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COMPANY NAME:
LAYER: 01 UNLESS OTHERWISE
SPECIFIED DIMENSIONS
PRIMARY-SIDE ROHM SEMICONDUCTOR USA ARE IN INCHES
8 H3
10 3
R11
R12
R13
R14
R15
R16
R39
R17
R33
R18
R10
R19
R20
R21
R22
R23
R24
R25
R26
R9
R8
U16
7 CORNER ACCEL 7 4
C30
4
C24
C31
C25
10 10
U13
CORNER ACCEL TEMPERATURE PRESSURE
HALL
5 4 9 11 C2 3
R1 C5
8
U4
6
C1
3 C3
4 5
U2 5 3
U11
PN: ROHM_SENSORSHLD1-EVK-101
U8 9 GYRO
C11
C21
R41
8
ACCEL+MAG MEM
6
H1
16
16
R42 C19
R34
5 5
10 C36
C12
C17
C22
C38 C10
U18
5
5 6
R43 C35 C7 C8
R46 U5
4 3 10 U6 U7
U17 6
5 4
3
C34
U19 4 5 4 C9 Pb
2
8 C37 5
R45 9 10 8 8 R37
C32 7 4
C33 UV COLOR R40
C6 ALS/PROX CORNER ACCEL
R44 CORNER ACCEL
A
C D1 7 4 7 4
6 C23
C28
C26
C29
C27
R36
R35
10
3 4 R38 10
U14 U15
R27
R28
R29
R30
R31
U12 4 H2
8 6
COMPANY NAME:
SILKSCREEN UNLESS OTHERWISE
SPECIFIED DIMENSIONS
PRIMARY-SIDE ROHM SEMICONDUCTOR USA ARE IN INCHES
COMPANY NAME:
SOLDERMASK UNLESS OTHERWISE
SPECIFIED DIMENSIONS
PRIMARY-SIDE ROHM SEMICONDUCTOR USA ARE IN INCHES
COMPANY NAME:
PASTEMASK UNLESS OTHERWISE
SPECIFIED DIMENSIONS
PRIMARY-SIDE ROHM SEMICONDUCTOR USA ARE IN INCHES
4 3 2
REVISIONS
D D
H3
R11
R12
R13
R14
R15
R16
R39
R17
R33
R18
R10
R19
R20
R21
R22
R23
R24
R25
R26
R9
R8
C30
C24
U13
C25
C31
U16
C1
C2
C5
R1
U1 U4
U2 C3
C21
R41
U8
C
U11 H1
C11
R42
C19
R34
C10
C12
C36
U18 C38
C17
C22
C35
C
R46 R43 C8
C7
U19
U17 U5 U6 U7 C9
C37
R45 C34 R37
C32 R40
C6
R44 C33
D1
C23
C26
C28
C27
C29
R36
U12 R35
U14 R38 U15
R27
R28
R29
R30
R31
H2
ASSEMBLY
PRIMARY-SIDE
B
B
A A
COMPANY NAME:
UNLESS OTHERWISE
ASSEMBLY TOP SPECIFIED DIMENSIONS
ROHM SEMICONDUCTOR USA ARE IN INCHES
4 3 2
4 3 2
LAYER STACKING DETAIL REVISIONS
Plating
to conduct a thorough review of the artwork and media for
1.35
manufacturability in the supplier's process compliance to all
Total Overal Thickness: 62.00+/-10% Mils
applicable specifications. Customer must be advised in
Material Ordering Info (used in lieu of Fasttrak data)
writing (in advance of manufacturing) of any changes, revisions,or
Panel Size ______
corrections made or recommendations to ensure conformance to
Number Up ______
standards, and of any specifications that cannot be met.
Number of Parts Due ______
Prepregs Construction Added? ______
D. This drawing is to be used in conjunction with the provided
gerber and drill data when applicable.
Material Ply Specified ______
Material Type (ie Nelco-29, 370 HR, ...) E. All notes are "Unless Otherwise Specified."
FR4
2. Material
A. FR4.
B. Color to be opaque.
2.800
3. Soldermask
Solder mask both sides with (green color) liquid
photoimageable soldermask, 003 max. thickness.
Soldermask over bare copper.
Soldermask is allowed in via holes.
4. Drilling
A. All hole diameters are finished sizes.
B. All hole to be +/- .003 from true position unless otherwise specified.
2.200
C. All hole diameters to be +/- .003 unless otherwise specified. C
C D. An NC drill file has been supplied - see drill table.
5. Finish
A. Plate thru with copper .0010 min to .002 max. thickness drill size
dimension apply after plating.
B. Use gold immersion over nickel.
C. Finished boards shall not have nicks,
scratches, voids, exposed copper, poor plating, all misdrilled holes.
6. Silkscreen
FAB NOTE
A. Silkscreen using white non-conductive epoxy or equivalent (both sides).
B. No silkscreen allowed on exposed lands.
C. Silkscreen must be a minimum of 3mm away form fiducial marks.
D. Minimum clearance between silkscreen legend and vias, pads, or holes
to be .005.
E. Silkscreen is allowed in via holes.
DRILL CHART: TOP to BOTTOM 7. Electrical Test
ALL UNITS ARE IN MILS A. All boards shall be 100% electrically tested for opens/short at 10 volts.
FIGURE SIZE TOLERANCE PLATED QTY MIL-SPEC boards to be tested at 40 volts.
B. Apply test stamp in non-legend area on solder side of PCB.
12.0 +3.0/-10.0 PLATED 264 C. Test is required on both sides of the board. B
B 40.0 +3.0/-3.0 PLATED 54
8. Cleanliness
125.0 +3.0/-3.0 PLATED 4 A. Boards shall be free of fiber glass dust or any other foreign material.
B. Finished boards must conform to 0.01 MG/IN max NAcL ionic contamination
as meaxured by the omega meter 600SMD.
9. Packaging
There shall be a max of 25 units per package, individually wrapped,
and shipped in cardboard cratons with sufficient surrounding
material to prevend shipping damage.
11. Inspection
A.Automatic optical inspection of all layers required.
B.The impedance should be controlled by stackup layer.
COMPANY NAME:
UNLESS OTHERWISE
FAB DRAWING SPECIFIED DIMENSIONS
ROHM SEMICONDUCTOR USA ARE IN INCHES
4 3 2
4 3 2
REVISIONS
D D
2.800
2.200
C
C
B
B
A A
COMPANY NAME:
UNLESS OTHERWISE
PANEL DRAWING SPECIFIED DIMENSIONS
ROHM SEMICONDUCTOR USA ARE IN INCHES
4 3 2
5
H6 8 H7 10
3
H8
ART FILM - SILK_BOTTOM