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FEATURES DESCRIPTION
n Dual, 180° Phased Controllers Reduce Required The LTC®3850 is a high performance dual synchronous
Input Capacitance and Power Supply Induced Noise step-down switching regulator controller that drives all
n High Efficiency: Up to 95% N-channel power MOSFET stages. A constant-frequency
n R
SENSE or DCR Current Sensing current mode architecture allows a phase-lockable fre-
n ±1% 0.8V Output Voltage Accuracy quency of up to 780kHz. Power loss and supply noise are
n Phase-Lockable Fixed Frequency 250kHz to 780kHz minimized by operating the two controller output stages
n Supports Pre-Biased Output out of phase.
n Dual N-Channel MOSFET Synchronous Drive
n Wide V Range: 4V to 24V (30V for LTC3850I)
OPTI-LOOP® compensation allows the transient response
IN to be optimized over a wide range of output capacitance
Operation
n Adjustable Soft-Start Current Ramping or Tracking
and ESR values. The LTC3850 features a precision 0.8V
n Foldback Output Current Limiting
reference and a power good output indicator. A wide 4V
n Power Good Output Voltage Monitor
to 24V (28V maximum/30V for LTC3850I) input supply
n 28-Pin 4mm × 4mm, 4mm × 5mm QFN and Narrow
range encompasses most battery chemistries and inter-
mediate bus voltages.
SSOP Packages
n AEC-Q100 Qualified for Automotive Applications Independent TK/SS pins for each controller ramp the
output voltages during start-up. Current foldback limits
APPLICATIONS MOSFET heat dissipation during short-circuit conditions.
n Notebook and Palmtop Computers The MODE/PLLIN pin selects among Burst Mode® opera-
n Portable Instruments tion, pulse-skipping mode, or continuous inductor cur-
n Battery-Operated Digital Devices rent mode and allows the IC to be synchronized to an
n DC Power Distribution Systems external clock.
All registered trademarks and trademarks are the property of their respective owners. Protected The LTC3850 is available in low profile 28-pin 4mm ×
by U.S. patents, including 5481178, 5705919, 5929620, 6100678, 6144194, 6177787,
6304066, 6580258. 4mm, 4mm × 5mm QFN and narrow SSOP packages.
TYPICAL APPLICATION
High Efficiency Dual 3.3V/2.5V Step-Down Converter Efficiency
VIN
7V TO 100 10000
22µF 24V VIN = 12V
4.7µF 50V 95 VOUT = 3.3V EFFICIENCY
VIN PGOOD INTVCC
90
TG1 TG2
0.1µF 0.1µF
85
POWER LOSS (mW)
1000
EFFICIENCY (%)
38501 TA01
Rev. D
PIN CONFIGURATION
TOP VIEW TOP VIEW
FREQ/PLLFLTR
RUN1 1 28 FREQ/PLLFLTR
MODE/PLLIN
SENSE1+ 2 27 MODE/PLLIN
SENSE1–
SENSE1+
SENSE1–
RUN1
3 26 SW1
SW1
TG1
TK/SS1 4 25 TG1
28 27 26 25 24 23 22
ITH1 5 24 BOOST1
TK/SS1 1 21 BOOST1
VFB1 6 23 BG1
ITH1 2 20 BG1
SGND 7 22 VIN
VFB1 3 19 VIN
VFB2 8 21 INTVCC VFB2 4 29 18 INTVCC
ITH2 9 20 BG2 ITH2 5 17 BG2
TK/SS2 10 19 PGND TK/SS2 6 16 PGND
SENSE2– 11 18 BOOST2 SENSE2– 7 15 BOOST2
SENSE2+ 12 17 TG2 8 9 10 11 12 13 14
RUN2 13 16 SW2
SENSE2+
RUN2
ILIM
EXTVCC
PGOOD
SW2
TG2
GN PACKAGE UF PACKAGE
28-LEAD NARROW PLASTIC SSOP 28-LEAD (4mm × 4mm) PLASTIC QFN
TJMAX = 125°C, θJA = 95°C/W TJMAX = 125°C, θJA = 37°C/W, θJC = 2.6°C/W
*PIN 14 = ILIM FOR LTC3850GN, EXTVCC FOR LTC3850GN-1 EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
TOP VIEW
FREQ/PLLFLTR
MODE/PLLIN
SENSE1+
RUN1
SW1
TG1
28 27 26 25 24 23
SENSE1– 1 22 BOOST1
TK/SS1 2 21 BG1
ITH1 3 20 VIN
VFB1 4 19 INTVCC
29
VFB2 5 18 BG2
ITH2 6 17 PGND
TK/SS2 7 16 BOOST2
SENSE2– 8 15 TG2
9 10 11 12 13 14
SENSE2+
RUN2
ILIM
EXTVCC
PGOOD
SW2
UFD PACKAGE
28-LEAD (4mm × 5mm) PLASTIC QFN
TJMAX = 125°C, θJA = 34°C/W, EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
Rev. D
Rev. D
Rev. D
Note 1: Stresses beyond those listed under Absolute Maximum Ratings LTC3850GN: TJ = TA + (PD • 95°C/W)
may cause permanent damage to the device. Exposure to any Absolute LTC3850UF: TJ = TA + (PD • 37°C/W)
Maximum Rating condition for extended periods may affect device LTC3850UFD: TJ = TA + (PD • 43°C/W)
reliability and lifetime. Note 4: The LTC3850 is tested in a feedback loop that servos VITH1,2 to a
Note 2: The LTC3850E/LTC3850E-1 are guaranteed to meet performance specified voltage and measures the resultant VFB1,2.
specifications from 0°C to 85°C. Specifications over the –40°C to 85°C Note 5: Dynamic supply current is higher due to the gate charge being
operating temperature range are assured by design, characterization and delivered at the switching frequency. See Applications Information.
correlation with statistical process controls. The LTC3850I/LTC3850I-1 Note 6: Rise and fall times are measured using 10% and 90% levels. Delay
are guaranteed to meet performance specifications over the –40°C to 85°C times are measured using 50% levels.
operating temperature range. Note 7: The minimum on-time condition is specified for an inductor
Note 3: TJ is calculated from the ambient temperature TA and power peak-to-peak ripple current ≥40% of IMAX (see Minimum On-Time
dissipation PD according to the following formulas: Considerations in the Applications Information section).
Note 8: VSENSE(MAX) defaults to 50mV typical for the LTC3850-1.
EFFICIENCY (%)
EFFICIENCY (%)
60 DCM DCM
60
50 50 90 1000
40 40 POWER LOSS
30 30 CCM
CCM 85 500
20 20
10 10 VIN = 12V
VOUT = 3.3V
0 0 80 0
10 100 1000 10000 10 100 1000 10000 5 10 15 20 25
LOAD CURRENT (mA) 38501 G01
LOAD CURRENT (mA) INPUT VOLTAGE (V) 38501 G03
38501 G02
CIRCUIT OF FIGURE 14 CIRCUIT OF FIGURE 14 CIRCUIT OF FIGURE 14
Rev. D
ILOAD ILOAD
2A/DIV 2A/DIV
200mA TO 2.5A 200mA TO 2.5A
IL IL
2A/DIV 2A/DIV
VOUT VOUT
100mV/DIV 100mV/DIV
AC COUPLED AC COUPLED
Load Step
(Pulse-Skipping Mode) Inductor Current at Light Load
ILOAD FORCED
2A/DIV CONTINUOUS
200mA TO 2.5A MODE
2A/DIV
IL
2A/DIV Burst Mode
OPERATION
VOUT 2A/DIV
100mV/DIV
AC COUPLED PULSE-SKIPPING
MODE
2A/DIV
38501 G06 38501 G07
40µs/DIV 1µs/DIV
CIRCUIT OF FIGURE 14 CIRCUIT OF FIGURE 14
VIN = 12V, VOUT = 1.8V VIN = 12V, VOUT = 1.8V
ILOAD = 100µA
RUN1
2V/DIV
VOUT VOUT1, 3.3V
VTK/SS
2V/DIV 3Ω LOAD, 1V/DIV
500mV/DIV
VOUT2, 1.8V
VFB 1.5Ω LOAD
500mV/DIV 1V/DIV
38501 G08 38501 G09
2.5ms/DIV 1ms/DIV
Rev. D
TK/SS1
5.00
TK/SS2 4
2V/DIV
0 3.50
5 10 15 20 25 0 5 10 15 20 25
INPUT VOLTAGE (V) INPUT VOLTAGE (V)
38501 G11 38501 G12
Current Sense Threshold Maximum Current Sense Threshold Maximum Current Sense
vs ITH Voltage vs Common Mode Voltage Threshold vs Duty Cycle
80 80 100
ILIM = INTVCC ILIM = INTVCC 90
70
CURRENT SENSE THRESHOLD (mV)
60
ILIM = FLOAT
20 40 50
ILIM = GND
ILIM = GND 30 40
ILIM = GND
0
30
20
–20 20
10
10
–40 0 0
0 0.5 1 1.5 2 0 1 3 2 4 5 0 20 40 60 80 100
VITH (V) VSENSE COMMON MODE VOLTAGE (V) DUTY CYCLE (%)
38501 G13 38501 G14 38501 G15
ILIM = INTVCC
70
60 1.75
TK/SS CURRENT (µA)
ILIM = FLOAT
50
40 1.50
ILIM = GND
30
20 1.25
10
0 1.00
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 –50 –25 0 25 50 75 100
FEEDBACK VOLTAGE (V) TEMPERATURE (°C)
38501 G16 38501 G17
Rev. D
802
FREQUENCY (kHz)
1.3
600
ON 800
VFREQ = 1.2V
500
1.2
OFF 798
400
1.1
796 300 VFREQ = 0V
4 40
RISING 410
FREQUENCY (kHz)
3 30
FALLING
400
2 20
390
1 10
0 380 0
–50 –25 0 25 50 75 100 5 10 15 20 25 5 10 15 20 25
TEMPERATURE (°C) INPUT VOLTAGE (V) INPUT VOLTAGE (V)
38501 G21 38501 G22 38501 G23
40 4
SHUTDOWN CURRENT (µA)
30 3
20 2
10 1
0 0
–50 –25 0 25 50 75 100 –50 –25 0 25 50 75 100
TEMPERATURE (°C) TEMPERATURE (°C)
38501 G24 38501 G25
Rev. D
RUN1, RUN2 (Pins 1, 13/Pins 26, 9/Pins 27, 10): Run VIN > VEXTVCC at all times. On the GN package, EXTVCC is
Control Inputs. A voltage above 1.2V on either pin turns the optional bonding in place of ILIM for LTC3850-1. In
on the IC. However, forcing either of these pins below 1.2V the LTC3850-1, ILIM will default to 50mV.
causes the IC to shut down that particular channel. There
ILIM (Pin 14, LTC3850 Only/Pin 10/Pin 11): Current
are 0.5µA pull-up currents for these pins. Once the RUN
Comparator Sense Voltage Range Inputs. Tying this pin to
pin rises above 1.2V, an additional 4.5µA pull-up current
SGND, FLOAT or INTVCC sets the maximum current sense
is added to the pin.
threshold to three different levels for each comparator.
SENSE1+, SENSE2+ (Pins 2, 12/Pins 27, 8/Pins 28, 9):
PGOOD (Pin 15/Pin 12/Pin 13): Power Good Indicator
Current Sense Comparator Inputs. The (+) inputs to the
Output. Open-drain logic out that is pulled to ground when
current comparators are normally connected to DCR
either channel output exceeds the ±7.5% regulation window,
sensing networks or current sensing resistors.
after the internal 17µs power bad mask timer expires.
SENSE1–, SENSE2– (Pins 3, 11/Pins 28, 7/Pins 1, 8):
PGND (Pin 19/Pin 16/Pin 17): Power Ground Pin. Connect
Current Sense Comparator Inputs. The (–) inputs to the
this pin closely to the sources of the bottom N-channel
current comparators are connected to the outputs.
MOSFETs, the (–) terminal of CVCC and the (–) terminal
TK/SS1, TK/SS2 (Pins 4, 10/Pins 1, 6/Pins 2, 7): Output of CIN.
Voltage Tracking and Soft-Start Inputs. When one channel
INTVCC (Pin 21/Pin 18/Pin 19): Internal 5V Regulator Output.
is configured to be master of the two channels, a capaci-
The control circuits are powered from this voltage.
tor to ground at this pin sets the ramp rate for the master
Decouple this pin to PGND with a 4.7µF low ESR tantalum
channel’s output voltage. When the channel is configured
or ceramic capacitor.
to be the slave of two channels, the VFB voltage of the
master channel is reproduced by a resistor divider and VIN (Pin 22/Pin 19/Pin 20): Main Input Supply. Decouple
applied to this pin. Internal soft-start currents of 1.3µA this pin to PGND with a capacitor (0.1µF to 1µF). For
charge the soft-start capacitors. applications where the main input power is 5V, tie the VIN
and INTVCC pins together.
ITH1, ITH2 (Pins 5, 9/Pins 2, 5/Pins 3, 6): Current Control
Thresholds and Error Amplifier Compensation Points. BG1, BG2 (Pins 23, 20/Pins 20, 17/Pins 21, 18): Bottom
Each associated channels’ current comparator tripping Gate Driver Outputs. These pins drive the gates of the
threshold increases with its ITH control voltage. bottom N-Channel MOSFETs and swings between PGND
and INTVCC.
VFB1, VFB2 (Pins 6, 8/Pins 3, 4/Pins 4, 5): Error Amplifier
Feedback Inputs. These pins receive the remotely sensed BOOST1, BOOST2 (Pins 24, 18/Pins 21, 15/Pins 22, 16):
feedback voltages for each channel from external resistive Boosted Floating Driver Supplies. The (+) terminal of the
dividers across the outputs. boost-strap capacitors connect to these pins. These pins
swing from a diode voltage drop below INTVCC up to VIN
SGND (Pin 7/Pin 29/Pin 29): Signal Ground. All small-sig- + INTVCC.
nal components and compensation components should
connect to this ground, which in turn connects to PGND TG1, TG2 (Pins 25, 17/Pins 22, 14/Pins 23, 15): Top Gate
at one point. Pin 29 is the Exposed Pad, only available on Driver Outputs. These are the outputs of floating drivers
the UF package. with a voltage swing equal to INTVCC superimposed on
the switch nodes voltages.
EXTVCC (Pin 14, LTC3850-1 Only/Pin 11/Pin 12): External
Power Input to an Internal Switch Connected to INTVCC. SW1, SW2 (Pins 26, 16/Pins 23, 13/Pins 24, 14):
This switch closes and supplies the IC power, bypassing Switch Node Connections to Inductors. Voltage swing
the internal low dropout regulator, whenever EXTVCC is at these pins are from a body diode voltage drop below
higher than 4.7V. Do not exceed 6V on this pin and ensure ground to VIN.
Rev. D
FUNCTIONAL DIAGRAM
FREQ/PLLFLTR MODE/PLLIN EXTVCC VIN
VIN
4.7V
+
CIN
– +
F
MODE/SYNC 0.8V 5V
DETECT REG
PLL-SYNC – + INTVCC
INTVCC
F
BOOST
OSC S BURSTEN
TG CB
R Q FCNT
M1
SW L1
ON SWITCH VOUT
3k
LOGIC
+ – AND SENSE+ DB
ICMP IREV ANTI-
SHOOT
– + THROUGH SENSE–
+
RUN COUT
BG
OV
M2
CVCC
ILIM SLOPE COMPENSATION
PGND
PGOOD
INTVCC UVLO
+ 0.74V
1 SLOPE RECOVERY R2
UV VFB
51k ACTIVE CLAMP
ITHB –
VIN SLEEP +
R1
OV
– 0.86V
0.8V – SS + – RUN + SGND
REF EA 1.3µA
– + – + +
0.64V 1.2V
0.55V 0.5µA
38501 FD
CC1 CSS
ITH RC RUN TK/SS
Rev. D
Rev. D
The 50mV setting is a good balance between the two. For INDUCTOR OR RSENSE 38501 F01
single output dual phase applications (see Figure 21), use Figure 1. Sense Lines Placement
the 50mV or 75mV setting for optimal current sharing. with Inductor or Sense Resistor
L R2
FILTER COMPONENTS *PLACE C1 NEAR SENSE+, R1||R2 × C1 = RSENSE(EQ) = DCR
DCR R1 + R2
PLACED NEAR SENSE PINS SENSE– PINS
(2a) Using a Resistor to Sense Current (2b) Using the Inductor DCR to Sense Current
Figure 2. Two Different Methods of Sensing Current
Rev. D
Rev. D
38501 F04
To scale the maximum inductor DCR to the desired sense
500ns/DIV
resistor value, use the divider ratio:
Figure 4. Voltage Waveform Measured After the R SENSE(EQUIV)
Sense Resistor Filter. CF = 1000pF, RF = 100Ω. RD =
DCR (MAX) at TL(MAX)
Inductor DCR Sensing
For applications requiring the highest possible efficiency C1 is usually selected to be in the range of 0.047µF to
at high load currents, the LTC3850 is capable of sensing 0.47µF. This forces R1 || R2 to around 2kΩ, reducing
the voltage drop across the inductor DCR, as shown in error that might have been caused by the SENSE pins’
Figure 2b. The DCR of the inductor represents the small ±1µA current.
amount of DC winding resistance of the copper, which can The equivalent resistance R1|| R2 is scaled to the room
be less than 1mΩ for today’s low value, high current induc- temperature inductance and maximum DCR:
tors. In a high current application requiring such an inductor, L
conduction loss through a sense resistor would cost several R1||R2 =
(DCR at 20°C) • C1
points of efficiency compared to DCR sensing.
If the external R1||R2 • C1 time constant is chosen to be The sense resistor values are:
exactly equal to the L/DCR time constant, the voltage drop R1|| R2 R1• RD
across the external capacitor is equal to the drop across R1= ; R2 =
the inductor DCR multiplied by R2/(R1 + R2). R2 scales the RD 1−RD
voltage across the sense terminals for applications where
The maximum power loss in R1 is related to duty cycle,
the DCR is greater than the target sense resistor value. To
and will occur in continuous mode at the maximum
properly dimension the external filter components, the DCR
input voltage:
of the inductor must be known. It can be measured using
a good RLC meter, but the DCR tolerance is not always the
same and varies with temperature; consult the manufactur- PLOSS R1=
( VIN(MAX) − VOUT ) • VOUT
R1
ers’ data sheets for detailed information.
Rev. D
VOUT1 VOUT1
OUTPUT VOLTAGE
OUTPUT VOLTAGE
VOUT2 VOUT2
38501 F06
I I
+
D1 D2 EA2
TK/SS2
–
0.8V
D3
VFB2
38501 F07
Rev. D
500
Minimum On-Time Considerations
400 Minimum on-time tON(MIN) is the smallest time duration
300 that the LTC3850 is capable of turning on the top MOSFET.
200 It is determined by internal timing delays and the gate
100 charge required to turn on the top MOSFET. Low duty
0 cycle applications may approach this minimum on-time
0 0.5 1 1.5 2 2.5
FREQ/PLLFLTR PIN VOLTAGE (V) limit and care should be taken to ensure that
38501 F10
Rev. D
VFB1
L1 RSENSE
SENSE1+ TG1 VOUT1
SENSE1– SW1
CB1
M1 M2
PLLLPF BOOST1 D1
ILIM
BG1 1µF
fIN CERAMIC
MODE/PLLIN COUT1
VIN
CVIN RIN
+
RUN1
PGND
RUN2 VIN GND
+
EXTVCC CIN
SGND
+
CINTVCC
+
CERAMIC
SENSE2+ BG2
M3 M4
VFB2 BOOST2 D2
CB2
ITH2 SW2
RSENSE
TG2 VOUT2
TK/SS2
L2
38501 F12
D1 COUT1 RL1
VIN
RIN
CIN
38501 F13
4.7µF
D3 D4
M1 VIN PGOOD EXTVCC INTVCC M2
TG1 TG2
0.1µF 0.1µF
L1 L2
3.3µH BOOST1 BOOST2 2.2µH
SW1 SW2
LTC3850
BG1 BG2 4.12k
6.19k 10k, 1% 1%
1% MODE/PLLIN PGND
ILIM FREQ/PLLFLTR
SENSE1+ SENSE2+
1.33k 0.1µF 0.1µF 1.5k
1% 1%
SENSE1– SENSE2–
33pF 33pF
RUN1 RUN2
VOUT1 VOUT2
3.3V VFB1 VFB2 1.8V
5A 63.4k ITH1 ITH2 25.5k 5A
1% 1800pF 2200pF 1%
TK/SS1 SGND TK/SS2
COUT1 100pF 100pF COUT2
20k 4.75k 3.16k 5.49k 20k
100µF 1% 1% 0.1µF 0.1µF 1% 1% 1% 100µF
X2 X2
38501 F14
L1, L2: COILTRONICS HCP0703
M1, M2: VISHAY SILICONIX Si4816BDY
COUT1, COUT2: TAIYO YUDEN JMK325BJ107MM
voltage will decrease as VIN approaches 5V, lowering the the maximum DC value plus one-half the ripple current,
switching frequency. If a separate 5V supply is connected or 5.725A for Channel 1 and 5.7A for Channel 2.
to EXTVCC, INTVCC will remain at 5V even if VIN decreases. The minimum on-time occurs on Channel 1 at the maxi-
The inductance values are based on a 35% maximum mum VIN, and should not be less than 90ns:
ripple current assumption (1.75A for each channel). The VOUT 1.8V
highest value of ripple current occurs at the maximum t ON(MIN) = = = 180ns
VIN(MAX)f 20V(500kHz)
input voltage:
VOUT ⎛ VOUT ⎞ With ILIM floating, the equivalent RSENSE resistor value
L= ⎜ 1− ⎟ can be calculated by using the minimum value for the
f • ΔIL(MAX) ⎝ VIN(MAX) ⎠
maximum current sense threshold (40mV).
Channel 1 will require 3.2µH, and Channel 2 will require VSENSE(MIN)
1.9µH. The next highest standard values are 3.3µH RSENSE(EQUIV) = =
ΔIL(NOM)
and 2.2µH. At the nominal input voltage (12V), the ripple ILOAD(MAX) +
will be: 2
40mV
V ⎛ V ⎞ ≅ 7mΩ
ΔIL(NOM) = OUT ⎜ 1− OUT ⎟ 1.5A
f •L ⎝ VIN(NOM) ⎠ 5A +
2
Channel 1 will have 1.45A (29%) ripple, and Channel 2 will The equivalent RSENSE is the same for Channel 2.
have 1.4A (28%) ripple. The peak inductor current will be
Rev. D
80 1
which is less than under full-load conditions.
EFFICIENCY (%)
DCR
70
CIN is chosen for an RMS current rating of at least 2A at
60 0.1 temperature assuming only channel 1 or 2 is on. COUT is
chosen with an ESR of 0.02Ω for low output ripple. The
50
EFFICIENCY
output ripple in continuous mode will be highest at the
40
POWER LOSS
0.01
maximum input voltage. The output voltage ripple due to
0.01 0.1 1 10 ESR is approximately:
LOAD CURRENT (mA)
38501 F15
VORIPPLE = RESR (∆IL) = 0.02Ω(1.5A) = 30mVP–P
Figure 15. Design Example Efficiency vs Load
Rev. D
VIN
7V TO
2.2Ω 22µF 24V
50V
1µF
4.7µF
D3 VIN PGOOD INTVCC D4
M1 M2
TG1 TG2
0.1µF 0.1µF
L2 L2
2.2µH BOOST1 BOOST2 3.3µH
SW1 SW2
LTC3850
BG1 BG2
10k
MODE/PLLIN 1%
PGND
ILIM FREQ/PLLFLTR
10Ω 10Ω
SENSE1+ SENSE2+
8mΩ 1000pF 1000pF 8mΩ
SENSE1– SENSE2–
15pF 10Ω 10Ω 10pF
RUN1 RUN2
VOUT1 EXTVCC VOUT2
3.3V VFB1 VFB2 5V
5A 63.4k ITH1 ITH2 105k 5A
1% 1000pF 1000pF 1%
TK/SS1 SGND TK/SS2
+ COUT1 20k 10k 100pF 15k 20k
+ COUT2
3.16k 100pF
1% 1% 0.1µF 0.1µF 1% 1%
220µF 1% 150µF
38501 F16
Rev. D
R27 L1
4.02k 0.68µH VOUT1
C6 R1
100pF 2.5V/
TYPICAL APPLICATIONS
VFB1 VIN
LTC3850 CVIN
VFB2 INTVCC 1µF
C11
1000pF R18 CVCC
4.99k ITH2 BG2 4.7µF
R3
PGND
20k TK/SS2 D4 PGND
COUT2
C12 CMDSH-3 GND
100pF 330µF
SENSE2– BOOST2 4V
+
C15
38501 TA02
L1, L2: VISHAY IHLP5050EZ-01 0.68µH
COUT1, COUT2: SANYO 4TPD330M
Figure 17. 2.5V/15A, 1.8V/15A Converter with DCR Sensing and Coincident Rail Tracking
FSW = 350kHz
31
Rev. D
LTC3850/LTC3850-1
32
VIN
10µF 7V TO 14V
C1
2x
1000pF +
C2 CIN
RVIN
0.01µF 180µF
R9 R10 2.2Ω
100Ω 100Ω PLLIN
CSS1 R5 400kHz
0.1µF C4 10k M1
1000pF RJK0305DPB
L1 RSENSE1
C6 0.4µH 0.002Ω
R1 VOUT1
100pF 17.8k CB1 1.5V/15A
0.1µF
TYPICAL APPLICATIONS
VFB1 VIN
LTC3850 CVIN
VFB2 INTVCC 1µF
C11
1000pF R18 CVCC
5.9k ITH2 BG2 4.7µF
R3
PGND PGND COUT2
20k TK/SS2 D4
C12 CMDSH-3 GND 330µF
2.5V
+
100pF
SENSE2– BOOST2 2X
M3 L2 RSENSE2
R4 RJK0305DPB 0.4µH 0.002Ω
VOUT2
PGOOD
38501 F18
L1, L2: VITEC 59PR9875
COUT1, COUT2: 2R5TPE330M9
Figure 18. 1.5V/15A, 1.2V/15A Core-I/O Converter with Sense Resistor Synchronized at 400kHz
Rev. D
LTC3850/LTC3850-1
TYPICAL APPLICATIONS
5V ± 0.5V
1Ω 4.7µF
6.3V
2x
4.7µF
D3 D4
M1 VIN PGOOD EXTVCC INTVCC M2
TG1 TG2
0.1µF 0.1µF
L1 L2
0.75µH BOOST1 BOOST2 0.75µH
SW1 SW2
LTC3850
BG1 BG2 1.2k
1.2k PLLIN 1%
1% MODE/PLLIN PGND
750kHz
ILIM FREQ/PLLFLTR
SENSE1+ SENSE2+
2.94k 0.047µF 0.047µF 4.99k
1% 1%
SENSE1– SENSE2–
47pF 100pF
RUN1 RUN2
VOUT1 VOUT2
1.8V VFB1 VFB2 1.2V
5A 25.5k ITH1 ITH2 10k 5A
1% 2200pF 1nF 2200pF 100pF 1%
TK/SS1 SGND TK/SS2 10nF
COUT1 100pF COUT2
20k 14k
100µF 0.1µF 0.1µF 10k 14k 20k 100µF
1% 1%
X2 1% 1% 1% X2
38501 F19
L1, L2: TOKO FDV0630 0.75µH
M1, M2: VISHAY SILICONIX Si4816BDY
COUT1, COUT2: TAIYO YUDEN JMK325BJ107MM
2.2Ω
VIN1 VIN2
12V 3.3V
4.7µF 1µF 13.0k 4.7µF
2x
4.7µF 10k
D3 D4
M1 VIN PGOOD EXTVCC INTVCC M2
TG1 TG2
0.1µF 0.1µF
L1 L2
2.2µH BOOST1 BOOST2 0.75µH
SW1 SW2
LTC3850
BG1 BG2 1.2k
3.74k 10k
1%
1% MODE/PLLIN 1%
PGND
ILIM FREQ/PLLFLTR
SENSE1+ SENSE2+
1.40k 0.1µF 0.1µF 4.32k
1% 1%
SENSE1– SENSE2–
47pF 100pF
RUN1 RUN2
VOUT1 VOUT2
2.5V VFB1 VFB2 1.2V
5A 43.2k ITH1 ITH2 10k 5A
1% 2200pF 2200pF 100pF 1%
TK/SS1 SGND TK/SS2
COUT1 100pF COUT2
20k 10k
100µF 0.1µF 3.16k 6.04k 20k 100µF
1% 1% 0.1µF
X2 1% 1% 1% X2
38501 F20
L1: TOKO FDV0630 2.2µH
L2: TOKO FDV0630 0.75µH
M1, M2: VISHAY SILICONIX Si4816BDY
COUT1, COUT2: TAIYO YUDEN JMK325BJ107MM
.386 – .393*
.045 ±.005 (9.804 – 9.982) .033
(0.838)
28 27 26 25 24 23 22 21 20 19 18 17 1615 REF
.015 ±.004
× 45° .0532 – .0688 .004 – .0098
(0.38 ±0.10)
(1.35 – 1.75) (0.102 – 0.249)
.0075 – .0098 0° – 8° TYP
(0.19 – 0.25)
Rev. D
0.70 ±0.05
4.50 ±0.05
3.10 ±0.05
2.64 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.20 ±0.05
0.40 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED BOTTOM VIEW—EXPOSED PAD PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
4.00 ±0.10 0.75 ±0.05 R = 0.115 CHAMFER
(4 SIDES) R = 0.05 TYP
27 28
TYP
PIN 1 0.40 ±0.05
TOP MARK
(NOTE 6) 1
2
2.64 ±0.10
(4-SIDES)
Rev. D
0.70 ±0.05
4.50 ±0.05
3.10 ±0.05
2.50 REF
2.65 ±0.05
3.65 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
3.50 REF
4.10 ±0.05
5.50 ±0.05
0.40 ±0.10
PIN 1
TOP MARK
(NOTE 6) 1
5.00 ±0.10
3.50 REF
(2 SIDES)
3.65 ±0.10
2.65 ±0.10
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGHD-3).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
Rev. D
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog
Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications
subject to change without notice. No license For more by
is granted information www.analog.com
implication or otherwise under any patent or patent rights of Analog Devices. 37
LTC3850/LTC3850-1
TYPICAL APPLICATION
VIN
20k 7V TO 14V
2.55k 10k 2.21k 10µF
+
RUN RJK0305DPB L1 180µF
1nF 0.1µF 2x
7.5k 0.56µH
PGOOD 2.21k
20k 100k
RUN
FOR SINGLE OUTPUT, DUAL PHASE OPERATION, TIE THE FOLLOWING PINS TOGETHER:
VFB1 TO VFB1 TK/SS1 TO TK/SS2
ITH1 TO ITH2 RUN1 TO RUN2
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DC Controller
Rev. D
38
01/20
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