DESIGN OF MEDIUM VOLTAGE Prepared by A.Srinivasan,B.E., SREE SWITCHGEARS & CONTROLS. COIMBATORE.« Peddilddd tdi ddd ddd dd dd | A oh AR RR teeter meme gargs sant ane = I thank all the members of ‘Electrical Installation Engineers Welfare Association’ having given me an opportunity to share the technical knowledge as I know to some extend thro’ this write up on Medium Voltage Busbar & Busduct Design. 1 hope this will be useful to the Practising Engineers & Contractors. I hope that I have covered all the area pertaining to Busbar Design. If at all any particulars left out or wrongly specified please feel free to inform me for further correction, deletion & addition. Regards A.SRINIVASAN Prete tee eee a aet t MEDIUM VOLTAGE BUSDUCT DESIGN In ‘ion : Busbar is a device to receive the total power from the source & distribute to various circuits connected to that. It consists of solid Electrical conducting material such as Aluminium or Copper. Normally in M.V. installation the busbars made out of Aluminium / Copper sections fixed on the insulators enclosed in ; } } i : i non magnetic or magnetic enclosures. While transmitting higher current in M.V.Installation we have to provide number of L.T.Cables. Wherein connecting the same to Transformer / Generator Terminals and switch boards is a cumbersome work. To avoid this solid Copper / Aluminium bars are used in an enclosure. The performance of busbar in the enclosure for indoor / outdoor use is subject to following parameters. 1) Conductivity of materials used. 2) Temperature rise during full load current & short circuit. She eee 6 beeen eee eeedaee a, SEEIES ESE IIE EIIIE IV IEE?Pbdd ES ddd bdbddddddd ddddd ld ld lll lle | 3) Power losses & voltage Drop 4) Forces acting on busbar during short circuit & withstanding capacity. 5) Altitude above mean sea level where we are using. 6) Skin Effect & Proximity effect 7) Painting of busbars. While designing the Busbar / Busduct we have to take into account the above and suitable derating factors should be applied and adequacy of Electrical & Mechanical features verified. Now we can discuss the above in details re oaths tn ee Aetna eae FreeeUSES II EIS o db ddd db d Ji IIIT LEE Se Jeera ena a ear ae a REE A RR AE te AAR A 1) Temperature Rise : 1) The operating temperature rise of busbar must be imited to a level at which there should not be a) Long term deterioration of the conductor, joints or the equipments connected to bus. b) A reduction Mechanical strength of busbar. 2) In Normal practice the temperature rise must not exceed 50°C on an ambient having a peak value of 40°C & average value of 35°C. Hence the total temperature should not exceed 85°C. The ambient temperature given here is not atmospheric temperature. It Is the temperature surrounding busbar. 3) The busbar material may be either Copper or Aluminium. Hence the busbar carrying the same current must dissipate the same amount of heat per unit surface area for equal Temperature Rise. AE EE HR dicted cele ed eddie led de te ede tee© ‘ I i } ; ‘ { ; ‘ ‘ i ; ; é i i ‘ i i i ; : ; ; ; i ‘ é ‘ i ; i i i ; ; i t a 4) To have the same Temperature Rise for the same current in Aluminium bar compared to Copper bar following measures should be taken case. a) The thickness of Aluminium bar should be increased 50% of Copper thickness. Example : Cu.100x6mm., Al: 100 x 9mm. In this case weight ratio will be 2.9 b) Alternatively increase the width of Al. by 25% of width of copper.In this case weight Ratio will be 2.63. 5) Ratio of Cross sectional Area of busbar to Enclosure Area plays a major role in limiting the Temperature e. The deratign#factor is to be applied as per the tabulation enclosed (Annexure ~ II) 2) Voltage Drop 1) This is mainly due to Reactance which can be minimized by making the busbar spacing small. 2) In multiple runs of busbar / phase if close spacing is provided between the busbar without Proximity effect will araise which will increase the resistive voltage Drop & corresponding Losses. bn ane hannah eae ete geen hte Ate te ana eet th ana eee ee. ddbdddddddddd du SEITE TIS EI Sd ag 2 ¢ FAP EAL ALAA ATE 3) Moreover the effect of reducing space will increase the Electro-magnetic force on busbar for a given fault current. 4) This must be countered by providing stronger or closer supports: 5) Larger spacing will save the cost of supports i 6) The ideal spacing between busbars of same phase should be thickness of bar used. For a 415V busbar the min. clearance should be a) To earth in air 19mm (Open) 16mm (Enclosed) b) Between Pharas in 25mm (Open) 19mm (Enclosed) 3) Alti The busbar intended for use at high altitude is tested near Sea Level, the limit of temperature rise should be reduced by 1% for each 300mts. excess of 1000 Mtrs. above sea level at which busbar is to be installed. The correction factor should be applied as per the table given in the Annexure-III-A. goes than a siete ste dec tech deleted tenet e-t-testetelteteteete teetePYveeseeVveseveeyvusevuvvuuvseeueunvvuVvVdv Ve suger pep eeeace eases ne cccecrecetoecasseaseeescuseereecest 4) Forces acting on Busbar + a) Weight b) Expansion Force c) Electromagnetic Force 1) Expansion joints should be provided at the interval of every 5Mtrs. and the ends of connecting equipments to arrest the longitudinal force which will stress the material & damage the insulators due to short circuit forces. 2) Electromagnetic force which is larger than all forces running perhaps to 100 Kgm? / Mtr. run or even more under the mostsevere short circuit conditions. 3) Electromagnetic force will act in the same direction as the weight. 4) Hence it is suggested to have a support at every 500mm & Provide the busbar arrangement invertical position to avoid heavy damage during short circuit. 5) If 2 or more runs of Busbars are provided spacer equivalent to Bus thickness should be provided at every 500mm interval. é Jie ae eet ere ete te Et ah ah REE A} Ii Ye A RT Rt At tt aan 5) Current Distribution & Inductive Effects : 1) A.C. Current Distribution is controlled by Inductive effect as well as by Resistance. ‘e i i i ; i ¢ 2) Hence the current density varies over the section in magnitude & phase based on the magnetic flux produced in the base. 3) The inductive effect due to the current in the conductor itself is known as SKIN EFFECT which results higher Uniform current density in the outer section of the conductor. ; i i i & * : I conductor varies depends on the SKIN DEPTH i; character of material i 5) The Current density may be distorted by the current in i adjacent conductors. This effect is called PROXIMITY i EFFECT. : 6) Due to Proximity effect the Current density of the i outer surface of the conductors facing each other will t } i : i : { a ¢ 4 ‘ 4 ; ‘ ‘ i } ' t t : ‘ ‘ ; } 4) The current density on the outer section of the i t 4 ‘ } } ; ; e é ‘ ‘ ‘ i. be reduced. 4 ; : i ‘ IEE IIS IIIS IS LI IIE EEE IF I IE ISSA T =, » 4Jee ET EL RT ew Joining of Busbar : 1) The joining of busbars may be done by two methods as normal practice. 1) Over lapping each other <8 __+ 0 0 0 A &B - 2 Busbars over lapping each 2. ? other : a A 2) By providing Splice Plates (Fish Plates) Cc <— oo o 0 A & B — Busbars 0 C - Fish Plate SSS A B In over lapping method disposition of busbar will happen which cannot be identified & hence the joining busbar with Fish Plates is preferable. 2) In the above both cases the over lapping length should be equal to width of busbar used. 8 JES IIS EES EE STITT EIS III III IID IE frown ener c ee eee SEER EMEA Te eT AEEY 3) In the case of copper bus at joints Tinning / plating should be done. 4) Tinning of Aluminium bar can also be done with self- abrasive solder such as one having a nominal composition of 70% tin. & 30% Zinc. 5) The grease used as joint compound will protect an indoor installation in clean surroundings. 6) The bolts used for busbar joints should be of steel bolts of high tensile strength, aluminized or electro- galvanised & Hexagonal heads. The min. tensile strength of the bolt should be of 45 ton / Sq in. 7) For every bolt suitable Plate washer & spring washer eae sen shae tenant tee anager teat an nate should be provided. 8) As a general Guide Bolting schedule is given in Annexure. Painti f Busbar : The busbars should be painted with Black matt finished paint by which the Rating of busbar will be increased by 20%. Yo arr sea eI REE RHE IEE Otte than eta ea ttt Ahh ttt Jee eee ea ana Dbddb ddd bd’ bddddddlddddddd ddl dd da — f¥ { : ' t ; ; ' : ? j ; : ; i : t : : # # i i ! i i : 3 ? 1 Enclosure : The Busbar enclosure should be fabricated with minimum 2.0mm thick CR sheet. Louvers with fine wire mesh should be provided at equal distance for ventilation. For outdoor use suitable canopy arrangement should be provided. She ircuit wi inding cal of Busd During short circuit heavy current will flow in the Busbar which will result higher temperature rise & development of Dynamic Force between busbars. Hence the adequacy of following should be verified. 1) Cross section Area of busbar to withstand Temperature Rise. 2) With standing of Busbar & supports due to Dynamic force developed. For the above the calculation procedure is as follow: 1) Cross section area of Busbar for Temperature Rise : Ix vt 0.0775 for Al. & 0.122 for Copper. A 10 ea Joe ee i aa EAN RE TE A Aebbddb bd bd bdd db ddd ddd bd dU dds 2) Dynamic Force 16 x I2 x 10x K Dynamic Force Fm = $s Short Circuit Current in Amps K Space factor for Rectangular bar should be obtained from Graph. (Annexure VII) It depends upon the Thickness & width of conductor & spacing. Dynamic Force Fm = Kg./mtr. = B Kg./Mtr. Static force between supports = B/2_ Kg./Mtr. B/2xL Corresponding stress = Kg. / cm? 12W Where W = Modules of section =4 for Al. L = Distance between supports B/2xL Hence stress willbe = - Kg. / cm? wa jos cece nce re scene ennStress in supports The Max. force in support should not exceed the static force between conductors (i.e.) B/2. 2x WxtCm2. The shearing area = Wherein W = Width of the bar in Cm t = thickness of the bar in Cm Force in supports Hence the insulation stress Shearing Area This should be less than that of Tensile strength of supports used. (For SMC 700 Kg. / Cm? & For Hylam 500 Kg./ Cm2) Heavy noise is produced in most of the Busducts while applying full load Current. This is mainly due to a) Reduced size of busbar b) Long interval for busbar supports ing adequate spacers at adequate interval. c) Not provi 12 foe eee ee eee te EEE I A th tee Jee nate nan Ae At tn th Ah A A bbddS bd Eb ddd ddddd db ddddddd dd ld ddaFE rear th ete tt Eee get se badd S SIN db ddd Edd dd IIE | Yer ar NEHA APRA AAR A A A RA ¢ t t 4 ; ‘ ' d) Not providing spring washers for the joints & take of points. e) Reduced section of enclosure with reduced thickness of sheet steel f) Not providing adequate space between Phase to Phase busbar resulting Skin Effect & Proximity Effect which result heating & noise. g) Non provision of flexible to allow expansion of bars during temperature rise h) Harmonic produced in the system. jon It Is assured that if the design given here is followed for making Busduct, abnormal Temperature Rise & noise will not happen. ren 1) Hand Book of INDAL ALUMINIUM BUSBAR 2) The J & P Switchgear Book by R.T.Lythall. 3) Aluminium busbar by A.G. Thomas & P.J.H.RATA 13 Fee crater ern tte tenth cite ate ee eeae ean ae eh