Qdoc - Tips Medison Sa6000ii Service Manual

C ontents
C hapter1. BASIC INFORMATION

1-1. PRE-INST
A LLATION
1-2. INSTRUCTION
1-3. INSTALLATION G UIDE
SA6000II PRELIMINARY INSPEC TON
SA6000II PRELIM INARY INSPECTON LIST
C hapter 2. DESC RIPTION OF SYSTEM

2-1. PSA BO ARD
2-2. BF & RX BO ARD
2-3. DSC BOARD
2-4.KEY INTERFAC E & MATRIX
2-5. REAR BO ARD
2-6. PC BO ARD
2-7. MO THER BO ARD
2-8. SYSTEM SET-UP DIALOG UE
2-9. MAIN BOARD PICTURE
C hapter 3. SUB-APPARATUS
3-1. MAIN POWER SUPPLY
3-2. MONITOR
3-3. MOD
C hapter 4. DIAG RAMS

4-1. ASSEMBLING DIAGRA MS
4-2. C ABLE DIAG RAMS
C hapter 5. SPEC IFIC ATION

5-1. MAIN FEATURES
5-2. TECHNICAL SPECIFICATIONS
Servic e Manual Published by C ustomer Servic e Depa rtment

Section 1-1. Pre- Installation
1. PRE-INSTALLATION
1.1 INSPECTION
Upon arrival, inventory the shipment with the carrier’s driver.
?? Carefully inspect the packing material for obvious si g
punctured, torn, broken,

attling
packages.
wet or
?? If damage evident,
is n ot sign and stamp “condition
a of contents
bill of unknown
lading–
subject to inspection. ”
?? If damage is evident, contact your Purchasing
ave
the carrier ’s driv er
Departmen
indicate the damage on t he damage on t he freight bill, and sign all copies of the bill.
During formal inspection, you should :
?? Open all packages within

eceipt
for
15 a
days
complete
of inspection of the
?? Report concealed damage to the carrier within 15 days
acceptility.
lia
1.2 UNPACKING
Please, unpack the system like following draw.
<Unpacking draw>
Sec tion 1-1. Pre- Installation
1.3 Basic features
?? 12 inch B/W monitor and main unit equipped with keyboar
?? Power cord, connection cable and fuse 2)
?? User ’s Guide (1)
?? Ultrasound gel 0.25 L)
?? Setcov er
Item Description Quantity

Location
226-
P -089A PANEL BASKET SA6000II1 Inside of Box
235-
P -007A BRACKET CLAMP LFT 1 Inside of Box
235-
P -007B BRACKET CLAMP RHT 1 Inside of Box
334
-M-011A CLAMP FILTER LFT 12MTR
1 Inside of Box
334
-M-011B CLAMP F
TER
I RHT 12MTR 1 Inside of Box
311
R-003A RUBBER GUIDE FILTER 12MTR
2 Inside of Box
271
Z-006C ACCESSARY BOX ALL 1 BOX
275
- K-
859A ST ACCESSARY BOX
MEDISON 1 Stacker on Box
CBL-ROUND-NEW GROUND CABLE 1 Inside of Box
CORD-
PWR-3-
250V EUROPE AC CORD
V 25 1 Inside of Box
CORD-316
-
MNT MNT PWR CORD 1.4M KKP1603
1 Inside of Box
GEL-0.25L SONO GEL 0.25L 1 Inside of Box
CNN -BNC-RC AJ BNC/MALE TO RCA/FEMALE

2 Inside of Box
RU-
48P
-BNC CAP CAP BNC 4800HD 4 On System
215
-
Z-715A SET COVER SA6000II 1 Inside Box
of
12.5 MONITOR FILTER SEO IL GLASS)

325-
Z-010A 1 Inside of Box
SA6000II
FUSE
-0T3.15L TRIAD 50T T3.15L250V2 Inside of Box
FUSE
-0T6.3L TRIAD 50T T6.3L250V 2 Inside of Box
MANUAL-000II
E SA6000II MANUAL ENGLISH
1 Inside of Box
Table) Part List
Service Ma nual Published by C ustomer Service Department

Sec tion 1-1. Pre- Installation
1.4 Option features
?? Linear Probe
Model Name Specification Application
HL5-
9ED 7.5 MHz / 40mmSmall Parts
L5-
9EC 7.5 MHz / 40mmSmall Parts
L5-9ER 7.5 MHz / 50mmSmall Parts
?? Convex Probe
Model Name Specification Application
C2-4ES 3.0 MHz/30R/

0 Cariac
EC4
- 9ES 6.5 MHz/10R/1
0D Trans
Vaginal
C3-7ED 4.5 MHz/50R/70DGene ral
?? Software : DICOM
?? External VGA M onitor
?? Echo Printer
ony UP890
: MISTUBISH P91W Video Printer
?? Line Printer : HP DeskJet Series
?? VCR : VHS Type
?? Foot switch
Service Ma nual Published by C ustomer Service Department

SonoAce 6000II Sec tion 1-2. Instruction
2.INSTRUCTION
2.1 NOTES TO USERS
Tha nk yo u for p urc has ing t he SA 6000II Ultra sou nd sy ste m. T o ens ure saf e ope rat ion and l ong
ter m per form ance sta bil ity , it is esse nti al tha t you ful ly und ers tan d the functions, operati on and
maintenance instructions by reading this manual before operating your equipment.
?? Incorrect operation, or failure of the user to main
manufacturer or his agent compliance

of the s yst em
with
s non
specificatio
responsibility for any

ury.
damage or in
?? The following conventions are used throughout the manual
emphasis.
WARNING !
“Warning” is used to indicate the presence of a hazard which can cause
severe personal injury, death, or substantial property damage if the
warning is ignored.
CAUTION !
“Caution” is used to indicate the presence of a hazard which will or can
cause minor personal injury or property damage if the warnings ignored.
NOTE
“Note” is used to notify the user of installation, operation, or maintenance

information which is important but not hazard-related. Hazard warnings
should never be included under the Note signal word.
Service Ma nual Published by C ustomer Servic e Depa rtment

Sec tion 1-2. Instruction
2.2 SAFETY PRECAUTIONS
2.2.1 Biological safety
This s ection contains inform ation about biological saf ety and a discussion of the prudent use of
the system.
A list of precautions related to biological safe ty f ollows; observe these precautions when using
the system.
Do not use t he system i f an error m e ssage appear s on the video di splay indicating
that a hazardous condition exists. Note the error code, turn off power to the system,
and call your customer service representative.
Do not us e a sys tem that exh ibits erratic or inconsistent up dating. Discontin uities in
the scanning sequence are indicative of a hardware failure that must be corrected
before us e.
Perform ultrasound procedures prudently. Use the ALARA (as low as reasonably
achievable) principle.
WARNING
Use only acoustic standoffs that have been approved for use by MEDISON.
Verify the alignment of the biopsy guide before use. See the [Probes] section of this
manual.
Verify the condition of the biopsy needle before use. Do not use a bent biopsy
needle.
Biopsy gui de shea ths co ntain nat ural rubb er lat ex. Th es e sheat hs may ca use al lergic
reactions. Refer to the FDA Medical Alert on Latex Products, dated March 29, 1991,
in the “Sheaths ” section of this manual.
ALARA Ed ucation Pr ogram
The guidance for the use of diagnostic ultrasound is defined by the ¡ °as lo w as reasonabl y
achievable ¡ ±(ALARA) princi ple. The decision as to what is reasonable has been left to the judg ement
and insight of qualified personnel. No set of rules can be formulated that would be sufficiently
complete t o di ctate th e co rrect re sponse t o e very c ircumstances. By ke eping ul trasound e xposure as
low as possible, w hile obtaining diagnostic images, u sers can minimize ultrasonic b ioeffects.
Since the threshold for diagnostic ultrasound bioeffects is undetermined, it is the sonographer ¡¯ s
responsibi lity to control tot al energy transmitted into the patient. The sonographer must reconcile
exposure time with diagnostic image quality. To ensure diagnostic image quality and limit exposure
time, an ultrasound system provides controls that can be manipulate d during the exam to optimize the
results of the exam. The ability of the user to abide by the ALARA principle is important. Advances in
diagnostic ultrasound not only in the technology but in the applications of that technology, have
resulted in the need for more and better inform ation to guide the user. The output indices are
designed to provide that important information
There are a number of variables which affect the way in which the output display indices can be
used to impleme nt the ALARA principl e. These variables include values, body size, location of the
bone relative to the focal point, attenuation in the body, and ultrasound exposure time. Exposure time
is an espe ci ally usef ul va riab le, b ecau se it is co ntro lled by the u se r. Th e a bility to limit t he in de x
values over time supports the ALARA principle.
Service Manual Published by C ustomer Servic e Department


2.2.2 Electronic Safety
This equipment has been verified as a Class I device with Type BF applied part. For maximum
safety observe these warnings
Shock hazards may exi st if thi s s ystem, including all ex ternally mounted
recording and monitoring devices, is not properly grounded. In a hospital, doctors
and patients are subjected to dangerous, uncontrollable compensating currents.
WARNING These currents are due to the potential differences be tween connected equipment
and touchable conducting parts as found in medical rooms. The safe solution to the
problem is accomplished with consistent equipotential bonding. Medical equipment
is connected with connecting leads made up with angled sockets to the equipotential
bonding network in medical rooms.
Connection Lead
(Socket)
M
A
Ground I
Connector N
Earth in Medical Room
B
O
~
~
D
Y
Detail 2. SA 6000II Main Console Safety Ground

Do not remove the protective covers on the system; hazardous voltages are present
inside. Cabinet panels must be in place while the system is in use. All internal
adjustments and replacements must be made by a qualified MEDISON customer
service representative.
Do not operate this system in the presence of flammable gases or anesthetics.
Explosion can result.
To avoid risk of electrical shock hazards, always inspec t all the probes bef ore use;
check the face, housing, and cable before use. Do not use, if the face is cracked,
chipped, or torn, the housing is damaged, or the cable is abraded.
To avoid ri sk of elect rical sho ck haz ards, al ways disconnect the sy stem from the wa ll
outlet prior to cleaning the system.
To avoid risk of electrical shock, do not use any probe that has been immersed
beyond the specified cleaning or disinfection level. See [Appendix A.
MAINTENANCE] manual.
WARNING To avoid risks of electrical shock and fire hazards, inspect the system power cord
and plug on a regular basis. Ensure that they are not damaged in any way.
To avoid risk of electrical shock hazards, accessory equipment connected to the
along the dig ital i nterfaces must be certified according to the representative IEC
standards ( I.e. I EC609 50/ EN609 50 fo r dat a pro ces sing eq uipmen t and IE C60601 -
1/EN60601 - 1 for medical equipment). Furthermore all configurations shall comply
wit h the syst em st anda rd IE C606 01 - 1- 1/EN60601 - 1- 1. Ev ery body who conn ect s
additional equipment to the signal input part or signal output part configurations a
medical system, and is therefore responsible that the system complies with the
requirement of IEC6 060 1 - 1- 1/EN60601 - 1- 1. If in do ubt, consult the t echnical
services dep artment or you r local representative.
Do not touch the SIP/SOP and patient simultaneously. It may cause a leakage current
exceeding the m aximum allowable valu es.
Althou gh your sys tem has been manufa ctured in com plianc e with existing EMI/ EMC
requirements, use of this system in the presence of an electromagnetic field can
cause momentary degradation of the ultrasound image. If this occurs often, MEDISON
sugg ests a rev iew o f the envi ronm ent i n whi ch th e sys tem i s be ing used, to identify
possible so ur ce s of radiated emissions . These emissions cou ld be from other
electrical devices used within the same room or an adjacent room. Communication
devices such as cellular phones a n d pagers can cause these emissi ons. The
exis tence of radio, TV, or microwave transmission equipment locat ed nearby can
cause emissions. In cases where EMI is causing disturbances, it may be necessary to
relocate your system.
Electrostatic discharge ( ESD), commonly referred to as a static shock, is a

CAUTION naturally occurring phenomenon. ESD is most prevalent during condi tions of low
humidity, which can be caused by heating or air conditioning. During low humidity
conditions, electrical charges naturally build up on individual s and can create static
shocks. An ESD condition occurs when an individual with an electrical energy build -
up comes in contact with objects such as metal doorknobs, file cabinets, computer
equipment, and even other individuals. The static shock or ESD is a discharge of the
electrical en ergy build - up from a ch arged individual to a le sser or non - charged
individual or object. The level of electrical energy discharged from a system user or
patient to the ultrasound system can be significant enough to cause damage to the
system or probes. The following precautions can help to reduce ESD: anti - static spray
on carpets; anti - static spray on linoleum; anti - static mats; or a ground wire
connection between the system and the patient table or b ed.

2.2.3 Mechanical Safety
Be aware of the casters, esp ecially wh en moving the system . The system can weig h
approximately 70kg, depending upon configuration, and it could cause inj ury to you
or others if it rolls over feet or into shins. MEDISON recommends that you exercise
WARNING
caution when going up a nd do wn ra mps.
The monitor has been designed so that it can be easily removed from the system if
needed.
?? System breake
The system has a brake for the front wheels.

o lock
Press
anddown
lift
on
release. Release the g

brake
the system.
when movi
However, if you apply
certain
limit to the system, the break may not work properly.
?? Moving the system
Only the front wheels are steerable on the system. Theref
spaces, use repeated

and
-forth
back
movements to position the system into
If the system behaves abnormally af ter moving the system,
department or your local representative. On rare occasio
dis co
nected inside the system and may cause a problem. The
and can withstand considerable shock, but excessive shock m
2.2.4 SYMBOLS
The inter national Electrotechnical Commission (IEC) has establis hed a set of symbols for medical
electroni c equipment, which class ify a connection or warn of pot ential hazards. The
classifications and symbols are shown below.
Isolated patient connection (Type BF applied part ).
I and O on power switch represent ON and OFF , respectively.
This symbol identifies a safety note. Be sure you understand the function of this
control before using it. The control function is described in the appropriate
operation manual.
Identifies equipotential ground.
Indicates dangerous voltage over 1000 VAC or over 1500 VDC.

Identifies the point where the system safety ground is fastenedto the
chassis. Protective earth connected to conductive parts of Class I
equipment for safety purposes.
Output port fo r VGA or Parallel port
Input/Output(I/O) port used for modem or RS232C port.
Left and right audio input.

Video input
Left and right audio input

Video output
Print remote output
Connection for foot switch
Protection against t he effects of immersion.
Protection against dripping water.
Connection for probes

2.3 MAINTENANCE
2.3.1 PROBE
Always use protec tiv e e yew ear and glo ves whe n c lea nin g a nd dis inf ecting p robes
WARNING
and b iopsy gu ide ada pters.
Probes must be cleaned after each use. Cleaning the probe is an essential step prior
to effective disinfection or sterilization. Be sure to follow the manufacturer ’s
instructions when using disinfectants.
CAUTION
Do not allow sharp objects, such as scalpels or cau terizing knives, to touch probes
or cables.
When handling a probe, do not bump the probe on hard surfaces.
The probe that you select is the most important factor in image quality. Optimal imaging cannot
be atta ined with out the co rr ect pr ob e. Th e syst em i s op ti mize d fo r us e ba se d on yo ur pr ob e
selection.
?? CLEANING
Do not use a ’ssurgeon

brush when cleaning probes. The use of even soft brushes
can damage the probe.
CAUTION During cleaning, disinfection, and strilization, orient the parts of the probe that must
remain dry higher than the wetted parts until all parts are dry. This will help keep liquid
from entering non - liquid - tight areas of the probe.
¨ç Disconnect the probe from the system.

¨è Re mo ve any sh ea th s, bi op sy gu ide ad ap te rs, or bi op sy ne ed le gu id es (b iopsy guide
adapters are r e - usable portion of the b iopsy guide and can be st erilized.)
¨é Discard sheaths(sheaths are single - use item)
¨ê Use a soft clot h lightly dampened in a mild soap or compatible cleaning so lution to
remove any particulate matter or body fluids that remain on the probe or cable.
¨ë To remove remaining particulates, rinse with water up to the immersion point.
¨ì Wipe with a dry cloth; or wipe with a water - dampened cloth to remove soap residue, and
then wipe with a dry cloth.

?? DISINFECTION OR
RILIZATION
ST
-
Only the9ES
EC4 probe can be sterilized.
reduction A in
10pathogens should
following the sterilization procedures in this manual and using
solutions. The following disinfectants

causeare
of recommended
both its biological
b
(as qualified through the FDA 510(k) process) and its chemic
product materials.
Solutions Country Type Active ingredient

FDA 510(k)
Cidex USA Liquid GluteraldehydeK 93434
Cidex Plus USA Liquid GluteraldehydeK9 23744
If a mixed
pre solution is used, be sure to observe the so
The level of disinfection required for a device is
contact during re
use.
that
Ensthe solution strength and dur
WARNING appropriate for disinfecti on or sterili zation. ’s Be su
instructions.
In neurosurgical application, sterilized probes should be used with a pyrogen - free
sheath.
Using a n o n - recom mended disinfection solution, incorrect solution strength, or

immersing a probe deeper or for a period longer than recommended can damage or
discolor the probe and will void the probe warranty.
CAUT ION Do not immerse probes longer than one ho u r, unless they are sterilizable. Probes
may be damaged by longer immersion times.
Sterilize probes using only liquid solutions. Using autoclave, gas(EtO), or other non -
MEDISON- approved methods will damage your probe and void your warranty.
¨í Mix the disin fecti on solutio n (or sterili zation soluti on, for steril izable probe) compat ible
with your probe according to label instructions for solution strength. A disinfectant
qualified by the FDA 510(k) process is recommended.
¨î Immerse the probe into the disinfectio n solution (or sterilization solution, for sterilizable
probe) as shown in the figure below for your probe.
¨ï Follow the instructions on the disinfection (or sterilization, for sterilizable probe) label for
the duration of probe immersion. Do not immerse pro bes longer than one hour, unless
they are sterilizable.
¨ð 10. Using the instruct ions on t he disinfect ant or st erilization label, rinse the probe up to
the point of immersion, and then air dry or towel dry with a clean cloth (or a sterile cloth,
for steriliza ble probe).
¨ñ 11. Examine the probe for damage such as crack s, splitti ng, fluid leaks, or sharp edges
or projections. If damage is evident, discontinue use of the probe and contact your
customer service representative.


2.3.2 BIOPSY GUIDE ADAPTOR AND NEEDLE GUIDE
The external surfaces of reusable biopsy guide adapters can be sterilized using one of the
-6
following procedures. A 10 red uction in pathogens shoul d be reached by following the sterilization
procedures in this manual.
Always use protec tiv e e yew ear and glo ves whe n c lea nin g a nd dis inf ecting p robes
WARNING
and b iopsy gu ide ada pters.
Biopsy guide must be cleaned after each use. Cleaning the biopsy guide adapter is
essenti al steps prior to effective disinfection or steriliza tion. Be sure to follow the
CAUTION manufacturer ’s instructions when using disinfectants.
Do not use bleach to clean or sterilize the biopsy guide adapter. Using bleach on the
adapter may cause damage and will v oid your warranty.
To clean and sterilize stainless steel biopsy guide
?? CLEANING
¨ç After use, remove the biopsy guide assembly from the p
¨è Disassembl e the biopsy guide into its component parts, i
use parts. These

not parts
be resterilized.
ca
¨é Usi ng a s mall brus h and wat er, s crub each part to re
reusable components.
¨ê Rinse with water to remove remaining particulates.
?? STERILIZITION
¨ç Sterilize the biopsy guide adapter by

gas
autoclaving
(Ethylene Oxi
(Ste
¨èAfter sterili zation, follow

terilization
the proper
procedure
po st for th
method used.
¨é Inspect the b iops y gui de ad apt er fo r dam age s uch a
damage is evident, discontinueadapter

us e of and
thecontact
biops yo
MEDISON representative.
To clean and sterilize stainless plastic biopsy guide
?? CLEANING
¨ç After use, remove the biopsy guide assembly from the p
¨è Disassemble the biopsy guide into its component

ard the
parts,
single
if
use parts. These parts cannot be resterilized.
¨é Usi ng a s mall brus h and wat er, s crub each part to re
reusable components.
¨ê Rinse with water to remove remaining particulates.

?? STERILIZATION
Reusable plasti
biopsy guide adapters can be sterilized o
CAUTION compatibleterilization
cold solution. Sterilization by auto
radiation will permanently damage these parts.
¨çSterili ze the components by using

atible
a terilization
chemically
cold com
solutio
sterilant qualified by the FDA 510(k) process is reco
time (usually 10 hours) and solution temperature used.
The following disinfectants are recommended because

ectiveness
of bo
(as
qualified through the FDA 510(k) process) and its chem
ultrasound product materials.
Solutions Country Type Active ingredient

FDA 510(k)
Cidex USA Liquid GluteraldehydeK934434
Cidex Plus USA Liquid Gluter

ldehyde K923744
¨ è After sterilizatio n, follo w the proper -post

sterilization procedure for the steri lizat ion
method used.
¨ é Inspect the comp onents fo r damage such as cracks, rust or breakage. If damag e is
evident, discontinue use of the biopsy adapter and
ntact
co your local MEDISON
representative.
??
2.3.3 SYSTEM SURFACES
The exterior sur fac es of most MEDISON ultrasound systems can be disinfected using a
recommended disinfectant with a wipe method.
You can use the following procedure to disinfect system sur faces on these systems.
Always use protective eyewear an d gl ov es wh en cl ea ni ng an d di si nf ec ti ng an y

WARNING
equipment.
CAUTION Use only recommended disinfectants on system surfaces.
?? CLEANING
¨ç Turn off the system and disconnect the

the system
wall outlet.
power cord
¨èUse a sof t cloth lightly dampened in a mild soap or d
surfaces on the system.
?? DISINFECTION
¨çMix the disinfection solution compatible with your syste
for solution
h.streng
A disinfectant qualified by the FDA 510(

¨è Wipe the system surfaces with the disinfection solution, follow ing disinfec tion label
instructions for wipe durations, solution strengths, and disinfectant contact duration.
Ensure that the solution strength and duration of contact are appropriate for the intended
clinical appl ication .
¨é Air dry or towel dry with a sterile cloth according t o the instructions on the disinfectant
label.
2.3.4 Protect Circuit
?? Fuse Replacement
¨ê Open the fus e drawer on the upper side of the appliance inlet, there will be the two small
fuse holder.
¨ë Push the fuse holder toward the arrow direction, and Pull the fuse holder toward the
upper side of the appliance inlet.
¨ì Remove the old fuse by pulling up.
¨í Install the new fuse by pushing to the fuse holder.
¨î Insert the fuse holder to the appliance inlet. At this time, the arrow direction on the upper
sid e of the fus e ho lde r shoul d be in a cco rda nce wit h that on t he f use dra w. Also, the
same method is used to e xchange t he ot her f use h older.
¨ï Close the fuse drawer
?? Regular Fuse Electricity
Input Electricity Fuse Electricity
100- 120VAC 50T6.3L / 250V
200- 240VAC 50T3.15L/250V

Kauttu. Box Fuse

Drawer
Nur Sicherung 250V
Use Only With A 250V Fuse
Employer Uniquement Avec
FusibleDe 250V
AC
INLET
Figure-A. Appliance INLET
Close
x 2EA
Open
Fuse Holder Fuse
Figure-B. Side view of Figure-C. Inserting Fus e and

Appliance INLET Fuse Holder @ s.h.kim 1996 Feb

SonoAce 6000II Section 1-3. Installation Guide
System location and check-out
Avoid the following environments for operation or storage
            
             
          
            
          
             
             
          
                                  
 
      
 
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                                   
                                      
                     
                                     
  
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           
            
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           
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 
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         
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            
                     
           
               
Service Manual Published by Customer Service Department

SonoAce 6000II Section 1-3. Installation Guide.
3) PROBE Installation
           
           
  
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       

              
                   
             
                                
                          

SonoAce 6000II Section 1-3. Installation Guide.
3.3.1. Rear Panel
ou can connect the system with peripherals, such as monitor, pr

Y inter, or VCR through the Rear
Panel at the rear part of the system.
This sends video signal to Main Monitor
This sends video signal to B/W Echo Printer
This sends video signal to VCR
This is port for foot switch
This can control VCR by the Serial port
This is port for Line Printer
This is USB port.
This is the access to the Intern et Line (Ethernet), and can be

applied to the option, DICOM
This sends VGA signal to the monitor.
This is B/W printer remote cable port.

SonoAce 6000II MEDISON Co.Ltd.,
3.3.2 Echo Printer
                       
                          

                          

                                        
                         
                            
                               

3.3.3 VCR (Video Cassette Recorder)
                                               
                             

  

                             
          
      
                
                                   
                            
                                        

           ‘PLAY’, press X]on

[ the alphanumeric ke yboard or [EXIT]button on the
control panel.
Service Manual Published by SERTECH

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3.3.4 Line Printer
                                         
                                     
   
                                  

                                      
           
                 
                             ’t b

e
confusedw
henyouuseL
ineprinte.
3.3.5 External Monitor
Plain Monitor
                                          
                                

           
3.3.6 Foot Switch
                 
 
                    

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Preventive Maintenance Procedure for SA6000II
This procedure should be completed using the same environment that is used when the customer is
performing daily exams, for example: Use the same examination room, the same wall outlet, and
especially during image quality evaluation, the same room background lighting conditions.
1. Press the Power On switch on the main side panel and confirm the following :
ç̈ Keyboard lights up.
è̈ LED on monitor lights up green color.
é̈ At first the MEDISON logo will appear and then the System execut es up in the standard
B-mode format.
2. On the Display Monitor, confirm the following :
ç̈ Adjustment of the monitor brightness and contrast controls fro m the minimum to
maximum results in no distorti on(blooming) on the display.
è̈ Display is centered on the sc reen, with good vertical and hori zontal resolution (linearity).
é̈ There is no tearing or bedding at the corners.
1. For each Probe attached to the system, perform the following tests, and confirm proper operation :
ç̈ Visually Inspect the head of th e probe to insure that there ar e no cracks, separation, or
peeling of the insulating material on the face of the probe.
è̈ Knife test : With a light coatin g of Echo Gel on the face of t he probe, slowly scan across
the elements with a thin flat blade, while observing the display for the resulting bright
columns of echoes, with no blank lines that would indicate missi ng or faulty channels in
the probe.

Screen image

- 14 -
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- 15 -

- 16 -
SA6000II Preventive Maintenance Check List
Date : Name of Distributor :

Name of Hospital System Serial #
Name of User Version #
Address Warranty
Expiration
Phone #
Instructions :
All of this information is necessary for the warranty.

Check appropriate box below upon the completion of each section of the procedure.
Items Good Bad Remarks

Ι. Check the packing items (compare with packing list)  
ΙΙ. System exterior cleaning procedure  
ΙΙΙ. Probe appearance  
A. Functional operation & test (system initialization state)

1. Power on Sequence and system diagnostics  
2. Monitor display  
3. Key Board Test  
B. Probe test (with each probe)

1. Appearance Condition  
2. Knife test  
C. Operational Mode Tests

1. 2D Mode  
2. M Mode  
3. Measurement Test  
4. Zooming & Cine memory Function Test  
5. Image Filing Function Test  
D . Electrical Test & Calibration

1. Power Supply  
2. System Calibration  
3. Power Cord/Plug and 110/220 switch  
E. Mechanical operation
1. Circuit boards, plugs, jacks, and connectors seated  
2. Handles & probe holders, monitor, metal panels and wheels  

- 17 -
3. Seating & connection of cables & cords to peripherals  
F. Echo printer, External monitor, Multi-form camera, VCR  
Please send this form to MEDISON by FAX or Air Mail after Fill out the above boxes completely,
Confirmation Signature
Name of Distributor
Service Representative Customer

- 18 -
Section 2-1. PSA Board
1. PSABOARD
PSA (Probe Select Array) has the function which interface System and Probe. Probe Select Board
has two 156 - pin cannon connectors , and eac h pin is defined t o divide Probe ID and Port A/B, and it
is made by Relay circuit to select either of th e two probes.
1.1 Generic Pin outs
1.1.1 Slot connector
It can define various kinds Probe ID and Slot Connector Pin outs accor ding to Port Select like
belo w ta ble.
Pin Signa l Function

J1 (1 82 ) /R_ A P ort A S el ec t
J1(181) /R_B Po rt B Se le ct
J1 (176) /P INSA Port A Insert
J1(17 5) /PINSB Port B Insert

J2 ( 1 7 5 ) P IDA 0 P o rt A I D
J2 ( 1 7 6 ) P IDA 1 P o rt A I D
J2 (1 81 ) P I DB0 P or t B I D
J2 (1 82 ) P IDB1 Por t B ID
J1,J2 ECHO 1 ~ 12 8 Echo

1.1.2 Cannon Connector
Connector use 156 - pin connector of ITT cannon
Linear/Curved Array
1 2 3 4 5 6
EL97 EL105 GND GND EL2 EL10 A
EL65 EL73 EL33 EL34 EL42 EL66 B
GND EL41 EL1 EL74 EL98 GND C
EL9 EL99 EL107 EL10 6 EL4 EL12 D

EL35 EL75 G ND GND EL36 EL44 E
EL3 EL43 EL67 EL68 EL76 EL100 F
GND EL11 EL101 EL108 EL6 GND G
EL109 EL69 EL77 EL14 EL38 EL46 H
EL37 EL45 G ND GND EL70 EL78 J
EL5 EL13 EL103 EL102 EL110 EL8 K

GND EL111 EL71 EL16 EL40 GND L
EL47 EL39 EL79 EL48 EL72 EL80 M
EL7 EL15 PIDA0 PIDA1 EL104 EL112 N
EL113 EL121 /PINSA GND EL18 EL26 P

EL49 EL89 EL81 EL50 EL58 EL82 R
GND EL57 EL17 EL90 EL114 GND S
EL25 EL115 EL123 EL122 EL 20 EL2 8 T
EL83 EL91 GN D GND EL52 EL6 0 U

EL51 EL59 EL19 EL84 EL92 EL116 V
GND EL27 EL117 EL124 EL22 GND W
EL125 EL85 EL93 EL30 EL54 EL62 X
EL53 EL61 GND GND EL86 EL94 Y

EL21 EL29 EL23 EL118 EL126 EL24 Z
GND EL31 EL55 EL32 EL56 GN D a
EL63 EL87 EL95 EL64 EL88 EL98 b
EL119 EL127 GND GND EL120 EL128 c

1.2 Probe Switching
1.2.1 Probe Switching
It uses Relay A GN21012 to do switching either of the two Probes. Relay A GN21012 have two 1-
pole/2 - thow switch in o ne chip, and it i s La tched type. These R el ays make /R_A_1 , /R_A_2, /R_A_3,
/R_ A_4 sig nal aft er r ece ivi ng t wo / R_A , /R_B sign al fr om B F boa rd. A nd it make s Gr oupi ng ea ch
Relay, and switching . /R_A_A and /R_A_B, /R_ AB_A and /R_AB _B are same signal . These switching
table is same as below table.
/R_A /R_B Probe Port
0 1 A
1 0 B
Switching of Table Relay
1.2.2 Probe ID and Port recognition
The resistance value of Probe ID is connected from PSA to RX B/D.
BF reads the value of /PINSA,/PINSB, to recognize Port, and Port Main S/W output Prot Out.
/PINSA /PINSB Probe Port

0 0 A,B
0 1 A
1 0 B
1 1 No Probe
Probe Port recognition
1.2.3 Relay Switching Diagram
System Probe
Element Switching
Port A
ECHO
+ - Port B
/R_A +
Relay switching diagram

1.3 PSA B/D Configuration Diagram
SA6000II PSA
J3 J4
J2 J1

Sec tion 2-2. BF & RX Board
2.BFandRXBoard
2.1 BF and RX in the whole system
SA6000- II is developed only B/W mode ultrasound diagnosis system.

Ultrasound syste m has standa rd flow as Tx - > Beamformation - > Mid - proce ssing - > Digita l Scan
Conversion - > Video Manager - > Monitor.
Tx Pulse
TARGET
delay line
Transducer
Tx
Focus
RF -> MONITER
Baseband
Time Gain
Compensation Rx Focus MID Proc DSC VM
Focused
signal
target
Transducer
delay line FM FM
StandardstructureofUltrasoundsystem

SA6000- II is very sim ple com par ed wit h SA9 900 , bec aus e it is only B/ W mode ultrasound
diagnosis system . And it is possible that integra te Mid - proces sing, Digita l Scan Conv ersi on, and
Video Manager in one board .
So, the main boar d of SA6000 - II is three boar ds (DSC, BF, RX), and the other boards a re Power , PC,
Key, Mother Board (Back Plane), PSA (Probe Select Assembly, Front Plane)
SA6000-II
Structure
MONITER
M RX
o
th
e BF P
S
r
B A
o
a D SC (
F
r r
d o
Rear Board (B PC n
t
a P
c l
a
k n
P
la POWER e
)
n
e
)
NETWORK
Standard st ructure of SA6000 - II
This chapter explains about BF and RX.
2.2 Feature of BF and RX in SA6000 - II
SA6000- II is only B/W mode popular ultrasound diagnosis system. It is not necessary Steering,
becaus e this syste m is not suppor t Color /Dopp ler Mode and Phased Array Probe. Also, this system
has Folding structure. Then it c an make 64 - channel resolut ion im age, althoug h internal struc ture is
32- channel. Moreover this system makes 128 - channel effect, because it supports Syntheth ic. Also, it
is possible to su pport Ap odization, maximum 64 - step Recei ving Dy nami c Apert ure, ma ximu m 16 Tx
Focal Point. Now, the Sampling frequency of RF signal is 30.8 MHz, but it is possible to be upgrade to
61.6MHz without changing circuit.
The B F and R X of SA 600 0 - II has very simila r function to B F of S A9900. Bu t that o f SA 6000 - II used
Foldin g St ruct ure t o re duce price and n umber of b oard. If R x is 64 - chan nel, it is nece ssa ry tha t

MCB014 is 16e a, ADC is 64ea , TGC is 64ea . But SA 6000 - II use d just 8 ea MCB 014, 3 2EA ADC , 32ea
TGC by usin g Analog Switch of 16ea MT8816.
M/ B
DS C
M ID
PROCESSING
MODULE
RF_DATA
[0..15]
B/ F
RO_OUT AD [0 .. 31 ] TX_PN ECHO

A/ D C BFICs Tx Pulser ASICs
[0..31] _D [0 .. 7] [0..127] [0..127]
PS A
RX
TGC_OUT TGC_IN
RO_OUT TGC REORDERING Rx
S/W ECHO
[0..63] [0..63] [0..63] [0..127]
Data Flow of BF an d RX
Abo ve picture is the data flow of BF and RX. Tx trigger signal to be made at BFIC of BF shoots
pulse through Tx pulser ASIC. Also, Echo signal to c ome from probe is p a ssed Pr e - amp step, an d in
this step it performs Reordering(or Folding) to rein force weak sign al. Signa l to be perfo rmed
Reo rde rin g is tra nsm itt ed TGC - M/B( Moth er Board ) - BF, perform ADC at BF, and is became
summing at BFIC.

2.3 B F Boar d
BF of S A6000- II c an d ivide f our part fu nction ally, T x Pa rt, BF IC, AD C Gr oup, an d BF - RX Bo ard
Controller . Tx part is part to shoot High Volt age( +/ - 80V) i n suit able c onditi on. BF IC is part that it
sends Trigger signal to Tx Pulsing according some Focal point, and performs summing AD input
signal to come from each Channel by Dynamic Focusing method according to Geometry of each
probe, and transmits the result to Mid - process ing Modu le of DSC . ADC Group is A nalog cir cuit par t to
be inc luded LC filter to have AD Conver ter (AD9283 - 50). BF - RX contro ller is part that contr ols each
Digital device by using XC95144 - TQ144 CPLD to be possible Hardware programming.
Block[7]
BF-CTRL
/METRG /M_ETRG
M_MCLK BUF's M_CLK Block[1]
p_mdata[15..0] p_data[15..0]
h_maddr[2..0] h_addr[2..0]
h_mdata[15..0] h_data[15..0] Block[0]
M_CL K /ETRG
Block[0]
p_data[15..0]
h_addr[2..0]p_data[15..0]M_CLK /ETRG LVC08's+HV TX
h_addr[2..0]
h_data[15..0]h_data[15..0] Pulser
MCB014(BFIC) -HV TX ec o n ,n
tgc_out[n+3]An ti -a li asi ng Pulser
Filter AD C ad(n+3)_data[7..0]
tx_out_p[7..0] +HV TX
tgc_out[n+2]An ti -a li asi ng ad(n+2)_data[7..0] Pulser
Filter AD C
tx_out_n[7..0] -HV TX echo[n+7..n]
tgc_out[n+1]An ti -a li asi ng Pulser
AD C ad(n+1)_data[7..0]
Filter elem_sel[7..0] MFC019's
tgc_out[n] An ti -a li asi ng
Filter AD C ad(n)_data[7..0] LV04's
BF Bloc k Diag ram
Ab ove pictur e is Block Diagram of BF . Ex citing signal from MCB0 14 (BFIC) is transmitted to
LV04(TTL, NOT gate) and LVC08(TTL, AND gate), and to probe element after conversion to High
voltage at High Voltage Pulser ASIC(MFC019). Also, 32ea ADC to be below part of picture is became
Path that Analog signa l to come from Rx b oard goes t o input of MCB014. Buffers a re became Gate at
Host, DSC, and Interfacing. XC is CPLD to be composed XC95144 - TQ144, and it is Controlle r. There
are more detail explanation at next section.

2.3.1 Controller
Becaus e BF and R X wor k as if on e boar d, it uses just one XL951 44 TQ - 144 in Controller . This
Controller control Digital Device as decodi ng of PC command when PC performs setting MCB014 inter
register of BF or downloading data at memory of RX board. Also, it contains version information of BF .
BF Controller works with two part Host Model(it is said to be CPU model, or Halt model) and Real
Mode. Timing Spec of input signal to be matched Host Model is same bel ow picture.
/CPU_CS
/CPU_WR
CPU_ADDR ADDR
CPU_DATA DATA
Ts TH Ts TH
When it is Host Mode, Time Spec Diagram of input Signa l
Real Mode have two input signal, and it is necessary /ETRG and Time Spec of Master Clock to
make ac cura te bf_d elay sig nal. 8e a BFIC of SA 6000 - II per form s input R F signa l Beamf ormi ng fro m
each channel. Bf_dealy is at a minimum time to necess itate a t BFIC .
/EX_TRG
MM_CLK
When Real Mode, Time Spec Diagram of Input Signal
As below picture, the signal of data_out_ready is connected to output pin of BFIC. This pin is the
signa l to annou nce, which BFIC performed summing to focu s RF signal came from 4ea channel and
preparation to add with BFIC is finished. Before preparation step, the signal is High Impedance state.
But finished preparation step, the signal become LOW state. But the Driving ability of this output pins
is shor tage , so it makes bf_delay signal at BF_CTRL. So bf_delay has more long time than point in
time which all of data_out_ready become LOW. The last data_en_b signal is delayed as number of
BFIC * 3 M_clk, and it become rf_dvs(RF Data Valid Strobe) to go to Mid.

/ETRG
M_CLK
BF CTRL
BF_DELAY
DATA_READY_OUT
DATA_OUT_READY DATA_OUT_READY DATA_OUT_READY DATA_OUT_READY
Board_DIR Board_DIR Board_DIR Board_DIR
DATA_EN_A DAT_EN_B
DATA_EN_A
DATA_EN_B DATA_EN_A
DATA_EN_B DATA_EN_A
DATA_EN_B DATA_EN_A
DATA_EN_B
(RF_DVS)
BFIC #7 BFIC #6 BFIC #(---) BFIC #0
EXT_B[ ]
EXT_A[ ] EXT_B[ ] EXT_ A[ ] EXT_ B[ ] EXT_ A[ ] EXT_ B[ ] EXT_ A[ ] EXT _B[ ]
Summing Chain and bf_delay of B FIC

2.3.2 BFIC
The B eamformation o f SA6000 - ll is mad e at MC B014 s imila r Cell - base d ASI C. MCB01 4 per form
out put nec ess ary sig nal aft er T x Fo cus ing and Rx F ocu sin g ca lcu lat ion. Eac h 8 - bit of t x _p_out,
tx_n_ou t, and elem _se charge Output about TX. Delay is based on Scan lin e is calc ulated by Micro -
processor of MCB014 with Geometry of probe. Micro code to calculate Tx Delay is a litter complex,
because it ha s diff erent Dela y acco rding t o Scanl ine. But th e value i s just p hysical De lay. M CB014 at
Rx Focusing is not necessary different Dynamic Focusing according to Scan line, because the signal
is finished reordering from Rx board. MCB014 can Programming about various Scan line, Tx focal
point, T x foc using calculation, and Rx Dyna mic focusing calculation. This pr ogram is Microcode. It is
Binary Code. It is necessary time to calculate Tx/Rx Focusing depend on Type. Therefore Scanline
and Line Type information to use at MCB014 come out before one PRF tha n Scanline to use at DSC.
T1 T2 T3 T4
LT[ ]
SC[ ] A A
/ETRG
P_WR
1.0-us 160.8-us
3.0-us
Timing Diagram for Microcode Execution
When T1, As see above picture, P_WR takes Scanline A with Rising. During T2, it calculates Data
to Tx/Rx Focusing of scanline A. And it saves at special regis ter (RX_I NIT_M EM, TX_IN IT_MEM ) of
BFIC. When T3, this saved Data, it is wrote another special Register (RX_WORK_MEM,
TX_WORK_MEM) of BFIC. During T4, it i s used at Tx o r Rx Dy namic focusing.

2.3.3 Tx Part
SA6000- II has 64ea MFC019 Chip same as Full Cus tom ASIC, because it supports maximum 128 -
element Probe. One chip has two independents Pulser, and Triggering Input is 3.3 - V level sig nal. One
MCB014 can suppo rt maximum 12 - channel Tx, but SA6000 - II has just 8ea MCB014. So, it use be low
method t o support 1 28 P uls er. SA60 00 - II can perf orm maxim um 64ea Tx fir ing at once, and Rx
element switching is not performed by 12ea elem_sel Bus of MCB014 like SA9900. Therefore it can
use 128ea Pulser independently after dividing 64ea by 64ea by using elem_sel Bus. Below picture is
diagram.
LVC08
MCB014 +HV TX
Pulser
-HV TX echo[n+64]
Pulser
tx_out_p[n] +HV TX
Pulser
tx_out_n[n] -HV TX echo[n]

Pulser
elem_sel[n]
MFC019
LV04
One channel Tx Part Diagram
2.3.4 AD Co nverter Group
All of the sig nal to c ome from Rx b oard to BF board is Analog signal. Therefore, it is necessary
ADC to A/D Conversion. SA6000 - II needs 32ea ADC, be cause it is 64 - channel Folding structure . And
it needs 8ea MCB014. Bf of SA6000 - II use s AD92 83 - 50 to AD C. The pres ent ti me, Sa mplin g Cloc k is
30.8 - MHz. But if you change L and C of Anti - aliasing Filter and AD9283 - 80, you can use 61.6 - MHz
Sampling Clock. Th is ADC input part has Anti - aliasing F ilt er to be com posed 4 - order L C Lo w - pass
Filter. And the structure and spectrum is same below picture. f 3dB= 10 - MHz.

Anti - aliasing Filter in SA6000 - II BF
Anti - aliasing Filter Fre quency Response for SA6000 - II BF
2.4 RX Board
RX Board compose Analog Device except SRAM Controlling part. Echo Signals from Element of
Probe trans mit to Pre - amp to compose with 2ea NPN - transis tor. And it performs Reor deri ng, and
goes to BF af ter passin g Time - gain Co mpensator. The standard structure is sa me be low p icture.

echo[n+64] Latch
RX-S/W (HC164) MEMORY
(32KB) TGC_D[..]
pre_sel[n+64]
C
A
D.F/F D
AX[..]
(HC175)
TGC-Curve
pre_sel[n]
RE - to BF
echo[n]
RX-S/W p re -Am p ORDERING TG C
AN AL OG
SWITCH
AD60 4AR
MT8816
SA6000- II RX Board Bloc k Diagram
2.4.1 Element Selection and Pre - amp Part
SA6000- II is 64 Channel, but it can support maximum 128 - element Probe. So. I t use s one - after -
the - other me thod to cho ose f or in put s ignal of Pr e - amp. Eff ective Ec ho Sig nal to co me eit her of t he
two (Echo( n) and Echo(n+64) ) become Inact ive, because PRES EL(n+64) becom e to LOW whe n
PRESEL(n) become HIGH ACTIVE. This D evice is p erforme d at Cont roller of B F.
2.4.2 Reorder ing Part
SA6000- II is 64 - channel Syst em, but it can redu ce the number of TG C Device, AD Co nverter , and
Beamforming IC(MCB014) until half by Reordering. The mean of Reordering is to relocate sequence. It
transmits to be changed Echo Signal according to Scanline always at same locate by Analog switch
(MT8816). SA6000 - II doesn¡ t¯use Steering Technique like Trapezoidal Mode or Phased Array. So,
when it per form s Reor derin g at C D2M3 494, It tr ansmit s sum ming d ata t o TGC i nput p art. This is
Folding. And it is possible to reduce TGC Device, AD Converter, and BFIC until half by Fol ding
Technique. And it can use Beamformation. This method is same below picture.

TGC - TGC - TGC -

channel(0) channel(1) channel(2)
An al og Sw it ch (C D2 2M 349 4)
elem(n-2) elem(n-1) el em (n ) ele m(n +1) elem(n+2) elem(n+3)
sc = 4 n
When scanline is 0,4,8 --- , Folding and Reorderin g
TGC - TGC - TGC -

channel(0) channel(1) channel(2)
An al og Sw it ch (C D2 2M 34 94 )
elem(n-2) elem(n-1) el em (n ) el em(n+1 ) elem(n+2)
sc = 4 n + 2
When scanline is 2, 6, 10, --- , Foldi ng and Reordering

At the above pic ture, CD2M3494 Ana log switch which charge Folding/Reordering is composed
with total 16ea. The struc ture and Time Diagr am of C ontro l Signal is same b elow t wo pic tures.
SA[6..0], CS[7..0], AY[2..0], RST, and STRB signals are made at Controller of BF. A X[0..3], DATA
signals come from S RAM(UM61256) in R X Boar d.

2.4.3 Time - gain Compensation Part
The Echo signal to be reflected from far Target is very small size than signal to be reflected from
near Target, because it oc curs Attenuation at medium . Theoretical ly, if it suppose that Dep th is z, it
has relation exp - 2z / z. And according to Depth, it compensates Attenuati on by multiply i t by z exp 2z.
It is Time - gain Com pensation(or TG C ). The ma in compo nent is AD 45003 (it is same AD 604).
2.4.4 Memory Part
Memory is 32 Kbyte SRAM(UM61256), and it has information about Reordering Data and Element
Selection. Below pictur e is signals to control SRAM, and flow of signal to be controlled by SRAM data.
CPU_DATA DIR DATA[8] D S/R pre_sel[0..7]

A B D Q
/ENQ
BUF SR_CLK psel_clk0
/SR_EN LATCH
/MEM_EN /OE DATA[6..4] /OE
DATA[3..0]
DATA AX[0..3]AY[0..2]
D Q ADDR SRAM Y[0..7] X[0..15]
MA_CLK /CS /OE/WE RSTCSSTRB DATA pre_sel[8..15]
D Q
LATCH /MEM_CS
/MEM_OE R/O S/Wpsel_clk1
/OE /MEM_WE LATCH
/OE
SC[8..0] DIR
addr_cnt [6..0] A B
BUF
pre_sel[56..63]
/OE D Q
psel_clk7
/psel_oe LATCH
/OE
Data on the SRAM(UM61256) circums tances
At the above picture, Address and Data of SRAM are information on h_data[15..0](cpu_data and
h_data is same meaning). Control Signal from BF divide two signals.
8- bit Data Bus have like below information according to each Bit.
?? D[7..6]
? There is Element Selection information to be saved
?? D[5..4]
? it has Control Bit information to be called Data of
?? D[3..0]
? There is AX[3..0] information of CD2M3494.

Below part is 15ea Address Bit Map .
?? A14 Synthetic On/Off
?? A[13..6]
? scanline[8..1]
?? A[5..0] – Because AX[3..0] of CD2M3494, D ATA Control and Element Selection inform ation
is sav ed in se ries, it t akes out in t urn b y usin g ext ernal 6 - bit C ounter. Thi s Cou nter exi sts i n
Controller of BF. To take out this Data faster, it reduced time by dividing Shift Register.
?? Data to be going to enter SRAM is saved to Binary Format
ro.dat. And it is wrote at SRAM by Host when it performs m
2.4.5 Probe
ntification
Id Part
When you see in front of the system,

port and
right
left
probe
probe
port.
port
port
It
is A
is
is
necessary to select which port the system

port
hasisto
0 read.
zero) and
At th
B
1 one). The Data to ID

read
Port
with
is Probe
Prob IDbit.
only If
lowthere
rank is
6 prob
port,7 Bit
become Low Active Signal. But
port,
there
Bit
become
is probe
Low state.
on
7 A B
and Bit
Data are signals to come from BF and Back Plane.
probe The
only on
port,
A port,
or B or all port, or nothing any port, and what

Sec tion 2-3. DSC Board
3.DSCBOARD
3.1 Specification
?? 640 * 480 screen ’t support 800*600 mode)

(don
mode
?? Overlay to
(RGB
VGA 16bit Data)
?? PC i nterface with PCI not ISA (Address e xpansion)
?? Support Synthetic M ode (128 Channel M ode)
?? Support left/right format BM top/bottom

mode format i
?? Support 3D Data Acquisition for Volume Rendering (PCI
?? Support VM Data Acquisition for Image Save (PCI Read)
?? Support interlace
Non display with VGA sync signal
?? Support Edge Enhancement Read Zoom
?? Support Dual Cine( Left : 64 Frame

Frame), Right
?? Maximum CINE Frame is 256 ( Density : 128 Frame , Fa
?? Maximum LOOP Line is 4096
?? Gray scale resolution is 256

3.2Featureand Concept of DSC
Scan conversion in Ultrasound scanner means the procedure from mapping echo informa tion to
Frame memory to displaying to monitor. This scan conversion actualizes to high technology then
need conversion from sampling data to pixel data.
Conventional DSC writes to F/M as vertical direction and reading from F/M as Horizontal direction.
But this DSC of SA6000II it writes from F/M and reading from F/M as Horizontal direction.
Why this DSC differe nt conventional DSC writes and reading method
Forthemoment, DSCof SA6000IIusednewtypecomponent.
FFO FM
FM
Convent ionaltype(abasisWrite)
SSRA FM
FM
SSRAM
S A 6 0 0 0I It y p e( ab a s i sW r i t e )
SSRAM FM

3.3 DSC description & Block Diagram
3.3.1 Overall Block Diagram
DSP DSC VM
(Synthetic)
SRAM SRAM CINE SSRAM 3D FIFO VCR

IN Scan Image
SDRAM Converter Grabber
(Even) (Odd) (128K) (PCI)
(128M x 2) (I-->NI) (SDRAM)
Image
Image Filing
Acq (PCI)
FIFO
NI Video
INPUT Video Out
DATA(B,M) DAC
MID ASIC InputCTR FM,LOOP CTR POST CTR
(MGA015) (XC2S200) (XC2S200) (XC2S100)
VGA(16bit) Video RGB
R(5bit) DAC Out
G(6bit)
B(5bit)
InputCTR
DSC DSP FM (B) LOOP(M) Mode
FM,LoopCTR (SDRAM) (SDRAM) Converter
PostCTR
Scanline
RTC CTR Linetype ,

DSC DSP
(XC2S30) RLinetype
/OF , /RP , XSYNC
SA6000 II DSC Overall Block Diagram
Above pictureof one DSC of the SA6000II showing be made with MGA 015 of MID processor,
SRRAM part for Synthetic of DSC and Video manager board.
This DSC of SA6000II is make B/W part of SA9900 (DSP, DSC and V /M board)

3.3.2 Block Diagram & Signal Flow of each part
1) DSP PART (MGA0 15 : MID Proces sor)

MGA015A makes I and Q data to process B/W image, spectral doppler and color doppler with RF
data to be transmitted from Beamformer.
But this DSC of SA6000II handled B/W data.
(1) BLOCK DIAGRAM
Synthetic To
Aperture ATGC
Memory BF
BF Decimation DC Cancel
Synthtic 1/N Quadrature
DTGC FIR Decimation FIR Mixer
Data Aperture Filter Filter
M/N Pixel Log Dynamic

Zone Envelop
Blend Decimation Decimation Compressi FIR
on Detection Filter
BHF BW To
NSF Post DSC
Mid- Processor(MGA015A) Block Diagram of BW Part
(2 )MGA 015A Function
¨ ç Synthetic Aperture Control
Fi rs t TX /R X CY CL E Se co nd TX /R X CY CL E
ΡΑΜ SUM
RXB/F RXB/F
TX
? ΟΥΤΠ ΥΤ ?

The signal to execute first TX/RX is stored in RAM like above diagram. After it sums
second TX/RX data with first data to be stored in RAM, transmit it to Output.
¨ è DTGC(DIGITAL TIME GAIN COMPENSAION)

Response of Ultrasound becomes attenuation as deeper more and more. Using TGC to
compensation this state.
MGA01 5A execu tes DTGC (Digi tal Time Gain Comp ensati on), but Front - end executes
ATGC(Analog Time Gain Compensation).
DTGC execut es ou tput by multip lica tion RF(Radio Freque ncy) from Beamfor mer and
DTGC gain.
Β/Φ ΡΦ ουτ πυτ
DTGC
?? Feature of DT GC
? ΤΓΧ γαιν χοντρολ ρανγε : −ινφ δΒ ∼ 30δΒ

? σταρτ (ορ Ινιτιαλ) γαιν ϖαλυε
: −ιρανγε
νφ δΒ ∼ +30δΒ
? Γαιν υπδατε ρατε : 62ΜΗζ
? ΤΓ Χ χυρ ϖε τψ πε : πιεχεωισε λινεαρ
? Μινιµυµ γαιν ινχρεµεντ/σ τεπ : <0.1δΒ/στεπ ωηεν στεπ= δατα ρατε, ατ 0δΒ
? ινιτιαλ ϖαλυε ρεσολυτιον : Σαµε ασ Μινιµυµ Γαιν ινχρεµεντ/στεπ
? Μαξ ποσσιβλε γαιν χηανγε : 10δΒ/χµ ≅λεσσ τηαν 0.1δΒ/στεπ,ατ 0δΒ
? ΣΓΧ(σχανλινε −γαιν χοµπενσατιον) :τωο 128 ωορδ λοοκ −υπ ταβλε, ϖαλυεσ,
βετωεεν 0∼4095.0δΒ=128 ινδεξεδ βψ
♦ ∆ΕΧΙΜΑΤΙΟΝ ΦΙΡ ΦΙΛΤΕΡ

ΜΓΑ015Α εξεχυτεσ το 61.6Μηζ χλοχκ.
Ιφ νοισε χοµπονεν τ το χονταιν ιν ΡΦ σιγν αλ βεχ οµεσ δ εχιµατιον , ιτ ισ τ ρανσµι ττεδ αφτερ
χηανγινγ λοω φρεθυενχψ ρατε.
Ιν τηισ χασε, ΣΝΡ ισ δροππεδ, σο υσε ΛΠΦ(Λοω −Πασσ Φιλτερ) το ρεδυχε τηε νοισε.

¨ ê 1/N DECIMATION
Noise
f
30.8Mhz 30.8Mhz
The clock of MGA015A uses 61.6Mhz.

It is diff icult ne xt calculat ion because the tim e to can next calculati on is 61.6Mhz. So it
uses 1/N.
Decimation executes 1/N Decimation.
When N is 2, for example, it indicates following diagram. It is meaning to select either of
two data. The t ime t o be t ransm itte d dat a is 61.6 Mhz. The t ime t o be t ransm itted id
divided by this method ; 61.6Mhz/2=30.8Mhz.
: Output Data
: Input D ATA
DATA
t
61.6Mhz

¨ ë DC CANCEL FIR FILTER

There ar e DC co mponent around fr e quency z ero. To reject t his DC component , it us es
HPF(high - Pass filer). And it executes maximum cut - off.
High High
pass pass
filter filter
Nosie
f
30.8Mhz 30.8Mhz
0
¨ì QUADRATURE MIXER
The operation to change RF data to componen t of base band is ¡ °quadrature
demodulator ¡ .±Mixer in quadratur e mixer is dem odulator in other wo rd. Main si gnal has to
be loaded at center of frequency. If main signal is not located at center of frequency, you
have to transfer that center of frequency. This is demodulator. It is method like following
diagram.
¿øÇÏ ´Â ½ÅÈ£
Demodulator
Nosie
30.8Mhz f
30.8Mhz
The s igna l to ex ecute qu adrature de modulat or ha s to us e Low - Pass Filt er lik e fol lowing
diagram. Because of it needs to reject Noise component and unnecessary signal. After
pas sed this Dy nam ic f ilt er, it i s se par ate d in to r oute to m ak e BW image data and I, Q
data.
LOW
Pass
Filter
30.8Mhz
30.8Mhz

¨í DYNAMIC FIR FILTER
It is called Dynamic filter, because it is changed cut - off according to the depth.
3.5MHz f
¨î ENVELOPE DETECTION
When the wave is transmitted li ke followi ng le ft dia gram, make it posit ive dir ectio n wave
to reject negative direction wave like following right diagram.
0 t 0 t
0
t
¨ï LOG COMPRESSION
OUTPUT
INPUT
0

Dynamic range of BW data to become Envelope detection is very large. It is impossible to
display image directly. So it compresses the data. This course is compression. In this
time, it executes log compression. If the value is small, raises the Dynamic range, and
valu e is lar ge, m akes s aturation. A s image dept h is deeper, the noise beco mes heavy
and the contrast small. Raising the contrast of deep depth and shallow depth makes
changeless. So it makes the whole contrast similarly.
¨ ð PIXEL DECIMATION
Real pixel number to execute out from M/N decimation to nearest is transmitted over
minimum 2000. But pixel numbe r to receive at DSC is 1000~2000 degree. Befor e
transmit to DSC, calculate real entered number as number of the pixel to need at DSC.
And transmit it to DSC.
¨ ñ Zone Blending
ZONE ±¸°£ È¥ÇÕ
When there are several TX focusing, it has to focus several times. In this time, curve
occurs like above left diagram. The sectio n between curve them is called Zone secti on. It
mixes overlap section of Zone naturally. This is Zone blending. Foll owing diagr am shows
gain to be g iven in each zone during mixing.

a 0(n )
1
0 n
a 1(n ) (depth)
1
0 n
a 2(n ) (depth)
1
0 n
a 3(n ) (depth)
1
0 n
n n n (depth)
1 2 3
¨ò BHF(BLOCK - HOLD - FILLTERING), NSF(NOISE - SPILCE FILLTERING)
Above diagram is BHF method. BHF(Block - hold - filtering) can take off the hole to be any
pl ac e in im ag e. It us es th e me th od th at co mp en sa te si mi la rl y wi th ar ou nd ga in af te r
ave rage ar oun d dat a. NS F(No ise - Sp lic e Fi lt er ing ) is op po sit e me th od with BH F. If the
gain in any place is very larger than around, w e can th in k it is n oise. In this case, it
rejects pixel.
¤¡ ¤¡ ¤¡
¡¤ ¡¤
¡¤ ¡¤ ¡¤

¨ ó BW POST FILLTER
BW da ta to b e fin ishe d all pr oce ssin g pas s LPF ( Low - pass filt er) t o rej ect n ois e or
unnecessary signal before transmitting to DSC.
2) DSC PART
Each FPGA block diagram of DSC as following;
(1) Input Controller
Input Controller FPGA

SSRAM_Addr
Data SSRAM
Generator (256M Word)
BW_D[0..10]
AZM_D0..7]
(from MID Asic) B (to MEMCTR)
Bit&Shift Even Frame Input
FIFO Azimuth
FIFO Averaging Intp
Saturation (1k)
(1k)
B 3D Acq
Odd FIFO
FIFO (MGA 015
(1k) x 2)
CINE
SDRAM
(128M x 2)
Loop_D0..7]
(to MEMCTR)
First, Input controller is Input data process Bit shift and saturation from MID processor. Bit shift
fe at ur e u se fo r s ma ll b it m or e t h an av ail ab le b it o f MI D pr oc es so r of the DSC . In ca se C ha nn el o r
G a i n i s sm a l l , ef f ect iv e b i t of D a t a t o b e ex ecu t ed b y M i d P r ocesso r com es ou t sm a l l .
The number of Mid Processor Data to come over for DSC is 11bit. If DSC uses just 8bit, it takes
8 b i t of M i d P r oc ess or D a t a .

B Even FIFO and B Odd FIFO is write one side by PRF and read other side by Hsync, likes ping
pong method, to perform the Data by PRF module. At this time, writing data to FIFO is write
1024EA by sampling CLK. (SA9900 write 2048 EA) Next step of Frame Averaging perform reading
the Previous frame ¡s¯1024 row data from Sampling Data 1024EA and CINE Memory.
As you see above Block Diagram, Cine Memory is not the same location with Frame Memory. It
is same location with SSRAM, Row Data (Samplin g Data) is saved on Cine memory.
Therefore Frame Averaging use Row Data, Finally Frame Averagi ng data is saved to SSRAM and
Cine memory. But Address of SSRAM is 18bit(256Kword Memory), so there are some problem
appear to OF and Vs ync is d ifferent when SSR A M Read/Write.
To solve it, like old 9900 DSC, write with Ping - Pong method and read with each Vsync with for
OF. This memory structure control WEB to manage Even frame and Odd frame data, because
SRAM¡s¯Data is 18bit. (Ping - Pong m ethod) SSR AM Add ress i s co me from Data Generation part of
Input Controller. This Data Generation part write value, which concerned with Data generation to
FPGA every times when image format is change when DSP initial time or mode change. Then
SSRAMM address is m ade pe r each Hsync.
6000 II DSC is made from BW Part of 9900 Revision DSC, but it has two different parts. One is
Frame Averaging, and the other is 3D Read Pass.
As you see above Block Diagram, FA circuit of 6000 II DSC is composed of Interpolator in FPGA.
But SA9900 is comp osed of SRAM. If it uses SRAM, it is not match Margin of Data on Timing.
And 9900 Revision DSC is able to support Real Time 3D, and it is not use 3D Pass of old method.
So 6000 II DSC uses different Pass to 3D Acquisition.
At the above Block Diagram, it d oe sn ¡t¯have Pass to go from 3D Acquisition FIFO to CINE Memory
directly. Also, it is necessary Scan Conversion because it has saved Row Data.
To make this, it makes Pass to write from CINE Memory to SSRAM directly. When it uses 3D, it
uses this Pass. But this Pass is able to use at Freeze mode. When it performs 3D Acquisition, first
set Freeze, and move CINE Bank to S SRAM, and read Data at SSRAM like Real Mode, and perform
Azimuth Interpolator, save Data to 3D Acq FIFO. And next step is to move Data to PC by PCI CLK
Cycle like 9900 old Version. It is possible to carry Data by setting ROI box during 3D Data
Acquisition. This method reduces 3D Acquisition time.
1024ea Sampling Data to get every PRF is saved at SSRAM in serial order by /OF. Namely, it is
necessary capacity of ma ximum 256 Scanline x 1024 Sampling = 25 6 Kbytes. To get Frame
Memory Data(A , B , C , D , E) equivalent Pixel of Monitor, it is necessary SSRAM Address like a1
and a2 , b1 and b2, and so on.
This Address comes out to Row direction ( Horizon tal direction) every Hsync at Data Generation,
and the difference of Previous Address and Current Address becomes maintenance as sampling

point (SA6000 II is 1024 Sampling).
It use s 61.6 MHz C LK to Azi mut h, but th e Outp ut is 61. 6MH z/2 . Nam ely, 1 ea( o ne) Interpolation
Data (Z) comes out per 30.8MHz.
SL0
SL4 SL8
a1
1st H line
b1 A a2
c1 d1 D d2 2nd H line
C
B b2
e1 e2
c2 E
Sampling Point
Monitor Pixel Point
(2) Me mory Cont roller

Memory & Loop controller processing Read / Write of Loop memory, Frame memory, read zoom
and edge enhance.
First, writing to Frame memory for has 4byte data bus and each 1byte saved different data of
Frame. Azimuth data from Input control FPGA write to In FIFO of memory controller
This FIFO is use for don ¡ ¯t lost the data during memory cycle (Refresh, Pre charge and Act, etc.)
Because of, this FIFO Length is shorter than the other FIFO. Next, Demux is demuxing 1Byte Data
bus to 4Byte Data bus in order to Frame interpolation by Frame memory.

FM & LOOP Controller FPGA
AZM_D0..7] BW_SD0..7]
(from MemCtr) 16
B (to PostCtr)
DEMUX 32 Frame DT FIFO Read Edge Out
IN FIFO FI MUX
(1 : 4) Interpolator (512) Zoom Ehnance FIFO
(63 x 8) (4:2)
(512)
FM
(SDRAM
64Mbit)
Loop_D0..7]
(fM
roem
mCtr) M LoopM M
Input (SDRAM Out
FIFO 16Mbit) FIFO
(512 ) (512 )
Loop
CTR
TMP_ABWSD
(D0-D7)
FABW_D
(D0-D7)
Frame 1* 4 Demux (Wr) TMP_BBWSD Frame
Average 4 * 2 Mux (Rd) (D0-D7) Intp
Fm
_W
r
FMB_D
(D0-D7,
d
D8-D15, R
_
M
D16-D23, F
D24-D32)
FM
FI _ M U X B l oc k D i a gr am
Ab ov e p i c tu r e ar e B l o c k D i a g r a m o f FI _ M u x an d FI _ D e m .
The role of FI_MUX is to switch required Frame during Frame Interpolation. Because the data of
Frame memory used now is 32 Bit and 8 bit us used for one Frame, 4 Frame could be stored at
Frame memory. The 1 x 4 DEMUX of FI_MUX operates this function (WR). The 4 x 2 MUX (RD) has

the role of sending only two Frames of four Frames. The 4 x 2 Mux(RD) is controlled by FI_sel.
The Frame Interpolation is to interpolation one Frame with the other Frame. The reason to execute
frame interpolate is that the gap between present Frame and next Frame is so large t hat the image
is not good.
Read FM we can know which Frame is interpolatio n. FI_Sel determines the selection of this Frame .
The picture below is regarding Frame Interpolation.

F .M
F.M0
( A )
A
F.M1 A
(B )
Z
F.I MUX (interpol
(4*2) F.I ation)
F.M2 B
( C )
F.M3 FI_SE L 0,1À Ì

( D ) " 00 "À Ï ¶§
FI Bloc k Diagr am
Because Vsync is 60Hz, DSC DSP gives FI vector for one Frame Interpolation. Then the
FI_Sel(0,1) is ¡ 0° 0¡ ±and give Frame A and Frame B to Frame Interpola tion input in the Frame
Interpola tion MUX. The next Frame Interpolat ion makes Frame Z by interpolatin g Frame A and
Frame B. Output one Frame for each Vsync like A - >Z - >B.
This DT FIFO using when data erase of B Image like B - M mode .

Read Zoom Block Diagram
s_rz_hintp_cur0
s_RZ_InputB Read H
Zoom
s_rz_hintp_prv0 Interpolator
FIFO 0 0
Latch
PXL_CLK s_H_OutputB0 OutputB
V
Interpolator
s_H_OutputB1
s_rz_hintp_cur1
Read H
Zoom
s_rz_hintp_prv1 Interpolator
FIFO 1 1
Latch
PXL_CLK
Read zoo m send data wit h signal of Sdo ut_En whe n active HS.
First, edge Enhan cement wai t for active of Sdout_En , when active HS. (Maxim um 1us)
Edge Enhance Block Diagram
s_rz_data_out_b
s_ee_fifo_wen0 EE FF 0 s_serial_data0
Serial Adder
0
s_serial_center0
s_serial_data1
s_ee_fifo_wen1 EE FF 1 Serial Adder Mean
1
s_serial_center1
EE
EE
s_serial_data2 Parallel Filter
EE_Data_Out
s_ee_fifo_wen2 EE FF 2 Serial Adder Adder
2
s_serial_center2
Center
s_serial_data3
s_ee_fifo_wen3 EE FF 3 Serial Adder
3
s_serial_center3
s_serial_data4
s_ee_fifo_wen4 EE FF 4 Serial Adder
4
s_serial_center4
EEfifo_REN
s_serial_center0
s_serial_center1
s_serial_center2 MUX
s_serial_center3
s_serial_center4
EECenter_Sel

Serial Adde r Bloc k Diag ram
s_ee_fifo_data0 s_Data_A
Latch
s_Adder_out1
Adder
Latch s_Data_B
s_Adder_out3
Adder
s_Data_C
Latch
Adder
s_Adder_out2
s_Serial_data0
s_Data_D Adder
Latch
Latch s_Data_E Latchs_Data_E_1d Latch

s_Data_E_2d
s_Serial_center0
s_Data_C s_Data_C_1d s_Data_C_1d
Latch Latch Latch
Above Block diagram show serial adder part of Edge enhance. For serial adding, delay 2 add ing
Input signal by latch. And make output sustenance of latency serial center of Serial Adder.

Parallel Adder
s_Serial_data0
s_Adder_out1
Adder
s_Serial_data1
Adder s_Adder_out3
s_Serial_data2
Adder
s_Adder_out2
s_Parallel_mean_data
s_Serial_data3 Adder
s_Serial_data4 s_Serial_data4_1d
Latch Latch
s_Serial_data4_2d
th
For parallel adder, delay 2 adding each Input signal by latch. And last adding 5 sustenance of
latency.
EE Filter
InputOrg
s_Sub_out s_mult_out s_add_out s_sat_out

Sub Adder Saturation
InputMean
D_Alpha
Latch_6d
s_mean_6d
EE filter process using final output of parallel and final output of Center data
Last, B out FIFO and M Out FIFO uses for reading Data as signal of FM_se and Loop_se from
VM part. Video Manager will be process data from signal of FM_se and Loop_se .

3) V/M PART
(1) Concept of VM.
?? VGA clock : Using 25Mhz and stand ard 640 x 480
?? Image clock : Using 25Mhz and standard 640 x 480
?? Image Grabber Memory : Using 256K x 32bit x 2bank(KM41
?? VCR In : Receiving input video

nd signal
using after
by KM0127
transformat
8bit format by AL422 field memory.
?? VCR out : Using VGA to NTSC / PAL converter chip(AL4 22)
?? VGA and VCR expression type : VGA expression is Non inter
monitor type. But VCR input/output

laced type. is Inte
(2)
VM Function
?? Executing Keying image to receive from DSC and VGA d
after making Interlace / Non Interlace si gnal. It ha
receiving VCR input data, and display it after Decoding
?? Also it has the function to save DSC input data in Imag
8bit by Post control FPGA and Post Map.
?? It has the function that does DT saved DATA in image
Memory, display to monitor data.

after (It
MUX with
displays
VG to monito
VGA 640 x 480 signal and Image grabber signal)
(3) Block Diagram
Video Manager
Scan
Video Image Filing
VCR IN Converter Image Image
Input
(I-->NI) Grabber Acq
Decoder
Field (SDRAM) FIFO
(KS0127)
Memory
640*480(1HS:37us) -->640*480(1HS
BW_SD[0..7]
Mode
(from MemCtr)
Post Image Converter
Map Grabber Ctr (Field
Memory)
VGA[0..7]
R:5
NI Video Out
G:6
B:5 Video Video (VGA Monitor)
DAC
Key
(BT121)
Post Control FPGA

Scan
ConverterVideo
(NI->I) DAC
Field (BT121)
Memory

(4) Function o f each part
¨ç VIDEO & IMAGE PART
SA9900 can display 800 x 600 full si ze at monitor. But ultrasound imag e expression zone
is just 640 x 480 size. Also this part can display external input such as VCR input.
SA6000II can display 640 x 480 size with ultrasound image, VCR input and VGA data
640
64 512
32
480
Below picture is real image format of SA6 000II

¨ è VCR INPUT
An al og ue vi de o si gn al (V HS , S - VHS) to be tran smit ted fr om VCR is TV si gn al an d

Interlace type signal. And TV image signal is divided NTSC, PAL and SECAM type by
character of each r egion. So, it uses e xclusive usin g chip like One chip fr o nt
end(KS0127) to process each different input data, and executes A/D conversion in the
inside. And it makes UV/Y format from input analogue video signal by internal
Chrominance circuit and Luminance circuit. And it transmits to be changed data.
¨ é B,M I NPUT (DSC INPUT)
In imag e part, B - mode image and M - mod e dat a to b e tra nsm itt ed fr om D SC bo ard
transmit to Post control. In this part, it transmits input signal according mode(B, M) to
Post map after separating signal.
( V/M part ou tput /IMGH S, /IM GVS, IM GdotClk, /FM_se, FM_sc , /Loop_s e, Loop_s c to
DSC part)
Post control use P ost FPGA (SC2S100 - FG256)
¨ ê IMAGE GRABBER
Real image signal and VCR signal is saved in Image grabber and image grabber data
works to make Vide o signal a fter transmitting to Output FIFO . Also, it works to
transmitting image of image grabber to main PC or receiving that.
SDRAM clock using 50Mhz. Reason is save and output at /HS 1 circle at same time.
Image Grabber memory using KM4132G512(256K x 32bit x 2bank) and clock is 50Mhz.
It store d 512 COLUMN to under ROW and stored 128 CO LUMN to upper A bank. This is
storage B - mode. Gray bar area is 0~39 and Image size is 512 so, Start 1 is 40 end 1 =
512 and Start 2 is 0 end 39. But real input end2 is 128.
left area : start 1=40 end 1=295 start 2= 0 end 2=0
right area : start 1=296 end 1=511 start 2=0 end 2=40

512
256
A bank B bank
512
1024
¨ ë FIELD MEMORY
It has to transform the signal after matching synchronism with Sync to display at VGA
monitor. Field memory works this function. And Field memory uses AL 422 and supports
suitabl e resolution to use VGA and TV signal. It is set for s ynchronize signal.
AL422 is 3M - bits FIFO field memory and it is possible to operate each read/write.
¨ì VIDEO KEY
Image/VCR signal of 640 x 480 size to be transmitted from field memory is displayed at
monitor in 640 x 480 si ze with overlay or other Menu signal. In this time, it is the part to
do MUX with VGA signal.
¨í NON- INTERLACE DAC
Digital BW signal to be exe cuted Keying is transmitted to VGA monitor after changin g into
Analogue BW through Video DAC(BT 121).
¨î INTERLACE Output
It is necessary output signal to display at Echo printer or Interlace monitor separately VGA
signal, and it uses chip AL442. Also it is necessary field memory to display 640 x 480
size of Interlace sync.

3.4 DSP d escription
3.4.1 DSC DSP

1) DSC DSP
?? DSC DSP controls memory controller and in/out SSRAM co
and various kinds of frame memory, line memory and c
?? It also controls the signal path of DSC board by stan
interr
pt before sending data from input SSRAM to vide
interpolation.
3.4.2 RTC DSP

1) Functions of RTC DSP
?? HOST Interface
- Receiving the cycle of PRF, EADC, XSYNC, EDFDLY sync from host.
- Sends the condition of RTC FPGA and sequence to ho st
- Receive the sequence of operation of each mode.
- Receiving operation sequence of each mode from host.
?? Sequence Change
- Carries out sequence table and specific mode transmission.
- Reads send data and register data is controlled by RTC FPGA
?? RTC FPGA Contro
- Post out to RTC FPGA various data.
- Sets register of RTC FPGA by determined value.
RTC makes standard signal for whole system operation in real time and controls system
operation.
BF, DSP, P RF, O F, RP, Line t ype, scan line and M id_PRF, ATGC_PRF for MGA01 5 of D SP a re
made and controlled.
In addition, it has the role of making signal to control data stream in the DSC board internally.
RTC(Real time controller) makes standard signal for whole system operation in real time and
controls system operation.

It makes the various standard signals essential to system operation because PC is the main
HOST and controls FPGA by DSP. Because these standard signal are used for whole system
operation, it should be easy to control and op erated accor di ng to basic frequency. RT C is
composed of DSP and RTC FPGA DSP part is commanded by HOST(PC) and carried out. Or

receives Sequence(operation order for each mode) at the form of table and makes progress. And
controls cycle of each signal by register setting of FPGA. FPGA is comm anded by DSP and ma kes
a real signal.
Below block diagram is RTC part.
RTC-DSP
Host Interface (ADSP2183)
LNTYP
RLNTYP
Scanline
/OF
61.6Mhz /RP
HSYNC /prf
RTC-FPGA
VSYNC (XC2S30-TQ144) /ETRG
/BW_RDY SWEEPRATE
xsync
/MID_TRP
/ATGC_PRF
ATGC_INFO
Fig1. Overall Structure of RTC

2) Structure of RTC - DSP

Below flow chart is RTC - DSP.
Variable
Init.
Host
command
process
No
PRF Interrupt ?
Ye s
Prf Process
Set Port Value
Port out to PLD
Set Next Sequence
Change Sequence Table
Flow chart of RTC-DSP

This shows processing of f low receiving data and command from Host.
?? Command Proc ess
It re
eives Command and Data from HOST and the definition
will be described
DSP
in command
the RTC list of Appendix A. There
the command list.
1st part is RTC control signal generation part
2nd part is receiving

r port data
out to
f RTC FPGA
3rd part is command for DSP debugging purpose.
?? PRF Process
If interrupt occurred by /PRF signal from RTC FPGA, t
part, it controls overall data flow to be processed

rred. whe
IF the PRF interrupt occurred, it assigns scan line and
the frequency of PRF, /EADC and /RP. And prepare to
?? Set Port Value
It assigns proper value per each Mode among

from Host
the and
tra
preparing value transfer to RTC FPGA. It should assign
that is presented by port map list per each PRF.
?? Port Out to FPGA
It is the part to transmit the assigned value

FPGA.
from the
?? Change Sequ ence Table
After checking the simulation of each PRF, changing
state change form.

g Followin g diagram sh ow ea ch tra n
a 1
process.
l
f
_
c
n
sy i
seq_Utable
x
e
l t
b t
st a st i i
i n i
x x x
e e e
e m e
_ d
m _
_
seq_Mtable seq_ table
State iagram of Sequence Tabl

3.4.3 RTC FPGA
1) RTC
All commands are sent fro m RTC- DSP and are written at internal register. The function of each
command is defined in port map table. First, TPRT and XPRT must make reference signal. It is
made by co unter MCLK(61.6Mhz). And all signals are made synchronous to MCLK.
2) Structure of RTC FPGA

?? DSP interface
Data to receive from DSP write data that it will send t
or Host.
?? PRF
Xprt_n makes system clock, PRT period is made from DSP
Xprt_n makes Tprf_n, PRF blank period is made from DS
?? sweep_rate
ync
x
Makde sweep rate signal and xsync signal
It is made with input clock and delay value from Hsync
?? MID_PRF , ATGC_PRF , ATGC_INFO
It is made signal needs MID processor(MGA015)
It is exist MID part in DSC board and make by RTC FPGA.
3) DSP Interface
Belw picture is st ructure of part to recei ve data from DS
they store data to be transmitted from D SP. And when PRF c
register. Therefore all internal registers

th every
are changed
PRF. The
s
movement is stabilized to match PRF, because we selected th
DSP_D[15:0]
TPRF
/PRF_WIDTH_CS GENERATION /TPRF
16BIT CNT
MCLK
/PR F_ BL ANK_ CS XPRF /XPRF_N

GENERATION
/TPRF 16BIT CNT
RPEN
DSP_D[15:0]
LATCH LATCH FIREEN
/PRTCTRCS0 LSTPRF
FSTPRF
/TPRF
DSP Inteface of RTC-FPGA

4) PRF
61.6MHz
20.53MHz
=MCLK
prf period
/tprf
prf prf
blank blank
/xprf
Firing Start
eof_n
etrg_delay
/etrg_dy
focusing start
/prf
eadc enable
/eadc eadc
delay
Timing Diagram of Main Signal

Picture 20
Above picture show timing relation of PRF and EADC to be main signal. First, receiving sy stem
clock of 61.6Mhz and making MCLK(master clock) of 20.53Mhz to divide it by 3. It determines
reference clock of RTC FPGA. It makes reference /tprf and /xprf according to PRF period value to
be transmitted from MCLK and DSP. And it makes /etrg_dy to be delayed as setting value in
ETRG- delay register to /prf of system. So, make /eadc signal.
3.5 Checking issue of each function
(1) Check mode image : B mode , Dual B , B - M left/right , B - M top/down , Depth Change,
128ch mode
(2) Cine , Loop operation : cine fast 256frams, density 128frams, Loop 4096 lines
(3) Check save of cine memor y : Using debug menu
(4) Check save of VM Image : Using debug menu
(5) Check of External VGA Monitor, check Echo Printer, VCR recording / Playing, PAL/NTSC
(6) Check Probes : convex and Linear

Sec tion 2-4. Key Interface & Matrix
4. Key Interface & Matrix
4.1 Key Interface & Matrix const ructi on and function

SA6000II KI/M is consists of two parts with one board.
One part is Key Interface that supports UI and the other part is Alpha Numeric Key.
The Key Interface Part that 89C51 t ake the lead in the work and Alpha Num eric Key Part that
HT82K28A take the lead in the work . The Key Int erface Part that 89C51 take the lead in the wor k
through MAX239 The Key Interface Part that 89C51 take the lead in the work through MAX239 /
through Ser ial Port of 89C 51 MAX 239(RS - 232C Inte rface)/ to the side of PC B/D and
COM2( T/B ),COM3( System Key )/ as Serial / Data exchange.
Alpha Numeric Key Part that HT82K28A take the lead in the work HT82K28A have itself Serial Port
and by it through MAX239(RS- 232C Interface) Alpha Numeric Key Part pass the key value to PC.
HT82K28A have itself Serial Port and by it. And, SA6000II Key Interface & Matrix / is consists of
each ke ys to appl y Multi - langua ge/e ach keys/ as Ma cro Key (one Key has va lue of many keys
and key S/Ws are consists of pushing key pad and attach a point of contact to key pad / send
electric curre nt into part again /form to work/ not push - button .
Diagram1. SA6000I I KIM

4.2 Block Diagram & Description
+3.3V
TTXA,B
Track TTYA,B
Ball SR[8..15]
Key Matrix
Key
TBR,TBL contol
CPLD
SC[0..7] XC9572X
L-TQ100
Power Control Signal
]
] 7
..
]
7
.. .7
. 0
[
TGC 0
[ A
0
[
D T
Volume A
S A
S D
Track Ball & Key

ADC SD[0..7]
0808 Power Control
uP Foot s/w
89c51 Alpha Nemuric
Key
+5VA Connector
DATA[0..7] TXD,RXD
UART RS-232C
8250 MAX239
MSOUT
POWER
+5V , +12V
KEY INTERFACE PART
Diag ram 2. S A600 0II KEY INT ERFA CE P ART Bloc k Diagr am

PC_KEY_CLK PC_KEY_DATA
From:PC To :PC
HT82K28A
Alpha C[0..7]
Numeric
Key Matrix
R[0..17]
Alpha Numeric Key Part
Diagram 3. SA6000II Alpha Numeric PART Block Diagram
Above diagram 1,2 shows Block Diagram about SA6000II Key Interface & Matrix
At first, we will explain about Key Interface Part.
As you see the BD , Ke y In terfac e Pa rt 89 C51 take the le ad in the work an d it co nsis t of Ke y
Interface Controller ( CPLD),ADC0808,82C50,MAX239.
Key Interface discharges as followi ngs.
¨ ç Track Ball Counter
¨ è Key Button( Scan )
¨ é TGC Volume Control
¨ ê Power Control
¨ ë PC to Key Panel Communication
4.2.1 Track Ball Counter
( A phase ) Clock 8 Bit

( B phase ) Up/Down Counter cnt_data[7..0] cpu_data [7..0]
Clear Try State
8Bit
Buffer
/RD
TRACK BALL PART
Diagram 4. Track ball part

A direction in A, B direction to input from X,Y axis of Track Ball.

According to the condition of direction B, fix Up/Down of counter.
At this time, data is converted into a form of 2 ¡complement
¯ and transmit to Main. ( a high positio n
bit is Direction )
A Phase
B Phase
ClockWise
A Phase
B Phase
CounterClockWise
Diagram 5. T/B wave form ( direction relation )
4.2.2 Key Button( Scan )

Key Button is constructed as and (for reference, Map ) send Scan Line (SR8 ~15) that is on ROW
side signal in order and is input Column side decodes D ata (SC0~7) and interpr et to in put
existence and nonexistence of each Button.
At this time if the value of SC is not FF, interpret that Data is input and go on next work.
# Key map
SC6 SC5 SC4 SC3 SC2 SC1 SC0

SR8 ID END PROBE I/F
EXAM
SR9 MENU SETUP APPL. SAVE
SR10 USER1 USER2 BODY INDICATOR BODY CLR
SR11 USER3 USER4 CALIPER CHANGE
SR12 USER5 REPORT MEASURE DOCUMENT MEA.CLR DOC.CLR
SR13 DEPTH+ DEPTH- SPEED HARMONIC FREQ. FOOTSWA
SR14 ZOOM+ ZOOM- DIRECTION B M FOOTSWB
SR15 FOCUS + FOCUS- APEX B/B 3D FREEZE
Table 1. Key Matrix Map

# Between Track Ball& Key Button and PC of transmitting and receiving connect to COM Port of
(MAX239 ) PC through RS - 232 Level.
Port Setting Usage
COM 2 0x2F8 / IRQ 15 Track Ball
COM 3 0x3F8 / IRQ 14 Key Panel
Table 2. COM Port
4.2.3 TGC Volume Control
It is use 50K ? Σλιδε ςΡ, α χχουντσ αν δ σενδ ω ιτη Α/ ∆ Χονϖ ερτερ (Α∆Χ0808) ποτεντι αλ διφφερενχ ε οφ
βοτη ενδσ οφ ςΡ (ΓΝ∆ ∼ +5ςΑ) . ςΡ νυµβερ το υσε ισ 7πχσ.
4.2.4 Power Control

POWER_DOWN PC_DOWN
CPLD
Power PC
XC9572
POWER_ON_OFF PC_ON_OFF
Power Control
Diagram 6. Pow er Control
Key Panel observes POWER_DOWN signal that is input from Power and when Power Switch is off
( Low ? High ) it is
f let
PC know.
PCIO
PCIO that senses it complete to practice all Windows Program
this time) and it is let Key Panel know.
After Key Panel observes PC_ON_OFF signal that receive fr
after 2seconds
let it
Power
i know that it is OFF.
4.2.5 PC to Key Panel Communication
?? - Track Ball : transmit Data by 82C50.
> Serial Mouse Mode
1200 bps , non parity , 1 stop 7bit data length
Bit No 6 5 4 3 2 1 0
st
word
1 1 L R Y7 Y6 X7 X6
nd
word
2 0 X5 X4 X3 X2 X1 X0
rd
word
3 0 Y5 Y4 Y3 Y2 Y1 Y0
Button
status : 1 = pressed, 0 = released
Table 3. Track Ball Serial Data Construction

> Initial Tim ing
Diagram 7. Ser ial Ti ming
?? Transmit Data by Serial

in 89C51.
port with built
Next, we will explain

t Alpha abo
Numeric Key Part.
Alpha Numeric Key discharges General PC Key Board

HT82K28A
functi
is
Standard Win98 Keyboard is the exclusive use of IC.
This IC is consists of Row 18bit, Column 8bit as Matrix

ey Map
form
Key values transmit in PC side. (Serial

ompounding
of
communication)
Row and Column.
by
Key Map is as followings.
C7 C6 C5 C4 C3 C2 C1 C0
R0 F5 L-RL PAUSE
R1 /1 ~/` Z ESC A TAB Q
R2 @/2 F1 X S CAPLOCK M
R3 #/3 F2 C F4 D F3 E
R4 $/4 %/5 B V G F T R
R5 &/7 ^/6 N M H J Y U
R6 */8 +/= </, F6 K }/] I
R7 (/9 F8 APP >/. L F7 O
R8 )/0 _/ ?// ¡°¯ :/; {/[ P
R9 PRINT R-LT L-LT SCRLOCK
R10 F10 F9 F12 ENTER F11 |/ BACKS
R11 DEL D- NUMLOCK SPACE
ARROW
R12 INSERTR-
ARROW
R13 PG-DN P G-UP
R14 END HOME L- U-
ARROW ARROW
R15 R-HT L-HT
Diagram 5. Alpha Numeric Key Map

4.3 Key Main program Description
Following is a description of Main program.
START
initialize 89C51
Main Loop
Start
TrackBall yes
scan_trackball
Event
Key Button yes scan_button_

Event matrix
yes
TGC
Event scan_tgc
Shutdown yes manage_system_

Event power
Command yes process_

Event command
Di a gram 8.Key Main S/W Flowchart
First, main S/W Flowchart show 89C51 doing early time setting and each parameter initializing as
soon as system start.
Second, Main loop run, sensing the event flag and call it.
SA6000II use fo llowing 5 eve nts.

¨ ç Track ball
¨ è Key button
¨é TGC
¨ ê Power (shutdown)
¨ë Command
If this five event flag is sensed, call the subroutine and return to main loop.
4.4 Dat a sheet
The following data sheet is important IC used for SA6000II Key Interface & M atrix.
4.4.1 CPLD XC9572XL-TQ100 Pin Description
75 51
76 50
XILINX R
XC9572XL-
TQ100
10
0 26
1 25

Pin Name Pin NO I/O Description

P2_6 20 I SCAN COLUME DIRECTION
/RD 25 I CPU READ
/WR 23 I CPU WRITE
/RESET 13 I PLD RESET
ALE 12 1 ADDRESS LATCH ENABLE
XCLK 22 I SYSTEM CLOCK(11.0592MHz)
PC_ON_OFF 28 I PC ON/OFF SIGNAL

POWER_DOWN 29 I POWER SWITCH OFF SIGNAL
/EOC0 18 I A/D CONVERTER END FLAG
PADCSTT_1D_I 36 I A/D CONVERTOR START_1D_I
PADCSTT_2D_I 33 I A/D CONVERTOR START_2D_I
TTXA 14 I TRACK BALL X AXIS A PHASE
TTXB 15 I TRACK BALL X AXIS B PHASE
TTYA 16 I TRACK BALL Y AXIS A PHASE
TTYB 17 I TRACK BALL Y AXIS B PHASE
TBL 32 I TRACK BALL LEFT BUTTON
TBR 30 I TRACK BALL RIGHT BUTTON
D [0..7] 1,3,4,6,8,9,10,11 I/O CPU DATA
SA [0..5] 93,94,95,96,97,99 I SCAN ADDRESS

SC [0..7] 82,85,85,87,89,90,91,92 I SCAN COLUME DATA
SD [0..7] 64,63,61,60,59,58,56,55 O SCAN DATA
SR [8..15] 74,72,71,70,68,67,66,65 O SCAN LINE SELECT
A[0..2] 42,41,40 O CPU ADDRESS
FRZLED 81 O FREEZE LED ON
/FRZLED 79 O UNFREEZE LED ON
SVO_6 53 O A/D CONVERTOR OE
PADCSTT 37 O A/D CONVERTOR ALE
PADCSTT_2D 52 O A/D CONVERTOR START
PADCSTT_1D_O 35 O A/D CONVERTOR START_1D_O
/8250CS 39 O 8250 CHIP SELECT
PC_DOWN 50 O PC OFF SIGNAL
POWER_ON_OFF 49 O POWER ON/OFF SIGNAL
RESET 77 O CPU RESET
/TMRINT 78 O TGC INTERRUT
ADCLK 54 O ADC0808 CLOCK

4.4.2 MAX239 ( RS-232C )
The function of this part is to convert normal signal into RS - 232C Serial.

4.4.3 8250 ( UART )
#Pin Description
# Cl oc k : 1.8 43 2 Mh z

4.4.4 A/D Converter ( ADC0808 )
# Pin Description

4.4.5 Alpha Numeric Key Controller ( HT82K28A )

Sec tion 2-5. Rear Boa rd .
5.REARBOARD
The function of th is boa rd is t o communicate with sub - apparatus. ( Ech o printer, Line printer, LAN,
USB, RS- 232C,Vid eo,VGA Monitor , Main Monitor, Foot SW) and composed of PCB and various
Connector. It doesn ¡ t¯have internal c ircuit Logic.
Rear B/D is connected with BNC, Foot SW and Cable at Rear Panel.
5.1 Rear B/D Configuration Diagram
J3 Serial Port
(RS-232C)
JP3
Pararell Port
P1 (Printer)
JP2 USB
JP1 LAN
(DICOM)
J2 VGA
(External)
J4 Echo Printer
Remote Jack

Sec tion 2-5. Rear Boa rd .
5.2 Rear Pa nel Configuration D iagram
RS
Monitor 232C
P
Echo Printer a
r
a
r
e
l
l
Video out
USB
Video in
LAN
Foot SW
VGA
E.P
Jack

Section 2-6. PC Board.
6. PC BOARD
6.1 Introd uction
6.1.1 External PC board
There has IO and bus as like general PC main boards. It is just different that ethenet card and
VGA card mount on this board.
6.1.2 PART OF PC
?? SYSTEM CONTROL.
?? USER & PERIPERAL INTERFACE
?? VGA
6.1.3 DESIGN CONCEPT (SPEC)
1) BASIC DESIGN CONCEPT
Service Ma nual Published by C ustomer Servic e Department

?? Low Cost System
?? High Performance
mbedded
for
Application
?? Simply Design
?? Supply the interface for using easily
?? Can be use various Application
2) Memory
?? Main Memory (SDRAM)
?? Minimum 16Mbyte, Max 256Mbytes
?? Fat SDRAM (PC 133)
?? Use 1 DIMM Socket (Service

gradableman up
?? Flash ROM : 512K x 16bit, 3.3V
3) Supply internal PCI bus/ISA bus
4) External peripheral connection supply Serial, Parallel
5) VIDEO
?? Basic resolution: 640 x 480, Color 24bit mode operation
6) Storage
?? 2 EID Connector for HDD
?? Extendable 4 Hard disk
6.2 General Description
6.2.1 H/W
1) PC specification
Parameter Specification Remark
Processor Strong ARM (RISC processor) SA110 (21281 - EB)
OS Linux Kernel 2.4.3 - rmk1
Memory 64MB (DIMM) 64, 128, 256MB
VRAM 1M x 16 Dynamic EDO RAM IS41C16100
Hard drive 20GB Quantum
VGA 640*480 color 16bit CHIPS F65550

ROM 512K*16bit (1MB) Flash ROM
Power +3, +5, +12, - 12V
Network Interfac e Ethenet 10/ 100 ba se TX Fast ethernet c ard
Serial RS - 232C DB - 9 Conne ctor
Pa rallel Standa rd EPP, EC P c ompa tibleness DB - 25 C onnector
Keyboa rd 86/ 103 keyboard 6pin DIN co nnec tor(PS2)
Mouse PS/ 2 Mouse 6pin DIN connector (PS2)
IDE po rt 4 HDD suppo rt
LCD 16bpp Using only Signal
2) Block diagram
Flash ROM 168pin DIMM

39VF800A SDRAM
CP U North Bridge
SA110 SYSTEM BUS 50MHz 21285 COM0
PCI BUS 33MHz
SouthBridge Ethernet VGA PCItoISABridge
VIA82C686A RTL8139 F65550 PLX9054
- 2 Serial ports
- PS/2 - 10/100B T, 1 RJ45 port - 256K*16*2 VRAM
- 1 Parrallel port
- 2 USB ports S
- RTC U DSC
B
- 2 IDE controller A
IS
,
PC ¿Üº Î bus T
O
L
S
N RX
IO
S
N
E
P
X
E
BEAM
In g eneral P C, PCI bus ¡¯s function of network and VGA mount on CPU board as slot . But, in this
case, each function chip is built - in of PCI bus on Board.

3) CPU
?? Intel strong ARM SA110: Hi gh performance RISC processor
?? Core clock: 233MHz
?? It is useful for power

tion. consum
That is to say, calorific’t valu
need cooler, and if u sers touch it when it is running, user doesn ’t feel hot.
?? 3V I/O
?? It has clock and bus as like general

point
Pentium
operation
PC. is B
v
slow, because
as no
it FPU.
?? Memory management unit (MMU) support virtual memory sy
?? 16KB of instruction cache and 16KB wri te back data cac
?? Write – enhancing performance

buffer
?? Static – low power consumption ideal for power sensitive app

operation
?? Fast sub microsecon

interrupt response
time for
application
real
?? Excellent
level
highlanguage support
?? Big and Little endian operating mode
?? IEEE 1149.1 boundary scan
?? 144pin TQFP package

SA - 110 micropr oc essor is gener al pu rposes micropr oc essor. It is one chi p th at is a bu ilt- in
16KB instruction ca che, 16KB write b ac k data c ac he, 8 - entry write b uffer with 16 bytes per entry, and
memory management unit (MM U).
SA - 110 play a role A RM V 4 arc hitec ture p roc essor family and software c ompa tible, and it c an b e
use with ARM support c hip for I/O, memor y and video . On - chip Ca che c an be rise exec ution speed
with write buffer, and to red uc e a verage memory ba ndwidth req uested b y proc essor. Ab ove things
make possible to use external memory for supplying ad ditional proc essor and direc t memo ry ac c ess
(DMA ). This instruc tion c a n be use for assessing memory mana geme nt, c onfiguration, and ca c he
cont rol register. SA - 110 have 1 6KB instructi on cac he ( lca che) by 32 - byt e block and 3 2 - way
associatively . Lc a c he supports flush - all- entry function. The I c ac he enab les when memory
mana gement is disab le. If Me mory manag ement disab les, all memory wa s cac hea ble b y Ic ac he. And ,
SA - 110 have 16KB data c ac he (Dca che) by 3 2 - byte block and 32 - way associat ively .
Dca c he suppli ed fl ush - all, flush - entry, and c opyba c k- entry function. But, in c ase of co py
ba c k- entry, it supplied b y software. Not hardwa re.
Strong ARM has 8 type of ba sic instruction.
4) North Bridge
?? Exclusive PCI bridge for SA110: 21285
?? Substantial all device control
?? PCI bridge (PCI revision

interface:
2.1 complian
32bit, 33MHz)
?? SDRAM interface
?? Flash ROM interface

?? DMA controllers
?? Serial port (For COM0, debugging)
?? Interrupt controller
?? PCI bus Arbiter
?? IEEE 1149.1 boundary scan and JEDEC
?? 21285 contr ol all device of PC board include

the point
CPU. ofT
Debugging. But, It is big problem that

’t check all pins cause of BGA type. it can
5) South Bridge
?? Supply all peripheral interface
?? US B
?? 2 Serial ports
?? Primary and Secondary IDE
?? Parallel port
?? RTC
?? Keyboard/Mouse
?? Power monitor (Usentrol)

for reset c
?? Floppy disk (Not use)
?? AC97 link (Not use)

6) VGA
?? Flat panel / CRT GUI Accelerator: CHIPS F65550
?? 640X480 16bpp
?? NTSC / PAL support
?? YUV / RGB output
?? System used only digital RGB, and send digital RGB to DS
data.
?? F65550 :
1M X 16 EDO / RAM(IS41 C16100 ) used 2ea
MONITOR
640*480 Displays
Whole VGA FORMAT

DSC MUXIMAGE DATA
All DISPLAY TRANSMIT TO

EXCEPT PC DSC BOARD
IMAGE ONLY RXIMAGE

7) Ethernet
?? Fast thern
controller:
et RTL8139
?? Complaint PCI Revision 2.2
?? 10/100B
TX
?? Use 93C46 ROM for appointing Mac address
?? Mac(Media Access
trol) Co
address : It find specified port,
and data structure through this address. It is po
giving specific number each system. It was managed
802.2.
?? Mediso n Mac –address

Received address officially from Medison
?? 00 05 B2 XX XX XX
?? XX XX XX defined as belo w.
?? FF FF 00 ~ FF FF FF : The system only for R&D.
?? 00 00 00 ~ FF FE FF : sh ipped system
?? Shipped system has exclusive MAC address correspond enc
¨çMac addr
ss generation
mac_generate.exe : Mac address generation prog
¨è It makes system to write mac address on ROM.
¨é Remark making date and serial number

8) PC I - ISA bridge
?? PCI I/O accelerator: PLX9054
?? PCI dual address cycle (DAC)
?? Two independent DMA channe
?? Use for PCI to ISA bridge
?? DSC, RX, Beamformer control and interface between each
?? ISA bus (16MHz, – It16bit

is slower than
bus)PCI bus.
?? Why this system use ISA bus.
??SA bus is very useful for programmer. ontrolled

Because,
by SA
proramme r with same address. ¯address

And, each
is always
device
same.
PCI bus can change the address with using virtual ad
than ISA.

9) Flash ROM
?? 512K X 16 multi purpose flash ROM : Use SST39VF800A
?? Supply JEDEC
dard
sta
?? Boot ROM
?? ROM file
?? BIOS : In the early Booting, It can be initialize
lode the Linux Kernel on system.
?? Kernel : Linux
rmk1
kernel
is go
2.4.3
to RAM after BIOS.

10) Loc k source
33MHz
SA110 33MHz
U8
OSC
3.68MHz 33MHz
U43
21285 ICS9169M
33MHz
U2 OSC
50.0MHz 33MHz
PLX9054
X2
OSC
48.0MHz Y2
VIA82C686 RTC XTAL
X3 14.31MHz
OSC Y3
14.3MHz
XTAL
F65550 32.68KHz
X1 Y4
OSC XTAL
14.3MHz 32.68KHz
RTL8139 Y5
XTAL
25.00KHz
?? Theyave clock generator at need except PCI clock/33M
?? Although ICS9169M is 33, 66, 48MHz frequency generator
?? Y3 is RTC (Rea l Time Clock). When power turn on, it t
power turn off,ery

it takes
voltage.
bat
?? U2 supply system bus CPU

clock.
-ort h RAM
bridg e inter face b etween e
mentioned clock.

11) C loc k source Analysis

Below table is type of clock for Ma in Board.
Name Source Frequenc y Remark

SA - 110 Oscillator 3.6864Mhz +3.3V
DC212 85 Oscillator 50Mhz Me mory cloc k
PC I_C LK_21285 33Mhz PCI clock
C T65550 PCI_CLK_VGA 33Mhz PCI clock
Oscillator 14.318Mhz Me mory cloc k
C rystal 32.768Khz
RTL8139C PCI_CLK1 33Mhz PCI clock
Crystal 25Mhz
PCI9054 PCI_CLK2 33Mhz PCI clock
VT82C 686A PCI_CLK0 33Mhz PCI clock
C rystal 14.318Mhz RTC
Oscillator 48Mhz USB
Oscillator 32.768Mhz
?? PCI CLOCK SOURCE
?? It is Clock Generator for making 33Mhz tha t is del
(14.318Mhz). In that time, Each

nected
interface
through
¯about
33R
Damping Register (RN96, RN98)
?? PCI DEVICE
?? It means PCI Device for S A6000II System. A ll 4 PCI d
And, each oscillator is clock

ystem(VIDEO
for driving
RAM, ISA,
sub USB e
Device.
?? SYSTEM
?? When er
u uses U8, user has to use110
3.3V.
works
Because,
with 3.3V
SA
And U2¯50 MHz is very important

¯North
clock
Bridge.
as U1 If U2 is
exert a bad influence to the whole system function,
Halt.
Referenc
: User must use at lease under 50PPM
ach
Crystal
Deviceand
detail
Osci
below.
¨çStrong ARM
?? CLK: 3.68Mhz Clock input. After making a change 23
Clock. And it uses ’s Oscillat or.asIf use

+3.3V 5.0V ’s OSC, CP U needs 3.3V
3.68Mhz

case of Level c ha nge.
?? MCLK : 48Mhz Clock Input, 21285

ving
Output,
BUS control
21285 the
for Cycle
dr
MCLK. Not Wait Signal.
¡Û DC212 85
?? PCI_CLK : 33Mhz Clock Input from Clock Generator(CY2260)
?? OSC : 48Mhz Clock Input, 21285 Core clock, FCLK, MC LK,
?? Generation.
CLK : 48Mhz Clock Output for sync
?? FCLK_IN : 48Mhz Clock input, FCLK and FCLK_IN should be
?? 21285 ‘s MCLK Output is used to MCLK Input, in that time, happen to delay depend on PCB
Pattern Capacitance. 21285 g enera ted SD RAM ’ s Clock and Con trol Signal, in that time, It
occur disc ord be tween CPU ’s SDRAM Ac cess Cyc le and 2128 5 ’s Clo ck and C ontrol Sign al
case of mentioned delay. For preventing discord, the length that is from FCLK to FCLK_IN
makes the same as length that is from 21285 ’s MCLK Ou tput to CPU ’s MCLK Input.
?? MC LK : 8Mhz Clock output

DCLKfor
[3:0]
CPU : 48Mhz Clock Output
Modules
¨é DI M M
?? SDCLK[3:0] : 48Mhz Clock Input from 21285
¨ê VGA
?? PCI_CLK : 33Mhz Clock Input from Clock Generator, Syste
?? OSC : Use for

.318Mhz
1 Clock Input form Osc, Video Timing Co
?? XTAL : 25Mhz Clock

CI
-to
-ISA
Input
Bridge for T10/100Base
?? OSC : .318Mhz
1 Clock Input from Oscillator, TC_CLK
I/O Device
:
?? 32.768Mhz Crystal SB_CLK

Input for
: 48Mhz
RTC Clock Input for USB
¨ë Clock Generator
?? XTAL : Clock Generator Input Clock, 14.318Mhz
?? PCI_CLK : 33Mhz Clock Output for PCI Device,

12) M emory a rchitecture
?? Main Memory (SDRAM)
It is basic Memory for SA6000II System. When this memo
there.
?? Memory Type : SDRAM(60Mh z)
?? DIMM Socket : 1ea
It is possible to use SDRAM DIMM : 16,32, 64,128,256Mb
?? Memory Map is compo sed of below 4artic le.
¨ç21285 General Memory Map
¨è Memory Map for CPU
¨é When 21285 is Master, Memory Map is on PCI Bus
¨ê When other Devices

are mater
xcept
21285, Memory Map is on PCI B
13) Power part
?? Supplied +5, +3.3,

12V from
+12,
Power B/D
?? Each power used FUSE cas e of protecting over current .
?? Change 5V to 2V by LM317 for supplying voltage to CPU
?? User is must to checkecause

2V output.
It was reflected by charact
Resistance.
?? +12V –12V
andis use for only serial communication.

1) Linux
128 B/ W system be used Linux O S pro gra m so it is very impo rtant know to pe c uliarity Linux
command.
Basic c ommand
C ommand describe Linux Dos / Window
Sea rch for direc tory Ls Dir
C hange direc tory CD CD
Ma ke to direc tory Mkdir MD
Remove Rmdir rm
Co py Cp co py
2) Mod ule
?? Powerman : Shutdown process
?? iop480 : ISA bus read / write
?? hdd_info : Reading serial number from HDD
?? idecsi : MO
ver
dr
6.3 Booting Sequence
6.3.1 H/W booting Seque nce

Power good signal is supplied to south bridge
Pic tur e 1.1.1 Pi cture 1.1.2
?? Originally, power good signal generated from ATX power,
delay chip(Pic.1.1.1) for following ’ stabi lity an d

reasons.(other
easiness of debugging.). Pic. 1.1.2 shows how power good signal moves into south bridge.

1) Reset
This de als with the Globa l Reset of whole board(signa ls up to ¡°C PU¡±are reset). System Reset is
as followings.
(1) Power O n Reset

ISA Bridge does the monitoring Power State through POWER_GOOD Input Pin and drives
PC I Reset (Low Ac tive) a nd RSTDRV (High Ac tive) when Pow er is ¡° On¡±
, and finally
Relea ses. RSTDRV is reversed by I nverter and b ec omes RSTDRV_L (Ac tive Low). After
making DC21285 reset, put 21285 ready. By two times Inverter (delay), CPU comes to be
reset. Befo re this stag e, other devices are a lrea dy reset (Ethernet, PLX, VG A, ISA) and wait
for starting in CPU.
C onside ring time, C PU is finally reset and oth er device s ca n start code at stable c ondition.
(2) South bridge receives po wer good signal and transfers reset signals into north bridge, C PU,
HDD.
(3) 21285 makes chips at PCI bus reset after rec eiving reset signal.
(4) Rea d comma nds from memory ad dress ¡°41000000H ¡±and prac tice.
(5) Me mory initial
(6) PCI bus initial (Device initial and ad dress mapping)
(7) H/W op erating.
6.3.2 S/W booting Sequence
1) When Power on, firstly BIOS have authority of control
- POST (power on self test)

- Memory CHE CKING
- Address mapping of each device
- Interrupt vector table
- Page table
2) After BIOS is over, jump to Kernel ¡ ¯s start point.

3) Kernel decompress
?? Initialize Stec and Resister.
?? Call decompress_kernel of misc.c

utomatically
and decompressed
?? Increase to
000
0x10
at memory.

?? From this point, output “Uncompressing
srcinal booting Linux …message.
OK, booting the
kernel.”
4) After this, Kernel from memory takes this function.
?? Kernel is essential ’s operating

for and provides basic many basic services with
computer
other opera ting par ts. Generally , Kernel o btains as followings.
¨ ç Input/Output process
¨ è Interrupt management. (All requests for Kernel ¡ s¯ ser vice.)
¨ é Scheduler. (Which program and order will use Kernel ¡ ¯s management time. )
¨ ê Supervisor. (After scheduler, give the rights to use computer )
¨ ë Kernel also manage address room for memory and storage and give to all surrounding
equipments and others.(Memory Manager). Kernel ¡ s¯ service requested by other operating
parts and consecutive program interface, ¡S
° ystem Call ¡ .±
?? Kernel
has path to all application H/W device for user.
5) IDE device mount (MO, HDD) for use of HDD
?? Linux needs mounting for use of HDD, Floppy, CDROM.
6) HDD init file start (Freeing init memory 212K)
?? Practice module for system.
?? Because Kernel is at
der
Bios,
is not
Boo t
necessary
Lo (LILO).
6.4 PC DEBUGGING
6.4.1 CHECK POINT
¨ç Check if parts are connected correctly.
Ex) Resistance value, ¯

connection,
Parts and Chips
Condenser
¯polarity.
¨è After parts insertion, Short & Open Check
¨é Check Jumper setting
Ex) System
t error.
bo
¨ê After
nsertion
check power source of board.
Ex) Power short

¨ë Power is supplied with boa rd.
¨ì Check if each chip ¡s̄ cloc k is generated c orrec tly.
¨í C heck reset input.
Ex ) Check if eac h chip ¡s̄ reset is input.
¨î At this point, pow er is ap proved. If no er ror, messag e ab out bo oting shows to debug po rt.
To see output of debut port, set other computer ¡¯
s serial port as baud rate = 38400, data
bit = 8bit, No Parity, 1 Stop bit. After that, you can obtain exact message. If the message
is broken or abnormal, sett ing proc ess abo ve should be chec ked.
¨ï From this, think normal booting is done.
If the booting fails, check the followings.
?? Check ROM
¯Chip Enable (CE) and Out Enable(OE).
?? CE & OE should be activ e

?60nS)
as Low
at (about
t he same
50 time.
?? Check 8 data
from
line
ROM.
?? Check Serial Controller (U53)
?? Power, Condenser, Resistance (Open or Short)
?? Connection of Debug Port
?? Message will be sho wn into debug po rt
00xx : 0000
00xx : 0000
00xx : 0000
00xx : 0000
¨ð Connect RAM on board
When connecting RAM on r

board
like and
10,err
ram interface is not e
?? U3, U4, U5, U6 check (Open & Short).
?? PCI Device pci_clk check.
?? SDRAM Clock Damp check (RN 14)
?? U3 and U4 is No.1 pin and check output from 21285(U
After checking this, ram check will be

Clock
normal.
is very
During
bad,
condenser (100uF) because this problem is caused by powe
¨ñ Check ram carefully.
¨ò ISA Device check

?? ISA is at interior VT82C686 and interfac e with exteri
Mouse , Serial 1, Serial

HDD1&2 2,
. Parallel
And do the initializati
¨óVGA Device chec k
Initialize VGA Device, F65550 (U54), and output on LCD and
image,
?? Jumper setting check (J10)
?? Check video
¯Open
RAM & Short.
?? Check Clock.
?? Check Hsync, ,B
Vsync,
¡¯output
R, of U54.
?? VGA Connector check.
¨ô Copy Kernel from ROM to RAM.
¨õ Practice Linux Kernel
16 During Kernel
¯operating, boot by HDD. Booting is done.
17Ethernet (U100) check.
?? Clock input check
?? U100
®Open & Short check.
?? U100 opera ting

After
check
power
at on,
least one of LED1, LED2,
Active, 10/100B) should be working.
6.4.2 Detail debugging
1) POWER
(1) Power Source

: ATX Power Supply Input (+12V, - 12V, +5V, - 5V, +3.3V, - 3.3V)
(2) Useable Power

+12, - 12V : serial communicatio n
+5V : PCI Bus System
+3.3V : PCI Device Power Source
+2V : C PU Core Voltage Only
(3) CHECK list before supply to power

Before power - on, FUSE and each power ¡ s¯ GND, short with power check is needed.
¨ ç FUSE CHECK

fuse c he ck for F1, F2, F3, F4
¨è GND SHORT CHECK about eac h of power
# F 4( - 12V) an d GND # F3(12V) an d GN D # F2(5V) an d GND

# F1(3V) an d GND # L12(2V) an d GND
¨é Eac h power¡ s̄ short chec k.
Following is meas urement by mu l timeter. Check the power .

# F4 ( - 12V), F3(12V) # F4( - 12V), F2(+5V) # F4( - 12V), F1(3V)
# F4( - 12V), L12(2V) # F3(12V), F2(5V) # F3(12V), F1(3V)
# F3( 12V) , L12(2V) # F 2(5V) , F1(3V) # F2(5V) , L12( 2V)
# F 1(3.3V) , L12(2V)
¨ê POWER C HECK ( - 12V, 12V, 5V, 3V)
After po wer- on, chec k the po wer is c orrec tly input by OSC ILLOSCO PE. F1, F2, F3, F4
chec k and c heck the same signal.
F4 signal VCC_- 12V F3 signa l VCC_ 12V
F1 signal VCC_ 3V F2 signal VCC_ 5V
< picture > ea ch powe r signal form

¨ë C PU Power chec k (2V)

CPU¡s̄ po wer should be 1.8 ~ 2.0V from Regulator(SC 1117) ¡s̄ No 2 PIN. So, C PU ca n
work normally.
By me a suri ng L12 with OSCILLOSCO PE, check the signals are as following.
<Picture> VC C_2V
If output voltage is incorrec t, need c hec k to the R144(100 §Ù1%), R145(62 §Ù1%)
<Picture> SC 1117C M C ircuit Diag ram
2) RESET
(1) RESET progress
When po wer on, RSTDR V Signa l (U62 J 1 pin) is input to the IC 5 pin of 7404(U64) , RSTDRV
Signal c ame out from VIA Chip 21285 (T17 pin: RESET) had RESET by inverting signal ( 6 pin :
RSTDRV_ L ) ,RESET signal active is ¡°
L ¡±

(2) Each of RESET signal form
<Pic ture>RESET si gna l

Sec tion 2-7. Mother Boa rd
7.MOTHERBOARD
System¿¡ Mother B/D perform the interface function between boards and cables and power and
sub- appa ratus.
Mother B/D is consisted of PCB parts and connectors without electronic compone nt.
There are DIN 96pin Connectors and Flat type, Mole type Connectors. Specially, SA6000II power is
designed by board type, and connect to mother B/D directly. So AC power input/output paths is used
on Mother B/D.

7.1 Mother B/D Configuration Diagram
FRONT
AC POWER
(From TRANS)
JP10
K
/I
M
J3 JP3 J6 J11 J12 J15
J
P
JP9 8
JP1
JP2
J8
J
T
J A
P G
J1 4 J4 J9 J14 J17
R
E
A
H
R
D
D
FAN &
M
JP11 O
JP12
JP14 JP15
J2 J5 J10 J13 J16
JP13
J J
T T
A A
System Power
( +5V,+12V ) G G
P
O D
P B R
W S
C F X
E C
R
Picture 1. Mother B/D Configuration Diagram

7.2 Connection Diagram between Mother B/D and TRANS
M O T HER
B/D
8mm
AC220_IN1
JP
AC_GND 8mm
10
AC220_IN2 8mm
8mm
MONITOR_AC_IN1
MONITOR_AC_OUT1 JP
3 6mm
MONITOR_AC_IN2
T
MONITOR_AC_OUT2 R
A
8m
AC15_IN2 N
JP
S
AC15_IN1 9
8mm
AC15_IN1
AC15_IN2 JP
2
AC15_SW1
4mm
AC15_SW2
8mm
Picture2. Connection Diagram between Mo ther B/D a nd TRANS

Sec tion 2-8. System Setup Dialogue.
8.SystemSetupDialogue
System Setup Dialogue is a kind of tool to setting the system setup when product the system or
change the system setting.
User c an ¡t¯use this program, usually product engineer or service engineer use this.
8.1 How to use System Setup Dialogue
8.1.1 How to go to System Setup Dialogue Shell
Picture1. Enter to System Setup Dialogue
1) Pres s ¡ °Ctrl + Shift + F1¡ ±after sys tem finish the booting.
2) Then you can see dialogue box like picture1.
3) Enter the passwor d ¡ °SILICA GEL¡ .±
? ΝοτιχεΠασσωορδ
: ισ α χονφιδεντιαλ,
τ τελλ ∆ον
ϒ↓ νορµαλ υσερ.

4) You can see ¡ °System Setup Dialog Shell ¡ ±like picture 2.
Picture 2. System Setup Dialogue Shell
On System Setup Dialogue Shell, there are tab dialogue menu for Admin, SW, Probe, Mode.
If you select ea c h Tab Dialogue menu , you can see each detail menu . Picture 2 show us Admin
menu, it is default when you comes to System Setup Dialogue Shell
Followings are details of each Tab Dialogu e.

8.1.2 MAdmin Tap Dialogue
Admin Tap Dialogue use Admin of Administ rator, and it can chage something concerned with
System Setup.
8.1.2.1 Linux Setup
SA6000II System use Linux by OS and this menu is possible to setting the Linux for SA6000II
System.
1) Pres s Butt on
2) You can see Picture 3. Linux Setup
Picture 3. Linux Setup

On this menu, you can modify 4 kind things.
In this part, you have to use keyboard - direction key and Tab key, Enter key - Mouse doesn ¡ ¯t work.
Select one of menu by direction key and go to ¡ °Run Tool ¡ ±by Tab key. And pres s ¡ °Enter ¡ ±then
you can s etting each part.
If you press space bare when curser is on option, option is selected with ¡ °* ¡ ±mark.

@ Authentication configuration
This part manage authentication part, and very important on security.
1) Select ¡ °Authentication configuration ¡ ,±then Pictur e4. will appear.
Check [*]Use Shadow Passwords option
This option encode and save password field of /etc/passwd to ¡ °shadow ¡ ±file in order to other
user ca n¡¯t see. This option must be checked.
2) Press Button and exit.
? Νοτιχε : Τηισ οπτιον ισ δεφαυλτ.
Πιχ τυρ ε 4. Αυτ ηεν τιχα τιο ν χονφ ιγυ ρατ ιον

@ Keybo ard configura tion

On this menu, we c an select keyboard type to each country.
SA6000ii use Multil anguage on one keyboard .
Usually, we select America ¡ °US¡ ±
If you select ¡° Keyboard configu ration ¡ ±then Picture 5 will appe ar.
1) Select ¡ u° s ¡ ±and press button.
? Νοτιχε : υσ
ϒ° ϒ±ισ α στανδαρδ.
Πι χτ υρ ε 5. Κε ψβ οα ρδ χ ον φι γυ ρα τι ον

@ System services
System service is called demon management on Linux.
SA6000II systems use followi ng 4 de mons b asica lly.
- lpd : Print service daemon to use printer on system.

- inetd : this is internet super server demon which charge internet, it manage telnet, FTP, rlogin
service.
- network: this script load the network interface when system booting.
- mys q l : This used when save the sonoview image or patient data.
1) If you select ¡ System

° services ¡±, picture6 will be appear.
Picture 6. System services
2) Select ¡ i±net,lpd,mysql,network ¡ ±and pres s button .
? Νοτιχε : Τηι σ οπτιον ισ στα νδαρδ.

@ Timezone configuration
This option is possible to sele ct time bend on Linux consol, check time to each country .
In case of Korea, ROK was selected.
We don ¡ t¯use Hareware clock set to GMT option.
1) If you select ¡ T
° imezone configuration ¡ ±Picture7. will be a ppear.
2) Select ¡ R
° OK¡ ±and press button.
? Νοτιχε : Τη ισ οπτιο ν ισ στανδαρ δ
Πιχτυρε 7. Τιµεζονε χονφιγυρα τιον
Ωηεν αλλ Λινυξ σετυπ ισ φινισηεδ, εξιτ

Θυιτϒ±
το
. ϒ°

8.1.2.2 Network Setup

To use networking, something setting value will be setup on this menu.
Before start Network Setup menu, note the Network setting value on setup information.
Picture 8. Ne twork information
1) Press Button on System Setup Dialog Shell (Picture 1, 2 )
2) Then Network Setup menu will appear like Picture 9.
Picture 9. Net work Setup

3) System ask ¡ W
° ould you like to set up Networking? ¡ ±If you select ¡ °Yes¡±, old networking setup
value will be delete. So, It is better note to old setting value.
4) Then Picture 10. will be appear. I
If you use DHCP to receive IP automatically, select [ * ] Use d y nam ic IP con fig ura tio n
( BOOTP/DHCP ). If you use static IP address enter like followings.
IP address : xxx.xxx.xxx.xxx
Default gateway ( IP ) : xx x.xxx.xxx.xxx
Primary namesever ( DNS ) : xxx.xxx.xxx.xxx
(x : gi ven add ressed num ber)
5) When finish Network se tting, press button.
6) You have to turn Off/On the system to use new network setting value.
Picture 10.Network Setting
8.1.2.3 HDD Checking
Use this option when you want to do scan disk on HDD like Win98 or Win2000.
1) Press Butt on.
2) Turn Off/ON pow er then system check the HDD during booting.

8.1.2.4 Printer Setup

Use this option when use line printer on SA6000II system.
1) Press button
2) Then you can see like picture 11. Printer Setup. Normally, there are no list because product
setup don ¡ t¯include i t.
Picture 11. Printer Setup
3) Press button to install the new printer.
Picture 12.Printer Add

Connect the parallel port to printer and press button.
4) Picture 13. show there are one Parallel port detected. If there are noting find, you have to
check system and printer.
±×¸ ² 13.Pr inter Detec t
5) Select button.
6) Select a printer name you want on ¡ °Names¡±. Usually write ¡ l°p¡±(local pri nter) on LI NUX.
Picture 14. Lo cal Pr inter Entry
7) Select button.
8) Select a printer type which you want to install.
If the re is exact printer, select that.
If not, select ¡ ° HP DeskJet 550C/560C/6xxC ¡ ± (HP deskjet type) or ¡ °Epson Stylus
Color(U P) ¡ ±(Epson printer)
Picture 15.Print er Select
9) Press but ton .
Picture 16. Printer Select Result

10) When finish all setup, ex it with ¡ °Qui t¡ ±button on ¡ P

° rint Tool ¡ ±menu.
Picture 17.Printer Se tup Exit

8.1.2.5 Lock Manager
Lock Manager used when Lock or Unlock SA6000II System Option S/W.
1) Select button.
2) Lockman window will be appear like picture 18.

3) Enter the Passwor d to dialog box ¡ °XXXXXXXXXXXXX¡.±
4) Select the option which you unlock.
Selected option is change to , unselected option is .

5) Press button and rebooting.
6) Check the option on Setup.
Picture 18. Lock Manager

8.1.2.6 Biopsy
Use this menu to setting biops y on p robe.
1) Press butt on.
2) Biopsy setting menu appear like Picture 19.

3) Select the start point by track ball and press ¡ °se t¡ ±key.
4) Select the end point by track ball and set key to save biopsy data.
Picture 19. Biopsy Setting
5) Check the r esult on Menu ? Biopsy On .
Picture 20. Biopsy Setting Result

# Delete biopsy setting
1) Select button
2) Biopsy setting picture show like picture 21.

3) Press ¡ °Set Key¡ ±two times without Biop sy Lin e.
Picture 21 Bio psy Setting
4) The other way is ¡ °Menu ? Biopsy ±to

On make
biopsy Off status.( Biopsy Clear
±×¸²
22 . Bi opsyá°ú
Cl ear

8.1.2.7 Upgrade
Use this menus to up - grade SA6000II system
1) Insert the MO diskette which contain U pgrade file.

2) Wait until MO lamp off.
3) Press but ton.
4) Ente r ¡ °/mnt/mo/* ¡ °on Filter.

You can see where is upgrade file and dire ctory on MO d iskette.
5) Select the version director y and file and press button.
Picture 23. Upgrade
6) During Up - garde, file was installed to mainsys directory.

? ∆υρινγ Υπ −γραδε, αλλ προ γραµ ισ χλ οσεδ σο, πο ωερ οφφ ισ ιµπ οσσιβλε.
7) Φολλοωινγ µενυ αππε αρ ωηεν πρεσσ λεφτ κεψ οφ Τραχκ Βαλλ. ( Εξιτ Κεψ )

8) Select New Window and make a prompt shell.

9) Execu te ¡ .±/powerman ¡ ±on prompt. ( When pr ess New Window, go t o /mainsys/bin di rectory)
Picture 24. Pr ompt Shell
10) Execute ¡ e
° ject /dev/sda ¡ ±and remove t he MO diskette.
11) Turn Off/On the power. (System check the HDD when reboot.)

8.1.2.8 Country
It need to setting the system to each country (Measure, Logo, Application, System
configuration..), Standard is Mediosn.
? It is not useful now.
1 Click
° ¡°b track ball, then you can see Picture25.
2 Select Country and click butto n.
3 System will allow saved value after Rebooting.
Picture 25. Country

8.1.2.9 NTSC/PAL
NTSC(60Hz),PAL(50Hz) is sele cted by each c ountry ¡ d̄ispl ay sync.

Usually Ame rica, K orea, Japan use NTSC, Europe use PAL.
1) Click the ¡ ° ¡ ±icon by track ball, then you can see like Picture 26.
2) SelectNTSCorPALandclick ¡ ° ¡ ±button.
3) System will allow saved value after Rebooting.
Picture 26. NTSC/PAL

8.1.2.10 language
It use when y ou select the language. (Multi Language)

System supply 5 la nguage(English, German, French, Italian, Spanish)
1) Click the ¡ ° ¡ ±icon by track ball then you can see like Picture 27.
2) Selectthelanguageandclick ¡ ° ¡± .
3) System will allow saved value after Rebootin g.
Picture 27. Language

8.1.2.11 System Serial
System serial number is booked when product.

You can install the system serial number like Picture 28.
Picture 28.Syst em Serial

8.1.2.12 Miscellaneous
Let¡¯
s check others.
There are 3 butt on on bottom side, we will check how to use these.
1) ¡° ¡±button make all setting value to beginning s tatus. Usually this button
executed before deliver ing on factory side. When you click this button, following password
box will be appear.
If you enter t he pass word ¡ °inito k ¡ ±and press ¡ °OK¡±, all setting value will be back to factory
setting. You have to pay attention because patient ID information and Image filing Data will
be lost.
2) ¡° ¡±button is used to close the Main Program. When you click this butto n,
password box appear. If you enter the password ¡ °quitok¡ ±then press ¡ O
° K¡ ±syst em go to
Shell. In order to back to Main write down ¡ °./runmain ¡ ±and ent er.
3) ¡° ¡±is used to go to Shell mode without close Main Program. Also it need
passwor d ¡ s°hell ok¡ ±and pre ss ¡ °OK¡±then go to Shell mode. If you come back to main
program, write ¡ e° xit¡ ±and pr ess en ter.

8.1.3 SW Tab Dialogue

This shows the information of system SW.
There are three part on Picture 9. - RUN OPTION/OPTION/EVENT FILTER -
Picture 29. SW
1) RUN OPTION
This part show the option when execute ¡ .°/main ¡ .±
Foramt : ./main ?XX XX X
¡1¡
® ¯is option is selected ¡0¡
¯ ¯is not selected.
- nohardware : To turn on the system without Hardware,
ex )./main - nh
- no_probe : To turn on the system without Probe,
ex )./ main -n p
- debug : To use debug Mode,
ex )./ mai n -- debug
- noprbdchk : Don ¡¯t check when take off the probe during using System
- ex )./main -- noprbchk
- nochkprb : Don ¡¯t check the probe when turn on the system
ex )./main -- nochk prb
2) O PTI ON
This part shows option status, 1¡
°¡ ± is selected and ¡ 0° ¡ ±is not selected.
3) EVENT FILTER
This part used by researcher.

8.1.4 Probe Tap Dialogue
This part shows probe information , there are all probe information.
Ex) Probe ID, Probe name, Eleme nt, others
Picture 30. Probe

8.1.5 Mode Tap Dialogue
Picture 31. Mode
Mode Tap Dialogue used by r esearcher or d ebugger to use main S/W command.
It is not allow to normal user.

8.2 MO Diskette
SA6000 II use MO Dr ive & Di sket te to i mage b ackup m e dia. Now we use MO d iskette i s FAT32
formatted 540MB. (near future we use 640MB,1. 3GB)
In order to us MO on Shell mode, need MO mount.
?? 540MB MO moun t method
1)Insert MO Diskette (wait until LED off)
2) bash.03 mount
?t vfat /dev/sda ? /mnt/mo
Τηισ χοµµανδ µ εανσ δο µουντ ΜΟ (σδα(σχσι) ιν δεριϖε) το /µντ/µο βψ ΦΑΤ32.

3) βαση−2.03# χδ /µντ/µο
Τηισ χοµµανδ µεανσ αχχεσσ τηε ΜΟ ιν /µντ/µο.
4) βαση−2.03# λσ
Τηισ χοµµανδ λιστ υπ το αλλ φιλε ανδ διρεχτορψ ιν ΜΟ ιτϒ°
διρϒ±
λοοκσ
χοµµανδ.
λικε
?? MO mount which higher than 640M
1)Insert MO Diskette (wait until LED off)
2) bash.03 mount ?
/dev/sda /mnt/mo
Τηισ χοµµανδ µεανσ δο µουντ ΜΟ (σδα(σχσι) ιν δεριϖε) το /µντ/µο βψ ΦΑΤ32.

3) βαση−2.03# χδ /µντ/µο ?
Τηισ χοµµανδ µεανσ αχχεσσ τηε ΜΟ ιν /µντ/µο.
4) βαση−2.03 # λσ ?
Τηισ χοµµαν δ λιστ υπ το αλλ φιλε ανδ διρεχτορψ ιν ΜΟ ιτϒ°
διρϒ±
λοοκσ
χοµµανδ.
λικε
?? MO eject (540MB, 640MB)
1)bash.03 ? cd
Τηισ χοµµανδ µεανσ γο το ρ οοτ δι ρεχτορψ.

2) βαση−2.03# εϕεχτ µο ?
Τηισ χοµµανδ ρεµοϖε ΜΟ ∆ισκεττε φροµ ΜΟ ∆ριϖε.
Ιν ορδερ το ρεµοϖε ΜΟ ∆ισκεττε, νεεδ υνµο υντ. Εϕεχτ µο ισ α χοµµανδ το υνµουντ.
Εϕεχτ βυττον δοεσνϒ↓
τ ωορκ ιν τηισ στατυσ.
?? MO Format (540MB, 640MB)
MO Diskette formats on Shell mode.
1)
Insert MO Diskette. (wait until LED off)
2) bash.03 mke2fs?I/dev/sda
This command means format the

e2fs
MOtype
Diskette
(linux
b partition typ
3) Then you can us MO by use MO mount.

8.3 SA 6000II S/W D irectory Str ucture
Let¡¯
s check SA6000II S/W directory.
1st 2nd 3rd
CONTENTS
directory directory directory
debug There are script for debug dial ogue
data
set00 There are probe application data
./main : SA6000II main program

./lockman : Option lock manager program
bin ./powerman : System shutdown program
root ./runmain : batch file(script) program
mainsys ./formatmo : MO diskette format(fat32) program
system_config.ini : Regist current system setting

ini
password.ini : Option password is recorded
image Image filing data

system
sonoview Image filing directory
measure GA table data and measurement data
bodymark body mark d rawing file
Under /bin directory, there are system file and remember back up the image filing data when up - trade
the system.
`

Section 2-9. Main Board Picture.
9.MAINBOARDPicture
9.1 Position of each BOARD

9.1.1 PSA BOARD

9.1.2 RE CEIVER BOARD
9.2.2 BEAMFORMER BOARD

9.2.3 DSC BOARD
9.3.4 POWER BOARD

SonoAce 6000II Section 3-1. Main Power.
1.MAINPOWER
1.1 GENERAL
THIS UNIT SUPPLY INPUTTING AC POWER (90V - 132V/180V - 264V SINGLE PHASE ) BY PWM
CONT ROL OUTP UT (¡ ¾5V,¡ ¾12V, +3.3V ¡ ¾10¡  80V POWE R) AND SU PPL Y HIGH VO LTA GE TO (LEGO
MODEL) SWITCHING MODE POWER SUPPLY
1.2 FUNCTION
?? AC INPUT AUTO DELAY

FF
?? ONSTANT VOLT AGE OUTPUT
?? VARIABLE ARRA Y OUTPUT VOLTAGE
?? OVER CURRENT PROTECTION

¦ OVER VOLTAGE
?? PROTECTION
1 3 ELECTRONIC CHARACTERISTICS
1.3.1 INPUT CHARACTERISTICS
1) VARIABLE INPUT VOLTAGE RANGE

AC90V¡  132V & AC180V ¡  AC264V SINGLE PHASE
2) RATED INPUT VOLTAGE
AC110V FIX & AC220V FIX
3) MAX INPUT CURRENT
9.4 MAX AT 90V AC
4) INRUSH CURRENT
100A MAX AT MAX OUTPUT/AC 110V INPUT
5) EFFICIENCY
65% AT MAX LOAD, MAX OUTPUT VOLTAGE, RATED INPUT
6) LEAKAGE CURRENT
100uA MAX at AC264V INPUT
1.3.2 OUT PUT CHARACTERISTICS
1) OUTPUT VOLTAGE £ ¦ CURRENT

POWER AC110V/AC220V

CURRENT º ñ°í
VOLTAGE
MIN TYP MAX MAX POWER
+ 3.5VF 0A 8A 12A 42W
+5.2VD 0A 6A 8A 41.6W
+ 12.2VD 0A 1.5A 2A 24.4W
- 12.2V D 0A 0.8A 1A 12.2W
+ 5.2VA 0A 3.8A 5A 26W
- 5.2VA 0A 3.5A 4.6A 23.9W

+10V ¡  80V 0A 0.1A 0.2A 16W
- 10V¡  80V 0A 0.1A 0.2A 16W
TOTAL 202.1W
2) REGULATION
¨ ¿ LINE REGU LATION ( ¡ ¾1% ÀÌ ÇÏ) `
¡ ØINPUT AC90V ¡  132V / AC180V ¡  AC264V
OUTPUT TYP LOAD
¨ À LOAD REGULATIO N ( ¡ ¾2% +0.1V ÀÌ ÇÏ )
¡ØINPUT AC110V/AC220V , OUTPUT MIN¡MAX LOAD
¨ Á CROSS REGUL ATION (¡ ¾3% +0 .1V ÀÌ ÇÏ )
¡ ØOUTPUT MIN,TYP,MA X LOAD
3) PROTECTION
¨ ¿ OVER VOLTAGE PROTECTION : 120% ¡ ¾10% +1V
´ Ü ¡ ¾HV´ Â : 11 0% ¡ ¾5% +1V
¨ À OVER CURRENT PROTECTIO N : SHORT PROTECTIO N
4) RIPPLE £¦ NOISE
¡ ØAC INPUT : A C11 0V
¡ ØTEST POINT : 1§Þ/250V CAP
¡ ØSCOPE PLUG : SHORT PLUG
¡ ØOUTPUT LOAD : MAX LOAD
VOLTAGE RIPPLE NOISE

+5.2VD 50mV P- P 100mVP- P
+3. 5VB F 35mVP- P 70mVP- P
¡ ¾12VD 120mVP- P 240mVP- P
¡ ¾5VA 50mVP- P 100mVP- P
¡ ¾80V 800mVP- P 1.6V
5) RISING TIME (+3. 5VBF,+5 .2VD)

30mS MAX AT RATED LOAD, MIN INPUT VOLTAGE
6) FAIL TIME (+3 . 5VBF,+5 .2VD)

200mS MAX AT TYP LOAD, RATED INPUT VOLTAGE
V
AC INPUT
AC FAIL TIME
FAIL TIME
V 200mS MAX
DC OUTPUT
90%
10%
DC OFF TIME
7 ) OVER SHOOT (ALL OUTPUT)
MAX 5%AT RATED OUTPUT
AC INPUT
AC FAIL TIME
OVER
SHOOT
RATED
DC OUTPUT
OFF TIME
8) P OWER SEQUENCE
IN PUT : AC110V/60HZ

OUTPUT : TYP LOAD

AC ON
| + ------------------------
+ -------- +------------------------
| | T a ON (+3.3V BF)
| | + -------------------
+ -------- +---- +-------------------
| | T b ON (+5 .2VD)
| | + -------------------
+ -------- +---- +-------------------
| | T c ON (+12V D)
| | + -------------------
+ -------- +---- +-------------------
| | T d ON ( -1 2VD)
| | + --------------------
+ -------- +---- +-------------------
| | T e on ( - 5VA)
| | + --------------------
+ -------- +---- +-------------------
+---- +
SET UP TIME : 100mS ¡ 450mS *Ta , Te Deflection : 15 0mS
9) LOGIG DIAGRAM
ON OFF
POWER
SWITCH
AC
OUTUT
DelayStart
P/O SIGNAL (Output)

OUTUT
Delay End(Input)
P.B SIGNAL
INPUT
Delay Time
10) BURN- IN TEST

CONDITION : LOAD - TYP LOAD , TEMPERATURE- 40¡ É , TIME- 8HR
MA X - LOAD NORMAL TEMPERATURE
* Component temperature must be lower than 90¡ É.

1.3.3 SAFETY
1) * IEC 601 - 1 (SAFTY O F ELECTRI C MEDICAL E QUIPMENT)

* CISPR 11 CLASS A, VDE 0871 C LASS B
2) INSULATION RESISTANCE
20M ohm MIN AT 500V DC
3) WITHSTANDING VOLTAGE
AC 1.5KV PRIMARY ¡ ê FG
AC 4K V PRIMA RY ¡ ê SECONDARY
1.3.4 ENVIRON MENT
1) TEMPERATURE
OPERATING : 0 ¡ É ¡  40 ¡ É
STO RAG E : - 20 ¡ É ¡  60 ¡ É
(+) STORAGE TEMPERATURE : SYSTEM NO OPERATION
60
48HR 2 HR
TEST POINT ¢Ö
( - ) STOR AGE TEMPERATURE : SYSTE M NO OPE RATION
25¡ É 48HR
HR
4 ¢Ö
- 20¡ É TEST POINT
(+) OPERATING TEMPERATURE
40¡ É 48HR
25 ¡ É
¢Ø
End Time

( - ) OPERATING TEMPERATURE
25¡ É
¢Ø
48HR End Time
0¡ É
2) HUMIDITY
OPERA TION : 10% - 90% RH
STO RAG E : 10% - 90% RH
90%
48HR
10%
¡è
END TIM E

D39 C99
1N4001 C104
Q15 D38 R112

BD2 BU806
1/8W100
W02
+ D35 D40 1N4001
R107 1N4001 R113
1N4001 1/4W120
AC15V 1/8W100
U25
R105 R110
1 2 4 U24 3 BR-950C
- C67 2W1.8K D36
1/8W1K
220/63+ 1N4001
AC15V R114 ACIN3
Q16 4 3 1 2 POWER RY3
D37 POWER CONTROL 1/4W1K
A708
1N4001 OFF PC817 SIGNAL
1 R111 PC817
LD1 SIGNAL
1/8W390 ACOUT 3
R106 ZD4 LED LED CH22-MD12F
MAIN12V
1/2W 8.2K 1N4742
ACIN4
2
R108 U23 RELAY ON/OFF TIME
KA431
C68 1%47K R109 POWER ON = 1 - 2 - 3
+ D45
RY1 ACOUT 4
22/63 C69
1%4.7K 1N4001
C104 POWER OFF = 3 - 2 - 1
D411N4001R116 1/4W470K
CH22-MD12F
3 4 1 2 R118
Q17 R104
RY2
D42 C2383 2W10
C71 1/4W3K D46 CR1
1N4001
MN105 1N4001 BTA16-600
D43 1N4001
R1171/4W100K CH22-MD12F
9 8 5 6 R119
Q18
D44 R1151/4W220K C2383 ACIN 1
C72 1/4W3K
MN105 TH1
U26 MC14584
1N4001 NTC10D11
ACOUT 1
R120
1/8W1K R103
CR2
2W10
BTA16-600
+5VA
OVP -5VA
+HV ACIN2
-HV
TH2
NTC10D11
ACOUT 2
D47
1N4001 -12
+12
+5VD
1/8W680
1/8W2.4K 1/8W330
1W30K
1W30K +3.5VD
1/8W680 1/8W680 1/8W2.4K
P/O C
R126R129R130
R128 R127 R123R124 R125
P/OE POSKOM CO.,LTD
PB+ Title
LD10LD11LD12
PB-
SA-6000II OFF
LD5 LD7 Size DocumentNumber Rev
LD6 LD9 B
LD8 SA-6000II 00
GR GR GR GR GR GR GR GR
Date: Friday, August 17, 2001 Sheet 1 of 1
Servic e Ma nual Published byCustomer Service Department

POWER
POWER
Èæ
110 AC15V
INLET CR2 L1 O02 0

110V AC15V
1 2 3 S2
ACINPUT °¥
2
C2 C4 220V 1
224/AC250V 221/AC250V471/AC250V
FG C1
C5
221/AC250V
ACINPUT 1 2 110V 3 AC110V
2 Àû
C3 471/AC250V
R1
220V 1 110 OUTLET1
VOLTAGE
1/2W 470K SELECTOR AC110V
INPUT 0
µî
AC110V
OUTLET2
AC110V
POSKOM CO.,LTD
Title
SA-6000II RACK
Size DocumentNumber Rev
B 00
SA-6000II

T4 R84 C45
1/2W47 M102
PQ2625
D15 L2
+DC +12.2
V 2A
+ C96 OB630 1.0 MAX
R44 D10LC20U C19 + +
47/400
2W24K C9 C13 + 2200/16 C44 C87
C103/1KV 2200/16 R50 C224 100/16
2W270
-DC
D14
1N4937
Q10 TOP225 R56 R49
1/8W100 1/8W15K
ControlSourceDrain
1 2 3 R48
C16 R55
D10 1N4937 M104 1/8W 10K 1/8W 3.3K
C15 + U15
47/25 R54
2 1/8W 4.7K VR6
PC817B U16 2K
R53 MN104 3
KA431
1/4W 6.8
C80
R88 C50
1/2W47 M102
T3
L8
EI2219
+ C97 D3 DRUM 10PIE 0.6MAX
R90 D10SC4M C48 + +
47/400
C97 C47 + R86 C49 C88
2W24K 1000/16
C103/1KV 1000/16 1W470 C224 100/16
-12.2 1.3A
D29
Q3 TOP223 1N4937 R28 R24

1/8W 100 1/8W 15K
ControlSourceDrain
1 2 3 R23
C7 R27
D30 1N4937 M104 1/8W10K 1/8W 3.3K
C52 + U9
47/25 R26
1/8W 4.7K VR3
2
PC817B U10 2K
R89 MN104 3
KA431
1/4W6.8
C79
POSKOM CO,.LTD
Title
SA-6000II +12.2,-12.2
B
SA-6000II 00

T2 R94 C58
1/2W47 M102
EER2834
D2 L9
+DC +5.2V 5A
DRUM10PIE 1.0 MAX
+ C98
D10SC4M + +
47/400 R91 C56
C54 C55 + R93 C57 C89
2W24K 3300/10
C103/1KV 3300/10 1W51 C224 100/16
-DC
D32
1N4937
Q2 TOP225 R10 R7
1/8W 100 1/8W 2.4K
Control Source Drain
1 2 3 R6
C2 R9
D31 1N4937 M104 1/8W10K 1/8W2k
C53 + U4
47/25 R8
2 1/8W 4.7K VR2
PC817B U3 500
R92 3
C78 KA431
1/4W 6.8
MN104
1
R97 C61
1/2W47 M102
T1
L8
EER2834
D1 DRUM 10PIE 1.0MAX
+ C93 R96 D10SC4M C63 + +
47/400
2W24K C59 C62 + R98 3300/10 C64 C90
C103/1KV 3300/10 1W51 C224 100/16
-5.1V 4.6A
D34
Q1 TOP225 R5 R2
1N4937
1/8W 100 1/8W 2.4K
Control Source Drain
1 2 3 R1
C1 R4
1/8W2k
D33 1N4937 M104 1/8W10K
C60 + U2
47/25 R3
2 1/8W 4.7K VR1
PC817B U1 500
R95 3
C77 KA431
1/4W18
MN104
1
POSKOM CO,.LTD
Title
SA-6000II +5VA,-5VA
B
SA-6000II 00

L11 LINEFILTER L12 INDUCTOR

T7 R80 C39
ACIN 1/2W47 M102
C65
PQ2625
C76 CR3 D27 L7
222/AC250V
C75 9G471 +3.5VF12A
104/AC250V 104/AC250V BD1 OB630
C66 + + C94
KBPC2506 C30P04Q
47/400 R73 R83 C33 + +
C36 + C37 + 2W24K C30 C31 + + 4700/10 C42 C85
ACIN 5W22
222/AC250V C103/1KV 4700/10 C32 C224 100/16
470/400 470/400 3300/10
-
D26
1N4937
Q13 TOP227 R79 R76
1/8W10 1/8W 1K
ControlSource Drain
1 2 3 R135 R75
2W15 C35 R78
1/8W 2.2K
D28 1N4937 M104 1/8W10K
C34 + U21
R77
47/25 2 1/8W 4.7K
VR9
PC817B U22
R74 MN105 3 1K
KA431
1/4W18 C82
R82 C41
T5 1/2W47 M102
EER2828
L5
+DC
+5VD 8.5A
+ C95 D20 D10SC4M DRUM 10PIE MAX
47/400 R62 C29 + +
2W24K C21 C25 + R64 3300/10 C43 C86
C103/1KV 3300/10 2W 33 C224 100/16
-DC
D19
1N4937
Q12 TOP226 R72 R69
1/8W 100 1/8W 3.3K
ControlSource Drain
1 2 3 R136 1W20 R68

C28 R71
1/8W 2.2K
D25 1N4937 M104 1/8W10K
C26 + U19
R70
47/25 2 1/8W 4.7K VR8
PC817B U17 1K
R67 MN104 3
KA431
1/4W6.8 C81
POSKOMCO,.LTD
Title
SA-6000II 3.5VF,5VD
Size Document
Number Rev
B
SA-6000II 00

AC INPUT RELAY
LINE FILTER RECTIFIER TRANS RECTIFIER FILTER +5.2VA
(AC110~220V) TOP S/W
AC INPUT
RELAY
PWM CONTROL
TOP S/W TRANS RECTIFIER FILTER -5.2VA
PWM CONTROL
AC INPUT RELAY
(15V) RECTIFIER CONTROL
AC INPUT
SIGNAL
+HV
RECTIFIER FILTER REGULATOR +HV
TOP S/W
high voltage 0V-5V

& CONTROL
TRANS SHORT PROTECTION CONTROL
-HV -HV
RECTIFIER FILTER REGULATOR
PWM CONTROL
POKSOM CO,.LTD
Title
LEGO BLOCK DIAGRAM
Size Document
Number Rev
B
LEGO
POWER 00
Date: Wednes
day,January31,2001 Sheet 1 of 1

7. BLOCK DIAGRAM
AC INPUT RELAY
LINEFILTER RECTIFIER TRANS RECTIFIER FILTER +3.5VBF
(AC110~220V) TOP S/W
AC INPUT
RELAY
PWM CONTROL
TOP S/W TRANS RECTIFIER FILTER +5.2VD
PWM CONTROL
AC INPUT RELAY
RECTIFIER
(15V) CONTROL
SIGNAL
AC INPUT TRANS RECTIFIER FILTER +12.2V
TOP S/W
PWM CONTROL
TOP S/W TRANS RECTIFIER FILTER -12.2V
PWM CONTROL
POSKOM CO.,LTD
Title
LEGO BLOCK DIAGRAM
Size Document Number Rev
B
LEGO
POWER 00
Date: Wednes
day,January31,2001 Sheet 1 of 1

AC_220V_IN(55cm) 1
2
3
AC_GND(55cm) 4
5
AC_220V_IN(55cm) 6
³ ì »ö GND´ÜÀÚ
ÇöÀç 220V ÀÔ
· Â »óÅÂ¹ è¼±ÀÓ
°¥»ö AC_110V_IN(51cm) 1
2
ÁÖÈ² »ö 3
4
LEGO TRANS 5
AC_110V_IN(51cm) 6
° ËÁ¤»ö
7
Àû»ö 8
AC_15V_IN(45cm) 1
2
AC_15V_IN(45cm) 3
INLET AC LINE
AC_110V_OUT(51cm)
Monitor
AC_110V_OUT(51cm)
Echo_Printer

SonoAce 6000II Section 3-2. Monitor.
2.MONITOR
2.1 APPLY MODEL
This model is using MEDIOSN SO NOACE SA6000II (SA - 6000II) DI SPLAY MONO MONITOR M ODEL
GM- 12LD (12 inch ).
2.2 UNIT CONTENTS
?? * ENCLOSURE (PLA STIC CASE)
?? * 12 inch MONO TUBE
?? * CHASSIS
?? * POWER SWEEP A ND SOCKET MODULE
2.3 STAN DARD TEST STATUS

Temperature : 23 ¡ ¾2deg C , humidity : 50 ¡ ¾
5%.
2.4 ELECTRONIC CHARACTERISTICS
2.4.1 INPUT PORT : BNC CONNECTOR
2.4.2. INPUT SIGNAL :

a. INPUT IMPEDANCE : 75 ohm
b. INPUT LEVEL : COMPOSITE VIDEO : 0 to 0.7 Vp-p
Sync on VIDEO : 0.3 Vp-p
c. POLARITY
c-1. VIDEO --- POSITIVE
c-2. SYNC --- NEGATIVE (HORIZONTAL. VERTICAL)
2.4.3 VIDEO Amp BAND WIDTH : 28 MHZ
2.4.4 DEFLECTION STAGE CHARACTERISTICS
Freq RETRACE TIME FULL-IN RANGE

HORIZONTAL 31.50KHz 3.9uS ¡ ¾300 Hz
VERTICAL b. 60 Hz 0.5mS ¡ ¾2 Hz

2.4.5 POWER SUPPLY
?? AC INPUT : AC
265V
90/V 0Hz
50
?? CONSUMPTION : 47 Watts MAX
2.5 CRT
HARACTERISTICS
?? TY PE : R12KP45 ( KEC )
?? SIZE : 12 inch SCREEN
?? DEFLECTION ANGLE : 110 Deg
?? PHOSPHOR : P4
?? LIGHT TRANSMISSI
N : 46 / 34
?? FACE TREATMENT : GLA RE
?? HE AT ER : DC 6.3V / 248 mA
2.6 DISPLAY CHARACTERISTICS
2.6.1 DISPLAY SIZE

?? H -IZE : 210mm
1.5mm
¾
?? V-IZE : 158
1
¾ .5mm
mm
2.6.2 SIZE REGULATION

?? W ¡¾ (with VARIATIONS OF EXTERNAL CONTROLS
to MAXIMUM)
MINIMUM
2.6.3 DISPLAY CENTERERING

?? H -CENTER :
1
¾ mm
?? V-CENTER 1
:
¾ mm
2.7 SETTING POINT
2.7.1 INTERNAL SETTING POINT
?? SUB-
BRIGHTNESS
?? VERTICAL SIZE

?? VERTICAL CENTER
?? VERTICAL LINEARITY
?? HORIZONTAL HOLD
?? HORIZONTAL PHASE
?? HORIZONTAL WIDTH
?? FOCUS
?? SUB CONTRAST
?? V-IZE COMPENSATION
2.7.2 EXTERNAL SETTING POINT
?? BRIGHTNESS CONTROL
?? CONTRAST CONTROL

2.9 PROBLEM CHECK LIST

Followings are in case of simple problem, serious problem need to repair by expert engineering.
2.9.1. NO RASTER
DC INPUT LINE a. POWER CN 301 CHECK
N.G b. D312 DIODE CHE CK

CHECK c. +12V, +40V CHECK
INPUT SIGNAL N.G a. SYTEM CHECK

CHECK b. VIDEO CABLE CHECK
(CN101 ARROUND) (INCLUDE BNC)
HD 101 NEAR N.G a. HD101 CHECK

b. HD101 NEAR PART BAD
PARTS CHECK SOLDERING CHECK
IC 101 OR a. IC101 FAIL

N.G b. AROUND CONDEN SE
PART PRO BLE M O R B A
AROUND PARTS SOLDERING
H. DRIVER (Q301) N.G a. Q301 FAIL

H.OUTPUT (Q302) b. Q301 FAIL
OR ARROUND PARTS c. FBT ARROUND CHE CK
VIDEO CIRCUIT a. HD102, Q501, Q502

N.G b. CRT SOCKET CONNE-
CTION OR EACH PAR
ARROUND CIRCUIT POWER CHECK
FBT HV NEED A EXPERT

N.G REPAIRING
CHECK

2.9.2 There are one horizontal line
IC 201 +24 V N.G

a. R201 OR D20 1 OPEN
CHECK
IC 201 OR ARROUND N.G a. IC 201 FAIL

b. C209, R217 FAIL
PARTS CHECK
H- DY CONNECT ION & N.G a. V - DY WIRE OPEN
V- DY CHECK b. V - DY OPEN
NEED A EXPERT RE PA-

IRING

2.9.3 There are one vertical line
FBT ARROUND CIRCUIT
CHECK
H- DY CON NECTI ON & N.G a. H - DY WIRE OPEN
H—DY CHECK b. H - DY OPEN
WIDTH COIL a. WIDTH COIL OPEN

N.G
LINEARITY COIL b. LINE ARITY COIL
CHECK OPEN
C307, 308 CHECK a. C307, 308 FAIL

N.G
b. T301 BAD SO LDERING
NEED A EXPE RT REPAI -
RING

2.9.4 Vertical synchronization broken
SYSTEM a. SYSTEM FAIL
N.G b. SYNC CABLE

SYNC OUTPUT CHECK OPEN OR SHORT
IC 201 SYNC N.G a. HD1 01, Q201

b. IC 201 FAIL
INPUT CIRCUIT CHECK
IC 201ÀÇ OCILLATOR N.G a. R204, 205

b. D202 FAIL
CIRCUIT CHECK C. IC201 FAIL
IC 201 CHECK
NEED A EXPERT REPAI -

RING

2.9.5 Horizontal synchronization broken
SYSTEM SYNC a. SYSTEM FAIL
N.G b. SYNC CABLE

OUTPUT (CN101) CHECK OPEN OR FAIL
HD 101 ARROUND a. R107, 101 OPEN OR

N.G
BAD SOLDERING
b.IC101 ARROUND COM P -
CIRCUIT CHECK ONENT FAIL OR BAD
SOLDERINGT
a. R115, 117, 118 FAIL

N.G OR BAD SOLDERING
IC 101 CHECK b. IC101 FAIL O R BAD
SOLDERING
c. VR 102 FAIL OR BAD
SOLDERING
d. VR 102 SETTIN G PRO-
BLEM
RING

2.9.6 Monitor is too bright when setting brightness volume.
INPUT a. POWER SUPPLY POWE

VOLTAGE CHECK (+12V) N.G CHECK
N.G a. CN303 CONNECTION FAIL

CN 301 CHECK b. CN301 O PEN
c. EXTERNAL BRI GHT NE
VOLUME FAIL
VR 301 NEAR PART a. R 30 9 FAIL O R BAD SOL -

N.G DERING
CHECK b. VR 301 FAI L OR BADSOL -
DERING
c. VR 301 SETTING FAIL
CN 304 NEAR PART a. CN304 G1 LIN E

N.G CONNECTINO PROBLEM
CHECK b. R507 OPEN OR BAD
SOLDERING
c. SG502 SHO RT
CRT SOCKET ARROUN N . G a. CRT SOCKET CONNEC -

TION PROBLEM
CHECK b. CRT SOCKET BAD SOL -
DERING

RING

2.9.7 Monitor is too dark when setting brightness volume.
a. If horizontal display size

DISPLAY SIZE CHECK N.G big ger t han s pec, CRT HV
down (decrease)

RING
a. If horizontal display size

smaller than spec, +40V
CHECK
a. If no problem on power
(+40V ¡ ¾0.2 V), need a
expert repairing
N.G a. VR 103 FAIL

VR 103 SETTING FAIL
b. VR 103 READJUSTING

2.9.8 Noise appear when external impact or movement.
Checking followings.
?? CN 101 connection fail or bad soldering.
?? CN 101 and all CONNECTOR check.
?? PCB SOLDER side

hec k
to fi nd ba d s ol de
oldering
ri ng an dwith
re SOLDER I
(30W~40W).
?? CHA SSIS SCREW check and screw to tight.
?? CRT AQUADAG ground plate (CRT ground copper plate ) and
part connection check , connect to tight.

SonoAce 6000II Sec tion 3-3. Ma gneto Optical Drive.
3.MOD
3.1 MCD3 130AP : Magneto - Optical Drive Characteristics
MCE/MCF3064AP/MCE3130AP
Magneto-Optical Drive
Fujitsu's MCE306 4AP/MCF3064AP series provides capacities of up to 640 mega -bytes on a single disk and
data transfer rates of up to four megabytes per second.
Fujitsu also introduces the MCE3130AP, featuring 1.3GB capacity in 3.5-inch disks. This capacity is
achieved by incorporating magnetically-induced super resolution (MSR) technology, which allows

significantly greater linear and tracking densities.
?? Internal data transfer rates of up to 4.96MB/s (MCE3064AP) and 5.92MB/s (MCE3130AP)

?? Up to 30% faster write performance with O (Direct-Overwrite) media
?? 1.3GB formatted capacity on a single-sided 3.5" disk (MCE3130AP)
?? Full read/write compatibility with conventional ISO standard media (640/540/230/128MB)
High-Performance Rewritable Storage

The MCE3064AP and MCE3130AP optical drives provide high-capacity, high-reliability storage. They are
ideal for backup, archiving, data acquisition, and software distribution. With a native data transfer rate of up
to 4.96MB/s, the MCE3064AP meets the requirements of many of today's demanding applications .
The MCE3130AP provides two transfer rates depending on the MO disk used. With a standard 1.3GB
-1
GIGAMO-standard disk, the maximum transfer rate is 5.92MB/s with 3,214min [RPM] rotational speed. With
-1
a standard ISO disk, the maximum transfer rate is 4.96MB/s with 4,558min [RPM] rotational speed.
Main Features
The MCE/MCF3064AP and MCE3130AP are fully compatible with conventional ISO-standard disks
(640MB/540MB/ 230MB/128MB). Additionally, the MCE3130AP supports a standard 1.3GB GIGAMO disk,
allowing storage of high volumes of user data. The lightweight carriage enables a high-speed seek time of
-1
23ms, and can even handle high rotational speeds of 4,558min (RPM).
No other storage solution offers as many options to tailor the media selection to the application while
providing such a high level of investment protection. In addition, servo-generated noise has been
greatly reduced; the MCE3130AP is 16dBA quiter than its predecessor, MCD3130AP.

3.2 M CE3130AP SPEC
Specifications
Functional MCE3064AP/MCF3064AP MCE3130AP
Storage capacity 128MB 230MB 540MB 640MB 1.3GB
Sector capacity 512 bytes 2,048 bytes
Standard ISO/IEC ISO/IEC ISO/IEC 15041 -
Interface ATAPI
Drive / 1.37 MB/s 1.65 - 2.95 - 2.94 - 3.46 - 5.92
Drive / 1.09 MB/s 1.3 - 2.1 2.33 - 2.32 -
Interface 16.6MB/s (PIO mode 4 with IORDY),
Recording density 1.04 0.87 0.48 0.285
Track de nsity ( µm/bit) 1.60 1.39 1.10 0.90
Random 23 ms (typical)
Full stroke 44 ms (typical)
-1 -1
Rotational Speed (RPM) 3,600 min {RPM} (MCF3064AP) / 4.558 3,214 min
Average Latency time 8.3 ms (MCF3064AP)/6.6 ms 9.3 ms
Recording code 2 - 7 RLLC 1 - 7 RLLC
Load time MCE/MCF3064AP- 7 sec (typical) 12 sec (typical)
Unload time 4 sec (typical)

Unload time 4 sec (typical)
Buffer size 2 MB
Physical Specification
Power Requirement 5VDC±5% 1.1A (typical); 2.5A (max.)
Power Random
5.3 W (typical) 5.5 W (typical)
consumptio R/W
n
Sleep 0.65 W
Dimensions 25.4 x 101.6 x 150.0 mm
Weight 480 g
Operation 5°C - 45°C

Ambient
Non-
temperature 0°C to 50°C
operation
Operation 10% to 85% (non-condensing)

Relative
Non-
humidity
10% to 85% (non-condensing)
operation
Operation 3.92 m/s² {0.4 G} (5-500Hz, sine sweep)
Vibration Non-
9.80 m/s² {1.0 G} (5-500Hz, sine sweep)
operation
Operation 19.61 m/s² {2.0 G} (10 ms, half -sine pulse)
Shock Non-
490 m/s² {5.0 G} (10ms, half-sine pu lse)
resistance operation
Transport 490 m/s² {50 G} (10ms, half-sine pulse)
Operation Less than 3,000 m
Altitude Non-
Less than 12,000 m
operation
Acoustic noise Less than 26dBA
Air flow requirement 0.02m³/min or lower, 0.3 m/s or lower
Reliability Specifications
MTBF 120,000 power on hours
MTTR < 30 minutes
Component life 5 years

3.3 JUMPER SETTING
3.3.1 Default setting (slave setting)
Figure 1 shows jumper settings at factory shipping.
3.3.2 Mode setting
1) Sett ing master device mode
Figure 2 shows the setting for recognizing the master device.

(device 0)
Figure 2. Mas ter device setting
2) Sett ing slave device mode

Figure 3 shows the setting for recognizing the slave device.
(device 1)
Figure 3. Sl ave device setting
3) Sett ing cabl e select mode

Figure 4 shows the master device/slave device setting when the CSEL signal is
connected to the interface. In the example shown in Figure 5 this setting requires a
special interface connection.
Figure 4. Cable select mode setting
Figure 5 shows a cable select example using a special interface cable.

The example connects CSEL of the master device to the CSEL line (conductor) of the
cable, then ground it so that the device recognizes that it is the master. At this time,
the CSEL conductor of the slave device is removed and cannot be connected to CSEL
of the cable, so that the drive recognizes that it is the slave.
Example 1
Example 2
Figure 5. Cable select example

SonoAce 6000II Sec tion 4-2. C able Diagrams.
2.CABLEDIARGAMS
Shrink Tube 5pie 2cm

MOTH(JP2) Shrink Tube 8pie 3cm POWER S/W
° üÅë °üÅë
BROWN 18cm Core / 11cm

BLUE Shrink Tube 16pie 4cm µÞ ¸é
BLUE BROWN
BROWN 60 cm BLUE BROWN
BLUE
Notice : 25 Tubing ÈÄ ¾ç´ ÜÀ» A-BAND-SMALL· Î ¹  ¾î ÁÜ
Name WH - 335 - PWR - 01 Connection MOTH ? POWER SWITCH
KEY J1)
MOTH JP13)
t 9 Orange
i 10Black
12 Black
11Red
8 Black
100 cm
k
e
7 Red
6 Black
r
5 Orange t MO_PWR
4 Black
i
5 Orange
3 Red
k t
2 Black i 6
8
Black
Black
1 Orange e
r 95 cm k 7 Red
e
r
HDD_PWR
15 cm
t 1 Orange
i 2 Black
4 Black
k 3 Red
e
r
Notice1: Twist Pair 3È¸/10cm
Notice2 : 30pie Tubing ÈÄ ¾ç´ÜÀ» A-BAND-SMAL
Notice3 : Core Turn 3È¸
Name WH -335-
PWR-02 Connection MOTH ? HDD,MO,KEY

MO_SIG HDD_SIG * Signal CableÀ» ½Î ° í ÀÖ´ Â

ÆíÁ¶¼±ºÎ º Ð°ú ¿¬°áÇÔ. MOTH(JP4)
7cm
Shrink Tube Core /
Shrink Tube
10pie 15cm Shrink Tube 18pie 4cm
10pie 3cm
°üÅë
Shrink Tube
10pie 3cm
24 cm 78 cm
Name WH- 335- SIG- 01 Connection MO ? HDD? BP
Shrink Tube 3 pie 7cm
EY JP1) MOTH JP8)
r
e
k
t
96 cm 4 cm
Notice1 : 30pie Tubing ÈÄ ¾ç´ÜÀ» A-BAND-SMALL

Notice2 : Core Turn 1È¸
Name WH-332-SIG-19 Connection BODY CHASSIS ? KEY PANEL
TRACK BALL
(TRACK BALL) KEY(JP3)
r
e S
k ti
itc c
k
S e
r
10 cm
Name WH- 335- SIG- 03 Connection TRACK BALL ? KEY

Shrink Tube 3pie

1.5cm Foot S/W
1 VIOLET
3 2 2 VIOLET
4 1 3 PINK
4 PINK
REAR 18 cm
(JP3)
VCR Video IN
4
S
16 cm
it
c
k
e
r
VCR Video OUT

3
14 cm
Echo Printer
5 PINK(4)
5
5
PINK(3) 2
VIOLET(2)
5 VIOLET(1) 12 cm
4 GND(-)
4 SIGNAL(+)
3 GND(-)
3 Shrink Tube 2pie 2cm
SIGNAL(+) Monitor
2 GND(-) ShrinkTube 3pie 1cm
2 SIGNAL(+)
1 GND(-) 1
1 SIGNAL(+)
10 cm
Name WH - 335 - SIG - 04 Connection REAR ? ONITOR, RINTER,
ID
EO, FOOT S/W
UL1007 18AWG
Twist Pair 7 È¸ /20cm Twist Pair 5 È¸ /5cm
33cm 11cm
(FAN1)
r
e BLACK
k
c
i
t
S
RED
MOTH(JP11)
22cm
(FAN2)
Name AY- FAN- 335 - BACK Connection MOTH ? FAN

UL1007 18AWG
Twist Pair 7 È¸ /20cm
20cm 5cm 10cm

(FAN1)
r
e BLACK Twist Pair 5 È¸ /5cm
k
c
i
t
S
RED
MOTH(JP12)
A-BAND-SMALL
10cm
(FAN2)
Name AY- FAN- 335 - BOTT Connection MOTH ? FAN

Sec tion 5-1. Main Features.
1.SA6000IImainfeatures
Premium Image Quality
Fine Digital Beamforming System

Full Digital Signal Processi ng
128 channel system
Application Specific Image
Multimedia Ult rasound
Image filing(management) : More than 40,000 image storage capability

DICOM(network) : DICOM 3.0 Compatibility
D I C OM P r i nt , Sav e, S end
Connection to PC image management software support for DICOM display.
Remote Service
ASIC technology
Increase system reliability

Decrease comp lexity
Power F ull Di git al Si gnal Pro ces sing
ASIC lists
Mid signal processing ASIC
Beamforming ASIC
Wide Band & High Sensitivity Transducers
High resolution & High sensitivity image

Wide Band Imag e
High Density probe
User interface
Easy to learn : In tuitive Operation

Reduce scanning time
Variety ap plication pr ogram :OB/GYN, Urology, Ba sic Caliper

Sec tion 5-2. Tec hnical Spec ifica tion.
2. Technical Specifications
Dimensions
Height : 1011 mm (without monitor) , 130 9 mm (with monitor)

Width : 508 mm
Depth : 610 mm
Weight : 70Kg
Power
Input voltage : 100 ~ 120Vac,

200 ~ 240Vac,
Power
1) 100 - 120VAC 50/60Hz: Max 215 .5(W), Max 317(VA)
2) 200 - 240VAC 50/60Hz: Max 216.1(W), Max 380(VA)
Beamformer
Transmitter
Frequency Range : Wide band system, 1 to 30MHz, depend on probes
Transmit channel : 64 channels
Sound Field parameter : limited by FDA 510K
Simultaneous selective 4 transmit focal points (max. 8 points)
Receiver
Frequency Range : Wide band & Low noise S ystem
Focusing : Fine Digital Beamforming
Sampling Rate : 61.6MHz
Receive r channel : 64 channels
Beamfor mer ASIC
Dynamic Range : 110 dB

Dynamic Aperture & Ap odization
Scan Conver ter
Memory size : 512 x 512 x 8

Gray scale resolution : 256 levels
Depth range : min. 2cm ~ max. 2 4cm (depend on probe)

Apex control : Up / Down
Direction control : Left / Right
Sweep Speed contr ol : 3 steps
Write zoom ( Maximum depth : 3CM)
Loop format change (Top/Bottom, Left/Right)
Cine & Loop Memory
Cine memory : 256 Frames (fast mode)

Loop memory : 4096 Lines
Auto save
Auto run capability : same as acquisition time
Display Cine F rame
Viewing Moni tor
12 inch Non Flickering B/W Monitor
Number of Probe Connections
2 ports , Auto freeze

Probe auto recognize
Languages
English, German, Spanish, Italian, French
DATA entry
Hospital nam e
Patient ID
Patient DATA
Text Annotation
Body Mar ker
User Inte rface
Track Ball
Standard Alpha - numer ic keyboa rd
6 TGC slide Volumes

Menu- driven operation
Fousing Velocity Change
1580 m /sec
1540 m /sec
1460 m /sec
1500 m/sec
Display Modes
2D mode : Single(2 D), Dual(2D/2D)

M mode : 2D/M ,
Bidirectional Harmonic Image
Caliper & measurements
Caliper
B mode : Distance, Angle, Area, Ellipse, Circumference, Volume
Measurements (Calculations)
OB measures
Early Gestation : CRL, GS, YS
Fetal Biometry : CRL, GS, YS, BPD, OFD, HC, APD, TAD, AC, FTA,
FL, TTD, APTD
Fetal Cranium : Cerebellum, OOD, IOD
Fetal Long Bo nes : HUM, ULNA, TIB, RAD, FIB, CLAV, LV
AFI
Umbilic al Artery
Mid Cerebral Artery
Observations and Comments
Obstetric Biometry tabl e list

BPD : HADLOCK, HANSMANN, JEANTY, KOREAN, MERZ,
SABBAGHA, TOKYO, No table, User
HC : HADLOCK, HANSMANN, KOREAN, MERZ, No table , User
AC : HADLOCK, HANSMANN, MERZ , No table, User
TAD : HANSMANN, No table, U ser
FL : HADLOCK, HANSMANN, HOHLER, JEANTY, Korean

MERZ, TOKYO, No tab le, User
CRL : HADLOCK, HANSMANN, KOREAN, NELSON, ROBINSON,
TOKYO, No table, U ser
GS : HANSMANN, HELLMAN, KOREAN, NYBURG, TOKYO
No table, User
APTD : HADLOCK, No table, User
TTD : HADLOCK, No table, User
Orbital : MAYDEN, No table, User
OFD : HANSMANN, No table, User
Cereberium : HILL, No table, U ser
APD : HANSMANN, No table, User
Humerus : JEANTY, No table, User
Tibia : JEANTY, No table, User
Ulna : JEANTY, No table, User
F.W. : Tokyo1, OSAKA, Mertz, Shepard, HADLOCK, HOCDLOCK1~4
HA SM AN N, TO KY O2
Trend function :Di splay and Print trend graph with independent growth table and trend data
table
Report pages : print, Save to Sonoview II Lite, Serial transfer
Cardiology measures
M mode study : Left ventricle, Ao/LA, MV ,
Report function :
Report pages : print, Save to So noview II Lite, Serial transfer
Gynecology Measures
Menu : Uterus, Rt. Ovary, Lt. Ovary, Rt. Follicles, Lt. Follicles
Rt . K idne y, Lt . K idne y, Rt . O va ri an A ., Lt . O va ri an A .
Report function
Report pages : print, Save to Sonoview II Lite, Serial transfer
Urology Meas ures
Residual Pre/Post, PSA - Density Vol, Endorectal Vol
Report Function : Print, and save to floppy diskette

2D Specifications
Scan Mode : Electronic Linear/Curved Linear

Image mode : 2 D, 2D/2D, 2D/M,
Bi di rect iona l H ar moni c Im age
Frame average : 4 steps (Off, Low, Middle, High)
Edge Enhancement : 0 ~ 9 step 1
Dynamic Range control : 50 dB ~ 110 dB, step 1 dB
Apex control : Up / Down
Wide, Normal, Narrow1, Narrow2, Narrow3 , Narrow4
Real Zoom ing
Probe con nection : 2 ports
Gray Scale : 2 56 levels
2D Post curves : 7 types
M mode Specifications
Depth : same as B mode depth

M Post curves : same as B post curves
Sweep speed : 120, 180, 240 Hz
Peripheral Signals
VHS (in/out) : BNC

NTSC/PAL
1.0 V pp / 75 ohms / unbalanced
Serial port
Parallel port
LAN port
USB(Reserve d for future use)
B/W printer remote control
Foot switch
Environment
Storage Range of Temperature and humidity : 5 ?Χ ∼ 40 ?Χ, 5∼9 % ΡΗ

Υσαβλε Ρανγε οφ Τεµπερατυρε ανδ ηυµιδιτψ : 10 ?Χ∼35 ?Χ, 30∼8 5%Ρ Η
Τηε µοστ οπτιµαλ ρεχο µµενδε δ ρανγε οφ τεµπερατυρε ανδ ηυµιδιτψ:17 ?Χ ∼ 23 ?Χ, 40∼60ΡΗ

Multimedia
Operating system : Linux
Image management system
Features
– 2D image save, review, back up
- More than 40,000 image storage capability to built - in HDD
– DICOM send, print

– Basic caliper : distance, ellipse
– Export images to BMP or JPEG format
– Search, delete, preview, sort exam
– E mail send
– Image & report print
– Report save
PC PART
Main CPU : Strong ARM
MOD : 1 .3 Gbytes (optional)
HDD : 20 Gbytes
Net work
Networking by DICOM 3.0 Connectivity
DICOM Storage, Print, Send
Integration with n - SONO Ultrasound PACS Solution

Remote Diagnostics and Service
Probe Lists
C3 - 7ED
EC4- 9ES
C2- 4ES
L5- 9ER
L5- 9EC
HL5- 9ED (TBD) •
HC2- 5ED(TBD)

3D Package
3D Scan method
Free Hand 3D
Photo mode
3D functions
Rotate
Magic Cut
Low/High Threshold Adjusting
Surface/Volume Ren dering Mo de Adj usting

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C ontents

C hapter1. BASIC INFORMATION

C hapter 2. DESC RIPTION OF SYSTEM

C hapter 4. DIAG RAMS

C hapter 5. SPEC IFIC ATION

Servic e Manual Published by C ustomer Servic e Depa rtment

?? Carefully inspect the packing material for obvious si g

punctured, torn, broken,

During formal inspection, you should :

?? Open all packages within

?? Report concealed damage to the carrier within 15 days

Please, unpack the system like following draw.

1.3 Basic features

?? 12 inch B/W monitor and main unit equipped with keyboar

?? Power cord, connection cable and fuse 2)

?? User ’s Guide (1)

?? Ultrasound gel 0.25 L)

Item Description Quantity

CBL-ROUND-NEW GROUND CABLE 1 Inside of Box

GEL-0.25L SONO GEL 0.25L 1 Inside of Box

CNN -BNC-RC AJ BNC/MALE TO RCA/FEMALE

12.5 MONITOR FILTER SEO IL GLASS)

Table) Part List

Service Ma nual Published by C ustomer Service Department

1.4 Option features

Model Name Specification Application

L5-9ER 7.5 MHz / 50mmSmall Parts

Model Name Specification Application

C2-4ES 3.0 MHz/30R/

C3-7ED 4.5 MHz/50R/70DGene ral

?? External VGA M onitor

?? Line Printer : HP DeskJet Series

?? VCR : VHS Type

Service Ma nual Published by C ustomer Service Department

2.1 NOTES TO USERS

?? Incorrect operation, or failure of the user to main

manufacturer or his agent compliance

responsibility for any

?? The following conventions are used throughout the manual

“Note” is used to notify the user of installation, operation, or maintenance

Service Ma nual Published by C ustomer Servic e Depa rtment

2.2 SAFETY PRECAUTIONS

2.2.1 Biological safety

ALARA Ed ucation Pr ogram

Service Manual Published by C ustomer Servic e Department

Service Manual Published by C ustomer Servic e Department

2.2.2 Electronic Safety

Detail 2. SA 6000II Main Console Safety Ground

Service Manual Published by C ustomer Servic e Department

Electrostatic discharge ( ESD), commonly referred to as a static shock, is a

Service Manual Published by C ustomer Servic e Department

2.2.3 Mechanical Safety

The system has a brake for the front wheels.

release. Release the g

?? Moving the system

Only the front wheels are steerable on the system. Theref

spaces, use repeated

If the system behaves abnormally af ter moving the system,

department or your local representative. On rare occasio

and can withstand considerable shock, but excessive shock m

Isolated patient connection (Type BF applied part ).

I and O on power switch represent ON and OFF , respectively.

Identifies equipotential ground.