RF PCB Design Guidelines You Must Know

RAYMING PCB & ASSEMBLY
RF PCB Design Guidelines You Must Know

Introduction
Designing printed circuit boards for radio frequency (RF) applications
requires special considerations to ensure proper performance. At
microwave and mmWave frequencies, the properties and layout of PCB
materials have a major impact on parameters like loss, impedance control,
and signal integrity.
This guide covers key RF PCB design guidelines and best practices.
Following these will help RF boards achieve target behavior in terms of
losses, spurious signals, power transfer, and other critical high
frequency characteristics. We’ll examine stackup arrangements, layout
techniques, grounded coplanars, material selection, simulations, and
more.
Properly incorporating sound RF design principles results in PCBs
delivering reliable, repeatable performance across fabrication variations
and a wide array of operating conditions. Avoid surprises late in the
development cycle by understanding these essential RF design guidelines
up front.
Stackup Arrangement
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A properly planned layer stackup forms the foundation of any high
performance RF PCB layout:
Use Thin Dielectrics
At higher frequencies, a thinner dielectric allows tighter impedance
control and reduced loss per inch. Typical RF dielectrics are 2 to 4 mils
thick.
Orient Core Grain Direction
Alternate the dielectric grain direction in subsequent cores to equalize
dimensional stability. This prevents skewing during lamination.
Include Ground Planes
Ground planes provide an ideal continuous RF return path and shielding.
Place them strategically to isolate different signals.
Embed Controlled Impedances
Sandwich controlled impedance traces between ground planes to
enhance tuning and shielding.
Model Before Finalizing

Model the stackup in your RF simulation tool and optimize before
committing to a configuration. Tweak dielectrics, copper weights, and
arrangements as needed to refined the design.
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Transmission Lines
PCB Transmission Lines
Transmission lines like microstrips and striplines carry high frequency
signals across a PCB:
Matched Impedance
Use controlled impedance lines matched to system impedance (typically
50 ohms) to minimize losses.
Short Stub Lines
Keep stubs short to avoid unwanted capacitive coupling. Use vertical
transitions where changes are unavoidable.

Smooth Wave Impedance
Taper impedance gradually over longer lengths for impedance matching
and reduced reflections.
Terminate Lines
Properly terminate lines in their system impedance at the load end to
prevent reflections from discontinuities.
Reflection-Free Bends
Avoid 90 degree bends. Use arc or mitered 45 degree bevels to reduce
discontinuities in the wave impedance.
Coupled Lengths
When coupling lines, tightly control the gap and length ratio to achieve
target coupling factors.
Careful application of transmission line theory is critical to RF PCB
performance.
Grounded Coplanar Waveguides
Grounded coplanar waveguides involve placing signal traces between
ground planes on the same layer. Benefits include:

 Excellent shielding and isolation
 Permits closer packing density
 Reduces radiation losses
 Allows easy shielding vias to ground
 Supports high frequency millimeter-wave signals
Use coplanar techniques where stripline or microstrip won’t suffice for
shielding or density needs.
Passive Components
RF passives require special attention during layout:
Place Near ICs
Keep passives physically close to their driving IC pins to avoid long stub
traces.
Orient Perpendicular
Wherever possible, orient inductors and capacitors perpendicular to their
attached traces. This avoids parasitics.
Flood Ground Around
Provide a flood ground fill around all passive components. This shields
noise coupling and maintains low inductance.

Watch Spacing
mind spacing around passives to avoid coupling between components.
Model Libraries
Use vendor 3D models or EM-based parasitic models for passives for
optimal simulation accuracy.
Careful passive layout minimizes parasitic effects that impair frequency
response.
Material Selection
Choosing suitable PCB materials is crucial for achieving target RF
performance. Key considerations include:
Dielectric Constant
Select a dielectric constant to ensure proper impedance. Variability risks
impedance mismatches.

Loss Tangent
Lower loss materials like PTFE reduce insertion losses for greater range
and efficiency.
Moisture Absorption
Lower absorption coefficients minimize performance degradation in
humid conditions.
Thermal Properties
Manage lamination stresses and match expansion coefficients to avoid
electrical issues from physical warping.
Lead-Free Assembly
Use high Tg materials compatible with lead-free assembly processes
necessary for commercial products.
Availability
Choose readily available materials with multiple qualified laminators to
control supply chain risks.
There are always tradeoffs to weigh when selecting RF laminates.
Copper and Finishes

Like dielectrics, carefully selecting conductor materials enhances RF
response:
Copper Weights
Heavier copper above 2 oz enables better power handling and low loss
performance.
Rolled or Electrodeposited
Electrodeposited copper foils tend to provide smoother surface finishes.
Surface Roughness
Smooth copper foil reduces conductor losses at high frequencies due to
skin effects.
Final Finish
Immersion silver or gold provide excellent surface conductivity while
slowing tarnishing.
Plating Buildup
For heavy power traces, electroplated copper increases conductor
thickness over foil alone.
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Thermal Management
PCB thermal resistance
Poor thermal performance impacts RF PCBs through:
 Electrical parameter variations with temperature
 Mechanical warping inducing stress
 Accelerated aging and material breakdown
Use Thermal Vias
Place thermal vias under hot components allowing heat conduction to
inner and bottom layers.
Flood Planes
Use thick copper plane layers as heat spreaders where possible.
Heatsinks

Add localized heatsinks under high power devices if needed.
Air Flow
Permit sufficient air flow for convection cooling during enclosure design.
Thermal Modeling
Model thermal performance early to identify hotspots and refine layouts.
Proper thermal design prevents fluctuations and damage over the
operating life.
Simulations
Accurately simulating RF boards requires using the appropriate tools:
EM Simulators
Full wave 3D EM simulation captures complex energy interactions
between components.
Parasitic Extractors
Model detailed parasitic characteristics caused by pads, vias, traces, and
ground planes.
Material Models

Leverage available laminate material models from manufacturers
capturing frequency dependent performance.
PCB PDN Analysis
Analyze common and differential path impedances to predict noise
coupling on board.
S-Parameters
Use s-parameters for components to capture frequency-based
input/output behavior.
TDR Modeling
Time domain TDR simulation validates impedance control and dispersion.
Matching simulations to real measured results builds confidence in the
PCB layout.
Conclusion
Following sound RF design principles enables PCBs operating reliably at
microwave and mmWave frequencies. Paying attention to stackup
arrangements, layout techniques, material selections, simulations, and
other best practices prevents nasty surprises late in the development
cycle. While RF design requires meticulous care, the methodical

application of these guidelines results in high performance boards
meeting their operating goals across all conditions.
Frequently Asked Questions
Q: At what frequency do RF design considerations for PCBs start to
become necessary?
A: Most experts recommend treating any design over 1 GHz as an RF
layout. However, techniques help even at a few hundreds MHz.
Q: What are some key software tools used for RF PCB design and
simulation?
A: Popular options include Cadence Allegro, Mentor Xpedition, Keysight
ADS, Ansys HFSS, and Altium.
Q: What are typical stackup layer counts for RF PCB designs?
A: High frequency boards trend towards 4-16 layers. This enables
embedding controlled impedances between ground planes while avoiding
overly thick dielectrics.
Q: How are impedance matched interconnects created on PCBs?

A: Carefully engineering the trace geometry and dimensions along with
dielectric height relative to ground maintains target impedance like 50
ohms across a route.
Q: What are some common RF PCB laminate materials?
A: Popular options
include Rogers RO4000, Taconic RF-35, Isola IS680, Arlon CLTE, and PTFE
composites. These provide tightly controlled dielectric constants.
Related Posts:
1. All You Should Know about HDI PCB Design Guidelines
2. PCB Design Guidelines For EMI EMC
3. 2oz Copper PCB Thickness and its Design Guidelines
4. GPS PCB Design Guidelines and its Importance in Todays Age
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RAYMING PCB & ASSEMBLY

RF PCB Design Guidelines You Must Know

Designing printed circuit boards for radio frequency (RF) applications

requires special considerations to ensure proper performance. At

microwave and mmWave frequencies, the properties and layout of PCB

materials have a major impact on parameters like loss, impedance control,

and signal integrity.

Following these will help RF boards achieve target behavior in terms of

losses, spurious signals, power transfer, and other critical high

frequency characteristics. We’ll examine stackup arrangements, layout

techniques, grounded coplanars, material selection, simulations, and

Properly incorporating sound RF design principles results in PCBs

delivering reliable, repeatable performance across fabrication variations

and a wide array of operating conditions. Avoid surprises late in the

development cycle by understanding these essential RF design guidelines

PCB Manufacturing & Assembly Services https://www.raypcb.com/

A properly planned layer stackup forms the foundation of any high

performance RF PCB layout:

Use Thin Dielectrics

At higher frequencies, a thinner dielectric allows tighter impedance

Orient Core Grain Direction

Alternate the dielectric grain direction in subsequent cores to equalize

dimensional stability. This prevents skewing during lamination.

Include Ground Planes

Ground planes provide an ideal continuous RF return path and shielding.

Place them strategically to isolate different signals.

Embed Controlled Impedances

Sandwich controlled impedance traces between ground planes to

enhance tuning and shielding.

Model Before Finalizing

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Model the stackup in your RF simulation tool and optimize before

committing to a configuration. Tweak dielectrics, copper weights, and

arrangements as needed to refined the design.

Request RF PCB Manufacturing Quote Now

PCB Transmission Lines

Transmission lines like microstrips and striplines carry high frequency

signals across a PCB:

Use controlled impedance lines matched to system impedance (typically

50 ohms) to minimize losses.

Short Stub Lines

Keep stubs short to avoid unwanted capacitive coupling. Use vertical

transitions where changes are unavoidable.

PCB Manufacturing & Assembly Services https://www.raypcb.com/

Smooth Wave Impedance

Taper impedance gradually over longer lengths for impedance matching

and reduced reflections.

Properly terminate lines in their system impedance at the load end to

prevent reflections from discontinuities.

Avoid 90 degree bends. Use arc or mitered 45 degree bevels to reduce

discontinuities in the wave impedance.

target coupling factors.

Careful application of transmission line theory is critical to RF PCB

Grounded Coplanar Waveguides

Grounded coplanar waveguides involve placing signal traces between

ground planes on the same layer. Benefits include:

PCB Manufacturing & Assembly Services https://www.raypcb.com/

 Excellent shielding and isolation

 Permits closer packing density

 Reduces radiation losses

 Allows easy shielding vias to ground

 Supports high frequency millimeter-wave signals

Use coplanar techniques where stripline or microstrip won’t suffice for

shielding or density needs.