Scribd
Upload
424 views143 pages

Engineering Product Design Course Guide

The document provides an overview of topics related to engineering product design including product development processes, power supply design, noise considerations, grounding and shielding techniques, PCB layout guidelines, component assembly, automation in PCB design, soldering, packaging, parasitic elements in high speed PCBs, mounting components in vibration environments, multilayer PCB testing, hardware design and testing methods using equipment like logic analyzers, spectrum analyzers, oscilloscopes, and considerations for signal integrity and Monte Carlo analysis. It also discusses product testing, EMC testing, environmental testing, and documentation requirements.

Uploaded by

Charles Unlocks
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
424 views143 pages

Engineering Product Design Course Guide

The document provides an overview of topics related to engineering product design including product development processes, power supply design, noise considerations, grounding and shielding techniques, PCB layout guidelines, component assembly, automation in PCB design, soldering, packaging, parasitic elements in high speed PCBs, mounting components in vibration environments, multilayer PCB testing, hardware design and testing methods using equipment like logic analyzers, spectrum analyzers, oscilloscopes, and considerations for signal integrity and Monte Carlo analysis. It also discusses product testing, EMC testing, environmental testing, and documentation requirements.

Uploaded by

Charles Unlocks
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

 Calculations of parasitic elements in high speed PCB.

High speed PCB


ECE 511 – ENGINEERING PRODUCT DESIGN design and points to be considered for designing the high speed PCBs

Jack Onyango, AMEI, GEng, MIEK  Mounting in presence of vibration. SMD assemblies

Course Description  Board layout check list. Tests for multilayer PCB

Product Design and development (Chapter 1 & 2) Hardware design and testing methods (Chapter 5)

 An overview of product development & product assessment, Pilot  Logic analyzer, its architecture & operation and Use of logic analyzer
production batch, Concept of availability, Screening test, Environmental
 Spectrum analyzer
effects on reliability, Redundancy, Failsafe system, Ergonomic &
aesthetic design considerations, Packaging & storage  Network analyzer,
 Estimating power supply requirement (Power supply sizing), Power  Oscilloscope , DSO trigger modes
supply protection devices
 Examples using MSO
 Noise consideration of a typical system, Noise in electronic circuit,
Measurement of noise  Signal integrity issues

 Grounding, Shielding and Guarding  Use & limitations of different types of analysis

 Enclosure sizing & supply requirements & materials for enclosure and  Monte Carlo analysis
tests carried out on enclosure Product testing (Chapter 7)
 Thermal management and its types  Environmental testing for product. Environmental test chambers &
PCB designing (Chapter 3 & 4) rooms. Tests carried out on the enclosures

 Layout, PCB sizes, Layout general rules & parameters.  Electromagnetic compatibility (EMC) with respect to compliance.
Recommendations for decoupling & bypassing. Design rules for digital Electromagnetic compatibility (EMC) testing. Conducted emission test
circuit PCB & analog circuit PCBs (time domain methods). Radiated emission test

 Noise generation, Supply & ground conductors  Basics on standard used. Instrument specifications

 Multilayer boards Documentation (Chapter 8)

 Component assembly & testing of assembled PCB, Bare boardtesting.  PCB documentation- Specifying laminate grade, drilling details, PCB
Component assembly techniques finish- Tin, solder, gold, silver plating, hot air leveling, and bare board
testing. Understanding advantages and limitations of each
 Automation & computers in PCB design, Computer aided design ,
Design automation  Product documentation- bill of materials, Production test specification-
a case study for real circuit, Interconnection diagram- A case study.,
 Soldering techniques, Solderability testing Front and rear panel diagrams for selected product
 Study of packages for discrete devices & ICs, IC reliability issues.  Manuals- Instruction or operating manual, Service and Maintenance
manual, Fault finding tree.
 Parasitic elements

You might also like