Process standardization

Screen printing

Locap document number NP.02

Edition: Modification Date Validation

1 Creation of the document 15/12/08 C FLOURY

2 Chap 3.2 & chap 5.5 25/05/09 C FLOURY

1. Material and consumable:...........................................................................................................................................................................2

1.1. Stencil material:......................................................................................................................................................................................2
1.2. consumable: .............................................................................................................................................................................................2
2. Paste:..................................................................................................................................................................................................................2
2.1. Qualified solder paste:...........................................................................................................................................................................2
2.2. For information: pastes used on old products or specified by the customer:...............................................................................3
3. Solder paste management:...........................................................................................................................................................................3
3.1. Paste “out of the fridge”:.......................................................................................................................................................................3
3.2. Paste in production:................................................................................................................................................................................4
3.3. Lead / lead free poka yoke:....................................................................................................................................................................4
3.3.1. DEK machine:.....................................................................................................................................................................................4
3.3.2. MPM machine:....................................................................................................................................................................................4
4. Apertures definitions & stencils historic:................................................................................................................................................4
4.1. Apertures rules: .......................................................................................................................................................................................4
4.2. Historic and management of stencil creation and evolution:..........................................................................................................4
5. Definition of the parameters:......................................................................................................................................................................5
5.1. Squeegee definition & paste quantity:.................................................................................................................................................5
5.2. Process specifications:...........................................................................................................................................................................6
5.3. Printing parameters DEK & MPM: .....................................................................................................................................................6
5.4. 2D Vision parameters:............................................................................................................................................................................6
5.4.1. DEK:......................................................................................................................................................................................................6
5.4.2. MPM: ....................................................................................................................................................................................................7
5.5. Modifications & tooling management:................................................................................................................................................7
6. Process control:...............................................................................................................................................................................................8
6.1. Thickness and aspect control :..............................................................................................................................................................8
6.2. 2 D board inspection:.............................................................................................................................................................................8
6.3. Visual inspection on line:.......................................................................................................................................................................8
6.4. Machine capability:................................................................................................................................................................................9

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 Process standardization

Screen printing

1. Material and consumable:

Key points :
Stencil and cleaning system
1.1. Stencil material:

Kind of component Thickness Particularities

No QFP pitch < 0.5 mm 150 µm Stainless steel cut laser
No BGA pitch < 1 mm Nickel cut laser

BGA pitch 0.75 or 0.8 mm 125 µm Stainless steel cut laser

Nickel cut laser

QFP pitch < 0.5 mm 125 µm Nickel electro formed

(ex = 0.4 mm)

Specials rules for QFN or

specifics components.
If ratio > 0.6 150 µm Stainless steel cut laser
If ratio < 0.6 125 µm Stainless steel cut laser

Ratio à Rd = area aperture / (stencil thickness x Aperture perimeter) > 0,6

1.2. consumable:
For the cleaning system, the process is performed with the vacuum and with the dry sequence as described
chapter 1.4.3
For the DEK machine, cleaner blue
Paper reference : Micro care MCC-105DA
Lacroix reference : 0450185800A
For the MPM machine,
Paper reference : Micro care MCC-105EA
Lacroix reference : 0450185800A

2. Paste:
Key points :
Qualified solder paste
For information : Paste used on old product or specified by the customer

1.1. Qualified solder paste:

The qualified solder pastes are the only ones to be uses for new products. If a customer specifies on other one,
discussion must be take place to propose the Lacroix standard.

Lead :
Designation ?
/ MULTICORE MP101
Characteristic No clean
?
References : 0450205100A

Composition : 80 %Sn63Pb37
20%Sn62Pb36 Ag2

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 Process standardization

Screen printing

Lead free :
Designation ?
/ COOKSON OM338-T MULTICORE LF318
Characteristic No clean No clean
?

References : 0450214700A 0450195800L

Composition : SAC 305 SAC 387

2.2. For information: pastes used on old products or specified by the customer:
Lead process :
Paste No Clean KOKI Ref / SE4-M953i à Sn63, Pb37
Paste Clean AVANTEC Ref / DMH0524 à Sn62, Pb36, Ag2
Paste No Clean INDIUM Ref / SMQ 92 J à Sn62, Pb36, Ag2
Paste No Clean KOKI Ref / SE4-M953i à Sn63, Pb37

Lead free process :

Paste No Clean MULTICORE Ref / LF 300 à SAC 387
Paste No Clean MULTICORE Ref / LF 310 à SAC 387

3. Solder paste management:

Key points :
Management “out of the fridge”
Reuse of solder paste at the end of the lot
Lead / lead free poka yoke

3.1. Paste “out of the fridge”:

The pot must be removed out the fridge 2 hours before the utilisation.
For the first time, when you remove the pot of the fridge you must :
glue and inform the specific label (date and time).
verify the placement of the Lacroix UM label.
control that the pot life is not over.

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 Process standardization

Screen printing

3.2. Paste in production:

In production :
Ä The maximum delay for a pot open and out of the fridge is 72 hours (3 days), the pot must be closed
hermetically after each utilisation.
Ä Before each paste deposit on the stencil, mix the paste during 3 minutes.
Ä At the end of production, the paste remaining on the stencil is put back inside the initial pot for further
reuse.

Case 1, temperature variation in the production hall.

Ä The maximum delay for a pot removed of the fridge and not open is 120 hours (5 days).

Case 2, no temperature variation in the production hall.

Ä The maximum delay for a pot removed of the fridge and not open is 4 weeks.

3.3. Lead / lead free poka yoke:

3.3.1. DEK machine:

In production :
Ä Used on the PC desk the software which
compare the paste reference between the screen
printing sheet and the label on the pot.

Bare code described in the screen printing sheet

Bare code installed on the pot

3.3.2. MPM machine:

Must be defined …

4. Apertures definitions & stencils historic:

Key points :
Apertures rules
Historic & management of files

4.1. Apertures rules:

The apertures rules are defined in the files
For lead à “apertures stencil for lead process _ Edition X”
For lead free à “apertures stencil for lead free process _ Edition X”

This files are under SPM process engineer responsibility.

4.2. Historic and management of stencil creation and evolution:

Each site has to update a specific file recording the evolution of the stencil used for each product and the specifics
points. The purpose of that is :
Tracking of tooling evolutions for each product / mandatory for EN 9100 & ISO TS
Experience feedback for evolution of the apertures rules

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 Process standardization

Screen printing

The historic is recorded in 3 separated files and following the specific format :
File for France: stencil historic_SPM
File for Poland: stencil historic_KWZ
File for Tunisia: stencil historic_ZRB

Format:
PRODUIT & DATE RESPONSABLE POINTS PARTICULIERS RESULTATS EDITION
SITE PRODUIT
SPECIAL INFORMATION OR APERTURES RESULTS EDITION
DATE LEADER OF THE
PRODUCT & PRODUCT
SITE

VA01058 - 15/07/2007 Piotr Józwiak * stencil thickness 150 um OK 1

bixenon * finish Cu + OSP
* modification of the T1 DPAK apertures –
solder beading due to one big aperture under
T1 component -> changed with Cookson design
(multiapertres & reduction)
* for the other apertures --> standard
Lacroix
VA10001 - 04/07/2007 Marek Redmer * bottom side
saab * stencil thickness 150 um OK 2
* recess to 125um for QFP ( x 4 )
* for the other apertures --> standard
Lacroix
OK 2
16/04/2008 * top side
* stencil thickness 150 um
* home plate design for chip resistors (
solder beading)
* for the other apertures --> standard
Lacroix

5. Definition of the parameters:

Key points :
Squeegees definition
Process specifications
Parameters specifications
2 D vision parameters
Parameters & tooling modification

5.1. Squeegee definition & paste quantity:

- Different length and colour are available for squeegees

Length of PCB Squeegee length Grey squeegees Green squeegees

accepted
L < 200 250 mm Lead process Lead free process

200 < L < 250 300 mm

250 < L < 300 350 mm

300 < L < 350 400 mm

350 < L < 400 440 mm

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 Process standardization

Screen printing

- On the screen printing machine, you must set the parameters “intermediate height” at 15 mm. This parameter
inform the machine that the height between the squeegee and the stencil is 15 mm (see the drawing below ). The
gasket of the paste must be check by the operator at each lot limit stop (each 20 boards). If the gasket paste is
cut add paste to have a gasket about 20 mm height.

lead free squeegee

lead free paste In this case, it is

necessary to add
H= 15 mm
paste

stencil

5.2. Process specifications:

ü Control priority, component to be inspected:

- 100 % BGA, µBGA, QFN, QFP < 0.5 mm.
- Inspect other component until the printing control cycle time does not exceed the placement time,
with the follow priority :
Fine pitch 0.5 mm
Extension of the board corner and the 0.6 mm pitch
Other

5.3. Printing parameters DEK & MPM:

Squeegee Squeegee Squeegee Squeegee Squeegee

Pressure front / rear 250 300 350 400 450
4.4 < P < 5.6 4.8 < P < 7 4.8 < P < 7.4 5.5 < P < 8.5 6.5 < P < 9.5

Speed of the Speed of the Length of the Cleaning

Cleaning
printing demould demould cycle & speed
frequency
mm/sec mm/sec mm mm/sec

* board with QFN, BGA or 5

component pitch < or = 0.5 V/D/D
mm Vacuum = 10
35 5 3
Dry = 40 10
Dry = 40
* Others

5.4. 2D Vision parameters:

5.4.1. DEK:

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 Process standardization

Screen printing

Vision 2D

* component with pitch > 0.5 mm • Coverage = 70%

• Stencil inspection, mode inactive
• Board inspection, mode basic
Alignment : inactive
* Specifics components, pitch > = à
0.5 mm, type QFN, BGA Paste on Pad: active
Bridging : inactive

• Coverage = 70 %
• Stencil inspection, mode inactive
* component with pitch < 0.5 mm • Board inspection, mode advanced
Alignment : inactive
Paste on Pad: active
Bridging: active

5.4.2. MPM:
Vision 2D

• Coverage = 70 %
* all components types • Stencil inspection, mode active
• Board inspection, mode active
Paste on Pad: active

5.5. Modifications & tooling management:

- The screen printing parameters are recorded inside the follow sheet.

- This sheet is printed for each lot, placed on the screen printing machine and destroyed at the end of the lot.

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 Process standardization

Screen printing

- The tracking of the screen printing parameters (support, pressure, stencil N°, program N° ….) is done throughout
this document (mandatory according the EN 9100 & ISO TS ).
- Archiving of these documents is done locally on each site.

- Alternative method to follow the screen printing parameters. All the points described above are included in the
MAC documentation, in this case, the tracking of the screen printing parameters (paste, support, pressure,
stencil N°, program N° ….) is done throughout this document (mandatory according the EN 9100 & ISO TS).

6. Process control:
Key points :
Thickness and aspect inspection at the start of each lot.
2D board inspection on selected patterns of 100 % of boards.
Visual inspection on line.
Machine capability.

6.1. Thickness and aspect control :

- Measurement done between: top of solder and surface of the solder resist.
- Frequency : each start of the lot.
- Number of the measurement points : 5 points
- Localisation : 4 in the corner
1 in the center, include a fine pitch in the measurement
- Values :
Stencil thickness 150 µm target 180 µm // tolerance +/- 45 µm
Stencil thickness 125 µm target 145 µm // tolerance +/- 35 µm
- These values are archived locally on each site.

6.2. 2 D board inspection:

Description of the patterns control with the 2 D automatic control :

stencil

VISION 2 D, inside the specific windows, control the

camera stencil apertures and the paste deposit on the pcb
pcb pad, 100% of the pattern.

Pad layout

Control
6.3. Visual inspection on line:
A binocular is installed on a conveyor after the screen printing machine or is available on a support, at this station, we
will check the shape of the plot following the instruction criteria, this control
must be apply for :
The first unit at the start of the production.
The 5iem board after the start of the production.
After each lot limit stop.
After each additional paste.
After each removal of stencil.
Example of the visual inspection after the printing machine à

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 Process standardization

Screen printing

6.4. Machine capability:

The result and the analysis of the screen printing capability is followed by the process engineer of each site. This
capability is performed :
After each preventive maintenance level 4 (logged on SAP).
After break down on the axis or the camera.
After calibration.

The calibration is performed following the instruction described in the preventive maintenance documentation and after
an incorrect capability result.

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