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Full Intruction about Rogers Circuit

Board Material

What is Rogers Circuit Board Material?

Rogers Corporation is a global leader in engineered materials solutions for

advanced connectivity and power electronics applications. Rogers

manufactures a range of high frequency, high performance printed circuit

board (PCB) materials that are designed to meet the increasing demands of

advanced circuits and systems.

Some key things to know about Rogers circuit board materials:

 They are engineered dielectric materials that provide excellent electrical, thermal, and
mechanical stability for high frequency and high speed circuits. Common product
families include RO4000® series high frequency circuit materials, RO3000® series high
frequency circuit materials, TMM® Thermount® microwave materials, and duroid® high
performance PCB materials.

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 They allow for the design and reliable fabrication of circuits with tighter tolerances and
stable electrical properties. This includes stable dielectric constant and low loss tangent
over a wide frequency range.
 They exhibit outstanding thermal conductivity which helps dissipate heat efficiently in
high power applications.
 They demonstrate excellent dimensional stability over a wide range of temperatures and
operating conditions. This allows circuits to retain precision and reliability over product
lifetimes.
 They are halogen-free, lead-free, and environmentally sustainable materials. Many
products meet UL 94V-0 flammability rating.

In summary, Rogers PCB materials enable high frequency, high speed, and

high reliability connectivity solutions demanded by advanced electronics. They

deliver exceptional electrical, mechanical, and thermal performance tailored to

the needs of specific applications across industries like aerospace and defense,

automotive, telecommunications, and more.

Rogers Circuit Board Materials Product Families

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Rogers Corporation offers several families and types of circuit board materials

engineered to meet different requirements across frequencies, applications,

budgets, and more.

RO4000 Series High Frequency Materials

The RO4000® series features glass reinforced hydrocarbon/ceramic (HR/CER)

laminates and prepregs for performance demanding, high volume applications

like telecommunications infrastructure, automotive radar, and defense

electronics.

Some details on key products in the RO4000 series line:

 RO4003C/TM - Glass reinforced, ceramic filled laminates and prepregs for high
frequency circuitry up to GHz frequencies. It has a low dielectric constant of 3.38 and a
low dissipation factor.
 RO4350B - Woven glass reinforced, ceramic filled laminates and prepregs with a low
dielectric constant of 3.48 for optimal high frequency performance up to mmWave
frequencies.
 RO4835TM - Glass microfiber and ceramic filled laminates and prepregs with an
ultra-low loss for high frequency applications beyond GHz frequencies. Low dielectric
constant of 3.33.

RO3000 Series High Frequency Materials

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The RO3000® series consist of glass reinforced hydrocarbon/ceramic

thermoset laminates and prepregs designed for high volume, moderate

performance microwave applications like test and measurement equipment

and communications electronics.

Some popular products in the RO3000 line:

 RO3010TM - Cost-effective microwave laminates and prepregs rated for high frequencies
up to 10 GHz. Thermoset resin system.
 RO3210TM - High performance and flow-enhanced prepreg with a low dielectric
constant of 10.2 for improved circuit speeds.
 RT/duroid® 6035HTC - High thermal conductivity (HTC) laminates and prepregs with
dielectric constant of 3.5 for thermal management.

Thermount® Microwave Materials

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The TMM® Thermount® product portfolio offers high performance,

ceramic-filled polytetrafluoroethylene (PTFE) composites reinforced for

dimensional stability tailored for low loss, tight tolerance microwave

constructions.

 TMM10i - Economical, PTFE-based composites for industrial microwave applications to

18 GHz. Low moisture absorption.
 TMM13i - High performance PTFE-ceramic composites with a low dielectric constant of
12.85 and low loss for up to 65 GHz frequencies.
 TMM4 - Premier PTFE-fiberglass composites with dielectric constant of 4.5 for low loss
microwave performances up to 40 GHz.

Duroid High Performance Materials

Rogers duroid® materials deliver high performance RF/microwave circuit

laminates and prepregs based on PTFE composites reinforced for exceptional

dimensional stability. Some options in this line:

 RT/duroid® 5870 / 5880 - Glass microfiber filled PTFE composites for low loss, tight
tolerance boards rated for mmWave frequencies up to 40/60 GHz.
 RT/duroid® 6002 - Economical, ceramic filled PTFE-based composites with low moisture
absorption and thermal expansion. Stable dielectric properties.
 RT/duroid® 6035HTC - As referenced earlier, high thermal conductivity prepregs and
laminates rated for frequencies exceeding 60 GHz.

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Selecting The Right Rogers Circuit Board Material

With the wide range of circuit board materials offered by Rogers Corporation,

it can seem difficult determining the right choice for your specific application

and PCB design requirements.

Here are some key factors and considerations when selecting a Rogers'

material for your high frequency PCB:

Frequency Range

 Consider the operating frequencies and bandwidth - Choose dielectric materials rated for
your target operating frequencies with minimal performance falloff at band extremes.
This ensures reliable operation across operating bands.
 Performance over wide bandwidths - Some materials like RO4835TM offer ultra low loss
for optimal operation up to mmWave frequencies exceeding 100 GHz.

Circuit Speed and Density

 Dielectric constant and loss tangent - Lower the dielectric constant and loss tangent, the
faster signal propagates for high speed designs. This allows for higher complex circuit
densities.
 Consistent dielectric properties - Tight dielectric constant and loss tangent tolerances
ensures stable, predictable circuit performance meeting design expectations.

Power Handling
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 Thermal conductivity - Materials with higher thermal conductivity like RO4000® or

RT/duroid® 6035HTC efficiently dissipates heat for reliable operation under high power
densities.

Environmental Conditions

 Withstand extreme conditions - Rogers' circuit materials operate reliably across wide
temperature ranges with excellent dimensional stability and low moisture absorption.
RO4000 series offers high glass transition temperatures exceeding 280°C.
 Lead-free and halogen-free - Most materials meet environmental compliance standards
for end products.

Budget

 Range of material options - Cost competitive materials meeting electrical and mechanical
requirements are offered for high volume applications which don't require cutting edge
performance.

Discuss designers' priorities with your Rogers representative to select the

optimal material solution matching electrical, mechanical, thermal, and cost

targets.

Rogers Circuit Material Properties

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Rogers circuit materials exhibit stable electrical, mechanical, thermal, and

chemical properties imperative for the reliable fabrication and high

performance operation of advanced PCBs across challenging operating

conditions.

Some key material properties to assess when selecting a Rogers' material:

Dielectric Constant

Dielectric constant (Dk) indicates the amount of electrostatic energy stored by

an insulating material under an applied voltage. A lower dielectric constant

allows faster signal propagation and increased circuit densities for high speed

designs.

Typical Dk values of Rogers' materials range from 2.33 (RT/duroid 5880) to

12.85 (TMM 13i). Stability over operating temperatures and frequencies

prevents electrical performance deviations.

Dissipation Factor / Loss Tangent

The dissipation factor or loss tangent (Df) indicates the dielectric loss rate of

amplitudes and energies of signals as they propagate through a PCB material.

A lower loss tangent equates to less losses, allowing for higher operating

frequencies, higher Q factors, and increased efficiency.

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Rogers' circuit materials achieve extremely low loss tangents starting around

0.0009 (RT/duroid® 6002). Losses remain stable over wide frequency and

temperature ranges.

Thermal Conductivity

A material's thermal conductivity indicates its ability to transfer heat. High

thermal conductivity speeds heat dissipation from electrically heated

components and traces, preventing localized heating and failures.

Materials with exceptional thermal conductivity include RO4000® LoPro®

(1.68 W/m/K) and RT/duroid 6035HTC (1.44 W/m/K). These efficiently channel

heat in high power designs.

Coefficient of Thermal Expansion (CTE)

The coefficient of thermal expansion (CTE) measures volume change in a

material in response to temperature changes. Tight control of CTE is critical for

dimensional stability and reliable plated through holes (PTHs) during PCB

fabrication and assembly.

Rogers materials leverage reinforcement fabrics (e.g. glass or quartz) to

precisely control expansion across X, Y axes (around 15-25 ppm/°C) and Z axis

(25-100 ppm/°C). This prevents failures from laminate stresses.

Stacked Microvias with Rogers' Materials

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High complexity PCBs demand advanced interconnect solutions pushing

fabrication limits. Stacked and staggered microvias offer routing capabilities

exceeding conventional via structures to boost circuit densities, but place

intense pressures on materials and processes.

Rogers leverages process refinements and material advancements to reliably

construct stacked microvias on dense multi-layer boards using direct laser

ablation.

Reliable Laser Ablated Stacked Microvias

Laser direct ablation provides a superior process to mechanically drill stacked

microvias while minimizing material stresses. Pulsed lasers rapidly vaporize

dielectric layers to cleanly form multiple stacked vias in precise locations on

multi-layer boards.

Thin Dielectric Films

Thin circuit cores (15-25 μm dielectric thickness) made with Rogers' materials

enable construction of stacked microvias due to reduced aspect ratios. This

prevents failures related to punchthrough or fracturing. Rogers offers core

films as thin as 8 μm.

Low Loss Materials

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Low loss, tight tolerance electrical properties provided by Rogers' materials

prevent performance variations or anomalies, especially important when

signals route through cascaded microvia interconnects.

CTE Tailored Prepregs

Compatible coefficient of thermal expansion (CTE) between adjacent dielectric

layers ensures reliable connections through stacked vias under temperature

fluctuations and gradients during fabrication and operation.

Rogers Flexible Circuit Materials

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Rogers Corporation offers dedicated flexible circuit materials providing

outstanding electrical and mechanical stability for dynamic, high frequency

applications like consumer electronics, automotive electronics, IoT devices,

aerospace systems, and military electronics.

These robust flexible circuit materials withstand bending and flexing stresses

over lifetimes while ensuring consistent circuit performance meeting the most

demanding application requirements.

Key Rogers Flexible Circuit Materials

 2929 Bondply - Woven glass reinforced polyimide films with outstanding dimensional
stability and low CTE. Handles continuous flexing with moderate dielectric constant and
loss properties.
 92MLTM StaCoolTM - Random glass reinforced heat resistant flexible material for high
layer count multilayer flex designs. Handles continuous dynamic bending.
 RT/duroid® 6202PR - Next generation flexible material with ultra-low loss (Df of 0.0035
at 10 GHz) and low Dk. Enables high frequency mmWave antennas and boards.

Features and Benefits

 Withstand millions of dynamic bending cycles

 Dimensionally stable with precisely controlled CTE
 Consistent electrical properties under flexing
 Low moisture absorption
 Excellent high frequency properties
 UL 94V-0 and RoHS compliant

Rogers flexible circuits empower innovations in consumer wearables, advanced

driver assistance systems (ADAS), 5G systems, defense electronics, and other

emerging applications.

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Rogers Circuit Board Material Selection Guide

Use the following table summarizing popular Rogers' materials across product

families as an initial selection guide based on key parameters for your

application:

Rogers Circuit Board Material Selection Guide

Reach out to your Rogers Corporation representative for personalized

guidance selecting the optimal material solution for your specific microwave,

high speed, high frequency, or flex PCB application based on dielectric, loss,

thermal, mechanical, and high volume manufacturing properties required.

PCB Material Comparison - Rogers vs FR4 vs Getek vs Isola

Rogers high frequency circuit materials provide clear advantages over

conventional FR4 laminates, GETEK dielectric films, and some Isola composites

for microwave and high speed designs.

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Rogers vs. FR4 Glass Epoxy

Rogers vs. GETEK Films

Rogers vs. Isola ASTRA MT77

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Rogers materials outperform standard FR4 and compete closely with advanced

laminates from GETEK and Isola on critical electrical, mechanical, and thermal

properties. Discuss tradeoffs with your Rogers representative.

Rogers Corporation PCB Material Certifications

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Rogers Corporation maintains global certifications and recognitions validating

the safety, performance, and reliability of its circuit materials meeting

established industry standards.

Key Quality Certifications

 ISO 9001 - Certifies Rogers Corporation's quality management system meets

international standards through

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