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The tasks:
1. The figure below shows a MOSFET characteristic. Indicate which region it is operating for
different letters mentioned in figure with direction of VGS.
A. 188.2 µA
B. 220.2 µA
C. 244.7 µA
D. 130.3 µA
E. I don’t know.
3. A layout of an amplifier is shown in figure 1, what type of amplifier? (Hint: Draw equivalent
circuit)
A. Common gate amplifier
B. Differential amplifier
C. Cascode amplifier
D. Cascade amplifier
E. I don’t know
Fig. 1.
4. The figure below shows the cross section of a CMOS-circuit that is produced on a weakly doped
p-type substrate. What circuit is it?
M1 M2
Iout
Iref
Fig. 2.
You want to scale the transistor geometries such that Iout = 4* Iref and the output impedance gets
as large as possible. Which alternative is the best?
A. W1= 10 m, L1 = 1 m, W2 = 40 m, og L2 = 1 m
B. W1= 40 m, L1 = 1 m, W2 = 10 m, og L2 = 1 m
C. W1 = 40 m, L1 = 4 m, W2 = 10 m, og L2 = 4 m
D. W1 = 10 m, L1 = 2 m, W2 = 40 m, og L2 = 2 m
E. I don’t know
6. The amplifier shown has a total instantaneous gate-to-source input voltage, with the input signal,
vgs, of vGS = VGS + vgs. This results in a total instantaneous drain-current, iD, consisting of three
components, c1, c2 and c3. c1 = (µnCoxW/2L)(VGS – Vt)2. c2 = (µnCoxW/L)(VGS – Vt)vgs. c3 =
(µnCoxW/2L)vgs2. Which component, or which components, are in most cases undesirable?
7. The common-source amplifier above, has an NMOS transistor with a transconductance of “gm”
and a small signal resistance from drain to source, “rds”. The transistor is operating in the active
region. What is the small signal voltage gain of the amplifier?
A. - gm(rds || RD)
B. - gm(rds)
C. - gm RD
D. - gm(rds x RD)
E. I don’t know.
8. A common source amplifier is given in the figure below. What is the voltage gain of the
amplifier?
Given: All MOSFET have W/L= 50 µm / 0.8 µm. µnCox= 90 µA/V2, µpCox=30 µA/V2,
Ibias= 100 µA, rds-n() = 8000 L(µm)/ID (mA) and rds-p() = 10000 L(µm)/ID (mA).
A. -37.7
B. -75.4
C. 7.54
D. 150.8
E. I don’t know
A. W1 = W2 = 2 µm, and L1 = L2 =
1.0 µm
B. W1 = 2 µm, W2 = 4 µm and L1 = M1 M2
L2 = 0.5 µm
C. W1 = 2 µm, W2 = 2 µm and L1 =
L2 = 2 µm Iout
D. W1 = 4 µm, W2 = 4 µm and L1 = Iref
L2 = 2 µm
E. I don’t know.
10. Which alternative below contains one or more false statements about matching in CMOS?
A. Matching is generally very important for analog CMOS. Matching of transistors may be
improved by connecting several unit-sized transistors in parallel.
B. Matched devices should ideally have the same boundary conditions, which may be
accomplished by adding dummy components.
C. For transistors with the same VGS we have to quadruple the device area if we are going to
improve the current matching by a factor of 2.
D. Vt mismatch seldom has to be taken into account by analog designers.
E. I don’t know.
11. What is the least number of transistors needed to implement F = A·B + A·C·D in CMOS ( not
exploiting a technique like for example pseudoNMOS )?
A. 8
B. 10
C. 16
D. 20
E. I don’t know
12. Which statement about power consumption in a CMOS inverter with capacitive load is not true?
A. The power consumption may be divided in one static (DC) and one dynamic component.
B. The dynamic power dissipation is proportional to the signal frequency.
C. Reducing the supply voltage is a very effective way of reducing the overall power
Consumption since it has a quadratic impact on the power consumption.
D. The static power consumption is proportional to the load capacitance.
E. I don’t know
14. A CMOS transistor has been produced, and parts of the result, are shown below. How does it
influence the operation of the gate?
15. Which statement below is generally not true for an NMOS transistor operating in the active
region?
A. The small signal output resistance, rds, increases when the gate length increases.
B. Increasing the voltage level of the bulk node decreases the current between drain and source.
C. Increasing Veff = VGS - Vtn increases the current between drain and source.
D. Increasing Veff = VGS - Vtn decreases the small signal output resistance, rds.
E. I don’t know.
16. The signal delay on an interconnect length of 10 µm is 2.5 ps. If the line is increased to 40 µm,
what would be the delay of the complete, extended, line?
A. 10 ps
B. 40 ps
17. You shall design an edge triggered D-register with synchronous set and reset. Set and Reset are
active HIGH. Which code is correct?
A. always@(clk)
if (1 == reset)
out = 0;
else if (1==set)
out = 1;
else
out = d_in;
B. always@(posedge(clk))
if (1 == set)
out = 0;
else if (1 == eset)
out = 1;
else
out = d_in;
D. always@(posedge clk)
if (1 == reset)
out = 0;
else if (1==set)
out = 1;
else
out = d_in;
E. I don’t know
B. 27 ps …
C. 36 ps
not #(2, 2)
D. 54 ps I1 (s[3], s[2]),
E. I don’t know I2 (s[4], s[3]),
I3 (s[5], s[4]),
I4 (s[6], s[5]),
I5 (s[7], s[6]),
I6 (s[8], s[7]),
I7 (s[9], s[8]),
I8 (s[1], s[9]);
nor #(2, 2)
N1 (s[2], s[1], reset);
assign clk = s[1];
20. The plot shows the output voltage from an inverter when it changes from HIGH to LOW value.
What is the fall-time tf, for the signal?
A. tf = t4 – t3 Vut
B. tf = t4 – t2
C. tf = t3 – t2
D. tf = t5 – t1
E. I don’t know
t1 t2 t3 t4 t5 tid
22. A standard CMOS inverter is implemented in an nWell process. The input voltage level is Vdd.
The transistor placed in the nWell has it’s “B” node decreased from one dc voltage level to another
dc voltage level. May this change in the voltage level impact the drain current through the devices?
A. This change leads to an increase in the drain-currents of both transistors.
B. This change does not lead to a change in the drain-currents of any transistor.
C. The change leads to an increased drain-current in the PMOS only.
D. The change leads to an increased drain-current in the NMOS only.
E. I don’t know.
23. How many transistors is it usually in CMOS AND and OR gates having N inputs?
A. N
B. N+1
C. 2N
D. 2N+2
E. I don’t know.
24. How may transistors is it in a simple pseudo nMOS gate having N inputs?
A. N
B. N+1
C. 2N
D. N2
E. I don’t know.
26. With the NOR-gate to the right, the test vector {AB} = {01} is applied. Which faults are detected
by this test? (A-SA1 is input A Stuck-at-1.)
A. A-SA1, F-SA1
B. A-SA1, F-SA0
C. B-SA0, F-SA0
D. B-SA0, F-SA1
E. I don’t know
27. We have the combinatorial network given below. The B inputs are Stuck-at-0. Which test vector,
{A,B,C,D}, detects this fault? ( Path sensitization is one possible means of finding a test vector.)
A. {1,1,1,1}
B. {1,0,0,1}
C. {0,1,0,1}
D. {0,1,1,1}
E. I don’t know
29. The figure is taken from “Introduction to VLSI Circuits and Systems, by John P. Uyemura and
shows an inverter cascade. A least possible delay through the chain is desired. Suppose that we want
to drive a load capacitance of value CL = 10 pF (where 1 pF = 10-12 F). The input stage is defined
with C1 = 20 fF (1 fF = 10-15 F). What is the proper number of scaled inverters that should be used?
30. Parts of a layout is shown below (from the book by J. P. Uyemura). What is the corresponding
circuit functionality?
A. A tri-state inverter
B. A D-latch with nFET pass gates
C. A 1-bit DRAM cell
D. An SRAM cell
E. I don’t know
31. With the given data, what is the value of in the conductor?
R□ = 0,05 /□
C = 0,05 fF/m2
= 0,25 m
A. 1,56 fs W=2
B. 0,625 fs
L = 100
C. 2,50 fs
D. 6,25 fs
E. I don’t know
B. .subckt NAND2B 1 2 3 4 5 6
m1 4 2 1 1 pmos l=1u w=1u
m2 4 3 1 1 pmos l=1u w=1u
m3 4 2 5 6 nmos l=1u w=1u
m4 5 3 6 6 nmos l=1u w=1u
.ends
C. .subckt NAND2C 1 2 3 4 5 6
m1 1 3 6 1 pmos l=1u w=1u
m2 6 4 5 1 pmos l=1u w=1u
m3 5 3 2 2 nmos l=1u w=1u
m4 5 4 2 2 nmos l=1u w=1u
.ends
D. .subckt NAND2D 1 2 3 4 5 6
m1 1 2 3 1 pmos l=1u w=1u
m2 6 4 5 1 pmos l=1u w=1u
m3 5 4 6 2 nmos l=1u w=1u
m4 3 2 1 2 nmos l=1u w=1u
.ends
E. I don’t know.
37. A CMOS gate has the P-net in the figure. Which function is this? Remember that 1’ = 0, 0’ = 1
A. This is not a digital function.
B. Out = (C·D+B·E+A)’ VDD
C. Out = [(B+C)·(A+D+E)]’
D. Out = [(A·D·E)+(B·C)]’ D
E. I don’t know
C E
B A
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