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Features D
� 7A,650V,RDS(on)(Max1.38Ω)@VGS=10V
� Low Crss (typical 15pF )
� Fast Switching Capability
� 100%Avalanche Tested G
� Isolation Voltage (VISO=4000V AC)
� Maximum Junction Temperature Range(150℃)
S
General Description
This Power MOSFET is produced using Winsemi's advancedplanar
stripe,VDMOS technology.this latest technology has beenespecially
designed to minimize on-state resistance, have a high rugged
avalanche characteristics .This devices is specially wellsuited for
half bridge and full bridge resonant topology line a electronic lamp
ballast, high efficiency switched mode power supplies, active power
factor correction.
Thermal Characteristics
Value
Symbol Parameter Units
Min Typ Max
RQJC Thermal Resistance , Junction -to -Case - - 1.04 ℃/W
WT-F126-Rev.A0 Dec.2015(B0)
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Copyright@Winsemi Microelectronics Co., Ltd., All right reserved. 1215
WFD7N65L Product Description
Silicon N-Channel MOSFET
Electrical Characteristics(Tc=25℃)
Characteristics Symbol Test Condition Min Type Max Unit
Gate leakage current IGSS VGS=±30V,VDS=0V - - ±100 nA
Silicon N-Channel MOSFET
Gate-source breakdown voltage V(BR)GSS IG=±10 µA,VDS=0V ±30 - - V
VDS=650V,VGS=0V - - 10 µA
Drain cut -off current IDSS
VDS=520V,Tc=125℃ - - 100 µA
Breakdown Voltage temperature Coefficient ∆BVDSS/∆TJ ID=250 µA,Referenced to 25℃ - 0.65 - V/℃
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VG S
To p 15V
10V
8V 10
10 7V
6 .5 V 2 5 °C
6V
Silicon N-Channel MOSFET 5 .5 V
B ot t om 5 V
1 5 0 °C
I D[A]
I D[A]
1
Note:
1.250µs pulse test Note:
1 1.250µs pulse test
2 .Tc =2 5 °C
2.VD S =40V
0 .1
1 10 2 4 6 8 10
VD S [V] V G S [V]
1 .3 5
10
1 .3 0
R DS(on) [Ω ]
1 .2 5 V G S =10V
I DR [A]
2 5 °C
1 .2 0
V G S =20V
1 .1 5 1
1 .1 0
1 5 0 °C
Notes:
1 .0 5 1.250µs pulse test
2.VG S =0V
N o t e : Tj = 2 5° C
1 .0 0
0 .9 5 0 .1
0 2 4 6 8 10 0 .4 0 .5 0 .6 0 .7 0 .8 0 .9 1 .0 1 .1 1 .2 1 .3 1 .4 1 .5
I D [A] VS D [V]
Fig.3 On-Resistance Variation vs Fig.4 Body Diode Forward Voltage
Drain Current and Gate Voltage Variation with Source Current
and Temperature
2000 12
Ciss=Cgs+Cgd(Cds=shorted) VD S =480V
Coss=Cds+Cgd
C rss= C gd
10 V D S =300V
1600
V GS Gate Source Voltage[V]
C is s
V D S =120V
Ca pa cit anc e[ pF ]
8
1200
C o ss
800
Note:
1.V G S =0V
4
C rss
2.f= 1M Hz
400
2
0
-1 0 1 0
10 10 10
0 2 4 6 8 10 12 14 16 18 20
VD S [V] Qg Toltal Gate Charge[nC]
Fig.5 Capacitance Characteristics Fig.6 Gate Charge Characteristics
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1 .2 3 .0
2 .5
BV DS (Normalixed)
1 .1
Silicon N-Channel MOSFET
R DS(on) (Normalized)
2 .0
1 .0 1 .5
0 .5
0 .9 Notes:
Notes:
0 .5 1.VG S =10V
1.VG S =0V 2.I D=3.5A
2.I D=250µA
0 .8 0 .0
-7 5 -5 0 -2 5 0 25 50 75 100 125 150 -7 5 -5 0 -2 5 0 25 50 75 100 125 150
T J [°C] TJ [°C]
1m s
10m s
100m s
ID [A ]
10 0 1s 4
DC
-1 2
10
Notes:
1 .Tc= 2 5 °C
2 .T J =150°C
-2 3.S ingle pulse
10 0
-1 10 0 10 1 10 2 25 50 75 100 125 150
10
VD S Drain-S ource Voltage[V ] TC [° C ]
Fig.9 Maximum Safe Operation Area Fig.10 Maximum Drain Current vs
Case Temperature
ZθJC (t),Thermal Response
D = 0 .5
100
0 .2 * N o te :
。
1.Z θ J C (t)=0.85 C/W Max.
0 .1 2.Duty Factor,D=t1/t2
3.T JM-T C=P DM* Z θJ C (t)
0 .0 5
-1
10
0 .0 2
PD M
0 .0 1
t1
Single pulse t2
1 0 -2
1 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 100 101
t1 [sec]
VG S VD S
Qg s Qg d
DUT
3m A
Ch a rg e
RL VD S
VD S 90%
VD D
VG S
RG
10%
VG S
10V DUT
td(on) tr td(off) tf
to n to f f
L 1 B V DSS
VD S EA S = L IA S 2
2 B V D S S - VD D
B V DSS
ID
IA S
RG
VD D I D( t)
10V DUT VD S( t )
VD D
tp
tp Tim e
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VD S
IS D
L
Driver
RG
Sam e Type
as DUT VD D
VG S
dv/dt controlled by RG
IS D conteolled by pulse period
IR M
VD S
(DUT) Body Diode Recovery dv/dt
VS D VD D
Body Diode
Forward Voltage Drop
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2.3±0.20
0.852±0.15
6.60±0.20
0.508±0.05
5.32±0.20
6.10±0.20
1.00±0.10
0.85±0.20
0.80±0.20
光面
2.848±0.30
2.286 2.286 0.508±0.05
0.76±0.10
Note:
1.plastic body is not marked as smooth Ra=0.1 ;
matt Ra=0.8
2.unmarked tolerance ± 0.15 , unlabeled corner
Rmax=0.25
3.plastic body without defect , shrinkage , cracks,
bubbles and other defects
4.units dimension mm
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NOTE:
1.We strongly recommend customers check carefully on the trademark when buying our product, if there is any
question, please don't be hesitate to contact us.
Silicon N-Channel
2.Please MOSFET
do not exceed the absolute maximum ratings of the device when circuit designing.
3.Winsemi Microelectronics Co., Ltd reserved the right to make changes in this specification sheet and is
subject to change without prior notice.
CONTACT:
Winsemi Microelectronics Co., Ltd.
ADD:Futian District, ShenZhen Tian An Cyber Tech Plaza two East Wing 1002
Post Code : 518040
Tel : +86-755-8250 6288
FAX : +86-755-8250 6299
Web Site : www.winsemi.com
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