• DECEMBER 2019

Simulating Heat Transfer

Heat Transfer Analysis – Lesson 3

Why Simulation?

• Necessary - In many practical heat transfer problems, an analytical solution is not

achievable: A numerical solution is the only option.
• Cheaper - Simulation is more efficient than physical experiments. Changes in
problems parameters are easier than changes in experimental setups.
• Insights - It provides insightful information like heat flow paths, temperature
distribution, etc.
• Power - It can use coupled physics, e.g. thermal-structural analysis, thermal-electric
analysis, etc.

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Why Simulation: Necessary

Although idealized and simplified models may be solved by hand calculations,

engineering problems often involve complex geometry and complex boundary
conditions.

Indoor Outdoor

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Why Simulation: Cheaper

Compared to physical experiments, simulation is significantly more time- and cost-

efficient.

4
Why Simulation: Insights

Simulation delivers valuable product insights in addition to target outputs.

• Simulation of an oven or furnace provides not only the temp distribution inside
and outside the oven, but also the heating time and food temperature.

Using constitutive equations for heat However, to design a thermal insulating cloth
transfer, the “feels like” temperature can be requires a detailed modeling of the material.
estimated based on wind speed.

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Why Simulation: Multiphysics Capabilities

Simulation can go beyond single-physics problem-solving to multiphysics solutions.

• A thermal gradient causes strain within an object, and the resultant corresponding stress is
referred to as thermal stress. An analysis that includes thermal fields and displacement fields is
known as a coupled thermal–structural analysis.
• Heat can degrade the performance and reliability of electronic devices. A coupled, electrothermal
analysis can accurately capture power losses on PCBs and predict the operating temperatures of
electronic devices.

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Engineering Judgement

Engineers must make sure the inputs and assumptions are reasonable by using:
• Results to make decisions
• Results to validate that the model was set up correctly

When simulating this fin cooler on a chip, can we
assume the cooler is in perfect contact with the chip?
To make the simulation more accurate, we also need
to consider the effect of the viscous high-conductive
glue in between.
When a simulation shows the soldering iron tip takes Simulation can help decide, for example, which fin
only 0.5 seconds to reach 360°C, then something is shape is more efficient for a specific length tube
incorrect in the model setup. exchange: circular or axial?