FINDINGS

1. The name of complex compounds.

There is a complex compound that is commonly used in electroplating which is cyanide

complex. Under the cyanide complex, there are a few compounds that help in
electroplating such as potassium silver cyanide (potassium argentocyanide), K[Ag(CN)2],
potassium gold cyanide (potassium dicyanoaurate), K[Au(CN)2], and copper cyanide
(cyanocopper (I)) [Cu(CN)].

2. The molecular structure of compounds.

The molecular structure of cyanide complexes:

Potassium silver cyanide Potassium gold cyanide

Copper cyanide
3. Study the properties of compounds.

One of the most significant and well-studied classes of compounds in inorganic

chemistry are cyano metal complexes, which are composed of one or more bound cyanide
ligands, CN. The cyanide ion can act as a π -acid ligand, but due to its negative charge, it
can also form potent sigma bonds. Due to its dual functionality, CN can stabilise metals
in both high and low oxidation states. There are a few compounds that will be furtherly
discuss on its uses in electroplating industry.

Firstly, potassium silver cyanide (also known as potassium argentocyanide). It exists

as a white crystalline solid. It is poisonous and has light-sensitive crystals. In addition to
being somewhat soluble in ethanol, it is soluble in water and acids. When it is heated to
decomposition, it produces extremely toxic fumes. Due to that, it is needed to be stored in
a poisoned room. It is odorless when dry, but smells faintly of ammonia when wet. The
boiling point of the compound is 25.7 °C and its density is 2.36 g/cm3.

Secondly, potassium gold cyanide (also known as potassium dicyanoaurate). It exists

as a white, crystalline powder and its density is 3.45 g/cm3. It is partially soluble in
alcohol and insoluble in ether, but soluble in water. The electroplating industry uses
potassium dicyanoaurate, a gold salt.

Apart from that, copper cyanide. It exists as a green powder. It is insoluble in water
and alcohol. However, it is soluble in ammonium hydroxide, aqueous ammonia, pyridine
and N-methylpyrrolidone. The melting point of the compound is 474 °C and its density is
2.92 g/cm3. Hydrogen cyanide, which results from slight decomposition, is toxic when
absorbed through the skin, through open wounds, consumed, and inhaled. It produces
harmful nitrogen oxides during fires. It is used extensively in the electroplating industry.
4. Explore the mechanism involved in the respective industries.

There is different mechanism involved in the electroplating industry nowadays.

Coordination compounds are needed in electroplating as metals can group together to
form nanoparticles and clusters when metal ions are reduced to create thin metal coatings.
The ligands in metal coordination complexes prevent the metal atoms from interacting
with one another.

For the first compound which is potassium silver cyanide, it is used as silver
plating. The holloware and flatware industries use silver plating the most, where it serves
as a long-lasting decorative finish. Almost all silver plating is done with alkaline cyanide
solutions. When silver anodes dissolve in potassium cyanide solution, the metal is
introduced as potassium silver cyanide. Silver metal concentrations in plating solutions
typically range from 10 to 40 g/L (1.3 to 5.3 oz/gal) and up to 120 g/L (16 oz/gal) of free
potassium cyanide. When a less noble metal is immersed in cyanide silver plating
solutions, immersion silver deposits will form on the metal. This holds true even though
the components enter the solution "live" (with voltage applied from the rectifier). Any
later electroplated layer that is applied will adhere poorly due to immersion deposits.

Next, potassium gold cyanide is used in electroplating gold in which

electroplated gold coatings are widely used in electronics and aerospace industries. It is
crucial that the potassium gold cyanide used to make plating baths is extremely pure.
There are two ways to make potassium gold cyanide: chemically and electrochemically.
Only auricyanide [Au(CN)4]- is produced during the conversion of AuCl3 to potassium
gold cyanide by reaction with cyanide, and depending on the plating conditions, it is
reduced to aurocyanide [Au(CN)2]-. Therefore, both monovalent and trivalent gold will be
present in the solution in the plating bath. It is challenging to estimate the amount of time
required to deposit a specific thickness because their ratio will continue to change as the
bath is kept in a longer time. Although simple, the electrochemical method has its own
disadvantages. When the current density is relatively low in cyanide solution, gold
displays passivity. As a result, a very low current density is required for anodic
dissolution to be successful.
 Lastly, the other compound is copper cyanide. Copper electroplated with
cyanide-based plating solutions has long been used as an engineering or decorative finish,
as well as an undercoat for other plated metals. These cyanide copper solutions are used
for plating on a wide range of substrates. Steels, zinc alloys, aluminium alloys, copper
alloys, magnesium alloys, nickel alloys, and lead alloys are among them. The ability of
copper from cyanide-based systems to adhere well to these alloys is an important
property. Copper cyanide, the source of copper in solution, is not soluble in water. To
dissolve it, potassium cyanide must be used to form the soluble complexes. Moreover, an
excess of alkali metal cyanide is required over the amount required to form the complexes
for sound, good quality deposits, and good anode corrosion. Copper plating solution
formulations differ depending on the application. High-speed rack plating solutions
contain 5 to 10 oz/gal copper (typically 6 oz/gal). Free cyanide is an important component
that is kept in proportion to the copper, typically at a 2:1 copper to "free" potassium
cyanide ratio. Although low free cyanide solutions improve plating efficiency and speed,
anode corrosion is reduced and deposits may be rough. Cyanide copper plating solutions
frequently contain proprietary additives. These additives enhance the colour, produce
semi-bright or fully bright deposits, reduce the effects of various impurities, and improve
anode corrosion.
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https://www.ias.ac.in/article/fulltext/boms/006/02/0165-0175