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What is Rigid Flex PCB ? – Design, Manufacturing & Cost

Rigid Flex PCB

Manufacturing Service
Rayming Rigid flex PCB capabilities:

Rigid Board: Up to 20 layer ( accept buried or blind hole design)

Flex Board: 8 Layer ( Accept PI,Aluminum, Fr4 stiffener, and other

special materials requirement ）

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will quote you Very Soon !

Rayming Rigid flex PCB board manufacturing solutions are custom

designed for many top electronic industry. Fabricated with

dependable high stardard quality control and reliability, our Rigid

flex Board are built to withstand the rigors of aerospace, Robot

control, medical, and military applications. As a reliability

replacement for wire and wire harness assemblies,rigid flex circuit

provide a significant cost saving with no reduction in

performance.Our pcb engineer team can assist you from

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early rigid-flex design stages of your application all the way to

final production for all your flex and rigid-flex circuit needs.

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Introduction
A rigid-flex printed circuit board (PCB) is a PCB that contains both rigid

and flexible substrate materials. The rigid sections provide mechanical

support and component mounting, while the flexible sections enable

connections between different rigid sections and allow the PCB to bend

and flex.

Rigid-flex PCBs provide a space-saving and lightweight solution for

electronic devices with complex interconnections and 3-dimensional

form factors. They are commonly used in consumer

electronics, automotive, aerospace, medical, and industrial

applications.

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This article will provide an in-depth overview of rigid-flex PCB

technology, covering topics such as:

 What is a rigid flex PCB and how does it work?

 Rigid-flex PCB design considerations

 Rigid-flex PCB manufacturing process

 Rigid-flex PCB cost factors

 Rigid-flex PCB applications

 Advantages vs traditional PCBs

 Design guidelines and best practices

Understanding rigid-flex PCBs enables designers and engineers to

effectively utilize this technology for products that require dynamic

flexing, folding, wrapping, and complex 3D shaping.

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What is Rigid Flex PCB?

A rigid-flex PCB consists of rigid PCB material combined

with flexible PCB material, connected by a flexible adhesive

material. The rigid sections provide mechanical support for

components and the flexible sections allow dynamic movement

and shaping.

The rigid sections are typically made of materials like FR-4, while

the flexible sections use polyimide or other flexible dielectric

materials. The layers are bonded together using advanced

adhesion techniques. Conductive traces can be etched on both

rigid and flexible layers to route signals between components.

Vias and component holes are plated through both rigid and

flexible layers to enable vertical interconnections. Components

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are mounted on the rigid portions only, while the flexible portions

provide dynamic interconnects between the rigid segments.

Rigid-flex PCBs enable:

 Dynamic flexing, bending, folding, and wrapping

 Interconnections between multiple PCBs

 Complex, dense, and compact electronics packaging

 Rugged devices with flex-resistant cabling

 Lighter and thinner products by eliminating wires and

connectors

 3D shaping and conformability

 Reduced assembly cost by combining multiple PCBs

Compared to using discrete rigid PCBs with external cables or flex

circuit interconnects, rigid-flex PCB technology provides a fully

integrated solution with design, performance and reliability

advantages.

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How Does Rigid Flex PCB

Work?
A rigid-flex PCB integrates rigid board material (like FR-4) with

flexible board material (like polyimide), allowing the PCB to be

dynamically flexed and shaped. Here is how the technology

works:

 Rigid segments provide mechanical structure for component

mounting and heat dissipation.

 Flexible segments enable out-of-plane interconnections

between rigid segments.

 Conductive layers are etched on both rigid and flexible

materials.

 Plated through holes connect layers vertically across both

rigid and flexible areas.

 Components are mounted on the rigid portions only.

 Flexible portions are dynamically folded, bent, wrapped, etc.

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 The rigid-flex PCB can be shaped into 3D geometries.

This configuration allows rigid support where needed, while

enabling flexible interconnects between sections that can be

dynamically shaped as required.

The rigid and flexible materials are bonded into a single

integrated PCB solution through advanced lamination processes.

The materials must be properly adhered to withstand thermal

and mechanical stresses during assembly and operation.

Proper design techniques are essential for rigid-flex PCBs to

function correctly. Special considerations include:

 Trace routing on flexible layers to enable dynamic bending

 Minimizing rigid-to-flex transition stress

 Maintaining proper bend radius control

 Allowing for thickness changes between rigid and flex areas

When designed properly, rigid-flex PCBs can achieve extreme

flexibility and 3D shaping while maintaining signal

and power integrity across both rigid and flex sections.

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Rigid Flex PCB Design

Considerations
Designing a reliable rigid-flex PCB requires attention to details

that are not relevant for standard rigid PCBs. Here are some

key rigid-flex design considerations:

1. Layer Stackup

The designer must define an appropriate layer stackup with the

necessary mix of rigid and flexible layers. Component density,

routing requirements, dynamic flexing needs, and other factors

influence the choice of stackup.

Typical rigid layers use FR-4 or other glass-reinforced laminates.

Typical flex layers use polyimide or other flexible dielectric

materials. Adhesive layers bond the rigid and flex layers into an

integrated structure.

The stackup must balance factors such as flexibility, rigidity,

thickness, impedance control, and manufacturability. More flex

layers improve dynamic shapeability but reduce rigidity. Thicker

rigid layers provide better heat dissipation but increase thickness.

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2. Rigid-to-Flex Transitions

The intersections between rigid and flexible sections require

careful management to avoid cracking or peeling stresses. The

design should optimize factors like:

 Transition geometry – Generally gradual tapers or rounded

corners

 Annular ring dimensions – Wider annular rings reduce stress

 copper pulls backs – Minimize uncovered copper near

transitions

 Avoid acute angles – Use gradually curving corners instead

3. Bend Radius

Flexible segments must be designed to avoid exceeding the

minimum bend radius. Too tight of a bend can fracture copper

traces, delaminate layers, or damage components.

The bend radius depends on factors such as flexible material,

layer stackup, copper thickness, and dynamic flexing

requirements. Typical minimum bend radius values range from

3mm to 10mm.

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4. Component Placement

Since flexible layers cannot support components, all components

must be placed in rigid areas. There should be a keepout area

around the edges of rigid sections to avoid component leads

overlapping flexible areas.

High stress components like connectors should be placed away

from rigid-flex transitions. Thermally critical components require

sufficient copper area for heat dissipation.

5. Routing Considerations

Traces on flexible layers require design adjustments such as:

 Wider trace widths and spacing to withstand dynamic

bending

 Avoiding acute angles

 Routing along the neutral bend axis where possible

 Balancing copper density across flexible layers

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Rigid Flex PCB

Manufacturing Process
Producing a reliable rigid-flex PCB requires advanced

manufacturing techniques and processes. Here is an overview of

rigid-flex fabrication:

1. Materials Preparation

The process starts with raw rigid and flexible core materials being

prepared. The materials are cleaned, coated, and conditioned to

optimize adhesion and processing performance.

2. Imaging

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The individual inner and outer layers are imaged with the

conductive pattern using lithography and etching processes. This

forms the traces, pads, and features on each layer.

3. Hole Formation

Holes are drilled or punched through the core layers. This

includes component holes, tooling holes, and through vias

between layers. The holes are plated with copper to form the

vertical interconnects.

4. Lamination

The rigid and flexible core layers are precisely aligned and bonded

using high temperature and pressure. The bond line between

materials is critical to performance. Advanced adhesives are used.

5. Outer Layer Imaging

After lamination, the outer layer traces and features are imaged

using lithography and etching. This completes the conductive

patterning on the PCB.

6. Solder Mask and Finish

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Solder mask is applied to exposed copper surfaces. The edges of

pads and traces are exposed. The PCB surface is finished with

treatments like ENIG, immersion tin, or OSP.

7. Singulation

The large panel is precision routed to separate into individual

PCBs. Rigid-flex PCBs often have complex board shapes.

8. Testing

Each completed PCB goes through electrical testing and

inspection to verify function and workmanship. Automated optical

inspection checks feature accuracy.

9. Assembly

Components are mounted on the rigid portions using soldering or

adhesive attachment. The PCB can then be dynamically flexed

into the 3D shape as required.

Rigid-flex PCB fabrication requires expertise in advanced

processes like:

 Surface preparation and adhesion promotion

 High-accuracy imaging and pattern transfer

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 Controlled lamination of dissimilar materials

 Mitigation of thermal and mechanical process stresses

 Precise techniques for routing, drilling, and hole plating

 DFM techniques for optimizing manufacturability

Rigid-flex PCBs tend to cost more than standard rigid PCBs due to

the specialized materials, processes, and lower fabrication

volumes. Here are some of the key factors that influence

rigid-flex PCB pricing:

1. Layer Count

Adding more conductive layers increases material costs,

lamination complexity, and fabrication difficulty. High layer count

rigid-flex PCBs cost exponentially more than 2-4 layer versions.

2. Panel Utilization

Rigid-flex PCB panels often have lower utilization due to complex

board geometries. Less PCB area per panel drives up cost. Tight

panel layout Optimization is critical.

3. Finishing and Coatings

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The specialized solder mask, coverlay, and surface finish add cost

compared to baseline FR-4 finishing. Thick copper, buried vias,

and other techniques also increase cost.

4. Flexible Material Type

The flexible dielectric material choices like polyimide, LCP, PEN

drive cost. More durable and heat-resistant flex materials are

more expensive.

5. Registration Accuracy

The precision alignment of layers and drilling/routing accuracy

requirements affect cost. Tighter tolerances require advanced

equipment and processes.

6. Design Complexity

Dense routing, high component counts, HDI features, and

impedance control requirements increase fabrication difficulty

and cost.

7. Low Volume

The overall smaller market for rigid-flex PCBs prevents economies

of scale. Shorter fabrication runs increase cost per board.

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8. Testing

Rigid-flex PCBs require extensive inspection and electrical testing

to validate quality. This adds cost compared to basic PCB

qualification.

In addition to fabrication costs, there are engineering costs

associated with specialized rigid-flex design, simulation,

prototyping, documentation, and qualification.

Here are some of the major application areas taking advantage of

rigid-flex PCB technology:

Consumer Electronics

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Wearables, smartphones, laptops, tablets, cameras, and other

connected consumer gadgets utilize rigid-flex PCBs to achieve

folding, compact size, rugged cabling, and dynamic positioning.

Automotive Electronics

Automotive camera systems, powertrain electronics, LED lighting,

and in-vehicle infotainment systems employ rigid-flex PCBs for

shape conformability and vibration resistance.

Medical Equipment

Hearing aids, blood analyzers, surgical tools, and implants use

rigid-flex PCBs to fit within tight, curved spaces and provide

dynamic interconnections.

Industrial

Industrial rigid-flex applications include robotics, motion control,

telemetry devices, and navigation systems that require

ruggedized, shape-conforming PCBs.

Military/Aerospace

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Avionics systems, guidance controls, communications, and

navigation electronics in defense and aerospace applications

utilize rigid-flex PCBs for compact, rugged performance.

Advanced HDI

Rigid-flex PCBs are commonly used as integrated carrier boards

for ultra-high density interposers and multi-chip modules (MCMs)

for applications like ASIC packaging.

From small wearable gadgets to large avionics systems, rigid-flex

PCB technology enables solutions not possible with standard rigid

boards – supporting dynamic motion, flexing, wrapping, and 3D

shaping.

Here are some of the key benefits provided by rigid-flex PCBs

compared to traditional rigid PCBs:

Dynamic Flexing and Motion

The flexible portions of rigid-flex PCBs enable motion, vibration

absorption, twisting, bending, and wrapping unavailable with rigid

PCBs.

Lightweight and Compact

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By eliminating external cables and connectors, rigid-flex PCBs

achieve significant size and weight reduction for portable and

space-constrained designs.

Enhanced Reliability

The integrated rigid-flex structure avoids interconnection failures

associated with cables and connectors. System reliability

improves.

Complex Shaping

Conformal and complex 3D shapes can be achieved with rigid-flex

PCBs to fit product enclosures and mechanics. Rigid PCBs are

planar and 2D.

Simplified Assembly

Components can be pre-mounted on the rigid portions, enabling

system assembly by simply folding the rigid-flex PCB into shape.

Design Flexibility

Rigid-flex PCBs allow optimal placement of rigid areas only where

mechanically required, improving design flexibility.

Cost Savings

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By reducing parts count, assembly steps, and handling, rigid-flex

PCBs can achieve net cost savings compared to hybrid rigid/flex

solutions.

For applications requiring dynamic motion, vibration resistance,

light weight, or complex 3D assembly, rigid-flex PCB technology

provides performance and reliability benefits over traditional rigid

PCBs. The advanced integration reduces cost and complexity

compared to hybrid solutions.

Here are some key design guidelines and best practices to follow

when working with rigid-flex PCBs:

Manage Layer Stackup Carefully

 Use sufficient layers and thickness for rigidity, heat

dissipation, and signal integrity.

 Minimize flexible layers to what’s required for dynamic

bending motions.

 Balance properties like impedance control, flex/rigid

transition stresses, and manufacturability.

Optimize Rigid-Flex Transitions

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 Use gradual tapers and teardrop shapes at transitions.

 Keep components and vias back from transition

intersections.

 Adjust solder mask pullbacks methodically.

 Analyze transition points using FEA stress simulation.

Maintain Proper Bend Radius

 Do not exceed minimum bend radius specifications.

 Keep bends in the central neutral axis of flex layers where

possible.

 Dynamic flexing stresses can decrease bend radius over

product lifetime.

Follow Flexible PCB Design Rules

 Use wider trace/space dimensions on flex layers.

 Avoid acute angles on traces and planes.

 Balance copper density across flex layers.

 Route critical signals near neutral bend axis.

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Allow Adequate Board Tolerances

 Account for greater alignment variability between layers.

 Provide tolerance for dynamic shape variations during use.

 Ensure critical features have design margin.

Simulate PCB Performance

 Verify shape and motion with 3D CAD simulation.

 Perform stress analysis at rigid-flex transitions.

 Thermally modelComponents on rigid areas with sufficient

copper.

 Verify signal integrity, especially across bends.

Facilitate Manufacturing and Testing

 Use standard materials when possible.

 Account forthickness variations between rigid and flex

areas.

 Provide testpoints to access critical signals.

 Follow fabrication shop DFM guidelines.

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With attention to these design principles, rigid-flex PCBs can be

optimized to achieve the desired balance of dynamic flexing,

shapeability, reliability, and manufacturability.

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To facilitate working with rigid-flex PCB designs, engineers use

various software tools for tasks like:

PCB Layout

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 Altium Designer

 Cadence Allegro

 Mentor Xpedition

 Zuken CR-8000

3D Modeling

 Cadence OrCAD 3D Modeler

 Altium 3D PCB Visualization

 SolidWorks PCB 3D Modeling

Simulation and Analysis

 Ansys Q3D Extractor (for signal integrity)

 Ansys HFSSTM (for antenna design)

 Cadence Clarity 3D Solver (for thermal and mechanical

analysis)

 Mentor Valor Process Preparation (for manufacturability

verification)

Documentation

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 AutoCAD

 PDF 3D

 Illustration and diagramming tools

Using these sophisticated design automation tools enables

engineers to design and analyze complex rigid-flex PCBs with

confidence. The tools help optimize parameters like layer stackup,

trace routing, 3D shape modeling, signal and power integrity

analysis, thermal analysis, and manufacturability validation.

Key points in summary:

 Rigid-flex PCBs contain both rigid board material (like FR-4)

and flexible dielectric material (like polyimide), providing

dynamic flexing and 3D shaping.

 Careful design is required to manage parameters like layer

stackup, rigid-to-flex transition geometry, bend radius, trace

routing, and component placement.

 Rigid portions provide mechanical structure while flexible

portions enable out-of-plane interconnections between rigid

sections.

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 Rigid-flex PCBs achieve space, weight, complexity, and

reliability benefits compared to traditional PCBs for many

applications.

 Cost is higher than rigid PCBs but can be offset by system

miniaturization, consolidation, and assembly benefits.

 Consumer electronics, automotive,

aerospace/defense, medical devices and industrial

automation are leading application areas.

 Following design guidelines for flex/rigid transitions, bend

radius, trace routing, and modeling ensures reliable

performance.

Rigid-flex PCB technology provides unique benefits for products

requiring dynamic flexing, vibration resistance, lightweight and

conformal assembly. By understanding the design, manufacturing

and cost considerations, engineers can effectively apply rigid-flex

PCBs as a solution.

Frequently Asked Questions

Here are some common questions on rigid-flex PCB technology:

Q: What are the main benefits of rigid-flex PCBs?

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They allow dynamic flexing and interconnections, consolidation of

multiple PCBs, lighter weight assembly, and improved reliability.

Q: What are some typical applications of rigid-flex boards?

Consumer products, computer components like drives, medical

devices, robotics, defense, automotive electronics are common

applications.

Q: What are the major design considerations for rigid-flex PCBs?

Stackup symmetry, adequate bonding widths, copper relief cuts,

component layout, controlling flex stresses, and smooth

impedance transitions are key considerations.

Q: How are rigid-flex PCBs manufactured?

Specialized lamination, drilling and routing processes are required

along with precise process control.

Q: What drives the higher cost of rigid-flex PCBs?

Low volume production, additional process steps, advanced

materials, complex designs and more inspection all contribute to

increased costs.

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