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  • 01-12-2020 Capa 3

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    ankit chaudhari
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    The summary identifies a non-conformity with a printed circuit board assembly (PCBA) where the glue was missing from one point. The root cause was determined to be an incomplete glue application process. As a corrective action, the production line was stopped to conduct a meeting to address the issue. Operators were retrained on the proper glue application process and random checks were implemented to verify compliance. The proposed completion date for corrective actions was January 31, 2020.

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    01-12-2020 gap

    Original Title

    01-12-2020 CAPA 3

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    The summary identifies a non-conformity with a printed circuit board assembly (PCBA) where the glue was missing from one point. The root cause was determined to be an incomplete glue application process. As a corrective action, the production line was stopped to conduct a meeting to address the issue. Operators were retrained on the proper glue application process and random checks were implemented to verify compliance. The proposed completion date for corrective actions was January 31, 2020.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    1 views1 page

    01-12-2020 Capa 3

    Uploaded by

    ankit chaudhari
    The summary identifies a non-conformity with a printed circuit board assembly (PCBA) where the glue was missing from one point. The root cause was determined to be an incomplete glue application process. As a corrective action, the production line was stopped to conduct a meeting to address the issue. Operators were retrained on the proper glue application process and random checks were implemented to verify compliance. The proposed completion date for corrective actions was January 31, 2020.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    of 1

    TOPBAND Indi Corrective Action Form Date: O1 122020

    Details of Non-conformity obserevd: No. Department (V)


    Section: (a) Quality Assurance
    Poctuction
    PGlue ispens 1issing souncl al oge (b) Production

    (c) Purchase
    Stne Yoltaj u n (ty200l730%)|
    (d) Stores
    Lwcahoo Ez in One PCBA
    (e) Mktg. & Sales

    ( HR& Admin.

    (g) Other

    Root Cause(s):
    l a e cupplíceutin Procen incompl ete units Proce Aext s tope .

    Whelue applfcuficn process he hus uiss fhe one poiu.


    Not fo llo the glue applicsudion proces
    Corrections:
    Re-Sceecnd the line wTP AS we Fg. we found fhe one Same
    oukect C Tota ee Sc|cened t y sgo)
    Aledes boands more to pl assa for then Proce.

    Corrective Action(s) planned:


    Stop4he line f Conduct the o pcuf me etin9 f tus lssue
    O Oekeive boa Shown fo lue cpplicei0 ProCtCo) openeutors
    Cuo w eu wo vT Openaudomns
    Chek point hao been aiven to vT opeasutos
    Production Supervisor Proposed Completion Date: Actual Completion Date:

    32|20ro
    Effectiveness a[sessment:

    Production HOD's Signature Quality HOD's Signature CA/PA Closure Date:

    TBIN-FR-QMS-011/Ver. B

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