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1 Features 3 Description
• Input overvoltage protection up to ±60 V The INA823 is an integrated instrumentation amplifier
• Input voltage extends 150 mV below negative that offers low power consumption and operates
supply over a wide, single-supply or dual-supply range.
• Low power supply current: 180 µA (typ) A single external resistor sets any gain from 1
• Precision performance: to 10,000. The device provides low input offset
– Low offset voltage: 20 µV (typ), 100 µV (max) voltage, low offset voltage drift, low input bias
– Low input bias current: 8nA (max) current, and low current noise while remaining
– Common-mode rejection: cost-effective. Additional circuitry protects the inputs
• 84 dB, G = 1 (min) against overvoltage up to ±60 V.
• 104 dB, G = 10 (min) The INA823 is optimized to provide a high common-
• 120 dB, G ≥ 100 (min) mode rejection ratio. At G = 1, the common-mode
– Power supply rejection: 100 dB, G = 1 (min) rejection ratio exceeds 84 dB across the full input
• Input voltage noise: 21 nV/√Hz common-mode range. The INA823 has a wide
• Bandwidth: 1.9 MHz (G = 1), 60 kHz (G = 100) common-mode voltage range as low as 150-mV
• Stable with 1-nF capacitive loads below negative supply. The device is designed for
• Supply range: low-voltage operation from a 2.7-V single supply, and
– Single-supply: 2.7 V to 36 V dual supplies up to ±18 V. The low power and single
– Dual-supply: ±1.35 V to ±18 V supply operation enable hand-held, battery-operated
• Specified temperature range: –40°C to +125°C systems.
• Packages: 8-pin SOIC and 8-pin VSSOP
Device Information
2 Applications PART NUMBER PACKAGE(1) BODY SIZE (NOM)
• Flow transmitter SOIC (8) 4.90 mm × 3.91 mm
INA823
• Wearable fitness and activity monitor VSSOP (8) 3.00 mm x 3.00 mm
• Infusion pump
(1) For all available packages, see the package option
• Blood glucose monitor addendum at the end of the data sheet.
• Electrocardiogram (ECG)
• Surgical equipment
• Weigh scale
• Analog input module
• Process analytics (pH, gas, concentration, force
and humidity)
• Battery test
7
+VS
2 IN Overvoltage
+ 50 k 50 k
Protection
1 RG
–
50 k –
6
50 k + OUT
8 RG
–
REF 5
50 k 50 k
3 +IN Overvoltage +
Protection
VS
4
Typical Distribution of
Input Stage Offset Voltage Drift
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
INA823
SBOSA75B – JULY 2021 – REVISED NOVEMBER 2021 www.ti.com
Table of Contents
1 Features............................................................................1 9 Application and Implementation.................................. 23
2 Applications..................................................................... 1 9.1 Application Information............................................. 23
3 Description.......................................................................1 9.2 Typical Applications.................................................. 24
4 Revision History.............................................................. 2 10 Power Supply Recommendations..............................29
5 Device Comparison Table...............................................3 11 Layout........................................................................... 29
6 Pin Configuration and Functions...................................3 11.1 Layout Guidelines................................................... 29
7 Specifications.................................................................. 4 11.2 Layout Example...................................................... 30
7.1 Absolute Maximum Ratings........................................ 4 12 Device and Documentation Support..........................31
7.2 ESD Ratings .............................................................. 4 12.1 Device Support....................................................... 31
7.3 Recommended Operating Conditions.........................4 12.2 Documentation Support.......................................... 31
7.4 Thermal Information....................................................4 12.3 Receiving Notification of Documentation Updates..31
7.5 Electrical Characteristics.............................................5 12.4 Support Resources................................................. 31
7.6 Typical Characteristics................................................ 7 12.5 Trademarks............................................................. 31
8 Detailed Description......................................................19 12.6 Electrostatic Discharge Caution..............................31
8.1 Overview................................................................... 19 12.7 Glossary..................................................................31
8.2 Functional Block Diagram......................................... 19 13 Mechanical, Packaging, and Orderable
8.3 Feature Description...................................................20 Information.................................................................... 31
8.4 Device Functional Modes..........................................22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (April 2019) to Revision B (November 2021) Page
• Changed device from advanced information (preview) to production data (active) ...........................................1
RG 1 8 RG
–IN 2 7 +VS
+IN 3 6 OUT
–VS 4 5 REF
Not to scale
Figure 6-1. D (8-Pin SOIC) and DGK (8-Pin VSSOP) Packages, Top View
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Dual supply, VS = (+VS) – (–VS) ± 20
VS –VS, +VS pins voltage V
Single supply, VS = (+VS) 40
IN pins voltage (–VS) – 60 (+VS) + 60 V
RG, REF, OUT pins voltage (–VS) – 0.5 (+VS) + 0.5 V
RG pins current –10 10 mA
OUT pin current –50 50 mA
ISC Output short-circuit current(2) Continuous
TA Operating temperature –50 150 °C
TJ Junction temperature 175 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Short-circuit to VS / 2.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
N = 1225 Mean = 3.63 μV Std Dev = 18.0 μV N = 30 Mean = –0.024 μV/ºC Std Dev = 0.177 μV//ºC
Figure 7-1. Typical Distribution of Input Stage Offset Voltage Figure 7-2. Typical Distribution of Input Stage Offset Voltage
Drift
N = 1225 Mean = 48.0 μV Std Dev = 92.4 μV N = 30 Mean = 0.17 μV/ºC Std Dev = 0.795 μV/ºC
Figure 7-3. Typical Distribution of Output Stage Offset Voltage Figure 7-4. Typical Distribution of Output Stage Offset Voltage
Drift
30 30
20 20
Amplifiers (%)
Amplifiers (%)
10 10
0 0
-2 -1 0 1 2 3 4 5 -2 -1 0 1 2 3 4 5
Input Bias Current (nA) Input Bias Current (nA)
N = 1200 Mean = 1.21 nA Std Dev = 0.384 nA N = 1200 Mean = 1.11 nA Std Dev = 0.368 nA
Figure 7-5. Typical Distribution of Inverting Input Bias Current Figure 7-6. Typical Distribution of Noninverting Input Bias
Current
30
20
Amplifiers (%)
10
0
-2 -1 0 1 2
Input Offset Current (nA)
N = 1170 Mean = –0.092 nA Std Dev = 0.35 nA N = 1225 Mean = –0.22 μV/V Std Dev = 6.95 μV/V
Figure 7-7. Typical Distribution of Input Offset Current Figure 7-8. Typical CMRR Distribution
15
10
Amplifiers (%)
0
-0.2 -0.15 -0.1 -0.05 0 0.05 0.1 0.15 0.2
Gain Error (%)
N = 1225 Mean = –0.0599 μV/V Std. Dev = 0.710 μV/V N = 550 Mean = –0.0334 % Std. Dev = 0.0433 %
G = 10 G = 10
Figure 7-9. Typical CMRR Distribution Figure 7-10. Typical Gain Error Distribution
100 1000
80 800
Input-Referred Offset Voltage ( V)
60 600
40 400
20 200
0 0
-20 -200
-40 -400
-60 Mean -600 Mean
-80 +3 -800 +3
-3 -3
-100 -1000
-60 -40 -20 0 20 40 60 80 100 120 140 -50 -25 0 25 50 75 100 125 150
Temperature ( C) Temperature ( C)
Figure 7-11. Input Stage Offset Voltage vs Temperature Figure 7-12. Output Stage Offset Voltage vs Temperature
4.5 2
4
1.5
3.5
1
2.5 0.5
2
1.5 0
1 -0.5
0.5
0 -1
-0.5 -1.5
-1 Mean Mean
+3 -2 +3
-1.5 -3 -3
-2 -2.5
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Temperature ( C) Temperature ( C)
Figure 7-13. Input Bias Current vs Temperature Figure 7-14. Input Offset Current vs Temperature
140 160
Unit 1 Unit 1
Common-Mode Rejection Ratio (dB)
120 140
110 130
100 120
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature ( C) Temperature ( C)
G=1 G = 10
Figure 7-15. CMRR vs Temperature Figure 7-16. CMRR vs Temperature
0.03 0.4
0.02 0.3
Normalized Gain Error (%)
0.01 0.2
0 0.1
-0.01 0
-0.02 -0.1
-0.03 -0.2
Mean Mean
-0.04 +3 -0.3 +3
-3 -3
-0.05 -0.4
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Temperature ( C) Temperature ( C)
G=1 Average of 120 units Normalized at +25°C G = 100 Average of 120 units Normalized at +25°C
Figure 7-17. Gain Error vs Temperature Figure 7-18. Gain Error vs Temperature
240 80
G=1
230 70
G = 10
220 60 G = 100
G = 1000
50
Supply Current (A)
210
40
200
Gain (dB)
30
190
20
180
10
170 0
160 -10
150 VS = 2.7 V -20
VS = 15 V
140 -30
-50 -30 -10 10 30 50 70 90 110 130 150 10 100 1k 10k 100k 1M
Temperature (C) Frequency (Hz)
Figure 7-19. Supply Current vs Temperature Figure 7-20. Closed-Loop Gain vs Frequency
160 160
G=1 G=1
Common-Mode Rejection Ratio (dB)
100 100
80 80
60 60
40 40
20 20
0 0
1 10 100 1k 10k 100k 1 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
Figure 7-21. CMRR vs Frequency (RTI) Figure 7-22. CMRR vs Frequency (RTI, 1-kΩ source imbalance)
160 160
Negative Power Supply Rejection Ratio (dB)
Positive Power Supply Rejection Ratio (dB)
140 140
120 120
100 100
80 80
60 60
40 G=1 40 G=1
G = 10 G = 10
20 G = 100 20 G = 100
G = 1000 G = 1000
0 0
100m 1 10 100 1k 10k 100k 1 10 100 1k 10k 100k
Frequency (Hz) Frequency (Hz)
Figure 7-23. Positive PSRR vs Frequency (RTI) Figure 7-24. Negative PSRR vs Frequency (RTI)
1000 1000
Spectral Density (nV/ Hz)
Current Noise
10
1 G=1
G = 10
G = 100
G = 1000
0.1 100
100m 1 10 100 1k 10k 100k 100m 1 10 100 1k 10k
Frequency (Hz) Frequency (Hz)
Figure 7-25. Voltage Noise Spectral Density vs Frequency (RTI) Figure 7-26. Current Noise Spectral Density vs Frequency (RTI)
Figure 7-27. 0.1-Hz to 10-Hz RTI Voltage Noise Figure 7-28. 0.1-Hz to 10-Hz RTI Voltage Noise
100 100
80 80
60 60
Output Amlitude (mV)
40 40
20 20
0 0
-20 -20
-40 -40
-60 -60
-80 -80
-100 -100
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20
Time ( s) Time ( s)
G=1 RL = 10 kΩ CL = 100 pF G = 10 RL = 10 kΩ CL = 100 pF
Figure 7-29. Small-Signal Response Figure 7-30. Small-Signal Response
100 100
80 80
60 60
Output Amlitude (mV)
-3
-6
-9
-12
0 100 200 300 400 500 600 700 800 900 1000
Time ( s)
Figure 7-33. Overshoot vs Capacitive Loads Figure 7-34. Large-Signal Step Response
39 20
0.01% VS = 15 V
36 0.001% 18 VS = 2.7 V
33 16
Output Amplitude (V)
30 14
Settling Time (µs)
27 12
24 10
21 8
18 6
15 4
12 2
9 0
2 4 6 8 10 12 14 16 18 20 100 1k 10k 100k 1M
Step Size (V) Frequency (Hz)
Figure 7-35. Settling Time vs Step Size Figure 7-36. Large-Signal Frequency Response
1000
100
Output Impedance ( )
10
0.1
1 10 100 1k 10k 100k 1M 10M
Frequency (Hz)
VS = ±15 V
Figure 7-37. Closed-Loop Output Impedance vs Frequency Figure 7-38. Input Current vs Input Overvoltage
1.5
1
Nonlinearity (ppm)
0.5
-0.5
-1
-1.5
G=1
-2
-12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Output Voltage (V)
1 4
2
0 0
-2
-1 -4
-6
-2
-8
-3 -10
G = 100 -12 G = 1000
-4 -14
-12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12
Output Voltage (V) Output Voltage (V)
0 2
Normalized Positive Input Bias Current (nA)
-30
-40 1
-50
Figure 7-43. Positive Input Bias Current vs Common‑Mode Figure 7-44. Positive Input Bias Current vs Common‑Mode
Voltage (VS–) Voltage (VS+)
10 2
Normalized Negative Input Bias Current (nA)
-30
1
-40
-50
IBN Avg 0.5
-60
IBN +3
-70 IBN −3
VCM Range
-80 0
-16 -15 -14 -13 -12 -11 -10 10 11 12 13 14 15
Common-Mode Voltage (V) Common-Mode Voltage (V)
Figure 7-45. Negative Input Bias Current vs Common‑Mode Figure 7-46. Negative Input Bias Current vs Common‑Mode
Voltage (VS–) Voltage (VS+)
50
-45 C
40 -20 C
25 C
Input Offset Voltage ( V)
85 C
30 125 C
VCM Range
20
10
-10
-20
-16 -12 -8 -4 0 4 8 12 16
Common-Mode Voltage (V)
VS = ±15 V VS = ±1.35 V
Figure 7-47. Offset Voltage vs Common-Mode Voltage Figure 7-48. Offset Voltage vs Common-Mode Voltage
15 -14
-40 C
14.9 -14.1 25 C
14.8 -14.2 85 C
125 C
14.7 -14.3
14.6 -14.4
14.5 -14.5
14.4 -14.6
14.3 -14.7
-40 C
14.2 -14.8
25 C
14.1 85 C -14.9
125 C
14 -15
0 0.005 0.01 0.015 0.02 0 0.005 0.01 0.015 0.02
Output Current (A) Output Current (A)
VS = ±15 V VS = ±15 V
Figure 7-49. Positive Output Voltage Swing vs Output Current Figure 7-50. Negative Output Voltage Swing vs Output Current
2.7 -1.7
-40 C
2.6 -1.8 25 C
2.5 -1.9 85 C
125 C
2.4 -2
Output Voltage (V)
2.3 -2.1
2.2 -2.2
2.1 -2.3
2 -2.4
-40 C
1.9 25 C -2.5
1.8 85 C -2.6
125 C
1.7 -2.7
0 0.005 0.01 0.015 0.02 0.025 0 0.005 0.01 0.015 0.02 0.025
Output Current (A) Output Current (A)
VS = ±1.35 V VS = ±1.35 V
Figure 7-51. Positive Output Voltage Swing vs Output Current Figure 7-52. Negative Output Voltage Swing vs Output Current
1.8 2.25
2.1 VREF = 0 V
1.6 1.95 VREF = 1.35 V
1.8
Common-Mode Voltage (V)
Common-Mode Voltage (V)
1.4
1.65
1.2 1.5
1.35
1 1.2
0.8 1.05
0.9
0.6 0.75
0.6
0.4 0.45
0.2 VREF = 0 V 0.3
VREF = 1.35 V 0.15
0 0
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75
Output Voltage (V) Output Voltage (V)
VS = 2.7 V G=1 VS = 2.7 V G = 100
Figure 7-53. Input Common-Mode Voltage vs Output Voltage Figure 7-54. Input Common-Mode Voltage vs Output Voltage
5 5
VREF = 0 V VREF = 0 V
4.5 VREF = 2.5 V 4.5 VREF = 2.5 V
4 4
Common-Mode Voltage (V)
G=1 G > 10
Figure 7-57. Input Common-Mode Voltage vs Output Voltage Figure 7-58. Input Common-Mode Voltage vs Output Voltage
8 Detailed Description
8.1 Overview
The INA823 is a monolithic precision instrumentation amplifier that incorporates a current-feedback input stage
and a four-resistor difference-amplifier output stage. One of the features of an instrumentation amplifier (IA)
is that the gain is set by placing an external resistor across the RG pins, as described in Section 8.3.1. The
three-op-amp IA topology in the INA823 limits the maximum input voltage applied to the input terminal. The
maximum input voltage depends on the common-mode voltage, differential voltage, gain, and the reference
voltage; for more information, see Section 8.3.2. The INA823 also features protection at each input by two
junction field-effect transistors (JFETs) that provide a low series resistance under normal signal conditions,
and preserve excellent noise performance. When excessive voltage is applied, these transistors limit the input
current, as described in Section 8.3.3.
The INA823 is developed for medical-sector applications such as infusion pumps (see Section 9.2.1), and
industrial applications such as programmable logic controllers (see Section 9.2.2)
The schematic in Figure 8-1 shows how the INA823 operates. A differential input voltage is buffered by the input
transistors, Q1 and Q2, and is forced across RG. This causes a signal current through RG, R1, and R2. The output
difference amplifier, A3, removes the common-mode component of the input signal and refers the output signal
to the REF pin. The threshold voltage of Q1 and Q2 (defined as VBE) along with the voltage drop across R1 and
R2 produce output voltages on A1 and A2, respectively, that are approximately 0.8 V less than the input voltages.
V+ V+
Optional RG
(External)
50 k
A1 Out = VCM + VBE + 0.125 V + VD /2 G R1 R2
A2 Out = VCM + VBE + 0.125 V VD /2 G 50 k 50 k V+
V V
50 k
Output Swing Range A1, A2, (V+) 0.1 V to (V ) + 0.1 V
50 k A OUT
VO = G (VIN+ VIN ) + VREF 3
V
50 k
REF
V+ V+
V
+IN
Q1 Q2
VD /2 C1 C2
Overvoltage V A1 A2 V Overvoltage
Protection Protection
IB Cancellation IB Cancellation
RB VB RB
VCM
VD /2
V
IN
VIN / 2
IN +VS
50 k 50 k
Overvoltage
+
+ Protection
–
RG
50 k – OUT
RG
50 k +
+
VCM RL
– RG
VIN / 2 –
50 k 50 k
Overvoltage + REF
+ +IN Protection
VS
VS
Figure 8-2. Simplified Schematic of the INA823 With Gain and Output Equations
G = 1+ 100 kΩ
R (1)
G
The value of the external gain resistor RG is then derived from the gain equation:
RG = 100 kΩ
G − 1 (2)
Table 8-1 lists several commonly used gains and resistor values. The 100-kΩ term in Equation 1 is a result of the
sum of the two internal 50-kΩ feedback resistors. These on-chip resistors are laser-trimmed to accurate absolute
values. The accuracy and temperature coefficients of these resistors are included in the gain accuracy and drift
specifications of the Section 7.5. As shown in Figure 8-2 and explained in more details in Section 11, make sure
to connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground that are placed as
close to the device as possible.
Table 8-1. Commonly Used Gains and Resistor Values
DESIRED GAIN NEAREST 1% RG (Ω) CALCULATED GAIN ERROR (%)
1 Not connected Not connected
2 100 k 0
5 24.9 k 0.321
10 11 k 0.909
20 5.23 k 0.602
33 3.09 k 1.098
50 2.05 k 0.439
65 1.58 k 1.091
100 1.02 k 0.961
200 499 0.700
500 200 0.200
1000 100 0.100
5 5
VREF = 0 V VREF = 0 V
4.5 VREF = 2.5 V 4.5 VREF = 2.5 V
4 4
Common-Mode Voltage (V)
VS = 5 V, G = 1 VS = 5 V, G = 100
Figure 8-3. Input Common-Mode Voltage Figure 8-4. Input Common-Mode Voltage
vs Output Voltage vs Output Voltage
Figure 8-5. Input Common-Mode Voltage Figure 8-6. Input Common-Mode Voltage
vs Output Voltage vs Output Voltage
transistors. The matched PNP transistors, Q1 and Q2, shift the input voltages of both inputs up by a diode drop,
and (through the feedback network) shift the output of A1 and A2 by approximately 0.6 V. The output of A1 and
A2 is well within the linear range when the inputs are within the single-supply ground. When inputs are within the
supply ground, differential measurements can be made at the ground level. As a result of this input level-shifting,
the voltages at pin 1 and pin 8 are not equal to the respective input pin voltages. For most applications, this
inequality is not important because only the gain-setting resistor connects to these pins.
8.3.3 Input Protection
The inputs of the INA823 device are individually protected for voltages up to ±60 V and for short transients up
to ±80 V. For example, a condition of –60 V on one input and +60 V on the other input does not cause damage.
Internal circuitry on each input provides low series impedance under normal signal conditions. If the input is
overloaded, the protection circuitry limits the input current to a value of approximately 4 mA.
+V
ZD1
+VS
IN Overvoltage
Input Voltage +
Protection
Source – Input Transistor
-VS
ZD2
-V
During an input overvoltage condition, current flows through the input protection diodes into the power supplies,
as shown in Figure 8-7. If the power supplies are unable to sink current, then Zener diode clamps (ZD1 and ZD2
in Figure 8-7) must be placed on the power supplies to provide a current pathway to ground. Figure 8-8 shows
the input current for input voltages from –80 V to +80 V when the INA823 is powered by ±15-V supplies.
Microphone,
Hydrophone, TI Device
and So Forth
47 kW 47 kW
Thermocouple TI Device
10 kW
TI Device
VEXT = 2.5 V
1 F 1 F
REF5025
A
R
k
+
99
0.1 F
R
4.
D
Pressure B –
Occlusion
Sensor VOUT
VDIFF RG INA823 ADC µC
C VREF
+
R1
GND
Low-tolerance bridge resistors must be used to minimize the offset and gain errors.
Given that there is only a positive differential voltage applied, this circuit is laid out in single-ended supply
mode. The excitation voltage, VEXT, to the bridge must be precise and stable; otherwise, measurement error is
introduced.
The REF5025 is a low-noise, low-drift (3 ppm/C), and high-precision (0.05%) voltage reference that is an
excellent option to generate the excitation voltage VEXT.
The following subsections give the design requirements and detailed design procedure for an application with a
occlusion pressure sensor.
For more information and design tips to consider when using a resistive-bride pressure sensor, see the Design
tips for a resistive-bridge pressure sensor in industrial process-control systems analog applications journal.
Calculate the new effective excitation voltage VEXT(NOM) associated with a desired VCM(MIN) value by solving the
following:
V
R1 = R V EXT 2.5 V
− 1 = 4.99 kΩ 1.366 V − 1 = 4.144 kΩ (4)
EXT NOM
Use the resulting value to verify that the minimum bridge common-mode voltage, VCM(MIN), is within the limits of
the INA823 by solving the following:
V
VCM MAX = VCM MIN + DIFF
2 = 1.8 V +
34.15 mV
2 = 1.817 V (6)
Next, use Equation 7 to calculate the required gain for the given maximum sensor output voltage span, VDIFF,
with respect to the required VOUT, which is the full-scale range of the ADC.
VOUT
G = V = 4.5 V = 131.77 V/V (7)
DIFF(MAX) 34.15 mV
Equation 8 calculates the gain-setting resistor value using the INA823 gain equation shown in Equation 2:
RG = 100 kΩ
G − 1 =
100 kΩ
= 764.69 Ω (8)
131.77 V V − 1
Use a standard 0.1% resistor value of 768 Ω, so as not to exceed the full-scale range of the ADC.
9.2.1.3 Application Curves
The following typical characteristic curve is for the circuit in Figure 9-2.
0.05 5
VDIFF
0.045 VOUT 4.5
Differential Input Voltage VDIFF (V)
0.04 4
Output Voltage VOUT (V)
0.035 3.5
0.03 3
0.025 2.5
0.02 2
0.015 1.5
0.01 1
0.005 0.5
0 0
4950 5050 5150 5250 5350 5450 5550
Bridge Resistance R+R ()
Figure 9-4. Input Differential Voltage, Output Voltage vs Bridge Resistance
RG VOUT
33.2 k INA823 ADC
+ +
VCM VREF
– –
VDIFF / 2 Rf' Cf'
R i' 249 k 47 nF
750 k
─ 15 V
0.1 μF
For a detailed description of the passive scaling approach and more, see the Supporting High-Voltage Common
Mode Using Instrumentation Amplifier application brief.
9.2.2.1 Design Requirements
The gain of the IA is calculated so that the circuit operates at unity gain, where VOUT = VDIFF.
The single-ended input impedance, Rin(SE), of the circuit is the sum of the scaling resistors (Rf + Ri). To
minimize the error that is caused by the tolerance of the scaling resistors, keep Rin > 1 MΩ.
Ideally, choose the resistors so that Rf / Ri = Rf' / Ri'. In the real world, designers have to trade off between
the mismatch of ratios that degrades the common-mode rejection ratio (CMRR) and the acceptable cost for the
design.
The following text describe how to estimate the CMRR performance of the external resistor scaling approach. In
the calculation of CMRR, the following factors are considered:
• Take into account the number of resistors, which is estimated by √n, where n is the number of resistors
applied. In this case, this estimation results in a factor of 2.
• ΔR / R is the resistor matching ratio. The resistor tolerance for all four resistors is 0.1%.
• Take into account that a normal production distribution of the resistor value with a standard deviation of ±3 σ
(99.7%). In this case, the assumption results in a factor σ = 1/3 = 0.33 into the equation.
CMRRdB = G1
ΔR
+1
(9)
α∙ R ∙ n
0.25 +1
CMRRdB = = 65.5 dB (10)
0.33∙0.1%∙√4
R
G1 = R +f R (11)
f i
where
• Rf is variable
• Ri is fixed at 750 kΩ.
Figure 9-6 shows a comparison between the CMRR performance at worst-case (α neglected) and considering
normal distribution for different gain settings of G1.
For more details about the calculation of CMRR, see the Difference amplifier (subtractor) circuit analog
engineer's circuit.
9.2.2.3 Application Curves
Figure 9-6. Common-mode Rejection Ratio of External Resistor Network for Different Scaling Ratios
CAUTION
Supply voltages higher than 40 V (±20 V) can permanently damage the device.
11 Layout
11.1 Layout Guidelines
Attention to good layout practices is always recommended. For best operational performance of the device, use
the following PCB layout practices:
• Make sure that both input paths are well-matched for source impedance and capacitance to avoid converting
common-mode signals into differential signals.
• Use bypass capacitors to reduce the coupled noise by providing low-impedance power sources local to the
analog circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
• Route the input traces as far away from the supply or output traces as possible to reduce parasitic coupling. If
these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better than crossing
in parallel with the noisy trace.
• Place the external components as close to the device as possible.
• Use short, symmetric, and wide traces to connect the external gain resistor to minimize capacitance
mismatch between the RG pins.
• Keep the traces as short as possible.
C2
R2
+VS
+IN
RG
R3 INA823 OUT
REF
RG
–VS
–IN
R1
C1
Ground plane
–V
removed at gain
resistor to minimize
parasitic capacitance
GND +V
GND
R1 1 RG RG 8 C2
R2 4 –VS REF 5
Low-impedance
connection for
GND
reference pin
C1
Place bypass
capacitors as close to
IC as possible
–V
12.7 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 25-Jun-2022
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
INA823DGKR ACTIVE VSSOP DGK 8 2500 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 2IVJ Samples
INA823DGKT ACTIVE VSSOP DGK 8 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 2IVJ Samples
INA823DR ACTIVE SOIC D 8 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 INA823 Samples
INA823DT ACTIVE SOIC D 8 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 125 INA823 Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jun-2022
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jun-2022
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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