Microchips limitation in computer

According to Moore’s law by Gordon Moore, co-founder of Intel, the number of transistors
in a dense integrated circuit (IC) doubles about every two years. However, according to
CEO of the UK’s Compound Semiconductor Applications Catapult, Stephen Doran, Since a
growing number of application that required increased speed, reduce latency, and lighten
detection, the silicon chips is reaching its maximum performance. (Carter, 2018) Thus, the
limitation of chips fabrication in the future design of the computer is the performance of
silicon chips will face a difficulty to hit up with the future computing-intensive endeavors.
This is because the future computer device need a more powerful and more agile device.

The predicted steps to overcome the limited performance of the silicon chips is cold
computing (Carter, 2018). This may help to create a higher-performance computer using
less power. One of the example of cold computing project is Microsoft’s Project Natick.
The main idea of cold computing is low temperature which is around 77 kelvin (-270 oc),
able to minimize the leakage of current and reducing the threshold voltage of the
transistor switch (Carter, 2018) (Ivankov, 2021). This will help to reduce the power
consume and at the same time increase the performance of a computer.

The second predicted step to overcome the insufficient of the performance of the
silicon chips is compound semiconductor (Carter, 2018). The next generation
semiconductor are made up off two or more elements whose properties make them
faster and more efficient than silicon . Example of combination of two elements
are gallium and nitride (Carter, 2018).

Next the limitation of System On a chips is the low unsustainability of the energy
density level as large amount of the energy is dissipated in the form of heat
(Ivankov, 2021). This makes the computer has a low sufficient .

Overheating is one of the causes of energy dissipation in the integrated circuit

(Ivankov, 2021). This is because there are large amount of components in a closer
proximity to one another will accumulate high energy density levels as well as
accumulate heat due to low thermal fow (Ivankov, 2021).
Bibliography
Carter, J. (2018, July 28). techradar. Retrieved from Silicon chips are reaching their limit. Here's the
future: https://www.techradar.com/sg/news/silicon-chips-are-reaching-their-limit-heres-the-
future

Ivankov, A. (2021, August 12). PROFOLUS. Retrieved from SoC: Advantages and Disadvantages of System
on a Chip: https://www.profolus.com/topics/soc-advantages-and-disadvantages-of-system-on-
a-chip/