
For the FEC layer at 10Gbps, the following performance counters are supported:
• BEC (Background Error Corrected): count of FEC corrected errors that occurred
outside a SCS (result is divided by 512 for display reasons)
• SCS (Severely Corrected Seconds): count of seconds with a FEC layer defect or at
least one FEC uncorrected block or more than 33 538 048 FEC corrected errors (this
corresponds to a rate of FEC corrected errors per second higher than approximately
3E-3)
• BBU (Background Block Uncorrected): count of FEC uncorrected blocks that
occurred outside a SUS
• SUS (Severely Uncorrected Seconds): count of te number of seconds of presence of
FEC/OCH layer defects in the system.
• CS (Corrected Seconds): counter not used; fixed value = 0.
• US (Uncorrected Seconds): counter not used; fixed value = 0.
For the Ethernet layer 1 at 1.25Gbps (GbE) or 1.0625Gbps (Fiber Channel), the
following performance counters are supported (per each port):
• based on 8B/10B coding structure of the Ethernet frame, two types of errors are
detected:
• RDE (Running Disparity Error)
• IW (Invalid Word)
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• these RDE and IW errors occurring in 1s are accumulated in a 16 bits counter, called
ICG (Invalid Code Group)
• based on ICG and LOS/LOF detection, the following performance counters are
supported
• ES: at least one ICG or one LOS or LOF or unit missing within the second
• SES: at least 10000 ICG (corresponds to a BER <10-5) or one LOS or LOF or unit
missing
• BBE: ICG occurring outside a SES
For the Ethernet Layer 2 (1 and 10 Gbps), the following performance counters are
supported (per each port):
• TRCF: Total Received Correct Frames
TRCF counts the number of valid frames received by each Ethernet port.
TRCF sums the number of received unicast, multicast and broadcast frames.
• TRCO: Total Received Correct Octets
TRCO counts the number of valid bytes received by each Ethernet port.
• TRSEF: Total Received Service Errored Frames
TRSEF counts the number of errored frames received by each Ethernet port.
• TTF: Total Transmitted Frames
TTF counts the number of frames transmitted by each Ethernet port.
TTF sums the number of transmitted unicast, multicast and broadcast frames.
• TTO: Total Transmitted Octets
TTO counts the number of bytes transmitted by each Ethernet port.
• TDF: Total Dropped Frames
TDF counts the number of frames dropped by each Ethernet port.
Unavailable Time
A period of unavailable time (UAT) shall begin when 10 consecutive SES (or SUS) events
have been detected. These 10 seconds are considered to be part of the available time.
The UAS counter shall accumulate over the monitoring period (it shall be reset at the end
of the monitoring period) the number of seconds of unavailable time.
Performance monitoring event counting for ES, SES, BBE shall be inhibited during
unavailable time.
An alarm UAT shall be raised at the detection of a period of unavailable time and cleared
at the detection of a new period of available time, whatever the monitoring period.
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24 hours Threshold
Threshold Data Id BBE ES SES
2 - RS Counters 24h 36000 150 15
24 hours Threshold
Threshold Data BB BE SU
Id U C US CS S SCS
8 - OCH Counters 1 218 0 0 300 300
24h
Alarms
For TCA, the ASAP mechanism to set the alarm severity is not used. In order to set the
alarm severity the reference object is Threshold Data, in which the alarm severity can be
configured setting the severity Indication field of the counter Threshold Attribute List
attribute. The default severity is Warning for all the TCA.
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Edition 1 March, 14th, 2008
Functional Description Introduction
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Transmission Frame
The G.709 standard offers a considerable quantity of service channels in the OverHead
(OH) bytes of the frame. These bytes are used for section maintenance (frame alignment,
network management operations, auxiliary communications,..).
For reader's convenience, the structure of some WDM frames is shown in the following
pages; in particular will be further detailed the structure to the digital domain structures.
Reference specifications: G.709.
Introduction
In the following is briefly described the G.709 frame construction (Optical Transport
Hierarchy - OTH), in client to WDM direction.
This paragraph is mainly dedicated to the adaptation of the 10 Gbps B&W client signals
(SDH/SONET...), into the WDM colored signals. A brief description of the 2.5 Gbps
B&W client signals is also given, in particular on the multiplexing structure to have the
10Gbps WDM signal.
The UNI interface is thus considered, client side.
In case of NNI, the input signals to the system is OTUk; thus, this is the starting level in
the structure (no OPUk and ODUk adaptation has to be performed).
Refer to Figure 3-9, “Optical Transport Hierarchy (OTH) frame structure” (p. 3-30). The
client signal or an Optical channel Data unit / Tributary Unit Group is mapped into the
OPUk. The OPUk is mapped into an ODUk and the ODUk is mapped into an OTUk. The
OTUk is mapped into an Optical Channel (OCh). In the next paragraph, an explanation of
these mapping will be provided.
The OCh is an information structure consisting of the OCh payload with a certain
bandwidth and non-associated overhead for the optical channel management. The OCh
transports a digital client signal between 3R regeneration points.
The OCh is then modulated onto an Optical Channel Carrier (OCC), representing a
tributary slot within the OTM. The OCC consists of the OCC Payload, assigned to a
wavelength/frequency of the WDM group, and OCC Overhead, that is transported within
the OTM Overhead Signal (OOS) structure.
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Functional Description Wavelength division multiplexing
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The Optical Physical Section of order n (OPSn) is a network layer providing functionality
for transmission of a multi-wavelength optical signal on optical media of various types
(e.g. G.652, G.653 and G.655 fibre).
It combines the transport functionality of the OMS and OTS layer networks without their
supervisory information.
The characteristic information of the Optical Transmission Section (OTS) consists of OTS
payload and OTS overhead. The OTS OverHead is added to the payload to create an OTM;
It includes information for maintenance and operational functions to support OTS. The
OTS overhead information is contained within the OOS structure and it is terminated
where the OTM is assembled and disassembled.
The Optical Transport Module (OTMn) is the information structure that is transported
across the Optical Network. The OTM consists of up to n multiplexed optical channels and
an OTM overhead signal (OOS) to support the non-associated overhead. It is the structure
used to support OTS layer connections in the OTN.
The Optical Supervisory Channel (OSC) is the physical carrier outside the amplifier band
providing the transport of the OTM overhead signal; it is multiplexed into the OTM using
wavelength division multiplexing.
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Functional Description Wavelength division multiplexing
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Functional Description TRBC & TRBD Loopbacks
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Loopbacks
Loopbacks are performed for troubleshooting purposes to identify faults in the
transmission path with the help of an external test device. The external test device is used
to compare the outgoing and returning signals. The result of the loopback is shown on the
external test device.
You can create a «loopback and continue» test at the user interface of ETHC, 2xGBE_FC
or TRBC/TRBD boards.
Important! You cannot create a loopback on both user and line sides at the same
time.
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Functional Description TRBC & TRBD Loopbacks
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• WDM line loop & continue: the signal received on the WDM interface is copied and
sent back through the WDM emitter. It is also transmitted to the B&W interface.
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Functional Description 2xGBE_FC & ETHC Loopbacks
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Functional Description 2xGBE_FC & ETHC Loopbacks
............................................................................................................................................................................................................................................................
• on line side, loop-and-continue: it performs a line loop after the PCS block.
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3AL 75131 AAAA 3-35
Edition 1 March, 14th, 2008
Functional Description Equipment Controller function
............................................................................................................................................................................................................................................................
Equipment Control
Equipment Controller manages Shelf Controllers.
There is one active Equipment Controller in each node and one active Shelf Controller in
each shelf.
The ESCT2000 (Equipment and Shelf Controller) is the hardware platform designed to
support the Equipment Controller (EC) function and the Shelf Controller (SC) function.
The ESCT2000 board is in charge of the internal management of the node. It dispatches
controls received by management system to the appropriate board, check consistency
between expected configuration and the actual one and finally reports alarms, performance
counters and measurements.
When the ESCT2000 board is located in the master shelf:
• both functionalities are operational and active,
• a flash memory hosts the node software and the configuration database.
When the ESCT 2000 board is located in secondary shelves:
• only the SC functionality is provided,
• the flash memory is not required.
Note
To work properly, the control function needs to know some mandatory information that
XTID1000 (eXTended ID 1000) is able to provide. There is one eXTended ID unit per
1626 LM shelf in slot 27..
The eXTended ID1000 unit is an hardware extension of the back panel. Its configuration
must be done before the system starts up and cannot be modified without a user manual
intervention.
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Functional Description Management buses/interfaces
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The EC function can be split into several domains, corresponding to the main functions
performed:
• equipment - equipment type, release, address, authorized NMS addresses, rack
description
• Fault Management - Alarm Severity Assignment Profiles (ASAP), Alarms correlations
• Performance Monitoring - history storage of 15 Minutes and 24hour PM data
(provided by SC) in order to provide them to Network Management
• Software - software version management, software activation, software download
• Support - Filtering, logging and forwarding of events and alarms received by SCs
• Routing and Addressing - OSI/IP routing capability configuration
• Security - access control.
The Database which contains the NE configuration is saved in the pluggable hard disk.
SC provides the resources to support the SW functions related to the physical machine
control and management and configuration provisioning.
In a shelf all the boards are connected to the SC via the SPI or ISPB (for PM collection on
ETHC1000 board) bus allowing the SC processor to collect the control information of the
boards (e.g.: alarms collection, remote inventory and data EEPROM reading).
The SC function can be split into several domains, corresponding to the main tasks
• Equipment - Detection of card presence with direct hardware link, Collection of
remote inventory, Check that card present in slots are the expected ones, Check
firmware version of the boards, Dispatching of provisioning requests received by EC
to boards
• Performance Monitoring - Collection of one-second primitives used for elaboration of
PM counters (15Min and 24 hours) which are then sent to EC, Collection of analog
measurements (if any)
• Fault Management - Monitoring of faults: local SC faults, boards faults (equipment,
communication, transmission), threshold crossing alarms
• Software - firmware download (via HW config bus on ETHC1000).
Management buses/interfaces
F interface: available from the EC function, CT is Q3/TL1 (supported in future release)
interface for the connection to a local Craft Terminal. It is a 38.4 kbit/s serial RS232
interface with a DB9 connector.
NMS Interface: available from the EC function, NMS is the Q3/TL1 (supported in future
release) interface toward Network Management System (NMS). It is a 10 / 100 Mbps
Ethernet interface (10 Base-T) with RJ45 connectors.
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3AL 75131 AAAA 3-37
Edition 1 March, 14th, 2008
Functional Description Management buses/interfaces
............................................................................................................................................................................................................................................................
IS-LINK is inter-shelf link, used to realize the communication between the EC and all the
SCs. It is a 100 Mbps Ethernet bus (10BaseT interface) between EC and SCs located in
separated shelves
In master shelf, front panel IS-LINK port is connected to EC processor (EC data to local
SC are carried over ISSB bus).
In each slave shelf, front panel IS-LINK is connected to SC processor.
ISSB: it is a local serial bus allowing communication between EC and the local SC (future
use).
Push Buttons interface, used to
• test LEDs: pushing this button on ESCT supporting EC functionality lights the LEDs
of all the units of all the shelves of the NE but not on Top Rack Unit. All the possible
colors of a LED are lit on whatever the previous state of the LED when this button is
pressed.
Nothing happens if ESCT only supports SC functionality (since this button is managed
by EC)
• reset ESCT board
• cut off the alarms.
RA (Remote Alarms) interface: it is dedicated to send commands toward the rack to light
up the relevant lamps.
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Functional Description Management buses/interfaces
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HK (HouseKeeping) interface: it allows the user to manage some electrical relays and
opto-couplers through CT/NMS (1353 NM) in order to remotely command some devices
external to the 1626 LM NE.
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3AL 75131 AAAA 3-39
Edition 1 March, 14th, 2008
Functional Description Example of control interfaces scheme
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Functional Description Functional description
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Power supply
The powering architecture is distributed: two PSUP1000 (Power SUPply unit) cards are in
charge of feeding, in 1+1 protection mode, all the other cards hosted in the shelf. Each
card is able to provide from the main powering, by means an internal DC/DC converter,
the required power supply.
The main purposes are:
• Supply and distribute -48V/-60V filtered and protected voltage to all the boards
housed in each 1626 LM shelf
• Supply and distribute +3.7V and +5.4V protected voltages to SPIDER circuitry in all
the boards
• Give alarms on fault battery and voltages loss.
Functional description
Each Subrack receives powering from two DC supplies compliant with ETSI standard
ETS 300 132-2, for nominal -48V or -60V supplies. Each of the two DC supplies is
protected at the top of the rack by appropriate circuit breakers prior to being fed to each
subrack within the rack.
Each of the two supplies (-48V_A and -48V_B) feed one of the two PSUP1000 plugged in
each subrack.
The PSUP1000 units provide the necessary filtering and surge suppression of the -48V or
-60V input DC supply, prior to distributing the power supply to the units within the
subrack.
The filtered -48V/-60V supply is fed from each power supply unit to the backplane, the
power rails are then combined using sharing diodes on each card supplied with the -48V/-
60V power supply.
Under normal operating conditions the load required by the unit from the -48V/-60V
supply is shared approximately equally between the two PSUP1000 inputs.
At the -48V/-60V input interface of each unit, appropriate fuses shall be used to protect
the card.
The normal input voltage range of the power supply module is either:
• - 40,5 V t - 48 V t - 57,0 V
• - 50,0 V t - 60 V t - 72,0 V.
A battery return path to each of the two -48V/-60V supplies from the units to the power
supplies is provided.
On each PSUP1000 unit, a 3.7V (V3A & V3B) power rail and a 5.4V (V5A & V5B)
power rail are derived from its filtered -48V/-60V power supply and from the filtered -
48V/-60V of the other PSUP1000. The 3.7V and 5.4V power rails are then distributed to
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Functional Description Functional description
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Therefore, the equipment accepting either a -48V or -60V power supply input is able to
operate within specification over the voltage range of -40.5 to -72.0V and will not suffer
any damage when subjected to an input voltage in the range of 0V to -40.5V and -72.0V to
-75.0V.
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3AL 75131 AAAA 3-43
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Functional Description Housekeeping
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Housekeeping
The 1626 LM system is able to interface with user's environment and/or another 1626 LM
system to build up maintenance operations by means of the HSKU (House Keeping unit).
Its main purpose is to send and receive data from/to master cards via SPI bus, and from/to
the user or another 1626 LM system throughout protected I/O interface.
The HSKU1000 allows the user to manage some electrical relays and opto-couplers
through the Craft/SH in order to command remotely some devices external to the 1626
LM. The user is thus able to
• be informed of the status of the input opto-couplers
• remotely change the state of the output relays.
Each HSKU1000 board provides 8 output relays and 8 input opto-couplers.
The status of the OUT relays can be managed (Open/Close) through the SW separately for
each relay. The IN opto-couplers status can be raised by the board to the SW separately for
each opto-coupler.
As regards the opto-couplers, the Shelf Controller poll them (IN1 to IN8) regularly, and
then this information is immediately transferred to the Equipment Controller and notified
to the management interface.
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Functional Description Rack Alarm Management
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Alarm management
The back panel wires (URG / NURG / UP and the ALARM bus) are sent to a first logic
sub-unit whose four output signals are connected to an OR logic module, which uses also
as input signals four signals from the SPIDER to determine the status of each one of the
four relays used to command the rack lamps
• URG / NURG / ATTD, with TRU using.
If the RAIU boards of a rack are linked together, the four signals coming from another
RAIU are also taken into account.
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3AL 75131 AAAA 3-45
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Functional Description Rack Alarm Management
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The four alarm signals sent to pilot the relays, are based on the following logics:
• CRI_AL On, if CMD_CRI or URG
• MAJ_AL On, if CMD_MAJ or UP or at least 2 FANs in failure
• MIN_AL On, if CMD_MIN or NURG or 1 FAN in failure
• RACK_AL On, if CMD_RACK or PRM_AL or SEC_AL (or FAN_AL, not managed
in 1626 LM).
Generally speaking, a critical, major or urgent alarm is traffic affecting.
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The RAIU board manages the three leds of a TRU: URG (urgent) alarm, NURG (non
urgent) alarm and ATTD (attended) alarm.
N.B. The TRU does not send information to the RAIU board.
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3AL 75131 AAAA 3-47
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Functional Description Ventilation
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Ventilation
Fans are located at the bottom of each shelf (slot 41) of a rack with in addition an air filter
just below, as shown in Figure 3-20, “Fan shelf description and Rack partitioning”
(p. 3-48).
The FANS are monitored via the SPI bus and some direct wires are sent to the HSKU and
the RAIU boards to monitor a possible failure of the cooling system.
The maximum power dissipation per shelf is 640 W.
The TEMP_W_x_y (where x_y can be 1_7 or 8_13 or 14_20) represents the external
control of each FAN module rotation speed, by the boards associated to this module. In
fact, the boards of a group share the same back panel wire to control the rotation speed of
the corresponding FAN module: if the temperature of one of the boards exceeds a given
threshold, the board sends a command to the FAN module to increase its rotation speed.
POWER SUPPLY. Two +48V power supplies are generated by DC/DC converters from 2
external batteries, providing supply redundancy.
The 2 batteries from back-panel can vary from 36V to 72V. On the board the two 48V
voltages (48V_A, 48V_B) are coupled together by a diode and the battery with the
maximum voltage is selected.
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Remote Inventory
See Figure 3-21, “Remote Inventory sub-system” (p. 3-50). The Remote Inventory
function permits the operator to retrieve information about any card present on the
equipment.
The available information is: construction date, code number, maker name, board
identification, etc.
The Remote Inventory information is stored within a dedicated EEPROM present on all
boards.
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3AL 75131 AAAA 3-49
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Functional Description Remote Inventory
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4 Technical specifications
General
Optical bit rate, client side 9.9532 Gbps (UNI) - TRBD1111, TRBD1121, TRBD1191
(B&W) 10.3125 Gbps (UNI) - TRBD1131, TRBD1191
39.813 Gbps (UNI) - TRBD4312
2.488 Gbps (UNI) - TRBC1111
2.488 Gbps (STM-16) - 2xGE_FC
1.250 Gbps (GbE) - 2xGE_FC, ETHC1000
1.0625 Gbps (FC) - 2xGE_FC
Optical bit rate, WDM side 10.709 Gbps for TRBD1111, TRBD1121, TRBD1191,
TRBC1111
11.095728 Gbps for TRBD1131 and TRBD1191
43.018 Gbps for TRBD4312
2.488 Gbps for 2xGE_FC
Type of optical fiber G.652, G.655, G.652 for tight links
Central frequencies and see Table 3-1, “Frequencies plan for Metropolitan applications
wavelengths (50 and 100GHz mixed grid)” (p. 3-16) for Metropolitan
applications
see Table 3-2, “Nominal frequencies allocation plan in C-Band
for long haul applications (50GHz grid)” (p. 3-23) for Long Haul
applications (50 GHz grid)
see Table 3-3, “Frequencies allocation plan in C-Band for
Metropolitan applications (100GHz grid)” (p. 3-33) for Regional
applications (100 GHz grid)
Application types Line Terminal (LT), Line Repeater (LR), Regenerative Back-to-
Back Terminal (BT), T-OADM, R-OADM, T/R-OADM
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Technical specifications 1626 LM system characteristics
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Interfaces types Electrical interfaces: Analog audio interf. G.712, 64Kbps G.703
(EOW), 2Mbps G.703 (user channels), RS-232 at 38.4 Kbps (CT
interface), USB 1.1 (CT interface, for future release), Ethernet
10Base-T at 100 Mbps (NMS interface), Ethernet 10Base-T at
100 Mbps (IS-LINK interface), RS-232 at 38.4 Kbps (debugger
interface)
Optical interfaces: all the client and WDM interfaces above
listed
System dimensions
Maximum number of racks in 12
Line
Add-Drop features
Connectivity 0-100% add-drop capability
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Protections
Network protections Optical SNCP, performed via OCPU2104
Equipment optical protections 1+1TRBD and TRBC, performed via OCPU2104
Powering protections 1+1Power Supply Card
Management interfaces
Functions provided Q3 interface with PC (CT/Remote CT), 1353NM and 1354RM
NMS (on terminal)
Station alarms
Equipment Alarm status (indicated by the front cover LEDs)
Visual indications for card fail.
Management interfaces Q3 to connect a Local or Remote Equipment Craft Terminal (RS
supported: 232 interface at 38.4Kbps and, for future release, USB1.1)
Q3 to connect the OS 1353NM (100 Mbps 10Base-T Ethernet
Interface)
Local interface: Craft Interface (PC) RS232 SUB-D 9pin, PC compatible at 38.4
Kbps. Mini USB 1.1 for future release
Remote interface: Craft Interface (PC) RS232 SUB-D 9pin, PC compatible at 38.4
Kbps and mini USB 1.1 for future release. It
handles up to 32 NEs via DCC
Remote interface: Transmission ITU-T G.773 10Base-T
Management Network
(TMN) interface
Protocol Q3
Stack/Information
Model messages
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Edition 1 March, 14th, 2008
Technical specifications 1626 LM system characteristics
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Performance monitoring TRBD/C client side, 2xGE_FC and ETHC, line side: based on B1
and Threshold Crossing Alarm based on B1 errors count, ingress and
egress (SDH/SONET), according to G.806, G.8201, G.709.
TRBD/C, WDM side: based on FEC corrected/uncorrected errors.
2xGE_FC and ETHC, client side: Layer 1 Ethernet PM, based on the
8B/10B coding structure of the Ethernet frame, according to Tables
36-1 and 36-2 of the 802.3 standard (2005 ed. section 3).
Remote Inventory At rack, subrack and board level
Unit and equipment Through Remote Inventory: Company id, Unit type, Unit part
acknowledgement number, Software part number, CLEI code, Manufacturing Plant,
Date Identifier, Date of construction... For details, refer to the
operator's handbook
Security Password, operator profile, back up for programs and data
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Housekeeping (HSKU)
Number of housekeeping 9 inputs and 9 outputs
accesses
Connector SUB-D 25 pins
Output HSKU signals By electronic relay contacts connected to the common out
Max. guaranteed current 100 mA
through IN relay with closed
condition
Voltage between OUTn and <2.5 V
common OUT with closed
condition
Resistance of the closed relay <300 mOhms
with closed condition
Voltage between OUT and <72 V
common with open condition
Input HSKU signals By opto-couplers connected to the common GND (GNDP)
maximum forward current 30 mA
maximum voltage applied 3 V (without resistor)
between INn and GNDP
N.B. If the user wants to connect -48V power supply, he has to put a resistor of a value higher than
1500
Ohms, 1.5 W to have a current equal to 30mA.
Optical Supervisory Channel (OSC) characteristics
See “Optical Supervisory
Channel Unit (OSCU101x)
optical characteristics”
(p. 4-53).
Clock characteristics
External clock is not required
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Applicable standards
ITU-T G.709 Interfaces for the Optical Transport Network (OTN)
ITU-T G.798 Characteristics of optical transport network hierarchy equipment
functional blocks
ITU-T G.691 Optical interfaces for single channel STM-64, STM-256 systems and
other SDH systems with optical amplifiers
ITU-T G.692 Optical interfaces for multichannel systems with optical amplifiers
ITU-T G.693 Optical interfaces for intra-office systems
ITU-T G.694.1 Spectral grids for WDM applications: DWDM wavelength grid
ITU-T G.872 Architecture of optical transport networks
ITU-T G.957 Optical interfaces for equipment and systems relating to the
synchronous digital hierarchy
ITU-T G.959.1 Optical transport network physical layer interfaces
G.7710 Common equipment management function requirements
G874.1 Optical Transport Network (OTN) protocol-neutral management
information model for the network element view
ITU-T G.664 Optical safety procedures and requirements for optical transport
systems
ITU-T G.825 The control of jitter and wander within digital networks which are
based on the synchronous digital hierarchy (SDH)
ITU-T G.8251 The control of jitter and wander within the optical transport network
(OTN)
IEEE 802.3 Ethernet standard
IEEE. 802.1Q (Annex D) VLAN bridge
G7041/Y13013 GFP
IEC60825-1 and IEC60825-2 Optical safety
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The loading plan for Regional applications is shown in “Loading plan for 100 GHz grid
mux/demux subsystem” (p. 3-32).
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Edition 1 March, 14th, 2008
Technical specifications Safety requirements and mechanism
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Safety status of the connections with TNV (Telecommunication Network Voltage) for Remote alarms,
other equipment Housekeeping, Rack lamps (RM) and tributary connections if
K20 protected.
SELV (Safety Extra Low Voltage) for all the other.
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Optical safety
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Technical specifications Safety requirements and mechanism
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In any case of failure, the overall FIT rate of all the mechanisms inside the system that are
involved in the APSD procedure which is triggered by this failure, does not exceed 500
FITs.
In normal operating conditions (no failure), the system matches HAZARD LEVEL 1M
criteria.
During the restart mechanism, the system matches HAZARD LEVEL 1M criteria.
So according to IEC 60825 recommendation, the 1626 LM equipment is classified as
HAZARD LEVEL 1M
The OSC alone is classified as
HAZARD LEVEL 1
The following figures give the AELs of class 1 and class 1M. In other words, it gives the
maximum power that can be reached to remain in Class 1 or in Class 1M ; the integration
duration is 100 sec.
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Table 4-1 AEL at 980 and 1480 nm for Hazard Levels 1 and 1M
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APSD procedure
The APSD complies with IEC 60825 1 and 2 and ITU-T G.664 recommendations.
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APSD example: line failure between two LRs with unidirectional amplifiers
Figure 4-3 Example of line failure between two LRs with unidirectional amplifiers
Let us consider the right NE (the same actions occur in the left NE as soon as it detects the
LOS consecutive to the APSD procedure in the right NE)
1. The top right amplifier detects a LOS
2. It shuts down its first stage (overshoots protection)
3. The previous amplifier exists but is located in an other NE so the top right amplifier
has to shut down the other amplifier of the right NE: the top right amplifier writes a SD
command on its APSD back panel link.
4. As software knows how amplifiers are connected, it has configured (during installation
phase) the down right amplifier to read the APSD back panel link written by the top
right amplifier. As a consequence, the down right amplifier receives the SD command
sent by the top right amplifier.
5. The down right amplifier shuts down.
6. The low amplifier of the left NE detects a LOS, the same procedure as the one already
described for the right NE applies.
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APSD example: line failure between two LTs with bidirectional amplifiers
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Technical specifications Safety requirements and mechanism
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9. As software knows how amplifiers are connected, it has configured (during installation
phase) the down amplifier (Stage 2) to read the APSD back panel link written by the
top amplifier (Stage 1). As a consequence, the down amplifier receives the SD
command sent by the top amplifier.
10. The down amplifier shuts down.
11. The low amplifier (Stage 1) of the left NE detects a LOS, the same procedure as the
one already described for the right NE applies.
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2xGE_FC characteristics
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ETHC1000 characteristics
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FC SFP module type 1FC, 2FC 850 nm 1FC, 2FC 1310 nm Unit
Addressed wavelength 830 –> 860 1265 -> 1370 nm
Min. launched power -10 -9.5 dBm
Max launched power -3 -3 dBm
Allowed bit rates 1.0625 Gbps; 2.125 Gbps Gbps
Min. extinction ratio 9 9 dB
Spectra Max. -20dB NA NA nm
l width bandwidth
Max. RMS width 0.85 see NOTE 1 nm
Minimum SMSR NA NA dB
Max chromatic disp. - - ps/n
m
Minimum sensitivity with 1.0625 Gbps = –17 -20 dBm
fiber, @ BER=1E-12 2.125 Gbps = –15
Minimum overload 0 -3 dBm
Max optic. path penalty - - dB
Max receiver reflect. 12 12 dB
Optical connector / Fiber type LC / SMF LC / SMF
Acronym / Interface type FC/2FCmm / FC/2FCmm FC/2FCsm / FC/2FCsm
Equipped on 2xGE_FC 2xGE_FC
Note: See figure 18 and figure 19 of the “Physical interfaces FC-PI-2 Rev. 30, 2002" (FC/2FC
standard)
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CDX parameters
(demultiplexing side) minimum typical maximum units Comments
Channel Passband 20 20 GHz Centered on the frequencies
specified in Table 3-2, “Nominal
frequencies allocation plan in C-
Band for long haul applications
(50GHz grid)” (p. 3-23)
Insertion loss 5.0 6.4 7.3 dB Across all channel centres
CDX input power -5 15 dBm
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12:1 and 1:12 Band Mux/DemuX for Band OADM (BMDX1100) optical characteristics
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Technical specifications Alarm characteristics
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Alarm characteristics
Units Alarms:
Each port card or access card of the equipment is provided with a bicolor (green/red) or
three-color (green/yellow/red) LED on the front coverplate.
This LED indicates:
• when red, internal failure
• when green, in service unit
• when yellow, board in firmware download state.
Centralized Equipment Alarms:
All the alarms detected on the units are collected by the ESCT2000 unit which will
deliver centralized optical indications (by means of LEDs on its front coverplate).
Specifically:
• Red LED “URG“: detection of an URGENT (MAJOR OR CRITICAL) alarm
• Red LED "NUR": detection of a NOT URGENT (MINOR) alarm
• Yellow LED "ATD": alarm condition ATTENDED
Refer to “Units front view” (p. 2-49), where the front view of each unit and the LED
locations are illustrated.
Note: On the Craft Terminal (C.T.) and on the Operation System (O.S.) application
the URGENT (URG), NOT URGENT (NURG) and WARNING alarms are named in a
different way; the relation between this two terminology is explained in Table 4-3,
“Relation between Alarm severity terminology displayed onC.T./O.S. and alarm
severity terminology used for the ESCT leds and ETSI market racks (TRU).” (p. 4-55).
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Table 4-3 Relation between Alarm severity terminology displayed onC.T./O.S. and
alarm severity terminology used for the ESCT leds and ETSI market
racks (TRU).
Alarm severity terminology on C.T. and Alarm severity terminology used for ESCT
O.S. leds and for TRU in the rack
CRITICAL or MAJOR URG
MINOR NURG
ATTENDED ATTD
Rack Alarms:
Some equipment alarms are carried to a connector and used to light-up alarm rack-lamps.
Rack alarms are physically available on the RAIU board connectors.
The TRU has four front panel leds: Urgent, Non Urgent, Attended, Signal Presence. Those
leds are managed by the RAIU boards of a rack, except for the last one which indicates
that the power is ON. The TRU has four DB25 connectors so that the RAIU boards of a
rack can be either linked together or directly connected to the TRU.
In NEs composed of more than one rack, the TRU of the master rack shows both the HW
alarms of the rack and the summary of the NE alarms. The TRU LEDs in secondary racks
only show the HW failures of the rack (from the FANS or the power supplies).
HouseKeeping Alarms/Commands:
A set of housekeeping contacts are available, located on the 25-pole connector of the
housekeeping board.
Alarm Attending:
The detected units alarm condition can be stored through the ACO (Alarms Cut Off) push-
button on the ESCT unit (Attended).
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This operation will turn OFF the general red LED “URG" and will light up the “ATD"
yellow LED on the ESCT unit (Attended); the attended command is also sent to the rack
lamps (if present) through the RAIU board.
Trouble-shooting:
This equipment has been designed to dialog with a Personal Computer (PC) for service,
activation and trouble-shooting purpose.
Trouble-shooting procedure for the equipment and details of the alarms for each card and
relevant indications are described in the Operator's Handbook.
Connection with the PC is achieved through the 9-pole connector (F interface) on the
ESCT board.
The unit can be connected to an Operation System associated to the Transmission
Management Network in order to execute operations similar to those carried out by the
PC.
Characteristics of the cited rack alarms and Housekeeping contacts interface (EM type)
are included in “1626 LM system characteristics” (p. 4-1).
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Input Voltage range (from station batteries) - 40,5 V < - 48 V < - 57,0 V
- 57,0 V < - 60 V < - 72,0 V
Power supply output voltages towards units 48/60 V filtered
+ 3.7 V (by DC/DC conv)
+ 5.4 V (by DC/DC conv)
The PSUP takes a 48V/60V battery supply and filters it before making it available on the backplane.
It then uses the redundant (filtered) 48V supplies to power the on board 3.7V and 5.4V supplies. The
unit also uses the 3.7V supply (either from the on board converter, or if failed from the backplane) to
power its SPIder. The maximum current drawn from these power rails shall not exceed the following
requirement
Power supply interface according to ETS EN 300132-2
Power consumption
This product is designed for low power consumption. Developing new components with
very high integration density and low voltage supply leads to a significant reduction of
power consumption.
Depending on the number and type of I/F ports, the power consumption may vary in a
wide range.
Estimated max 1626 LM shelf power 900W - a fully equipped expansion shelf with 16
consumption transponders
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Mechanical characteristics
Rack mechanical compatibility ETSI ETS/E3, Optinex compatible
1626 LM subrack size 466 mm H x 532 mm W x 288 mm D (w/ front panel)
Board size there are four types of board:
338 mm Height x 213 mm Depth x 25 mm Width
338 mm Height x 213 mm Depth x 75 mm Width
338 mm Height x 213 mm Depth x 100 mm Width
265 mm Height x 213 mm Depth x 20 mm Width
73 mm Height x 213 mm Depth x 20 mm Width
73 mm Height x 213 mm Depth x 25 mm Width
Rack size 2200 mm Height x 300 mm Depth x 600 mm Width
1626MS Subrack weight 14 Kg for an empty shelf and
47 Kg for a fully populated expansion shelf with 16 TRBDs,
2 CMDXs, 2 PSUPs, 1 ESCT and 1 RAIU
Cooling Fans located at the bottom of the shelf
Rack cabling Vertical between rack and subrack front access
Electrical Connectors SUB-D 3-pole connector: power supply
SUB-D 25-pole connector: housekeeping interface
SUB-D 9-pole connector: F and RAIU interfaces
mini USB connector: F interface
RJ45 (2x): Q interface for NMS connection
RJ45 (2x): 10Base-T interface for intra-shelf connection
RJ45: RS-232 debugger interface
RJ45: 2Mbps user interface on TRBD/TRBC
RJ45: 2x64Kbps user interface on USIB1000
RJ11: analog audio interface on USIB1000
RJ11: RAIU interface
Back-to-back installation Yes
Boards dimension
TRBD11X1, TRBC1111, 338mm Height x 213mm Depth x 25mm Width
ETHC1000, BMDX1x00
WMAN and TDMX 338mm Height x 213 mm Depth x 100 mm Width
TRBD4312 338mm Height x 213 mm Depth x 75 mm Width
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Boards weight
TRBD11x1 1.85 Kg max.
TRBC1111 1.6 Kg
TRBD4312 3.9 Kg
2xGE_FC 0.85 Kg
ETHC1000 1.05 Kg
WMAN3174 5.280 Kg
TDMX1180 4.840 Kg
CMDX1010 0.9 Kg
BMDX1x00 1.2 Kg
ALCT1010 0.9 Kg
OMDX8100 1.01 Kg
OMDX4100 1.01 Kg
LOFA11x0 1.2 Kg
OCPU2104 0.28 Kg
ESCT2000 1.03 Kg
OSCU101x 0.97 Kg
OADC0104 0.260 Kg
OADC1100 0.260 Kg
OADC1300 0.910Kg
OADC1750 0.920 Kg
OCNC1230 0.260 Kg
RAIU1000 0.14 Kg
HSKU1x00 0.15 Kg
USIB1000 0,17 Kg
PSUP1000 0.3 Kg
FANS1000 3.360 Kg
FANS2000 0.580 Kg
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Technical specifications Environmental characteristics
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Environmental characteristics
Main environmental aspects of Alcatel-Lucent products are:
• energy consumption during manufacturing and use,
• materials harmfulness and recycleability,
• emissions to air, water or soil related to the manufacturing and the use of the product,
• electromagnetic (EM) emissions,
• value recovery at the product end of life.
The 1626 LM is designed to be compliant to ETSI standards.
The technical data of this chapter are referred to ITU-T Recommendations and ETSI
Standards.
Compliancy to the above Directives is declared, when the equipment is installed as for the
manufacturer handbooks, according to the following European Norms:
• EN 300 386 (V1.3.2), environment “Telecommunication center"
WARNING
This is a class A product of EN 55022. In domestic, residential and light industry
environments, this product may cause radio interference in which case the user may be
required to take adequate measures.
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In addition to the requirements of EN 300 386 specification, the equipment meets the
additional requirements of ES 201 468 ("Additional Electro Magnetic Compatibility
(EMC) requirements for Telecommunications Equipment for Enhanced Availability of
Service in Specific Conditions“).
EMI/EMC condition are described in “Electromagnetic Compatibility (EMC condition)”
(p. A-10).
The general principle is the producer responsibility in the management of the products he
puts on the market when discarded by the owner. The producer responsibility now covers
the end of life of the products sold.
The European directive is effective in a country once transposed. The starting date for the
producer responsibility for the European text is 13th August 2005.
All Alcatel-Lucent products fall under in Category 3 of Annex 1A of the WEEE directive
(Directive 2002/96/ EC) i.e. "IT and Telecommunication equipment" under item "other
products transmitting sound, images or other information by telecommunications."
Alcatel-Lucent products fall under WEEE directive name: "Other product or equipment
of transmitting sound, images or other information by telecommunications" in Annex 1B.
This mark will not cause any responsibility as all responsibilities will be defined by
contract.
Acoustical noise
The acoustical noise level of the product complies with:
• ETS 300 753, environment “Telecommunication equipment rooms unattended"
The measurements have been performed according to the standard ISO 3745.
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• ordinary storage rooms for frost resistant products and farm buildings, etc.
29
5 95
Figure 4-6 Climatogram for Class 3.2: Partly temperature controlled locations
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The equipment operates within its specified performance limits over the range specified in
the climatogram for this environmental class (Figure 4-6, “Climatogram for Class 3.2:
Partly temperature controlled locations” (p. 4-65)).
The equipment thus also operates within its specified performance limits over the
temperature and humidity range. Thus an increase in the specified upper temperature limit
to +50 ºC from +45 ºC as specified in EN 300 019-1-3 for Class 3.2.
The applicable extreme external operating conditions are summarized in Table 4-4,
“Environmental Operating Conditions[1]” (p. 4-66). A description of the applicable
operating conditions for both the ETSI requirements are described below.
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Storage
The units are un-powered and packed in a “ready to ship” condition prior to being
subjected to the following storage conditions. The packaging procedures and materials
used have to be representative of those used for the final delivered product. The delivered
product is: equipped racks, equipped subracks and individual units, unit design is
compatible with all of these.
The 1626 LM equipment meets the following requirements Vs. Storage:
ETS 300 019-1-1: 1992, class 1.2
Class 1.2: weather protected, not temper. controlled storage location.
This class applies to weather protected storage having neither temperature nor humidity
control. The location may have openings directly to the open air, i.e., it may be only partly
weatherproofed. The climatogram is shown on Figure 4-7, “Climatogram for Class 1.2:
not temperature controlled storage location” (p. 4-68).
This class applies to storage locations:
• where equipment may be exposed to solar radiation and temporarily to heat radiation:
They may also be exposed to movements of the surrounding air due to draughts, e.g.
through doors, windows or other openings. They may be subjected to condensed
water, dripping water and to icing. They may also be subjected to limited wind-driven
precipitation including snow;
• where mould growth or attacks by animals, except termites, may occur;
• with normal levels of contaminants experienced in urban areas with industrial
activities scattered over the whole area, ad/or with heavy traffic;
• in areas with sources of sand or dust, including urban areas;
• with vibration of low significance and insignificant shock.
The conditions of this class may occur in:
• unattended buildings;
• some entrances of buildings;
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29
Figure 4-7 Climatogram for Class 1.2: not temperature controlled storage location
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Transportation
The units are un-powered and packed in a “ready to ship” condition prior to being
subjected to the following transportation conditions. The packaging procedures and
materials used have to be representative of those used for the final delivered product. The
delivered product is: equipped racks, equipped subracks and individual units, unit design
is compatible with all of these.
The 1626 LM equipment meets the following requirements Vs. transportation:
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5 Dismantling & recycling
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Subrack disassembly
Figure 5-1, “Subrack front and rear view” (p. 5-3) shows an example of subrack.
The same rules can be applied to the specific equipment to be dismantled.
In order to disassemble the subrack first remove the boards eventually present, included
termination bus.
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Procedure:
• Remove the two screws (A) in order to disassemble the handle as reported in
Figure 5-2, “Handle removing and disassembly” (p. 5-4).
• Repeat the same procedure on the other handle.
• Separate the two plastic blocks of the handle as reported in Figure 5-2, “Handle
removing and disassembly” (p. 5-4).
plastic block
plastic block
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• Unscrew all the screws present on rear cover as shown in Figure 5-3, “Rear cover
removing” (p. 5-5) (dashed lines).
• Remove the rear cover in order to access the subrack Back Panel.
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• Unscrew all the screws fastening the Back Panel to the mechanical structure of the
subrack as indicated in Figure 5-4, “Back Panel removing” (p. 5-6) (dashed line).
• Remove the Back Panel from the subrack mechanical structure.
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• Remove the upper and lower guides from the subrack access area by unscrewing the
relevant screws as indicated in Figure 5-5, “Upper and lower guides plane removing”
(p. 5-7).
BASIC AREA
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• Remove the side wall by unscrewing the relevant screw as indicated in Figure 5-6,
“Side wall removing” (p. 5-8).
• Remove the two contact springs from the side wall as indicated in Figure 5-7, “Optical
fiber duct, guides and contact spring removing” (p. 5-10) (refer to “Hazardous
materials and components” (p. 5-24) for info about hazardous parts dismantling).
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• Remove the two guides of the “basic area" and the two optical fiber ducts by pulling
them out as indicated in Figure 5-7, “Optical fiber duct, guides and contact spring
removing” (p. 5-10).
• Unscrew all the screws present on the other “side wall" in order to complete the
subrack disassembly.
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guides guides
contact spring
contact spring
Figure 5-7 Optical fiber duct, guides and contact spring removing
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Unit disassembly
Procedure:
• Remove the two screws (A) from the side coverplate as indicated in Figure 5-8, “Side
coverplate removal” (p. 5-11).
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• Remove the screws (B) that fix the two levers and subsequently pull out them from the
front plate as indicated in Figure 5-9, “Levers removal” (p. 5-12).
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• Unscrew and extract the two optical connectors (C) as indicated Figure 5-10, “Optical
connectors support removal” (p. 5-13).
• Remove the screw (D) fixing the connectors support as indicated in Figure 5-10,
“Optical connectors support removal” (p. 5-13).
• Rotate the connectors support (E) and pull it sideways to remove as indicated
Figure 5-10, “Optical connectors support removal” (p. 5-13).
D
C
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• Remove the two screws (F) from the side coverplate as indicated in Figure 5-11, “Side
coverplate and contact spring removal” (p. 5-15).
• Extract from the top the contact spring (G) as indicated in Figure 5-11, “Side
coverplate and contact spring removal” (p. 5-15) (refer to “Hazardous materials and
components” (p. 5-24) for info about hazardous parts dismantling).
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• Extract the fibers from the cavity (H) as indicated in Figure 5-11, “Side coverplate and
contact spring removal” (p. 5-15).
F
G
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• Disconnect the two flat cables (M) as indicated in Figure 5-12, “Internal connectors
removal” (p. 5-17).
• Unscrew (L) connectors with the aid of a wrench as indicated Figure 5-12, “Internal
connectors removal” (p. 5-17).
• Remove the fibers (N) from supports pulling them out Figure 5-12, “Internal
connectors removal” (p. 5-17).
• Remove the two screws (O) on the other side of the board that fixes the dissipator to
the Printed Circuit Board (PCB) as indicated in Figure 5-13, “Dissipator removal”
(p. 5-18).
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• The dissipator can now be removed (refer to Figure 5-14, “Modules removal from
dissipator” (p. 5-19)).
L L L L L
M L
N
N
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Dismantling & recycling How to disassembly equipment
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• Remove the plastic part (X) in Figure 5-15, “Daughter board removal” (p. 5-20) by
unscrewing the screw present on the rear side of the dissipator.
P P
P
P
P
P P
P
............................................................................................................................................................................................................................................................
3AL 75131 AAAA 5-19
Edition 1 March, 14th, 2008
Dismantling & recycling How to disassembly equipment
............................................................................................................................................................................................................................................................
• Remove the screws (Q) and (R) that fix the daughter board and pull it out from the
mother board (refer to Figure 5-15, “Daughter board removal” (p. 5-20)).
MOTHER BOARD R
DAUGHTER BOARD
Q
Q
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5 - 20 3AL 75131 AAAA
Edition 1 March, 14th, 2008
Dismantling & recycling How to disassembly equipment
............................................................................................................................................................................................................................................................
• Cut away gold connector (S) from daughter board (refer to Figure 5-16, “Gold
connector removal” (p. 5-21))
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3AL 75131 AAAA 5-21
Edition 1 March, 14th, 2008
Dismantling & recycling How to disassembly equipment
............................................................................................................................................................................................................................................................
• Remove all internal cables as indicated in Figure 5-17, “Internal cables removal”
(p. 5-22). To remove cables it is enough to pull them out from their support.
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5 - 22 3AL 75131 AAAA
Edition 1 March, 14th, 2008
Dismantling & recycling How to disassembly equipment
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Metal support
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3AL 75131 AAAA 5-23
Edition 1 March, 14th, 2008
Dismantling & recycling How to disassembly equipment
............................................................................................................................................................................................................................................................
Table 5-1 List of hazardous materials and components present in the equipment
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5 - 24 3AL 75131 AAAA
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Dismantling & recycling How to disassembly equipment
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3AL 75131 AAAA 5-25
Edition 1 March, 14th, 2008
Dismantling & recycling How to disassembly equipment
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5 - 26 3AL 75131 AAAA
Edition 1 March, 14th, 2008
Dismantling & recycling ECO declaration
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ECO declaration
The Alcatel-Lucent 1626 Light Manager is a global 3rd generation DWDM transmission
platform addressing Long Haul (LH) and Ultra Long Haul (ULH) terrestrial applications
and unrepeatered submarine systems.
This product complements and extends Alcatel-Lucent's highly successful range of
Regional and Long Haul DWDM products to achieve lower costs and superior system
performance.
The 1626 Light Manager helps service providers lower the overall transmission cost per
bit in the core of the network by minimizing CAPEX and optimizing OPEX.
Key features
• Best-in-class footprint
• Lower power consumption
• Greater span performance
• Seamless upgrade using the Optical Network Extender Shelf to grow the network
• Cost optimized transponders
• Ease of use with new channel balancing feature
• Integrated submarine and terrestrial platform
• Fully managed by the Alcatel-Lucent 1350 management suite
Moreover refer to Chapter 5, “1626 LM system characteristics” on page 5-1.
POWER CONSUMPTION
Refer to Chapter 5, “Power supply characteristics” on page 5-56.
ACOUSTICAL NOISE
Refer to Chapter 5, “Acoustical noise” on page 5-61.
MATERIALS
Refer to “List of hazardous materials and components present in the equipment” (p. 5-24)
for details.
DISASSEMBLY
Refer to paragraph “How to disassembly equipment” (p. 5-2).
BATTERIES
The product requires no backup batteries.
PACKAGING
The packaging of this Alcatel-Lucent equipment complies with the directive 94/62/EEC
concerning packaging and packaging waste. Depending on the means of transportation the
racks are packed in a cardboard or wooden box, which can easily be recycled after use.
Environmentally harmful materials are not used for packaging. The packaging materials
are marked according to ISO 11 469. If required by the Customer and agreed by both
parties, Alcatel-Lucent can take care of the proper disposal of all packaging materials.
For details refer to the “Installation Handbook".
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5 - 28 3AL 75131 AAAA
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Dismantling & recycling ECO declaration
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DOCUMENTATION
In order to reduce paper consumption for Customer Documentation, Alcatel-Lucent
delivers the Generic Customer Documentation on a CD-ROM. The CD-ROM contains
interactive HW Descriptions, SW Descriptions, Functional Descriptions, Maintenance
Manuals and User Guides. This allows the operator to put the documentation on a server
accessible by all relevant people in the organization without any additional paper copies.
Additionally more specific documentations as e.g. information about products and
solutions, services and support, training events etc. will be provided by means of Alcatel-
Lucent website accessible by all customers. This will allow distribution of up-to-date
information very quickly and without wasting natural resources.
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3AL 75131 AAAA 5-29
Edition 1 March, 14th, 2008
Dismantling & recycling ECO declaration
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A Safety Norms &
Equipment Labels
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3AL 75131 AAAA A -1
For Approval March, 11th, 2008
Safety Norms & Equipment Labels First aid for electric shock
............................................................................................................................................................................................................................................................
ARTIFICIAL RESPIRATION
It is important to start mouth to mouth resuscitation at once and seek medical help
immediately.
TREATMENT OF BURNS
This treatment should be used after the patient has regained consciousness. It can also be
employed while the artificial respiration is being applied (in this case there should be at
least two persons present).
CAUTION:
• Do not attempt to remove his clothing from the burnt parts;
• Apply dry gauze on the burns;
• Do not apply ointments or other oily substances.
............................................................................................................................................................................................................................................................
A-2 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels First aid for electric shock
............................................................................................................................................................................................................................................................
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3AL 75131 AAAA A-3
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
Safety Rules
General Safety Rule 1
When the equipment is in service, nobody is authorized to access to the components
protected with cover plate shields.
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3AL 75131 AAAA A-5
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
CONTAINS A SYMBOL.
INDICATES WARNING OR DANGER: BLUE BACKGROUND,
WHITE SYMBOL OR STATEMENT
The labels have been affixed to indicate a dangerous condition. They may contain any
standard-known symbol or any statement necessary to safeguard users and service
personnel against the most common ones, specifically:
• dangerous electrical voltages
• harmful optical signals
• risk of explosion
• moving mechanical parts
• heat-radiating mechanical parts
Pay attention to the information stated in the following, and proceed as instructed
............................................................................................................................................................................................................................................................
A-6 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
If it is a Class 1 equipment connected to mains, then the label associated to it will state that
the equipment will have to be grounded before connecting it to the power supply voltage,
e.g.:
WARNING!
Ground protect the equipment
before connecting it to mains
Make sure that power has been cut
off before disconnecting ground
protection.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-7
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
The symbol indicates the presence of a LASER beam. Danger level is stated within a
rectangular label:
If the laser is a Hazard Level 1 product, the label depicting the symbol within a triangle is
not compulsory.
The rectangular shaped label bears all the information needed, i.e.:
• LASER class
• Power emitted
• Wave length
• Ref. Norm
• Precautionary measures taken depend on LASER class
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A-8 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
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3AL 75131 AAAA A-9
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
6. Never point an unterminated optical fiber splice, cable or connector to other persons,
unless it is absolutely known that no laser radiation is present.
7. Always remove electrical power from near and far optical transmitters before
disconnecting optical links between the transmitter and the receiver.
8. Wearing of laser safety goggles or eyes shields is recommended for every person
working on optical devices, whenever the above listed rules cannot be followed.
Therefore, slits or apertures are made to let air circulate freely and allow dangerous gasses
to downflow (battery-emitted hydrogen). A 417-IEC-5641 Norm. compliant label is
affixed next to it indicating that the openings must not be covered up.
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A - 10 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
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Before carrying out any maintenance operation see that all the moving mechanical parts
have been stopped.
As stated by IEC 950 Norm, mechanical parts which carry the above pictured label and
that could be touched, have maximum overtemperature as described in the following table.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-11
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
Observe the precautionary measures stated when having to touch the electronic parts
during the installation/maintenance phases.
Workers are supplied with antistatic protection devices consisting of:
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-13
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Safety Rules
............................................................................................................................................................................................................................................................
Suggestion or note....
Cautions to avoid possible equipment damage are marked by the following
symbol:
TITLE...
(caution to avoid equipment damage)
statement....
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A - 14 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Labels affixed to the equipment
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3AL 75131 AAAA A-15
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Labels affixed to the equipment
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A - 16 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Labels affixed to the equipment
............................................................................................................................................................................................................................................................
2 4
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
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3AL 75131 AAAA A-17
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Labels affixed to the equipment
............................................................................................................................................................................................................................................................
xxxxxxxxx
xxxxxx
2
ABC
xxxxxxxxx
3
xxxxxx
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
Figure A-2 Labels on units with standard cover plate, with two extraction handles
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A - 18 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
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ANV CODE
P/N ICS
3AL 34422 AA AA 01
3AL 34422 AA AB 01
3AL 34422 AA AC 01
Note: The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
In this example you can see that the production series is identified by the 'suffix + ICS'
in the ANV code.
Some of the possible positions of the labels indicating the unit's P/Ns and CS-ICS are
illustrated in Appendix A, “Labels affixed to the equipment” on page A-13.
As the Customer may have to manage many units of the same type (same Part Number)
but with different ICS, each hardware settings paragraph describes with possible different
parts the different setting options, according to all the possible P/N + ICSs. For this
purpose, when more than one setting versions are present, a table at the beginning of
the paragraph indicates the part to be used according to the corresponding 'suffix + ICS',
taking into account that:
– a change of the production series does not necessarily imply a change in the setting
options;
– a change of the ANV P/N suffix does not imply a handbook change;
– the SUFFIX and ICS must be meant as:
– from specified SUFFIX or ICS (included)
– to next SUFFIX or ICS (excluded) if listed
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3AL 75131 AAAA A-19
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
EXAMPLE
Note: The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
Taking into account the same unit of Table A-3, “Example of ANV Part Number + ICS
evolution” (p. A-19):
Supposing that the setting options valid for CS=01 are equal to those for CS=02, but
change for CS=03, the table at the beginning of the document 3AL 34422 AAAA
MSZZQ will be:
ANV CODE
P/N ICS
3AL 34422 AAAA 01
3AL 34422 AAAB 01
you will use the Part 1 of the paragraph for 3AL 34422 AAAA
ANV CODE
P/N ICS
3AL 34422 AAAC 01
3AL 34422 AAAD 01
you will use Part 2 of the paragraph for 3AL 34422 AAAA
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A - 20 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
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............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-21
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
NB. 1 = The label is present on p.b.a. components side or rear side on the empty spaces.
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
............................................................................................................................................................................................................................................................
A - 22 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
The commercial code (10 digits) is silk-screened printing on the front panel label.
The position and size is defined in design phase.
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-23
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
The commercial code (10 digits) is silk-screened printing on the front panel label.
The position and size is defined in design phase.
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
............................................................................................................................................................................................................................................................
A - 24 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
NOTE: The above reference numbers are detailed on Table A-2, “Label references”
(p. A-15).
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-25
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
Figure A-8 Label identifying Unit, Optical assembly, Shelf, Back panel
Figure A-9 External label for unit identification (unit with two ejectors): P/N
Figure A-10 External label for unit/shelf identification - unit with ejector(s): CLEI
code
............................................................................................................................................................................................................................................................
A - 26 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-27
For Approval March, 11th, 2008
Safety Norms & Equipment Labels Part Number and Change Status identification
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
A - 28 3AL 75131 AAAA
For Approval March, 11th, 2008
Safety Norms & Equipment Labels General Maintenance Rules
............................................................................................................................................................................................................................................................
WARNING
CE, WEEE and China RoHS symbols can be in the same label or in different position of
the equipment.
............................................................................................................................................................................................................................................................
3AL 75131 AAAA A-29
For Approval March, 11th, 2008
Safety Norms & Equipment Labels General Maintenance Rules
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
A - 30 3AL 75131 AAAA
For Approval March, 11th, 2008
B Abbreviations
ABBREVIATION MEANING
A/D Add and Drop functionality
AFI Authority and Format Identifier
AIS Alarm Indication Signal
ALS Automatic Laser Shutdown
AMS proprietary Alcatel Maintenance Signal; there are
two types of AMS: AMSs (for legacy submarine
equipment) and AMSt (for legacy terrestrial
equipment)
APA Automatic Pre-emphasis Adjustment
APD Avalanche Photo Detector (photodiode
technology)
APS Automatic Protection switching
APSD Automatic Power ShutDown
AS Alarm Surveillance
ASAP Alarm Severity Assignment Profile
ASIC Application Specific Integrated Circuit
ATTD ATTendeD (Alarm storing)
BER Bit Error Rate
B&W Black and White
BOL Beginning of Life
CBR Constant Bit Rate
CDR Clock and Data Recovery CD-ROM Compact
Disk Read Only Memory
Ch Channel
............................................................................................................................................................................................................................................................
3AL 75131 AAAA B -1
Edition 1 March, 14th, 2008
Abbreviations
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B-2 3AL 75131 AAAA
Edition 1 March, 14th, 2008
Abbreviations
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B-4 3AL 75131 AAAA
Edition 1 March, 14th, 2008
Abbreviations
............................................................................................................................................................................................................................................................
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3AL 75131 AAAA B-5
Edition 1 March, 14th, 2008
Abbreviations
............................................................................................................................................................................................................................................................
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3AL 75131 AAAA B-7
Edition 1 March, 14th, 2008
Abbreviations
............................................................................................................................................................................................................................................................
............................................................................................................................................................................................................................................................
B-8 3AL 75131 AAAA
Edition 1 March, 14th, 2008