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What is Ro4003c Dielectric

Constant?
RO4003C is a ceramic-filled, thermoset laminate material made by Rogers
Corporation designed for high frequency circuit boards and antenna
applications from 3–27+ GHz. RO4003C laminates exhibit excellent
dimensional stability versus temperature due to x-y expansion matched to
copper and low z-axis CTE.

Some key properties of Rogers RO4003C include:

 Dielectric constant of 3.38 (±0.05)

 Low loss tangent for high frequencies

 Tight dielectric constant tolerance

 Lead-free assembly compatible

 UL 94V-0 flame retardant rating

 Low moisture absorption

RO4003C is well suited for microwave systems including radar, satellite

communication, terrestrial microwave links, and test equipment. It can deliver
stable electrical performance under demanding thermal and environmental
conditions.

RO4003C Dielectric Composition

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RO4003C features a thermoset dielectric resin matrix reinforced with glass

fabric. Importantly, it incorporates a functional filler using a specialized
ceramic particle system to obtain stable dielectric properties at high
frequencies along with enhanced thermal conductivity.

Typical Composition

 Thermoset resin: Cyanate ester

 Reinforcement: E-glass fabric

 Filler: Ceramic compounds

The ceramic filler matrix enables the combination of low loss, dimensional
stability, and matched thermal expansion necessary for precision microwave
circuit performance.

Dielectric Properties

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The dielectric constant (Dk) defines how signals propagate in the printed
circuit board material. Key electrical properties include:

The precise control of dielectric constant gives consistent, predictable electrical

behavior essential for microwave system signal integrity.

Dielectric Constant Stability

In addition to accuracy of the nominal dielectric constant value, maintaining

stability over environmental conditions and temperature is critical for circuit
performance.

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This dielectric constant stability of RO4003C allows circuit designs with tight
impedance control and return loss budgets to be realized for broadband
microwave operation.

Microwave Circuit Models

Accurate modeling is key to achieving first-pass PCB layout success. Rogers

provides dielectic property data for modeling in leading simulation tools like
Keysight ADS and Ansys HFSS including:

 Broadband dielectric constant/loss tangent versus frequency

 Resistivity, breakdown voltage

 Thermal conductivity, heat capacity

 X,Y,Z coefficient of thermal expansion

RO4003C Modeled Dielectric Constant

Dielectric Model Showing Stable Value Versus Frequency

This data enables precise modeling for impedance-controlled circuit

simulations.

Lead-Free Assembly Compatibility

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RO4003C laminates pass lead-free soldering requirements including:

 IPC J-STD-004B SIR and ECM testing

 IPC-TM-650 Method 2.6.27 T-260 thermal stress test

 IPC-9701A thermal shock, drop/shock, vibe, load compatibility

The high decomposition temperature and closely matched thermal expansion

properties prevent solder joint cracking. This avoids failures in lead-free PCB
assembly processes.

Common Microwave Applications

Stable electrical properties, excellent passive intermodulation (PIM)

performance, and reliability make RO4003C a frequent choice for:

 Military and commercial radars

 5G antennas and infrastructure

 Point-to-point radios

 Satellite payloads and communication

 Flight instrumentation and navigation

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 Test and measurement equipment

The consistent precision microwave dielectric properties simplify modeling

while eliminating nasty fabrication surprises.

RO4003C Laminate Stackup

A typical 4 layer board stackup may integrate different dielectric thicknesses:

Features:

 Very low loss layers for sensitive RF traces

 Thin bonding dielectric layer

 Mix materials to optimize function

This allows high density routing, impedance control, and isolation for complex
microwave PCBs.

PCB Design and Layout

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To achieve first-pass PCB fabrication success, Rogers provides extensive design

resources:

1. Materials Declaration (MD)

 Specifies all material details

 Composite dielectrics and properties

 Guide for modeling values

2. Flexible Circuit Material Selection Guide

 Assists material selection

 Properties comparison

 Stack up configurations

 Layer count guidelines

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3. Application Notes

 Modeling, simulation tips

 Layout considerations

 Layer stack cross-sections

 Test coupon design files

Signal Integrity Simulations

Rogers partnered with Polar Instruments for impedance modeling data packs
for their industry leading Si8000m simulation tool.

This enables accurate virtual prototyping of Rogers PCB characteristics

including:

 Controlled impedance transmission lines

 Differential pairs with cross-talk

 Insertion loss of components

 Eye diagram analysis

 Parametrically study stack variations

These high fidelity models prevent unexpected microwave performance issues.

First Article Testing

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Small quantity Rogers material testing samples are available tovalidate

fabrication processing including:

Rogers Test Coupons for Process Validation

Coupons Include:

 Transmission lines

 Test features

 Fiducial targets

 Buried features

 Plated and bare cu pads

This allows qualification of lamination, drilling, plating, and etching steps.

First pass yield is improved before commencing expensive multilayer designs.

Conclusion

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The Rogers RO4003C circuit board material provides consistent, stable

dielectric properties essential for broadband microwave systems with tight
impedance control requirements. Close tolerance of dielectric constant
combined with low loss tangent simplifies accurate modeling for first-pass PCB
success. Integrating material property data into simulation flows ensures
match between modeled response and measured performance. Test coupons
facilitate process validation to avoid fabrication surprises. For RF PCB designs
from 3–30+ GHz, RO4003C delivers the precision microwave dielectric
constant needed for uncompromised signal integrity.

FAQ

What is the tolerance on the dielectric constant for Rogers

RO4003C?

Rogers maintains tight control of the dielectric constant during manufacture of

±0.05. This allows much more consistent material properties compared to
lower cost circuit laminates with higher Dk variance.

How does moisture absorption affect dielectric constant?

RO4003C exhibits extremely low moisture absorption at <0.2% when

immersed for 24 hours. This minimizes any dielectric constant change or
property shifts over the operating environment.

What is the dielectric constant versus frequency response?

The dielectric model provided by Rogers shows stable dielectric value over the
entire operating frequency band with minimal change above or below the
mean value. This allows broadband circuit design.

Can RO4003C enable first pass microwave PCB layouts?

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Yes — through extensive characterization data and modeling parameters

supplied by Rogers for simulation, the fabricated PCB response can accurately
match pre-layout predictions. This de-risks prototype iterations.

Is RO4003C compatible with common PCB processes?

RO4003C is engineered to work with standard lamination, imaging, plating,

etching and assembly processes making adoption into production flows
straightforward. Dk stability also avoids tuning required for other materials.

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