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APPLIED PHYSICS LETTERS 112, 173502 (2018)
Beta-phase gallium oxide (b-Ga2O3) is a promising can- high breakdown fields above 5 MV/cm for vertical Schottky
didate for electronic device applications because of the large diodes12 and 3.8 MV/cm for lateral MOSFET transistors have
bandgap energy (4.7 eV) and the expected high breakdown been reported,16 which have already surpassed the material
field of 8 MV/cm.1 Significantly, b-Ga2O3 is the first wide limit for GaN and SiC. While excellent device performance
bandgap material that can be grown from the melt, which has been demonstrated using homoepitaxial b-Ga2O3 device
makes it feasible to achieve large area bulk substrates on a structures, the b-(AlxGa1-x)2O3/Ga2O3 heterojunctions have
manufacturable scale.2–6 The expected good transport prop- remained under-explored.
erties (a mobility of >200 cm2/Vs, and a saturation velocity Preliminary demonstration of modulation-doped field
of 2 107 cm/s)1,7–9 make b-Ga2O3 very promising for a effect transistors (MODFETs) using b-(AlxGa1-x)2O3/Ga2O3
range of technological applications including high power heterostructures has been reported.22–24 Sheet charge densi-
electronics, detectors, and high frequency transistors. Further ties above 5 1012 cm2 were measured based on either Si-
bandgap tunability can be realized through the introduction delta doping22 or Ge doping23 in the b-(AlxGa1-x)2O3 layer,
of In and Al into b-Ga2O3, leading to b-(In,Ga)2O3 and b- but the presence of parallel conduction through the low
(Al,Ga)2O3 alloys. b-(Al,Ga)2O3 is expected to be stable in mobility channel in the (AlxGa1-x)2O3 layer compromised
the monoclinic phase over a broad range of compositions, and the transport properties of the two-dimensional electron gas
the bandgap can be tuned from the bandgap of b-Ga2O3 (2DEG). In this study, we show a direct evidence of a quan-
(4.7 eV) to above 6 eV.10,11 This enables the realization of sev- tum confinement of electrons at the b-(AlxGa1-x)2O3/Ga2O3
eral semiconductor heterostructure designs such as modulation- interface based on temperature-dependent Hall measure-
doped electron channels, quantum wells, and superlattices in ments and Shubnikov-de Haas (SdH) oscillations. We dem-
this semiconductor system. onstrate the room temperature mobility of 180 cm2/Vs and
Recent efforts have led to the demonstration of various the low temperature mobility of 2790 cm2/Vs achieved using
device structures with excellent performance, including the modulation-doped structure.
Schottky diodes,12,13 metal-oxide-semiconductor field effect Figure 1(a) shows the b-(AlxGa1-x)2O3/Ga2O3
transistors (MOSFETs),1,14–21 and metal-semiconductor field MODFET structure studied in this work. The samples were
effect transistors (MESFETs).1 Experimental observations of grown on a (010)-oriented Fe-doped semi-insulating b-
Ga2O3 substrate using oxygen plasma-assisted molecular
a)
Authors to whom correspondence should be addressed: zhang.3789@ beam epitaxy (PA-MBE).25,26 It consists of an unintentionally
osu.edu and rajan@ece.osu.edu doped (UID) b-Ga2O3 buffer layer, a 4.5 nm b-(AlxGa1-x)2O3
FIG. 1. (a) Schematic epitaxial stack of the MODFET structure. The UID buffer layer thicknesses are 130 nm and 360 nm in samples A and B, respectively. Here,
AlGaO represents (AlxGa1-x)2O3. (b) XRD of the (020) diffraction patterns. Both samples showed 18% Al content. (c) Equilibrium energy band diagram and calcu-
lated 2DEG charge distribution.
spacer, a Si delta-doped layer, and a 22.5 nm b-(AlxGa1-x)2O3 self-consistent description of the system. Detailed studies using
cap layer. The growth details could be found in the supple- independent sample series may be necessary to extract these
mentary material. Two samples were compared in this study, parameters accurately.
with the only difference being the UID b-Ga2O3 buffer layer To achieve ohmic contact to the channel, the contact
thickness, which is 130 nm and 360 nm for samples A and B, regrowth of nþþ Ga2O3 with a high Si doping concentration
respectively. The (AlxGa1-x)2O3 layer thickness and the Al above 1020 cm3 was carried out using SiO2 as a regrowth
composition were estimated to be 27 nm and 18%, respec- mask. The contact regrowth and device fabrication processes
tively, for both samples, based on high resolution XRD mea- are described in the supplementary material. The highly
surements of the (020) diffraction [Fig. 1(b)].27 The observed degenerate doping prevented carrier freeze-out at cryogenic
diffraction fringes indicate sharp heterointerfaces. Both sam- temperatures and ensured the reliability of the low tempera-
ples showed smooth surfaces with a RMS roughness of ture electrical measurements. Ohmic contacts were verified
0.45 nm obtained from AFM measurements as shown in by transfer length measurements, with extracted contact resis-
Fig. S1. tances of 9.3 X mm for sample A and 4.1 X mm for sample B,
The energy band diagram of the MODFET structure was which were limited by the sidewall contacts between the
obtained based on a self-consistent solution of the Schrodinger- regrown contacts and the low charge density 2DEG channel.
Poisson equation assuming a conduction band offset (DEC) of Temperature-dependent Hall measurements were carried
0.4 eV, a surface depletion barrier of 1.4 eV, and a back- out using a van der Pauw structure with regrown nþþ Ga2O3
depletion due to the Fe-doped semi-insulating substrate (assum- contacts, as shown in Fig. 2. Both samples showed a weak
ing the Fermi level pinned at the midgap), as shown in Fig. temperature dependence in the measured carrier density,
1(c). A 2DEG is expected to form at the (AlxGa1-x)2O3/Ga2O3 which dropped from 1.12 1012 cm2 to 1.07 1012 cm2
interface. When a donor concentration of 4.7 1012 cm2 was in sample A and from 2.25 1012 cm2 to 2.05 1012 cm2
adopted in the delta-doped layer, the simulated 2DEG density in sample B upon lowering the temperature. This is in con-
increased from 1.12 1012 cm2 to 1.50 1012 cm2 as the trast to carrier freeze-out in bulk-doped b-Ga2O3 at low tem-
buffer layer was increased from 130 nm to 360 nm because of a peratures28 and serves as a direct proof of a degenerate
corresponding reduction of backside depletion. It should be electron gas with no parallel conduction in the (AlxGa1-x)2O3
noted that the parameters adopted for the band simulations are barrier layer. Using a higher Si sheet density in the delta-doped
based on the best estimates we have currently and do provide a layer led to partial freeze-out of charge at low temperatures,
FIG. 2. (a) Temperature-dependence of charge density measured using a van der Pauw configuration as shown in the inset. (b) and (c) Experimental and calcu-
lated electron mobilities for sample A (b) and sample B (c) by considering various scattering mechanisms, including polar optical phonon scattering (lPOP),
remote impurity scattering (lRS), background impurity scattering (lbackground), interface roughness scattering (lIFR), and acoustic deformation potential scatter-
ing (lADP). The b-Ga2O3 material parameters used in the calculations are m* ¼ 0.313m0, static dielectric constant es ¼ 10.2, high-frequency dielectric constant
e1 ¼ 3.57, sound velocity vs ¼ 6800 m/s, mass density q ¼ 5880 kg/m3, acoustic deformation potential nADP ¼ 6.9 eV (Ref. 32), and polar optical phonon
energy nPOP ¼ 44 meV.
173502-3 Zhang et al. Appl. Phys. Lett. 112, 173502 (2018)
1 A sinhðvÞ pm 1
ln ¼ C2 ;
4 R0 v esq B
FIG. 5. (a) Output characteristics measured with gate bias VGS from 2 V to 0 V at a step of 0.25 V. (b) Transfer characteristics measured under a drain bias of
VDS ¼ 10 V. (c) RF characteristics measured at VDS ¼ 10 V and VGS ¼ 1.5 V. The gate length, gate-drain spacing, and source-drain spacing of the device are
LG ¼ 0.7 lm, LGD ¼ 0.7 lm, and LSD ¼ 1.8 lm, respectively.
173502-5 Zhang et al. Appl. Phys. Lett. 112, 173502 (2018)
16
mobility values allowed for the observations of the SdH oscil- A. J. Green, K. D. Chabak, E. R. Heller, R. C. Fitch, M. Baldini, A.
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We acknowledge funding from the Office of Naval 111(2), 023502 (2017).
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E. Ahmadi, O. S. Koksaldi, X. Zheng, T. Mates, Y. Oshima, U. K. Mishra,
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