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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00

Document Owner : Jeans Gao Effective Date : 9/23/2008

REVISION HISTORY
Revision Description of Change Writer/Reviser Effective Date
A First Release Murad Kurwa 9/24/2008
B Updated safety protection guidelines Jeans Gao/Gordon Huang 7/15/2014

APPROVERS
Author Name Title Department Name
Jeans Gao / Gordon Huang Sr. Manager AEG Asia -TDPE

Author’s Manager Name Title Department Name

Andy Zhang Director AEG Asia -TDPE

AEG VP Name Title Department Name

Murad Kurwa Vice President Advanced Engineering Group

ABOUT FLEXTRONICS

Flextronics is a leading Electronics Manufacturing Services (EMS) provider focused on delivering complete design,
engineering and manufacturing services to automotive, computing, consumer, industrial, infrastructure, medical, clean
tech and mobile OEMs. Flextronics helps customers design, build, ship, and service electronics products through a
network of facilities in 30 countries on four continents. This global presence provides design and engineering solutions
that are combined with core electronics manufacturing and logistics services, and vertically integrated with components
technologies, to optimize customer operations by lowering costs and reducing time to market.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

1. Introduction ......................................................................................................................................................3
1.1. Propose of this document ......................................................................................................................................3
1.2. Acronyms and Abbreviations................................................................................................................................3
2. Fixture Design Guidelines................................................................................................................................3
2.1. Test probes ............................................................................................................................................................3
2.2. Tooling Holes........................................................................................................................................................8
2.3. Safety and Electrostatic Protection Design ...........................................................................................................9
2.4. Material Selection ...............................................................................................................................................11
2.5. FPC B2B Connector Access Recommendation...................................................................................................13
2.6. Mini PCI Access Recommendation ....................................................................................................................16
2.7. Board Identification ............................................................................................................................................18
2.8. Hold Down Gate .................................................................................................................................................18
2.9. Recommended top plate ......................................................................................................................................18
2.10. Recommended probe plate ..................................................................................................................................19
2.11. Recommended guided probe plate ......................................................................................................................19
2.12. Ground Planes .....................................................................................................................................................19
2.13. Fixture Cover Plates and Fixture Protection .......................................................................................................19
2.14. Pin Electronics Wiring ........................................................................................................................................20

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

1. Introduction
1.1. Propose of this document
This document outlines Flextronics’ corporate test fixture design rules to ensure that the test fixtures are
designed in the most effective manner possible, therefore, to achieve better test efficiency, more
convenient operation, better test stability, and lower fixture cost, and finally, result in higher level of
product quality with acceptable level of cost.
This document will not cover the process of the fixture design, but focuses on the design rules.
This document is intended for fixture designers and test engineers for input into test fixture design.

1.2. Acronyms and Abbreviations

ICT – In-circuit test
MDA – Manufacturing Defect Analyzer
BScan – Boundary Scan Test
FPT – Flying Probe Test
FCT – Functional Test
BFT – Board Level Functional Test
AOI – Automatic Optical Inspection
AXI – Automatic X-Ray Inspection
PCB – Print Circuit Board
PCBA – Print Circuit Board Assembly

2. Fixture Design Guidelines

2.1. Test probes
2.1.1.All test probes are preferred to be on one side of the PCB.
Although topside probing can be done, targeting accuracy is lightly diminished due to additional tolerances
involved
2.1.2. Avoid placing test probes on SMT devices.
This can cause damage to the device; false test results, and provides minimal probe contact area.
2.1.3.Correctly chose the probe target, test pads which Solder mask should not cover

2.1.4.The preferred probing target size is 20mil for bottom side and 24mil for top side targets. This target size can
be reduced by choosing receptacles with alignment plates, guided probes, sharper tooling pins etc.
2.1.5.Test probes should to be distributed evenly over the surface of the PCB.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

Areas of high probe density may cause the PCB to flex significantly, resulting in a loss of probe travel, poor
probe contact with the test target and possible damage to the PCB.
2.1.6.Limit test points under BGA with below criteria
< 29 testpt/sq.in. with 5.5 to 6.5 oz probe
< 47 testpt/sq.in. with 4 oz probe
Max 80 testpt/sq.in. can be accommodated providing test pts distributed evenly and there is 200 mils
minimum clearance around BGA
If exceeding above limits, possibility of pushing directly on BGA device or push around BGA device to
counter upward force from probes
2.1.7.Probe Travel
Probe travel is to be 2/3 ( +/-20%) of full travel with following criteria.
0.167” ± 0.020” for 0.250” probes
0.317” ± 0.020” for 0.400” probes
0.317” ± 0.020” for 0.350” probes.
Probe travel measurement will be taken by either free stand method or with indicator probes by actuating the
fixture with a loaded board.
2.1.8.Test probe spacing

The minimum center-to-center spacing between test points or adjacent drilled locations is as follows.

Probe Combination Minimum Spacing

100 Mil  100 Mil .083”
100 Mil  75 Mil .076”
100 Mil  50 Mil .068”
75 Mil  75 Mil .068”
75 Mil  50 Mil .061”
50 Mil  50 Mil .050”

2.1.9.The spacing of Test targets to board edge

Test targets should be at least .125” away from the edge of the PCB or “break away” areas. In vacuum
fixtures, this region allows gaskets to meet evenly with the board surface and create a good vacuum seal.
Mechanical board handlers may require additional clearance for conveyor rails.
2.1.10. Test Point to Component Spacing as follows
The following guidelines represent the minimum spacing allowed for placing probes relative to SMD
components on the side of the board being tested. These guidelines are based on fixture drilling

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

requirements and do not reflect any board related keep-out requirements around the component, which may
limit the spacing to a distance greater than that specified below.
In the following figures, the "component" geometry refers to the component placement boundary. Thus, all
dimensions are from the edge of the component placement boundary to the center of the test target.
The minimum probe-to-component distances identified below are based on the use of 100mil probes.
Tighter spacing may be achieved by using 75mil or 50mil probes. All dimensions shown are in inches.

Component Height Bottom Side Top Side

1.00 < height > .400 0.070 in. 0.320 in.
.400 < height > .255 0.070 in. 0.170 in.
.255 < height > .150 0.070 in. 0.090 in.
.150 < height > .050 0.050 in. 0.070 in.
.050 < height > 0 0.028 in. 0.050 in.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

Standard Top Plate

Component Height <.125”

Standard Top Plate

Component Height > .125”

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

Guided Probe Top Plate

Component Height < .050”
Manual/Automated Zero-flexing

Guided Probe Top Plate

Component Height > .050”
Automated Zero-Flexing

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

Guided Probe Top Plate

Component Height > .050”
Manual Zero-Flexing - Digitized Component Locations

2.2. Tooling Holes

2.2.1.Minimum 3 tooling hole should be designed, two tooling holes should be placed in opposing corners of the
PCBA, as far apart as practical.
2.2.2.The preferred tooling hole size is 0.125" or above and should chose the un-plated holes as tooling holes, the
minimum tooling hole size is 0.093”. If no such tooling holes available, extra fixturing mechanism should
be designed. Just like guided blocks…
2.2.3.Tooling holes locations should be a minimum of .100” from the edge of the PCB.
2.2.4.The diameter of the tooling holes should have a tolerance of +.002”/-.000”
2.2.5.Diamond tooling pins can be assistance on increasing targeting accuracy.
2.2.6.Sufficient distance should be kept between tooling hole and test probes, refer to below table.
Probe Grid Minimum Spacing
100mil .033”
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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

75ml .026”
50mil .019”
39mil .015”

2.3. Safety and Electrostatic Protection Design

2.3.1.The strain gage test (less than 500u strain) is necessary before online debug and test. A board stress analysis
should be considered to proactively identify areas of high stress or deflection, which can be addressed and
corrected during fixture build.

2.3.2.The selection of fabrication material must follow the design of the electrostatic protection standard. For
example, DUT loading board and pressing block and so on should be used with ESD material, the probe
board can’t be used with ESD material, and this may ensure PCBA or electronic components can’t be
damaged better.

2.3.3.Fixture design must meet the safety requirement when operators open or close the fixture to test, for
example below, add the clear PMMA protection cover, and it may ensure the operator hands isn’t easy to be
damaged.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.3.4.Fixture design must meet the safety requirement when the fixture is being tested, refer to the right picture
fixture design, the operators can’t open the fixture upper cover when the fixture is being tested, and this may
ensure the tester is safer

2.3.5.Fixture design must meet the safety requirement when the fixture is being repaired, adds the safe lock in the
fixture bottom box, and this may ensure the operator hands aren’t easy to be damaged when the upper
fixture drops suddenly because of the gas spring.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.4. Material Selection

2.4.1.PCBA test plate.
All PCBA functional test fixture, ESD material are considered first, for probe plate, None ESD material will
be used or a standard thick with antistatic surface treatment only.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.4.2.Product Protection
To protect product surface, soft material should be used. Such as Teflon & PU, even silicon rubber.

2.4.3.Tooling Pin
All tooling pin suggest use SUS304 or ordering Misumi standard part.

2.4.4.Frame, Bracket & Shielding Box

Frame & bracket we can use aluminum tube or square steel/angle steel according to the requirement.
Shielding box always use aluminum plate to weld (few quantity)/molding (large quantity).

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.5. FPC B2B Connector Access Recommendation

2.5.1.Design a holder to fix B2B connector

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.5.2.Using test probe adaptor holder to transfer B2B connector signal

2.5.3.Test probe selection & spacing

Production Spacing Test Probe maximum Diameter(mm)

0.35mm 0.26< X < 0.35
0.40mm 0.30< X < 0.40
0.50mm 0.37< X < 0.50
0.60mm 0.45< X < 0.60
0.80mm 0.60< X < 0.80

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.6. Mini PCI Access Recommendation

2.6.1.Design a holder to fix Mini PCI card

2.6.2.Used a test probe to transfer test signal to flex board

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

Top View

Front View

2.6.3.Test probe selection & spacing

Mini PCI connector test point spacing is 0.5mm (between centers of two test point), suggest to choose test
probe (diameter 0.58mm), and used two row test probe to connect Mini PCI connector.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.7. Board Identification

The following board identification guidelines should be considered:
2.7.1.Board labeling
2.7.2.Consistent text orientation
2.7.3.Board type, revision and serial numbers clearly marked on the top side
2.7.4.Barcode label on the top side and consistent
2.7.5.Component identities visible clearly and placed adjacent to component with lines as necessary

2.8. Hold Down Gate

2.8.1.Hold-down gates require positive force to close but cannot spring up rapidly when opened as it could cause
injury.
2.8.2.Fixtures may require plates that provide extra support at the location of the hold-down gates.
2.8.3.Hold-down fingers should not make contact with any components, solder joints etc ( norm .05” clearance,
can use .02" clearance if required for stress mitigation).
2.8.4.Hold-down gates hold the UUT flat and do not allow it to warp or flare up on the sides. Design to reduce the
flex of the UUT.

2.9. Recommended top plate

2.9.1.All top plates should have a minimum nominal thickness of .192” (4.9mm). Thicker top plates can be sued
for specific applications.
2.9.2.A recommended method for mounting the top plate to the probe plate is through the use of four locking
guide pins, one in each corner, which work to align the top and probe plates

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
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2.10. Recommended probe plate

2.10.1. Fixtures with less than 1000 probes can use a probe plate that has a minimum thickness of .375” (9.5mm).
2.10.2. Fixtures with more than 1000 probes require a probe plate with a minimum thickness of .50” (12.7mm).
2.10.3. Fixtures that are going to be testing “no-clean” PCAs require a probe plate with a minimum thickness of
.50” (12.7mm). Typically
2.10.4. No Clean use higher force probes.

2.11. Recommended guided probe plate

2.11.1. Guided probe plates are recommended for fixtures using small test pads and spacing, below .028“in
diameter.
2.11.2. One method is to modify the top plate of the fixture kit to countersink the back side of the top plate to act
as a guide.
2.11.3. Another method is to mount plates between the probe plate and the top plate that are used to increase the
accuracy of smaller test probes.

2.12. Ground Planes

2.12.1. Ground planes must be used on boards with a significant amount of digital circuitry.
2.12.2. Ground planes must be installed on the bottom of the fixture probe plate and on the receiver/fixture
interface.
2.12.3. Ground connections between the ground plane on the probe plate and the ground plane on the
receiver/fixture interface must be made by soldering a minimum of two braided copper wire straps, each
with a minimum width of 3/8".

2.13. Fixture Cover Plates and Fixture Protection

2.13.1. It is recommended that a cover plate of 0.125“ (3.175mm) Lexan stock, cut to the dimensions of the PCA,
be used when the fixture is not in use.
2.13.2. Another cover plate, made of identical stock, can be provided toprotect the receiver/fixture interface pins
on the bottom of the test fixture.
2.13.3. Install rubber feet to protect the fixture during handling.
If you are going to use the fixture with adapter plates on other test systems beware of the use of rubber feet.
Rubber feet can cause the adapter plate and the fixture not to seal to each other and cause connectivity
problems.

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Title : Test Fixture Design Guidelines Document Number : OPS-ENG-3-079-00
Document Owner : Jeans Gao Effective Date : 9/23/2008

2.14. Pin Electronics Wiring

2.14.1. Pin Electronics Wire: Kynar/Teflon coated solid wire wrap wire, 26-28 awg
2.14.2. Adjacent rows of wires on the receiver/fixture interface should be different colors. Wire colors can repeat
after all available colors have been used.
2.14.3. Twisted pair wiring is preferred on all pins high speed digital devices.
2.14.4. Twisted pair ground wires should be black with 4-8 twisted per inch.
2.14.5. Suggested Wire wrapping specification:
7 loops of bare wire contacting the probe socket post
1 1/2 Loops of insulated wire around top of probe socket post
Do not bundle wires.
Do not "daisy chain" any wires
2.14.6. Do not dress wires in-between receiver/fixture interface pins.

Note:
This template provides a framework to document Policy, Process, and Procedures. The originator can add topics and
sections as are required to bring clarity to the document. Additionally, the originator can delete sections that are not
Mandatory or applicable.

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