PCB Stiffeners Difference Between FR4, Polyimide (PI) and Aluminum in Flex Circuit

RAYMING PCB & ASSEMBLY
PCB Stiffeners Difference Between FR4, Polyimide (PI) and Aluminum in Flex Circuit
Introduction
Flexible printed circuits (FPCs) provide many advantages with their ability
to bend and flex to fit challenging form factors. However, by nature
flexible boards can lack the rigidity needed for some applications.
Adding mechanical stiffeners or backbone structures is a common
technique to reinforce specific areas of flex circuits that require stability.
Stiffeners provide anchoring points for connectors and components that
undergo stress.
There are various options when selecting stiffener materials for flex PCBs.
The three most popular choices are FR4, polyimide (PI) film, and aluminum.
Each material has inherent benefits and tradeoffs.
This article provides a detailed comparison between FR4, PI and aluminum
stiffeners for flexible PCBs. We’ll examine material properties,
performance, manufacturability and cost factors to determine the optimal
selection for your application.
Request Flex PCB Manufacturing Quote Now
What are PCB Stiffeners?
PCB Manufacturing & Assembly Services https://www.raypcb.com/

Flexible PCB Stiffeners
Stiffeners, also called backbone boards or frames, are additional layers
laminated into a flex circuit stackup to provide enhanced rigidity and
robustness. Typical stiffener locations:
 Along the length of conductor tabs to prevent tearing
 Supporting heavy components like connectors or batteries
 Securing flex-to-board connections at PCB interfaces
 Protecting cable connections from pull force damage
 Eliminating unwanted bending zones of the circuit
Stiffeners transform limited sections of the FPC into essentially a small
segment of rigid PCB, allowing integration of stress points into the
assembly. Components and connectors can be reliably mounted to
stiffened regions.
Without the additional reinforcement, flexing stresses applied to
connectors, cables and interfaces with rigid boards can crack solder joints,

delaminate layers and tear conductive traces. Stiffeners absorb these
forces and isolate the flexible portion of the circuit.
FR4 Stiffeners
FR4
Stiffener
FR4 glass epoxy is the most common and cost effective stiffening option
due to the same laminate material being used for the FPC substrate.
Pros of FR4
 Inexpensive – No additional material cost using same base
laminate.
 Easy assembly – Bonds well with FPC adhesive and lamination
process.

 Solderable – Standard FR4 finish allows solder pad plating.
 Availability – Readily accessible material with short lead times.
 Rigidity – Provides adequate stiffness for most applications.
Cons of FR4
 Size constraints – Limited by standard panel sizes and fabricator
tooling.
 Moisture absorption – Glass weave can absorb humidity and
solvents.
 Copper tear – Glass fiber reinforcement risks copper being pulled
off pad.
 Brittle – Epoxy resin prone to cracking if overloaded.
Design Guidelines
 Keep unsupported stiffener length short to minimize bending.
 Use thicker cores like 1.6mm for maximum stiffness.
 Watch for DFM violations on minimum trace spacing and hole size.
 Seal exposed glass fibers with solder mask or additional PI overlay.
Overall, FR4 stiffeners offer the fastest and most cost-effective
reinforcement solution for flex circuits due to material commonality with
the FPC substrate.

Polyimide (PI) Stiffeners
Polyimide films like Kapton provide an enhanced performance option as
flex stiffening materials.
Pros of Polyimide
 High strength – Withstands repeated stress and bending.
 Low moisture absorption – Resists humidity and liquid damage.
 High temperature – Can withstand over 260°C.
 Lightweight – Low density material reduces mass.
 Thin cores available – From 25um to 150um options.
 Chemical resistance – Inert to most solvents and acids.
Cons of Polyimide
 Higher cost – Roughly 5-10X more expensive than FR4.
 Lead time – Some flex-grade PI films have long fabrication lead
times.
 Lamination challenge – Difficult adhesive bonding to FPC layers.

 Non-solderable – Requires metallization for component pads.
Design Guidelines
 Adhesion promoting surface treatments may be needed.
 Watch for handling damage to thin cores.
 Careful drill and routing parameters are required.
 Minimize exposed PI edges.
Polyimide stiffeners provide the best strength at minimal thickness for flex
circuits where high performance is critical. The tradeoff is substantially
higher cost.
Aluminum Stiffeners
Most rigid option using metal backing plates or frames.
Pros of Aluminum

 Maximum rigidity – Strongest stiffening with thin material.
 Lower cost than PI – Less than polyimide films.
 Lightweight – Aluminum alloys are lightweight.
 Machining options – Can be machined or formed into shapes.
 Heat sinking – High thermal conductivity.
Cons of Aluminum
 CTE mismatch – Thermal expansion difference can cause warping.
 Harder assembly – Metallization or insulation may be needed.
 Oxidation – Prone to corrosion without protective plating.
 Springback – Flexible aluminum (heat treated) requires careful
handling.
Design Guidelines
 Anodization helps insulation and oxidation resistance.
 Adhesives selection is critical to handle CTE differences.
 Allow clearance for flexing zones around stiffeners.
 Minimize rigid portions of assembly for easiest dynamic flexion.
Aluminum or metal stiffeners provide the strongest option but require
additional processing steps to integrate properly with the flex circuit
stackup.

Stiffener Performance Comparison
Here is a summary comparing the key performance characteristics
between the three common stiffener materials:
Parameter FR4 Polyimide

Rigidity Medium Low Hig
Thermal conductivity Medium Low Hig
CTE Medium Medium-Low Hig
Moisture absorption High Low Med
Solderable Yes No No
Chemical resistance Medium High Hig
High temperature Medium High Hig
Lead time Short Medium Med
Cost Low High Med
Polyimide and aluminum provide the best performance but at
substantially higher cost than basic FR4 stiffeners. The optimum choice
depends on the mechanical, thermal and chemical needs of the specific
application.
Stiffener Integration and Design
flexi board

Several considerations go into integrating the stiffener structure
successfully into the flex PCB assembly:
Layer Position
Stiffeners are normally laminated as a symmetric pair on the outer
surfaces of the flex circuit, containing the FPC layers between them. This
prevents asymmetric expansion differences from moisture or
temperature.
Layer Adhesion
PI and aluminum require specific surface treatments or adhesives
formulated to bond with the FPC polymer layers. Manufacturers can
recommend compatible adhesive systems.
Stiffener Contour
Laser machining can cut stiffeners to match complex flex circuit outlines,
allowing dynamic bending only in required areas.
Mounting Features
Cutouts, holes and pads need to be included in the stiffener to allow
mounting components, hardware and connecting to the rigid PCB.
Flex Transition

Adequate clearance should be provided around the stiffener perimeter for
the flexible portion of the circuit to bend and transition into rigid areas.
With careful design and process consideration, stiffeners become
integrated backbone structures enabling flexible circuits to withstand
mechanical and thermal stresses seen in real-world operating
environments.
Stiffener Fabrication Process Overview
The general fabrication steps to incorporate stiffeners are outlined below:
1. Fabricate base FPC layers
2. Fabricate stiffener layers from FR4/PI/aluminum
3. Cut/route stiffener layers to desired outlines
4. Surface treat stiffener for adhesion
5. Align and laminate stiffener layers to FPC
6. Laser cut stiffened assembly outline
7. Continue standard FPC processing (Coverlay, solder mask, plating,
singulation)
The critical technology is developing the adhesive system that reliably
bonds the stiffener layers to the FPC materials on both sides, providing a
symmetric construction.

Cost Analysis
One of the primary considerations when selecting stiffener material is cost.
Below is a relative cost comparison:
 FR4 – Lowest cost option, no additional material expense. Requires
basic fabrication processing.
 Polyimide – 5-10X cost increase over FR4. Additional film cost plus
metallization and bonding process steps.
 Aluminum – 2-3X cost increase over FR4 due to material cost. Extra
processing to pattern and isolate metal layers.
For high volume and larger boards, the enhanced performance of PI or
aluminum stiffeners can justify the additional costs. On lower complexity
flex assemblies, FR4 provides adequate reinforcement at the lowest price.
Assemblies with just small localized areas needing reinforcement are good
candidates for basic FR4 backbone boards. Cost factors should align with
the performance requirements of each unique design.
Stiffener Selection Guidelines
Here is a summary of selection criteria when choosing the optimal
stiffener material:
When to choose FR4:

 Cost sensitivity or high production volumes
 Adequate rigidity provided with thicker FR4 cores
 Lower temperature or chemical resistance requirements
 Small localized stiffened regions only
When to choose Polyimide:
 Thin, high performance materials are required
 Extreme flexibility and dynamic bending cycles
 High temperature or chemical resistance needed
 Low moisture absorption critical
When to choose Aluminum:
 Maximum rigidity and structural support required
 Large or long stiffener sizes dictate metal reinforcement
 Heatsinking for power components necessary
 Hermetic assembly demands metal enclosure
The vast range of flex circuit applications means each project should be
evaluated independently to determine the ideal stiffener material striking
the right balance of cost, manufacturability and performance.
Conclusion

Adding stiffening structures provides a technique to reinforce specific
regions of flex circuits, improving manufacturability and reliability under
mechanical or thermal stresses. FR4, polyimide and aluminum films offer
a range of cost and performance options.
FR4 glass epoxy, while limited in some performance metrics, provides the
most accessible and affordable stiffening solution due to process
commonality with standard flex circuit fabrication.
For more demanding applications, polyimide and aluminum films boost
high temperature capability, strength and rigidity at the tradeoff of higher
cost. The increased material and processing expenses may be justified for
large, complex or high performance flex designs.
Careful design consideration around layer sequence, adhesion, transitions
and mounting features allows stiffeners to become fully integrated

backbone structures. The result is flex assemblies that maintain dynamic
mechanical compliance where needed while providing rigid anchoring
structures to absorb and isolate stress and loads.
Frequently Asked
Questions
What are some typical locations for stiffeners on flex
circuits?
Stiffeners are commonly placed reinforcing points like connectors, cable
attachments, component pads, and junctions with rigid boards. High
strain areas on dynamic flexing portions may also need reinforcement
against cracking.
Can multiple stiffener materials be combined on one flex
circuit?
Yes, it is possible to use FR4, polyimide, aluminum together on a single
FPC to optimize cost and performance. FR4 can support lower load areas
while polyimide or aluminum is used in high stress spots.

What adhesive is used to bond aluminum stiffeners to flex
layers?
Epoxy is commonly used but requires preparation of the aluminum
surface for adhesion. Some options include etching, anodization,
application of bonding films, or mechanical abrasion.
How thick can polyimide stiffeners be fabricated?
Polyimide films are available in sheets from 25um up 5mil (125um) in
thickness. Multiple sheets can be laminated together for thicker stiffeners
up to 10mil range. Above that machined aluminum is easier to produce
reliably.
What is the ideal position in the layer stackup for stiffeners?
Stiffeners achieve maximum flatness and stability when placed
symmetrically on both outer surfaces of the flex laminate stackup. This
prevents curling or warpage from asymmetric construction.
Related Posts:
1. What is the difference between a flex circuit and a PCB?
2. Comparing Polyamide and Polyimide: What’s the Difference for
PCB?

3. What is the Metal Core PCB Difference Between Aluminum PCB and
Copper Base PCB?
4. What is the Difference between Flex Board Design and Rigid-Flex
Design?
https://www.raypcb.com/why-flexible-pcb-need-stiffeners/

PCB Stiffeners Difference Between FR4, Polyimide (PI) and Aluminum in Flex Circuit

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

PCB Stiffeners Difference Between FR4, Polyimide (PI) and Aluminum in Flex Circuit

Uploaded by

Copyright:

Available Formats

RAYMING PCB & ASSEMBLY

to bend and flex to fit challenging form factors. However, by nature

Adding mechanical stiffeners or backbone structures is a common

technique to reinforce specific areas of flex circuits that require stability.

Stiffeners provide anchoring points for connectors and components that

Each material has inherent benefits and tradeoffs.

This article provides a detailed comparison between FR4, PI and aluminum

stiffeners for flexible PCBs. We’ll examine material properties,

performance, manufacturability and cost factors to determine the optimal

selection for your application.

Request Flex PCB Manufacturing Quote Now

What are PCB Stiffeners?

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Flexible PCB Stiffeners

Stiffeners, also called backbone boards or frames, are additional layers

laminated into a flex circuit stackup to provide enhanced rigidity and

robustness. Typical stiffener locations:

 Along the length of conductor tabs to prevent tearing

 Supporting heavy components like connectors or batteries

 Securing flex-to-board connections at PCB interfaces

 Protecting cable connections from pull force damage

 Eliminating unwanted bending zones of the circuit

Stiffeners transform limited sections of the FPC into essentially a small

segment of rigid PCB, allowing integration of stress points into the

assembly. Components and connectors can be reliably mounted to

Without the additional reinforcement, flexing stresses applied to

PCB Manufacturing & Assembly Services https://www.raypcb.com/

delaminate layers and tear conductive traces. Stiffeners absorb these

forces and isolate the flexible portion of the circuit.

 Inexpensive – No additional material cost using same base

 Easy assembly – Bonds well with FPC adhesive and lamination

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Solderable – Standard FR4 finish allows solder pad plating.

 Availability – Readily accessible material with short lead times.

 Rigidity – Provides adequate stiffness for most applications.

 Size constraints – Limited by standard panel sizes and fabricator

 Moisture absorption – Glass weave can absorb humidity and

 Copper tear – Glass fiber reinforcement risks copper being pulled

 Brittle – Epoxy resin prone to cracking if overloaded.

 Keep unsupported stiffener length short to minimize bending.

 Use thicker cores like 1.6mm for maximum stiffness.

 Seal exposed glass fibers with solder mask or additional PI overlay.

Overall, FR4 stiffeners offer the fastest and most cost-effective

reinforcement solution for flex circuits due to material commonality with

the FPC substrate.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Polyimide (PI) Stiffeners

Polyimide films like Kapton provide an enhanced performance option as

flex stiffening materials.

 High strength – Withstands repeated stress and bending.

 Low moisture absorption – Resists humidity and liquid damage.

 High temperature – Can withstand over 260°C.

 Lightweight – Low density material reduces mass.

 Thin cores available – From 25um to 150um options.

 Chemical resistance – Inert to most solvents and acids.

 Higher cost – Roughly 5-10X more expensive than FR4.

 Lead time – Some flex-grade PI films have long fabrication lead

 Lamination challenge – Difficult adhesive bonding to FPC layers.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Non-solderable – Requires metallization for component pads.

 Adhesion promoting surface treatments may be needed.

 Watch for handling damage to thin cores.

 Careful drill and routing parameters are required.

 Minimize exposed PI edges.